U2320B VHF/UHF Tuner-IC Description This tuner IC requires a power supply of 12 V and performs the function of two separate oscillators and mixers, SAW-filter driver and dual state band switch. Features D Frequency range from 48 to 860 MHz D Band A: balanced high impedance mixer input and D SAW filter driver with low impedance output D Voltage regulator for stable operating characteristics amplitude controlled oscillator D Band B: balanced low impedance mixer input and D ESD protection on all pins except oscillator pins and symmetrical oscillator RF-inputs Block Diagram 1 3 4 Osc. A 15 6 5 7 2 Osc. B Voltage stabiliser Band switch Mixer output SAW–filter driver 8 13 14 10 9 RF Band A Band B 95 10713 19 18 20 17 16 12 11 Figure 1. Ordering Information Extended Type Number U2320B-FLG3 TELEFUNKEN Semiconductors Rev. A1, 29-May-96 Package SO20 plastic package Remarks Taped and reeled 1 (7) U2320B Pin Description GND (RF) 1 20 RF in, A 2 19 GND (common) RF in, A 3 18 Osc A, coll. Osc A, base RF in, B 4 17 RF in, B 5 16 Osc B, coll. VS 6 15 Osc B, coll. Mix.out 7 14 Osc B, base Mix. out 8 13 Band sw. SAWF, inp. 9 12 SAWF, out 11 SAWF, inp. 10 Osc B, base Pin 1 2 3 4, 7 5, 6 8 9, 10 11, 12 13, 14 15 16, 17 18, 19 20 Symbol Osc A, base GND (common) Osc A, coll. Osc B, base Osc B, coll. Band sw. SAWF, out SAWF, inp. Mix, out VS RF in, B RF in, A GND (RF) Function Oscillator band A, base Ground, common Oscillator band A, collector Oscillator band B, bases Oscillator band B, collectors Dual-state band switch SAW filter driver outputs SAW filter driver input Mixer outputs, open collector Supply voltage Vs RF inputs, band B RF inputs, band A Ground, RF part SAWF, out 9612044 Absolute Maximum Ratings All voltages are referred to GND, Pin 2 Parameters Supply voltage RF inputs IF outputs Dual-state switch voltage Junction temperature Storage temperature Test Conditions / Pins Pin 15 Pin 16-19 Pin 13-14 Pin 8 Symbol VS Min. Typ. Max. 13,.5 5.0 13. 5 13. 5 150 150 Unit V V V V ViDSW Tj Tstg –40 Test Conditions / Pins Pin 13-15 With heat conductive glue Symbol VS Tamb Min. 10.8 –25 Typ. 12 Max. 13.2 75 Unit V °C Test Conditions / Pins Test conditions page 4 Package soldered to PCB Symbol RthJA Min. Typ. 90 Max. Unit K/W °C °C Operating Range All voltages are referred to GND, Pin 2 Parameters Supply voltage Ambient temperature Thermal Resistance Parameters Junction ambient 2 (7) TELEFUNKEN Semiconductors Rev. A1, 29-May-96 U2320B Electrical Characteristics Test conditions (unless otherwise specified): Vs = 12 V, Tamb = 25°C, reference point Pin 2, referred to test circuit page 5. Parameters Supply voltage Supply current Band switch Voltage band A Voltage band B Switching current SAW filter driver Input impedance Output impedance Voltage gain Band A (note 1) Input frequency range Input impedance Gain (note 4) Noise figure DSB (note 2) Input level for (note 3): IM3 (Interm. of 3rd order) IM2 (Interm. of 2nd order) Band B (note 1) Input frequency range Input impedance Gain (note 4) Noise figure DSB (note 2) Test Conditions / Pins Pin 13-15 Pin 13-15 VSW = 5 V fi = 36 MHz Symbol VS IS Min. 10.8 Typ. 12.0 42 Max. 13.2 50 Unit V mA Pin 8 Pin 8 Pin 8 VSWA VSWB ISW 0 3.4 0 4.0 1.0 5.0 100 V V mA Pin 11, 12 Pin 9, 10 ZiSAW ZoSAW GvSAW 11, 12 → 9, 10 Figure 4 Pin18 Pin18 I/P to O/P I/P to O/P fiA = 50 MHz fiA = 150 MHz Each carrier fiA = 71 MHz I/P fiA = 71 MHz I/P Figure 4 Pin 16, 17 Pin 16, 17 I/P to O/P I/P to O/P fiB = 500 MHz fiB = 800 MHz Input p level for IM3 Each carrier (Interm. of 3rd order, note 3) fiB = 600 MHz I/P Notes 1) 2) 3) 4) fiA S11A GA NF 48 ViA ViA fiB S11B GB NF ViB W W 450 70 19 dB 470 MHz 30 11.5 12 dB dB dB –22 –22 dBm dBm 470 860 MHz 34 10.5 11.5 dB dB dB –27 dBm The RF input B is symmetrical driven by means of a hybrid for 180° phase shifting, consequently the source impedance is 100 W. All other impedance for RF tests is 50 W. The noise figure (NF) is the value for double-side-band measurement. The intermodulation test (2-carrier-method) which is made on IF-centre is in reference to a signal-to-IM ratio of 60 dB. Gain is the ratio of the voltage at the primary coil of L5 to the available voltage at the input. TELEFUNKEN Semiconductors Rev. A1, 29-May-96 3 (7) U2320B Test and Principle Application Circuit Band B UHF I/P Band A VHF I/P Hybrid 0 / 180 degree with 50 ohms Z(in) and 100 ohms (2x50) Z(out) VS 180 o 10n 15p L6 1n 1n 1n 1n Air Coils 0.6 mm enamelled copper wire L1 2 turns 2.5 mm dia L2 8 turns 3.5 mm dia L3 3 turns 2.5 mm dia L4 3 turns 2.5 mm dia TOKO–Coils L5 12+2 turns L6 6+6 turns 17 1 The output voltage of the IF is calculated back to the primary coil of L5 13 5 9 L5 1n 2p2 2p2 Bd. I/III 1p0 BB515 1p0 L1 1k5 IF : PC 38.9 MHz SC 33.4 MHz 1n 1n 18k 1p0 15p 1p0 1n L3 2k2 USW L4 BB619 BA282 100p L2 820p 68p 18k IF–Out O/P 8p2 18k 18k 1n BB515 96 11674 VT Figure 2. Test and principle application circuit Note: All component values must be determined application specific. For more detailed information pls. request the application note “Semiconductors for TV-Tuners and The New EasyLink Concept”. PCB for the RthJA-Measurement 35 mm one-sided Cu-coated PCB, 40 mm x 40 mm x 1.5 mm. 95 10715 Figure 3. PCB for the RthJA-measurement 4 (7) TELEFUNKEN Semiconductors Rev. A1, 29-May-96 U2320B Input Impedance Mixer Band A (S11A) and B (S11B) j 0.5j 2j ÁÁÁ ÁÁÁÁ 1) ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁ Á ÁÁ ÁÁ Á 1045 MHz 845 MHz 0.2j 5j 645 MHz 445 MHz 245 MHz 0 0.2 45 MHz 0.5 1 Á Á 2 Á Á 1 ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁ 5 45 MHz 250 MHz –0.2j 500 MHz –5j 2) –0.5j 750 MHz –2j Z0 = 50 W 95 9928 –j Figure 4. Input impedance mixer band A (S11A), and B (S11B) 1) VHF-Low Normalized to 50 W, measuring range 45 MHz to 750 MHz. 2) VHF-High and UHF Normalized to 50 W, measuring range 45 MHz to 1045 MHz. Both inputs are driven symmetrical. The output impedance of the hybrid is 100 W, the measured levels are then calculated in reference to 50 W. TELEFUNKEN Semiconductors Rev. A1, 29-May-96 5 (7) U2320B Package Dimensions Small outline plastic package, 20 pin-SO20 Dimensions in mm 95 10712 6 (7) TELEFUNKEN Semiconductors Rev. A1, 29-May-96 U2320B Ozone Depleting Substances Policy Statement It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances ( ODSs). The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency ( EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively. TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423 TELEFUNKEN Semiconductors Rev. A1, 29-May-96 7 (7)