FREESCALE MC34911BAC

MC33910G5AC/MC3433910G5AC
Freescale Semiconductor
Advance Information
Document Number: MC33911
Rev. 8.0, 3/2010
LIN System Basis Chip with DC
Motor Pre-driver
33911
The 33911G5/BAC is a Serial Peripheral Interface (SPI) controlled
System Basis Chip (SBC), combining many frequently used functions
in an MCU based system, plus a Local Interconnect Network (LIN)
transceiver. The 33911 has a 5.0 V, 50 mA/60 mA low dropout
regulator with full protection and reporting features. The device
provides full SPI readable diagnostics and a selectable timing
watchdog for detecting errant operation. The LIN Protocol Specification
2.0 and 2.1 compliant LIN transceiver has waveshaping circuitry that
can be disabled for higher data rates.
One 50 mA/60 mA high side switch and two 150 mA/160 mA low
side switches with output protection are available. All outputs can be
pulse-width modulated (PWM). Two high voltage inputs are available
for use in contact monitoring, or as external wake-up inputs. These
inputs can be used as high voltage Analog Inputs. The voltage on these
pins is divided by a selectable ratio and available via an analog
multiplexer.
The 33911 has three main operating modes: Normal (all functions
available), Sleep (VDD off, wake-up via LIN, wake-up inputs (L1, L2),
cyclic sense and forced wake-up), and Stop (VDD on with limited current
capability, wake-up via CS, LIN bus, wake-up inputs, cyclic sense,
forced wake-up and external reset).
The 33911 is compatible with LIN Protocol Specification 2.0, 2.1, and
SAEJ2602-2.
SYSTEM BASIS CHIP WITH LIN
2ND GENERATION
AC SUFFIX (Pb-FREE)
98ASH70029A
32-PIN LQFP
ORDERING INFORMATION
Features
• Full-duplex SPI interface at frequencies up to 4.0 MHz
• LIN transceiver capable of up to 100 kbps with wave shaping
• One 50 mA/60 mA high side and two 150 mA/60 mA low side
protected switches
• Two high voltage analog/logic Inputs
• Configurable window watchdog
• 5.0 V low drop regulator with fault detection and low voltage reset
(LVR) circuitry
• Pb-free packaging designated by suffix code AC
Device
Temperature
Range (TA)
MC33911G5AC/R2
- 40°C to 125°C
MC34911G5AC/R2
-40°C to 85°C
MC33911BAC/R2
- 40°C to 125°C
MC34911BAC/R2
-40°C to 85°C
* See Page 2 for Device Variations
33911
VBAT
VSENSE
HS1
VS1
VS2
LIN INTERFACE
L1
L2
LIN
VDD
PWMIN
ADOUT0
LS1
M
MOSI
MISO
SCLK
CS
RXD
TXD
IRQ
RST
LS2
WDCONF
LGND
PGND
AGND
MCU
Figure 1. 33911 Simplified Application Diagram
* This document contains certain information on a new product.
Specifications and information herein are subject to change without notice.
© Freescale Semiconductor, Inc., 2009 - 2010. All rights reserved.
Package
32-LQFP
MC33911G5AC/MC3433911G5AC
DEVICE VARIATIONS
DEVICE VARIATIONS
The 33911G5 data sheet is within MC33911G5 Product
Specifications Pages 3 to 47
The 33911BAC data sheet is within MC33911BAC
Product Specifications pages 48 to 88
Table 1. This specification support the following products
Device
MC33911G5AC
Temperature
Generation
1. Increase ESD GUN IEC61000-4-2 (gun test contact with 150 pF,
330 Ω test conditions) performance to achieve ±6.0 kV min on the LIN
pin.
- 40 to 125°C
2.5
MC34911G5AC
- 40 to 85°C
MC33911BAC/R2
- 40 to 125°C
MC34911BAC/R2
- 40 to 85°C
2. Immunity against ISO7637 pulse 3b
3. Reduce EMC emission level on LIN
4. Improve EMC immunity against RF – target new specification
including 3x68 pF
5. Comply with J2602 conformance test
2.0
Initial release
33911
2
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
MC33911G5 PRODUCT SPECIFICATIONS PAGES 3 TO 47
MC33911G5 PRODUCT SPECIFICATIONS
PAGES 3 TO 47
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
3
MC33911G5AC/MC3433911G5AC
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
RST IRQ
INTERRUPT CONTROL
MODULE
LVI, HVI,
ALL OT (VDD,HS,LS,LIN,SD)
RESET CONTROL
MODULE
LVR, WD, EXT ΜC
VS1
INTERNAL BUS
VS2
VDD
AGND
VOLTAGE REGULATOR
LS1
LOW SIDE
CONTROL
MODULE
WINDOW
WATCHDOG
MODULE
LS2
PWMIN
PGND
VS2
MISO
SCLK
HS1
SPI
&
CONTROL
ANALOG MULTIPLEXER
MOSI
HIGH SIDE
CONTROL
MODULE
CS
ADOUT0
WAKE-UP MODULE
VBAT
SENSE MODULE
CHIP TEMPERATURE
SENSE MODULE
ANALOG INPUT
MODULE
DIGITAL INPUT MODULE
RXD
TXD
VSENSE
L1
L2
LIN PHYSICAL
LAYER
LIN
LGND
WDCONF
Figure 2. 33911G5 Simplified Internal Block Diagram
33911
4
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
PIN CONNECTIONS
AGND
VDD
NC*
VSENSE
NC*
VS1
VS2
HS1
32
31
30
29
28
27
26
25
PIN CONNECTIONS
RXD
1
24
NC*
TXD
2
23
L1
MISO
3
22
L2
MOSI
4
21
NC*
SCLK
5
20
NC*
CS
6
19
LS1
ADOUT0
7
18
PGND
PWMIN
8
17
LS2
9
10
11
12
13
14
15
16
RST
IRQ
NC*
WDCONF
LIN
LGND
NC*
NC*
* See Recommendation in Table below
Figure 3. 33911 Pin Connections
Table 2. 33911 Pin Definitions
A functional description of each pin can be found in the Functional Pin Description section beginning on page 24.
Pin
Pin Name
Formal Name
Definition
1
RXD
Receiver Output
This pin is the receiver output of the LIN interface which reports the state of
the bus voltage to the MCU interface.
2
TXD
Transmitter Input
This pin is the transmitter input of the LIN interface which controls the state of
the bus output.
3
MISO
SPI Output
SPI (Serial Peripheral Interface) data output. When CS is high, pin is in the
high-impedance state.
4
MOSI
SPI Input
SPI (Serial Peripheral Interface) data input.
5
SCLK
SPI Clock
SPI (Serial Peripheral Interface) clock Input.
6
CS
SPI Chip Select
7
ADOUT0
Analog Output Pin 0
8
PWMIN
PWM Input
9
RST
Internal Reset I/O
Bidirectional Reset I/O pin - driven low when any internal reset source is
asserted. RST is active low.
10
IRQ
Internal Interrupt
Output
Interrupt output pin, indicating wake-up events from Stop mode or events from
Normal and Normal request modes. IRQ is active low.
11 & 30
NC
Not Connected
SPI (Serial Peripheral Interface) chip select input pin. CS is active low.
Analog Multiplexer Output.
High Side and Low Side Pulse Width Modulation Input.
This pin must not be connected.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
MC33911G5AC/MC3433911G5AC
PIN CONNECTIONS
Table 2. 33911 Pin Definitions
A functional description of each pin can be found in the Functional Pin Description section beginning on page 24.
Pin
Pin Name
Formal Name
Definition
12
WDCONF
Watchdog
Configuration Pin
13
LIN
LIN Bus
14
LGND
LIN Ground Pin
This pin is the device LIN ground connection. It is internally connected to the
PGND pin.
15,16, 20 &
21
NC
Not Connected
This pin must not be connected or connected to ground.
17
LS2
19
LS1
18
PGND
22
L2
23
L1
24
This input pin is for configuration of the watchdog period and allows the
disabling of the watchdog.
This pin represents the single-wire bus transmitter and receiver.
Low Side Outputs
Relay drivers low side outputs.
Power Ground Pin
This pin is the device low side ground connection. It is internally connected to
the LGND pin.
Wake-up Inputs
These pins are the wake-up capable digital inputs(1). In addition, all Lx inputs
can be sensed analog via the analog multiplexer.
NC
Not Connected
This pin must not be connected or connected to VS2.
25
HS1
High Side Output
High side switch output.
26
VS2
27
VS1
Power Supply Pin
These pins are device battery level power supply pins. VS2 is supplying the
HS1 driver while VS1 supplies the remaining blocks.(2)
28
NC
Not Connected
This pin can be left opening or connected to any potential ground or power
supply
29
VSENSE
Voltage Sense Pin
Battery voltage sense input.(3)
31
VDD
Voltage Regulator
Output
+5.0 V main voltage regulator output pin.(4)
32
AGND
Analog Ground Pin
This pin is the device analog ground connection.
Notes
1. When used as digital input, a series 33 kΩ resistor must be used to protect against automotive transients.
2. Reverse battery protection series diodes must be used externally to protect the internal circuitry.
3. This pin can be connected directly to the battery line for voltage measurements. The pin is self protected against reverse battery
connections. It is strongly recommended to connect a 10 kΩ resistor in series with this pin for protection purposes.
4. External capacitor (2.0 µF < C < 100 µF; 0.1 Ω < ESR < 10 Ω) required.
33911
6
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
Normal Operation (DC)
VSUP(SS)
-0.3 to 27
Transient Conditions (load dump)
VSUP(PK)
-0.3 to 40
VDD
-0.3 to 5.5
VIN
-0.3 to VDD +0.3
VIN(IRQ)
-0.3 to 11
HS1 Pin Voltage (DC)
VHS
- 0.3 to VSUP +0.3
V
LS1 and LS2 Pin Voltage (DC)
VLS
-0.3 to 45
V
Normal Operation with a series 33k resistor (DC)
VLxDC
-18 to 40
Transient input voltage with external component (according to ISO7637-2)
(See Figure 5, page 20)
VLxTR
±100
VVSENSE
-27 to 40
Normal Operation (DC)
VBUSDC
-18 to 40
Transient input voltage with external component (according to ISO7637-2)
(See Figure 4, page 20)
VBUSTR
-150 to 100
IVDD
Internally Limited
ELECTRICAL RATINGS
Supply Voltage at VS1 and VS2
Supply Voltage at VDD
Input / Output Pins Voltage
V
(5)
CS, RST, SCLK, PWMIN, ADOUT0, MOSI, MISO, TXD, RXD
Interrupt Pin (IRQ)(6)
V
L1 and L2 Pin Voltage
VSENSE Pin Voltage (DC)
V
LIN Pin Voltage
VDD Output Current
V
V
V
A
Notes
5. Exceeding voltage limits on specified pins may cause a malfunction or permanent damage to the device.
6. Extended voltage range for programming purpose only.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
MC33911G5AC/MC3433911G5AC
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
ESD Capability
Unit
V
AECQ100
Human Body Model - JESD22/A114 (CZAP = 100 pF, RZAP = 1500 Ω)
± 8.0k
LIN Pin
VESD1-1
L1 and L2
VESD1-2
± 6.0k
all other Pins
VESD1-3
±2000
Corner Pins (Pins 1, 8, 9, 16, 17, 24, 25 and 32)
VESD2-1
± 750
All other Pins (Pins 2-7, 10-15, 18-23, 26-31)
VESD2-2
± 500
LIN pin with 220 pF
VESD3-1
± 20k
LIN pin without capacitor
VESD3-2
± 11k
VS1/VS2 (100 nF to ground)
VESD3-3
>± 12k
Lx inputs (33 kΩ serial resistor)
VESD3-4
±6000
LIN pin with 220 pF and without capacitor
VESD4-1
± 8000
VS1/VS2 (100 nF to ground)
VESD4-2
± 8000
VESD4-3
± 8000
Charge Device Model - JESD22/C101 (CZAP = 4.0 pF)
According to LIN Conformance Test Specification / LIN EMC Test
Specification, August 2004 (CZAP = 150 pF, RZAP = 330 Ω)
Contact Discharge, Unpowered
According to IEC 61000-4-2 (CZAP = 150 pF, RZAP = 330 Ω)
Unpowered
Lx inputs (33 kΩ serial resistor)
THERMAL RATINGS
Operating Ambient Temperature (7)
Operating Junction Temperature
°C
TA
33911
-40 to 125
34911
-40 to 85
TJ
-40 to 150
°C
Storage Temperature
TSTG
-55 to 150
°C
Thermal Resistance, Junction to Ambient
RθJA
Natural Convection, Single Layer board (1s)(7), (8)
Natural Convection, Four Layer board (2s2p)(7), (9)
Thermal Resistance, Junction to Case(10)
Peak Package Reflow Temperature During Reflow(11), (12)
°C/W
85
56
RθJC
23
°C/W
TPPRT
Note 12
°C
Notes
7.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
8.
9.
10.
11.
Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and
enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
12.
33911
8
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33911 and -40°C ≤ TA ≤ 85°C for the
34911, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
VSUP
5.5
–
18
V
Functional Operating Voltage(13)
VSUPOP
–
–
27
V
Load Dump
VSUPLD
–
–
40
V
IRUN
–
4.5
10
mA
SUPPLY VOLTAGE RANGE (VS1, VS2)
Nominal Operating Voltage
SUPPLY CURRENT RANGE (VSUP = 13.5 V)
Normal Mode (IOUT at VDD = 10 mA), LIN Recessive State(14)
Stop Mode, VDD ON with IOUT = 100 µA, LIN Recessive State
(16) (17)
,
(14), (15),
ISTOP
µA
5.5 V < VSUP < 12 V
–
47
VSUP = 13.5 V
–
62
90
13.5 V < VSUP < 18 V
–
180
400
5.5 V < VSUP < 12 V
–
27
35
VSUP = 13.5 V
–
33
48
13.5 V ≤ VSUP < 18 V
–
160
300
ICYCLIC
–
10
–
Threshold (measured on VS1)(18)
VBATFAIL
1.5
3.0
3.9
Hysteresis (measured on VS1)(18)
VBATFAIL_HYS
–
0.9
–
VSUV
5.55
6.0
6.6
VSUV_HYS
–
0.2
–
VSOV
18
19.25
20.5
–
1.0
–
Sleep Mode, VDD OFF, LIN Recessive State(14), (16)
Cyclic Sense Supply Current Adder(18)
80
ISLEEP
µA
µA
SUPPLY UNDER/OVER-VOLTAGE DETECTIONS
Power-On Reset (BATFAIL)(19)
V
VSUP under-voltage detection (VSUV Flag) (Normal and Normal Request
Modes, Interrupt Generated)
Threshold (measured on VS1)
Hysteresis (measured on VS1)
V
VSUP over-voltage detection (VSOV Flag) (Normal and Normal Request
Modes, Interrupt Generated)
Threshold (measured on VS1)
Hysteresis (measured on VS1)
VSOV_HYS
V
Notes
13. Device is fully functional. All features are operating.
14. Total current (IVS1 + IVS2) measured at GND pins excluding all loads, cyclic sense disabled.
15.
Total IDD current (including loads) below 100 µA.
16.
Stop and Sleep modes current will increase if VSUP exceeds13.5 V.
17.
18.
19.
This parameter is guaranteed after 90 ms.
This parameter is guaranteed by process monitoring but not production tested.
The Flag is set during power up sequence. To clear the flag, a SPI read must be performed.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
9
MC33911G5AC/MC3433911G5AC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33911 and -40°C ≤ TA ≤ 85°C for the
34911, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
(20)
VOLTAGE REGULATOR
Symbol
Min
Typ
Max
4.75
5.00
5.25
60
110
200
–
0.1
0.25
Unit
(VDD)
Normal Mode Output Voltage
VDDRUN
1.0 mA < IVDD < 50 mA; 5.5 V < VSUP < 27 V
Normal Mode Output Current Limitation
IVDDRUN
Dropout Voltage(21)
VDDDROP
IVDD = 50 mA
Stop Mode Output Voltage
V
V
VDDSTOP
IVDD < 5.0 mA
mA
V
4.75
5.0
5.25
IVDDSTOP
6.0
13
36
Normal Mode, 5.5 V < VSUP < 18 V; IVDD = 10 mA
LRRUN
–
–
25
Stop Mode, 5.5 V < VSUP < 18 V; IVDD = 1.0 mA
LRSTOP
–
–
25
Normal Mode, 1.0 mA < IVDD < 50 mA
LDRUN
–
–
80
Stop Mode, 0.1 mA < IVDD < 5.0 mA
LDSTOP
–
–
50
90
115
140
TPRE_HYS
–
13
–
°C
TSD
150
170
190
°C
TSD_HYS
–
13
–
°C
VRSTTH
4.3
4.5
4.7
V
0.0
–
0.9
-150
-250
-350
Stop Mode Output Current Limitation
Line Regulation
mV
Load Regulation
Over-temperature Prewarning
mA
mV
(Junction)(22)
TPRE
Interrupt generated, VDDOT Bit Set
Over-temperature Prewarning Hysteresis(22)
Over-temperature Shutdown Temperature
(Junction)(22)
(22)
Over-temperature Shutdown Hysteresis
°C
RST INPUT/OUTPUT PIN (RST)
VDD Low Voltage Reset Threshold
Low-state Output Voltage
VOL
IOUT = 1.5 mA; 3.5 V ≤ VSUP ≤ 27 V
High-state Output Current (0 V < VOUT < 3.5 V)
IOH
Pull-down Current Limitation (internally limited)
IPD_MAX
VOUT = VDD
Low-state Input Voltage
High-state Input Voltage
V
µA
mA
1.5
–
8.0
VIL
-0.3
–
0.3 x VDD
V
VIH
0.7 x VDD
–
VDD +0.3
V
Notes
20. Specification with external capacitor 2.0 µF < C < 100 µF and 100 mΩ ≤ ESR ≤ 10 Ω.
21. Measured when voltage has dropped 250 mV below its nominal Value (5.0 V).
22. This parameter is guaranteed by process monitoring but not production tested.
33911
10
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33911 and -40°C ≤ TA ≤ 85°C for the
34911, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
0.0
–
1.0
VDD -0.9
–
VDD
Unit
MISO SPI OUTPUT PIN (MISO)
Low-state Output Voltage
VOL
IOUT = 1.5 mA
High-state Output Voltage
VOH
IOUT = -250 µA
Tri-state Leakage Current
V
V
ITRIMISO
0 V ≤ VMISO ≤ VDD
µA
-10
–
10
SPI INPUT PINS (MOSI, SCLK, CS)
Low-state Input Voltage
VIL
-0.3
–
0.3 x VDD
V
High-state Input Voltage
VIH
0.7 x VDD
–
VDD +0.3
V
MOSI, SCLK Input Current
IIN
0 V ≤ VIN ≤ VDD
CS Pull-up Current
µA
-10
–
10
IPUCS
0 V < VIN < 3.5 V
µA
10
20
30
0.0
–
0.8
VDD -0.8
–
VDD
INTERRUPT OUTPUT PIN (IRQ)
Low-state Output Voltage
VOL
IOUT = 1.5 mA
High-state Output Voltage
VOH
IOUT = -250 µA
Leakage Current
V
V
IOUT
VDD ≤ VOUT ≤ 10 V
mA
–
–
2.0
PULSE WIDTH MODULATION INPUT PIN (PWMIN)
Low-state Input Voltage
VIL
-0.3
–
0.3 x VDD
V
High-state Input Voltage
VIH
0.7 x VDD
–
VDD +0.3
V
10
20
30
Pull-up current
0 V < VIN < 3.5 V
IPUPWMIN
µA
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
11
MC33911G5AC/MC3433911G5AC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33911 and -40°C ≤ TA ≤ 85°C for the
34911, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
TJ = 25°C, ILOAD = 50 mA; VSUP > 9.0 V
–
–
7.0
TJ = 150°C, ILOAD = 50 mA; VSUP > 9.0 V(23)
–
–
10
TJ = 150°C, ILOAD = 30 mA; 5.5 V < VSUP < 9.0 V(23)
–
–
14
60
90
250
–
5.0
7.5
–
–
10
Unit
HIGH SIDE OUTPUT HS1 PIN (HS1)
Output Drain-to-Source On Resistance
Ω
RDS(ON)
Output Current Limitation(24)
ILIMHS1
0 V < VOUT < VSUP - 2.0 V
Open Load Current Detection(25)
IOLHS1
Leakage Current
ILEAK
-0.2 V < VHS1 < VS2 + 0.2 V
Short-circuit Detection Threshold(26)
mA
µA
VTHSC
5.5 V < VSUP < 27 V
mA
V
VSUP -2.0
–
–
THSSD
140
160
180
°C
THSSD_HYS
–
10
–
°C
TJ = 25°C, ILOAD = 150 mA, VSUP > 9.0 V
–
–
2.5
TJ = 125°C, ILOAD = 150 mA, VSUP > 9.0 V
–
–
4.5
–
–
10
160
275
350
–
7.5
12
Over-temperature
Shutdown(27), (31)
Over-temperature Shutdown
Hysteresis(31)
LOW SIDE OUTPUTS LS1 AND LS2 PINS (LS1, LS2)
Output Drain-to-Source On Resistance
RDS(ON)
TJ = 125°C, ILOAD = 120 mA, 5.5 V < VSUP < 9.0 V
Output Current Limitation(28)
ILIMLSX
2.0 V < VOUT < VSUP
Open Load Current Detection(29)
IOLLSX
Leakage Current
ILEAK
-0.2 V < VOUT < VS1
Active Output Energy Clamp
mA
Short-circuit Detection Threshold(26)
–
–
10
VSUP +2.0
–
VSUP +5.0
V
VTHSC
5.5 V < VSUP < 27 V
(30), (31)
(31)
Over-temperature Shutdown Hysteresis
mA
µA
VCLAMP
IOUT = 150 mA
Over-temperature Shutdown
Ω
V
2.0
–
–
TLSSD
140
160
180
°C
TLSSD_HYS
–
10
–
°C
Notes
23. This parameter is production tested up to TA = 125°C, and guaranteed by process monitoring up to TJ = 150°C.
24.
25.
26.
27.
28.
29.
30.
31.
When over-current occurs, the corresponding high side stays ON with limited current capability and the HS1CL flag is set in the HSSR.
When open load occurs, the flag (HS1OP) is set in the HSSR.
HS and LS automatically shutdown if HSOT or LSOT occurs or if the HVSE flag is enabled and an over-voltage occurs.
When over-temperature shutdown occurs, the high side is turned off. All flags in HSSR are set.
When over-current occurs, the corresponding low side stays ON with limited current capability and the LSxCL flag is set in the LSSR.
When open load occurs, the flag (LSxOP) is set in the LSSR.
When over-temperature shutdown occurs, both low sides are turned off. All flags in LSSR are set.
Guaranteed by characterization but not production tested
33911
12
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33911 and -40°C ≤ TA ≤ 85°C for the
34911, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
L1 AND L2 INPUT PINS (L1 AND L2)
Low Detection Threshold(32)
VTHL
5.5 V < VSUP < 27 V
V
2.0
2.5
3.0
3.0
3.5
4.0
0.4
0.8
1.4
-10
–
10
800
1300
2000
LXDS (Lx Divider Select) = 0
0.95
1.0
1.05
LXDS (Lx Divider Select) = 1
3.42
3.6
3.78
High Detection Threshold
(32)
VTHH
5.5 V < VSUP < 27 V
Hysteresis(32)
VHYS
5.5 V < VSUP < 27 V
Input Current(33)
V
IIN
-0.2 V < VIN < VS1
Analog Input Impedance(34)
RLXIN
Analog Input Divider Ratio (RATIOLx = VLx / VADOUT0)
µA
kΩ
RATIOLX
Analog Output offset Ratio
VRATIOLx-
LXDS (Lx Divider Select) = 0
Analog Inputs Matching
mV
-80
6.0
80
-22
2.0
22
96
100
104
96
100
104
REXT
20
–
200
kΩ
WDACC
-15
–
15
%
OFFSET
LXDS (Lx Divider Select) = 1
LXMATCHING
LXDS (Lx Divider Select) = 0
LXDS (Lx Divider Select) = 1
WINDOW WATCHDOG CONFIGURATION PIN (WDCONF)
V
%
(35)
External Resistor Range
Watchdog Period Accuracy with External Resistor (Excluding Resistor
Accuracy)(36)
ANALOG MULTIPLEXER
Temperature Sense Analog Output Voltage
VADOUT0_TEMP
V
TA = -40°C
2.0
-
2.8
TA = 25°C
2.8
3.0
3.6
TA = 125°C
3.6
Temperature Sense Analog Output Voltage per characterization
(37)
VADOUT0_25
TA = 25°C
Internal Chip Temperature Sense Gain
Internal Chip Temperature Sense Gain per characterization at 3
temperatures(37) See Figure 16, Temperature Sense Gain
VSENSE Input Divider Ratio (RATIOVSENSE = VVSENSE / VADOUT0)
5.5 V < VSUP < 27 V
Notes
32.
33.
34.
35.
4.6
V
3.1
3.15
3.2
STTOV
9.0
10.5
12
mV/K
STTOV_3T
9.9
10.2
10.5
mV/K
5.0
5.25
5.5
RATIOVSENSE
The unused Lx pins must be connected to ground.
Analog multiplexer input disconnected from Lx input pin.
Analog multiplexer input connected to Lx input pin.
For VSUP 4.7 to 18 V
36.
Watchdog timing period calculation formula: tPWD [ms] = [0.466 * (REXT - 20)] + 10 with (REXT in kΩ)
37.
