FAIRCHILD All

4N38M, H11D1M, H11D2M, H11D3M, MOC8204M
High Voltage Phototransistor Optocouplers
Features
General Description
■ High voltage:
The 4N38M, H11DXM and MOC8204M are phototransistor-type optically coupled optoisolators. A gallium
arsenide infrared emitting diode is coupled with a high
voltage NPN silicon phototransistor. The device is supplied in a standard plastic six-pin dual-in-line package.
– MOC8204M, BVCER = 400V
– H11D1M, H11D2M, BVCER = 300V
– H11D3M, BVCER = 200V
■ High isolation voltage:
– 7500 VAC peak, 1 second
■ Underwriters Laboratory (UL) recognized
File # E90700, Volume 2
IEC
60747-5-2 approved (ordering option V)
■
Applications
■ Power supply regulators
■ Digital logic inputs
■ Microprocessor inputs
■ Appliance sensor systems
■ Industrial controls
Schematic
ANODE 1
CATHODE 2
N/C 3
Package Outlines
6 BASE
5 COLLECTOR
4 EMITTER
©2007 Fairchild Semiconductor Corporation
4N38M, H11D1 M, H11D2M, H11D3M, MOC8204M Rev. 1.0.6
www.fairchildsemi.com
4N38M, H11D1 M, H11D2M, H11D3M, MOC8204M — High Voltage Phototransistor Optocouplers
September 2009
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
Device
Value
Units
TOTAL DEVICE
TSTG
Storage Temperature
All
-40 to +150
°C
TOPR
Operating Temperature
All
-40 to +100
°C
TSOL
Lead Solder Temperature (Wave Solder)
All
260 for 10 sec
°C
Total Device Power Dissipation @ TA = 25°C
All
260
mW
3.5
mW/°C
PD
Derate Above 25°C
EMITTER
IF
Forward DC Current(1)
All
80
mA
VR
Reverse Input Voltage(1)
All
6.0
V
Forward Current – Peak (1µs pulse, 300pps)(1)
All
3.0
A
LED Power Dissipation @ TA = 25°C(1)
All
IF(pk)
PD
Derate Above 25°C
150
mW
1.41
mW/°C
DETECTOR
PD
Power Dissipation @ TA = 25°C
All
300
mW
4.0
mW/°C
MOC8204M
400
V
H11D1M, H11D2M
300
H11D3M
200
4N38M
80
MOC8204M
400
H11D1M, H11D2M
300
H11D3M
200
4N38M
80
H11D1M, H11D2M,
H11D3M,
MOC8204M
7
V
All
100
mA
Derate linearly above 25°C
VCER
VCBO
VECO
IC
Collector to Emitter Voltage(1)
Collector
Base Voltage(1)
Emitter to
Collector Voltage(1)
Collector Current (Continuous)
V
Note:
1. Parameters meet or exceed JEDEC registered data (for 4N38M only).
©2007 Fairchild Semiconductor Corporation
4N38M, H11D1 M, H11D2M, H11D3M, MOC8204M Rev. 1.0.6
www.fairchildsemi.com
2
4N38M, H11D1 M, H11D2M, H11D3M, MOC8204M — High Voltage Phototransistor Optocouplers
Absolute Maximum Ratings
Individual Component Characteristics
Symbol
Characteristic
Test Conditions
Device
Min.
Typ.*
Max.
Unit
All
1.15
1.5
All
-1.8
mV/°C
25
V
50
pF
65
pF
EMITTER
VF
Forward Voltage(2)
∆VF
∆TA
Forward Voltage
Temp. Coefficient
BVR
Reverse Breakdown
Voltage
IR = 10µA
All
CJ
Junction Capacitance
VF = 0V, f = 1MHz
All
IF = 10mA
6
VF = 1V, f = 1MHz
IR
Reverse Leakage
Current(2)
VR = 6V
All
0.05
10
V
µA
DETECTOR
BVCER
Breakdown Voltage
Collector to Emitter(2)
BVCEO
BVCBO
RBE = 1MΩ, IC = 1.0mA, IF = 0
MOC8204M
400
H11D1M/2M
300
H11D3M
200
No RBE, IC = 1.0mA
Collector to Base(2)
IC = 100µA, IF = 0
4N38M
80
MOC8204M
400
H11D1M/2M
300
H11D3M
200
4N38M
80
BVEBO
Emitter to Base
IE = 100µA, IF = 0
4N38M
7
BVECO
Emitter to Collector
IE = 100µA, IF = 0
All
7
Leakage Current
Collector to Emitter(2)
(RBE = 1MΩ)
VCE = 300V, IF = 0, TA = 25°C
ICER
V
V
V
10
MOC8204M
VCE = 300V, IF = 0, TA = 100°C
VCE = 200V, IF = 0, TA = 25°C
H11D1M/2M
VCE = 200V, IF = 0, TA = 100°C
VCE = 100V, IF = 0, TA = 25°C
H11D3M
VCE = 100V, IF = 0, TA = 100°C
ICEO
V
100
nA
250
µA
100
nA
250
µA
100
nA
250
µA
50
nA
4N38M
No RBE, VCE = 60V, IF = 0,
TA = 25°C
Transfer Characteristics (TA = 25°C Unless otherwise specified.)
