U2309B VHF/ UHF-Tuner-IC Description This tuner IC requires a power supply of 9 V and performs the function of three separate oscillators an mixers, SAWF-driver, L.O.-output and tri-state band switch. Additional to TV-tuner application this IC is usable for DAB (Digital Audio Broadcast) tuners. Features D 9 V supply voltage D Frequency range from 48 to 860 MHz D Band A: balanced high impedance mixer input and amplitude controlled oscillator D Band B + C: balanced low impedance mixer input and D Balanced L. O.-outputs for prescalers or PLL D SAW filter driver with low impedance output D Voltage regulator for stable operating characteristics D ESD protection on all pins except oscillator pins and symmetrical oscillator RF-inputs Benefits D The integration of 3 bands and the small SSO28 package allows to design very small and economical 3-band tuners with high performance. Block Diagram 1 3 Osc. A 4 8 10 9 11 6 5 7 Osc. B 19 2 Osc. C Voltage stabiliser 12 Band switch L.O. 27 28 Mixer output SAW–filter driver 17 18 14 13 RF Band B Band A Band C 95 10717 25 24 23 22 26 21 20 16 15 Figure 1. Block diagram TELEFUNKEN Semiconductors Rev. A2, 29-May-96 1 (8) U2309B Pin Description Osc A, base 1 28 L.O. out GND (common) 2 27 L.O. out Osc A, coll. 3 26 GND (RF) Osc B, base 4 25 RF in, A Osc B, coll. 5 24 RF in, A Osc B, coll. 6 23 RF in, B Osc B, base 7 22 RF in, B Osc C, base 8 21 Osc C, coll. 9 20 RF in, C RF in, C Osc C, coll. 10 19 VS Osc C, base 11 18 Mix out Band sw. 12 17 Mix out SAWF, out 13 16 SAWF, inp. SAWF, out 14 15 SAWF, inp. Pin 1 2 3 4, 7 5, 6 8, 11 9, 10 12 13, 14 15, 16 17, 18 Symbol Osc A, base GND (common) Osc A, coll. Osc B, base Osc B, coll. Osc C, base Osc C, coll. Band sw. SAWF, out SAWF, inp. Mix out 19 20, 21 22, 23 24, 25 26 27, 28 VS RF in, C RF in, B RF in, A GND (RF) L.O. out Function Oscillator band A, base Ground, common Oscillator band A, collector Oscillator band B, bases Oscillator band B, collectors Oscillator band C, bases Oscillator band C, collectors Tri-state band switch SAW filter driver outputs SAW filter driver inputs Mixer outputs, open collector Supply voltage Vs RF inputs, band C RF inputs, band B RF inputs, band A Ground, RF part L.O.-outputs 95 10886 Ordering Information Extended Type Number U2309B-FLG3 U2309B-FSG3 2 (8) Package SO28 SSO28 Remarks Taped and reeled Taped and reeled TELEFUNKEN Semiconductors Rev. A2, 29-May-96 U2309B Absolute Maximum Ratings All voltages are referred to GND, Pin 2 Parameters Supply voltage RF inputs IF outputs Tri-state switch voltage Junction temperature Storage temperature Pin 19 Pin (20-25) Pin 17-18 Pin 12 Symbol VS Min. ViTRI Tj Tstg –40 Symbol VS Tamb Min 8.1 –25 Typ. Max. 10.5 5.0 10.5 10.5 125 125 Unit V V V V °C °C Typ 9 Max 9.9 75 Unit V °C Operating Range All voltages are referred to GND, Pin 2 Parameters Supply voltage Ambient temperature Test Conditions / Pins Pin 17-19 Thermal Resistance Parameters Symbol Typ Unit RthJA 70 128 K/W Junction ambient Package SO28 soldered to PCB Package SSO28 soldered to PCB (see layout page 5) Electrical Characteristics Test conditions (unless otherwise specified): Vs = 9 V. Tamb = 25 °C. Reference point Pin 2 Parameters Test Conditions / Pins Supply voltage Pin 17-19 Supply current Pin 17-19 Band switch Voltage band A Pin 12 Voltage band B Pin 12 Voltage band C Pin 12 Switching current VSW = 5 V Pin 12 L. O .