TEMIC E5530H-232-DIT

e5530
128-Bit IDIC for Radio Frequency Identification
via an internal load. This damping-in-turn can be detected
by the interrogator. The identifying data are stored in a
128 bit PROM on the e5530, realized as an array of laserprogrammable fuses. The logic block diagram for the
e5530 is shown in figure 2. The data are output bitserially as a code of length 128, 96, 64 or 32 bits. The
chips are factory-programmed with a unique code.
Description
The e5530 is part of a closed coupled identification
system. It receives power from an RF transmitter which
is coupled inductively to the IDIC. The frequency is
typically 100 to 450 kHz. Receiving RF, the IDIC
responds with a data stream by damping the incoming RF
Features
Bitrate [bit/s]:
D Low power, low voltage CMOS
D Rectifier, voltage limiter, clock extraction
RF/8,RF/16, RF/32, RF/40,
RF/50, RF/64, RF/80, RF/100,
RF/128, RF/256
FSK, PSK, BIPH, Manchester
BIPH-FSK
Modulation:
on-chip (no battery)
D Small size
Application
D Factory laser programmable ROM
D Operating temperature range –40 to +125°C
RF transmitter
and
interrogator
D Radio Frequency (RF): 100 to 450 kHz
IDIC
e5530
RF
D Transmission options
95 10318
Code length: 128, 96, 64, 32 bits
Figure 1. Application
Analog front end
Load
95 10155
Mod
Modulator
FSK
PSK
BIPH
Manchester
Data
Clk
R7
R6
R5
R4
R3
R2
R1
R0
128 bit PROM
C15
C14
C13
C12
C11
C10
C9
C8
C7
C6
C5
C4
C3
C2
C1
C0
Clock
extractor
Row decoder
Coil
Coil
VDD
Bitrate
A6
A5
A4
A3
Rectifier
A2
A1
A0
Column decoder
Counter
VSS
Figure 2. Block diagram
IDIC stands for IDentification Integrated Circuit and is a trademark of TEMIC.
Rev. A3, 17-Sep-98
1 (5)
e5530
Ordering Information
Extended Type Number
Package
e5530H-232-DOW
e5530H-232-DIT
e5530H-232-S8
e5530H-zzz-DOW *
e5530H-zzz-DIT *
e5530H-zzz-S8 *
DOW
DIT
SO8
DOW
DIT
SO8
*
Checksum
Header
IP Code
no
checksum
E6
fixed and
unique code
SPQ
(Minimum
Volume)
10 kpcs
10 kpcs
1120
defined by customer
Minimum
Order Volume
10 kpcs
10 kpcs
1120
> 600 kpcs p.a.
> 600 kpcs p.a.
> 400 kpcs p.a.
1) Definition of customized part number basing on orders for first year volume (300 kpcs)
2) Definition of header, ID code, checksum etc. according to customers data base
3) 8.000 US$ initial cost for metal mask
4) Lead time 5 month
5) Low volume customized application can be covered by TK5550F–PP programming.
With identical features of TK5530H–zzz–pPP possible
Chip Dimensions
Functional Description
Read Operation
0.175 mm
e5530
1.17 mm
0.447 mm
Coil 1
Coil 2
Pad: 150 m x 150 m (Metal: 99% Al, 1% Si)
Padwindow: 138 m x 138 m
1.62 mm
13368
Figure 3. Chip size
Pads
ÁÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
ÁÁÁÁ
ÁÁÁÁÁÁ
ÁÁÁÁÁÁÁÁ
Name
Coil1
Coil2
Pad Window
Function
138 138 mm2 1st coil pad
138 138 mm2 2nd coil pad
Coil 2
1
8
2
7
Coil 1
e5530
3
4
Once the IC detects the incoming RF, the IC repetively
reads out the code data as long as the RF signal is applied.
The transition from the last bit to bit 1 of the next
sequence occurs without interruption. Data is transmitted
by alternating damping of the incoming RF via a load.
Different kinds of modulation and bitrates are optionally
available.
Rectifier
For internal power supply, an on-chip bridge rectifier is
used which consists of two diodes and two n-channel
transistors. A Zener diode, which protects the circuit
against overvoltage on the coil inputs, and a smoothing
capacitor for the internal supply are also provided.
