Order this document by MC3334/D This device is designed to use the signal from a reluctor type ignition pickup to produce a well controlled output from a power Darlington output transistor. • Very Low Peripheral Component Count • • • • • • • HIGH ENERGY IGNITION CIRCUIT No Critical System Resistors Wide Supply Voltage Operating Range (4.0 V to 24 V) SEMICONDUCTOR TECHNICAL DATA Overvoltage Shutdown (30 V) Dwell Automatically Adjusts to Produce Optimum Stored Energy without Waste Externally Adjustable Peak Current Available in Chip and Flip–Chip Form P SUFFIX PLASTIC PACKAGE CASE 626 Transient Protected Inputs and Outputs 8 1 D SUFFIX PLASTIC PACKAGE CASE 751 (SO–8) MAXIMUM RATINGS Rating Symbol Value Unit Vbat 24 90 V Output Sink Current–Steady State Transient 300 ms or less IO(Sink) 300 1.0 mA A Junction Temperature TJ(max) 150 °C Device TA –40 to +125 °C MC3334P MC3334D Power Supply Voltage–Steady State Transient 300 ms or less Operating Temperature Range Storage Temperature Range Tstg –65 to +150 °C Power Dissipation, Plastic Package, Case 626 Derate above 25°C PD 1.25 10 W mW/°C ORDERING INFORMATION Operating Temperature Range Package Plastic DIP SO–8 TA = – 40° to +125°C MCC3334 MCCF3334 Chip Flip–Chip Figure 1. Block Diagram and Typical Application 4.0 Vbat–24 Vdc Rbat 300 V ts CFilter 0.1 t 6 RA 20k Reluctor Pickup 1.35H C1* 470 S2 5 RL 10k RB 20k Input Comparator with Hysteresis + + – S1 VCC RDrive 100 Power Output & OVP 7 IO 4 C2* 0.01 RGain 5.0k Dwell Reference Buffer – C CDwell 0.1 + 3 Current Limit Sense Ignition Coil Primary 8.0mH **MJ10012 8 IL RD2 100 RD1 35–350 RS 0.075 MC3334 Sense *Optional parts for extended transient protection Ground **A 350 V zener clamp is required when using the standard MJ10012. **This clamp is not required if a selected version with VCEO(sus) 550 V is used. 2 1 Power Ground w Motorola, Inc. 1996 MOTOROLA ANALOG IC DEVICE DATA Rev 0 1 MC3334 MCC3334 MCCF3334 ELECTRICAL CHARACTERISTICS (TA = –40° to +125°C, Vbat = 13.2 Vdc, circuit of Figure 1, unless otherwise noted.) Symbol Characteristics Internal Supply Voltage, Pin 6 Vbat = 4.0 Vdc Vbat = 8.0 Vdc Vbat = 12.0 Vbat = 14.0 VCC Ignition Coil Current Peak, Cranking RPM 2.0 Hz to 27 Hz Vbat = 4.0 Vdc Vbat = 6.0 Vbat = 8.0 Vbat = 10.0 Io(pk) Ignition Coil Current Peak, Normal RPM Frequency = 33 Hz Frequency = 133 Hz Frequency = 200 Hz Frequency = 267 Hz Frequency = 333 Hz Io(pk) Ignition Coil On–Time, Normal RPM Range Frequency = 33 Hz Frequency = 133 Hz Frequency = 200 Hz Frequency = 267 Hz Frequency = 333 Hz Min Typ Max – – – – 3.5 7.2 10.4 11.8 – – – – 3.0 4.0 4.6 5.1 3.4 5.2 5.3 5.4 – – – – 5.1 5.1 4.2 3.4 2.7 5.5 5.5 5.4 4.4 3.4 – – – – – – – – – 7.5 5.0 4.0 3.0 2.3 14.0 5.9 4.6 3.6 2.8 25 30 35 – – 360 90 – – 75 – – – – 1.8 1.5 – – – 60 120 – 4.0 – Unit Vdc A pk A pk ton Shutdown Voltage Vbat Input Threshold (Static Test) Turn–on Turn–off VS2–VS1 Input Threshold Hysteresis VS2–VS1 Input Threshold (Active Operation) Turn–on Turn–off ms Vdc mVdc mVdc VS2 Total Circuit Lag from ts (Figure 1) until Ignition Coil Current Falls to 10% Ignition Coil Current Fall Time (90% to 10%) Saturation Voltage IC Output (Pin 7) (RDRIVE = 100 Ω) Vbat = 10 Vdc Vbat = 30 Vdc Vbat = 50 Vdc Vdc µs µs VCE(sat) Current Limit Reference, Pin 8 Vref mVdc – – – 120 280 540 – – – 120 160 190 mVdc Figure 2. Ignition Coil Current versus Frequency/Period I O (A) 6.0 5.5 5.0 Vbat – 1.5 V Slope = 8.0 mH Vbat = 13.2 Vdc 4.0 3.0 2.0 1.0 333 0 200 5 133 100 10 70 50 15 20 33 25 30 ms f, FREQUENCY (Hz) 2 MOTOROLA ANALOG IC DEVICE DATA MC3334 MCC3334 MCCF3334 CIRCUIT DESCRIPTION The MC3334 high energy ignition circuit was designed to serve aftermarket Delco five–terminal ignition applications. This device, driving a high voltage Darlington transistor, offers an ignition system which optimizes spark energy at minimum power dissipation. The IC is pinned–out to permit thick film or printed circuit module design without any crossovers. The basic function of an ignition circuit is to permit build–up of current in the primary of a spark coil, and then to interrupt the flow at the proper firing time. The resulting flyback action in the ignition coil induces the required high secondary voltage needed for the spark. In the simplest systems, fixed dwell angle produces a fixed duty cycle, which can result in too little stored energy at high RPM, and/or wasted power at low RPM. The MC3334 uses a variable DC voltage reference, stored on CDwell, and buffered to the bottom end of the reluctor pickup (S1) to vary the duty cycle at the spark coil. At high RPM, the MC3334 holds the output “off” for approximately 1.0 ms to permit full energy discharge from the previous spark; then it switches the output Darlington transistor into full saturation. The current ramps up at a slope dictated by Vbat and the coil L. At very high RPM the peak current may be less than desired, but it is limited by the coil itself. As the RPM decreases, the ignition coil current builds up and would be limited only by series resistance losses. The MC3334 provides adjustable peak current regulation sensed by RS and set by RD1, in this case at 5.5 A, as shown in Figure 2. As the RPM decreases further, the coil current is held at 5.5 A for a short period. This provides a reserve for sudden acceleration, when discharge may suddenly occur earlier than expected. The peak hold period is about 20% at medium RPM, decreasing to about 10% at very low RPM. (Note: 333 Hz = 5000 RPM for an eight cylinder four stroke engine.) At lower Vbat, the “on” period automatically stretches to accommodate the slower current build–up. At very low Vbat and low RPM, a common condition during cold starting, the “on” period is nearly the full cycle to permit as much coil current as possible. The output stage of the IC is designed with an OVP circuit which turns it on at Vbat ≈ 30 V (VCC ≈ 22 V), holding the output Darlington off. This protects the IC and the Darlington from damage due to load dump or other causes of excessive Vbat. Component Values Pickup – series resistance = 800 Ω ± 10% @ 25°C inductance = 1.35 H @ 1.0 kHz @ 15 Vrms Coil – leakage L = 0.6 mH primary R = 0.43 Ω ± 5% @ 25°C primary L = 7.5 mH to 8.5 mH @ 5.0 A RL R A , RB – load resistor for pickup = 10 kΩ ± 20% – input buffer resistors provide additional transient protection to the already clamped inputs = 20 k ± 20% MOTOROLA ANALOG IC DEVICE DATA C1, C2 – for reduction of high frequency noise and spark transients induced in pick–up and leads; optional and non–critical Rbat – provides load dump protection (but small enough to allow operation at Vbat = 4.0 V) = 300 Ω ± 20% CFilter – transient filter on VCC, non–critical CDwell – stores reference, circuit designed for 0.1 µF ± 20% RGain – RGain/RD1 sets the DC gain of the current regulator = 5.0 k ± 20% RD2 – RD2/RD1 set up voltage feedback from RS RS – sense resistor (PdAg in thick film techniques) = 0.075 Ω ± 30% RDrive – low enough to supply drive to the output Darlington, high enough to keep VCE(sat) of the IC below Darlington turn–on during load dump = 100 Ω ± 20%, 5.0 W RD1 – starting with 35 Ω assures less than 5.5 A, increasing as required to set 5.5 A RD1 = IO(pk) RS–Vref – (≈ 100 Ω) Vref – 1.4 RD2 RGain General Layout Notes The major concern in the substrate design should be to reduce ground resistance problems. The first area of concern is the metallization resistance in the power ground to module ground and the output to the Rdrive resistor. This resistance directly adds to the VCE(sat) of the IC power device and if not minimized could cause failure in load dump. The second concern is to reference the sense ground as close to the ground end of the sense resistor as possible in order to further remove the sensitivity of ignition coil current to ground I.R. drops. All versions were designed to provide the same pin–out order viewed from the top (component side) of the board or substrate. This was done to eliminate conductor cross–overs. The standard MC3334 plastic device is numbered in the industry convention, counter–clockwise viewed from the top, or bonding pad side. The MCCF3334 “flip” or “bump” chip is made from reversed artwork, so it is numbered clockwise viewed from its bump side. Since this chip is mounted face down, the resulting assembly still has the same counter–clockwise order viewed from above the component surface. All chips have the same size and bonding pad spacing. See Figure 4 for dimensions. 3 MC3334 MCC3334 MCCF3334 Figure 3. Internal Schematic 6 VCC 14V 5.2V 2.0φ 5.2V 5 5.2V S2 X 21V 7 5.2V Out 2.0φ Input Comparator with Hysteresis 8 Simplified Internal Power Supply VCC 4 S1 Sense Ground 2 VCC Output Stage with OVP and Current Limiting 1 IL Power Ground Charge Up 2.0φ 3 C 2.0φ Charge Down Dwell Reference Buffer X Figure 4. MCCF3334 Ignition Circuit Bump Side View + S2 + 5 VCC + + 6 7 Out 8 IL 66 ±2 Mils 50 Mils (8) Bumps 7 ± 1 Mil Dia. raised minimum 0.5 Mils above passivated chip surface 6 ±1 + + 4 5.5 +1 4 Sense Ground C S1 + 3 20 Mils Power Ground + 2 20 Mils 76 ± 2 Mils 1 20 Mils MOTOROLA ANALOG IC DEVICE DATA MC3334 MCC3334 MCCF3334 OUTLINE DIMENSIONS 8 P SUFFIX PLASTIC PACKAGE CASE 626–05 ISSUE K 5 –B– 1 NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 4 F DIM A B C D F G H J K L M N –A– NOTE 2 L C J –T– N SEATING PLANE D M K MILLIMETERS MIN MAX 9.40 10.16 6.10 6.60 3.94 4.45 0.38 0.51 1.02 1.78 2.54 BSC 0.76 1.27 0.20 0.30 2.92 3.43 7.62 BSC ––– 10_ 0.76 1.01 INCHES MIN MAX 0.370 0.400 0.240 0.260 0.155 0.175 0.015 0.020 0.040 0.070 0.100 BSC 0.030 0.050 0.008 0.012 0.115 0.135 0.300 BSC ––– 10_ 0.030 0.040 G H 0.13 (0.005) M T A M B D SUFFIX PLASTIC PACKAGE CASE 751–05 (SO–8) ISSUE N –A– 8 5 –B– 1 M 4X NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. P 0.25 (0.010) 4 M B M G R C –T– 8X K D 0.25 (0.010) M T B SEATING PLANE S A M_ S MOTOROLA ANALOG IC DEVICE DATA X 45 _ F J DIM A B C D F G J K M P R MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.18 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.189 0.196 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.007 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019 5 MC3334 MCC3334 MCCF3334 Motorola reserves the right to make changes without further notice to any products herein. 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