These limits have been defined after laboratory characterization on 3 lots and 30 samples. These tighten limits could not be guaranteed
by production test.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
13
MC33911G5AC/MC3433911G5AC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33911 and -40°C ≤ TA ≤ 85°C for the
34911, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
VSENSE Input Divider Ratio (RATIOVSENSE=Vsense/Vadout0) per
characterization(38)
Symbol
VSENSE Output Related Offset per characterization(38)
Typ
Max
5.15
5.25
5.35
-30
-10
30
Unit
RATIOVSENSECZ
5.5 <VSUP< 27 V
VSENSE Output Related Offset
Min
OFFSETVSENSE
mV
OFFSETVSENSE_
CZ
mV
-30
-12.6
0
VDD -0.35
–
VDD
ANALOG OUTPUT (ADOUT0)
Maximum Output Voltage
VOUT_MAX
-5.0 mA < IO < 5.0 mA
Minimum Output Voltage
V
VOUT_MIN
-5.0 mA < IO < 5.0 mA
V
0.0
–
0.35
0.0
–
0.8
VDD -0.8
–
VDD
RXD OUTPUT PIN (LIN PHYSICAL LAYER) (RXD)
Low-state Output Voltage
VOL
IOUT = 1.5 mA
High-state Output Voltage
VOH
IOUT = -250 µA
V
V
TXD INPUT PIN (LIN PHYSICAL LAYER) (TXD)
Low-state Input Voltage
VIL
-0.3
–
0.3 x VDD
V
High-state Input Voltage
VIH
0.7 x VDD
–
VDD +0.3
V
IPUIN
10
20
30
µA
Pin Pull-up Current, 0 V < VIN < 3.5 V
LIN PHYSICAL LAYER WITH J2602 FEATURE ENABLED (BIT DIS_J2602 = 0)
LIN Under Voltage threshold
Positive and Negative threshold (VTHP, VTHN)
Hysteresis (VTHP - VTHN)
VTH_UNDER_
VOLTAGE
VJ2602_DEG
V
5.0
6.0
400
mV
Notes
38. These limits have been defined after laboratory characterization on 3 lots and 30 samples. These tighten limits could not be guaranteed
by production test.
33911
14
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 4. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33911 and -40°C ≤ TA ≤ 85°C for the
34911, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Operating Voltage Range
VBAT
Supply Voltage Range
Typ
Max
Unit
8.0
18
V
VSUP
7.0
18
V
VSUP_NON_OP
-0.3
40
V
(39)
LIN PHYSICAL LAYER, TRANSCEIVER (LIN)
Voltage Range within which the device is not destroyed
Current Limitation for Driver Dominant State
IBUS_LIM
Driver ON, VBUS = 18 V
Input Leakage Current at the receiver
mA
40
90
200
-1.0
–
–
–
–
20
-1.0
–
1.0
–
–
100
–
–
0.4
0.6
–
–
IBUS_PAS_DOM
Driver off; VBUS = 0 V; VBAT = 12 V
Leakage Output Current to GND
IBUS_PAS_REC
Driver Off; 8.0 V < VBAT < 18 V; 8.0 V < VBUS < 18 V; VBUS ≥ VBAT
Control unit disconnected from ground(40)
µA
IBUS_NO_GND
GNDDEVICE = VSUP; VBAT = 12 V; 0 < VBUS < 18 V
VBAT Disconnected; VSUP_DEVICE = GND; 0 V < VBUS < 18 V(41)
Receiver Dominant State
mA
IBUSNO_BAT
µA
VBUSDOM
Receiver Recessive State
VSUP
VBUSREC
Receiver Threshold Center
VSUP
VBUS_CNT
(VTH_DOM + VTH_REC)/2
Receiver Threshold Hysteresis
VSUP
0.475
0.5
0.525
–
–
0.175
VHYS
(VTH_REC - VTH_DOM)
mA
VSUP
Voltage Drop at the serial Diode in pull-up path
VSERDIODE
0.4
1.0
V
VBAT_SHIFT
VSHIFT_BAT
0
11.5%
VBAT
VSHIFT_GND
0
11.5%
VBAT
5.3
5.8
V
GND_SHIFT
LIN Wake-up threshold from Stop or Sleep Mode
(42)
LIN Pull-up Resistor to VSUP
Over-temperature
Shutdown(43)
Over-temperature Shutdown Hysteresis
VBUSWU
RSLAVE
20
30
60
kΩ
TLINSD
140
160
180
°C
TLINSD_HYS
–
10
–
°C
Notes
39. Parameters guaranteed for 7.0 V ≤ VSUP ≤ 18 V.
40.
41.
42.
43.
Loss of local ground must not affect communication in the residual network.
Node has to sustain the current that can flow under this condition. Bus must remain operational under this condition.
This parameter is 100% tested on an Automatic Tester. However, since it has not been monitored during reliability stresses, Freescale
does not guarantee this parameter during the product's life time.
When over-temperature shutdown occurs, the LIN bus goes in recessive state and the flag LINOT in LINSR is set.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
15
MC33911G5AC/MC3433911G5AC
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33911 and -40°C ≤ TA ≤ 85°C for the
34911, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
SPI Operating Frequency
f SPIOP
–
–
4.0
MHz
SCLK Clock Period
SPI INTERFACE TIMING (SEE Figure 13, PAGE 23)
tPSCLK
250
–
N/A
ns
SCLK Clock High Time(44)
tWSCLKH
110
–
N/A
ns
SCLK Clock Low Time(44)
tWSCLKL
110
–
N/A
ns
Falling Edge of CS to Rising Edge of SCLK(44)
tLEAD
100
–
N/A
ns
Falling Edge of SCLK to CS Rising Edge(44)
tLAG
100
–
N/A
ns
MOSI to Falling Edge of SCLK(44)
tSISU
40
–
N/A
ns
Falling Edge of SCLK to MOSI(44)
tSIH
40
–
N/A
ns
MISO Rise Time(44)
tRSO
–
40
–
CL = 220 pF
MISO Fall Time(44)
tFSO
CL = 220 pF
Time from Falling or Rising Edges of
ns
ns
–
40
–
CS to:(44)
ns
- MISO Low-impedance
tSOEN
0.0
–
50
- MISO High-impedance
tSODIS
0.0
–
50
Time from Rising Edge of SCLK to MISO Data Valid(44)
tVALID
0.0
–
75
t RST
0.65
1.0
1.35
ms
t RSTDF
350
480
900
ns
8.5
10
11.5
0.2 x VDD ≤ MISO ≥ 0.8 x VDD, CL = 100 pF
ns
RST OUTPUT PIN
Reset Low-level Duration After VDD High (see Figure 12, page 23)
Reset Deglitch Filter Time
WINDOW WATCHDOG CONFIGURATION PIN (WDCONF)
Watchdog Time Period(45)
External Resistor REXT = 20 kΩ (1%)
t PWD
ms
External Resistor REXT = 200 kΩ (1%)
79
94
108
Without External Resistor REXT (WDCONF Pin Open)
110
150
205
Notes
44. This parameter is guaranteed by process monitoring but not production tested.
45. Watchdog timing period calculation formula: tPWD [ms] = [0.466 * (REXT - 20)] + 10 with (REXT in kΩ)
33911
16
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33911 and -40°C ≤ TA ≤ 85°C for the
34911, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
t WUF
8.0
20
38
μs
–
–
5.0
t NR TOUT
110
150
205
ms
TON
130
200
270
µs
+35
%
L1 AND L2 INPUTS
Lx Filter Time Deglitcher(46)
STATE MACHINE TIMING
Delay Between CS LOW-to-HIGH Transition (at End of SPI Stop Command)
and Stop Mode Activation(46)
Normal Request Mode Timeout (see Figure 12, page 23)
Cyclic Sense ON Time from Stop and Sleep Mode(47)
t STOP
Cyclic Sense Accuracy(46)
Delay Between SPI Command and HS /LS Turn On(48)
-35
–
–
10
μs
t S-OFF
9.0 V < VSUP < 27 V
Delay Between Normal Request and Normal Mode After a Watchdog Trigger
Command (Normal Request Mode)(46)
μs
t S-ON
9.0 V < VSUP < 27 V
Delay Between SPI Command and HS /LS Turn Off(48)
μs
–
–
10
–
–
10
μs
t SNR2N
Delay Between CS Wake-up (CS LOW to HIGH) in Stop Mode and:
μs
Normal Request Mode, VDD ON and RST HIGH
t WUCS
9.0
15
80
First Accepted SPI Command
t WUSPI
90
—
N/A
t 2CS
4.0
—
—
35
50
70
Minimum Time Between Rising and Falling Edge on the CS
μs
J2602 DEGLITCHER
VSUP Deglitcher(49)
(DIS_J2602 = 0)
tJ2602_DEG
μs
Notes
46. This parameter is guaranteed by process monitoring but not production tested.
47. This parameter is 100% tested on an Automatic Tester. However, since it has not been monitored during reliability stresses, Freescale
does not guarantee this parameter during the product's life time.
48. Delay between turn on or off command (rising edge on CS) and HS or LS ON or OFF, excluding rise or fall time due to external load.
49. This parameter has not been monitoring during operating life test.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
17
MC33911G5AC/MC3433911G5AC
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33911 and -40°C ≤ TA ≤ 85°C for the
34911, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR NORMAL SLEW RATE - 20.0KBIT/SEC ACCORDING TO LIN PHYSICAL
LAYER SPECIFICATION(50), (51)
Duty Cycle 1:
D1
THREC(MAX) = 0.744 * VSUP
THDOM(MAX) = 0.581 * VSUP
D1 = tBUS_REC(MIN)/(2 x tBIT), tBIT = 50 µs, 7.0 V ≤ VSUP ≤ 18 V
Duty Cycle 2:
0.396
—
—
—
—
0.581
D2
THREC(MIN) = 0.422 * VSUP
THDOM(MIN) = 0.284 * VSUP
D2 = tBUS_REC(MAX)/(2 x tBIT), tBIT = 50 µs, 7.6 V ≤ VSUP ≤ 18 V
LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR SLOW SLEW RATE - 10.4KBIT/SEC ACCORDING TO LIN PHYSICAL LAYER
SPECIFICATION(50), (52)
Duty Cycle 3:
D3
THREC(MAX) = 0.778 * VSUP
THDOM(MAX) = 0.616 * VSUP
D3 = tBUS_REC(MIN)/(2 x tBIT), tBIT = 96 µs, 7.0 V ≤ VSUP ≤ 18 V
Duty Cycle 4:
0.417
—
—
—
—
0.590
D4
THREC(MIN) = 0.389 * VSUP
THDOM(MIN) = 0.251 * VSUP
D4 = tBUS_REC(MAX)/(2 x tBIT), tBIT = 96 µs, 7.6 V ≤ VSUP ≤ 18 V
Notes
50. Bus load RBUS and CBUS 1.0 nF / 1.0 kΩ, 6.8 nF / 660 Ω, 10 nF / 500 Ω. Measurement thresholds: 50% of TXD signal to LIN signal
threshold defined at each parameter. See Figure 6, page 21.
51. See Figure 7, page 21.
52. See Figure 8, page 21.
33911
18
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 5. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33911 and -40°C ≤ TA ≤ 85°C for the
34911, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
SRFAST
—
20
—
V / μs
t REC_PD
—
4.2
6.0
t REC_SYM
- 2.0
—
2.0
t PROPWL
42
70
95
t WAKE_SLEEP
—
—
1500
t WAKE_STOP
9.0
27
35
t TXDDOM
0.65
1.0
1.35
LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR FAST SLEW RATE
LIN Fast Slew Rate (Programming Mode)
LIN PHYSICAL LAYER: CHARACTERISTICS AND WAKE-UP TIMINGS
(53)
Propagation Delay and Symmetry(54)
μs
Propagation Delay of Receiver, tREC_PD=MAX (tREC_PDR, tREC_PDF)
Symmetry of Receiver Propagation Delay, tREC_PDF - tREC_PDR
Bus Wake-up Deglitcher (Sleep and Stop
Modes)(55),(59), (56)
Bus Wake-up Event Reported
From Sleep Mode
(57)
From Stop Mode(58)
TXD Permanent Dominant State Delay
μs
μs
s
PULSE WIDTH MODULATION INPUT PIN (PWMIN)
PWMIN pin(59)
Max. frequency to drive HS and LS output pins
fPWMIN
kHz
10
Notes
53. VSUP from 7.0 to 18 V, bus load RBUS and CBUS 1.0 nF / 1.0 kΩ, 6.8 nF / 660 Ω, 10 nF / 500 Ω. Measurement thresholds: 50% of TXD
signal to LIN signal threshold defined at each parameter. See Figure 6, page 21.
54. See Figure 9, page 22
55. See Figure 10, page 22 for Sleep and Figure 11, page 22 for Stop mode.
56. This parameter is tested on automatic tester but has not been monitoring during operating life test.
57. The measurement is done with 1.0 µF capacitor and 0mA current load on VDD. The value takes into account the delay to charge the
capacitor. The delay is measured between the bus wake-up threshold (VBUSWU) rising edge of the LIN bus and when VDD reaches 3.0 V.
See Figure 10, page 22. The delay depends of the load and capacitor on VDD.
58.
59.
In Stop mode, the delay is measured between the bus wake-up threshold (VBUSWU) and the falling edge of the IRQ pin. See Figure 11,
page 22.
This parameter is guaranteed by process monitoring but not production tested.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
19
MC33911G5AC/MC3433911G5AC
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
TIMING DIAGRAMS
33911
1.0 nF
LIN
TRANSIENT PULSE
GENERATOR
(NOTE)
GND
PGND LGND
AGND
Note Waveform per ISO 7637-2. Test Pulses 1, 2, 3a, 3b.
Figure 4. Test Circuit for Transient Test Pulses (LIN)
33911
Transient Pulse
Generator
(Note)
1.0 nF
L1, L2
10 kΩ
GND
PGND LGND AGND
Note Waveform per ISO 7637-2. Test Pulses 1, 2, 3a, 3b,.
Figure 5. Test Circuit for Transient Test Pulses (Lx)
VSUP
TXD
LIN
R0
RXD
C0
R0 AND C0 COMBINATIONS:
• 1.0 KΩ and 1.0 nF
• 660 Ω and 6.8 nF
• 500 Ω and 10 nF
Figure 6. Test Circuit for LIN Timing Measurements
33911
20
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
TXD
tBIT
tBIT
tBUS_DOM(MAX)
VLIN_REC
THREC(MAX)
74.4% VSUP
THDOM(MAX)
58.1% VSUP
tBUS_REC(MIN)
Thresholds of
receiving node 1
LIN
THREC(MIN)
THDOM(MIN)
Thresholds of
receiving node 2
42.2% VSUP
28.4% VSUP
tBUS_DOM(MIN)
tBUS_REC(MAX)
RXD
Output of receiving Node 1
tREC_PDF(1)
tREC_PDR(1)
RXD
Output of receiving Node 2
tREC_PDF(2)
tREC_PDR(2)
Figure 7. LIN Timing Measurements for Normal Slew Rate
TXD
tBIT
tBIT
tBUS_DOM(MAX)
VLIN_REC
THREC(MAX)
77.8% VSUP
THDOM(MAX)
61.6% VSUP
tBUS_REC(MIN)
Thresholds of
receiving node 1
LIN
THREC(MIN)
THDOM(MIN)
Thresholds of
receiving node 2
38.9% VSUP
25.1% VSUP
tBUS_DOM(MIN)
tBUS_REC(MAX)
RXD
Output of receiving Node 1
tREC_PDF(1)
tREC_PDR(1)
RXD
Output of receiving Node 2
tREC_PDR(2)
tREC_PDF(2)
Figure 8. LIN Timing Measurements for Slow Slew Rate
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
21
MC33911G5AC/MC3433911G5AC
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
VLIN_REC
VBUSREC
0.6% VSUP
VBUSDOM
0.4% VSUP
VSUP
LIN BUS SIGNAL
RXD
tREC_PDF
tREC_PDR
Figure 9. LIN Receiver Timing
VLIN_REC
LIN
5.0 V
VBUSWU
DOMINANT LEVEL
3.0 V
VDD
tPROPWL
tWAKE_SLEEP
Figure 10. LIN Wake-up Sleep Mode Timing
VLIN_REC
LIN
5.0 V
VBUSWU
DOMINANT LEVEL
IRQ
tPROPWL
tWAKE_STOP
Figure 11. LIN Wake-up Stop Mode Timing
33911
22
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
VSUP
VDD
RST
tNRTOUT
tRST
Figure 12. Power On Reset and Normal Request Timeout Timing
tPSCLK
CS
tWSCLKH
tLEAD
tLAG
SCLK
tWSCLKL
tSISU
MOSI
UNDEFINED
D0
tSIH
DON’T CARE
D7
DON’T CARE
tVALID
tSODIS
tSOEN
MISO
D0
DON’T CARE
D7
Figure 13. SPI Timing Characteristics
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
23
MC33911G5AC/MC3433911G5AC
FUNCTIONAL DESCRIPTION
INTRODUCTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
The 33911 was designed and developed as a highly
integrated and cost-effective solution for automotive and
industrial applications. For automotive body electronics, the
33911 is well suited to perform relay control in applications
such as a window lift, sunroof, etc. via the LIN bus.
Power switches are provided on the device configured as
high side and low side outputs. Other ports are also provided,
which include a current and voltage sense port and two wakeup capable pins. An internal voltage regulator provides power
to a MCU device.
Also included in this device is a LIN physical layer, which
communicates using a single wire. This enables this device
to be compatible with 3-wire bus systems, where one wire is
used for communication, one for battery, and one for ground.
FUNCTIONAL PIN DESCRIPTION
See Figure 1, 33911 Simplified Application Diagram,
page 1, for a graphic representation of the various pins
referred to in the following paragraphs. Also, see the pin
diagram on page 5 for a description of the pin locations in the
package.
MASTER OUT SLAVE IN PIN (MOSI)
RECEIVER OUTPUT PIN (RXD)
The MISO pin sends data to an SPI-enabled MCU. It is a
digital tri-state output used to shift serial data to the
microcontroller. Data on this output pin changes on the
positive edge of the SCLK. When CS is High, this pin will
remain in the high-impedance state.
The RXD pin is a digital output. It is the receiver output of
the LIN interface and reports the state of the bus voltage:
RXD Low when LIN bus is dominant, RXD High when LIN bus
is recessive.
TRANSMITTER INPUT PIN (TXD)
The TXD pin is a digital input. It is the transmitter input of
the LIN interface and controls the state of the bus output
(dominant when TXD is Low, recessive when TXD is High).
This pin has an internal pull-up to force recessive state in
case the input is left floating.
LIN BUS PIN (LIN)
The LIN pin represents the single-wire bus transmitter and
receiver. It is suited for automotive bus systems and is
compliant to the LIN bus specification 2.0, 2.1, and SAE
J2602-2.
The LIN interface is only active during Normal mode. See
Table 6, Operating Modes Overview.
The MOSI digital pin receives SPI data from the MCU. This
data input is sampled on the negative edge of SCLK.
MASTER IN SLAVE OUT PIN (MISO)
CHIP SELECT PIN (CS)
CS is an active low digital input. It must remain low during
a valid SPI communication and allow for several devices to
be connected in the same SPI bus without contention. A
rising edge on CS signals the end of the transmission and the
moment the data shifted in is latched. A valid transmission
must consist of 8 bits only.
While in STOP mode, a low-to-high level transition on this
pin will generate a wake-up condition for the 33911.
ANALOG MULTIPLEXER PIN (ADOUT0)
The ADOUT0 pin can be configured via the SPI to allow
the MCU A/D converter to read the several inputs of the
Analog Multiplexer, including the VSENSE, L1, L2 input
voltages, and the internal junction temperature.
SERIAL DATA CLOCK PIN (SCLK)
PWM INPUT CONTROL PIN (PWMIN)
The SCLK pin is the SPI clock input. MISO data changes
on the positive transition of the SCLK. MOSI is sampled on
the negative edge of the SCLK.
This digital input can control the high side and low sides
drivers in Normal Request and Normal mode.
To enable PWM control, the MCU must perform a write
operation to the High Side Control Register (HSCR) or the
Low Side Control Register (LSCR).
This pin has an internal 20 μA current pull-up.
33911
24
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
RESET PIN (RST)
This bidirectional pin is used to reset the MCU in case the
33911 detects a reset condition, or to inform the 33911 that
the MCU has just been reset. After release of the RST pin,
Normal Request mode is entered.
The RST pin is an active low filtered input and output
formed by a weak pull-up and a switchable pull-down
structure which allows this pin to be shorted either to VDD or
to GND during software development, without the risk of
destroying the driver.
INTERRUPT PIN (IRQ)
The IRQ pin is a digital output used to signal events or
faults to the MCU while in Normal and Normal Request mode
or to signal a wake-up from Stop mode. This active low output
will transition to high only after the interrupt is acknowledged
by a SPI read of the respective status bits.
WATCHDOG CONFIGURATION PIN (WDCONF)
The WDCONF pin is the configuration pin for the internal
watchdog. A resistor can be connected to this pin to configure
the window watchdog period. When connected directly to
ground, the watchdog will be disabled. When this pin is left
open, the watchdog period is fixed to its lower precision
internal default value (150 ms typical).
GROUND CONNECTION PINS (AGND, PGND,
LGND)
The AGND, PGND and LGND pins are the Analog and
Power ground pins.
The AGND pin is the ground reference of the voltage
regulator.
The PGND and LGND pins are used for high current load
return as in the relay-drivers and LIN interface pin.
Note: PGND, AGND and LGND pins must be connected
together.
LOW SIDE PINS (LS1 AND LS2)
LS1 and LS2 are the low side driver outputs. Those
outputs are short-circuit protected and include active clamp
circuitry to drive inductive loads. Due to the energy clamp
voltage on this pin, it can raise above the battery level when
switched off. The switches are controlled through the SPI and
can be configured to respond to a signal applied to the
PWMIN input pin.
Both low side switches are protected against overheating.
In case of VS1 disconnection and the low sides are still
supplied by VBAT through a load, both low sides will have a
VDS voltage equal to the clamping value, as stated in the
specification.
DIGITAL/ANALOG PINS (L1 AND L2)
The Lx pins are multi purpose inputs. They can be used as
digital inputs, which can be sampled by reading the SPI and
used for wake-up when 33911 is in low power mode or used
as analog inputs for the analog multiplexer. When used to
sense voltage outside the module, a 33 kohm series resistor
must be used on each input.
When used as wake-up inputs L1 and L2 can be
configured to operate in cyclic-sense mode. In this mode the
high side switch is configured to be periodically turned on and
sample the wake-up inputs. If a state change is detected
between two cycles a wake-up is initiated. The 33911 can
also wake-up from Stop or Sleep by a simple state change on
L1 and L2.
When used as analog inputs, the voltage present on the Lx
pins is scaled down by an selectable internal voltage divider
and can be routed to the ADOUT0 output through the analog
multiplexer.
Note: If an Lx input is selected in the analog multiplexer, it
will be disabled as a digital input and remains disabled in low
power mode. No wake-up feature is available in that
condition.
When an Lx input is not selected in the analog multiplexer,
the voltage divider is disconnected from that input.
HIGH SIDE OUTPUT PIN (HS1)
This high side switch is able to drive loads such as relays
or lamps. Its structure is connected to the VS2 supply pin.
The pin is short-circuit protected and also protected against
overheating.
HS1 is controlled by SPI and can respond to a signal
applied to the PWMIN input pin.
The HS1 output can also be used during low-power mode
for the cyclic-sense of the wake inputs.
POWER SUPPLY PINS (VS1 AND VS2)
Those are the battery level voltage supply pins. In an
application, VS1 and VS2 pins must be protected against
reverse battery connection and negative transient voltages
with external components. These pins sustain standard
automotive voltage conditions such as a load dump at 40 V.
The high side switch (HS1) is supplied by the VS2 pin. All
other internal blocks are supplied by the VS1 pin.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
25
MC33911G5AC/MC3433911G5AC
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
VOLTAGE SENSE PIN (VSENSE)
+5.0 V MAIN REGULATOR OUTPUT PIN (VDD)
This input can be connected directly to the battery line. It
is protected against battery reverse connection. The voltage
present in this input is scaled down by an internal voltage
divider, and can be routed to the ADOUT0 output pin and
used by the MCU to read the battery voltage.
The ESD structure on this pin allows for excursion up to
+40 V and down to -27 V, allowing this pin to be connected
directly to the battery line. It is strongly recommended to
connect a 10 kohm resistor in series with this pin for
protection purposes.
An external capacitor has to be placed on the VDD pin to
stabilize the regulated output voltage. The VDD pin is
intended to supply a microcontroller. The pin is current limited
against shorts to GND and over-temperature protected.
During Stop mode, the voltage regulator does not operate
with its full drive capabilities and the output current is limited.
During Sleep mode, the regulator output is completely shut
down.
33911
26
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
INTRODUCTION
The 33911 offers three main operating modes: Normal
(Run), Stop, and Sleep (Low Power). In Normal mode, the
device is active and is operating under normal application
conditions. The Stop and Sleep modes are low power modes
with wake-up capabilities.
In Stop mode, the voltage regulator still supplies the MCU
with VDD (limited current capability), while in Sleep mode the
voltage regulator is turned off (VDD = 0 V).
Wake-up from Stop mode is initiated by a wake-up
interrupt. Wake-up from Sleep mode is done by a reset and
the voltage regulator is turned back on.
The selection of the different modes is controlled by the
MOD1:2 bits in the Mode Control Register (MCR).
Figure 14 describes how transitions are done between the
different operating modes. Table 6, gives an overview of the
operating modes.
The VDD regulator is ON and delivers its full current
capability.
If an external resistor is connected between the WDCONF
pin and the Ground, the window watchdog function will be
enabled.
The wake-up inputs (L1 and L2) can be read as digital
inputs or have its voltage routed through the analogmultiplexer.
The LIN interface has slew rate and timing compatible with
the LIN protocol specification 2.0, 2.1 and SAEJ2602. The
LIN bus can transmit and receive information.
The high side and low side switches are active and have
PWM capability according to the SPI configuration.
The interrupts are generated to report failures for VSUP
over/under-voltage, thermal shutdown, or thermal shutdown
prewarning on the main regulator.
SLEEP MODE
RESET MODE
The 33911 enters the Reset mode after a power up. In this
mode, the RST pin is low for 1.0 ms (typical value). After this
delay, it enters the Normal Request mode and the RST pin is
driven high.
