FOD852 4-Pin High Operating Temperature Photodarlington Optocoupler Features Description ■ Applicable to Pb-free IR reflow soldering The FOD852 consists of gallium arsenide infrared emitting diode driving a silicon photodarlington output (with integral base-emitter resistor) in a 4-pin dual in-line package. ■ Compact 4-pin package ■ High current transfer ratio: 1000% minimum ■ C-UL, UL, and VDE approved ■ High input-output isolation voltage of 5000Vrms ■ High operating temperature of 100°C Applications ■ Power supply regulators ■ Digital logic inputs ■ Microprocessor inputs Functional Block Diagram ANODE 1 4 COLLECTOR 4 CATHODE 2 3 EMITTER 1 ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.1 www.fairchildsemi.com FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler December 2008 Symbol Parameter Value Units TOTAL DEVICE TSTG Storage Temperature -55 to +125 °C TOPR Operating Temperature -30 to +100 °C TSOL Lead Solder Temperature 260 for 10 sec °C PTOT Total Device Power Dissipation 200 mW IF Continuous Forward Current 50 mA VR Reverse Voltage 6 V PD LED Power Dissipation 70 mW VCEO Collector-Emitter Voltage 300 V VECO Emitter-Collector Voltage 0.1 V IC Continuous Collector Current 150 mA PC Collector Power Dissipation 150 mW INPUT OUTPUT ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.1 www.fairchildsemi.com 2 FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler Absolute Maximum Ratings (TA = 25°C Unless otherwise specified.) Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Individual Component Characteristics Symbol Parameter Test Conditions Min. Typ. Max. Unit 1.2 1.4 V 10 µA 30 250 pF 200 nA INPUT VF Forward Voltage IF = 10mA IR Reverse Current VR = 4V Ct Terminal Capacitance V = 0, f = 1kHz Collector Dark Current VCE = 200V, IF = 0 BVCEO Collector-Emitter Breakdown Voltage IC = 0.1mA, IF = 0 300 V BVECO Emitter-Collector Breakdown Voltage IE = 10µA, IF = 0 0.1 V OUTPUT ICEO Transfer Characteristics Symbol IC CTR VCE (sat) DC Characteristic Collector Current Test Conditions Min. IF = 1mA, VCE = 2V Current Transfer Ratio(1) Collector-Emitter Saturation Voltage IF = 20mA, IC = 100mA Riso Isolation Resistance DC500V 40~60% R.H. Cf Floating Capacitance V = 0, f = 1MHz fC Cut-Off Frequency VCE = 2V, IC = 20mA, RL = 100Ω, -3dB tr Response Time (Rise) VCE = 2V, IC = 20mA, RL = 100Ω tf Response Time (Fall) Typ. Max. Unit 10 40 1 f0 mA 1,000 4,000 15,000 % 1.2 V 1 pF Ω 5x1010 1x1011 0.6 1 7 kHz 100 300 µs 20 100 µs Isolation Characteristics Symbol Characteristic Test Conditions VISO Input-Output Isolation Voltage f = 60Hz, t = 1 min, II-O ≤ 2µA RISO Isolation Resistance VI-O = 500 VDC CISO Isolation Capacitance VI-O = 0, f = 1MHz Min. Typ. Max. 5000 5 x 1010 Units Vac(rms) 1011 – Ω 0.6 1.0 pf Note: 1. Current Transfer Ratio (CTR) = IC/IF x 100%. ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.1 www.fairchildsemi.com 3 FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler Electrical Characteristics (TA = 25°C unless otherwise specified.) FORWARD CURRENT IF (mA) 60 50 40 30 20 10 0 -30 Fig. 2 Collector Power Dissipation vs. Ambient Temperature COLLECTOR POWER DISSIPATION PC (mW) Fig. 1 Forward Current vs. Ambient Temperature 0 25 50 75 100 125 AMBIENT TEMPERATURE TA (°C) 200 150 100 50 0 -30 5 Fig. 4 Forward Current vs. Forward Voltage 100 Ic =5mA 10mA 30mA 50mA 70mA 100mA 4. 