-output L. O. level each output RL = 50 Ohm Pin 27, 28 SAW filter driver fi = 36 MHz Input impedance Pin 15, 16 Output impedance Pin 13, 14 Voltage gain Pin 15, 16 → 13, 14 TELEFUNKEN Semiconductors Rev. A2, 29-May-96 Symbol VS IS Min 8.1 Typ 9.0 42 Max 9.9 50 Unit V mA VSWA VSWB VSWC ISW 0 1.6 3.4 0 2.0 4.0 1.0 2.4 5.0 100 V V V mA PLO –25 –17 dBm ZiSAW ZoSAW GvSAW 450 70 17 Ohm Ohm dB 3 (8) U2309B Electrical Characteristics (continued) Parameters Band A Input frequency range Input impedance Gain (note 4) Noise figure DSB (note 2) Symbol Min Pin 24 Pin 24 Pin I/P to O/P Pin I/P to O/P fiA = 50 MHz fiA = 150 MHz Each carrier fiA = 71 MHz Pin I/P fiA = 71 MHz Pin I/P fiA S11A GA 48 Pin 22, 23 Pin 22, 23 Pin I/P to O/P Pin I/P to O/P fiB = 200 MHz fiB = 450 MHz Each carrier fiB = 300 MHz Pin I/P fiA S11B GB Pin 20, 21 Pin 20, 21 Pin I/P to O/P Pin I/P to O/P fiC = 500 MHZ fiC = 800 MHz Input level for IM3 Each carrier (interm. of 3rd order, note 3) fiC = 600 MHz Pin I/P fiC S11C GC Input level for (note 3): IM3 (interm. of 3rd order IM2 (interm. of 2nd order) Band B (note 1) Input frequency range Input impedance Gain (note 4) Noise figure DSB (note 2) Input level for (note 3): IM3 (interm. of 3rd order) Band C (note 1) Input frequency range Input impedance Gain Noise figure DSB (note 2) Test Conditions / Pins Figure 3 Figure 3 Typ Max Unit 170 MHz 28 dB NF NF 11.5 12 dB dB ViA ViA –23 –22 dBm dBm 170 470 MHz see Fig. 3 32 dB NF NF 9.5 10 dB dB ViB –28 dBm NF NF ViC 470 860 MHz 32 dB 10.5 11.5 –28 dB dB dBm Notes 1) 2) 3) 4) 4 (8) The RF inputs B and C are symmetrical driven by means of a hybrid for 180° phase shifting, consequently the source impedance is 100 W. All other impedance for RF tests is 50 W. The noise figure (NF) is the value for double-side-band measurement. The intermodulation test (2-carrier-method) which is made on IF-centre is in reference to a signal-to-IM ratio of 60 dB. Gain is the ratio of the voltage at the primary coil of L5 to the available voltage at the input. TELEFUNKEN Semiconductors Rev. A2, 29-May-96 U2309B Test and Principle Application Circuit I/P Band C 180 UHF I/P Band B 180 VHFH Hybrids 0 / 180 degree o with 50 ohms Z(in) and 100 ohms (2x50) Z(out) o VS L6 I/P Band A VHFL IF : PC 38.9 MHz 1n 1n 1n 1n 1n 1n 100p L.O. 10n 15p 1n 1n SC 33.4 MHz 100p L.O. 25 21 The output–voltage of the 17 IF is calculated back to the U2309B 1 Air Coils 0.6 mm 5 primary coil of L5 9 13 1n enamelled copper wire L1 L2 L3 L4 8 3 3 3 turns 3.0 mm dia. turns 2.5 mm dia. 1p turns 2.5 mm dia. turns 2.5 mm dia. 2p7 2p2 18 2p7 2p TOKO–Coils BB620 L5 12+2 turns L6 6+6 turns 1p 2p2 L5 IF–Out 1p O/P 1n 1p 1p L3 2k2 L2 68p VSW L1 1k 15p 100p BB619 L4 18k 1n 82p 18k 8p2 18k BB515 18k 95 10718 10n VT Figure 2. Test and principle application circuit PCB for the RthJA-Measurement Material: 35 mm one-sided Cu-coated epoxy PCB, 40 mm 40 mm 1.5 mm R(th) SO28 U2300B 95 10719 Figure 3. PCB for the RthJA-measurement TELEFUNKEN Semiconductors Rev. A2, 29-May-96 5 (8) U2309B Input Impedance Mixer Band A (S11A), B and C (S11B/C) j 0.5j 2j ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁÁÁ ÁÁ ÁÁ ÁÁÁÁÁ ÁÁ ÁÁ 1045 MHz 845 MHz 0.2j 2 5j 645 MHz 445 MHz 245 MHz 0 0.2 45 MHz 0.5 1 Á Á 2 Á Á 1 ÁÁÁ ÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁ ÁÁÁÁ 5 45 MHz 250 MHz –0.2j 500 MHz –5j 1 –0.5j 750 MHz –2j Z0 = 50 W 95 9928 –j Figure 4. Input impedance mixer band A (S11A), B and C (S11B/C) 1) VHF-low Normalised to 50 W, measuring range 45 MHz to 750 MHz. 2) VHF-high and UHF Normalised to 50 W, measuring range 45 MHz to 1045 MHz. Both inputs are driven symmetrical. The output impedance of hybrid is 100 W,the measured levels are then calculated in reference to 50 W. 6 (8) TELEFUNKEN Semiconductors Rev. A2, 29-May-96 U2309B Dimensions in mm: Package: SO28 95 9932 Package: SSO28 95 10721 TELEFUNKEN Semiconductors Rev. A2, 29-May-96 7 (8) U2309B Ozone Depleting Substances Policy Statement It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances ( ODSs). The Montreal Protocol ( 1987) and its London Amendments ( 1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency ( EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively. TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 ( 0 ) 7131 67 2831, Fax number: 49 ( 0 ) 7131 67 2423 8 (8) TELEFUNKEN Semiconductors Rev. A2, 29-May-96