Symbol
Characteristics
Test Conditions
Device
Min.
H11D1M/2M/3M,
MOC8204M
2 (20)
2 (20)
Typ.*
Max.
Units
EMITTER
CTR
VCE(SAT)
Current Transfer
Ratio, Collector to
Emitter
IF = 10mA, VCE = 10V,
RBE = 1MΩ
IF = 10mA, VCE = 10V
4N38M
Saturation Voltage(2)
IF = 10mA, IC = 0.5mA,
RBE = 1MΩ
H11D1M/2M/3M,
MOC8204M
IF = 20mA, IC = 4mA
mA (%)
0.1
4N38M
0.40
V
1.0
SWITCHING TIMES
tON
Non-Saturated
Turn-on Time
tOFF
Turn-off Time
VCE = 10V, ICE = 2mA,
RL = 100Ω
All
5
µs
All
5
µs
*All Typical values at TA = 25°C
Note:
2. Parameters meet or exceed JEDEC registered data (for 4N38M only).
©2007 Fairchild Semiconductor Corporation
4N38M, H11D1 M, H11D2M, H11D3M, MOC8204M Rev. 1.0.6
www.fairchildsemi.com
3
4N38M, H11D1 M, H11D2M, H11D3M, MOC8204M — High Voltage Phototransistor Optocouplers
Electrical Characteristics (TA = 25°C unless otherwise specified.)
Isolation Characteristics
Symbol
VISO
Characteristic
Isolation Voltage
Test Conditions
Device
Min.
All
7500
11
f = 60Hz, t = 1 sec.
RISO
Isolation Resistance
VI-O = 500 VDC
All
CISO
Isolation Capacitance
f = 1MHz
All
10
Typ.*
Max.
Units
VACPEAK
Ω
0.2
pF
*All Typical values at TA = 25°C
Safety and Insulation Ratings
As per IEC 60747-5-2, this optocoupler is suitable for “safe electrical insulation” only within the safety limit data.
Compliance with the safety ratings shall be ensured by means of protective circuits.
Symbol
Parameter
Min.
Typ.
Max.
Unit
Installation Classifications per DIN VDE 0110/1.89
Table 1
For Rated Main Voltage < 150Vrms
I-IV
For Rated Main voltage < 300Vrms
I-IV
Climatic Classification
55/100/21
Pollution Degree (DIN VDE 0110/1.89)
2
CTI
Comparative Tracking Index
175
VPR
Input to Output Test Voltage, Method b,
VIORM x 1.875 = VPR, 100% Production Test
with tm = 1 sec, Partial Discharge < 5pC
1594
Vpeak
Input to Output Test Voltage, Method a,
VIORM x 1.5 = VPR, Type and Sample Test
with tm = 60 sec, Partial Discharge < 5pC
1275
Vpeak
VIORM
Max. Working Insulation Voltage
850
Vpeak
VIOTM
Highest Allowable Over Voltage
6000
Vpeak
External Creepage
7
mm
External Clearance
7
mm
Insulation Thickness
0.5
mm
Insulation Resistance at Ts, VIO = 500V
109
Ω
RIO
©2007 Fairchild Semiconductor Corporation
4N38M, H11D1 M, H11D2M, H11D3M, MOC8204M Rev. 1.0.6
www.fairchildsemi.com
4
4N38M, H11D1 M, H11D2M, H11D3M, MOC8204M — High Voltage Phototransistor Optocouplers
DC Electrical Characteristics (Continued) (TA = 25°C unless otherwise specified.)
