GBPC 12, 15, 25, 35 SERIES
Bridge Rectifiers (Glass Passivated)
Features
• Integrally molded heat-sink provided very low thermal resistance for maximum heat dissipation.
• Surge Overload Ratings from 300 A to 400 A.
• Isolated voltage from case to lead over 2500 V.
• UL certified, UL #E258596
• Terminals Finish Material - Silver (Solderable per MIL-STD-202, Method 208 for the wire type GBPC-W package)
- Nickel for GBPC package.
Suffix “W”
• Wire Lead Structure
Suffix “M”
• Terminal Location Face to Face
~
–
~
–
+
~
~
GBPC
+
GBPC-W
Ordering Informations
Part Number
Marking
Package
Packing Method
GBPC35005W
GBPC35005W
GBPC-W 4L
Bulk
GBPC35005
GBPC35005
GBPC 4L
Bulk
© 2010 Fairchild Semiconductor Corporation
GBPC 12, 15, 25, 35 SERIES Rev. 1.3.1
www.fairchildsemi.com
1
GBPC 12, 15, 25, 35 SERIES — Bridge Rectifiers (Glass Passivated)
June 2013
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. Values are at TA = 25°C unless otherwise noted.
Symbol
Value
Parameter
005
01
02
04
06
08
10
Units
VRRM
Maximum Repetitive Reverse Voltage
50
100
200
400
600
800
1000
V
VRMS
Maximum RMS Bridge Input Voltage
35
70
140
280
420
560
700
V
DC Reverse Voltage (Rated VR)
50
100
200
400
600
800
1000
V
VR
IF(AV)
GBPC12
12
GBPC15
15
GBPC25
25
GBPC35
35
Forward GBPC12,
15, 25
300
Average Rectified Forward
Current at TC = 55°C
Peak
A
IFSM
Non-Repetitive
Surge Current
400
A
TSTG
Storage Temperature Range
-55 to +150
°C
Operating Junction Temperature
-55 to +150
°C
8.3ms Single Half-Sine-Wave
TJ
GBPC35
A
Note:
1. These ratings are limiting values above which the serviceability of any semiconductor device may by impaired.
Thermal Characteristics
Values are at TA = 25°C unless otherwise noted.
Symbol
PD
Parameter
Value
Power Dissipation
Units
83.3
W
1.5
°C/W
Value
Units
1.1 (Max)
V
TA = 25°C
5.0 (Max)
μA
TA = 125°C
500 (Max)
Thermal Resistance, Junction to Case(2)
RθJC
Note:
2. With Heatsink.
Electrical Characteristics
Values are at TA = 25°C unless otherwise noted.
Symbol
Parameter
Test Conditions
6.0 A
VF
IR
Forward Voltage Drop, per bridge
Reverse Current, per element at Rated VR
I2t
Rating for Fusing t < 8.35 ms
CT
Total Capacitance, per leg
VR = 4.0 V
f = 1.0 MHz
© 2010 Fairchild Semiconductor Corporation
GBPC 12, 15, 25, 35 SERIES Rev. 1.3.1
GBPC12
7.5 A
GBPC15
12.5 A
GBPC25
17.5 A
GBPC35
μA
2
GBPC12, 15, 25
375
A Sec
GBPC35
660
A2Sec
GBPC12, 15, 25
180
pF
GBPC35
200
pF
www.fairchildsemi.com
2
GBPC 12, 15, 25, 35 SERIES — Bridge Rectifiers (Glass Passivated)
Absolute Maximum Ratings(1)
Peak Forward Surge Current, IFSM [A]
Average Rectified Forward Current, IF [A]
400
40
GBPC35
SINGLE PHASE
HALF WAVE
60Hz
RESISTIVE OR
INDUCTIVE LOAD
LENGTHS
30
GBPC25
200
100
20
GBPC15
10
0
GBPC35
GBPC12
0
25
50
75
100
125
150
175
GBPC12-GBPC25
50
20
1
Case Temperature [ºC]
Ambient
Figure 1. Forward Current Derating Curve
5
10
20
Number of Cycles at 60Hz
50
100
Figure 2. Non-Repetitive Surge Current
200
100
100
GBPC35
T A = 125 º C
GBPC25
IR [μA]
Reverse Current, IR
[mA]
Forward Current, IF [A]
2
GBPC12-GBPC15
10
1
TA = 25º C
μs
Pulse Width = 300μ
2% Duty Cycle
0.1
0.6
0.8
Fi
3 F
1
1.2
1.4
1.6
Forward Voltage, VF [V]
dV l
Ch
1.8
1
TA = 25º C
0.1
2
Fi
i i
0
20
40
60
80
100
120
140
Percent
of Rated
Reverse
Voltage
[%][%]
Percent
of Rated
PeakPeak
Reverse
Voltage
(per leg)
4 R
C
R
V l
Figure 4. Reverse Current vs. Reverse Voltage
Figure 3. Forward Voltage Characteristics
© 2010 Fairchild Semiconductor Corporation
GBPC 12, 15, 25, 35 SERIES Rev. 1.3.1
10
www.fairchildsemi.com
3
GBPC 12, 15, 25, 35 SERIES — Bridge Rectifiers (Glass Passivated)
Typical Performance Characteristics
GBPC 12, 15, 25, 35 SERIES — Bridge Rectifiers (Glass Passivated)
Physical Dimensions
GBPC
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Figure 5. 4-TERMINAL, COMBINATION GBPC AND GBPC-W (ACTIVE)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
For current tape and reel specifications, visit Fairchild Semiconductor’s online packaging area:
http://www.fairchildsemi.com/packing_dwg/PKG-GBPC04A_TSC.pdf.
© 2010 Fairchild Semiconductor Corporation
GBPC 12, 15, 25, 35 SERIES Rev. 1.3.1
www.fairchildsemi.com
4
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First Production
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Datasheet contains the design specifications for product development. Specifications may change
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Rev. I64
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