The Reset mode is entered if a reset condition occurs (VDD
low, watchdog trigger fail, after wake-up from Sleep mode,
Normal Request mode timeout occurs).
NORMAL REQUEST MODE
This is a temporary mode automatically accessed by the
device after the Reset mode, or after a wake-up from Stop
mode.
In Normal Request mode, the VDD regulator is ON, the
RESET pin is High, and the LIN is operating in RX Only
mode.
As soon as the device enters in the Normal Request mode
an internal timer is started for 150 ms (typical value). During
these 150 ms, the MCU must configure the Timing Control
Register (TIMCR) and the Mode Control Register (MCR) with
MOD2 and MOD1 bits set = 0, to enter the Normal mode. If
within the 150 ms timeout, the MCU does not command the
33911 to Normal mode, it will enter in Reset mode. If the
WDCONF pin is grounded in order to disable the watchdog
function, it goes directly in Normal mode after the Reset
mode.
NORMAL MODE
In Normal mode, all 33911 functions are active and can be
controlled by the SPI interface and the PWMIN pin.
The Sleep mode is a low power mode. From Normal
mode, the device enters into Sleep mode by sending one SPI
command through the Mode Control Register (MCR), or (VDD
low > 150 ms) with VSUV = 0. When in Reset mode, a VDD
under-voltage condition with no VSUP under-voltage (VSUV =
0) will send the device to Sleep mode. All blocks are in their
lowest power consumption condition. Only some wake-up
sources (wake-up inputs with or without cyclic sense, forced
wake-up and LIN receiver) are active. The 5.0 V regulator is
OFF. The internal low-power oscillator may be active if the IC
is configured for cyclic-sense. In this condition, the high side
switch is turned on periodically and the wake-up inputs are
sampled.
Wake-up from Sleep mode is similar to a power-up. The
device goes in Reset mode except that the SPI will report the
wake-up source and the BATFAIL flag is not set.
STOP MODE
The Stop mode is the second low power mode, but in this
case the 5.0 V regulator is ON with limited current drive
capability. The application MCU is always supplied while the
33911 is operating in Stop mode.
The device can enter into Stop mode only by sending the
SPI command. When the application is in this mode, it can
wake-up from the 33911 side (for example: cyclic sense,
force wake-up, LIN bus, wake inputs) or the MCU side (CS,
RST pins). Wake-up from Stop mode will transition the 33911
to Normal Request mode and generates an interrupt except
if the wake-up event is a low to high transition on the CS pin
or comes from the RST pin.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
27
MC33911G5AC/MC3433911G5AC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
Normal Request
Timeout
Expired
(t NRTOUT
)
Normal Request
timeout
expired (NR
TOUT)
VVDD
Low
DD Low
VDD High and
Normal
Request
VVDDLow
Low
DD
VVDD
LOW (>t NRTOUT
) expired) Expired
DD Low (>NRTOUT
andand
VSUV
=0
VSUV
=0
Wake-up
Wake-Up (Reset)
(Reset)
Sleep
Command
SLEEP
Command
Sleep
Stop
STOPCommand
Command
Normal
WD
Failed
WD
failed
Wake-up
(Interrupt)
Wake-Up Interrupt
Reset
Reset
Delay
(t Delay
VDD
High and
Reset
RST) expired
RST) (tExpired
WD
Disabled
WD disabled
Power Up
WDtrigger
Trigger
WD
Power
Down
Stop
VDD
VDD Low
Low
Legend
WD: Watchdog
Notes:
WD Disabled:
Watchdog disabled (WDCONF pin connected to GND)
WD
- meansisWatchdog
WD Trigger:
Watchdog
triggered by SPI command
WD
means or
Watchdog
disabled
(WDCONF
terminal connected to GND)
WD Failed: No disabled
watchdog- trigger
trigger occurs
in closed
window
WD
trigger
–
means
Watchdog
is triggered by SPI command
Stop Command: Stop command
sent via SPI
WD failed
– means
no Watchdog
trigger or trigger occurs in closed window
Sleep Command:
Sleep
command
sent via SPI
STOP
Command
means
STOP
command
via SPI Periodic wake-up, CS rising edge wake-up or RST wake-up.
Wake-up from
Stop
mode: L1- or
L2 state
change,
LIN sent
bus wake-up,
SLEEP
Command
SLEEP
command
via SPI
Wake-up from
Sleep
mode: L1 -ormeans
L2 state
change,
LIN bussend
wake-up,
Periodic wake-up.
Wake-Up - means L1 or L2 state change or LIN bus wake up or SS rising edge
Figure 14. Operating Modes and Transitions
33911
28
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
Table 6. Operating Modes Overview
Function
VDD
Reset Mode Normal Request Mode
Normal
Mode
Stop Mode
Sleep Mode
Full
Full
Full
Stop
-
-
SPI/PWM(60)
SPI/PWM
-
-
HS1
-
SPI/PWM(60)
SPI/PWM
Note(61)
Note(62)
Analog Mux
-
SPI
SPI
-
-
Lx
-
Inputs
Inputs
Wake-up
Wake-up
LIN
-
Rx-Only
LSx
Watchdog
-
150 ms (typ.) timeout
Voltage Monitoring
VSUP/VDD
VSUP/VDD
Notes
60.
61.
62.
63.
Full/Rx-Only Rx-Only/Wake-up
Wake-up
(63)
-
-
VSUP/VDD
VDD
-
On
/Off
Operation can be controlled by the PWMIN input.
HS1 switch can be configured for cyclic sense operation in Stop mode.
HS1 switch can be configured for cyclic sense operation in Sleep mode.
Windowing operation when enabled by an external resistor.
INTERRUPTS
Low-voltage Interrupt:
Interrupts are used to signal a microcontroller that a
peripheral needs to be serviced. The interrupts which can be
generated, change according to the operating mode. While in
Normal and Normal Request modes, the 33911 signals
through interrupts special conditions which may require a
MCU software action. Interrupts are not generated until all
pending wake-up sources are read in the Interrupt Source
Register (ISR).
While in Stop mode, interrupts are used to signal wake-up
events. Sleep mode does not use interrupts. Wake-up is
performed by powering-up the MCU. In Normal and Normal
Request mode the wake-up source can be read by SPI.
The interrupts are signaled to the MCU by a low logic level
of the IRQ pin, which will remain low until the interrupt is
acknowledged by a SPI read command of the ISR register.
The IRQ pin will then be driven high.
Interrupts are only asserted while in Normal, Normal
Request and Stop mode. Interrupts are not generated while
the RST pin is low.
The following is a list of the interrupt sources in Normal and
Normal Request modes. Some of these can be masked by
writing to the SPI - Interrupt Mask Register (IMR).
Signals when the supply line (VS1) voltage drops below
the VSUV threshold (VSUV).
High-voltage Interrupt:
Signals when the supply line (VS1) voltage increases
above the VSOV threshold (VSOV).
Over-temperature Prewarning:
Signals when the 33911 temperature has reached the preshutdown warning threshold. It is used to warn the MCU that
an over-temperature shutdown in the main 5.0 V regulator is
imminent.
LIN Over-temperature Shutdown / TXD Stuck At
Dominant / RXD Short-circuit:
These signal fault conditions within the LIN interface will
cause the LIN driver to be disabled. In order to restart the
operation, the fault must be removed and TXD must go
recessive.
High Side Over-temperature Shutdown:
Signals a shutdown in the high side output.
Low Side Over-temperature Shutdown:
Signals a shutdown in the low side outputs.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
29
MC33911G5AC/MC3433911G5AC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
RESET
To reset a MCU the 33911 drives the RST pin low for the
time the reset condition lasts.
After the reset source is removed, the state machine will
drive the RST output low for at least 1.0 ms (typical value)
before driving it high.
In the 33911, four main reset sources exist:
5.0 V Regulator Low-voltage-Reset (VRSTTH)
The 5.0 V regulator output VDD is continuously monitored
against brown outs. If the supply monitor detects that the
voltage at the VDD pin has dropped below the reset threshold
VRSTTH the 33911 will issue a reset. In case of overtemperature, the voltage regulator will be disabled and the
voltage monitoring will issue a VDDOT Flag independently of
the VDD voltage.
In order to select and activate direct wake-up from Lx
inputs, the Wake-up Control Register (WUCR) must be
configured with appropriate LxWE inputs enabled or
disabled. The wake-up input’s state is read through the
Wake-up Status Register (WUSR).
Lx inputs are also used to perform cyclic-sense wake-up.
Note: Selecting an Lx input in the analog multiplexer
before entering low power mode will disable the wake-up
capability of the Lx input
Wake-up from Wake-up inputs (L1 and L2) with cyclic
sense timer enabled
During Sleep mode, the 5.0 V regulator is not active,
hence all wake-up requests from Sleep mode require a
power-up/reset sequence.
The SBCLIN can wake-up at the end of a cyclic sense
period if on one of the two wake-up input lines (L1-L2) a state
change occurs. The HS1 switch can be activated in Sleep or
Stop modes from an internal timer. Cyclic sense and force
wake-up are exclusive. If cyclic sense is enabled, the force
wake-up can not be enabled.
In order to select and activate the cyclic sense wake-up
from Lx inputs, before entering in low power modes (Stop or
Sleep modes), the following SPI set-up has to be performed:
In WUCR: select the Lx input to WU-enable.
In HSCR: enable the desired HS1.
• In TIMCR: select the CS/WD bit and determine the
cyclic sense period with CYSTx bits.
• Perform Go to Sleep/Stop command.
External Reset
Forced Wake-up
The 33911 has a bidirectional reset pin which drives the
device to a safe state (same as Reset mode) for as long as
this pin is held low. The RST pin must be held low long
enough to pass the internal glitch filter and get recognized by
the internal reset circuit. This functionality is also active in
Stop mode.
After the RST pin is released, there is no extra t RST to be
considered.
The 33911 can wake-up automatically after a
predetermined time spent in Sleep or Stop mode. Cyclic
sense and Forced wake-up are exclusive. If Forced wake-up
is enabled, the Cyclic Sense can not be enabled.
To determine the wake-up period, the following SPI set-up
has to be sent before entering in low power modes:
• In TIMCR: select the CS/WD bit and determine the low
power mode period with CYSTx bits.
• In HSCR: The HS1 bit must be disabled.
Window Watchdog Overflow
If the watchdog counter is not properly serviced while its
window is open, the 33911 will detect an MCU software runaway and will reset the microcontroller.
Wake-up From Sleep Mode
WAKE-UP CAPABILITIES
Once entered into one of the low-power modes (Sleep or
Stop) only wake-up sources can bring the device into Normal
mode operation.
In Stop mode, a wake-up is signaled to the MCU as an
interrupt, while in Sleep mode the wake-up is performed by
activating the 5.0 V regulator and resetting the MCU. In both
cases the MCU can detect the wake-up source by accessing
the SPI registers and reading the Interrupt Source Register.
There is no specific SPI register bit to signal a CS wake-up or
external reset. If necessary this condition is detected by
excluding all other possible wake-up sources.
Wake-up from Wake-up inputs (L1 and L2) with cyclic
sense disabled
CS Wake-up
While in Stop mode, a rising edge on the CS will cause a
wake-up. The CS wake-up does not generate an interrupt,
and is not reported on SPI.
LIN Wake-up
While in the low-power mode, the 33911 monitors the
activity on the LIN bus. A dominant pulse larger than t PROPWL
followed by a dominant to recessive transition will cause a
LIN wake-up. This behavior protects the system from a short
to ground bus condition. The bit RXONLY = 1 from LINCR
Register disables the LIN wake-up from Stop mode.
The wake-up lines are dedicated to sense state changes
of external switches and wake-up the MCU (in Sleep or Stop
mode).
33911
30
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
RST Wake-up
While in Stop mode, the 33911 can wake-up when the
RST pin is held low long enough to pass the internal glitch
filter. Then, the 33911 will change to Normal Request or
Normal modes depending on the WDCONF pin
configuration. The RST wake-up does not generate an
interrupt and is not reported via SPI.
From Stop mode, the following wake-up events can be
configured:
• Wake-up from Lx inputs without cyclic sense
• Cyclic sense wake-up inputs
• Force wake-up
• CS wake-up
• LIN wake-up
• RST wake-up
From Sleep mode, the following wake-up events can be
configured:
• Wake-up from Lx inputs without cyclic sense
• Cyclic sense wake-up inputs
• Force wake-up
• LIN wake-up
WINDOW WATCHDOG
The 33911 includes a configurable window watchdog
which is active in Normal mode. The watchdog can be
configured by an external resistor connected to the WDCONF
pin. The resistor is used to achieve higher precision in the
timebase used for the watchdog.
SPI clears are performed by writing through the SPI in the
MOD bits of the Mode Control Register (MCR).
During the first half of the SPI timeout, watchdog clears are
not allowed, but after the first half of the SPI timeout window,
the clear operation opens. If a clear operation is performed
outside the window, the 33911 will reset the MCU, in the
same way as when the watchdog overflows.
WINDOW CLOSED
NO WATCHDOG CLEAR
ALLOWED
WD TIMING X 50%
WINDOW OPEN
FOR WATCHDOG
CLEAR
WD TIMING X 50%
WD PERIOD (tPWD)
WD TIMING SELECTED BY RESISTOR
ON WDCONF PIN
Figure 15. Window Watchdog Operation
To disable the watchdog function in Normal mode the user
must connect the WDCONF pin to ground. This measure
effectively disables Normal Request mode. The WDOFF bit
in the Watchdog Status Register (WDSR) will be set. This
condition is only detected during Reset mode.
If neither a resistor nor a connection to ground is detected,
the watchdog falls back to the internal lower precision
timebase of 150 ms (typ.) and signals the faulty condition
through the Watchdog Status Register (WDSR).
The watchdog timebase can be further divided by a
prescaler which can be configured by the Timing Control
Register (TIMCR). During Normal Request mode, the
window watchdog is not active but there is a 150 ms (typ.)
timeout for leaving the Normal Request mode. In case of a
timeout, the 33911 will enter into Reset mode, resetting the
microcontroller before entering again into Normal Request
mode.
FAULTS DETECTION MANAGEMENT
The 33911 has the capability to detect faults like an over
or under-voltage on VS1, TxD in permanent Dominant State,
Over-temperature on HS, LIN. It is able to take corrective
actions accordingly. Most of faults are monitoring through
SPI and the Interrupt pin. The microcontroller can also take
actions.
The following table summarizes all fault sources the
device is able to detect with associated conditions. The status
for a device recovery and the SPI or pins monitoring are also
described.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
31
MC33911G5AC/MC3433911G5AC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
Table 7. Fault Detection Management Conditions
MONITORING(65)
BLOCK
FAULT
BATTERY FAIL
VSUP OVERVOLTAGE
Power Supply
MODE
All modes
Normal, Normal
Request
VSUP UNDERVOLTAGE
VDD UNDERVOLTAGE
CONDITION
FALLOUT
VSUP<3.0 V (typ)
then power-up
VSUP > 19.25 V (typ)
In Normal mode, HS
and LS shutdown if
bit HVSE=1 (reg
MCR)
VSUP < 6.0 V (typ)
All except Sleep
VDD < 4.5 V (typ)
RECOVERY
REG (FLAG,
BIT)
INTERRUPT
Condition gone
VSR (BATFAIL, 0)
-
Condition gone, to
re-enable HS or LS
write to HSCR or
LSCR registers
VSR (VSOV,3)
IRQ low +
ISR (0101)(66)
VSR (VSUV,2)
IRQ low + ISR
(0101)
Reset (64)
-
-
Condition gone
VDD OVER-TEMP
PREWARNING
VDD OVERTEMPERATURE
All except Low
Power modes
RXD PIN SHORT
CIRCUIT
LIN
High Side
TXD PIN
PERMANENT
DOMINANT
RXD pin shorted to
GND or 5 V
LIN trans shutdown
TXD pin low for more
than 1s (typ)
HIGH SIDE DRIVER
OVERTEMPERATURE
Temperature >
160°C (typ)
Normal, Normal
Request
LIN transmitter
shutdown
HS1 thermal
shutdown
Current through HS1
< 5.0 mA (typ)
HS1 on with limited
current capability
60 mA (min)
LOW SIDE DRIVERS
OVERTEMPERATURE
Temperature >
160°C (typ)
Both LS thermal
shutdown
LS2 OPEN-LOAD
LS2 OVER-CURRENT
NORMAL REQUEST
TIME-OUT EXPIRED
Normal Request
-
IRQ low + ISR
(0101)
-
LINSR,
(RXSHORT,3)
LIN transmitter reenabled once the
condition is gone and
TXD is high
Condition gone, to
re-enable HS1 write
to HSCR reg
-
Current through HS1
tends to rise above
the current limit
60 mA (min)
Normal, Normal
Request
VSR (VDDOT,1)
LINSR (TXDOM,2)
IRQ low + ISR
(0100)(66)
LINSR (LINOT,1)
HS1 OVERCURRENT
LS1 OVER-CURRENT
Watchdog
VDD shutdown,
Reset then Sleep
Temperature >
160°C (typ)
HS1 OPEN-LOAD
DETECTION
-
Temperature >
170°C (typ)
LIN DRIVER OVERTEMPERATURE
LS1 OPEN-LOAD
Low Side
Normal, Normal
Request
Temperature >
115°C (typ)
All flags in HSSR
are set
IRQ low + ISR
(0010) (66)
HSSR (HS1OP,1)
Condition gone
HSSR (HS1CL,0)
Condition gone, to
re-enable LS write to
LSCR reg
All flags in LSSR are
set
IRQ low + ISR
(0011) (66)
LSSR (LS1OP,1)
Current through LSx
< 7.5 mA (typ)
LSSR (LS2OP,3)
-
Current through LSx
tends to rise above
the current limit
160 mA (min)
LSx on with limited
current capability
160 mA (min)
The MCU did not
command the device
to Normal mode
within the 150 ms
timeout after reset
Reset
LSSR (LS1CL,0)
-
LSSR (LS2CL,2)
-
WATCHDOG
TIMEOUT
Normal
WD timeout or WD
clear within the
window closed
Reset
-
WATCHDOG ERROR
Normal
WDCONF pin is
floating
WD internal lower
precision timebase
150 ms (typ)
WDSR (WDTO, 3)
Connect WDCONF
to a resistor or to
GND
WDSR (WDERR, 2)
Notes
64.
65.
66.
When in Reset mode a VDD under-voltage condition combined with no VSUP under-voltage (VSUV=0) will send the device to Sleep mode.
Registers to be read when back in Normal Request or Normal mode depending on the fault. Interrupts only generated in Normal, Normal Request and Stop
modes
Unless masked, If masked IRQ remains high and the ISR flags are not set.
33911
32
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
TEMPERATURE SENSE GAIN
The analog multiplexer can be configured via SPI to allow
the ADOUT0 pin to deliver the internal junction temperature
of the device.
The graph below illustrates the internal chip temp sense
obtained per characterization at 3 temperatures with 3
different lots and 30 samples.
Temperature Sense Analog Output Voltage
5
4.5
Vadout0 (V)
4
3.5
3
2.5
2
-50
0
50
100
150
Temperature (°C)
Figure 16. Temperature Sense Gain
HIGH SIDE OUTPUT PINS HS1
This output is one high side driver intended to drive small
resistive loads or LEDs incorporating the following features:
• PWM capability (software maskable)
• Open load detection
• Current limitation
• Over-temperature shutdown (with maskable interrupt)
• High-voltage shutdown (software maskable)
• Cyclic sense
The high side switch is controlled by the bit HS1 in the High
Side Control Register (HSCR).
PWM Capability (direct access)
The high side driver offers additional (to the SPI control)
direct control via the PWMIN pin.
If the bit HS1 and PWMHS1 are set in the High Side
Control Register (HSCR), then the HS1 driver is turned on if
the PWMIN pin is high and turned of if the PWMIN pin is low.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
33
MC33911G5AC/MC3433911G5AC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
Interrupt
Control
Module
MOD1:2
HS1
HS1OP
VDD
VDD
PWMIN
High-Side Interrupt
High Voltage Shutdown
HVSE
PWMHS1
VS2
on/off
Control
Status
HS1CL
High Side Driver
charge pump
open load detection
current limitation
over-temperture shutdown (interrupt maskable)
high voltage shutdown (maskable)
Cyclic Sense
HS1
Wakeup
Module
Figure 17. High Side Drivers HS1
Open Load Detection
The high side driver signals an open load condition if the
current through the high side is below the open load current
threshold.
The open load condition is indicated with the bit HS1OP in
the High Side Status Register (HSSR).
Current Limitation
The high side driver has an output current limitation. In
combination with the over-temperature shutdown the highside driver is protected against over-current and short-circuit
failures.
When the driver operates in the current limitation area, it is
indicated with the bit HS1CL in the HSSR.
Note: If the driver is operating in current limitation mode,
excessive power might be dissipated.
Over-temperature Protection (HS Interrupt)
The high side driver is protected against over-temperature.
In case of an over-temperature condition, the high side driver
is shut down and the event is latched in the Interrupt Control
Module. The shutdown is indicated as HS Interrupt in the
Interrupt Source Register (ISR).
A thermal shutdown of the high side driver is indicated by
setting the HS1OP and HS1CL bits simultaneously.
If the bit HSM is set in the Interrupt Mask Register (IMR),
then an interrupt (IRQ) is generated.
A write to the High Side Control Register (HSCR), when
the over-temperature condition is gone, will re-enable the
high side driver.
High-voltage Shutdown
In case of a high voltage condition and if the high voltage
shutdown is enabled (bit HVSE in the Mode Control Register
(MCR) is set the high side driver is shut down.
A write to the High Side Control Register (HSCR), when
the high voltage condition is gone, will re-enable the high side
driver.
Sleep And Stop Mode
The high side driver can be enabled to operate in Sleep
and Stop mode for cyclic sensing. Also see Table 6,
Operating Modes Overview.
LOW SIDE OUTPUT PINS LS1 AND LS2
These outputs are two low side drivers intended to drive
relays incorporating the following features:
• PWM capability (software maskable)
• Open load detection
• Current limitation
• Over-temperature shutdown (with maskable interrupt)
• Active clamp (for driving relays)
• High-voltage shutdown (software maskable)
The low side switches are controlled by the bit LS1:2 in the
Low Side Control Register (LSCR).
33911
34
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
To protect the device against over-voltage when an
inductive load (relay) is turned off. An active clamp will reenable the low side FET if the voltage on the LS1 or LS2 pin
exceeds a certain level.
If both the bits LS1 and PWMLS1 are set in the Low Side
Control Register (LSCR), then the LS1 driver is turned on if
the PWMIN pin is high and turned off if the PWMIN pin is low.
The same applies to the LS2 and PWMLS2 bits for the LS2
driver.
PWM Capability (direct access)
Each low side driver offers additional (to the SPI control)
direct control via the PWMIN pin.
HVSE
VDD
Interrupt
Control
Module
VDD
MOD1:2
LSx
LSxOP
PWMLSx
Low Side Interrupt
High-voltage Shutdown
PWMIN
active
clamp
LSx
on/off
Control
LSxCL
Status
Low Side Driver
(active clamp)
Open-load Detection
Current Limitation
Over-temperture Shutdown (interrupt maskable)
High-voltage shutdown (maskable)
PGND
Figure 18. Low Side Drivers LS1 and LS2
Open Load Detection
High-voltage Shutdown
Each low side driver signals an open load condition if the
current through the low side is below the open load current
threshold.
The open load condition is indicated with the bit LS1OP
and LS2OP in the Low Side Status Register (LSSR).
In case of a high-voltage condition and if the high-voltage
shutdown is enabed (bit HVSE in the Mode Control Register
(MCR) is set both low sides drivers are shut down.
A write to the Low Side Control Register (LSCR), when the
high-voltage condition is gone, will re-enable the low side
drivers.
Current Limitation
Each low side driver has a current limitation. In
combination with the over-temperature shutdown the low
side drivers are protected against over-current and shortcircuit failures.
When the drivers operate in current limitation, this is
indicated with the bits LS1CL and LS2CL in the LSSR.
Note: If the drivers are operating in current limitation mode
excessive power might be dissipated.
Over-temperature Protection (LS Interrupt)
Both low side drivers are protected against overtemperature. In case of an over-temperature condition both
low side drivers are shut down and the event is latched in the
Interrupt Control Module. The shutdown is indicated as an LS
Interrupt in the Interrupt Source Register (ISR).
If the bit LSM is set in the Interrupt Mask Register (IMR)
then an Interrupt (IRQ) is generated.
A write to the Low Side Control Register (LSCR), when the
over-temperature condition is gone, will re-enable the low
side drivers.
Sleep And Stop Mode
The low side drivers are disabled in Sleep and Stop mode.
Also see Table 6, Operating Modes Overview.
LIN PHYSICAL LAYER
The LIN bus pin provides a physical layer for single-wire
communication in automotive applications. The LIN physical
layer is designed to meet the LIN physical layer specification
and has the following features:
• LIN physical layer 2.0, 2.1 and SAEJ2602 compliant
• Slew rate selection
• Over-temperature shutdown
• Advanced diagnostics
The LIN driver is a low side MOSFET with thermal
shutdown. An internal pull-up resistor with a serial diode
structure is integrated, so no external pull-up components are
required for the application in a slave node. The fall time from
dominant to recessive and the rise time from recessive to
dominant is controlled. The symmetry between both slopes is
guaranteed.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
35
MC33911G5AC/MC3433911G5AC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
LIN Pin
The LIN pin offers a high susceptibility immunity level from
external disturbance, guaranteeing communication during
external disturbance.
WAKE-UP
MODULE
LIN
Wake-up
MOD1:2
LSR0:1
J2602
VS1
LIN DRIVER
RXONLY
Slope and Slew Rate Control
RXSHORT
Over-temperature Shutdown (interrupt maskable)
TXDOM
LINOT
30 K
LIN
TXD
SLOPE
CONTROL
WAKE-UP
FILTER
LGND
RXD
RECEIVER
Figure 19. LIN Interface
Slew Rate Selection
The slew rate can be selected for optimized operation at
10.4 and 20 kBit/s as well as a fast baud rate for test and
programming. The slew rate can be adapted with the bits
LSR1:0 in the LIN Control Register (LINCR). The initial slew
rate is optimized for 20 kBit/s.