Fig. 1 LED Forward Voltage vs. Forward Current
Fig. 2 Normalized Output Characteristics
NORMALIZED ICER – OUTPUT CURRENT
VF – FORWARD VOLTAGE (V)
1.8
1.7
1.6
1.5
1.4
TA = -55˚C
1.3
TA = 25˚C
1.2
1.1
TA = 100˚C
1.0
1
10
Normalized to:
VCE = 10V
IF = 10mA
RBE = 106 Ω
TA = 25˚C
10
IF = 50mA
IF = 10mA
1
IF = 5mA
0.1
0.01
0.1
100
1
IF – LED FORWARDCURRENT (mA)
Normalized to:
VCE = 10 V
IF = 10 mA
RBE = 106 Ω
TA = 25˚C
1
0.1
0.01
IF = 10mA
1
IF = 5mA
0.1
-60
10
-40
-20
VCE = 300V
VCE = 100V
10
VCE = 50V
1
0.1
10
20
30
40
50
60
70
80
90
100
110
20
40
60
80
100
Fig. 6 Normalized Collector-Base Current vs. Temperature
10
Normalized to:
VCE = 10V
IF = 10mA
RBE = 106 Ω
TA = 25˚C
9
8
IF = 50mA
7
6
5
4
3
2
IF = 10mA
1
0
-60
IF = 5mA
-40
-20
0
20
40
60
80
100
TA – AMBIENT TEMPERATURE (˚C)
TA – AMBIENT TEMPERATURE (˚C)
©2007 Fairchild Semiconductor Corporation
4N38M, H11D1 M, H11D2M, H11D3M, MOC8204M Rev. 1.0.6
NORMALIZED ICBO – COLLECTOR-BASE CURRENT
NORMALIZED ICER – DARK CURRENT
Normalized to:
VCE = 100V
RBE = 106 Ω
TA = 25˚C
100
0
TA – AMBIENT TEMPERATURE (˚C)
Fig. 5 Normalized Dark Current vs. Ambient Temperature
1000
Normalized to:
VCE = 10V
IF = 10mA
RBE = 106 Ω
TA = 25˚C
IF = 20mA
IF – LED INPUT CURRENT (mA)
10000
100
Fig. 4 Normalized Output Current vs. Temperature
NORMALIZED ICER – OUTPUT CURRENT
NORMALIZED ICER – OUTPUT CURRENT
Fig. 3 Normalized Output Current vs. LED Input Current
10
1
10
VCE – COLLECTOR VOLTAGE (V)
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5
4N38M, H11D1 M, H11D2M, H11D3M, MOC8204M — High Voltage Phototransistor Optocouplers
Typical Performance Curves
Through Hole
0.4" Lead Spacing
8.13–8.89
6
4
8.13–8.89
6
4
1
3
6.10–6.60
6.10–6.60
Pin 1
1
3
Pin 1
5.08 (Max.)
0.25–0.36
7.62 (Typ.)
3.28–3.53
5.08 (Max.)
0.25–0.36
3.28–3.53
0.38 (Min.)
2.54–3.81
0.38 (Min.)
2.54–3.81
0.20–0.30
2.54 (Bsc)
(0.86)
15° (Typ.)
2.54 (Bsc)
(0.86)
0.41–0.51
1.02–1.78
0.20–0.30
0.41–0.51
0.76–1.14
10.16–10.80
1.02–1.78
0.76–1.14
Surface Mount
(1.78)
8.13–8.89
6
4
(1.52)
(2.54)
(7.49)
6.10–6.60
8.43–9.90
(10.54)
1
3
(0.76)
Pin 1
Rcommended Pad Layout
0.25–0.36
3.28–3.53
5.08
(Max.)
0.38 (Min.)
0.20–0.30
2.54 (Bsc)
(0.86)
0.16–0.88
(8.13)
0.41–0.51
1.02–1.78
0.76–1.14
Note:
All dimensions in mm.
©2007 Fairchild Semiconductor Corporation
4N38M, H11D1 M, H11D2M, H11D3M, MOC8204M Rev. 1.0.6
www.fairchildsemi.com
6
4N38M, H11D1 M, H11D2M, H11D3M, MOC8204M — High Voltage Phototransistor Optocouplers
Package Dimensions
Option
Order Entry Identifier
(Example)
Description
No option
H11D1M
Standard Through Hole Device (50 units per tube)
S
H11D1SM
SR2
H11D1SR2M
T
H11D1TM
0.4" Lead Spacing
V
H11D1VM
VDE 0884
TV
H11D1TVM
VDE 0884, 0.4" Lead Spacing
SV
H11D1SVM
VDE 0884, Surface Mount
SR2V
H11D1SR2VM
Surface Mount Lead Bend
Surface Mount; Tape and Reel
VDE 0884, Surface Mount, Tape and Reel
Marking Information
1
V
3
H11D1
2
X YY Q
6
4
5
Definitions
1
Fairchild logo
2
Device number
3
VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4
One digit year code, e.g., ‘7’
5
Two digit work week ranging from ‘01’ to ‘53’
6
Assembly package code
©2007 Fairchild Semiconductor Corporation
4N38M, H11D1 M, H11D2M, H11D3M, MOC8204M Rev. 1.0.6
www.fairchildsemi.com
7
4N38M, H11D1 M, H11D2M, H11D3M, MOC8204M — High Voltage Phototransistor Optocouplers
Ordering Information
12.0 ± 0.1
4.5 ± 0.20
2.0 ± 0.05
Ø1.5 MIN
4.0 ± 0.1
0.30 ± 0.05
1.75 ± 0.10
11.5 ± 1.0
21.0 ± 0.1
9.1 ± 0.20
Ø1.5 ± 0.1/-0
10.1 ± 0.20
0.1 MAX
24.0 ± 0.3
User Direction of Feed
Reflow Profile
300
260°C
280
260
>245°C = 42 Sec
240
220
200
180
°C
Time above
183°C = 90 Sec
160
140
120
1.822°C/Sec Ramp up rate
100
80
60
40
33 Sec
20
0
0
60
120
180
270
360
Time (s)
©2007 Fairchild Semiconductor Corporation
4N38M, H11D1 M, H11D2M, H11D3M, MOC8204M Rev. 1.0.6
www.fairchildsemi.com
8
4N38M, H11D1 M, H11D2M, H11D3M, MOC8204M — High Voltage Phototransistor Optocouplers
Carrier Tape Specification
Auto-SPM™
Build it Now™
CorePLUS™
CorePOWER™
CROSSVOLT™
CTL™
Current Transfer Logic™
EcoSPARK®
EfficentMax™
EZSWITCH™*
™*
®
®
Fairchild
Fairchild Semiconductor®
FACT Quiet Series™
FACT®
FAST®
FastvCore™
FETBench™
FlashWriter®*
FPS™
F-PFS™
FRFET®
SM
Global Power Resource
Green FPS™
Green FPS™ e-Series™
Gmax™
GTO™
IntelliMAX™
ISOPLANAR™
MegaBuck™
MICROCOUPLER™
MicroFET™
MicroPak™
MillerDrive™
MotionMax™
Motion-SPM™
OPTOLOGIC®
®
OPTOPLANAR
®
PDP SPM™
Power-SPM™
PowerTrench®
PowerXS™
Programmable Active Droop™
QFET®
QS™
Quiet Series™
RapidConfigure™
™
Saving our world, 1mW/W/kW at a time™
SmartMax™
SMART START™
SPM®
STEALTH™
SuperFET™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
SupreMOS™
SyncFET™
Sync-Lock™
®
*
The Power Franchise®
TinyBoost™
TinyBuck™
TinyLogic®
TINYOPTO™
TinyPower™
TinyPWM™
TinyWire™
TriFault Detect™
TRUECURRENT™*
µSerDes™
UHC®
Ultra FRFET™
UniFET™
VCX™
VisualMax™
XS™
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR
CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE
SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN,
WHICH COVERS THESE PRODUCTS.
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FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE
EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are
intended for surgical implant into the body or (b) support or sustain life,
and (c) whose failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be reasonably
expected to result in a significant injury of the user.
2. A critical component in any component of a life support, device, or
system whose failure to perform can be reasonably expected to
cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ANTI-COUNTERFEITING POLICY
Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com,
under Sales Support.
Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts.
Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications,
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PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Advance Information
Formative / In Design
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
Definition
Datasheet contains the design specifications for product development. Specifications may change in
any manner without notice.
Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild
Semiconductor reserves the right to make changes at any time without notice to improve design.
Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes
at any time without notice to improve the design.
Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor.
The datasheet is for reference information only.
Rev. I40
©2007 Fairchild Semiconductor Corporation
4N38M, H11D1 M, H11D2M, H11D3M, MOC8204M Rev. 1.0.6
www.fairchildsemi.com
9
4N38M, H11D1 M, H11D2M, H11D3M, MOC8204M — High Voltage Phototransistor Optocouplers
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intended to be an exhaustive list of all such trademarks.