Damping Load
Incoming RF will be damped by the power consumption
of the IC itself and by an internal load, which is controlled
by the modulator. The loads are p-channel transistors
connected between VDD and the coil inputs. The layout
includes metal mask options for the load circuit:
single-side, double-side and alternate-side modulation.
Modulator
6
One of four methods of modulation can be selected by
fuses. The timing diagram is shown in figure 5.
5
FSK
Note:
Pins 2 to 7 have to be open. They are
not specified for applications
Figure 4. Pinning SO8
2 (5)
13367
Logical “1” and “0” are distinguished via different
frequencies of damping. The frequency for “1” is the RF
divided by 10, a “0” divides by 8.
Rev. A3, 17-Sep-98
e5530
PSK
Manchester
A logical “1” causes (at the end of the bit period) a 180°
phase shift on the carrier frequency, while a logical “0”
causes no phase shift. The carrier frequency is RF/2.
A logical “1” causes a positive edge in the middle of a bit
period, while a logical “0” causes negative edge.
BIPH
Logical “1” produces a signal which is the same as the bitclock and a logical “0” produces a signal of twice the
bitclock period.
A combination of BIPH- and FSK-modulation is also
optionally available. The available combinations between the modulation types and the bitrates are shown in
table “Transmission Options”.
DataClk
Data
1
0
1
1
0
0
1
FSK
PSK
Man
Biph
95 10278
Figure 5. Timing diagram for modulation options
Absolute Maximum Ratings
Parameters
Maximum current into Coil1 and Coil2
Maximum power dissipation (dice)
Maximum ambient air temperature with voltage applied
Storage temperature
*
Symbol
Icoil
Ptot
Tamb
Tstg
Value
10
100
–40 to +125
–65 to +150
Unit
mA
mW*
°C
°C
Free-air condition. Time of application: 1 s
Stresses above those listed under ‘Absolute Maximum Ratings’ may cause permanent damage to the device.
Functional operation of the device at these conditions is not imlied.
Rev. A3, 17-Sep-98
3 (5)
e5530
Operating Characteristics
Tamb = 25°C, reference terminal is VDD, operating voltage VDD – VSS = 3 V dc, unless otherwise specified
Parameters
Operating voltage
Operating temperature
Input frequency (RF)
Operating current
Test Conditions / Pins
Condition for logic test
fCLK = 125 kHz,
VSS = –2 V
I = 4 mA
Clamp voltage
*
Symbol
VSS
Tamb
fCLK
ICC
Min.
–1.5
–40
100
VCL
6.7
Typ. *
Max.
–5.0
125
450
Unit
V
°C
kHz
mA
10
V
3
Typical parameters represent the statistical mean values
Transmission Options
Modulation
Carrier Frequency (CF)
RF/8, RF/10
FSK
PSK
BIPH
Bitrate [bit/s]
RF/32, RF/40, RF/50, RF/64, RF/80,
RF/100, RF/128
CF/4, 8, 16, 32
RF/8, RF/16, RF/32, RF/64, RF/100,
RF/128
RF/8, RF/16, RF/32, RF/64, RF/100,
RF/128
RF/2
Manchester
IDD
100
VDD
=
Vpp Coil ≅ 1.5 V
Figure 6. Measurement setup for IDD
Mod
2V
Coil 2
Coil 2
VSS
4 (5)
~2V
Coil 1
Coil 1
~
W
100
W
~2V
96 12304
96 12303
Figure 7. Simplified damping circuit
Rev. A3, 17-Sep-98
e5530
Application Example
From
oscillator
IAC
740 mH
4.05 mH 390 pF
Input capacitance
5 pF static, 4 pF dynamic
Energy
125 kHz
Coil1 (Pin 8)
e5530
(SO8)
Coil2 (Pin 1)
Data
To read
amplifier
2.2 nF
fres
+ 2p Ǹ1LC + 125 kHz
13369
Figure 8. Typical application circuit
Package Information
Package SO8
Dimensions in mm
5.2
4.8
5.00
4.85
3.7
1.4
0.25
0.10
0.4
1.27
6.15
5.85
3.81
8
0.2
3.8
5
technical drawings
according to DIN
specifications
13034
1
4
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized
application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of,
directly or indirectly, any claim of personal damage, injury or death associated with such unintended or
unauthorized use.
TEMIC Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 ( 0 ) 7131 67 2594, Fax number: 49 ( 0 ) 7131 67 2423
Rev. A3, 17-Sep-98
5 (5)