J2602 Conformance
To be compliant with the SAE J2602-2 specification, the
J2602 feature has to be enabled in the LINCR Register (bit
DIS_J2602 sets to 0). The LIN transmitter is disabled in case
of a VSUP under-voltage condition occurs and TXD is in
Recessive State: the LIN bus goes in Recessive State and
RXD goes high. The LIN transmitter is not disabled if TXD is
in Dominant State. A deglitcher on Vsup (tJ2602_DEG) is
implemented to avoid false switching.
If the (DIS_J2602) bit is set to 1, the J2602 feature is
disabled and the communication TXD-LIN-RXD works for
VSUP down to 4.6 V (typical value) and then the
communication is interrupted.
The (DIS_J2602) bit is set per default to 0.
Over-temperature Shutdown (LIN Interrupt)
The output low side FET is protected against overtemperature conditions. In case of an over-temperature
condition, the transmitter will be shut down and the LINOT bit
in the LIN Status Register (LINSR) is set.
If the LINM bit is set in the Interrupt Mask Register (IMR),
an Interrupt IRQ will be generated.
The transmitter is automatically re-enabled once the
condition is gone and TXD is high.
RXD Short-circuit Detection (LIN Interrupt)
The LIN transceiver has a short-circuit detection for the
RXD output pin. If the device transmits and in case of a short-
33911
36
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
circuit condition, either 5.0 V or Ground, the RXSHORT bit in
the LIN Status Register (LINSR) is set and the transmitter is
shut down.
If the LINM bit is set in the Interrupt Mask Register (IMR),
an Interrupt IRQ will be generated.
The transmitter is automatically re-enabled once the
condition is gone (transition on RXD) and TXD is high.
A read of the LIN Status Register (LINSR) without the RXD
pin short-circuit condition will clear the bit RXSHORT.
TXD Dominant Detection (LIN Interrupt)
The LIN transceiver monitors the TXD input pin to detect a
stuck in dominant (0 V) condition. In case of a stuck condition
(TXD pin 0 V for more than 1 second (typ.)), the transmitter is
shut down and the TXDOM bit in the LIN Status Register
(LINSR) is set.
If the LINM bit is set in the IMR, an Interrupt IRQ will be
generated.
The transmitter is automatically re-enabled once TXD is
high.
A read of the LIN Status Register (LINSR) with the TXD pin
at 5.0 V will clear the bit TXDOM.
LIN Receiver Operation Only
While in Normal mode, the activation of the RXONLY bit
disables the LIN TXD driver. In case of a LIN error condition,
this bit is automatically set. If Stop mode is selected with this
bit set, the LIN wake-up functionality is disabled and the RXD
pin will reflect the state of the LIN bus.
STOP Mode And Wake-up Feature
During Stop mode operation, the transmitter of the
physical layer is disabled. The receiver is still active and able
to detect wake-up events on the LIN bus line.
A dominant level longer than TPROPWL followed by a rising
edge will generate a wake-up interrupt, and will be reported
in the Interrupt Source Register (ISR). Also see Figure 11.
SLEEP Mode And Wake-up Feature
During Sleep mode operation, the transmitter of the
physical layer is disabled. The receiver must be active to
detect wake-up events on the LIN bus line.
A dominant level longer than TPROPWL followed by a rising
edge will generate a system wake-up (Reset), and will be
reported in the Interrupt Source Register (ISR). Also see
Figure 10.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
37
MC33911G5AC/MC3433911G5AC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
LOGIC COMMANDS AND REGISTERS
33911 SPI INTERFACE AND CONFIGURATION
• MISO — Master-in Slave-out
• SCLK— Serial Clock
A complete data transfer via the SPI consists of 1 byte.
The master sends 4 bits of address (A3:A0) + 4 bits of control
information (C3:C0) and the slave replies with 4 system
status bits (VMS,LINS,HSS,LSS) + 4 bits of status
information (S3:S0).
The serial peripheral interface creates the communication
link between a microcontroller (master) and the 33911.
The interface consists of four pins (see Figure 20):
• CS — Chip Select
• MOSI — Master-out Slave-in
CS
Register Write Data
MOSI
A3
A2
A1
A0
C3
C2
C1
C0
S1
S0
Register Read Data
MISO
VMS LINS HSS
LSS
S3
S2
SCLK
Read Data Latch
Rising: 33911 changes MISO/
MCU changes MOSI
Write Data Latch
Falling: 33911 samples MOSI/
MCU samples MISO
Figure 20. SPI Protocol
During the inactive phase of the CS (HIGH), the new data
The rising edge of the Chip Select CS indicates the end of
transfer is prepared.
the transfer and latches the write data (MOSI) into the
register. The CS high forces MISO to the high-impedance
The falling edge of the CS indicates the start of a new data
state.
transfer and puts the MISO in the low-impedance state and
Register reset values are described along with the reset
latches the analog status data (Register read data).
condition.
Reset condition is the condition causing the bit to
With the rising edge of the SPI clock (SCLK), the data is
be set to its reset value. The main reset conditions are:
moved to MISO/MOSI pins. With the falling edge of the SPI
- Power-On Reset (POR): the level at which the logic is
clock (SCLK), the data is sampled by the receiver.
reset
and BATFAIL flag sets.
The data transfer is only valid if exactly 8 sample clock
- Reset mode
edges are present during the active (low) phase of CS.
- Reset done by the RST pin (ext_reset)
33911
38
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
SPI REGISTER OVERVIEW
Table 8. System Status Register
Adress(A3:A0)
$0 - $F
BIT
Register Name / Read / Write Information
SYSSR - System Status Register
R
7
6
5
4
VMS
LINS
HSS
LSS
Table 9 summarizes the SPI Register content for Control Information (C3:C0)=W and status information (S3:S0) = R.
Table 9. SPI Register Overview
Adress(A3:A0)
BIT
Register Name / Read / Write Information
3
2
1
0
MCR - Mode Control Register
W
HVSE
0
MOD2
MOD1
VSR - Voltage Status Register
R
VSOV
VSUV
VDDOT
BATFAIL
VSR - Voltage Status Register
R
VSOV
VSUV
VDDOT
BATFAIL
WUCR - Wake-up Control Register
W
0
0
L2WE
L1WE
WUSR - Wake-up Status Register
R
-
-
L2
L1
WUSR - Wake-up Status Register
R
-
-
L2
L1
LINCR - LIN Control Register
W
DIS_J2602
RXONLY
LSR1
LSR0
LINSR - LIN Status Register
R
RXSHORT
TXDOM
LINOT
0
LINSR - LIN Status Register
R
RXSHORT
TXDOM
LINOT
0
HSCR - High Side Control Register
W
0
PWMHS1
0
HS1
HSSR - High Side Status Register
R
-
-
HS1OP
HS1CL
HSSR - High Side Status Register
R
-
-
HS1OP
HS1CL
LSCR - Low Side Control Register
W
PWMLS2
PWMLS1
LS2
LS1
LSSR - Low Side Status Register
R
LS2OP
LS2CL
LS1OP
LS1CL
LSSR - Low Side Status Register
R
LS2OP
LS2CL
LS1OP
LS1CL
TIMCR - Timing Control Register
W
CS/WD
WD2
WD1
WD0
CYST2
CYST1
CYST0
WDSR - Watchdog Status Register
R
WDTO
WDERR
WDOFF
WDWO
$B
WDSR - Watchdog Status Register
R
WDTO
WDERR
WDOFF
WDWO
$C
AMUXCR - Analog Multiplexer Control Register
W
LXDS
MX2
MX1
MX0
$D
CFR - Configuration Register
W
0
CYSX8
0
0
IMR - Interrupt Mask Register
W
HSM
LSM
LINM
VMM
ISR - Interrupt Source Register
R
ISR3
ISR2
ISR1
ISR0
ISR - Interrupt Source Register
R
ISR3
ISR2
ISR1
ISR0
$0
$1
$2
$3
$4
$5
$6
$7
$8
$9
$A
$E
$F
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
39
MC33911G5AC/MC3433911G5AC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
REGISTER DEFINITIONS
System Status Register - SYSSR
HS1CL
The System Status Register (SYSSR) is always
transferred with every SPI transmission and gives a quick
system status overview. It summarizes the status of the
Voltage Monitor Status (VMS), LIN Status (LINS), High Side
Status (HSS), and the Low Side Status (LSS).
Table 10. System Status Register
Read
HSS
HS1OP
Figure 23. High Side Status
LSS - Low Side Switch Status
S7
S6
S5
S4
VMS
LINS
HSS
LSS
VMS - Voltage Monitor Status
This read-only bit indicates that one or more bits in the
LSSR are set.
1 = Low Side Status bit set
0 = None
This read-only bit indicates that one or more bits in the
VSR are set.
1 = Voltage Monitor bit set
0 = None
LS1CL
LS1OP
LSS
LS2CL
LS2OP
BATFAIL
VDDOT
VSUV
Figure 24. Low Side Status
VMS
VSOV
Figure 21. Voltage Monitor Status
Mode Control Register - MCR
The Mode Control Register (MCR) allows switching
between the operation modes and to configure the 33911.
Writing the MCR will return the VSR.
Table 11. Mode Control Register - $0
LINS - LIN Status
This read-only bit indicates that one or more bits in the
LINSR are set.
1 = LIN Status bit set
0 = None
C3
C2
C1
C0
Write
HVSE
0
MOD2
MOD1
Reset
Value
1
0
-
-
Reset
Condition
POR
POR
-
-
LINOT
TXDOM
LINS
RXSHORT
Figure 22. LIN Status
HSS - High Side Switch Status
This read-only bit indicates that one or more bits in the
HSSR are set.
1 = High Side Status bit set
0 = None
HVSE - High-Voltage Shutdown Enable
This write-only bit enables/disables automatic shutdown of
the high side and the low side drivers during a high-voltage
VSOV condition.
1 = automatic shutdown enabled
0 = automatic shutdown disabled
MOD2, MOD1 - Mode Control Bits
These write-only bits select the operating mode and allow
clearing the watchdog in accordance with Table 7 Mode
Control Bits.
33911
40
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
Wake-up Control Register - WUCR
Table 12. Mode Control Bits
This register is used to control the digital wake-up inputs.
Writing the WUCR will return the Wake-up Status Register
(WUSR).
MOD2
MOD1
Description
0
0
Normal mode
0
1
Stop mode
1
0
Sleep mode
1
1
Normal mode + Watchdog Clear
Table 14. Wake-up Control Register - $2
Voltage Status Register - VSR
Returns the status of the several voltage monitors. This
register is also returned when writing to the Mode Control
Register (MCR).
C3
C2
C1
C0
Write
0
0
L2WE
L1WE
Reset
Value
1
1
1
1
Reset
Condition
POR, Reset mode or ext_reset
Table 13. Voltage Status Register - $0/$1
Read
S3
S2
S1
S0
VSOV
VSUV
VDDOT
BATFAIL
VSOV - VSUP Over-voltage
This read-only bit indicates an over-voltage condition on
the VS1 pin.
1 = Over-voltage condition.
0 = Normal condition.
VSUV - VSUP Under-voltage
This read-only bit indicates an under-voltage condition on
the VS1 pin.
1 = Under-voltage condition.
0 = Normal condition.
VDDOT - Main Voltage Regulator Over-temperature
Warning
This read-only bit indicates that the main voltage regulator
temperature reached the Over-temperature Prewarning
Threshold.
1 = Over-temperature Prewarning
0 = Normal
BATFAIL - Battery Fail Flag.
This read-only bit is set during power-up and indicates that
the 33911 had a Power-On-Reset (POR).
Any access to the MCR or VSR will clear the BATFAIL flag.
1 = POR Reset has occurred
0 = POR Reset has not occurred
LxWE - Wake-up Input x Enable
This write-only bit enables/disables which Lx inputs are
enabled. In Stop and Sleep mode the LxWE bit determines
which wake inputs are active for wake-up. If one of the Lx
inputs is selected on the analog multiplexer, the
corresponding LxWE is masked to 0.
1 = Wake-up Input x enabled.
0 = Wake-up Input x disabled.
Wake-up Status Register - WUSR
This register is used to monitor the digital wake-up inputs
and is also returned when writing to the WUCR.
Table 15. Wake-up Status Register - $2/$3
Read
S3
S2
S1
S0
-
-
L2
L1
Lx - Wake-up input x
This read-only bit indicates the status of the corresponding
Lx input. If the Lx input is not enabled, then the according
Wake-up status will return 0.
After a wake-up from Stop or Sleep mode these bits also
allow to determine which input has caused the wake-up, by
first reading the Interrupt Status Register (ISR) and then
reading the WUSR. The source of the wake-up is only
reported on the first WUCR or WUSR access.
1 = Lx pin high, or Lx is the source of the wake-up.
0 = Lx pin low, disabled or selected as an analog input.
LIN Control Register - LINCR
This register controls the LIN physical interface block.
Writing the LIN Control Register (LINCR) returns the LIN
Status Register (LINSR).
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
41
MC33911G5AC/MC3433911G5AC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
Table 18. LIN Status Register - $4/$5
Table 16. LIN Control Register - $4
C3
C2
C1
C0
Write
DIS_J2602
RXONLY
LSR1
LSR0
Reset
Value
0
0
0
0
POR
POR, Reset
mode, ext_reset
or LIN failure
gone*
Reset
Condition
POR
* LIN failure gone: if LIN failure (overtemp, TXD/RXD short) was set,
the flag resets automatically when the failure is gone.
J2602 - LIN Dominant Voltage Select
This write-only bit controls the J2602 circuitry. If the
circuitry is enabled (bit sets to 0), the TXD-LIN-RXD
communication works down to the battery under-voltage
condition is detected. Below, the bus is in recessive state. If
the circuitry is disabled (bit sets to 1), the communication
TXD-LIN-RXD works down to 4.6 V (typical value).
0 = Enabled J2602 feature.
1 = Disabled J2602 feature.
RXONLY - LIN Receiver Operation Only
This write-only bit controls the behavior of the LIN
transmitter.
In Normal mode, the activation of the RXONLY bit disables
the LIN transmitter. In case of a LIN error condition, this bit is
automatically set.
In Stop mode this bit disables the LIN wake-up
functionality, and the RXD pin will reflect the state of the LIN
bus.
1 = only LIN receiver active (Normal mode) or LIN wakeup disabled (Stop mode).
0 = LIN fully enabled.
LSRx - LIN Slew-Rate
This write-only bit controls the LIN driver slew-rate in
accordance with Table 17.
Table 17. LIN Slew Rate Control
LSR1
LSR0
Description
0
0
Normal Slew Rate (up to 20 kb/s)
0
1
Slow Slew Rate (up to 10 kb/s)
1
0
Fast Slew Rate (up to 100 kb/s)
1
1
Reserved
LIN Status Register - LINSR
This register returns the status of the LIN physical
interface block and is also returned when writing to the
LINCR.
Read
S3
S2
S1
S0
RXSHORT
TXDOM
LINOT
0
RXSHORT - RXD Pin Short-circuit
This read-only bit indicates a short-circuit condition on the
RXD pin (shorted either to 5.0 V or to Ground). The shortcircuit delay must be a worst case of 8µs to be detected and
to shut down the driver. To clear this bit, it must be read after
the condition is gone (transition detected on RXD pin). The
LIN driver is automatically re-enabled once the condition is
gone and TXD is high.
1 = RXD short-circuit condition.
0 = None.
TXDOM - TXD Permanent Dominant
This read-only bit signals the detection of a TXD pin stuck
at dominant (Ground) condition and the resultant shutdown in
the LIN transmitter. This condition is detected after the TXD
pin remains in dominant state for more than 1 second (typical
value).
To clear this bit, it must be read after TXD has gone high.
The LIN driver is automatically re-enabled once TXD goes
High.
1 = TXD stuck at dominant fault detected.
0 = None.
LINOT - LIN Driver Over-temperature
This read-only bit signals that the LIN transceiver was
shutdown due to over-temperature. The transmitter is
automatically re-enabled after the over-temperature
condition is gone and TXD is high. The LINOT bit is cleared
after SPI read once the condition is gone.
1 = LIN over-temperature shutdown
0 = None
High Side Control Register - HSCR
This register controls the operation of the high side driver.
Writing to this register returns the High Side Status Register
(HSSR).
Table 19. High Side Control Register - $6
C3
C2
C1
C0
Write
0
PWMHS1
0
HS1
Reset
Value
0
0
0
0
Reset
Condition
POR
POR, Reset mode, ext_reset, HS1
over-temp or (VSOV & HVSE)
33911
42
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
PWMHS1 - PWM Input Control Enable.
PWMLx - PWM input control enable.
This write-only bit enables/disables the PWMIN input pin
to control the high side switch. The high side switch must be
enabled (HS1 bit).
1 = PWMIN input controls HS1 output.
0 = HS1 is controlled only by SPI.
This write-only bit enables/disables the PWMIN input pin
to control the respective low side switch. The corresponding
low side switch must be enabled (LSx bit).
1 = PWMIN input controls LSx.
0 = LSx is controlled only by SPI.
HS1 - HS1 Switch Control.
LSx - LSx switch control.
This write-only bit enables/disables the high side switch.
1 = HS1 switch on.
0 = HS1 switch off.
This write-only bit enables/disables the corresponding low
side switch.
1 = LSx switch on.
0 = LSx switch off.
High Side Status Register - HSSR
This register returns the status of the high side switch and
is also returned when writing to the HSCR.
Table 20. High Side Status Register - $6/$7
Read
Low Side Status Register - LSSR
This register returns the status of the low side switches
and is also returned when writing to the LSCR.
Table 22. Low Side Status Register - $8/$9
S3
S2
S1
S0
-
-
HS1OP
HS1CL
Read
C3
C2
C1
C0
LS2OP
LS2CL
LS1OP
LS1CL
High Side thermal shutdown
A thermal shutdown of the high side driver is indicated by
setting the HS1OP and HS1CL bits simultaneously.
Low Side thermal shutdown
A thermal shutdown of the low side drivers is indicated by
setting all LSxOP and LSxCL bits simultaneously.
HS1OP - High Side Switch Open-Load Detection
This read-only bit signals that the high side switch is
conducting current below a certain threshold indicating
possible load disconnection.
1 = HS1 Open Load detected (or thermal shutdown)
0 = Normal
LSxOP - Low Side Switch Open-Load Detection
This read-only bit signals that the low side switches are
conducting current below a certain threshold indicating
possible load disconnection.
1 = LSx Open Load detected (or thermal shutdown)
0 = Normal
HS1CL - High Side Current Limitation
This read-only bit indicates that the high side switch is
operating in current limitation mode.
1 = HS1 in current limitation (or thermal shutdown)
0 = Normal
LSxCL - Low Side Current Limitation
This read-only bit indicates that the respective low side
switch is operating in current limitation mode.
1 = LSx in current limitation (or thermal shutdown)
0 = Normal
Low Side Control Register - LSCR
This register controls the operation of the low side drivers.
Writing the Low Side Control Register (LSCR) will also return
the Low Side Status Register (LSSR).
Table 21. Low Side Control Register - $8
C3
C2
C1
C0
Write
PWMLS2
PWMLS1
LS2
LS1
Reset
Value
0
0
0
0
Reset
Condition
POR
Timing Control Register - TIMCR
This register allows to configure the watchdog, the cyclic
sense and Forced Wake-up periods. Writing to the Timing
Control Register (TIMCR) will also return the Watchdog
Status Register (WDSR).
POR, Reset mode, ext_reset, LSx
over-temp or (VSOV & HVSE)
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
43
MC33911G5AC/MC3433911G5AC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
Table 25. Cyclic Sense and Force Wake-up Interval
Table 23. Timing Control Register - $A
CYSX8(67)
CYST2
CYST1
CYST0
Interval
X
0
0
0
No cyclic sense(68)
0
0
0
1
20 ms
0
0
1
0
40 ms
0
0
1
1
60 ms
0
1
0
0
80 ms
0
1
0
1
100 ms
0
1
1
0
120 ms
CS/WD - Cyclic Sense or Watchdog prescaler select
0
1
1
1
140 ms
This write-only bit selects which prescaler is being written
to the Cyclic Sense/Forced Wake-up prescaler or the
Watchdog prescaler.
1 = Cyclic Sense/Forced Wake-up Prescaler selected
0 = Watchdog Prescaler select
1
0
0
1
160 ms
1
0
1
0
320 ms
1
0
1
1
480 ms
1
1
0
0
640 ms
1
1
0
1
800 ms
WDx - Watchdog Prescaler
1
1
1
0
960 ms
1
1
1
1
1120 ms
C3
Write
C2
C1
C0
WD2
WD1
WD0
CYST2
CYST1
CYST0
CS/WD
Reset
Value
-
Reset
Condition
0
-
0
0
POR
This write-only bits selects the divider for the watchdog
prescaler and therefore selects the watchdog period in
accordance with Table 24. This configuration is valid only if
windowing watchdog is active.
Notes
67. bit CYSX8 is located in Configuration Register (CFR)
68. No Cyclic Sense and no Force Wake up available.
Table 24. Watchdog Prescaler
Watchdog Status Register - WDSR
This register returns the Watchdog status information and
is also returned when writing to the TIMCR.
WD2
WD1
WD0
Prescaler Divider
0
0
0
1
0
0
1
2
0
1
0
4
0
1
1
6
1
0
0
8
1
0
1
10
WDTO - Watchdog Timeout
1
1
0
12
1
1
1
14
This read-only bit signals the last reset was caused by
either a watchdog timeout or by an attempt to clear the
Watchdog within the window closed.
Any access to this register or the Timing Control Register
(TIMCR) will clear the WDTO bit.
1 = Last reset caused by watchdog timeout
0 = None
CYSTx - Cyclic Sense Period Prescaler Select
This write-only bits selects the interval for the wake-up
cyclic sensing together with the bit CYSX8 in the
Configuration Register (CFR) (see Configuration Register CFR on page 45).
This option is only active if the high side switch is enabled
when entering in Stop or Sleep mode. Otherwise a timed
wake-up is performed after the period shown in Table 25.
Table 26. Watchdog Status Register - $A/$B
Read
S3
S2
S1
S0
WDTO
WDERR
WDOFF
WDWO
WDERR - Watchdog Error
This read-only bit signals the detection of a missing
watchdog resistor. In this condition the watchdog is using the
internal, lower precision timebase. The Windowing function is
disabled.
1 = WDCONF pin resistor missing
0 = WDCONF pin resistor not floating
33911
44
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
WDOFF - Watchdog Off
Configuration Register - CFR
This read-only bit signals that the watchdog pin connected
to Ground and therefore disabled. In this case watchdog
timeouts are disabled and the device automatically enters
Normal mode out of Reset. This might be necessary for
software debugging and for programming the Flash memory.
1 = Watchdog is disabled
0 = Watchdog is enabled
WDWO - Watchdog Window Open
This read-only bit signals when the watchdog window is
open for clears. The purpose of this bit is for testing. Should
be ignored in case WDERR is High.
1 = Watchdog window open
0 = Watchdog window closed
Analog Multiplexer Control Register - MUXCR
This register controls the analog multiplexer and selects
the divider ration for the Lx input divider.
Table 27. Analog Multiplexer Control Register -$C
C3
C2
C1
C0
Write
LXDS
MX2
MX1
MX0
Reset Value
1
0
0
0
Reset Condition
POR
POR, Reset mode or ext_reset
LXDS - Lx Analog Input Divider Select
This write-only bit selects the resistor divider for the Lx
analog inputs. Voltage is internally clamped to VDD.
0 = Lx Analog divider: 1
1 = Lx Analog divider: 3.6 (typ.)
This register controls the cyclic sense timing multiplier.
Table 29. Configuration Register - $D
C3
C2
C1
C0
Write
0
CYSX8
0
0
Reset
Value
0
0
0
0
Reset
Condition
POR, Reset mode
or ext_reset
POR
POR
POR
CYSX8 - Cyclic Sense Timing x 8.
This write-only bit influences the cyclic sense and Forced
Wake-up period as shown in Table 25.
1 = Multiplier enabled
0 = None
Interrupt Mask Register - IMR
This register allows masking of some of the interrupt
sources. No interrupt will be generated to the MCU and no
flag will be set in the ISR register. The 5.0V Regulator overtemperature prewarning interrupt and Under-voltage (VSUV)
interrupts can not be masked and will always cause an
interrupt.
Writing to the IMR will return the ISR.
Table 30. Interrupt Mask Register - $E
C3
C2
C1
C0
Write
HSM
LSM
LINM
VMM
Reset Value
1
1
1
1
Reset Condition
POR
MXx - Analog Multiplexer Input Select
These write-only bits selects which analog input is
multiplexed to the ADOUT0 pin according to Table 28.
When disabled or when in Stop or Sleep mode, the output
buffer is not powered and the ADOUT0 output is left floating
to achieve lower current consumption.
Table 28. Analog Multiplexer Channel Select
MX2
MX1
MX0
Meaning
0
0
0
Disabled
0
0
1
Reserved
0
1
0
Die Temperature Sensor
0
1
1
VSENSE input
1
0
0
L1 input
1
0
1
L2 input
1
1
0
Reserved
1
1
1
Reserved
HSM - High Side Interrupt Mask
This write-only bit enables/disables interrupts generated in
the high side block.
1 = HS Interrupts Enabled
0 = HS Interrupts Disabled
LSM - Low Side Interrupt Mask
This write-only bit enables/disables interrupts generated in
the low side block.
1 = LS Interrupts Enabled
0 = LS Interrupts Disabled
LINM - LIN Interrupts Mask
This write-only bit enables/disables interrupts generated in
the LIN block.