5 4 3. 5 3 FORWARD CURRENT IF (mA) COLLECTOR-EMITTER SATURATION VOLTAGE VCE (sat) (V) Fig. 3 Collector-Emitted Saturation Voltage vs. Forward Current 0 20 40 60 80 100 AMBIENT TEMPERATURE TA (°C) 2. 5 2 1. 5 1 100°C 20°C 60°C 10 0. 5 0 1 1 0 2 3 4 5 0. 5 0.7 FORWARD CURRENT IF (mA) 0.9 1. 3 1.5 1. 7 1.9 Fig. 6 Collector Current vs. Collector-Emitter Voltage 100 7000 COLLECTOR CURRENT IC (mA) VCE = 2V 6000 5000 4000 3000 2000 1000 0 0. 1 1.1 FORWARD VOLTAGE VF (V) Fig. 5 Current Transfer Ratio vs. Forward Current CURRENT TRANSFER RATIO CTR ( %) 40 °C 80°C 10m A 2. 5mA 5m A 80 3m A 2mA 1. 5mA 60 1mA PC (M AX.) 40 20 IF = 0.5mA 0 1 0 10 FORWARD CURRENT IF (mA) ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.1 1 2 3 4 5 COLLECTOR-EMITTER VOLTAGE VCE (V) www.fairchildsemi.com 4 FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler Typical Electrical/Optical Characteristic Curves (TA = 25°C Unless otherwise specified.) COLLECTOR-EMITTER SATURATION VOLTAGE VCE (sat) (V) Fig. 7. Relative Current Transfer Ratio vs. Ambient Temperature RELATIVE CURRENT TRANSFER RATIO (%) 1.0 IF = 1mA VCE = 2V 0.8 0.6 0.4 0.2 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 20 40 60 80 100 AMBIENT TEMPERATURE TA (°C) 40 60 80 100 AMBIENT TEMPERATURE TA (°C) Fig. 9 Collector Dark Current vs. Ambient Temperature VCE = 200V VCE = 2V 500 I = 20mA C 100 tr 200 100 tf 50 td ts 20 10 5 2 10 20 40 60 80 100 AMBIENT TEMPERATURE TA (°C) 1 Fig. 11. Frequency Response Test Circuit for Response Time 0.1 1 10 LOAD RESISTANCE RL (kΩ) VCE = 2V IC = 2mA 0 VOLTAGE GAIN AV (dB) Fig. 10. Response Time vs. Load Resistance 1000 1000 RESPONSE TIME (µs) COLLECTOR DARK CURRENT ICEO (nA) 0 20 Fig. 8 Collector-Emitter Saturation Voltage vs. Ambient Temperature 1.20 IF = 20mA 1.10 IC = 100mA 1.00 Vcc -5 Input RD Input Output RL 10% Output 90% -10 ts td -15 RL=1kΩ 100Ω 10Ω tr tf -20 Test Circuit for Frequency Response -25 Vcc 0.1 1 10 100 FREQUENCY f (kHz) ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.1 500 RD RL Output www.fairchildsemi.com 5 FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler Typical Electrical/Optical Characteristic Curves (TA = 25°C Unless otherwise specified.) Through Hole Surface Mount 0.276 (7.00) 0.236 (6.00) 0.200 (5.10) 0.161 (4.10) 0.312 (7.92) 0.288 (7.32) 0.157 (4.00) 0.118 (3.00) 0.130 (3.30) 0.091 (2.30) 0.200 (5.10) 0.161 (4.10) SEATING PLANE SEATING PLANE 0.312 (7.92) 0.288 (7.32) 0.157 (4.00) 0.118 (3.00) 0.051 (1.30) 0.043 (1.10) 0.020 (0.51) TYP 0.276 (7.00) 0.236 (6.00) 0.010 (0.26) 0.049 (1.25) 0.030 (0.76) 0.024 (0.60) 0.004 (0.10) 0.412 (10.46) 0.388 (9.86) 0.010 (0.26) 0.150 (3.80) 0.110 (2.80) 0.110 (2.79) 0.090 (2.29) 0.393 (9.98) 0.300 (7.62) Lead Coplanarity 0.004 (0.10) MAX 0.024 (0.60) 0.016 (0.40) 0.110 (2.79) 0.090 (2.29) Surface Mount (Footprint Dimensions) 0.4" Lead Spacing 1.5 SEATING PLANE 1.3 0.200 (5.10) 0.161 (4.10) 0.312 (7.92) 0.288 (7.32) 0.157 (4.00) 0.118 (3.00) 0.276 (7.00) 0.236 (6.00) 9 0.291 (7.40) 0.252 (6.40) 0.130 (3.30) 0.091 (2.30) 0.110 (2.80) 0.011 (1.80) 0.150 (3.80) 0.110 (2.80) 0.024 (0.60) 0.016 (0.40) 0.010 (0.26) 2.54 0.110 (2.79) 0.090 (2.29) 0.42 (10.66) 0.38 (9.66) Note: All dimensions are in inches (millimeters) Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.1 www.fairchildsemi.com 