ZXMP10A18K 100V DPAK P-channel enhancement mode MOSFET Summary RDS(on) (⍀) ID (A) 0.150 @ VGS= -10V -5.9 0.190 @ VGS= -6V -5.2 V(BR)DSS -100 Description D This new generation trench MOSFET from Zetex features a unique structure combining the benefits of low on-resistance and fast switching, making it ideal for high efficiency power management applications. G Features • Low on-resistance • Fast switching speed • Low threshold • Low gate drive • DPAK package S D Applications • DC-DC converters • Power management functions • Disconnect switches • Motor control D G S Pinout - top view Ordering information Device ZXMP10A18KTC Reel size (inches) Tape width (mm) Quantity per reel 13 16 2,500 Device marking ZXMP 10A18 Issue 1 - August 2006 © Zetex Semiconductors plc 2006 1 www.zetex.com ZXMP10A18K Absolute maximum ratings Parameter Symbol Limit Unit Drain-source voltage VDSS -100 V Gate-source voltage VGS ± 20 V ID -5.9 A Continuous drain current @ VGS= 10V; Tamb =25°C(b) @ VGS= 10V; Tamb =70°C(b) -4.7 @ VGS= 10V; Tamb =25°C(a) -3.8 IDM -21.1 A IS -10 A Pulsed source current (body diode)(c) ISM -21.1 A Power dissipation at Tamb = 25°C(a) PD 4.3 W 34.4 mW/°C 10.2 W 81.3 mW/°C 2.17 W 17.4 mW/°C Tj, Tstg -55 to +150 °C Pulsed drain current(c) Continuous source current (body diode)(b) Linear derating factor PD Power dissipation at Tamb = 25°C(b) Linear derating factor PD Power dissipation at Tamb = 25°C(d) Linear derating factor Operating and storage temperature range Thermal resistance Parameter Symbol Limit Unit ambient(a) R⍜JA 29 °C/W Junction to ambient(b) R⍜JA 12.3 °C/W Junction to ambient(d) R⍜JA 57.6 °C/W Junction to NOTES: (a) For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions. (b) For a device surface mounted on FR4 PCB measured at t ⱕ10 sec. (c) Repetitive rating 50mm x 50mm x 1.6mm FR4 PCB, D=0.02 pulse width=300s - pulse width limited by maximum junction temperature. (d) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions. Issue 1 - August 2006 © Zetex Semiconductors plc 2006 2 www.zetex.com ZXMP10A18K Thermal characteristics Issue 1 - August 2006 © Zetex Semiconductors plc 2006 3 www.zetex.com ZXMP10A18K Electrical characteristics (at Tamb = 25°C unless otherwise stated) Parameter Symbol Min. Drain-source breakdown voltage V(BR)DSS -100 Typ. Max. Unit Conditions Static V ID= -250A, VGS=0V Zero gate voltage drain current IDSS -1 A VDS= -100V, VGS=0V Gate-body leakage IGSS 100 nA VGS=±20V, VDS=0V Gate-source threshold voltage VGS(th) -4.0 V ID= -250A, VDS=VGS Static drain-source on-state resistance (*) RDS(on) 0.150 0.190 ⍀ VGS= -10V, ID= -2.8A VGS= -6V, ID= -2.4A Forward transconductance(*)(‡) gfs 6.0 S VDS= -15V, ID= -2.8A Input capacitance Ciss 1055 pF Output capacitance Coss 90 pF VDS= -50V, VGS=0V f=1MHz Reverse transfer capacitance Crss 76 pF Turn-on-delay time td(on) 4.9 ns Rise time tr 6.8 ns Turn-off delay time td(off) 33.9 ns Fall time tf 17.9 ns Total gate charge Qg 26.9 nC Gate-source charge Qgs 3.9 nC Gate drain charge Qgd 10.2 nC Diode forward voltage(*) VSD -0.85 Reverse recovery time(‡) trr Reverse recovery charge(‡) Qrr -2.0 Dynamic(‡) (3) Switching (†) (‡) VDD= -50V, ID= -1A RG=6.0⍀, VGS= -10V VDS= -50V, VGS= -10V ID= -2.8A Source-drain diode -0.95 V Tj=25°C, IS= -3.5A, VGS=0V 49 ns 107 nC Tj=25°C, IS= -2.8A, di/dt=100A/ms NOTES: (*) Measured under pulsed conditions. Pulse width ⱕ300s; duty cycle ⱕ2% (†) Switching characteristics are independent of operating junction temperature. (‡) For design aid only, not subject to production testing. Issue 1 - August 2006 © Zetex Semiconductors plc 2006 4 www.zetex.com ZXMP10A18K Typical characteristics Issue 1 - August 2006 © Zetex Semiconductors plc 2006 5 www.zetex.com ZXMP10A18K Typical characteristics Current regulator QG 12V VG QGS 50k 0.2F Same as D.U.T QGD VDS IG D.U.T ID VGS Charge Basic gate charge waveform Gate charge test circuit VDS 90% RD VGS VDS RG VCC 10% VGS tr td(off) t(on) tr t(on) Switching time waveforms Issue 1 - August 2006 © Zetex Semiconductors plc 2006 Pulse width ⬍ 1S Duty factor 0.1% td(on) Switching time test circuit 6 www.zetex.com ZXMP10A18K Intentionally left blank Issue 1 - August 2006 © Zetex Semiconductors plc 2006 7 www.zetex.com ZXMP10A18K Package outline - DPAK DIM A A1 b b2 b3 c c2 D D1 E E1 Inches Min Max 0.086 0.094 0.005 0.020 0.035 0.030 0.045 0.205 0.215 0.018 0.024 0.018 0.023 0.213 0.245 0.205 0.250 0.265 0.170 - Millimeters Min Max 2.18 2.39 0.127 0.508 0.89 0.762 1.14 5.21 5.46 0.457 0.61 0.457 0.584 5.41 6.22 5.21 6.35 6.73 4.32 - DIM e H L L1 L2 L3 L4 L5 ⍜1° ⍜° - Inches Min Max 0.090 BSC 0.370 0.410 0.055 0.070 0.108 REF 0.020 BSC 0.035 0.065 0.025 0.040 0.045 0.060 0° 10° 0° 15° - Millimeters Min Max 2.29 BSC 9.40 10.41 1.40 1.78 2.74 REF 0.508 BSC 0.89 1.65 0.635 1.016 1.14 1.52 0° 10° 0° 15° - Note: Controlling dimensions are in inches. Approximate dimensions are provided in millimeters Europe Americas Asia Pacific Corporate Headquarters Zetex GmbH Streitfeldstraße 19 D-81673 München Germany Zetex Inc 700 Veterans Memorial Highway Hauppauge, NY 11788 USA Zetex (Asia Ltd) 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong Zetex Semiconductors plc Zetex Technology Park, Chadderton Oldham, OL9 9LL United Kingdom Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 [email protected] Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 [email protected] Telephone: (852) 26100 611 Fax: (852) 24250 494 [email protected] Telephone: (44) 161 622 4444 Fax: (44) 161 622 4446 [email protected] For international sales offices visit www.zetex.com/offices Zetex products are distributed worldwide. For details, see www.zetex.com/salesnetwork This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned. The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. Issue 1 - August 2006 © Zetex Semiconductors plc 2006 8 www.zetex.com