1 = LIN Interrupts Enabled
0 = LIN Interrupts Disabled
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
45
MC33911G5AC/MC3433911G5AC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
VMM - Voltage Monitor Interrupt Mask
This register is also returned when writing to the Interrupt
Mask Register (IMR).
This write-only bit enables/disables interrupts generated in
the Voltage Monitor block. The only maskable interrupt in the
Voltage Monitor Block is the VSUP over-voltage interrupt.
1 = Interrupts Enabled
0 = Interrupts Disabled
Table 31. Interrupt Source Register - $E/$F
Read
Interrupt Source Register - ISR
S3
S2
S1
S0
ISR3
ISR2
ISR1
ISR0
ISRx - Interrupt Source Register
This register allows the MCU to determine the source of
the last interrupt or wake-up respectively. A read of the
register acknowledges the interrupt and leads IRQ pin to
high, in case there are no other pending interrupts. If there
are pending interrupts, IRQ will be driven high for 10µs and
then be driven low again.
These read-only bits indicate the interrupt source following
Table 32. If no interrupt is pending then all bits are 0.
In case more than one interrupt is pending, the interrupt
sources are handled sequentially multiplex.
Table 32. Interrupt Sources
Interrupt Source
ISR3 ISR2 ISR1 ISR0
Priority
none maskable
maskable
no interrupt
none
highest
0
0
0
0
no interrupt
0
0
0
1
Lx Wake-up from Stop and Sleep mode
-
0
0
1
0
-
HS Interrupt (Over-temperature)
0
0
1
1
-
LS Interrupt (Over-temperature)
0
1
0
0
LIN Wake-up
LIN Interrupt (RXSHORT, TXDOM, LIN OT)
0
1
0
1
0
1
1
0
Voltage Monitor Interrupt
Voltage Monitor Interrupt
(Low Voltage and VDD over-temperature)
(High Voltage)
Forced Wake-up
-
lowest
33911
46
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
TYPICAL APPLICATION
TYPICAL APPLICATION
The 33911 can be configured in several applications. The figure below shows the 33911 in the typical Slave Node Application.
V BAT
VS2
VS1
D1
C2
C1
C4
Interrupt
Control Module
LVI, HVI, HTI, OCI
IRQ
C3
Internal
Bus
VDD
Voltage Regulator
AGND
VDD
IRQ
Reset
Control Module
LVR, HVR, HTR, WD,
RST
LS1
Low Side Control
Module
RST
TIMER
HB Type Relay
PGND
Window
Watchdog Module
PWMIN
LS2
R1
Motor Output
High Side Control
Module
HS1
MISO
MOSI
Chip Temp Sense Module
SCLK
Analog Multiplexer
SPI
&
CONTROL
SPI
CS
MCU
VSENSE
VBAT Sense Module
L1
Analog Input Module
A/D
ADOUT0
L2
R2
R3
Wake Up Module
Digital Input Module
RXD
LIN Physical Layer
SCI
LIN
LIN
TXD
WDCONF
LGND
AGND
PGND
C5
Typical Component Values:
C1 = 47 µF; C2 = C4 = 100 nF; C3 = 10 µF; C5 = 220 pF
R1 = 10 kΩ; R2 = R3 = 10 kΩ; R4 = 20 kΩ-200 kΩ
R4
Recommended Configuration of the not Connected Pins (NC):
Pin 15, 16, 20, 21 = GND
Pin 11, 30 = open (floating)
Pin 24 = open (floating) or VS2
Pin 28 = this pin is not internally connected and may be used for PCB routing
optimization.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
47
MC33911BAC / MC34911BAC
MC33911BAC PRODUCT SPECIFICATIONS PAGES 48 TO 88
MC33911BAC PRODUCT SPECIFICATIONS
PAGES 48 TO 88
33911
48
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911BAC / MC34911BAC
INTERNAL BLOCK DIAGRAM
INTERNAL BLOCK DIAGRAM
VS2
INTERRUPT
CONTROL
MODULE
LVI, HVI, HTI, OCI
VS1
INTERNAL BUS
RST IRQ
VDD
AGND
VOLTAGE REGULATOR
RESET CONTROL
MODULE
LVR, HVR, HTR, WD
LS1
LOW SIDE
CONTROL
MODULE
WINDOW
WATCHDOG
MODULE
LS2
PGND
PWMIN
VS2
HIGH SIDE
CONTROL
MODULE
MISO
SCLK
SPI
&
CONTROL
ANALOG MULTIPLEXER
MOSI
CS
ADOUT0
WAKE-UP MODULE
RXD
TXD
HS1
VBAT
SENSE MODULE
VSENSE
CHIP TEMPERATURE
SENSE MODULE
ANALOG INPUT
MODULE
DIGITAL INPUT MODULE
L1
L2
LIN PHYSICAL
LAYER
LIN
LGND
WDCONF
Figure 25. 33911BAC Simplified Internal Block Diagram
33911
49
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911BAC / MC34911BAC
PIN CONNECTIONS
AGND
VDD
NC*
VSENSE
NC
VS1
VS2
HS1
32
31
30
29
28
27
26
25
PIN CONNECTIONS
RXD
1
24
NC*
TXD
2
23
L1
MISO
3
22
L2
MOSI
4
21
NC*
SCLK
5
20
NC*
CS
6
19
LS1
ADOUT0
7
18
PGND
PWMIN
8
17
LS2
9
10
11
12
13
14
15
16
RST
IRQ
NC*
WDCONF
LIN
LGND
NC*
NC*
* Special Configuration Recommended /
Mandatory for Marked NC Pins
Figure 26. 33911 Pin Connections
Table 33. 33911 Pin Definitions
A functional description of each pin can be found in the Functional Pin Description section.
Pin
Pin Name
Formal Name
Definition
1
RXD
Receiver Output
This pin is the receiver output of the LIN interface which reports the state of
the bus voltage to the MCU interface.
2
TXD
Transmitter Input
This pin is the transmitter input of the LIN interface which controls the state of
the bus output.
3
MISO
SPI Output
SPI (Serial Peripheral Interface) data output. When CS is high, pin is in the
high-impedance state.
4
MOSI
SPI Input
SPI (Serial Peripheral Interface) data input.
5
SCLK
SPI Clock
SPI (Serial Peripheral Interface) clock Input.
6
CS
SPI Chip Select
7
ADOUT0
Analog Output Pin 0
8
PWMIN
PWM Input
9
RST
Internal Reset I/O
Bidirectional reset I/O pin - driven low when any internal reset source is
asserted. RST is active low.
10
IRQ
Internal Interrupt
Output
Interrupt output pin, indicating wake-up events from Stop mode or events from
Normal and Normal Request modes. IRQ is active low.
SPI (Serial Peripheral Interface) chip select input pin. CS is active low.
Analog Multiplexer Output.
High side and low side pulse-width modulation input.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
50
MC33911BAC / MC34911BAC
PIN CONNECTIONS
Table 33. 33911 Pin Definitions
A functional description of each pin can be found in the Functional Pin Description section.
Pin
Pin Name
Formal Name
12
WDCONF
Watchdog
Configuration Pin
13
LIN
LIN Bus
14
LGND
LIN Ground Pin
17
LS2
19
LS1
18
PGND
22
L2
23
L1
25
HS1
26
VS2
27
VS1
29
Definition
This input pin is for configuration of the watchdog period and
allows the disabling of the watchdog.
This pin represents the single-wire bus transmitter and receiver.
This pin is the device LIN ground connection. It is internally connected to the
PGND pin.
Low Side Outputs
Relay drivers low side outputs.
Power Ground Pin
This pin is the device low side ground connection. It is internally connected to
the LGND pin.
Wake-Up Inputs
These pins are the wake-up capable digital inputs(69). In addition, all LX inputs
can be sensed analog via the analog multiplexer.
High Side Output
High side switch output.
Power Supply Pin
These pins are device battery level power supply pins. VS2 is supplying the
HS1 driver while VS1 supplies the remaining blocks.(70)
VSENSE
Voltage Sense Pin
Battery voltage sense input. (71)
31
VDD
Voltage Regulator
Output
+5.0V main voltage regulator output pin. (72)
32
AGND
Analog Ground Pin
This pin is the device analog ground connection.
Notes
69. When used as a digital input, a series 33 kΩ resistor must be used to protect against automotive transients.
70. Reverse battery protection series diodes must be used externally to protect the internal circuitry.
71. This pin can be connected directly to the battery line for voltage measurements. The pin is self-protected against reverse battery
connections. It is strongly recommended to connect a 10 kΩ resistor in series with this pin for protection purposes.
72. External capacitor (2.0 µF < C < 100 µF; 0.1Ω < ESR < 10 Ω) required.
33911
51
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911BAC / MC34911BAC
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 34. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
Normal Operation (DC)
VSUP(SS)
-0.3 to 27
Transient Conditions (load dump)
VSUP(PK)
-0.3 to 40
VDD
-0.3 to 5.5
VIN
-0.3 to VDD +0.3
VIN(IRQ)
-0.3 to 11
VHS1
- 0.3 to VSUP +0.3
V
VLS
-0.3 to 45
V
Normal Operation with a series 33kΩ resistor (DC)
VLxDC
-18 to 40
Transient input voltage with external component (according to ISO7637-2)
(See Figure 28)
VLxTR
±100
VVSENSE
-27 to 40
Normal Operation (DC)
VBUSDC
-18 to 40
Transient input voltage with external component (according to ISO7637-2)
(See Figure )
VBUSTR
-150 to 100
IVDD
Internally Limited
Human Body Model - LIN Pin(75)
VESD1-1
± 8000
Human Body Model - all other Pins(75)
VESD1-2
±2000
VESD2
± 150
VESD3-1
± 750
VESD3-2
± 500
VNC
Note 78
ELECTRICAL RATINGS
Supply Voltage at VS1 and VS2
Supply Voltage at VDD
Input / Output Pins Voltage
V
(73)
CS, RST, SCLK, PWMIN, ADOUT0, MOSI, MISO, TXD, RXD
V
V
Interrupt Pin (IRQ)(74)
HS1 Pin Voltage (DC)
LS1 and LS2 Pin Voltage (DC)
L1 and L2 Pin Voltage
VSENSE Pin Voltage (DC)
V
LIN Pin Voltage
VDD output current
V
ESD Voltage
Machine Model(76)
Charge Device Model(77)
Corner Pins (Pins 1, 8, 9, 16, 17, 24, 25 and 32)
All other Pins (Pins 2-7, 10-15, 18-23, 26-31)
NC Pin Voltage (NC pins 11, 15, 16, 20, 21, 24, 28 and 30)(78)
V
A
V
Notes
73. Exceeding voltage limits on specified pins may cause a malfunction or permanent damage to the device.
74. Extended voltage range for programming purpose only.
75. Testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 Ω),
76.
Testing is performed in accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 Ω),
77.
Testing is performed in accordance with the Charge Device Model, Robotic (CZAP = 4.0 pF).
78.
Special configuration recommended / mandatory for marked NC pins. Please refer to the typical application shown on page 88.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
52
MC33911BAC / MC34911BAC
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 34. Maximum Ratings (continued)
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
THERMAL RATINGS
Operating Ambient Temperature(79)
°C
TA
Operating Junction Temperature
33911
-40 to 125
34911
-40 to 85
TJ
-40 to 150
°C
Storage Temperature
TSTG
-55 to 150
°C
Thermal Resistance, Junction to Ambient
RθJA
Natural Convection, Single Layer board (1s)(80), (81)
Natural Convection, Four Layer board (2s2p)(80), (82)
(83)
Thermal Resistance, Junction to Case
Peak Package Reflow Temperature During
Reflow(84), (85)
°C/W
85
56
RθJC
23
°C/W
TPPRT
Note 85
°C
Notes
79. The limiting factor is junction temperature; taking into account the power dissipation, thermal resistance, and heat sinking.
80.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient
temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
81.
82.
83.
84.
Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1).
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
85.
33911
53
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911BAC / MC34911BAC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 35. Static Electrical Characteristics
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33911 and -40°C ≤ TA ≤ 85°C for the
34911, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
VSUP
5.5
–
18
V
Functional Operating Voltage(86)
VSUPOP
–
–
27
V
Load Dump
VSUPLD
–
–
40
V
IRUN
–
4.5
10
mA
–
48
80
–
58
90
–
27
35
–
37
48
ICYCLIC
–
10
–
VBATFAIL
1.5
3.0
3.9
VBATFAIL_HYS
–
0.9
–
VSUV
5.55
6.0
6.6
VSUV_HYS
–
1.0
–
VSOV
18
19.25
20.5
–
1.0
–
SUPPLY VOLTAGE RANGE (VS1, VS2)
Nominal Operating Voltage
SUPPLY CURRENT RANGE (VSUP = 13.5 V)
Normal Mode (IOUT at VDD = 10 mA), LIN Recessive State(87)
Stop Mode, VDD ON with IOUT = 100 µA, LIN Recessive State
(87), (88), (89)
ISTOP
5.5 V < VSUP < 12 V
VSUP = 13.5 V
Sleep Mode, VDD OFF, LIN Recessive
State(87), (89)
ISLEEP
5.5 V < VSUP < 12 V
12 V ≤ VSUP < 13.5 V
Cyclic Sense Supply Current
Adder(90)
µA
µA
µA
SUPPLY UNDER/OVER VOLTAGE DETECTIONS
Power-On Reset (BATFAIL)(91)
Threshold (measured on VS1)
V
(90)
Hysteresis (measured on VS1)(90)
VSUP Under-voltage Detection (VSUV Flag) (Normal and Normal Request
Modes, Interrupt Generated)
Threshold (measured on VS1)
Hysteresis (measured on VS1)
V
VSUP Over-voltage Detection (VSOV Flag) (Normal and Normal Request
Modes, Interrupt Generated)
Threshold (measured on VS1)
Hysteresis (measured on VS1)
VSOV_HYS
V
Notes
86. Device is fully functional. All features are operating.
87. Total current (IVS1 + IVS2) measured at GND pins excluding all loads, cyclic sense disabled.
88.
Total IDD current (including loads) below 100 µA.
89.
Stop and Sleep modes current will increase if VSUP exceeds 13.5 V.
90.
91.
This parameter is guaranteed by process monitoring but not production tested.
The flag is set during power-up sequence. To clear the flag, a SPI read must be performed.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
54
MC33911BAC / MC34911BAC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 35. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33911 and -40°C ≤ TA ≤ 85°C for the
34911, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
(92)
VOLTAGE REGULATOR
Symbol
Min
Typ
Max
4.75
5.00
5.25
60
110
200
–
0.1
0.25
Unit
(VDD)
Normal Mode Output Voltage
VDDRUN
1.0 mA < IVDD < 50 mA; 5.5 V < VSUP < 27 V
Normal Mode Output Current Limitation
IVDDRUN
Dropout Voltage(93)
VDDDROP
IVDD = 50 mA
Stop Mode Output Voltage
V
V
VDDSTOP
IVDD < 5.0 mA
mA
V
4.75
5.0
5.25
IVDDSTOP
6.0
12
36
Normal Mode, 5.5 V < VSUP < 18 V; IVDD = 10 mA
LRRUN
–
20
25
Stop Mode, 5.5 V < VSUP < 18 V; IVDD = 1.0 mA
LRSTOP
–
5.0
25
Normal Mode, 1.0 mA < IVDD < 50 mA
LDRUN
–
15
80
Stop Mode, 0.1 mA < IVDD < 5.0 mA
LDSTOP
–
10
50
110
125
140
TPRE_HYS
–
10
–
°C
TSD
155
170
185
°C
TSD_HYS
–
10
–
°C
Stop Mode Output Current Limitation
Line Regulation
mV
Load Regulation
Over-temperature Prewarning
mA
mV
(Junction)(94)
TPRE
Interrupt generated, Bit VDDOT Set
Over-temperature Prewarning hysteresis(94)
Over-temperature Shutdown Temperature
(94)
Over-temperature Shutdown hysteresis
(Junction)(94)
°C
Notes
92. Specification with external capacitor 2.0 µF < C < 100 µF and 100 mΩ ≤ ESR ≤ 10 Ω.
93. Measured when voltage has dropped 250 mV below its nominal Value (5.0 V).
94. This parameter is guaranteed by process monitoring but not production tested.
33911
55
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911BAC / MC34911BAC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 35. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33911 and -40°C ≤ TA ≤ 85°C for the
34911, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
VRSTTH
4.3
4.5
4.7
V
0.0
–
0.9
-150
-250
-350
1.5
–
8.0
RST INPUT/OUTPUT PIN (RST)
VDD Low-Voltage Reset Threshold
Low-state Output Voltage
VOL
IOUT = 1.5 mA; 3.5 V ≤ VSUP ≤ 27 V
High-state Output Current (0 < VOUT < 3.5 V)
Pull-down Current Limitation (internally limited)
IOH
V
IPD_MAX
VOUT = VDD
µA
mA
Low-state Input Voltage
VIL
-0.3
–
0.3 x VDD
V
High-state Input Voltage
VIH
0.7 x VDD
–
VDD +0.3
V
0.0
–
1.0
VDD -0.9
–
VDD
MISO SPI OUTPUT PIN (MISO)
Low-state Output Voltage
VOL
IOUT = 1.5 mA
High-state Output Voltage
VOH
IOUT = -250 µA
Tri-state Leakage Current
V
V
ITRIMISO
0 V ≤ VMISO ≤ VDD
µA
-10
–
10
SPI INPUT PINS (MOSI, SCLK, CS)
Low-state Input Voltage
VIL
-0.3
–
0.3 x VDD
V
High-state Input Voltage
VIH
0.7 x VDD
–
VDD +0.3
V
MOSI, SCLK Input Current
IIN
0 V ≤ VIN ≤ VDD
CS Pull-up Current
µA
-10
–
10
10
20
30
0.0
–
0.8
VDD -0.8
–
VDD
IPUCS
0 V < VIN < 3.5 V
µA
INTERRUPT OUTPUT PIN (IRQ)
Low-state Output Voltage
VOL
IOUT = 1.5 mA
High-state Output Voltage
VOH
IOUT = -250 µA
Leakage Current
V
V
VOH
VDD ≤ VOUT ≤ 10 V
mA
–
–
2.0
PULSE WIDTH MODULATION INPUT PIN (PWMIN)
Low-state Input Voltage
VIL
-0.3
–
0.3 x VDD
V
High-state Input Voltage
VIH
0.7 x VDD
–
VDD +0.3
V
10
20
30
Pull-up current
0 V < VIN < 3.5 V
IPUPWMIN
µA
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
56
MC33911BAC / MC34911BAC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 35. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33911 and -40°C ≤ TA ≤ 85°C for the
34911, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
TJ = 25°C, ILOAD = 50 mA; VSUP > 9.0 V
–
–
7.0
TJ = 150°C, ILOAD = 50 mA; VSUP > 9.0 V(95)
–
–
10
TJ = 150°C, ILOAD = 30 mA; 5.5 V < VSUP < 9.0 V(95)
–
–
14
Unit
HIGH SIDE OUTPUT HS1 PIN (HS1)
Output Drain-to-Source On resistance
Ω
RDS(ON)
Output Current Limitation(96)
ILIMHS1
0 V < VOUT < VSUP - 2.0 V
mA
60
120
250
–
5.0
7.5
–
–
10
VSUP -2
–
–
THSSD
150
165
180
°C
THSSD_HYS
–
10
–
°C
TJ = 25°C, ILOAD = 150 mA, VSUP > 9.0 V
–
–
2.5
TJ = 125°C, ILOAD = 150 mA, VSUP > 9.0 V
–
–
4.5
–
–
10
160
275
350
–
8.0
12
Open Load Current Detection
(97)
IOLHS1
Leakage Current
ILEAK
-0.2 V < VHS1 < VS2 + 0.2 V
Short-circuit Detection Threshold(98)
Over-temperature Shutdown(99), (104)
Over-temperature Shutdown
µA
VTHSC
5.5 V < VSUP < 27 V
Hysteresis(104)
mA
V
LOW SIDE OUTPUTS LS1 AND LS2 PINS (LS1, LS2)
Output Drain-to-Source On resistance
RDS(ON)
TJ = 125°C, ILOAD = 120 mA, 5.5 V < VSUP < 9.0 V
Output Current Limitation (100)
Ω
ILIMLSX
2.0 V < VOUT < VSUP
Open Load Current Detection(101)
IOLLSX
Leakage Current
ILEAK
-0.2 V < VOUT < VS1
Active Output Energy Clamp
mA
µA
–
–
10
VSUP +2
–
VSUP +5
2.0
–
–
TLSSD
150
165
180
°C
TLSSD_HYS
–
10
–
°C
VCLAMP
IOUT = 150 mA
Short-circuit Detection Threshold(102)
V
VTHSC
5.5 V < VSUP < 27 V
Over-temperature Shutdown(103), (104)
(104)
Over-temperature Shutdown Hysteresis
mA
V
Notes
95. This parameter is production tested up to TA = 125°C and guaranteed by process monitoring up to TJ = 150°C.
96.
97.
98.
99.
100.
101.
102.
103.
104.
When over-current occurs, the High Side stays ON with limited current capability and the HS1CL flag is set in the HSSR.
When open Load occurs, the flag (HS1OP) is set in the HSSR.
When short-circuit occurs and if the HVSE flag is enabled, HS1 automatically shut down.
When over-temperature Shutdown occurs, the High Side is turned off. All flags in HSSR are set.
When over-current occurs, the corresponding Low Side stays ON with limited current capability and the LSxCL flag is set in the LSSR.
When open load occurs, the flag (LSxOP) is set in the LSSR.
When short-circuit occurs and if the HVSE flag is enabled, both LS automatically shut down.
When over-temperature shutdown occurs, both Low Sides are turned off. All flags in LSSR are set.
Guaranteed by characterization but not production tested
33911
57
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911BAC / MC34911BAC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 35. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33911 and -40°C ≤ TA ≤ 85°C for the
34911, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
2.0
2.5
3.0
3.0
3.5
4.0
0.5
1.0
1.5
-10
–
10
800
1550
–
LXDS (Lx Divider Select) = 0
0.95
1.0
1.05
LXDS (Lx Divider Select) = 1
3.42
3.6
3.78
-80
0.0
80
-22
0.0
22
Unit
L1 AND L2 INPUT PINS (L1, L2)
Low Detection Threshold
VTHL
5.5 V < VSUP < 27 V
High Detection Threshold
VTHH
5.5 V < VSUP < 27 V
Hysteresis
Analog Input Divider Ratio (RATIOLx = VLx / VADOUT0)
Analog Output offset Ratio
LXDS (Lx Divider Select) = 0
RLxIN
µA
kΩ
RATIOLx
VRATIOLxOFFSET
LXDS (Lx Divider Select) = 1
Analog Inputs Matching
V
IIN
-0.2 V < VIN < VS1
Analog Input Impedance(106)
V
VHYS
5.5 V < VSUP < 27 V
Input Current(105)
V
mV
LxMATCHING
%
LXDS (Lx Divider Select) = 0
96
100
104
LXDS (Lx Divider Select) = 1
96
100
104
REXT
20
–
200
kΩ
WDACC
-15
–
15
%
STTOV
–
10.5
–
mV/K
5.0
5.25
5.5
-30
–
30
-45
–
45
WINDOW WATCHDOG CONFIGURATION PIN (WDCONF)
External Resistor Range
Watchdog Period Accuracy with External Resistor (Excluding Resistor
Accuracy)(107)
ANALOG MULTIPLEXER
Internal Chip Temperature Sense Gain
VSENSE Input Divider Ratio (RATIOVSENSE = VVSENSE / VADOUT0)
RATIOVSENSE
5.5 V < VSUP < 27 V
VSENSE Output Related Offset
OFFSETVSENSE
-40°C < TA < -20°C
mV
ANALOG OUTPUT (ADOUT0)
Maximum Output Voltage
VOUT_MAX
-5.0 mA < IO < 5.0 mA
Minimum Output Voltage
-5.0 mA < IO < 5.0 mA
V
VDD -0.35
–
VDD
0.0
–
0.35
VOUT_MIN
V
Notes
105. Analog Multiplexer input disconnected from Lx input pin.
106. Analog Multiplexer input connected to Lx input pin.
107. Watchdog timing period calculation formula: tPWD [ms] = 0.466 * (REXT - 20) + 10 (REXT in kΩ)
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
58
MC33911BAC / MC34911BAC
ELECTRICAL CHARACTERISTICS
STATIC ELECTRICAL CHARACTERISTICS
Table 35. Static Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33911 and -40°C ≤ TA ≤ 85°C for the
34911, unless otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal
conditions, unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
0.0
–
0.8
VDD -0.8
–
VDD
Unit
RXD OUTPUT PIN (LIN PHYSICAL LAYER) (RXD)
Low-state Output Voltage
VOL
IOUT = 1.5 mA
High-state Output Voltage
VOH
IOUT = -250 µA
V
V
TXD INPUT PIN (LIN PHYSICAL LAYER) (TXD)
Low-state Input Voltage
VIL
-0.3
–
0.3 x VDD
V
High-state Input Voltage
VIH
0.7 x VDD
–
VDD +0.3
V
IPUIN
10
20
30
µA
40
120
200
Pin Pull-up Current, 0 V < VIN < 3.5 V
LIN PHYSICAL LAYER, TRANSCEIVER (LIN)(108)
Output Current Limitation
IBUSLIM
Dominant State, VBUS = 18 V
mA
Leakage Output Current to GND
Dominant State; VBUS = 0 V; VBAT = 12 V
IBUS_PAS_DOM
-1.0
–
–
mA
Recessive State; 8.0 V < VBAT < 18 V; 8.0 V < VBUS < 18 V; VBUS ≥
VBAT
IBUS_PAS_REC
–
–
20
µA
GND Disconnected; GNDDEVICE = VSUP; VBAT = 12 V; 0 V < VBUS <
18 V
IBUS_NO_GND
-1.0
–
1.0
mA
IBUS
–
–
100
µA
VBAT Disconnected; VSUP_DEVICE = GND; 0 V < VBUS < 18 V
Receiver Input Voltages
VSUP
Receiver Dominant State
VBUSDOM
–
–
Receiver Recessive State
VBUSREC
0.6
–
–
Receiver Threshold Center (VTH_DOM + VTH_REC)/2
VBUS_CNT
0.475
0.5
0.525
Receiver Threshold Hysteresis (VTH_REC - VTH_DOM)
VHYS
–
–
0.175
VLIN_REC
VSUP-1
–
–
Dominant State, TXD LOW, 500 Ω External Pull-up Resistor, LDVS = 0
VLIN_DOM_0
–
1.1
1.4
Dominant State, TXD LOW, 500 Ω External Pull-up Resistor, LDVS = 1
VLIN_DOM_1
–
1.7
2
RSLAVE
20
30
60
kΩ
TLINSD
150
165
180
°C
TLINSD_HYS
–
10
–
°C
0.4
LIN Transceiver Output Voltage
Recessive State, TXD HIGH, IOUT = 1.0 µA
LIN Pull-up Resistor to VSUP
Over-temperature Shutdown
(109)
Over-temperature Shutdown Hysteresis
V
Notes
108. Parameters guaranteed for 7.0 V ≤ VSUP ≤ 18 V.
109.
When over-temperature shutdown occurs, the LIN bus goes into a recessive state and the flag LINOT in the LINSR is set.
33911
59
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911BAC / MC34911BAC
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 36. Dynamic Electrical Characteristics
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33911 and -40°C ≤ TA ≤ 85°C for the
34911, otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions,
unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
SPI Operating Frequency
f SPIOP
–
–
4.0
MHz
SCLK Clock Period
SPI INTERFACE TIMING (see Figure 36)
tPSCLK
250
–
N/A
ns
SCLK Clock High Time(110)
tWSCLKH
110
–
N/A
ns
SCLK Clock Low Time(110)
tWSCLKL
110
–
N/A
ns
Falling Edge of CS to Rising Edge of SCLK(110)
tLEAD
100
–
N/A
ns
Falling Edge of SCLK to CS Rising Edge(110)
tLAG
100
–
N/A
ns
MOSI to Falling Edge of SCLK(110)
tSISU
40
–
N/A
ns
Falling Edge of SCLK to MOSI(110)
tSIH
40
–
N/A
ns
MISO Rise Time(110)
tRSO
–
40
–
CL = 220 pF
MISO Fall Time(110)
tFSO
CL = 220 pF
Time from Falling or Rising Edges of
ns
ns
–
40
–
CS to:(110)
ns
- MISO Low-impedance
tSOEN
0.0
–
50
- MISO High -impedance
tSODIS
0.0
–
50
Time from Rising Edge of SCLK to MISO Data Valid(110)
tVALID
0.0
–
75
t RST
0.65
1.0
1.35
ms
t RSTDF
350
600
900
ns
8.5
10
11.5
0.2 x VDD ≤ MISO ≥ 0.8 x VDD, CL = 100 pF
ns
RST OUTPUT PIN
Reset Low-Level Duration after VDD High (see Figure 35)
Reset Deglitch Filter Time
WINDOW WATCHDOG CONFIGURATION PIN (WDCONF)
Watchdog Time Period (111)
External Resistor REXT = 20 kΩ (1%)
t PWD
ms
External Resistor REXT = 200 kΩ (1%)
79
94
108
Without External Resistor REXT (WDCONF pin open)
110
150
205
Notes
110. This parameter is guaranteed by process monitoring but not production tested.
111. Watchdog timing period calculation formula: tPWD [ms] = 0.466 * (REXT - 20) + 10 (REXT in kΩ)
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
60
MC33911BAC / MC34911BAC
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 36. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33911 and -40°C ≤ TA ≤ 85°C for the
34911, otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions,
unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
t WUF
8.0
20
38
μs
–
–
5.0
110
150
205
–
–
10
L1 AND L2 INPUTS
Wake-up Filter Time
STATE MACHINE TIMING
Delay Between CS LOW-to-HIGH Transition (at the End of a SPI Stop
Command) and Stop Mode Activation(112)
Normal Request Mode Timeout (see Figure 35)
Delay Between SPI Command and HS /LS Turn On(113)
t NR TOUT
Delay Between Normal Request and Normal Mode After a Watchdog Trigger
Command (Normal Request Mode)(112)
μs
t S-OFF
9.0 V < VSUP < 27 V
–
–
10
–
–
10
μs
t SNR2N
Delay Between CS Wake-Up (CS LOW to HIGH) in Stop Mode and:
μs
Normal Request Mode, VDD ON and RST HIGH
t WUCS
9.0
15
80
First Accepted SPI Command
t WUSPI
90
—
N/A
t 2CS
4.0
—
—
Minimum Time Between Rising and Falling Edge on the CS
ms
μs
t S-ON
9.0 V < VSUP < 27 V
Delay Between SPI Command and HS /LS Turn Off(113)
μs
t STOP
μs
LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR NORMAL SLEW RATE - 20.0 KBIT/SEC(114), (115)
Duty Cycle 1: D1 = tBUS_REC(MIN)/(2 x tBIT), tBIT = 50 µs
D1
7.0 V ≤ VSUP ≤ 18 V
Duty Cycle 2: D2 = tBUS_REC(MAX)/(2 x tBIT), tBIT = 50 µs
LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR SLOW SLEW RATE - 10.4
7.6 V ≤ VSUP ≤ 18 V
—
—
—
0.581
KBIT/SEC(114), (116)
μs
D3
7.0 V ≤ VSUP ≤ 18 V
Duty Cycle 4: D4 = tBUS_REC(MAX)/(2 x tBIT), tBIT = 96 µs
—
D2
7.6 V ≤ VSUP ≤ 18 V
Duty Cycle 3: D3 = tBUS_REC(MIN)/(2 x tBIT), tBIT = 96 µs
0.396
0.417
—
—
—
—
0.590
μs
D4
Notes
112. This parameter is guaranteed by process monitoring but not production tested.
113. Delay between turn on or off command (rising edge on CS) and HS or LS ON or OFF, excluding rise or fall time due to an external load.
114. Bus load RBUS and CBUS 1.0 nF / 1.0 kΩ, 6.8nF / 660 Ω, 10 nF / 500 Ω. Measurement thresholds: 50% of TXD signal to LIN signal
threshold defined at each parameter. See Figure 29.
115. See Figure 30.
116. See Figure 31.
33911
61
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911BAC / MC34911BAC
ELECTRICAL CHARACTERISTICS
DYNAMIC ELECTRICAL CHARACTERISTICS
Table 36. Dynamic Electrical Characteristics (continued)
Characteristics noted under conditions 5.5 V ≤ VSUP ≤ 18 V, -40°C ≤ TA ≤ 125°C for the 33911 and -40°C ≤ TA ≤ 85°C for the
34911, otherwise noted. Typical values noted reflect the approximate parameter mean at TA = 25°C under nominal conditions,
unless otherwise noted.
Characteristic
Symbol
Min
Typ
Max
Unit
SRFAST
—
20
—
V / μs
t REC_PD
—
3.0
6.0
t REC_SYM
- 2.0
—
2.0
t PROPWL
42
70
95
t WAKE
—
—
1500
t WAKE
9.0
13
17
t TXDDOM
0.65
1.0
1.35
LIN PHYSICAL LAYER: DRIVER CHARACTERISTICS FOR FAST SLEW RATE
LIN Fast Slew Rate (Programming Mode)
LIN PHYSICAL LAYER: CHARACTERISTICS AND WAKE-UP TIMINGS
(117)
Propagation Delay and Symmetry(118)
μs
Propagation Delay Receiver, tREC_PD = max (tREC_PDR, tREC_PDF)
Symmetry of Receiver Propagation Delay tREC_PDF - tREC_PDR
Bus Wake-up Deglitcher (Sleep and Stop
Modes)(119)
Bus Wake-up Event Reported
From Sleep Mode
(120)
From Stop Mode(121)
TXD Permanent Dominant State Delay
μs
μs
s
PULSE WIDTH MODULATION INPUT PIN (PWMIN)
PWMIN pin(122)
fPWMIN
Max. frequency to drive HS and LS output pins
kHz
10
Notes
117. VSUP from 7.0 V to 18 V, bus load RBUS and CBUS 1.0 nF / 1.0 kΩ, 6.8 nF / 660 Ω, 10 nF / 500 Ω. Measurement thresholds: 50% of TXD
signal to LIN signal threshold defined at each parameter. See Figure 29.
118. See Figure 32.
119. See Figure 33 for Sleep and Figure 34 for Stop mode.
120. The measurement is done with 1.0 µF capacitor and 0 mA current load on VDD. The value takes into account the delay to charge the
capacitor. The delay is measured between the bus wake-up threshold (VBUSWU) rising edge of the LIN bus and when VDD reaches 3.0V.
See Figure 33. The delay depends of the load and capacitor on VDD.
121.
In Stop mode, the delay is measured between the bus wake-up threshold (VBUSWU) and the falling edge of the IRQ pin. See Figure 34.
122.
This parameter is guaranteed by process monitoring but not production tested.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
62
MC33911BAC / MC34911BAC
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
TIMING DIAGRAMS
33911
1.0nF
LIN
TRANSIENT PULSE
GENERATOR
(NOTE)
GND
PGND LGND
AGND
Note Waveform per ISO 7637-2. Test Pulses 1, 2, 3a, 3b.
Figure 27. Test Circuit for Transient Test Pulses (LIN)
33911
1.0nF
L1, L2
10kΩ
PGND LGND
TRANSIENT PULSE
GENERATOR
(NOTE)
GND
AGND
NOTE: Waveform per ISO 7637-2. Test Pulses 1, 2, 3a, 3b.
Figure 28. Test Circuit for Transient Test Pulses (Lx)
VSUP
TXD
LIN
R0
RXD
C0
R0 AND C0 COMBINATIONS:
• 1.0 KΩ and 1.0 nF
• 660 Ω and 6.8 nF
• 500 Ω and 10 nF
Figure 29. Test Circuit for LIN Timing Measurements
33911
63
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911BAC / MC34911BAC
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
TXD
tBIT
tBIT
tBUS_DOM (MAX)
VLIN_REC
tREC - MAX
tDOM - MIN
74.4% VSUP
tDOM - MIN
58.1% VSUP
40.0% VSUP
LIN
tBUS_REC (MIN)
60.0% VSUP
58.1% VSUP
40.0% VSUP
28.4% VSUP
28.4% VSUP
42.2% VSUP
tREC - MIN
tDOM - MAX
tBUS_DOM (MIN)
tBUS_REC (MAX)
RXD
tRDOM
tRREC
Figure 30. LIN Timing Measurements for Normal Slew Rate
TXD
tBIT
tBIT
tBUS_DOM (MAX)
VLIN_REC
tBUS_REC (MIN)
tREC - MAX
tDOM - MIN
61.6% VSUP
40.0% VSUP
LIN
tDOM - MIN
77.8% VSUP
60.0% VSUP
61.6% VSUP
40.0% VSUP
25.1% VSUP
25.1% VSUP
38.9% VSUP
tREC - MIN
tDOM - MAX
tBUS_DOM (MIN)
tBUS_REC (MAX)
RXD
tRDOM
tRREC
Figure 31. LIN Timing Measurements for Slow Slew Rate
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
64
MC33911BAC / MC34911BAC
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
VLIN_REC
VBUSrec
VBUSdom
VSUP
LIN BUS SIGNAL
RXD
tRX_PDF
tRX_PDR
Figure 32. LIN Receiver Timing
VLIN_REC
LIN
0.4 VSUP
DOMINANT LEVEL
VDD
tPROPWL
tWAKE
Figure 33. LIN Wake-up Sleep Mode Timing
Vrec
VLIN_REC
LIN
0.4VSUP
0.4 VSUP
Dominant
Level
Dominant level
IRQ
t PROPWL
TpropWL
t WAKE
Twake
Figure 34. LIN Wake-up Stop Mode Timing
33911
65
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911BAC / MC34911BAC
ELECTRICAL CHARACTERISTICS
TIMING DIAGRAMS
VSUP
VDD
RST
tNRTOUT
tRST
Figure 35. Power On Reset and Normal Request Timeout Timing
tPSCLK
CS
tWSCLKH
tLEAD
tLAG
SCLK
tWSCLKL
tSISU
MOSI
UNDEFINED
D0
tSIH
DON’T CARE
D7
DON’T CARE
tVALID
tSODIS
tSOEN
MISO
D0
DON’T CARE
D7
Figure 36. SPI Timing Characteristics
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
66
MC33911BAC / MC34911BAC
FUNCTIONAL DESCRIPTION
INTRODUCTION
FUNCTIONAL DESCRIPTION
INTRODUCTION
The 33911 was designed and developed as a highly
integrated and cost-effective solution for automotive and
industrial applications. For automotive body electronics, the
33911 is well suited to perform relay control in applications
like window lift, sunroof, etc. via a LIN bus.
Power switches are provided on the device configured as
high side and low side outputs. Other ports are also provided,
which include a voltage sense port and two wake-up capable
pins. An internal voltage regulator provides power to a MCU
device.
Also included in this device is a LIN physical layer, which
communicates using a single wire. This enables this device
to be compatible with 3-wire bus systems, where one wire is
used for communication, one for battery, and one for ground.
FUNCTIONAL PIN DESCRIPTION
See Figure 1, 33911 Simplified Application Diagram, for a
graphic representation of the various pins referred to in the
following paragraphs. Also, see the 33911 Pin Connections
diagram for a description of the pin locations in the package.
RECEIVER OUTPUT (RXD)
The RXD pin is a digital output. It is the receiver output of
the LIN interface and reports the state of the bus voltage:
RXD Low when LIN bus is dominant, RXD High when LIN bus
is recessive.
TRANSMITTER INPUT (TXD)
The TXD pin is a digital input. It is the transmitter input of
the LIN interface and controls the state of the bus output
(dominant when TXD is Low, recessive when TXD is High).
This pin has an internal pull-up to force recessive state in
case the input is left floating.
LIN BUS (LIN)
The LIN pin represents the single-wire bus transmitter and
receiver. It is suited for automotive bus systems and is
compliant to the LIN bus specification 2.0.
The LIN interface is only active during Normal and Normal
Request modes.
SERIAL DATA CLOCK (SCLK)
The SCLK pin is the SPI clock input pin. MISO data
changes on the negative transition of the SCLK. MOSI is
sampled on the positive edge of the SCLK.
MASTER OUT SLAVE IN (MOSI)
The MOSI digital pin receives SPI data from the MCU. This
data input is sampled on the positive edge of SCLK.
MASTER IN SLAVE OUT (MISO)
The MISO pin sends data to a SPI-enabled MCU. It is a
digital tri-state output used to shift serial data to the
microcontroller. Data on this output pin changes on the
negative edge of the SCLK. When CS is High, this pin will
remain in high-impedance state.
CHIP SELECT (CS)
CS is an active low digital input. It must remain low during
a valid SPI communication and allow for several devices to
be connected in the same SPI bus without contention. A
rising edge on CS signals the end of the transmission and the
moment the data shifted in is latched. A valid transmission
must consist of 8 bits only.
While in STOP mode a low-to-high level transition on this
pin will generate a wake-up condition.
ANALOG MULTIPLEXER (ADOUT0)
The ADOUT0 pin can be configured via the SPI to allow
the MCU A/D converter to read the several inputs of the
Analog Multiplexer, including the VSENSE, L1, L2 input
voltages and the internal junction temperature.
PWM INPUT CONTROL (PWMIN)
This digital input can control the high side and low side
drivers in Normal Request and Normal mode.
To enable PWM control, the MCU must perform a write
operation to the High Side Control Register (HSCR), or the
Low Side Control Register (LSCR).
This pin has an internal 20 μA current pull-up.
RESET (RST)
This bidirectional pin is used to reset the MCU in case the
33911 detects a reset condition, or to inform the 33911 that
the MCU was just reset. After release of the RST pin Normal
Request mode is entered.
The RST pin is an active low filtered input and output
formed by a weak pull-up and a switchable pull-down
structure, which allows this pin to be shorted either to VDD or
to GND during software development without the risk of
destroying the driver.
INTERRUPT (IRQ)
The IRQ pin is a digital output used to signal events or
faults to the MCU while in Normal and Normal Request mode
or to signal a wake-up from Stop mode. This active low output
33911
67
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911BAC / MC34911BAC
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
will transition high only after the interrupt is acknowledged by
a SPI read of the respective status bits.
WATCHDOG CONFIGURATION (WDCONF)
The WDCONF pin is the configuration pin for the internal
watchdog. A resistor can be connected to this pin to configure
the window watchdog period. When connected directly to
ground, the watchdog will be disabled. When this pin is left
open, the watchdog period is fixed to its lower precision
internal default value (150 ms, typical).
GROUND CONNECTIONS (AGND, PGND, LGND)
The AGND, PGND and LGND pins are the Analog and
Power ground pins.
The AGND pin is the ground reference of the voltage
regulator.
The PGND and LGND pins are used for high-current load
return as in the relay-drivers and LIN interface pin.
Note: PGND, AGND and LGND pins must be connected
together.
LOW SIDES (LS1 AND LS2)
LS1 and LS2 are the low side driver outputs. Those
outputs are short-circuit protected and include active clamp
circuitry to drive inductive loads. Due to the energy clamp
voltage on this pin, it can raise above the battery level when
switched off. The switches are controlled through the SPI and
can be configured to respond to a signal applied to the
PWMIN input pin.
Both low side switches are protected against overheating.
DIGITAL/ANALOGS (L1 AND L2)
The Lx pins are multi purpose inputs. They can be used as
digital inputs, which can be sampled by reading the SPI and
used for wake-up when 33911 is in low-power mode or used
as analog inputs for the analog multiplexer. When used to
sense voltage outside the module, a 33kohm series resistor
must be used on each input.
When used as wake-up inputs L1 and L2 can be
configured to operate in cyclic sense mode. In this mode, the
high side switch is configured to be periodically turned on and
sample the wake-up inputs. If a state change is detected
between two cycles, a wake-up is initiated. The 33911 can
also wake-up from Stop or Sleep by a simple state change on
L1 and L2.
When used as an analog input, the voltage present on the
Lx pins are scaled down by a selectable internal voltage
divider and can be routed to the ADOUT0 output through the
analog multiplexer.
Note: If an Lx input is selected in the analog multiplexer, it
will be disabled as a digital input and remains disabled in lowpower mode. No wake-up feature is available in that
condition.
When an Lx input is not selected in the analog multiplexer,
the voltage divider is disconnected from that input.
HIGH SIDE OUTPUT (HS1)
This high side switch is able to drive loads such as relays
or lamps. Its structure is connected to the VS2 supply pin.
The pin is short-circuit protected and also protected against
overheating.
HS1 is controlled by SPI and can respond to a signal
applied to the PWMIN input pin.
The HS1 output can also be used during low-power mode
for the cyclic-sense of the wake inputs.
POWER SUPPLIES (VS1 AND VS2)
These are the battery level voltage supply pins. In
application, VS1 and VS2 pins must be protected against a
reverse battery connection and negative transient voltages
with external components. These pins sustain standard
automotive voltage conditions such as a load dump at 40V.
The high side switch (HS1) is supplied by the VS2 pin, all
other internal blocks are supplied by the VS1 pin.
VOLTAGE SENSE (VSENSE)
This input can be connected directly to the battery line. It
is protected against a battery reverse connection. The
voltage present on this input is scaled down by an internal
voltage divider, and can be routed to the ADOUT0 output pin
and used by the MCU to read the battery voltage.
The ESD structure on this pin allows for excursion up to
+40 V and down to -27 V, allowing this pin to be connected
directly to the battery line. It is strongly recommended to
connect a 10kohm resistor in series with this pin for protection
purposes.
+5.0 V MAIN REGULATOR OUTPUT (VDD)
An external capacitor must be placed on the VDD pin to
stabilize the regulated output voltage. The VDD pin is
intended to supply a microcontroller. The pin is current limited
against shorts to GND and over-temperature protected.
During Stop mode, the voltage regulator does not operate
with its full drive capabilities and the output current is limited.
During Sleep mode the regulator output is completely shut
down.
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Analog Integrated Circuit Device Data
Freescale Semiconductor
68
MC33911BAC / MC34911BAC
FUNCTIONAL DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
FUNCTIONAL INTERNAL BLOCK DESCRIPTION
MC33911 - Functional Block Diagram
Window Watchdog
Digital / Analog Input
High Side Drivers
HS1
WakeUp
Voltage & Temperature
Sense
Low Side Driver
LS1 - LS2
SPI Interface
Reset & IRQ Logic
Voltage Regulator
VDD
LS/HS - PMW Control
LIN Interface / Control
LIN Physical Layer
Interface LIN
Analog Output 0
Analog Circutry
MCU Interface and Output Control
Drivers
Figure 37. Functional Internal Block Diagram
ANALOG CIRCUITRY
MCU INTERFACE
The 33911 is designed to operate under automotive
operating conditions. A fully configurable window watchdog
circuit will reset the connected MCU in case of an overflow.
Two low-power modes are available with several different
wake-up sources to reactivate the device. Two analog / digital
inputs can be sensed or used as the wake-up source.
The device is capable of sensing the supply voltage
(VSENSE), the internal chip temperature (CTEMP) as well as
the motor current using an external sense resistor.)
The 33911 is providing its control and status information
through a standard 8-Bit SPI interface. Critical system events
such as low or high-voltage/temperature conditions as well as
over-current conditions in any of the driver stages can be
reported to the connected MCU via IRQ or RST.
Both low side and both high side driver outputs can be
controlled via the SPI register as well as PWMIN input.
The integrated LIN physical layer interface can be
configured via the SPI register and its communication is
driven through the RXD and TXD device pin.
All internal analog sources are multiplexed to the ANOUT0
pin.
HIGH SIDE DRIVER
One current and temperature protected high side driver
with PWM capability is provided to drive small loads such as
status LED’s or small lamps.
The driver can be configured for periodic sense during lowpower modes.
LOW SIDE DRIVERS
Two current and temperature protected low side drivers
with PWM capability are provided to drive H-Bridge type
relays for power motor applications.
VOLTAGE REGULATOR OUTPUTS
One voltage regulators is implemented on the 33911. The
VDD main regulator output is designed to supply an MCU
with a precise 5.0 V.
LIN PHYSICAL LAYER INTERFACE
The 33911 provides a LIN 2.0 compatible LIN physical
layer interface with selectable slew rate and various
diagnostic features.
33911
69
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911BAC / MC34911BAC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
INTRODUCTION
The 33911 offers three main operating modes: Normal
(Run), Stop, and Sleep (Low-power). In Normal mode, the
device is active and operating under normal application
conditions. The Stop and Sleep modes are low-power modes
with wake-up capabilities.
In Stop mode, the voltage regulator still supplies the MCU
with VDD (limited current capability), and in Sleep mode the
voltage regulator is turned off (VDD = 0 V).
Wake-up from Stop mode is initiated by a wake-up
interrupt. Wake-up from Sleep mode is done by a reset and
the voltage regulator is turned back on.
The selection of the different modes is controlled by the
MOD1:2 bits in the Mode Control Register (MCR).
Figure 38 describes how transitions are done between the
different operating modes, and Table 37, gives an overview
of the operating modes.
RESET MODE
The 33911 enters the Reset mode after a power up. In this
mode, the RST pin is low for 1.0 ms (typical value). After this
delay, the 33911 enters the Normal Request mode and the
RST pin is driven high.
The Reset mode is entered if a reset condition occurs (VDD
low, Watchdog trigger fail, after a wake-up from Sleep mode,
or a Normal Request mode timeout).
NORMAL REQUEST MODE
This is a temporary mode automatically accessed by the
device after the Reset mode, or after a wake-up from Stop
mode.
In Normal Request mode, the VDD regulator is ON, the
Reset pin is high and the LIN is operating in RX Only mode.
As soon as the device enters the Normal Request mode,
an internal timer is started for 150 ms (typical value). During
these 150 ms, the MCU must configure the Timing Control
Register (TIMCR) and the MCR with MOD2 and MOD1 bits
set = 0, to enter in Normal mode. If within the 150 ms timeout
the MCU does not command the 33911 to Normal mode, it
will enter in Reset mode. If the WDCONF pin is grounded in
order to disable the watchdog function, the 33911 goes
directly in Normal mode after the Reset mode. If the
WDCONF pin is open, the 33911 stays typically for 150 ms in
Normal Request before entering in Normal mode.
The VDD regulator is ON and delivers its full current
capability.
If an external resistor is connected between the WDCONF
pin and the Ground, the window watchdog function will be
enabled.
The wake-up inputs (L1 and L2) can be read as digital
inputs or have its voltage routed through the analog
multiplexer.
The LIN interface has slew rate and timing compatible with
the LIN protocol specification 2.0. The LIN bus can transmit
and receive information.
The high side and the low side switches are active and
have PWM capability according to the SPI configuration.
The interrupts are generated to report failures for VSUP
over/under-voltage, thermal shutdown or thermal shutdown
prewarning on the main regulator.
SLEEP MODE
The Sleep mode is a low-power mode. From Normal
mode, the device enters the Sleep mode by sending one SPI
command through the MCR. All blocks are in their lowest
power consumption condition. Only some wake-up sources
(wake-up inputs with or without cyclic sense, forced wake-up,
and LIN receiver) are active. The 5.0 V regulator is OFF. The
internal low-power oscillator may be active if the IC is
configured for cyclic sense. In this condition, the high side
switches are turned on periodically and the wake-up inputs
are sampled.
Wake-up from Sleep mode is similar to a power-up. The
device goes into Reset mode except that the SPI will report
the wake-up source, and the BATFAIL flag is not set.
STOP MODE
The Stop mode is the second low-power mode, but in this
case the 5.0 V regulator is ON with limited current drive
capability. The application MCU is always supplied while the
33911 is operating in Stop mode.
The device can enter the Stop mode only by sending a SPI
command. When the application is in this mode, it can wakeup from the 33911 side (for example: cyclic sense, force
wake-up, LIN bus, wake inputs) or the MCU side (CS, RST
pins). Wake-up from Stop mode will transition the 33911 to
Normal Request mode and generate an interrupt, except if
the wake-up event is a low to high transition on the CS pin or
comes from the RST pin.
NORMAL MODE
In Normal mode, all 33911 functions are active and can be
controlled by the SPI interface and the PWMIN pin.
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Freescale Semiconductor
70
MC33911BAC / MC34911BAC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
Normal Request Timeout Expired (t NRTOUT)
VDD LOW
NORMAL
REQUEST
VDD LOW
VDD LOW (>t NRTOUT) EXPIRED
AND VSUV = 0
SLEEP COMMAND
STOP COMMAND
NORMAL
WD FAILED
WAKE-UP (INTERRUPT)
RESET
VDD HIGH AND
RESET DELAY (t RST) EXPIRED
WD DISABLED
Power Up
WD TRIGGER
POWER
DOWN
WAKE-UP (RESET)
SLEEP
STOP
VDD LOW
Legend
WD: Watchdog
WD Disabled: Watchdog disabled (WDCONF pin connected to GND)
WD Trigger: Watchdog is triggered by SPI command
WD Failed: No watchdog trigger or trigger occurs in closed window
Stop Command: Stop command sent via SPI
Sleep Command: Sleep command sent via SPI
wake-up from Stop mode: Lx state change, LIN bus wake-up, Periodic wake-up, CS rising edge wake-up or RST wake-up.
wake-up from Sleep mode: Lx state change, LIN bus wake-up, Periodic wake-up.
Figure 38. Operating Modes and Transitions
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Analog Integrated Circuit Device Data
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MC33911BAC / MC34911BAC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
Table 37. Operating Modes Overview
Function
Reset Mode
Normal Request Mode
Normal Mode
Stop Mode
VDD
Full
Full
Full
Stop
-
LSx
-
SPI/PWM(123)
SPI/PWM
-
-
HS1
-
SPI/PWM(123)
SPI/PWM
Note(124)
Note(125)
Analog Mux
-
SPI
SPI
-
-
Lx
-
Inputs
Inputs
Wake-up
Wake-up
LIN
-
Rx-Only
full/Rx-Only
Rx-Only/Wake-up
Wake-up
Watchdog
-
150 ms (typ.) timeout
On(126)/Off
-
-
VSENSE
On
On
On
VDD
-
Notes
123.
124.
125.
126.
Sleep Mode
Operation can be controlled by the PWMIN input.
HS switch can be configured for cyclic sense operation in Stop mode.
HS switch can be configured for cyclic sense operation in Sleep mode.
Windowing operation when enabled by an external resistor.
INTERRUPTS
High-voltage Interrupt
Interrupts are used to signal a microcontroller that a
peripheral needs to be serviced. The interrupts which can be
generated change according to the operating mode. While in
Normal and Normal Request modes, the 33911 signals
through interrupts special conditions which may require a
MCU software action. Interrupts are not generated until all
pending wake-up sources are read in the Interrupt Source
Register (ISR).
While in Stop mode, interrupts are used to signal wake-up
events. Sleep mode does not use interrupts, wake-up is
performed by powering-up the MCU. In Normal and Normal
Request mode the wake-up source can be read by the SPI.
The interrupts are signaled to the MCU by a low logic level
of the IRQ pin, which will remain low until the interrupt is
acknowledged by a SPI read. The IRQ pin will then be driven
high.
Interrupts are only asserted while in Normal, Normal
Request and Stop mode. Interrupts are not generated while
the RST pin is low.
Following is a list of the interrupt sources in Normal and
Normal Request modes, some of those can be masked by
writing to the SPI-Interrupt Mask Register (IMR).
The high-voltage interrupt signals when the supply line
(VS1) voltage increases above the VSOV threshold (VSOV).
Low-voltage Interrupt
The low-voltage interrupt signals when the supply line
(VS1) voltage drops below the VSUV threshold (VSUV).
Over-temperature Prewarning
Over-temperature prewarning signals when the 33911
temperature has reached the pre-shutdown warning
threshold. It is used to warn the MCU that an overtemperature shutdown in the main 5.0 V regulator is
imminent.
LIN Over-current Shutdown / Over-temperature
Shutdown / TXD Stuck At Dominant / RXD Short-Circuit
These signal fault conditions within the LIN interface will
cause the LIN driver to be disabled, except for the LIN overcurrent. In order to restart an operation, the fault must be
removed and must be acknowledged by reading the SPI.
The LINOC bit functionality in the LIN Status Register
(LINSR) is to indicate that an LIN over-current occurred and
the driver stays enabled.
High Side Over-temperature Shutdown
The high side over-temperature shutdown signals a
shutdown in the high side output.
Low Side Over-temperature Shutdown
The low side over-temperature shutdown signals a
shutdown in the low side outputs.
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Analog Integrated Circuit Device Data
Freescale Semiconductor
72
MC33911BAC / MC34911BAC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
RESET
To reset an MCU, the 33911 drives the RST pin low for the
time the reset condition lasts.
After the reset source has been removed, the state
machine will drive the RST output low for at least 1ms (typical
value) before driving it high.
In the 33911 four main reset sources exist:
5.0 V Regulator Low-voltage-Reset (VRSTTH)
The 5.0 V regulator output VDD is continuously monitored
against brown outs. If the supply monitor detects that the
voltage at the VDD pin has dropped below the reset threshold
VRSTTH the 33911 will issue a reset. In case of an overtemperature, the voltage regulator will be disabled and the
voltage monitoring will issue a VDDOT Flag independently of
the VDD voltage.
In order to select and activate direct wake-up from Lx
inputs, the Wake-up Control Register (WUCR) must be
configured with appropriate LxWE inputs enabled or
disabled. The wake-up inputs state are read through the
Wake-up Status Register (WUSR).
Lx inputs are also used to perform cyclic sense wake-up.
Note: Selecting an Lx input in the analog multiplexer
before entering low-power mode will disable the wake-up
capability of the Lx input.
Wake-up from Wake-up inputs (L1-L2) with cyclic sense
timer enabled
During Sleep mode, the 5.0 V regulator is not active.
Hence, all wake-up requests from Sleep mode require a
power-up/reset sequence.
The SBCLIN can wake-up at the end of a cyclic sense
period if on one of the two wake-up input lines (L1-L2), a state
change occurs. The HS1 switch is activated in Sleep or Stop
modes from an internal timer. Cyclic sense and force wakeup are exclusive. If cyclic sense is enabled, the force wakeup can not be enabled.
In order to select and activate the cyclic sense wake-up
from Lx inputs, before entering in low-power modes (Stop or
Sleep modes), the following SPI set-up has to be performed:
• In WUCR: select the Lx input to WU-enable.
• In HSCR: enable HS1.
• In TIMCR: select the CS/WD bit and determine the
cyclic sense period with CYSTx bits.
• Perform Go to Sleep/Stop command.
External Reset
Forced Wake-up
The 33911 has a bidirectional reset pin which drives the
device to a safe state (same as Reset mode) for as long as
this pin is held low. The RST pin must be held low long
enough to pass the internal glitch filter and get recognized by
the internal reset circuit. This functionality is also active in
Stop mode.
After the RST pin is released, there is no extra t RST to be
considered.
The 33911 can wake-up automatically after a
predetermined time spent in Sleep or Stop mode. Cyclic
sense and forced wake-up are exclusive. If forced wake-up is
enabled, the cyclic sense can not be enabled.
To determine the wake-up period, the following SPI set-up
has to be sent before entering in low-power modes:
• In TIMCR: select the CS/WD bit and determine the lowpower mode period with CYSTx bits.
• In HSCR: the HS1 bit must be disabled.
Window Watchdog Overflow
If the watchdog counter is not properly serviced while its
window is open, the 33911 will detect an MCU software runaway and will reset the microcontroller.
Wake-Up From Sleep Mode
WAKE-UP CAPABILITIES
Once entered into one of the low-power modes (Sleep or
Stop) only wake-up sources can bring the device into Normal
mode operation.
In Stop mode, a wake-up is signaled to the MCU as an
interrupt, while in Sleep mode, the wake-up is performed by
activating the 5.0 V regulator and resetting the MCU. In both
cases, the MCU can detect the wake-up source by accessing
the SPI registers. There is no specific SPI register bit to signal
a CS wake-up or external reset. If necessary, this condition is
detected by excluding all other possible wake-up sources.
Wake-up from Wake-up inputs (L1-L2) with cyclic sense
disabled
CS Wake-up
While in Stop mode, a rising edge on the CS will cause a
wake-up. The CS wake-up does not generate an interrupt
and is not reported on the SPI.
LIN Wake-up
While in the low-power mode the 33911 monitors the
activity on the LIN bus. A dominant pulse larger than t PROPWL
followed by a dominant to recessive transition will cause a
LIN wake-up. This behavior protects the system from a shortto ground bus condition.
The wake-up lines are dedicated to sense state changes
of external switches, and wake-up the MCU (in Sleep or Stop
mode).
33911
73
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911BAC / MC34911BAC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
RST Wake-up
While in Stop mode, the 33911 can wake-up when the
RST pin is held low long enough to pass the internal glitch
filter. Then, it will change to Normal Request or Normal
modes depending on the WDCONF pin configuration. The
RST wake-up does not generate an interrupt and is not
reported via the SPI.
From Stop mode, the following wake-up events can be
configured:
• Wake-up from Lx inputs without cyclic sense
• Cyclic sense wake-up inputs
• Force wake-up
• CS wake-up
• LIN wake-up
• RST wake-up
From Sleep mode, the following wake-up events can be
configured:
• Wake-up from Lx inputs without cyclic sense
• Cyclic sense wake-up inputs
• Force wake-up
• LIN wake-up
WINDOW WATCHDOG
The 33911 includes a configurable window watchdog
which is active in Normal mode. The watchdog can be
configured by an external resistor connected to the WDCONF
pin. The resistor is used to achieve higher precision in the
timebase used for the watchdog.
SPI clears are performed by writing through the SPI in the
MOD bits of the Mode Control Register (MCR).
During the first half of the SPI timeout, watchdog clears are
not allowed, but after the first half of the SPI timeout window,
the clear operation opens. If a clear operation is performed
outside the window, the 33911 will reset the MCU, in the
same way as when the watchdog overflows.
WINDOW CLOSED
NO WATCHDOG CLEAR
ALLOWED
WD TIMING X 50%
WINDOW OPEN
FOR WATCHDOG
CLEAR
WD TIMING X 50%
WD PERIOD (tPWD)
WD TIMING SELECTED BY REGISTER
ON WDCONF PIN
Figure 39. Window Watchdog Operation
To disable the watchdog function in Normal mode, the
user must connect the WDCONF pin to ground. This
measure effectively disables Normal Request mode. The
WDOFF bit in the Watchdog Status Register (WDSR) will be
set. This condition is only detected during Reset mode.
If neither a resistor nor a connection to ground is detected,
the watchdog falls back to the internal lower precision
timebase of 150 ms (typ.) and signals the faulty condition
through the WDSR.
The watchdog timebase can be further divided by a
prescaler which can be configured by the Timing Control
Register (TIMCR). During Normal Request mode, the
window watchdog is not active but there is a 150 ms (typ.)
timeout for leaving the Normal Request mode. In case of a
timeout, the 33911 will enter into Reset mode, resetting the
microcontroller before entering again into Normal Request
mode.
HIGH SIDE OUTPUT PIN HS1
This output is one high side driver intended to drive small
resistive loads or LEDs incorporating the following features:
• PWM capability (software maskable)
• Open-load detection
• Current limitation
• Over-temperature shutdown (with maskable interrupt)
• High-voltage shutdown (software maskable)
• Cyclic sense
The high side switch is controlled by the HS1 bit in the High
Side Control Register (HSCR).
PWM Capability (direct access)
The high side driver offers additional (to the SPI control)
direct control via the PWMIN pin.
If the HS1 bit and PWMHS1 is set in the HSCR, then the
HS1 driver is turned on if the PWMIN pin is high, and turned
off if the PWMIN pin is low.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
74
MC33911BAC / MC34911BAC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
Interrupt
Control
Module
MOD1:2
HS1
HS1OP
VDD
VDD
PWMIN
High-Side Interrupt
High Voltage Shutdown
HVSE
PWMHS1
VS2
on/off
Control
Status
HS1CL
High Side - Driver
charge pump
open load detection
current limitation
overtemperture shutdown (interrupt maskable)
high voltage shutdown (maskable)
Cyclic Sense
HS1
Wakeup
Module
Figure 40. High Side Driver HS1
Open Load Detection
The high side driver signals an open-load condition if the
current through the high side is below the open-load current
threshold.
The open-load condition is indicated with the HS1OP bits
in the High Side Status Register (HSSR).
Current Limitation
The high side driver has an output current limitation. In
combination with the over-temperature shutdown, the high
side driver is protected against over-current and short-circuit
failures.
When the driver operates in the current limitation area, it is
indicated with the bit HS1CL in the HSSR.
Note: If the driver is operating in current limitation mode
excessive power might be dissipated.
Module. The shutdown is indicated as an HS Interrupt in the
Interrupt Source Register (ISR).
A thermal shutdown of the high side driver is indicated by
setting the HS1OP and HS1CL bits simultaneously.
If the bit HSM is set in the Interrupt Mask Register (IMR)
than an interrupt (IRQ) is generated.
A write to the High Side Control Register (HSCR), when
the over-temperature condition is gone, will re-enable the
high side driver.
High-voltage Shutdown
In case of a high-voltage condition, and if the high-voltage
shutdown is enabled (bit HVSE in the Mode Control Register
(MCR) is set), the high side driver is shut down.
A write to the HSCR, when the high-voltage condition is
gone, will re-enable the high side driver.
Over-temperature Protection (HS Interrupt)
Sleep And Stop Mode
The high side driver is protected against over-temperature.
In case of an over-temperature condition, the high side driver
is shut down and the event is latched in the Interrupt Control
The high side driver can be enabled to operate in Sleep
and Stop mode for cyclic sensing. Also see Table 37,
Operating Modes Overview.
33911
75
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911BAC / MC34911BAC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
LOW SIDE OUTPUT PINS LS1 AND LS2
These outputs are two low side drivers intended to drive
relays incorporating the following features:
• PWM capability (software maskable)
• Open load detection
• Current limitation
• Over-temperature shutdown (with maskable interrupt)
• Active clamp (for driving relays)
• High-voltage shutdown (software maskable)
The low side switches are controlled by the bit LS1:2 in the
Low Side Control Register (LSCR).
HVSE
To protect the device against over-voltage when an
inductive load (relay) is turned off, an active clamp will reenable the low side FET if the voltage on the LS1 or LS2 pin
exceeds a certain level.
PWM Capability (direct access)
Each low side driver offers additional (to the SPI control)
direct control via the PWMIN pin.
If both the LS1 and PWMLS1 bits are set in the LSCR, then
the LS1 driver is turned on if the PWMIN pin is high, and
turned off if the PWMIN pin is low. The same applies to the
LS2 and PWMLS2 bits for the LS2 driver.
VDD
Interrupt
Control
Module
VDD
MOD1:2
LSx
LSxOP
PWMLSx
Low Side Interrupt
High-voltage Shutdown
PWMIN
active
clamp
LSx
on/off
Control
LSxCL
Status
Low Side - Driver
(active clamp)
Open-load Detection
Current Limitation
Over-temperture Shutdown (interrupt maskable)
High-voltage Shutdown (maskable)
PGND
Figure 41. Low Side Drivers LS1 and LS2
Open Load Detection
Each low side driver signals an open-load condition if the
current through the low side is below the open-load current
threshold.
The open-load condition is indicated with the bit LS1OP
and LS2OP in the Low Side Status Register (LSSR).
Current Limitation
Each low side driver has a current limitation. In
combination with the over-temperature shutdown, the low
side drivers are protected against over-current and shortcircuit failures.
When the drivers operate in current limitation, this is
indicated with the LS1CL and LS2CL bits in the LSSR.
Note: If the drivers are operating in current limitation mode
excessive power might be dissipated.
Over-temperature Protection (LS Interrupt)
Both low side drivers are protected against overtemperature. In case of an over-temperature condition both
low side drivers are shut down and the event is latched in the
Interrupt Control Module. The shutdown is indicated as an LS
Interrupt in the Interrupt Source Register (ISR).
If the bit LSM is set in the Interrupt Mask Register (IMR),
then an Interrupt (IRQ) is generated.
A write to the Low Side Control Register (LSCR), when the
over-temperature condition is gone, will re-enable the low
side drivers.
High-voltage Shutdown
In case of a high voltage condition, and if the high-voltage
shutdown is enabed (bit HVSE in the Mode Control Register
(MCR) is set), both low side drivers are shut down.
A write to the LSCR, when the high-voltage condition is
gone, will re-enable the low side drivers.
Sleep And Stop Mode
The low side drivers are disabled in Sleep and Stop mode.
Also see Table 37, Operating Modes Overview.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
76
MC33911BAC / MC34911BAC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
LIN PHYSICAL LAYER
The LIN bus pin provides a physical layer for single-wire
communication in automotive applications. The LIN physical
layer is designed to meet the LIN physical layer specification
and has the following features:
• LIN physical layer 2.0 compliant
• Slew rate selection
• Over-current shutdown
• Over-temperature shutdown
• LIN pull-up disable in Stop and Sleep modes
• Advanced diagnostics
• LIN dominant voltage level selection
The LIN driver is a low side MOSFET with over-current
and thermal shutdown. An internal pull-up resistor with a
serial diode structure is integrated, so no external pull-up
components are required for the application in a slave node.
The fall time from dominant to recessive and the rise time
from recessive to dominant is controlled. The symmetry
between both slopes is guaranteed.
LIN Pin
The LIN pin offers a high susceptibility immunity level from
external disturbance, guaranteeing communication.
INTERRUPT
CONTROL
MODULE
High-voltage
Shutdown
High Side
Interrupt
WAKE-UP
MODULE
LIN
Wake-up
MOD1:2
LSR0:1
VS1
LINPE
LIN – DRIVER
LDVS
RXONLY
RXSHORT
Slope and Slew Rate Control
Over-current Shutdown (interrupt maskable)
Over-temperature Shutdown (interrupt maskable)
TXDOM
LINOT
LINOC
30K
LIN
TXD
SLOPE
CONTROL
WAKE-UP
FILTER
LGND
RXD
RECEIVER
Figure 42. LIN Interface
Slew Rate Selection
The slew rate can be selected for optimized operation at
10.4 and 20 kBit/s as well as a fast baud rate for test and
programming. The slew rate can be adapted with the LSR1:0
bits in the LIN Control Register (LINCR). The initial slew rate
is optimized for 20 kBit/s.
LIN pin can be disconnected by clearing the LINPE bit in the
Mode Control Register (MCR). The bit LINPE also changes
the Bus wake-up threshold (VBUSWU).
This feature will reduce the current consumption in STOP
and SLEEP modes. It also improves performance and safe
operation.
LIN Pull-up Disable In Stop And Sleep Modes
Current Limit (LIN Interrupt)
In case of a LIN bus short to GND or LIN bus leakage
during low-power mode, the internal pull-up resistor on the
The output low side FET is protected against over-current
conditions. If an over-current condition occurs (e.g. LIN bus
33911
77
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911BAC / MC34911BAC
FUNCTIONAL DEVICE OPERATIONS
OPERATIONAL MODES
short to VBAT), the transmitter will not be shut down. The bit
LINOC in the LIN Status Register (LINSR) is set.
If the LINM bit is set in the Interrupt Mask Register (IMR)
an Interrupt IRQ will be generated.
The transmitter is automatically re-enabled once TXD is
high.
A read of the LINSR with the TXD pin is high will clear the
bit TXDOM.
Over-temperature Shutdown (LIN Interrupt)
LIN Dominant Voltage Level Selection
The output low side FET is protected against overtemperature conditions. If an over-temperature condition
occurs, the transmitter will be shut down and the LINOT bit in
the LINSR is set.
If the LINM bit is set in the IMR an Interrupt IRQ will be
generated.
The transmitter is automatically re-enabled once the
condition is gone and TXD is high.
A read of the LINSR with the TXD pin high will re-enable
the transmitter.
The LIN dominant voltage level can be selected by the
LDVS bit in the LIN Control Register (LINCR).
RXD Short-circuit Detection (LIN Interrupt)
STOP Mode And Wake-up Feature
The LIN transceiver has a short-circuit detection for the
RXD output pin. In case of a short-circuit condition, either
5.0 V or Ground, the RXSHORT bit in the LINSR is set and
the transmitter is shutdown.
If the LINM bit is set in the IMR an Interrupt IRQ will be
generated.
The transmitter is automatically re-enabled once the
condition is gone (transition on RXD) and TXD is high.
A read of the LINSR without the RXD pin short-circuit
condition will clear the RXSHORT bit.
During Stop mode operation, the transmitter of the
physical layer is disabled. If the LIN-PU bit was set in the Stop
mode sequence, the internal pull-up resistor is disconnected
from VSUP and a small current source keeps the LIN pin in
the recessive state. The receiver is still active and able to
detect wake-up events on the LIN bus line.
A dominant level longer than tPROPWL followed by a rising
edge will generate a wake-up interrupt and will be reported in
the Interrupt Source Register (ISR). Also see Figure 34.
TXD Dominant Detection (LIN Interrupt)
The LIN transceiver monitors the TXD input pin to detect
stuck-in-dominant (0 V) condition. If a stuck condition occurs
(TXD pin 0V for more than 1 second (typ.), the transmitter is
shut down and the TXDOM bit in the LINSR is set.
If the bit LINM is set in the IMR an Interrupt IRQ will be
generated.
LIN Receiver Operation Only
While in Normal mode, the activation of the RXONLY bit
disables the LIN TXD driver. If a LIN error condition occurs,
this bit is automatically set. If a low-power mode is selected
with this bit set, the LIN wake-up functionality is disabled.
Then in STOP mode, the RXD pin will reflect the state of the
LIN bus.
SLEEP Mode And Wake-up Feature
During Sleep mode operation, the transmitter of the
physical layer is disabled. If the LIN-PU bit was set in the
Sleep mode sequence, the internal pull-up resistor is
disconnected from VSUP and a small current source keeps
the LIN pin in recessive state. The receiver must still active to
detect wake-up events on the LIN bus line.
A dominant level longer than tPROPWL followed by a rising
edge will generate a system wake-up (Reset), and will be
reported in the ISR. Also see Figure 33.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
78
MC33911BAC / MC34911BAC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
LOGIC COMMANDS AND REGISTERS
33911 SPI INTERFACE AND CONFIGURATION
• MISO — Master-In Slave-Out
• SCLK— Serial Clock
A complete data transfer via the SPI consists of 1 byte.
The master sends 4 bits of address (A3:A0) + 4 bits of control
information (C3:C0) and the slave replies with 4 system
status bits (VMS,LINS,HSS,LSS) + 4 bits of status
information (S3:S0).
The serial peripheral interface creates the communication
link between a microcontroller (master) and the 33911.
The interface consists of four pins (see Figure 43):
• CS — Chip Select
• MOSI — Master-Out Slave-In
CS
Register Write Data
MOSI
A3
A2
A1
A0
C3
C2
C1
C0
S1
S0
Register Read Data
MISO
VMS LINS HSS
LSS
S3
S2
SCLK
Read Data Latch
Rising Edge of SCLK
Change MISO/MISO Output
Write Data Latch
Falling Edge of SCLK
Sample MISO/MISO Input
Figure 43. SPI Protocol
During the inactive phase of the CS (HIGH), the new data
The rising edge of the Chip Select (CS) indicates the end
transfer is prepared.
of the transfer and latches the write data (MOSI) into the
register. The CS high forces MISO to the high-impedance
The falling edge of the CS indicates the start of a new data
state.
transfer and puts the MISO in the low-impedance state and
Register reset values are described along with the reset
latches the analog status data (Register read data).
condition.
Reset condition is the condition causing the bit to
With the rising edge of the SPI clock (SCLK), the data is
be set to its reset value. The main reset conditions are:
moved to MISO/MOSI pins. With the falling edge of the SPI
- Power-On Reset (POR): level at which the logic is reset
clock (SCLK), the data is sampled by the receiver.
and BATFAIL flag sets.
The data transfer is only valid if exactly 8 sample clock
- Reset mode
edges are present during the active (low) phase of CS.
- Reset done by the RST pin (ext_reset)
33911
79
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911BAC / MC34911BAC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
SPI REGISTER OVERVIEW
Table 38. System Status Register
Adress(A3:A0)
$0 - $F
BIT
Register Name / Read / Write Information
SYSSR - System Status Register
R
7
6
5
4
VMS
LINS
HSS
LSS
Table 39 summarizes the SPI Register content for Control Information (C3:C0)=W and status information (S3:S0) = R.
Table 39. SPI Register Overview
Adress(A3:A0)
BIT
Register Name / Read / Write Information
3
2
1
0
MCR - Mode Control Register
W
HVSE
LINPE
MOD2
MOD1
VSR - Voltage Status Register
R
VSOV
VSUV
VDDOT
BATFAIL
VSR - Voltage Status Register
R
VSOV
VSUV
VDDOT
BATFAIL
WUCR - Wake-up Control Register
W
-
-
L2WE
L1WE
WUSR - Wake-up Status Register
R
-
-
L2
L1
WUSR - Wake-up Status Register
R
-
-
L2
L1
LINCR - LIN Control Register
W
LDVS
RXONLY
LSR1
LSR0
LINSR - LIN Status Register
R
RXSHORT
TXDOM
LINOT
LINOC
LINSR - LIN Status Register
R
RXSHORT
TXDOM
LINOT
LINOC
HSCR - High Side Control Register
W
-
PWMHS1
-
HS1
HSSR - High Side Status Register
R
-
-
HS1OP
HS1CL
HSSR - High Side Status Register
R
-
-
HS1OP
HS1CL
LSCR - Low Side Control Register
W
PWMLS2
PWMLS1
LS2
LS1
LSSR - Low Side Status Register
R
LS2OP
LS2CL
LS1OP
LS1CL
LSSR - Low Side Status Register
R
LS2OP
LS2CL
LS1OP
LS1CL
TIMCR - Timing Control Register
W
CS/WD
WD2
WD1
WD0
CYST2
CYST1
CYST0
WDSR - Watchdog Status Register
R
WDTO
WDERR
WDOFF
WDWO
$B
WDSR - Watchdog Status Register
R
WDTO
WDERR
WDOFF
WDWO
$C
AMUXCR - Analog Multiplexer Control Register
W
LXDS
MX2
MX1
MX0
$D
CFR - Configuration Register
W
-
CYSX8
-
-
IMR - Interrupt Mask Register
W
HSM
LSM
LINM
VMM
ISR - Interrupt Source Register
R
ISR3
ISR2
ISR1
ISR0
ISR - Interrupt Source Register
R
ISR3
ISR2
ISR1
ISR0
$0
$1
$2
$3
$4
$5
$6
$7
$8
$9
$A
$E
$F
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
80
MC33911BAC / MC34911BAC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
REGISTER DEFINITIONS
System Status Register - SYSSR
HS1CL
The System Status Register (SYSSR) is always
transferred with every SPI transmission and gives a quick
system status overview. It summarizes the status of the
Voltage Status Register (VSR), LIN Status Register (LINSR),
High Side Status Register (HSSR), and the Low Side Status
Register (LSSR).
HSS
HS1OP
Figure 46. High Side Status
LSS - Low Side Switch Status
Table 40. System Status Register
Read
S7
S6
S5
S4
VMS
LINS
HSS
LSS
This read-only bit indicates that one or more bits in the
LSSR are set.
1 = Low Side Status bit set
0 = None
VMS - Voltage Monitor Status
This read-only bit indicates that one or more bits in the
VSR are set.
LS1CL
LS1OP
1 = Voltage Monitor bit set
0 = None
LS2OP
Figure 47. Low Side Status
BATFAIL
VDDOT
VSUV
VMS
Mode Control Register - MCR
The Mode Control Register (MCR) allows to switch
between the operation modes and to configure the 33911.
Writing the MCR will return the VSR.
VSOV
Figure 44. Voltage Monitor Status
Table 41. Mode Control Register - $0
LINS - LIN Status
This read-only bit indicates that one or more bits in the
LINSR are set.
1 = LIN Status bit set
0 = None
TXDOM
C3
C2
C1
C0
Write
HVSE
LINPE
MOD2
MOD1
Reset Value
1
1
-
-
Reset Condition
POR
POR
-
-
HVSE - High-Voltage Shutdown Enable
LINOC
LINOT
LSS
LS2CL
LINS
RXSHORT
Figure 45. LIN Status
HSS - High Side Switch Status
This read-only bit indicates that one or more bits in the
HSSR are set.
1 = High Side Status bit set
0 = None
This write-only bit enables/disables automatic shutdown of
the high side and the low side drivers during a high-voltage
VSOV condition.
1 = automatic shutdown enabled
0 = automatic shutdown disabled
LINPE - LIN pull-up enable.
This write-only bit enables/disables the 30 kΩ LIN pull-up
resistor in STOP and SLEEP modes. This bit also controls
the LIN bus wake-up threshold.
1 = LIN pull-up resistor enabled
0 = LIN pull-up resistor disabled
33911
81
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911BAC / MC34911BAC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
MOD2, MOD1 - Mode Control Bits
These write-only bits select the operating mode and allow
to clear the watchdog in accordance with Table 42, Mode
Control Bits.
Any access to the MCR or Voltage Status Register (VSR)
will clear the BATFAIL flag.
1 = POR Reset has occurred
0 = POR Reset has not occurred
Table 42. Mode Control Bits
Wake-up Control Register - WUCR
MOD2
MOD1
Description
0
0
Normal Mode
0
1
Stop Mode
1
0
Sleep Mode
1
1
Normal Mode + watchdog Clear
This register is used to control the digital wake-up inputs.
Writing the Wake-up Control Register (WUCR) will return the
Wake-up Status Register (WUSR).
Table 44. Wake-up Control Register - $2
C3
C2
C1
C0
Write
0
0
L2WE
L1WE
Reset
Value
1
1
1
1
Voltage Status Register - VSR
Returns the status of the several voltage monitors. This
register is also returned when writing to the Mode Control
Register (MCR).
Table 43. Voltage Status Register - $0/$1
Read
S3
S2
S1
S0
VSOV
VSUV
VDDOT
BATFAIL
VSOV - VSUP Over-voltage
This read-only bit indicates an over-voltage condition on
the VS1 pin.
1 = Over-voltage condition.
0 = Normal condition.
Reset Condition
POR, Reset mode or ext_reset
LxWE - Wake-up Input x Enable
This write-only bit enables/disables which Lx inputs are
enabled. In Stop and Sleep mode the LxWE bit determines
which wake inputs are active for wake-up. If one of the Lx
inputs is selected on the analog multiplexer, the
corresponding LxWE is masked to 0.
1 = Wake-up Input x enabled.
0 = Wake-up Input x disabled.
VSUV - VSUP Under-voltage
Wake-up Status Register - WUSR
This read-only bit indicates an under-voltage condition on
the VS1 pin.
1 = Under-voltage condition.
0 = Normal condition.
This register is used to monitor the digital wake-up inputs
and is also returned when writing to the WUCR.
VDDOT - Main Voltage Regulator Over-temperature
Warning
This read-only bit indicates that the main voltage regulator
temperature reached the Over-temperature Prewarning
Threshold.
1 = Over-temperature Prewarning
0 = Normal
BATFAIL - Battery Fail Flag.
This read-only bit is set during power-up and indicates that
the 33911 had a Power On Reset (POR).
Table 45. Wake-Up Status Register - $2/$3
Read
S3
S2
S1
S0
-
-
L2
L1
Lx - Wake-up input x
This read-only bit indicates the status of the corresponding
Lx input. If the Lx input is not enabled then the according
Wake-Up status will return 0.
After a wake-up form Stop or Sleep mode these bits also
allow to determine which input has caused the wake-up, by
first reading the Interrupt Status Register (ISR) and then
reading the WUSR.
1 = Lx Wake-up.
0 = Lx Wake-up disabled or selected as analog input.
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
82
MC33911BAC / MC34911BAC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
LIN Control Register - LINCR
LIN Status Register - LINSR
This register controls the LIN physical interface block.
Writing the LIN Control Register (LINCR) returns the LIN
Status Register (LINSR).
This register returns the status of the LIN physical
interface block and is also returned when writing to the LIN
Control Register (LINCR).
Table 46. LIN Control Register - $4
Table 48. LIN Status Register - $4/$5
C3
C2
C1
C0
Write
LDVS
RXONLY
LSR1
LSR0
Reset
Value
0
0
0
0
Reset
Condition
POR, Reset
mode or
ext_reset
POR, Reset mode,
ext_reset or LIN
failure gone*
POR
* LIN failure gone: if LIN failure (overtemp, TxD/RxD short) was set, the flag
resets automatically when the failure is gone.
LDVS - LIN Dominant Voltage Select
This write-only bit controls the LIN Dominant voltage:
1 = LIN Dominant Voltage = VLIN_DOM_1 (1.7 V typ)
0 = LIN Dominant Voltage = VLIN_DOM_0 (1.1 V typ)
RXONLY - LIN Receiver Operation Only.
This write-only bit controls the behavior of the LIN
transmitter.
In Normal mode the activation of the RXONLY bit disables
the LIN transmitter. In case of a LIN error condition this bit is
automatically set.
In Stop mode this bit disables the LIN wake-up
functionality and the RXD pin will reflect the state of the LIN
bus.
1 = only LIN receiver active (Normal mode) or LIN wakeup disabled (Stop mode).
0 = LIN fully enabled.
LSRx - LIN Slew-rate
This write-only bit controls the LIN driver slew-rate in
accordance with Table 47.
Table 47. LIN Slew-rate Control
LSR1
LSR0
Description
0
0
Normal Slew-Rate (up to 20 kb/s)
0
1
Slow Slew-Rate (up to 10 kb/s)
1
0
Fast Slew-Rate (up to 100 kb/s)
1
1
Reserved
Read
S3
S2
S1
S0
RXSHORT
TXDOM
LINOT
LINOC
RXSHORT - RXD Short-circuit
This read-only bit indicates a short-circuit condition on
RXD (shorted either to 5.0V or to Ground). The short-circuit
delay must be 8µs worst case to be detected and to shutdown
the driver. To clear this bit, it must be read after the condition
is gone (transition detected on RXD). The LIN driver is
automatically re-enabled once the condition is gone.
1 = RxD short-circuit condition.
0 = None.
TXDOM - TXD Permanent Dominant
This read-only bit signals the detection of a TXD pin stuck
at dominant (Ground) condition and the resultant shutdown in
the LIN transmitter. This condition is detected after the TXD
pin remains in dominant state for more than 1 second typical
value.
To clear this bit, it must be read after TXD has gone high.
The LIN driver is automatically re-enabled once TXD goes
high.
1 = TXD stuck at dominant fault detected.
0 = None.
LINOT - LIN Driver Over-temperature Shutdown
This read-only bit signals that the LIN transceiver was
shut-down due to over-temperature. The transmitter is
automatically re-enabled after the over-temperature
condition is gone and TXD is high. The LINOT bit is cleared
after SPI read once the condition is gone.
1 = LIN over-temperature shutdown
0 = None
LINOC - LIN Driver Over-current Shutdown
This read-only bit signals an over-current condition
occurred on the LIN pin. The LIN driver is not shut down but
an IRQ is generated. To clear this bit, it must be read after the
condition is gone.
1 = LIN over-current shutdown
0 = None
33911
83
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911BAC / MC34911BAC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
High Side Control Register - HSCR
Low Side Control Register - LSCR
This register controls the operation of the high side driver.
Writing to this register returns the High Side Status Register
(HSSR).
Table 49. High Side Control Register - $6
This register controls the operation of the low side drivers.
Writing the Low Side Control Register (LSCR) will also return
the Low Side Status Register (LSSR).
C3
C2
C1
C0
Write
0
PWMHS1
0
HS1
Reset
Value
0
0
0
0
Reset
Condition
POR, Reset mode, ext_reset, HS1
over-temp or (VSOV & HVSE)
POR
PWMHS1 - PWM Input Control Enable.
This write-only bit enables/disables the PWMIN input pin
to control the high side switch. The high side switch must be
enabled (HS1 bit).
1 = PWMIN input controls HS1 output.
0 = HS1 is controlled only by SPI.
HS1 - High Side Switch Control.
This write-only bit enables/disables the high side switch.
1 = HS1 switch on.
0 = HS1 switch off.
High Side Status Register - HSSR
This register returns the status of the high side switch and
is also returned when writing to the High Side Control
Register (HSCR).
Table 50. High Side Status Register - $6/$7
Read
S3
S2
S1
S0
-
-
HS1OP
HS1CL
High Side thermal shutdown
A thermal shutdown of the high side drivers is indicated by
setting the HS1OP and HS1CL bits simultaneously.
HS1OP - High Side Switch Open-Load Detection
This read-only bit signals that the high side switch is
conducting current below a certain threshold indicating
possible load disconnection.
1 = HS1 Open Load detected (or thermal shutdown)
0 = Normal
HS1CL - High Side Current Limitation
This read-only bit indicates that the high side switch is
operating in current limitation mode.
1 = HS1 in current limitation (or thermal shutdown)
0 = Normal
Table 51. Low Side Control Register - $8
C3
C2
C1
C0
Write
PWMLS2
PWMLS1
LS2
LS1
Reset
Value
0
0
0
0
Reset
Condition
POR, Reset mode, ext_reset, LSx
over-temp or (VSOV & HVSE)
POR
PWMLx - PWM input control enable.
This write-only bit enables/disables the PWMIN input pin
to control the respective low side switch. The corresponding
low side switch must be enabled (LSx bit).
1 = PWMIN input controls LSx.
0 = LSx is controlled only by SPI.
LSx - LSx switch control.
This write-only bit enables/disables the corresponding low
side switch.
1 = LSx switch on.
0 = LSx switch off.
Low Side Status Register - LSSR
This register returns the status of the low side switches
and is also returned when writing to the LSCR.
Table 52. Low Side Status Register - $8/$9
Read
C3
C2
C1
C0
LS2OP
LS2CL
LS1OP
LS1CL
Low Side thermal shutdown
A thermal shutdown of the low side drivers is indicated by
setting all LSxOP and LSxCL bits simultaneously.
LSxOP - Low Side Switch Open-Load Detection
This read-only bit signals that the low side switches are
conducting current below a certain threshold indicating
possible load disconnection.
1 = LSx Open-load detected (or thermal shutdown)
0 = Normal
LSxCL - Low Side Current Limitation
This read-only bit indicates that the respective low side
switch is operating in current limitation mode.
1 = LSx in current limitation (or thermal shutdown)
0 = Normal
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
84
MC33911BAC / MC34911BAC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
Timing Control Register - TIMCR
This register is a double purpose register which allows to
configure the watchdog and the cyclic sense periods. Writing
to the Timing Control Register (TIMCR) will also return the
Watchdog Status Register (WDSR).
Table 53. Timing Control Register - $A
Configuration Register (CFR) (see Configuration Register CFR).
This option is only active if the high side switch is enabled
when entering in Stop or Sleep mode. Otherwise a timed
wake-up is performed after the period shown in Table 55.
Table 55. Cyclic Sense Interval
CYSX8(127)
CYST2
CYST1
CYST0
Interval
X
0
0
0
No cyclic sense
0
0
0
1
20ms
0
0
1
0
40ms
0
0
1
1
60ms
0
1
0
0
80ms
0
1
0
1
100ms
0
1
1
0
120ms
0
1
1
1
140ms
1
0
0
1
160ms
1
0
1
0
320ms
1
0
1
1
480ms
1
1
0
0
640ms
1
1
0
1
800ms
WDx - Watchdog Prescaler
1
1
1
0
960ms
This write-only bits selects the divider for the watchdog
prescaler and therefore selects the watchdog period in
accordance with Table 54. This configuration is valid only if
windowing watchdog is active.
1
1
1
1
1120ms
C3
Write
C2
C1
C0
WD2
WD1
WD0
CYST2
CYST1
CYST0
0
0
0
CS/WD
Reset
Value
-
Reset
Condition
-
POR
CS/WD - Cyclic Sense or Watchdog prescaler select.
This write-only bit selects which prescaler is being written
to, the Cyclic Sense prescaler or the watchdog prescaler.
1 = Cyclic Sense Prescaler selected
0 = watchdog Prescaler select
Notes
127. bit CYSX8 is located in Configuration Register (CFR)
Watchdog Status Register - WDSR
Table 54. Watchdog Prescaler
WD2
WD1
WD0
Prescaler Divider
0
0
0
1
0
0
1
2
0
1
0
4
0
1
1
6
1
0
0
8
1
0
1
10
1
1
0
12
1
1
1
14
CYSTx - Cyclic Sense Period Prescaler Select
This write-only bits selects the interval for the wake-up
cyclic sensing together with the bit CYSX8 in the
This register returns the watchdog status information and
is also returned when writing to the TIMCR.
Table 56. Watchdog Status Register - $A/$B
Read
S3
S2
S1
S0
WDTO
WDERR
WDOFF
WDWO
WDTO - Watchdog Timeout
This read-only bit signals the last reset was caused by
either a watchdog timeout or by an attempt to clear the
watchdog within the window closed.
Any access to this register or the TIMCR will clear the
WDTO bit.
1 = Last reset caused by watchdog timeout
0 = None
33911
85
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911BAC / MC34911BAC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
WDERR - Watchdog Error
MXx - Analog Multiplexer Input Select
This read-only bit signals the detection of a missing
watchdog resistor. In this condition the watchdog is using the
internal, lower precision timebase. The Windowing function is
disabled.
1 = WDCONF pin resistor missing
0 = WDCONF pin resistor not floating
These write-only bits selects which analog input is
multiplexed to the ADOUT0 pin according to Table 58.
When disabled or when in Stop or Sleep mode, the output
buffer is not powered and the ADOUT0 output is left floating
to achieve lower current consumption.
WDOFF - Watchdog Off
This read-only bit signals that the watchdog pin connected
to Ground and therefore disabled. In this case watchdog
timeouts are disabled and the device automatically enters
Normal mode out of Reset. This might be necessary for
software debugging and for programming the Flash memory.
1 = Watchdog is disabled
0 = Watchdog is enabled
WDWO - Watchdog Window Open
This read-only bit signals when the watchdog window is
open for clears. The purpose of this bit is for testing. Should
be ignored in case WDERR is High.
1 = Watchdog window open
0 = Watchdog window closed
Table 58. Analog Multiplexer Channel Select
MX2
MX1
MX0
0
0
0
Disabled
0
0
1
Reserved
0
1
0
Die Temperature Sensor
0
1
1
VSENSE input
1
0
0
L1 input
1
0
1
L2 input
1
1
0
Reserved
1
1
1
Reserved
Configuration Register - CFR
This register controls the cyclic sense timing multiplier.
Table 59. Configuration Register - $D
C3
C2
C1
C0
Write
0
CYSX8
0
0
Reset
Value
0
0
0
0
Reset
Condition
POR, Reset
mode or
ext_reset
POR
POR
POR
Analog Multiplexer Control Register - MUXCR
This register controls the analog multiplexer and selects
the divider ration for the Lx input divider.
Table 57. Analog Multiplexer Control Register -$C
C3
C2
C1
C0
Write
LXDS
MX2
MX1
MX0
Reset
Value
1
0
0
0
Reset
Condition
POR
POR, Reset mode or ext_reset
LXDS - Lx Analog Input Divider Select
Meaning
CYSX8 - Cyclic Sense Timing x 8.
This write-only bit influences the cyclic sense period as
shown in Table 55.
1 = Multiplier enabled
0 = None
This write-only bit selects the resistor divider for the Lx
analog inputs. Voltage is internally clamped to VDD.
0 = Lx Analog divider: 1
1 = Lx Analog divider: 3.6 (typ.)
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
86
MC33911BAC / MC34911BAC
FUNCTIONAL DEVICE OPERATIONS
LOGIC COMMANDS AND REGISTERS
Interrupt Mask Register - IMR
LINM - LIN Interrupts Mask
This register allow to mask some of interrupt sources. The
respective flags within the Interrupt Source Register (ISR) will
continue to work but will not generate interrupts to the MCU.
The 5.0 V Regulator over-temperature prewarning interrupt
and Under Voltage (VSUV) interrupts can not be masked and
will always cause an interrupt.
This write-only bit enables/disables interrupts generated in
the LIN block.
1 = LIN Interrupts Enabled
0 = LIN Interrupts Disabled
VMM - Voltage Monitor Interrupt Mask
Writing to the Interrupt Mask Register (IMR) will return the
ISR.
This write-only bit enables/disables interrupts generated in
the Voltage Monitor block. The only maskable interrupt in the
Voltage Monitor Block is the VSUP over-voltage interrupt.
1 = Interrupts Enabled
0 = Interrupts Disabled
Table 60. Interrupt Mask Register - $E
C3
C2
C1
C0
Write
HSM
LSM
LINM
VMM
Reset
Value
1
1
1
1
Reset
Condition
Interrupt Source Register - ISR
This register allows the MCU to determine the source of
the last interrupt or wake-up respectively. A read of the
register acknowledges the interrupt and leads IRQ pin to
high, in case there are no other pending interrupts. If there
are pending interrupts, IRQ will be driven high for 10 µs and
then be driven low again.
This register is also returned when writing to the IMR.
POR
HSM - High Side Interrupt Mask
This write-only bit enables/disables interrupts generated in
the high side block.
1 = HS Interrupts Enabled
0 = HS Interrupts Disabled
Table 61. Interrupt Source Register - $E/$F
Read
LSM - Low Side Interrupt Mask
This write-only bit enables/disables interrupts generated in
the low side block.
1 = LS Interrupts Enabled
0 = LS Interrupts Disabled
S3
S2
S1
S0
ISR3
ISR2
ISR1
ISR0
ISRx - Interrupt Source Register
These read-only bits indicate the interrupt source following
Table 62. If no interrupt is pending than all bits are 0.
In case more than one interrupt is pending, than the
interrupt sources are handled sequentially multiplex.
Table 62. Interrupt Sources
Interrupt Source
ISR3 ISR2 ISR1 ISR0
none maskable
maskable
0
0
0
0
0
0
0
1
0
0
1
0
-
HS Interrupt (Over-temperature)
0
0
1
1
-
LS Interrupt (Over-temperature)
0
1
0
0
0
1
0
1
0
1
1
0
no interrupt
Priority
no interrupt
none
Lx Wake-up from Stop mode-
highest
LIN Interrupt (RXSHORT, TXDOM, LIN OT, LIN
OC) or LIN Wake-up
Voltage Monitor Interrupt
Voltage Monitor Interrupt
(Low-voltage and VDD over-temperature)
(High-voltage)
-
Forced Wake-up
lowest
33911
87
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
TYPICAL APPLICATION
LOGIC COMMANDS AND REGISTERS
TYPICAL APPLICATION
The 33911 can be configured in several applications. The figure below shows the 33911 in the typical Slave Node Application.
V BAT
VS2
VS1
D1
C2
C1
C4
Interrupt
Control Module
LVI, HVI, HTI, OCI
IRQ
C3
Internal
Bus
VDD
Voltage Regulator
AGND
VDD
IRQ
Reset
Control Module
LVR, HVR, HTR, WD,
RST
LS1
Low Side Control
Module
RST
TIMER
LS2
HB Type Relay
PGND
Window
Watchdog Module
PWMIN
R1
Motor Output
High Side Control
Module
HS1
MISO
MOSI
Chip Temp Sense Module
SCLK
Analog Multiplexer
SPI
&
CONTROL
SPI
CS
MCU
VSENSE
VBAT Sense Module
L1
Analog Input Module
A/D
ADOUT0
L2
R2
R3
Wake Up Module
Digital Input Module
RXD
LIN Physical Layer
SCI
LIN
LIN
TXD
WDCONF
LGND
AGND
PGND
C5
R4
Typical Component Values:
C1 = 47µF; C2 = C4 = 100nF; C3 = 10µF; C5 = 220pF
R1 = 10kΩ; R2 = R3 = 10kΩ; R4 = 20kΩ-200kΩ
Recommended Configuration of the not Connected Pins (NC):
Pin 15, 16, 20, 21 = GND
Pin 11, 30 = open (floating)
Pin 24 = open (floating) or VS2
Pin 28 = this pin is not internally connected and may be used for PCB routing
optimization.
33911
88
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
PACKAGING
PACKAGE DIMENSIONS
PACKAGING
PACKAGE DIMENSIONS
Important For the most current revision of the package, visit www.Freescale.com and select Documentation, then under
Available Documentation column select Packaging Information.
AC SUFFIX (PB-FREE)
32-PIN LQFP
98ASH70029A
REVISION D
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
89
MC33911G5AC/MC3433911G5AC
IMPORTANT FOR THE MOST CURRENT REVISION OF THE PACKAGE, VISIT WWW.FREESCALE.COM AND SELECT DOCUMENTA-
AC SUFFIX (PB-FREE)
32-PIN LQFP
98ASH70029A
REVISION D
33911
90
Analog Integrated Circuit Device Data
Freescale Semiconductor
MC33911G5AC/MC3433911G5AC
REVISION HISTORY
REVISION HISTORY
Revision
Date
Description of Changes
1.0
5/2007
•
Initial Release
2.0
9/2007
•
•
•
•
•
Several textual corrections
Page 11: “Analog Output offset Ratio” (LXDS=1) changed to “Analog Output offset” +/-22mV
Page 11: VSENSE Input Divider Ratio adjusted to 5,0/5,25/5,5
Page 12: Common mode input impedance corrected to 75kΩ
Page 13/15: LIN PHYSICAL LAYER parameters adjusted to final LIN specification release
3.0
9/2007
•
Revision number incremented at engineering request.
4.0
2/2008
•
Changed Functional Block Diagram on page 24.
5.0
11/2008
•
•
•
•
Datasheet updated according to the Pass1.2 silicon version electrical parameters
Add Maximum Rating on IBUS_NO_GND parameter
Added L1 and L2, Temperature Sense Analog Output Voltage per characterization(37), Internal Chip
Temperature Sense Gain per characterization at 3 temperatures(37) See Figure 16, Temperature Sense Gain,
VSENSE Input Divider Ratio (RATIOVSENSE=Vsense/Vadout0) per characterization(38), and VSENSE Output
Related Offset per characterization(38) parameters
Added Temperature Sense Gain section
Minor corrections to ESD Capability, (17), Cyclic Sense ON Time from Stop and Sleep Mode(47), Lin Bus Pin
(LIN), Serial Data Clock Pin (SCLK), Master Out Slave In Pin (MOSI), Master In Slave Out Pin (MISO), Low
Side Pins (LS1 and LS2), Digital/analog Pins (L1 and L2), Normal Request Mode, Sleep Mode, LIN Overtemperature Shutdown / TXD Stuck At Dominant / RXD Short-circuit:, Fault Detection Management Conditions,
Lin Physical Layer, LIN Interface, Over-temperature Shutdown (LIN Interrupt), LIN Receiver Operation Only,
SPI Protocol, Lx - Wake-up input x, LIN Control Register - LINCR, and RXSHORT - RXD Pin Short-circuit
Updated Freescale form and style
Added explanation for pins Not Connected (NC).
•
•
6.0
2/2009
•
7.0
3/2009
•
Changed VBAT_SHIFT and GND_SHIFT maximum from 10% to 11.5% for both parameters on page 14.
3/2010
•
Combined Complete Data sheet for Part Numbers MC33911BAC and MC34911BAC to the back of this data
sheet.
Changed ESD Voltage for Machine Model from ± 200 to ± 150
8.0
•
33911
Analog Integrated Circuit Device Data
Freescale Semiconductor
91
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MC33911
Rev. 8.0
3/2010