6 FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler Package Dimensions Option Order Entry Identifier Description S .S Surface Mount Lead Bend SD .SD Surface Mount; Tape and reel W .W 0.4" Lead Spacing 300 .300 VDE Approved 300W .300W VDE Approved, 0.4" Lead Spacing 3S .3S VDE Approved, Surface Mount 3SD .3SD VDE Approved, Surface Mount, Tape & Reel Marking Information 4 5 V X ZZ Y 3 852 6 2 1 Definitions 1 Fairchild logo 2 Device number 3 VDE mark (Note: Only appears on parts ordered with VDE option – See order entry table) 4 One digit year code 5 Two digit work week ranging from ‘01’ to ‘53’ 6 Assembly package code ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.1 www.fairchildsemi.com 7 FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler Ordering Information P2 Ø1.55±0.05 P0 1.75±0.1 F W B0 A0 P1 0.3±0.05 K0 Note: All dimensions are in millimeters. Symbol Description Dimensions in mm (inches) W Tape wide 16 ± 0.3 (.63) P0 Pitch of sprocket holes 4 ± 0.1 (.15) F P2 Distance of compartment 7.5 ± 0.1 (.295) 2 ± 0.1 (.079) P1 Distance of compartment to compartment 12 ± 0.1 (.472) A0 Compartment 10.45 ± 0.1 (.411) B0 5.30 ± 0.1 (.209) K0 4.25 ± 0.1 (.167) ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.1 www.fairchildsemi.com 8 FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler Carrier Tape Specifications Temperature (°C) Tp Tsmax Ramp-down Tsmin 25°C Soldering zon ts (Preheat) Time (sec) Profile Feature Pb-Sn solder assembly Lead Free assembly Preheat condition (Tsmin-Tsmax / ts) 100°C ~ 150°C 60 ~ 120 sec 150°C ~ 200°C 60 ~120 sec Melt soldering zone 183°C 60 ~ 120 sec 217°C 30 ~ 90 sec Peak temperature (Tp) 240 +0/-5°C 260 +0/-5°C Ramp-down rate 6°C/sec max. 6°C/sec max. Recommended Wave Soldering condition Profile Feature For all solder assembly Peak temperature (Tp) ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.1 Max 260°C for 10 sec www.fairchildsemi.com 9 FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler Lead Free Recommended IR Reflow Condition Build it Now™ CorePLUS™ CorePOWER™ CROSSVOLT™ CTL™ Current Transfer Logic™ EcoSPARK® EfficentMax™ EZSWITCH™ * ™ ® Fairchild® Fairchild Semiconductor® FACT Quiet Series™ ® FACT ® FAST FastvCore™ FlashWriter® * FPS™ F-PFS™ FRFET® SM Global Power Resource Green FPS™ Green FPS™e-Series™ GTO™ IntelliMAX™ ISOPLANAR™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MillerDrive™ MotionMax™ Motion-SPM™ OPTOLOGIC® ® OPTOPLANAR ® PDP SPM™ Power-SPM™ PowerTrench® PowerXS™ Programmable Active Droop™ QFET® QS™ Quiet Series™ RapidConfigure™ ™ Saving our world, 1mW/W/kW at a time™ SmartMax™ SMART START™ SPM® STEALTH™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SupreMOS™ SyncFET™ ® TinyBoost™ TinyBuck™ TinyLogic® TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ µSerDes™ UHC® Ultra FRFET™ UniFET™ VCX™ VisualMax™ XS™ The Power Franchise® * EZSWITCH™ and FlashWriter® are trademarks of System General Corporation, used under license by Fairchild Semiconductor. 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Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I37 ©2006 Fairchild Semiconductor Corporation FOD852 Rev. 1.2.1 www.fairchildsemi.com 10 FOD852 — 4-Pin High Operating Temperature Photodarlington Optocoupler TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks.