FREESCALE PPC5674FMVYA264

Freescale Semiconductor
Data Sheet: Advance Information
Document Number: MPC5674F
Rev. 6, 2/2011
MPC5674F
MPC5674F Microcontroller
Data Sheet
Covers: MPC5674F and MPC5673F
Features:
• Dual issue, 32-bit CPU core complex (e200z7)
– Compliant with the Power Architecture embedded
category
– 16 KB I-Cache and 16 KB D-Cache
– Includes an instruction set enhancement allowing
variable length encoding (VLE), optional encoding of
mixed 16-bit and 32-bit instructions, for code size
footprint reduction
– Includes signal processing extension (SPE2) instruction
support for digital signal processing (DSP) and
single-precision floating point operations
• 4 MB on-chip flash
– Supports read during program and erase operations, and
multiple blocks allowing EEPROM emulation
• 256 KB on-chip general-purpose SRAM including 32 KB
of standby RAM
• Two direct memory access controller (eDMA2) blocks
– One supporting 64 channels
– One supporting 32 channels
• Interrupt controller (INTC)
• Frequency modulated phase-locked loop (FMPLL)
• Crossbar switch architecture for concurrent access to
peripherals, flash, or RAM from multiple bus masters
• External bus interface (EBI) for calibration and application
development (not available on all packages)
• System integration unit (SIU)
• Error correction status module (ECSM)
• Boot assist module (BAM) supports serial bootload via
CAN or SCI
• Two second-generation enhanced time processor units
(eTPU2) that share code and data RAM.
– 32 standard channels per eTPU2
– 24 KB code RAM
– 6 KB parameter (data) RAM
© Freescale Semiconductor, Inc., 2008-2011. All rights reserved.
TEPBGA–416
27mm x 27mm
Known Good Die
(KGD)
TEPBGA–516
27mm x 27mm
TEPBGA–324
23mm x 23mm
• Enhanced modular input output system supporting 32
unified channels (eMIOS) with each channel capable of
single action, double action, pulse width modulation
(PWM) and modulus counter operation
• Four enhanced queued analog-to-digital converters
(eQADC)
– Support for 64 analog channels
– Includes one absolute reference ADC channel
– Includes eight decimation filters
• Four deserial serial peripheral interface (DSPI) modules
• Three enhanced serial communication interface (eSCI)
modules
• Four controller area network (FlexCAN) modules
• Dual-channel FlexRay controller
• Nexus development interface (NDI) per IEEE-ISTO
5001-2003/5001-2008 standard
• Device and board test support per Joint Test Action Group
(JTAG) (IEEE 1149.1)
• On-chip voltage regulator controller regulates supply
voltage down to 1.2 V for core logic
Table of Contents
1
2
3
4
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.1 Orderable Parts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
1.2 MPC567xF Family Differences . . . . . . . . . . . . . . . . . . . .4
MPC5674F Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
2.1 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
3.1 324-ball TEPBGA Pin Assignments . . . . . . . . . . . . . . . .6
3.2 416-ball TEPBGA Pin Assignments . . . . . . . . . . . . . . . .9
3.3 516-ball TEPBGA Pin Assignments . . . . . . . . . . . . . . .14
3.4 SignalProperties and Muxing . . . . . . . . . . . . . . . . . . . .19
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
4.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
4.2 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .21
4.2.1 General Notes for Specifications at Maximum
Junction Temperature . . . . . . . . . . . . . . . . . . . .23
4.3 EMI (Electromagnetic Interference) Characteristics . . .24
4.4 ESD Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .26
4.5 PMC/POR/LVI Electrical Specifications . . . . . . . . . . . .26
4.6 Power Up/Down Sequencing . . . . . . . . . . . . . . . . . . . .29
4.6.1 Power-Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
4.6.2 Power-Down . . . . . . . . . . . . . . . . . . . . . . . . . . .30
4.6.3 Power Sequencing and POR Dependent on
VDDA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
4.7 DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . .31
4.7.1 I/O Pad Current Specifications . . . . . . . . . . . . .34
4.7.2 I/O Pad VDD33 Current Specifications . . . . . . . .34
4.7.3 LVDS Pad Specifications . . . . . . . . . . . . . . . . . 36
Oscillator and FMPLL Electrical Characteristics . . . . . 36
eQADC Electrical Characteristics . . . . . . . . . . . . . . . . 39
4.9.1 ADC Internal Resource Measurements . . . . . . 40
4.10 C90 Flash Memory Electrical Characteristics . . . . . . . 41
4.11 AC Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
4.11.1 Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
4.11.2 Pad AC Specifications . . . . . . . . . . . . . . . . . . . 45
4.12 AC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
4.12.1 Generic Timing Diagrams . . . . . . . . . . . . . . . . 46
4.12.2 Reset and Configuration Pin Timing. . . . . . . . . 47
4.12.3 IEEE 1149.1 Interface Timing . . . . . . . . . . . . . 48
4.12.4 Nexus Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 51
4.12.5 External Bus Interface (EBI) Timing . . . . . . . . . 54
4.12.6 External Interrupt Timing (IRQ Pin) . . . . . . . . . 58
4.12.7 eTPU Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 58
4.12.8 eMIOS Timing . . . . . . . . . . . . . . . . . . . . . . . . . 59
4.12.9 DSPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
5 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
5.1 324-Pin Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
5.2 416-Pin Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69
5.3 516-Pin Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
6 Product Documentation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
Appendix ASignal Properties and Muxing . . . . . . . . . . . . . . . . . . 74
Appendix BRevision History . . . . . . . . . . . . . . . . . . . . . . . . . . . 128
4.8
4.9
MPC5674F Microcontroller Data Sheet, Rev. 6
2
Freescale Semiconductor
Ordering Information
1
Ordering Information
1.1
Orderable Parts
Figure 1 and Table 1 describe and list the orderable part numbers for the MPC5674F.
M PC 5674F M VR
A
264 R
Qualification status
Core code
Note: Not all options are
available on all
devices. Refer to
Table 1.
Device number
Temperature range
Package identifier
Revision of Silicon
Operating frequency (MHz)
Tape and reel status
Temperature Range
M = –40 °C to 125 °C
Package Identifier
VZ = 324 BGA Pb-free
VR = 416 BGA Pb-free
VY = 516 BGA Pb-free
VV = 516 BGA SnPb
Qualification Status
P = Pre qualification
M = Fully spec. qualified, general market flow
S = Fully spec. qualified, automotive flow
Operating Frequency
150 = 150 MHz
200 = 200 MHz
264 = 264 MHz
Tape and Reel Status
R = Tape and reel
(blank) = Trays
Revision of Silicon
(blank) = Rev 1
A = Rev 2
(MPC and SPC part numbers will not have this field)
Figure 1. MPC5674F Orderable Part Number Description
Table 1. Orderable Part Numbers1
Freescale Part Number2
Speed (MHz)3
Package Description
Operating Temperature4
Nominal
Max5 (fMAX)
Min (TL)
Max (TH)
PPC5674FMVRA264
416 package, Pb-free
264
270
–40 °C
125 °C
PPC5674FMVVA264
516 package, SnPb
264
270
–40 °C
125 °C
PPC5674FMVYA264
516 package, Pb-free
264
270
–40 °C
125 °C
PPC5674FMVZA264
324 package, Pb-free
200
200
–40 °C
125 °C
1
2
3
4
5
This table includes part numbers for sample parts. Refer to the product summary page on http://www.freescale.com for
production part numbers.
All packaged devices are PPC5674F, rather than MPC5674F or SPC5674F, until product qualifications are complete. The
unpackaged device prefix is PCC, rather than SCC, until product qualification is complete.
Not all configurations are available in the PPC parts.
For the operating mode frequency of various blocks on the device, see Table 28.
The lowest ambient operating temperature is referenced by TL; the highest ambient operating temperature is referenced by TH.
Speed is the nominal maximum frequency. Max speed is the maximum speed allowed including frequency modulation (FM).
270 MHz parts allow for 264 MHz system clock + 2% FM.
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
3
Ordering Information
1.2
MPC567xF Family Differences
Table 2 lists the differences between the MPC567xF devices. Refer to the MPC5674F Reference Manual for a full feature list
and comparison.
Table 2. MPC567xF Family Differences
Feature
Package
Flash
SRAM
External bus
Serial
eSCI_A
eSCI_B
eSCI_C
SPI
DSPI_A
DSPI_B
DSPI_C
DSPI_D
eMIOS
eTPU2
eTPU_A
eTPU_B
ADC
eQADC_A
eQADC_B
1
MPC5674F
416 BGA
516 BGA
4 MB
256 KB
Yes
(516 BGA only)
3
Yes
Yes
Yes
4
Yes
Yes
Yes
Yes
32 channel
64 channel
Yes (32 ch)
Yes (32 ch)
64 channel
Yes (64 ch)1
MPC5674F
324 BGA
4 MB
256 KB
No
2
Yes
Yes
No
3
No
Yes
Yes
Yes
22 channel
47 channel
Yes (26 ch)
Yes (21 ch, no
TCRCLK)
48 channel
Yes (24 ch)
Yes (24 ch)
MPC5673F
416 BGA
516 BGA
3 MB
192 KB
Yes
(516 BGA only)
3
Yes
Yes
Yes
4
Yes
Yes
Yes
Yes
32 channel
64 channel
Yes
Yes
64 channel
Yes (64 ch)1
MPC5673F
324 BGA
3 MB
192 KB
No
2
Yes
Yes
No
3
No
Yes
Yes
Yes
22 channel
47 channel
Yes (26 ch)
Yes (21 ch, no
TCRCLK)
48 channel
Yes (24 ch)
Yes (24 ch)
There are are two pairs of 24 channels plus 16 shared channels. This gives 64 channels total: 40 per
ADC (since 16 are shared).
MPC5674F Microcontroller Data Sheet, Rev. 6
4
Freescale Semiconductor
MPC5674F Blocks
2
MPC5674F Blocks
2.1
Block Diagram
Figure 2 shows a top-level block diagram of the MPC5674F device.
Power™
e200z7 Core
MPC5674F
SPE2
Interrupt
Controller
Nexus
VLE
JTAG
MMU
eDMA2
64 Channel
eDMA2
32 Channel
16K
I-Cache
16K
D-Cache
FlexRay
EBI
(Calibration
&
Development
Use)
Crossbar Switch
MPU
ECSM
ADCi
ADC
ADCi
ADC
eQADC eQADC
ADC
DECFILx8
FlexCAN
FlexCAN
I/O
Bridge
FlexCAN
FlexCAN
DSPI
DSPI
DSPI
DSPI
Boot Assist
Module
ADC
24KB
Code
RAM
eTPU2
32
Channel
eSCI
eTPU2
32
Channel
6KB
Data
RAM
256KB SRAM
(32K S/B)
SIU
eSCI
eMIOS
32
Channel
I/O
Bridge
eSCI
4MB
Flash
AMux
LEGEND
ADC
ADCi
AMux
DECFIL
DSPI
EBI
ECSM
eDMA2
eMIOS
eQADC
– Analog to digital convertor
– ADC interface
– Analog multiplexer
– Decimation filter
– Deserial/serial peripheral interface
– External bus interface
– Error correction status module
– Enhanced direct memory access
– Enhanced modular I/O system
– Enhanced queued A/D converter module
eSCI
– Enhanced serial communications interface
eTPU2 – Enhanced time processing unit 2
FlexCAN– Controller area network
MMU
– Memory management unit
MPU
– Memory protection unit
S/B
– Stand-by
SIU
– System integration unit
SPE2
– Signal processing engine 2
SRAM – General-purpose static RAM
VLE
– Variable length instruction encoding
Figure 2. Block Diagram
3
Pin Assignments
The figures in this section show the primary pin function. For the full signal properties and muxing table, see Appendix A,
Signal Properties and Muxing.
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
5
Pin Assignments
3.1
324-ball TEPBGA Pin Assignments
Figure 3 shows the 324-ball TEPBGA pin assignments in one figure. The same information is shown split into to halves in
Figure 4 through Figure 5.
1
A
VSS
B VDDEH1
2
VDD
VSS
C ETPUA21 ETPUA26
3
4
RSTOUT ANA0
5
6
7
8
9
10
11
12
13
14
15
16
ANA1
ANA4
ANA5
REF–
REF–
VDDA_ B0
VRL_B VRH_B
ANA15 VDDA_A0 VRH_A VRL_A
BYPCB1
BYPCB1
17
18
19
20
21
22
ANB2
ANB3
ANB6
ANB7
ANB22
VSS
A
VDD
TEST
ANA2
ANA3
ANA6
REF– REF–
VDDA_ B1 VSSA_ B0 ANB0
ANA7 VDDA_A0 VSSA_A1
BYPCA BYPCB
ANB1
ANB4
ANB5
ANB19
ANB23
VSS TCRCLKC B
VSS
VDD
ANA8
ANA10
ANA9
ANA13
ANA17
ANA19
ANA21
ANA23
ANB10
ANB9
ANB11
ANB12
ANB14
ANB16
ANB20
VSS
ETPUC0 VDDEH7 C
VSS
VDD
ANA11
ANA12
ANA14
ANA16
ANA18
ANA20
ANA22
ANB8
ANB13
ANB15
ANB17
ANB18
ANB21
VSS
D ETPUA23 ETPUA25 ETPUA31
ETPUC1 ETPUC3 ETPUC2 D
ETPUC5 ETPUC10 ETPUC11 ETPUC4 E
E ETPUA20 ETPUA22 ETPUA24 ETPUA30
F ETPUA13 ETPUA14 ETPUA15 ETPUA27
ETPUC12 ETPUC14 ETPUC13 ETPUC9 F
MPC5674F 324 TEPBGA
(as viewed from top through the package)
G ETPUA10 ETPUA11 ETPUA12 ETPUA17
ETPUC20 ETPUC18 ETPUC19 ETPUC17 G
VDDEH7 ETPUC23 ETPUC22 ETPUC21 H
H ETPUA5 ETPUA6 ETPUA9 ETPUA16
J ETPUA1 ETPUA2 ETPUA3 ETPUA4
VSS
VSS
VSS
VSS
VSS
VSS
ETPUC27 ETPUC28 ETPUC26 ETPUC24 J
K TCRCLKA ETPUA0
VSTBY
VSS
VSS
VSS
VSS
VSS
VSS
ETPUC31 ETPUC30 ETPUC29 ETPUC25 K
BOOTPLLCFG1 PLLCFG2 VDDEH1
CFG1
VSS
VSS
VSS
VSS
VSS
VSS
ETPUB12 ETPUB13 ETPUB14 VDDEH7 L
VSS
VSS
VSS
VSS
VSS
ETPUB7 ETPUB10 ETPUB11 ETPUB9 M
L
VDD
M JCOMP RESET PLLCFG0
RDY
VDDE2
N VDDE2
MCKO
MSEO1
EVTI
VDDE2 VDDE2
VSS
VSS
VSS
VSS
ETPUB0 VDDEH6 ETPUB8 ETPUB6 N
EVTO
MSEO0
MDO0
MDO1
VDDE2 VDDE2
VSS
VSS
VSS
VSS
TCRCLKB ETPUB16 ETPUB5 ETPUB4 P
R MDO2
MDO3
MDO4
MDO5
ETPUB1 ETPUB17 ETPUB3 ETPUB2 R
T MDO6
MDO7
MDO8
VDDE2
ETPUB19 ETPUB18 VDDEH6 REGCTL T
U MDO9
MDO10 MDO11 MDO15
ETPUB31 ETPUB30 VDDREG VSSSYN U
P
V MDO12 VDDE2 MDO14 VDD33_2
VDD
W
TDO
MDO13
TMS
VSS
VDD
Y
TCK
TDI
VSS
VDD
FR_A_
TX
FR_B_
TX
SCKA
SCKB
PCSB0 EMIOS2 EMIOS5 EMIOS14 EMIOS15 EMIOS19 EMIOS23 EMIOS26 EMIOS30 CNTXB CNRXD
VSS
VDD
AA ENGCLK
VSS
VDD
FR_A_
RX
FR_B_
RX
PCSA5
SINA
SINB
EMIOS0 EMIOS3 EMIOS10 EMIOS13 EMIOS17 EMIOS21 EMIOS25 EMIOS28 EMIOS29 CNRXA
SINC
VSS
AB
VSS
VDD
1
2
VDDE2 PCSB2 VDDEH4
VDD
EMIOS8 EMIOS9 EMIOS18 EMIOS22 EMIOS27 EMIOS31 CNTXC CNRXC CNRXB
VSS
REGSEL VSSFL
SCKC
VDD VDD33_3 XTAL
FR_B_
FR_A_
VDDE2 TX_EN PCSA0 SOUTA SOUTB EMIOS1 EMIOS4 EMIOS7 EMIOS11 EMIOS12 EMIOS16 EMIOS20 EMIOS24 CNTXA SOUTC PCSC0 VDDEH4 CNTXD
TX_EN
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
EXTAL V
20
21
W
VDDSYN Y
VDD
AA
VSS
AB
22
Figure 3. MPC5674F 324-ball TEPBGA (full diagram)
MPC5674F Microcontroller Data Sheet, Rev. 6
6
Freescale Semiconductor
Pin Assignments
A
1
2
3
4
5
6
7
VSS
VDD
RSTOUT
ANA0
ANA1
ANA4
ANA5
VSS
VDD
TEST
ANA2
ANA3
ANA6
ANA7
VSS
VDD
ANA8
ANA10
ANA9
ANA13
ANA17
ANA19
ANA21
C
VSS
VDD
ANA11
ANA12
ANA14
ANA16
ANA18
ANA20
D
B VDDEH1
C ETPUA21 ETPUA26
D ETPUA23 ETPUA25 ETPUA31
8
9
ANA15 VDDA_A0
10
11
VRH_A
VRL_A
VDDA_A0 VSSA_A1
A
REF–
B
BYPCA
E ETPUA20 ETPUA22 ETPUA24 ETPUA30
F ETPUA13 ETPUA14 ETPUA15 ETPUA27
MPC5674F 324 TEPBGA
(as viewed from top through the package)
G ETPUA10 ETPUA11 ETPUA12 ETPUA17
H ETPUA5 ETPUA6 ETPUA9 ETPUA16
J ETPUA1 ETPUA2 ETPUA3 ETPUA4
VSS
VSS
VSS
J
K TCRCLKA ETPUA0
VSS
VSS
VSS
K
VSS
VSS
VSS
L
L
BOOTCFG1
VDD
VSTBY
PLLCFG1 PLLCFG2 VDDEH1
M JCOMP
RESET PLLCFG0
RDY
VDDE2
VSS
VSS
M
N
VDDE2
MCKO
MSEO1
EVTI
VDDE2
VDDE2
VSS
N
P
EVTO
MSEO0
MDO0
MDO1
VDDE2
VDDE2
VSS
P
R
MDO2
MDO3
MDO4
MDO5
T
MDO6
MDO7
MDO8
VDDE2
U
MDO9
MDO10
MDO11
MDO15
V MDO12
VDDE2
MDO14 VDD33_2
W
TDO
MDO13
TMS
VSS
VDD
VDDE2
PCSB2
VDDEH4
VDD
EMIOS8 EMIOS9 W
Y
TCK
TDI
VSS
VDD
FR_A_
TX
FR_B_
TX
SCKA
SCKB
PCSB0
EMIOS2 EMIOS5 Y
AA ENGCLK
VSS
VDD
FR_A_
RX
FR_B_
RX
PCSA5
SINA
SINB
EMIOS0 EMIOS3 EMIOS10 AA
AB
VSS
VDD
FR_A_
TX_EN
VDDE2
FR_B_
TX_EN
PCSA0
SOUTA
SOUTB
EMIOS1 EMIOS4 EMIOS7 AB
1
2
3
4
5
6
7
8
9
10
11
Figure 4. MPC5674F 324-ball TEPBGA (1 of 2)
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
7
Pin Assignments
12
13
14
REF–
REF–
A
VDDA_ B0
BYPCB1
BYPCB1
15
16
17
18
19
20
21
22
VRL_B
VRH_B
ANB2
ANB3
ANB6
ANB7
ANB22
VSS
ANB0
ANB1
ANB4
ANB5
ANB19
ANB23
VSS
VSS
B
REF–
BYPCB VDDA_ B1 VSSA_ B0
C
ANA23
ANB10
ANB9
ANB11
ANB12
ANB14
ANB16
ANB20
D
ANA22
ANB8
ANB13
ANB15
ANB17
ANB18
ANB21
VSS
A
TCRCLKC B
ETPUC0 VDDEH7 C
ETPUC1 ETPUC3 ETPUC2 D
ETPUC5 ETPUC10 ETPUC11 ETPUC4 E
ETPUC12 ETPUC14 ETPUC13 ETPUC9 F
MPC5674F 324 TEPBGA
(as viewed from top through the package)
ETPUC20 ETPUC18 ETPUC19 ETPUC17 G
VDDEH7 ETPUC23 ETPUC22 ETPUC21 H
J
VSS
VSS
VSS
ETPUC27 ETPUC28 ETPUC26 ETPUC24 J
K
VSS
VSS
VSS
ETPUC31 ETPUC30 ETPUC29 ETPUC25 K
L
VSS
VSS
VSS
ETPUB12 ETPUB13 ETPUB14 VDDEH7 L
M
VSS
VSS
VSS
ETPUB7 ETPUB10 ETPUB11 ETPUB9 M
N
VSS
VSS
VSS
ETPUB0 VDDEH6 ETPUB8 ETPUB6 N
P
VSS
VSS
VSS
TCRCLKB ETPUB16 ETPUB5 ETPUB4 P
ETPUB1 ETPUB17 ETPUB3 ETPUB2 R
ETPUB19 ETPUB18 VDDEH6 REGCTL T
ETPUB31 ETPUB30 VDDREG VSSSYN U
VDD
REGSEL
VSSFL
EXTAL
V
VSS
VDD
VDD33_3
XTAL
W
Y EMIOS14 EMIOS15 EMIOS19 EMIOS23 EMIOS26 EMIOS30 CNTXB
CNRXD
VSS
VDD
AA EMIOS13 EMIOS17 EMIOS21 EMIOS25 EMIOS28 EMIOS29 CNRXA
SCKC
SINC
VSS
VDD
AA
SOUTC
PCSC0
VDDEH4
CNTXD
VSS
AB
18
19
20
21
22
W EMIOS18 EMIOS22 EMIOS27 EMIOS31 CNTXC
CNRXC
AB EMIOS11 EMIOS12 EMIOS16 EMIOS20 EMIOS24 CNTXA
12
13
14
15
16
17
CNRXB
VDDSYN Y
Figure 5. MPC5674F 324-ball TEPBGA (2 of 2)
MPC5674F Microcontroller Data Sheet, Rev. 6
8
Freescale Semiconductor
Pin Assignments
3.2
416-ball TEPBGA Pin Assignments
Figure 6 shows the 416-ball TEPBGA pin assignments in one figure. The same information is shown split into four quadrants
in Figure 7 through Figure 10.
1
A
VSS
2
3
4
VDD RSTOUT ANA0
5
6
13
14
ANA4
ANA8
REF– VRL_A VRH_A
ANA11 ANA15 VDDA_A0
BYPCA1
7
8
9
10
11
12
AN28
AN32
AN36 VDDA_B0 REF– VRL_B VRH_B ANB7
BYPCB1
15
16
ANB11 ANB14 ANB17 ANB21 ANB23
AN24
AN27
AN29
AN33 VDDA_B1 VSSA_B0 REF– ANB6
BYPCB
ANB8
ANB10 ANB15 ANB18 ANB22
17
18
19
20
21
22
23
VDD
TEST
ANA1
ANA5
REF–
ANA10 ANA14 VDDA_A1 VSSA_A1 BYPCA
C ETPUA30 ETPUA31 VSS
VDD
ANA2
ANA6
ANA9
ANA13 ANA17 ANA19 ANA21 ANA23
AN26
AN30
AN34
AN37
AN38
ANB0
ANB4
ANB5
ANB12 ANB16 ANB19
D ETPUA27 ETPUA28 ETPUA29 VSS
VDD
ANA3
ANA7
ANA12 ANA16 ANA18 ANA20 ANA22
AN25
AN31
AN35
AN39
ANB1
ANB2
ANB3
ANB9
ANB13 ANB20
B VDDEH1 VSS
24
VSS
25
26
VSS
A
VSS TCRCLKC B
ETPUC0 ETPUC1 C
VSS VDDEH7 ETPUC2 ETPUC3 D
VDDEH7 ETPUC4 ETPUC5 ETPUC6 E
E ETPUA23 ETPUA24 ETPUA25 ETPUA26
ETPUC7 ETPUC8 ETPUC9 ETPUC10 F
F ETPUA19 ETPUA20 ETPUA21 ETPUA22
MPC5674F 416-ball TEPBGA
G ETPUA15 ETPUA16 ETPUA17 ETPUA18
ETPUC11 ETPUC12 ETPUC13 ETPUC14 G
(as viewed from top through the package)
H ETPUA11 ETPUA12 ETPUA14 ETPUA13
ETPUC15 ETPUC16 ETPUC17 ETPUC18 H
J ETPUA7 ETPUA8 ETPUA9 ETPUA10
ETPUC19 ETPUC20 ETPUC21 ETPUC22 J
K ETPUA3 ETPUA4 ETPUA5 ETPUA6
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
ETPUC23 ETPUC24 ETPUC25 ETPUC26 K
L TCRCLKA ETPUA0 ETPUA1 ETPUA2
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
ETPUC27 ETPUC28 ETPUC29 ETPUC30 L
M VDD33_1 TXDA
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
ETPUC31 ETPUB15 ETPUB14 VDDEH7 M
BOOT–
N RXDB CFG1 WKPCFG VDD
VDDE2
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDDEH6 ETPUB11 ETPUB12 ETPUB13 N
P TXDB PLLCFG1 PLLCFG2 VDDEH1
VDDE2 VDDE2
VSS
VSS
VSS
VSS
VSS
VSS
ETPUB7 ETPUB8 ETPUB9 ETPUB10 P
R JCOMP RESET PLLCFG0 RDY
VDDE2 VDDE2
VSS
VSS
VSS
VSS
VSS
VSS
ETPUB3 ETPUB4 ETPUB5 ETPUB6 R
T VDDE2 MCKO MSEO1
EVTI
VDDE2 VDDE2 VDDE2
VSS
VSS
VSS
VSS
VSS
TCRCLKB ETPUB0 ETPUB1 ETPUB2 T
U EVTO MSEO0 MDO0
MDO1
VDDE2 VDDE2 VDDE2
VSS
VSS
VSS
VSS
VSS
ETPUB19 ETPUB18 ETPUB17 ETPUB16 U
V MDO2
MDO3
MDO4
MDO5
ETPUB26 ETPUB22 ETPUB21 ETPUB20 V
W MDO6
MDO7
MDO8 VDDE2
REGSEL ETPUB25 ETPUB24 ETPUB23 W
Y MDO9 MDO10 MDO11 MDO15
ETPUB29 ETPUB28 ETPUB27 REGCTL Y
AA MDO12 MDO13 MDO14 VDD33_2
VDD33_3 ETPUB30 VDDREG VSSSYN AA
TDO
RXDA VSTBY
TCK
TMS
VDD
TDI
VDD
VSS
AD ENGCLK VDD
VSS
AB
AC VDDE2
AE
VDD
AF
VSS
1
VSS
VDD ETPUB31 VSSFL EXTAL AB
VDDE2 PCSA1 PCSA2 PCSB4 PCSB1 VDDEH3 VDDEH4 VDD
FR_A_ FR_B_
PCSA5 SOUTA SCKA PCSB0 PCSB3 EMIOS2 EMIOS5 EMIOS9 EMIOS15 EMIOS19 EMIOS23 EMIOS26 EMIOS30 CNTXB CNTXD SCKC
TX
TX
FR_A_ FR_B_
PCSA4 PCSA0 PCSA3 SCKB
RX
RX
FR_A_ FR_B_
VDDE2 TX_EN TX_EN VDDEH3 PCSB5
2
3
EMIOS8 EMIOS14 EMIOS18 EMIOS22 EMIOS27 EMIOS31 CNRXB CNRXD VDDEH5 PCSC1
4
5
6
SINA
7
SINB EMIOS0 EMIOS3 EMIOS6 EMIOS10 EMIOS13 EMIOS17 EMIOS21 EMIOS25 EMIOS29 CNRXA CNRXC PCSC0
VSS
RXDC PCSC3
SINC
VDD VDDEH6 XTAL AC
VSS
PCSC2 PCSC5
VDD VDDSYN AD
VSS
VDD
AE
PCSB2 SOUTB EMIOS1 EMIOS4 EMIOS7 EMIOS11 EMIOS12 EMIOS16 EMIOS20 EMIOS24 EMIOS28 CNTXA CNTXC SOUTC VDDEH4 TXDC PCSC4 VDDEH5 VSS
AF
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
Figure 6. MPC5674F 416-ball TEPBGA (full diagram)
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
9
Pin Assignments
A
1
2
3
4
5
6
7
VSS
VDD
RSTOUT
ANA0
ANA4
ANA8
ANA11
ANA15 VDDA_A0
VSS
VDD
TEST
ANA1
ANA5
ANA10
VSS
VDD
ANA2
ANA6
VSS
VDD
ANA3
B VDDEH1
C ETPUA30 ETPUA31
D ETPUA27 ETPUA28 ETPUA29
8
9
10
11
12
13
REFBYPCA1
VRL_A
VRH_A
AN28
A
ANA14 VDDA_A1 VSSA_A1 REFBYPCA
AN24
AN27
B
ANA9
ANA13
ANA17
ANA19
ANA21
ANA23
AN26
C
ANA7
ANA12
ANA16
ANA18
ANA20
ANA22
AN25
D
E ETPUA23 ETPUA24 ETPUA25 ETPUA26
E
F ETPUA19 ETPUA20 ETPUA21 ETPUA22
F
MPC5674F 416-ball TEPBGA
G ETPUA15 ETPUA16 ETPUA17 ETPUA18
G
(as viewed from top through the package)
(1 of 4)
H ETPUA11 ETPUA12 ETPUA14 ETPUA13
H
J ETPUA7 ETPUA8 ETPUA9 ETPUA10
J
K ETPUA3 ETPUA4 ETPUA5 ETPUA6
VSS
VSS
VSS
VSS
K
L TCRCLKA ETPUA0 ETPUA1 ETPUA2
VSS
VSS
VSS
VSS
L
M VDD33_1
VSTBY
VSS
VSS
VSS
VSS
M
VDD
VDDE2
VSS
VSS
VSS
N
10
11
12
13
N
TXDA
RXDA
RXDB BOOTCFG1 WKPCFG
1
2
3
4
5
6
7
8
9
Figure 7. MPC5674F 416-ball TEPBGA (1 of 4)
MPC5674F Microcontroller Data Sheet, Rev. 6
10
Freescale Semiconductor
Pin Assignments
14
15
16
17
18
19
20
21
22
23
24
25
26
A
AN32
AN36
VDDA_B0
REFBYPCB1
VRL_B
VRH_B
ANB7
ANB11
ANB14
ANB17
ANB21
ANB23
VSS
B
AN29
AN33
VDDA_B1 VSSA_B0 REFBYPCB ANB6
ANB8
ANB10
ANB15
ANB18
ANB22
VSS
C
AN30
AN34
AN37
AN38
ANB0
ANB4
ANB5
ANB12
ANB16
ANB19
VSS
D
AN31
AN35
AN39
ANB1
ANB2
ANB3
ANB9
ANB13
ANB20
VSS
A
TCRCLKC B
ETPUC0 ETPUC1 C
VDDEH7 ETPUC2 ETPUC3 D
E
VDDEH7 ETPUC4 ETPUC5 ETPUC6 E
F
ETPUC7 ETPUC8 ETPUC9 ETPUC10 F
MPC5674F 416-ball TEPBGA
G
ETPUC11 ETPUC12 ETPUC13 ETPUC14 G
(as viewed from top through the package)
(2 of 4)
H
ETPUC15 ETPUC16 ETPUC17 ETPUC18 H
J
ETPUC19 ETPUC20 ETPUC21 ETPUC22 J
K
VSS
VSS
VSS
VSS
ETPUC23 ETPUC24 ETPUC25 ETPUC26 K
L
VSS
VSS
VSS
VSS
ETPUC27 ETPUC28 ETPUC29 ETPUC30 L
M
VSS
VSS
VSS
VSS
ETPUC31 ETPUB15 ETPUB14 VDDEH7 M
N
VSS
VSS
VSS
VSS
VDDEH6 ETPUB11 ETPUB12 ETPUB13 N
14
15
16
17
18
19
20
21
22
23
24
25
26
Figure 8. MPC5674F 416-ball TEPBGA (2 of 4)
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
11
Pin Assignments
1
2
3
4
5
6
7
8
9
10
11
12
13
PLLCFG1 PLLCFG2 VDDEH1
VDDE2
VDDE2
VSS
VSS
P
RDY
VDDE2
VDDE2
VSS
VSS
R
P
TXDB
R
JCOMP
RESET PLLCFG0
T
VDDE2
MCKO
MSEO1
EVTI
VDDE2
VDDE2
VDDE2
VSS
T
U
EVTO
MSEO0
MDO0
MDO1
VDDE2
VDDE2
VDDE2
VSS
U
V
MDO2
MDO3
MDO4
MDO5
V
W
MDO6
MDO7
MDO8
VDDE2
W
Y
MDO9
MDO10
MDO11
MDO15
AA
MDO12
MDO13
MDO14 VDD33_2
AB
TDO
TCK
TMS
VDD
AC
VDDE2
TDI
VDD
VSS
VDD
VSS
MPC5674F 416-ball TEPBGA
AD ENGCLK
Y
(as viewed from top through the package)
(3 of 4)
AA
AB
VDDE2
PCSA2
PCSB4
PCSB1 VDDEH3 VDDEH4
FR_A_TX FR_B_TX PCSA5
SOUTA
SCKA
PCSB0
PCSA0
PCSA3
SCKB
SINB
EMIOS0 EMIOS3 EMIOS6 EMIOS10 AE
EMIOS1 EMIOS4 EMIOS7 EMIOS11 AF
AE
VDD
VSS
AF
VSS
VDDE2
FR_A_
TX_EN
FR_B_
TX_EN
VDDEH3
PCSB5
SINA
PCSB2
SOUTB
1
2
3
4
5
6
7
8
9
FR_A_RX FR_B_RX PCSA4
PCSB3
10
VDD
EMIOS8 AC
PCSA1
EMIOS2 EMIOS5 EMIOS9 AD
11
12
13
Figure 9. MPC5674F 416-ball TEPBGA (3 of 4)
MPC5674F Microcontroller Data Sheet, Rev. 6
12
Freescale Semiconductor
Pin Assignments
14
15
16
17
18
19
20
21
22
23
24
25
26
P
VSS
VSS
VSS
VSS
ETPUB7 ETPUB8 ETPUB9 ETPUB10 P
R
VSS
VSS
VSS
VSS
ETPUB3 ETPUB4 ETPUB5 ETPUB6 R
T
VSS
VSS
VSS
VSS
TCRCLKB ETPUB0 ETPUB1 ETPUB2 T
U
VSS
VSS
VSS
VSS
ETPUB19 ETPUB18 ETPUB17 ETPUB16 U
V
ETPUB26 ETPUB22 ETPUB21 ETPUB20 V
W
REGSEL ETPUB25 ETPUB24 ETPUB23 W
MPC5674F 416-ball TEPBGA
Y
ETPUB29 ETPUB28 ETPUB27 REGCTL Y
(as viewed from top through the package)
(4 of 4)
VDD33_3 ETPUB30 VDDREG VSSSYN AA
AA
AB
VDD
AC EMIOS14 EMIOS18 EMIOS22 EMIOS27 EMIOS31 CNRXB
CNRXD VDDEH5 PCSC1
AD EMIOS15 EMIOS19 EMIOS23 EMIOS26 EMIOS30 CNTXB
CNTXD
SCKC
AE EMIOS13 EMIOS17 EMIOS21 EMIOS25 EMIOS29 CNRXA
CNRXC
PCSC0
AF EMIOS12 EMIOS16 EMIOS20 EMIOS24 EMIOS28 CNTXA
CNTXC
SOUTC VDDEH4
14
15
16
17
18
19
20
21
ETPUB31 VSSFL
VSS
VDD
VDDEH6
RXDC
PCSC3
VSS
VDD
SINC
PCSC2
PCSC5
VSS
TXDC
PCSC4 VDDEH5
22
23
24
25
EXTAL
AB
XTAL
AC
VDDSYN AD
VDD
AE
VSS
AF
26
Figure 10. MPC5674F 416-ball TEPBGA (4 of 4)
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
13
Pin Assignments
3.3
516-ball TEPBGA Pin Assignments
Figure 11 shows the 516-ball TEPBGA pin assignments in one figure. The same information is shown split into four quadrants
in Figure 12 through Figure 15.
1
A
2
3
4
VDD RSTOUT ANA0
5
6
ANA4
ANA9
ANA11 ANA15 VDDA_A0
7
8
9
13
14
REF–
VRL_A VRH_A
BYPCA1
10
11
12
AN28
AN29
AN36 VDDA_B0
15
16
17
18
19
REF–
BYPCA
AN24
AN27
AN30
AN32 VDDA_B1 VSSA_B0
REF–
ANB4
BYPCB
20
REF–
VRL_B VRH_B ANB5
BYPCB1
21
22
ANB10 ANB13 ANB19 ANB22
VSS
ANB11 ANB15 ANB20
ANA1
ANA5
ANA10 ANA14 VDDA_A1 VSSA_A1
C ETPUA30 ETPUA31 VSS
VDD
ANA2
ANA6
ANA7
ANA13 ANA17 ANA19 ANA21 ANA22
AN25
AN31
AN34
AN39
AN37
ANB0
ANB7
ANB6
D ETPUA27 ETPUA28 ETPUA29 VSS
VDD
ANA3
ANA8
ANA12 ANA16 ANA18 ANA20 ANA23
AN26
AN33
AN35
AN38
ANB1
ANB2
ANB3
ANB14 ANB16 ANB17
E ETPUA23 ETPUA24 ETPUA25 ETPUA26 VSS
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
ANB23
F ETPUA19 ETPUA20 ETPUA21 ETPUA22 VSS
VDDE8
VSS
VSS
VSS
VDDE8
VSS
VSS
VSS
VDDE8 VDDE8
VDDE10 VDDE10
VSS
H ETPUA5 ETPUA7 ETPUA8 ETPUA3 ETPUA14 ETPUA16
26
A
VSS
B
VSS ETPUC0 ETPUC1 C
VSS VDDEH7 ETPUC2 ETPUC3 D
VSS VDDEH7 ETPUC4 ETPUC5 ETPUC6 E
VDDE10 TCRCLKC ETPUC7 ETPUC8 ETPUC9 ETPUC10 F
VDDE10
MPC5674F 516-ball TEPBGA
G ETPUA11 ETPUA13 ETPUA15 ETPUA17 ETPUA18
25
ANB8
TEST
VSS
24
VSS
VDD
B VDDEH1 VSS
23
ANB12 ANB18 ANB21
ANB9
ETPUC11 ETPUC12 ETPUC13 ETPUC14 ETPUC15 G
ETPUC19 ETPUC16 ETPUC17 ETPUC18 ETPUC20 ETPUC21 H
(as viewed from top through the package)
J ETPUA1 ETPUA2 ETPUA9 ETPUA4 ETPUA12
ETPUC22 ETPUC23 ETPUC24 ETPUC26 ETPUC27 J
RXDA TCRCLKA ETPUA6 ETPUA10
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
ETPUC25 ETPUC28 ETPUC29 ETPUC30 ETPUC31 D_DAT15 K
BOOT– BOOT–
L PLLCFG1 PLLCFG2 CFG1 CFG0 RXDB ETPUA0
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDD33_6 D_DAT14 D_DAT13 D_DAT12 D_DAT11 D_DAT10 L
M VDD33_1 D_BDIP PLLCFG0 VSTBY WKPCFG
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
D_DAT9 D_DAT8 D_DAT7 D_DAT5 VDDEH7 M
VDDE2
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDDE10 D_DAT6 VDDEH6 D_DAT2 D_DAT3 D_DAT4 N
VDDE10 ETPUB13 D_OE
K TXDB
TXDA
N D_WE0 D_WE2 D_WE3
VDD
RESET VDDE8
D_ALE D_DAT0 D_DAT1 P
P D_ADD9 D_ADD10 D_ADD11 VDDEH1 D_WE1 VDD33_1
VDDE2 VDDE2
VSS
VSS
VSS
VSS
VSS
VSS
R D_ADD12 D_ADD13 D_ADD14 D_ADD15 D_ADD16
VDDE2 VDDE2
VSS
VSS
VSS
VSS
VSS
VSS
D_RD_
ETPUB9 ETPUB12 ETPUB14 ETPUB15 WR R
T VDDE2 D_ADD18 D_ADD19 D_ADD20 D_ADD17 D_CS3
VDDE2 VDDE2 VDDE2
VSS
VSS
VSS
VSS
VSS
ETPUB17 ETPUB3 ETPUB7 ETPUB8 ETPUB10 ETPUB11 T
U D_CS2 JCOMP
RDY
MCKO MSEO1 MSEO0
VDDE2 VDDE2 VDDE2
VSS
VSS
VSS
VSS
VSS
ETPUB23 ETPUB1 ETPUB2 ETPUB4 ETPUB5 ETPUB6 U
V
MDO2
EVTI
EVTO
MDO0
W MDO4
MDO5
MDO6 VDDE2 MDO8
Y MDO7
MDO9 MDO10 MDO11 MDO12
AA MDO13 MDO14 MDO15 VDD33_1 VDDE8
AB
TDO
TCK
TMS
VDD
TDI
VDD
VSS
AD ENGCLK VDD
VSS
AC VDDE2
AE
VDD
AF
VSS
VDDE2
1
2
ETPUB21 ETPUB22 ETPUB16 TCRCLKB ETPUB0 V
MDO3
VSS
ETPUB25 ETPUB29 REGSEL ETPUB20 ETPUB19 ETPUB18 W
MDO1
ETPUB31 ETPUB26 ETPUB27 ETPUB24 REGCTL Y
VSS
VDDE9 VDDE9 SCKA
SINB
VDDE9 VDD33_4
EMIOS23 EMIOS31
VSS
CNRXB
D_CS1 D_ADD21 D_ADD29 EMIOS1 EMIOS11 EMIOS17 EMIOS19 EMIOS29 VDDE9 VDDE9 VDDE9 VDDE9
VDDE2 PCSA1 SOUTA SCKB PCSB3 VDDEH3 VDDEH4 VDD
SINA
PCSB1
FR_A_ FR_B_
VDDEH3 PCSA2 PCSB4 PCSB0
TX_EN TX_EN
4
5
6
7
8
VDDE10 VDD33_3 ETPUB28 VDDREG VSSSYN AA
VSS
EMIOS0 EMIOS8 EMIOS13 EMIOS22 EMIOS24 EMIOS28 CNTXB CNRXD VDDEH5 PCSC1
FR_A_ FR_B_
PCSA0 PCSA3 PCSB2 D_CS0 D_ADD22 D_ADD25 D_ADD28 EMIOS2 EMIOS7 EMIOS12 EMIOS16 EMIOS18 EMIOS27 CNRXA CNTXD SCKC
TX
TX
FR_A_ FR_B_
PCSA4 PCSB5
RX
RX
3
SOUTB VDD33_4
PCSA5
D_TS D_ADD23 D_ADD26 D_ADD30 EMIOS3 EMIOS6 EMIOS10 EMIOS15 EMIOS21 EMIOS26 CNTXA CNRXC PCSC0
VDD ETPUB30 VSSFL EXTAL AB
VSS
RXDC PCSC3
SINC
VDD VDDEH6 XTAL AC
VSS
PCSC2 PCSC5
VDD VDDSYN AD
VSS
VDD
D_
D_TA D_ADD24 D_ADD27 CLKOUT EMIOS4 EMIOS5 EMIOS9 EMIOS20 EMIOS14 EMIOS25 EMIOS30 CNTXC SOUTC VDDEH4 TXDC PCSC4 VDDEH5
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
AE
AF
26
Figure 11. MPC5674F 516-ball TEPBGA (full diagram)
MPC5674F Microcontroller Data Sheet, Rev. 6
14
Freescale Semiconductor
Pin Assignments
1
2
3
4
5
6
7
A
VDD
RSTOUT
ANA0
ANA4
ANA9
ANA11
ANA15 VDDA_A0
B VDDEH1
VSS
VDD
TEST
ANA1
ANA5
ANA10
VSS
VDD
ANA2
ANA6
VSS
VDD
E ETPUA23 ETPUA24 ETPUA25 ETPUA26
F ETPUA19 ETPUA20 ETPUA21 ETPUA22
C ETPUA30 ETPUA31
D ETPUA27 ETPUA28 ETPUA29
8
9
10
11
12
13
REFBYPCA1
VRL_A
VRH_A
AN28
A
ANA14 VDDA_A1 VSSA_A1 REFBYPCA
AN24
AN27
B
ANA7
ANA13
ANA17
ANA19
ANA21
ANA22
AN25
C
ANA3
ANA8
ANA12
ANA16
ANA18
ANA20
ANA23
AN26
D
VSS
VDD
VSS
VSS
VSS
VSS
VSS
VSS
VSS
E
VSS
VDDE8
VDDE8
VDDE8
VSS
F
VDDE8
MPC5674F 516-ball TEPBGA
G ETPUA11 ETPUA13 ETPUA15 ETPUA17 ETPUA18
G
(as viewed from top through the package)
(1 of 4)
H ETPUA5 ETPUA7 ETPUA8 ETPUA3 ETPUA14 ETPUA16
H
J ETPUA1 ETPUA2 ETPUA9 ETPUA4 ETPUA12
J
K
TXDB
TXDA
RXDA
VSS
VSS
VSS
VSS
K
VSS
VSS
VSS
VSS
L
VSS
VSS
VSS
VSS
M
VDDE2
VSS
VSS
VSS
N
10
11
12
13
TCRCLKA ETPUA6 ETPUA10
L PLLCFG1 PLLCFG2 BOOTCFG1 BOOTCFG0 RXDB
ETPUA0
M VDD33_1 D_BDIP PLLCFG0 VSTBY WKPCFG
N
D_WE0
D_WE2
D_WE3
VDD
RESET
VDDE8
1
2
3
4
5
6
7
8
9
Figure 12. MPC5674F 516-ball TEPBGA (1 of 4)
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
15
Pin Assignments
14
15
16
17
18
19
20
21
22
23
24
25
A
AN29
AN36
VDDA_B0
REFBYPCB1
VRL_B
VRH_B
ANB5
ANB9
ANB12
ANB18
ANB21
VSS
B
AN30
AN32
VDDA_B1 VSSA_B0 REFBYPCB ANB4
ANB8
ANB10
ANB13
ANB19
ANB22
VSS
C
AN31
AN34
AN39
AN37
ANB0
ANB7
ANB6
ANB11
ANB15
ANB20
VSS
D
AN33
AN35
AN38
ANB1
ANB2
ANB3
ANB14
ANB16
ANB17
VSS
E
VSS
VSS
VSS
VSS
VSS
VSS
ANB23
VSS
VSS
F
VSS
VDDE10 VDDE10
26
A
VSS
B
ETPUC0 ETPUC1 C
VDDEH7 ETPUC2 ETPUC3 D
VDDEH7 ETPUC4 ETPUC5 ETPUC6 E
VDDE10 TCRCLKC ETPUC7 ETPUC8 ETPUC9 ETPUC10 F
VDDE10
MPC5674F 516-ball TEPBGA
G
ETPUC11 ETPUC12 ETPUC13 ETPUC14 ETPUC15 G
(as viewed from top through the package)
(2 of 4)
H
ETPUC19 ETPUC16 ETPUC17 ETPUC18 ETPUC20 ETPUC21 H
J
ETPUC22 ETPUC23 ETPUC24 ETPUC26 ETPUC27 J
K
VSS
VSS
VSS
VSS
ETPUC25 ETPUC28 ETPUC29 ETPUC30 ETPUC31 D_DAT15 K
L
VSS
VSS
VSS
VSS
VDD33_6 D_DAT14 D_DAT13 D_DAT12 D_DAT11 D_DAT10 L
M
VSS
VSS
VSS
VSS
N
VSS
VSS
VSS
VSS
14
15
16
17
D_DAT9 D_DAT8
D_DAT7 D_DAT5 VDDEH7 M
VDDE10 D_DAT6 VDDEH6 D_DAT2 D_DAT3 D_DAT4
18
19
20
21
22
23
24
25
N
26
Figure 13. MPC5674F 516-ball TEPBGA (2 of 4)
MPC5674F Microcontroller Data Sheet, Rev. 6
16
Freescale Semiconductor
Pin Assignments
1
2
3
4
5
6
7
8
9
10
11
12
13
P D_ADD9 D_ADD10 D_ADD11 VDDEH1 D_WE1 VDD33_1
VDDE2
VDDE2
VSS
VSS
P
R D_ADD12 D_ADD13 D_ADD14 D_ADD15 D_ADD16
VDDE2
VDDE2
VSS
VSS
R
VDDE2
VDDE2
VDDE2
VSS
T
VDDE2
VDDE2
VDDE2
VSS
U
T
VDDE2 D_ADD18 D_ADD19 D_ADD20 D_ADD17 D_CS3
U
D_CS2
JCOMP
RDY
MCKO
MSEO1
V
EVTI
EVTO
MDO0
MDO2
MDO3
W
MDO4
MDO5
MDO6
VDDE2
MDO8
Y
MDO7
MDO9
MDO10
MDO11
MDO12
AA
MDO13
MDO14
MDO15 VDD33_1 VDDE8
AB
TDO
TCK
TMS
VDD
VSS
VDDE9
VDDE9
SCKA
SINB
AC
VDDE2
TDI
VDD
VSS
VDDE2
PCSA1
SOUTA
SCKB
PCSB3
VDD
VSS
FR_A_TX FR_B_TX PCSA0
PCSA3
PCSB2
D_CS0 D_ADD22 D_ADD25 D_ADD28 EMIOS2 AD
PCSB5
SINA
PCSB1
D_TS
D_ADD23 D_ADD26 D_ADD30 EMIOS3 AE
D_ADD24 D_ADD27 D_CLKOUT EMIOS4 AF
AD ENGCLK
AE
VDD
AF
1
VSS
FR_A_RX FR_B_RX PCSA4
MSEO0
V
MPC5674F 516-ball TEPBGA
(as viewed from top through the package)
(3 of 4)
MDO1
W
Y
VSS
PCSA5
SOUTB VDD33_4
VDDE2
FR_A_
TX_EN
FR_B_
TX_EN
VDDEH3
PCSA2
PCSB4
PCSB0
D_TA
2
3
4
5
6
7
8
9
VDDE9
AA
D_CS1 D_ADD21 D_ADD29 EMIOS1 AB
VDDEH3 VDDEH4
10
11
VDD
12
EMIOS0 AC
13
Figure 14. MPC5674F 516-ball TEPBGA (3 of 4)
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
17
Pin Assignments
14
15
16
17
18
19
20
21
P
VSS
VSS
VSS
VSS
R
VSS
VSS
VSS
VSS
ETPUB9 ETPUB12 ETPUB14 ETPUB15 D_RD_WR R
T
VSS
VSS
VSS
VSS
ETPUB17 ETPUB3 ETPUB7 ETPUB8 ETPUB10 ETPUB11 T
U
VSS
VSS
VSS
VSS
ETPUB23 ETPUB1 ETPUB2 ETPUB4 ETPUB5 ETPUB6 U
VDDE10 ETPUB13
MPC5674F 516-ball TEPBGA
V
22
23
24
25
26
D_OE
D_ALE
D_DAT0
D_DAT1
P
ETPUB21 ETPUB22 ETPUB16 TCRCLKB ETPUB0 V
(as viewed from top through the package)
(4 of 4)
W
ETPUB25 ETPUB29 REGSEL ETPUB20 ETPUB19 ETPUB18 W
Y
ETPUB31 ETPUB26 ETPUB27 ETPUB24 REGCTL Y
AA VDD33_4
EMIOS23 EMIOS31
CNRXB
AB EMIOS11 EMIOS17 EMIOS19 EMIOS29 VDDE9
VDDE9
VSS
VDDE9
VDDE9
VDDE10 VDD33_3 ETPUB28 VDDREG VSSSYN AA
VSS
AC EMIOS8 EMIOS13 EMIOS22 EMIOS24 EMIOS28 CNTXB
CNRXD VDDEH5 PCSC1
AD EMIOS7 EMIOS12 EMIOS16 EMIOS18 EMIOS27 CNRXA
CNTXD
SCKC
AE EMIOS6 EMIOS10 EMIOS15 EMIOS21 EMIOS26 CNTXA
CNRXC
PCSC0
AF EMIOS5 EMIOS9 EMIOS20 EMIOS14 EMIOS25 EMIOS30 CNTXC
14
15
16
17
18
19
20
VDD
VSS
VDD
VDDEH6
RXDC
PCSC3
VSS
VDD
SINC
PCSC2
PCSC5
VSS
TXDC
PCSC4 VDDEH5
SOUTC VDDEH4
21
ETPUB30 VSSSFL
22
23
24
25
EXTAL
AB
XTAL
AC
VDDSYN AD
VDD
AE
AF
26
Figure 15. MPC5674F 516-ball TEPBGA (4 of 4)
MPC5674F Microcontroller Data Sheet, Rev. 6
18
Freescale Semiconductor
Pin Assignments
3.4
SignalProperties and Muxing
See Appendix A, Signal Properties and Muxing, for a listing and description of the pin functions and properties.
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
19
Electrical Characteristics
4
Electrical Characteristics
This section contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing
specifications for the MPC5674F.
The electrical specifications are preliminary and are from previous designs, design simulations, or initial evaluation. These
specifications may not be fully tested or guaranteed at this stage of the product life cycle, however for production silicon these
specifications will be met. Finalized specifications will be published after complete characterization and device qualifications
have been completed.
4.1
Maximum Ratings
Table 3. Absolute Maximum Ratings1
Spec
Characteristic
Symbol
Min
Max2
Unit
VDD
–0.3
1.65 4
V
VSTBY
–0.3
6.4 5,6
V
VDDSYN
–0.3
4.5 6,7
V
1
1.2 V Core Supply Voltage3
2
SRAM Standby Voltage
3
Clock Synthesizer Voltage
4
I/O Supply Voltage (I/O buffers and predrivers)
VDD33
–0.3
4.5 6,7
V
5
Analog Supply Voltage (reference to VSSA8)
VDDA9
–0.3
6.4 5,6
V
6
I/O Supply Voltage (fast I/O pads)
VDDE
–0.3
4.5 6,7
V
5,6
V
7
I/O Supply Voltage (medium I/O pads)
VDDEH
–0.3
6.4
8
Voltage Regulator Input Supply Voltage
VDDREG
–0.3
6.4 5,6
V
9
Analog Reference High Voltage (reference to VRL10)
VRH11
–0.3
6.4 5,6
V
10
VSS to VSSA8 Differential Voltage
VSS – VSSA
–0.1
0.1
V
11
VREF Differential Voltage
VRH – VRL
–0.3
6.4 5,6
V
12
VRL to VSSA Differential Voltage
VRL – VSSA
–0.3
0.3
V
13
VDD33 to VDDSYN Differential Voltage
VDD33 – VDDSYN
–0.1
0.1
V
14
VSSSYN to VSS Differential Voltage
VSSSYN – VSS
–0.1
0.1
V
15
Maximum Digital Input Current 12 (per pin, applies to all
digital pins)
IMAXD
–3 13
3 13
mA
16
Maximum Analog Input Current 14 (per pin, applies to all
analog pins)
IMAXA
–39
3 9,13
mA
17
Maximum Operating Temperature Range 15 – Die Junction
Temperature
TJ
–40.0
150.0
oC
18
Storage Temperature Range
Tstg
–55.0
150.0
oC
19
Maximum Solder Temperature 16
Pb-free package
SnPb package
Tsdr
—
—
260.0
245.0
Moisture Sensitivity Level 17
MSL
—
3
20
o
C
—
MPC5674F Microcontroller Data Sheet, Rev. 6
20
Freescale Semiconductor
Electrical Characteristics
1
Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings only,
and functional operation at the maxima is not guaranteed. Stress beyond the listed maxima may affect device reliability or
cause permanent damage to the device.
2
Absolute maximum voltages are currently maximum burn-in voltages. Absolute maximum specifications for device stress have
not yet been determined.
3
1.2 V ±10% for proper operation. This parameter is specified at a maximum junction temperature of 150 °C.
4
1.65 V for 10 hours cumulative time, 1.2 V +10% for time remaining.
5
6.4 V for 10 hours cumulative time, 5.0 V +10% for time remaining.
6
Voltage overshoots during a high-to-low or low-to-high transition must not exceed 10 seconds per instance.
7
5.3 V for 10 hours cumulative time, 3.3 V +10% for time remaining.
8
MPC5674F has two analog power supply pins on the pinout: VDDA_A and VDDA_B.
9
MPC5674F has two analog ground supply pins on the pinout: VSSA_A and VSSA_B.
10
MPC5674F has two analog low reference voltage pins on the pinout: VRL_A and VRL_B.
11
MPC5674F has two analog high reference voltage pins on the pinout: VRH_A and VRH_B.
12
Total injection current for all pins must not exceed 25 mA at maximum operating voltage.
13 Injection current of ±5 mA allowed for limited duration for analog (ADC) pads and digital 5 V pads. The maximum accumulated
time at this current shall be 60 hours. This includes an assumption of a 5.25 V maximum analog or VDDEH supply when under
this stress condition.
14 Total injection current for all analog input pins must not exceed 15 mA.
15 Lifetime operation at these specification limits is not guaranteed.
16 Solder profile per CDF-AEC-Q100.
17 Moisture sensitivity per JEDEC test method A112.
4.2
Thermal Characteristics
Table 4. Thermal Characteristics, 416-pin TEPBGA Package1
Characteristic
Symbol
Value
Unit
Junction to Ambient 2,3 Natural Convection (Single layer board)
RθJA
24
°C/W
Junction to Ambient 2,4 Natural Convection (Four layer board 2s2p)
RθJA
18
°C/W
Junction to Ambient (@200 ft./min., Single layer board)
RθJMA
19
°C/W
Junction to Ambient (@200 ft./min., Four layer board 2s2p)
RθJMA
14
°C/W
RθJB
9
°C/W
RθJC
6
°C/W
ΨJT
2
°C/W
Junction to Board 5
Junction to Case 6
Junction to Package Top
1
2
3
4
5
7
Natural Convection
Thermal characteristics are targets based on simulation that are subject to change per device
characterization. This data is PRELIMINARY based on similar package used on other devices.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the
board, and board thermal resistance.
Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
21
Electrical Characteristics
6
Indicates the average thermal resistance between the die and the case top surface as measured by the
cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case
temperature.
7
Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per JEDEC JESD51-2.
Table 5. Thermal Characteristics, 516-pin TEPBGA Package1
Characteristic
1
2
3
4
5
6
7
Symbol
Value
Unit
Junction to Ambient 2,3 Natural Convection (Single layer board)
RθJA
25
°C/W
Junction to Ambient 2,4 Natural Convection (Four layer board 2s2p)
RθJA
18
°C/W
Junction to Ambient (@200 ft./min., Single layer board)
RθJMA
20
°C/W
Junction to Ambient (@200 ft./min., Four layer board 2s2p)
RθJMA
15
°C/W
Junction to Board 5
RθJB
10
°C/W
Junction to Case 6
RθJC
6
°C/W
Junction to Package Top 7 Natural Convection
ΨJT
2
°C/W
Thermal characteristics are targets based on simulation that are subject to change per device
characterization. This data is PRELIMINARY based on similar package used on other devices.
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the
board, and board thermal resistance.
Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
Indicates the average thermal resistance between the die and the case top surface as measured by the
cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case
temperature.
Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per JEDEC JESD51-2.
Table 6. Thermal Characteristics, 324-pin Package1
MPC5567 Thermal Characteristic
Symbol
Value
Unit
natural convection (one-layer board)
RθJA
29
°C/W
natural convection (four-layer board 2s2p)
RθJA
19
°C/W
Junction to ambient (@200 ft./min., one-layer board)
RθJMA
23
°C/W
Junction to ambient (@200 ft./min., four-layer board 2s2p)
RθJMA
16
°C/W
RθJB
10
°C/W
RθJC
7
°C/W
ΨJT
2
°C/W
Junction to ambient
2, 3,
Junction to ambient
1, 4,
5
Junction to board (four-layer board 2s2p)
Junction to case
6
Junction to package top
1
7,
natural convection
Thermal characteristics are targets based on simulation that are subject to change per device
characterization. This data is PRELIMINARY based on similar package used on other devices.
MPC5674F Microcontroller Data Sheet, Rev. 6
22
Freescale Semiconductor
Electrical Characteristics
2
3
4
5
6
7
4.2.1
Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the
board, and board thermal resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
Indicates the average thermal resistance between the die and the case top surface as measured by the
cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case
temperature.
Thermal characterization parameter indicating the temperature difference between package top and the
junction temperature per JEDEC JESD51-2.
General Notes for Specifications at Maximum Junction Temperature
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RθJA * PD)
Eqn. 1
where:
TA = ambient temperature for the package (oC)
RθJA = junction to ambient thermal resistance (oC/W)
PD = power dissipation in the package (W)
The junction to ambient thermal resistance is an industry standard value that provides a quick and easy estimation of thermal
performance. Unfortunately, there are two values in common usage: the value determined on a single layer board and the value
obtained on a board with two planes. For packages such as the TEPBGA, these values can be different by a factor of two. Which
value is closer to the application depends on the power dissipated by other components on the board. The value obtained on a
single layer board is appropriate for the tightly packed printed circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low power dissipation and the components are well separated.
When a heat sink is used, the thermal resistance is expressed as the sum of a junction to case thermal resistance and a case to
ambient thermal resistance:
RθJA = RθJC + RθCA
Eqn. 2
where:
RθJA = junction to ambient thermal resistance (oC/W)
RθJC = junction to case thermal resistance (oC/W)
RθCA = case to ambient thermal resistance (oC/W)
RθJC is device related and cannot be influenced by the user. The user controls the thermal environment to change the case to
ambient thermal resistance, RθCA. For instance, the user can change the size of the heat sink, the air flow around the device, the
interface material, the mounting arrangement on printed circuit board, or change the thermal dissipation on the printed circuit
board surrounding the device.
To determine the junction temperature of the device in the application when heat sinks are not used, the Thermal
Characterization Parameter (ΨJT) can be used to determine the junction temperature with a measurement of the temperature at
the top center of the package case using the following equation:
TJ = TT + (ΨJT x PD)
Eqn. 3
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
23
Electrical Characteristics
where:
TT = thermocouple temperature on top of the package (oC)
ΨJT = thermal characterization parameter (oC/W)
PD = power dissipation in the package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40 gauge type T thermocouple epoxied
to the top center of the package case. The thermocouple should be positioned so that the thermocouple junction rests on the
package. A small amount of epoxy is placed over the thermocouple junction and over about 1 mm. of wire extending from the
junction. The thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling effects
of the thermocouple wire.
References:
Semiconductor Equipment and Materials International
3081 Zanker Road
San Jose, CA 95134
(408) 943-6900
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at 800-854-7179 or
303-397-7956.
JEDEC specifications are available on the WEB at http://www.jedec.org.
•
•
•
C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine
Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47-54.
G. Kromann, S. Shidore, and S. Addison, “Thermal Modeling of a PBGA for Air-Cooled Applications,” Electronic
Packaging and Production, pp. 53-58, March 1998.
B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its Application
in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212-220.
4.3
EMI (Electromagnetic Interference) Characteristics
To find application notes that provide guidance on designing your system to minimize interference from radiated emissions, go
to www.freescale.com and perform a keyword search for “radiated emissions.” The following tables list the values of the
device's radiated emissions operating behaviors.
Table 7. EMC Radiated Emissions Operating Behaviors: 416 BGA
Symbol
VRE_TEM
Description
Radiated emissions,
electric field and
magnetic field
Conditions
VDD = 1.2 V
VDDE = 3.3 V
VDDEH = 5 V
TA = 25 °C
416 BGA
EBI off
CLK on
FM off
fOSC
fSYS
Frequency
band (MHz)
Level
(max.)
40 MHz crystal
264 MHz
(fEBI_CAL = 66
MHz)
0.15–50
26
50–150
30
150–500
34
500–1000
30
IEC and SAE level
I2
Unit Notes
dBμV
1
—
1, 3
MPC5674F Microcontroller Data Sheet, Rev. 6
24
Freescale Semiconductor
Electrical Characteristics
Table 7. EMC Radiated Emissions Operating Behaviors: 416 BGA (continued)
Symbol
VRE_TEM
1
2
3
4
5
Description
Radiated emissions,
electric field and
magnetic field
Conditions
VDD = 1.2 V
VDDE = 3.3 V
VDDEH = 5 V
TA = 25 °C
416 BGA
EBI off
CLK off
FM on4
fOSC
fSYS
Frequency
band (MHz)
Level
(max.)
40 MHz crystal
264 MHz
(fEBI_CAL = 66
MHz)
0.15–50
24
50–150
25
150–500
25
500–1000
21
IEC and SAE level
K5
Unit Notes
dBμV
1
—
1,3
Determined according to IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband TEM
Cell Method, and SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated Circuits—TEM/Wideband
TEM (GTEM) Cell Method.
I = 36 dBμV
Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method, and Appendix D of SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated
Circuits—TEM/Wideband TEM (GTEM) Cell Method.
“FM on” = FM depth of ±2%
K = 30 dBμV
Table 8. EMC Radiated Emissions Operating Behaviors: 516 BGA
Symbol
VRE_TEM
VRE_TEM
Description
Radiated emissions,
electric field and
magnetic field
Radiated emissions,
electric field and
magnetic field
fOSC
fSYS
Frequency
band (MHz)
Level
(max.)
VDD = 1.2 V
VDDE = 3.3 V
VDDEH = 5 V
TA = 25 °C
516 BGA
EBI on
CLK on
FM off
40 MHz crystal
264 MHz
(fEBI_CAL = 66
MHz)
0.15–50
40
50–150
48
150–500
48
500–1000
47
IEC and SAE level
VDD = 1.2 V
VDDE = 3.3 V
VDDEH = 5 V
TA = 25 °C
516 BGA
EBI on
CLK on
FM on4
40 MHz crystal
264 MHz
(fEBI_CAL = 66
MHz)
Conditions
Unit Notes
dBμV
1
G2
—
1, 3
0.15–50
40
dBμV
1
50–150
44
150–500
41
500–1000
36
IEC and SAE level
G2
—
1, 3
1
Determined according to IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband TEM
Cell Method, and SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated Circuits—TEM/Wideband
TEM (GTEM) Cell Method.
2 G = 48 dBμV
3
Specified according to Annex D of IEC Standard 61967-2, Measurement of Radiated Emissions—TEM Cell and Wideband
TEM Cell Method, and Appendix D of SAE Standard J1752-3, Measurement of Radiated Emissions from Integrated
Circuits—TEM/Wideband TEM (GTEM) Cell Method.
4
“FM on” = FM depth of ±2%
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
25
Electrical Characteristics
4.4
ESD Characteristics
Table 9. ESD Ratings1,2
Spec
Characteristic
Symbol
Value
Unit
1
ESD for Human Body Model (HBM)
VHBM
2000
V
2
ESD for Charged Device Model (CDM)
VCDM
750 (corners)
250 (other)
V
1
All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for Automotive Grade
Integrated Circuits.
2
A device will be defined as a failure if after exposure to ESD pulses the device no longer meets the device
specification requirements. Complete DC parametric and functional testing shall be performed per applicable
device specification at room temperature followed by hot temperature, unless specified otherwise in the
device specification.
4.5
PMC/POR/LVI Electrical Specifications
Note: For ADC internal resource measurements, see Table 21 in Section 4.9.1, “ADC Internal Resource Measurements.”
Table 10. PMC Operating conditions
Name
Parameter
Condition
Min
Typ
Max
Unit
Note
VDDREG
Supply voltage VDDREG LDO5V / SMPS5V mode
5V nominal
4.5
5
5.5
V
1
VDDREG
Supply voltage VDDREG LDO3V mode
3V nominal
3.0
3.3
3.6
V
1
VDD33
Supply voltage VDDSYN / LDO3V mode
VDD33 3.3V nominal
3.0
3.3
3.6
V
2
VDD
Supply voltage VDD
1.2V nominal
1.14
1.2
1.32
V
3
—
1
Voltage should be higher than maximum VLVDREG to avoid LVD event
Applies to both VDD33 (flash supply) and VDDSYN (PLL supply) pads. Voltage should be higher than maximum VLVD33
to avoid LVD event
3 Voltage should be higher than maximum V
LVD12 to avoid LVD event
2
NOTE
In the following table, "untrimmed” means “at reset" and "trimmed” means “after reset".
Table 11. PMC Electrical Specifications
ID
Name
Parameter
1
VBG
Nominal bandgap reference voltage
1a
—
Untrimmed bandgap reference voltage
2
VDD12OUT
Nominal VRC regulated 1.2V output VDD
Min
Typ
Max
Unit
—
0.620
—
V
VBG – 5%
VBG
VBG + 5%
V
—
1.2
—
V
MPC5674F Microcontroller Data Sheet, Rev. 6
26
Freescale Semiconductor
Electrical Characteristics
Table 11. PMC Electrical Specifications (continued)
ID
Name
Parameter
Min
Typ
Max
Unit
2a
—
Untrimmed VRC 1.2V output variation before band
gap trim (unloaded)
Note: Voltage should be higher than maximum
VLVD12 to avoid LVD event
VDD12OUT – 8% VDD12OUT VDD12OUT + 10%
V
2b
—
Trimmed VRC 1.2V output variation after band gap
trim (REGCTL load max. 20mA, VDD load max.
1A)1
VDD12OUT – 5% VDD12OUT VDD12OUT + 10%
V
2c
VSTEPV12
Trimming step VDD12OUT
—
10
—
mV
3
VPORC
POR rising VDD 1.2V
—
0.7
—
V
3a
—
POR VDD 1.2V variation
VPORC – 30%
VPORC
VPORC + 30%
3b
—
POR 1.2V hysteresis
—
75
—
mV
4
VLVD12
Nominal rising LVD 1.2V
Note: ~VDD12OUT × 0.87
—
1.100
—
V
4a
—
Untrimmed LVD 1.2V variation before band gap trim
Note: Rising VDD
VLVD12 – 6%
VLVD12
VLVD12 + 6%
V
4b
—
Trimmed LVD 1.2V variation after band gap trim
Rising VDD
VLVD12 – 3%
VLVD12
VLVD12 + 3%
V
4c
—
LVD 1.2V Hysteresis
15
20
25
mV
4d
VLVDSTEP12
Trimming step LVD 1.2V
—
10
—
mV
5
IREGCTL
VRC DC current output on REGCTL
—
—
20
mA
6
—
Voltage regulator 1.2V current consumption
VDDREG
—
3
—
mA
7
VDD33OUT
Nominal VREG 3.3V output
—
3.3
—
V
7a
—
Untrimmed VREG 3.3V output variation before band
gap trim (unloaded)
Note: Rising VDDSYN
VDD33OUT – 6% VDD33OUT VDD33OUT + 10%
V
7b
—
Trimmed VREG 3.3V output variation after band gap
trim (max. load 80mA)
VDD33OUT – 5% VDD33OUT VDD33OUT + 10%
V
7c
VSTEPV33
Trimming step VDDSYN
—
30
—
mV
8
VLVD33
Nominal rising LVD 3.3V
Note: ~VDD33OUT × 0.872
—
2.950
—
V
8a
—
Untrimmed LVD 3.3V variation before band gap trim
Note: Rising VDDSYN
VLVD33 – 5%
VLVD33
VLVD33 + 5%
V
8b
—
Trimmed LVD 3.3V variation after bad gap trim
Note: Rising VDDSYN
VLVD33 – 3%
VLVD33
VLVD33 + 3%
V
8c
—
LVD 3.3V Hysteresis
—
30
—
mV
8d
VLVDSTEP33
Trimming step LVD 3.3V
—
30
—
mV
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
27
Electrical Characteristics
Table 11. PMC Electrical Specifications (continued)
ID
Name
Parameter
Min
Typ
Max
Unit
9
IDD33
VREG 3.3V max DC output current
Note: Max current supplied by VDDSYN that does
not cause it to drop below VLVD33
—
—
60
mA
10
—
Voltage regulator 3.3V current consumption
VDDREG
Note: Except IDD33
—
2
—
mA
11
VPORREG
POR rising on VDDREG
—
2.00
—
V
11a —
POR VDDREG variation
11b —
POR VDDREG hysteresis
—
250
—
mV
12
Nominal rising LVD VDDREG
(LDO3V / LDO5V mode)
—
2.950
—
V
VLVDREG
VPORREG – 30% VPORREG VPORREG + 30%
V
12a —
Untrimmed LVD VDDREG variation before band
gap trim
Note: Rising VDDREG
VLVDREG – 5%
VLVDREG
VLVDREG + 5%
V
12b —
Trimmed LVD VDDREG variation after band gap
trim
Note: Rising VDDREG
VLVDREG – 3%
VLVDREG
VLVDREG + 3%
V
12c —
LVD VDDREG Hysteresis
(LDO3V / LDO5V mode)
—
30
—
mV
12d VLVDSTEPREG Trimming step LVD VDDREG
(LDO3V / LDO5V mode)
—
30
—
mV
13
—
4.360
—
V
VLVDREG
Nominal rising LVD VDDREG
(SMPS5V mode)
13a —
Untrimmed LVD VDDREG variation before band
gap trim
Note: Rising VDDREG
VLVDREG – 5%
VLVDREG
VLVDREG + 5%
V
13b —
Trimmed LVD VDDREG variation after band gap
trim
Note: Rising VDDREG
VLVDREG – 3%
VLVDREG
VLVDREG + 3%
V
13c —
LVD VDDREG Hysteresis
(SMPS5V mode)
—
50
—
mV
—
50
—
mV
—
4.60
—
V
13d VLVDSTEPREG Trimming step LVD VDDREG
(SMPS5V mode)
14
VLVDA
Nominal rising LVD VDDA
14a —
Untrimmed LVD VDDA variation before band gap
trim
VLVDA – 5%
VLVDA
VLVDA + 5%
V
14b —
Trimmed LVD VDDA variation after band gap trim
VLVDA – 3%
VLVDA
VLVDA + 3%
V
14c —
LVD VDDA Hysteresis
—
150
—
mV
14d VLVDASTEP
Trimming step LVD VDDA
—
20
—
mV
MPC5674F Microcontroller Data Sheet, Rev. 6
28
Freescale Semiconductor
Electrical Characteristics
Table 11. PMC Electrical Specifications (continued)
ID
Name
Parameter
Min
Typ
Max
Unit
15
—
SMPS regulator output resistance
Note: Pulup to VDDREG when high, pulldown to
VSSREG when low.
—
15
25
Ohm
16
—
SMPS regulator clock frequency (after reset)
1.0
1.5
2.0
MHz
17
—
SMPS regulator overshoot at start-up2
—
1.32
1.4
V
18
—
SMPS maximum output current
—
1.0
—
A
19
—
Voltage variation on current step2 (20% to 80% of
maximum current with 4 usec constant time)
—
—
0.1
V
1
VRC linear regulator is capable of sourcing a current up to 20 mA and sinking a current up to 500 uA. When using the
recommended ballast transistor the maximum output current provided by the voltage regulator VRC/ballast to the VDD core
voltage is up to 1A.
2 Parameter cannot be tested; this value is based on simulation and characterization.
4.6
Power Up/Down Sequencing
There is no power sequencing required among power sources during power up and power down in order to operate within
specification as long as the following two rules are met:
•
•
When VDDREG is tied to a nominal 3.3V supply, VDD33 and VDDSYN must be both shorted to VDDREG.
When VDDREG is tied to a 5V supply, VDD33 and VDDSYN must be tied together and shall be powered by the
internal 3.3V regulator.
The recommended power supply behavior is as follows: Use 25 V/millisecond or slower rise time for all supplies. Power up
each VDDE/VDDEH first and then power up VDD. For power down, drop VDD to 0 V first, and then drop all VDDE/VDDEH
supplies. There is no limit on the fall time for the power supplies.
Although there are no power up/down sequencing requirements to prevent issues like latch-up, excessive current spikes, etc.,
the state of the I/O pins during power up/down varies according to Table 12 and Table 13.
Table 12. Power Sequence Pin States for MH and AE pads
1
VDD
VDD33
VDDE
MH Pad
MH+LVDS Pads1
AE/up-down Pads
High
High
High
Normal operation
Normal operation
Normal operation
—
Low
High
Pin is tri-stated (output buffer,
input buffer, and weak pulls
disabled)
Outputs driven high
Pull-ups enabled,
pull-downs disabled
Low
High
Low
Output low,
pin unpowered
Outputs disabled
Output low,
pin unpowered
Low
High
High
Pin is tri-stated (output buffer,
input buffer, and weak pulls
disabled)
Outputs disabled
Pull-ups enabled,
pull-downs disabled
MH+LVDS pads are output-only.
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
29
Electrical Characteristics
Table 13. Power Sequence Pin States for F and FS pads
1
4.6.1
VDD
VDD33
VDDE
F and FS pads
low
low
high
Outputs drive high
low
high
—
Outputs Disabled
high
low
low
Outputs Disabled
high
low
high
Outputs drive high
high
high
low
Normal operation - except no drive current
and input buffer output is unknown.1
high
high
high
Normal Operation
The pad pre-drive circuitry will function normally but since VDDE is unpowered
the outputs will not drive high even though the output pmos can be enabled.
Power-Up
If VDDE/VDDEH is powered up first, then a threshold detector tristates all drivers connected to VDDE/VDDEH. There is no limit
to how long after VDDE/VDDEH powers up before VDD must power up. If there are multiple VDDE/VDDEH supplies, they can
be powered up in any order. For each VDDE/VDDEH supply not powered up, the drivers in that VDDE/VDDEH segment exhibit
the characteristics described in the next paragraph.
If VDD is powered up first, then all pads are loaded through the drain diodes to VDDE/VDDEH. This presents a heavy load that
pulls the pad down to a diode above VSS. Current injected by external devices connected to the pads must meet the current
injection specification. There is no limit to how long after VDD powers up before VDDE/VDDEH must power up.
The rise times on the power supplies are to be no faster than 25 V/millisecond.
4.6.2
Power-Down
If VDD is powered down first, then all drivers are tristated. There is no limit to how long after VDD powers down before
VDDE/VDDEH must power down.
If VDDE/VDDEH is powered down first, then all pads are loaded through the drain diodes to VDDE/VDDEH. This presents a heavy
load that pulls the pad down to a diode above VSS. Current injected by external devices connected to the pads must meet the
current injection specification. There is no limit to how long after VDDE/VDDEH powers down before VDD must power down.
There are no limits on the fall times for the power supplies.
4.6.3
Power Sequencing and POR Dependent on VDDA
During power up or down, VDDA can lag other supplies (of magnitude greater than VDDEH/2) within 1 V to prevent any
forward-biasing of device diodes that causes leakage current and/or POR. If the voltage difference between VDDA and VDDEH
is more than 1 V, the following will result:
•
•
•
Triggers POR (ADC monitors on VDDEH1 segment which powers the RESET pin) if the leakage current path created,
when VDDA is sufficiently low, causes sufficient voltage drop on VDDEH1 node monitored crosses low-voltage detect
level.
If VDDA is between 0–2 V, powering all the other segments (especially VDDEH1) will not be sufficient to get the part
out of reset.
Each VDDEH will have a leakage current to VDDA of a magnitude of ((VDDEH – VDDA – 1 V(diode drop)/200 KOhms)
up to (VDDEH/2 = VDDA + 1 V).
MPC5674F Microcontroller Data Sheet, Rev. 6
30
Freescale Semiconductor
Electrical Characteristics
•
4.7
Each VDD has the same behavior; however, the leakage will be small even though there is no current limiting resistor
since VDD = 1.32 V max.
DC Electrical Specifications
Table 14. DC Electrical Specifications1
Spec
Characteristic
Symbol
Min
Max
Unit
1
Core Supply Voltage (External Regulation)
VDD
1.14
1.322, 3
V
1a
Core Supply Voltage (Internal Regulation)4
VDD
1.08
1.32
V
2
I/O Supply Voltage (fast I/O pads)
VDDE
3.0
3.62, 5
V
3
I/O Supply Voltage (medium I/O pads)
VDDEH
3.0
5.252, 6
V
4
3.3 V I/O Buffer Voltage
VDD33
3.0
3.62, 5
V
VDDA
4.75
5.252, 6
V
5
Analog Supply Voltage
6a
SRAM Standby Voltage
Keep-out Range: 1.2V–2V
VSTBY_LOW
0.957
1.2
V
6b
SRAM Standby Voltage
Keep-out Range: 1.2V–2V
VSTBY_HIGH
2
6
V
7
Voltage Regulator Control Input Voltage8
VDDREG
2.79
5.52, 6
V
8
Clock Synthesizer Operating Voltage10
VDDSYN
3.0
3.62, 5
V
9
Fast I/O Input High Voltage
Hysteresis enabled
Hysteresis disabled
VIH_F
VDDE + 0.3
V
Fast I/O Input Low Voltage
Hysteresis enabled
Hysteresis disabled
VIL_F
Medium I/O Input High Voltage
Hysteresis enabled
Hysteresis disabled
VIH_S
Medium I/O Input Low Voltage
Hysteresis enabled
Hysteresis disabled
VIL_S
10
11
12
0.65 × VDDE
0.55 × VDDE
VSS – 0.3
V
0.35 × VDDE
0.40 × VDDE
VDDEH + 0.3
V
0.65 × VDDEH
0.55 × VDDEH
V
VSS – 0.3
0.35 × VDDEH
0.40 × VDDEH
13
Fast I/O Input Hysteresis
VHYS_F
0.1 × VDDE
—
V
14
Medium I/O Input Hysteresis
VHYS_S
0.1 × VDDEH
—
V
15
Analog Input Voltage
VINDC
VSSA – 0.1
VDDA + 0.1
V
16
Fast I/O Output High Voltage11
VOH_F
0.8 × VDDE
—
V
17
Medium I/O Output High Voltage12
VOH_S
0.8 × VDDEH
—
V
18
Fast I/O Output Low Voltage11
VOL_F
—
0.2 × VDDE
V
19
Medium I/O Output Low Voltage12
VOL_S
—
0.2 × VDDEH
V
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
31
Electrical Characteristics
Table 14. DC Electrical Specifications1 (continued)
Spec
Characteristic
Symbol
Min
Max
Unit
—
—
—
—
10
20
30
50
pF
pF
pF
pF
Load Capacitance (Fast I/O)13
DSC(PCR[8:9]) = 0b00
DSC(PCR[8:9]) = 0b01
DSC(PCR[8:9]) = 0b10
DSC(PCR[8:9]) = 0b11
CL
21
Input Capacitance (Digital Pins)
CIN
—
7
pF
22
Input Capacitance (Analog Pins)
CIN_A
—
10
pF
23
Input Capacitance (Digital and Analog Pins14)
CIN_M
—
12
pF
24
Operating Current 1.2 V Supplies @ fsys = 264 MHz
VDD @1.32 V
VSTBY15 @1.2 V and 85oC
VSTBY @6.0 V and 85oC
IDD
IDDSTBY
IDDSTBY6
—
—
—
1.016
0.10
0.15
A
mA
mA
IDD33
note17
718
mA
mA
3019
1.0
22
mA
mA
mA
20
25
26
27
28
29
Operating Current 3.3 V Supplies @ fsys = 264 MHz
VDD3317
VDDSYN
IDDSYN
—
—
Operating Current 5.0 V Supplies @ fsys = 264 MHz
VDDA
Analog Reference Supply Current (Transient)
VDDREG
IDDA
IREF
IREG
—
—
—
Operating Current VDDE/VDDEH20 Supplies
VDDE2
VDDEH1
VDDEH3
VDDEH4
VDDEH5
VDDEH6
VDDEH7
IDD2
IDD1
IDD3
IDD4
IDD5
IDD6
IDD7
—
—
—
—
—
—
—
note20
mA
mA
mA
mA
mA
mA
mA
IACT_F
42
158
μA
15
35
95
200
μA
μA
IINACT_D
–2.5
2.5
μA
IIC
–1.0
1.0
mA
IINACT_A
–250
250
nA
–150
150
nA
VSS – VSSA
–100
100
mV
VRL
VSSA
VSSA + 100
mV
Fast I/O Weak Pull Up/Down Current21
3.0 V–3.6 V
Medium I/O Weak Pull Up/Down Current22
3.0 V–3.6 V
4.5 V–5.5 V
30
I/O Input Leakage Current23
31
DC Injection Current (per pin)
32
Analog Input Current, Channel Off24, AN[0:7], AN38,
AN39
Analog Input Current, Channel Off, all other analog
inputs AN[x]
33
VSS Differential Voltage
34
Analog Reference Low Voltage
IACT_S
MPC5674F Microcontroller Data Sheet, Rev. 6
32
Freescale Semiconductor
Electrical Characteristics
Table 14. DC Electrical Specifications1 (continued)
Spec
Characteristic
35
VRL Differential Voltage
36
Analog Reference High Voltage
37
VREF Differential Voltage
38
VSSSYN to VSS Differential Voltage
39
Operating Temperature Range—Ambient (Packaged)
40
Slew rate on power supply pins
Symbol
Min
Max
Unit
VRL – VSSA
–100
100
mV
VRH
VDDA – 100
VDDA
mV
VRH – VRL
4.75
5.25
V
VSSSYN – VSS
–100
100
mV
TA (TL to TH)
–40.0
125.0
—
—
25
ο
C
V/ms
1
These specifications are design targets and subject to change per device characterization.
Voltage overshoots during a high-to-low or low-to-high transition must not exceed 10 seconds per instance.
3 2.0 V for 10 hours cumulative time, 1.2 V +10% for time remaining.
4 Assumed with DC load.
5 5.3 V for 10 hours cumulative time, 3.3 V +10% for time remaining.
6 6.4 V for 10 hours cumulative time, 5.0 V +10% for time remaining.
7 V
STBY below 0.95 V the RAM will not retain states, but will be operational. VSTBY can be 0 V when bypass standby mode.
8 Regulator is functional with derated performance, with supply voltage down to 4.0 V for system with V
DDREG = 4.5 V (min).
9 2.7 V minimum operating voltage allowed during vehicle crank for system with V
=
3.0
V
(min).
Normal
operating voltage
DDREG
should be either VDDREG = 3.0 V (min) or 4.5 V (min) depending on the user regulation voltage system selected.
10 Required to be supplied when 3.3 V regulator is disabled. See Section 4.5, “PMC/POR/LVI Electrical Specifications.”
11 I
OH_F = {12,20,30,40} mA and IOL_F = {24,40,50,65} mA for {00,01,10,11} drive mode with VDDE = 3.0 V
12 I
OH_S = {11.6} mA and IOL_S = {17.7} mA for {medium} I/O with VDDE = 4.5 V;
IOH_S = {5.4} mA and IOL_S = {8.1} mA for {medium} I/O with VDDE = 3.0 V
13 Applies to D_CLKOUT, external bus pins, and Nexus pins.
14 Applies to the FCK, SDI, SDO, and SDS_B pins.
15 V
o
STBY current specified at 1.0 V at a junction temperature of 85 C. VSTBY current is 700 µA maximum at a junction temperature
o
of 150 C.
16 Preliminary. Specification pending typical and/or high-use Runidd pattern simulation as well as final silicon characterization.
900 mA based on transistor count estimate at Worst Case (wcs) process and temperature condition.
17 Power requirements for the V
DD33 supply depend on the frequency of operation and load of all I/O pins, and the voltages on
the I/O segments. See Section 4.7.2, “I/O Pad VDD33 Current Specifications,” for information on both fast (F, FS) and medium
(MH) pads. Also refer to Table 16 for values to calculate power dissipation for specific operation.
18
This value is a target that is subject to change.
19 This value allows a 5 V reference to supply ADC + REF.
20 Power requirements for each I/O segment depend on the frequency of operation and load of the I/O pins on a particular I/O
segment, and the voltage of the I/O segment. See Section 4.7.1, “I/O Pad Current Specifications,” for information on I/O pad
power. Also refer to Table 15 for values to calculate power dissipation for specific operation. The total power consumption of
an I/O segment is the sum of the individual power consumptions for each pin on the segment.
21
Absolute value of current, measured at VIL and VIH.
22 Absolute value of current, measured at V and V .
IL
IH
23 Weak pull up/down inactive. Measured at V
DDE = 3.6 V and VDDEH = 5.25 V. Applies to pad types F and MH.
24
Maximum leakage occurs at maximum operating temperature. Leakage current decreases by approximately one-half for each
8 to 12 oC, in the ambient temperature range of 50 to 125 oC. Applies to pad types AE and AE/up-down. See Appendix A,
Signal Properties and Muxing.
2
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
33
Electrical Characteristics
4.7.1
I/O Pad Current Specifications
The power consumption of an I/O segment is dependent on the usage of the pins on a particular segment. The power
consumption is the sum of all output pin currents for a particular segment. The output pin current can be calculated from
Table 15 based on the voltage, frequency, and load on the pin. Use linear scaling to calculate pin currents for voltage, frequency,
and load parameters that fall outside the values given in Table 15.
The AC timing of these pads are described in the Section 4.11.2, “Pad AC Specifications.”
Table 15. VDDE/VDDEH I/O Pad Average DC Current1
Spec
Pad Type
Symbol
Frequency
(MHz)
Load2
(pF)
Voltage
(V)
Drive/Slew
Rate Select
Current (mA)
1
Medium
IDRV_MH
50
50
5.25
11
16.0
2
20
50
5.25
01
6.3
3
3.0
50
5.25
00
1.1
4
2.0
200
5.25
00
2.4
66
10
3.6
00
6.5
6
66
20
3.6
01
9.4
7
66
30
3.6
10
10.8
8
66
50
3.6
11
33.3
66
50
3.6
11
12.0
50
50
3.6
10
6.2
11
33.33
50
3.6
01
4.0
12
20
50
3.6
00
2.4
13
20
200
3.6
00
8.9
5
9
10
1
2
Fast
Fast w/ Slew
Control
IDRV_FC
IDRV_FSR
These are average IDDE numbers for worst case PVT from simulation. Currents apply to output pins only.
All loads are lumped.
4.7.2
I/O Pad VDD33 Current Specifications
The power consumption of the VDD33 supply is dependent on the usage of the pins on all I/O segments. The power consumption
is the sum of all input and output pin VDD33 currents for all I/O segments. The VDD33 current draw on fast speed pads can be
calculated from Table 16 dependent on the voltage, frequency, and load on all F type pins. The VDD33 current draw on medium
pads can be calculated from Table 16 dependent on voltage and independent on the frequency and load on all MH type pins.
Use linear scaling to calculate pin currents for voltage, frequency, and load parameters that fall outside the values given in
Table 16.
The AC timing of these pads are described in the Section 4.11.2, “Pad AC Specifications.”
MPC5674F Microcontroller Data Sheet, Rev. 6
34
Freescale Semiconductor
Electrical Characteristics
Table 16. VDD33 Pad Average DC Current1
Spec
Pad Type
Symbol
Frequency
(MHz)
Load2
(pF)
VDD33
(V)
VDDE
(V)
Drive/Slew
Rate Select
Current (mA)
1
Medium
I33_MH
—
—
3.6
5.5
—
0.0007
2
Fast
I33_FC
66
10
3.6
3.6
00
0.92
3
66
20
3.6
3.6
01
1.14
4
66
30
3.6
3.6
10
1.50
5
66
50
3.6
3.6
11
2.19
66
50
3.6
3.6
11
0.74
50
50
3.6
3.6
10
0.52
8
33.33
50
3.6
3.6
00
0.19
9
20
50
3.6
3.6
00
0.19
10
20
200
3.6
3.6
00
0.19
6
7
Fast w/
Slew
Control
I33_FSR
1
These are average IDDE for worst case PVT from simulation. Currents apply to output pins only for the fast pads and to input
pins only for the medium pads.
2 All loads are lumped.
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
35
Electrical Characteristics
4.7.3
LVDS Pad Specifications
LVDS pads are implemented to support the MSC (Microsecond Channel) protocol, which is an enhanced feature of the DSPI
module.
Table 17. DSPI LVDS Pad Specification 1, 2
(VDD33 = 3.0 V to 3.6 V, VDDEH = 4.75 V to 5.25 V, TA = TL to TH)
Spec
Characteristic
Symbol
Min
Typical
Max
Unit
fLVDSCLK
—
40
—
MHz
Data Rate
1
Data Frequency
Driver Specs
2
Differential Output Voltage
VOD
150
—
400
mV
3
Common Mode Voltage (LVDS), VOS
VOS
1.075
1.2
1.325
V
4
Rise/Fall Time
tR or tF
—
2
—
ns
5
Delay, Z to Normal (High/Low)
tDZ
—
500
—
ns
6
Differential Skew between Positive and
Negative LVDS Pair
I tphla – tplhb I or I tplhb – tphla I
tSkew
—
—
0.5
ns
ZO
95
100
105
ohm
Termination
7
1
2
Transmission Line (Differential)
These are typical values that are estimated from simulation.
These specifications are subject to change per device characterization.
4.8
Oscillator and FMPLL Electrical Characteristics
Table 18. FMPLL Electrical Specifications1
(VDDSYN = 3.0 V to 3.6 V, VSS = VSSSYN = 0 V, TA = TL to TH)
Spec
Symbol
Min
Max
fref_crystal
fref_crystal
fref_ext
fref_ext
8
40
8
40
20
403
20
40
PLL Frequency 4
Enhanced Mode
fPLL
fvco(min) ÷ 64
fmax
MHz
3
Loss of Reference Frequency5
fLOR
100
1000
kHz
4
Self Clocked Mode Frequency6
fSCM
4
16
MHz
tLPLL
—
<750
μs
tDC
40
60
%
1
2
Characteristic
PLL Reference Frequency Range2 (Normal Mode)
Crystal Reference (PLLCFG2 = 0b0)
Crystal Reference (PLLCFG2 = 0b1)
External Reference (PLLCFG2 = 0b0)
External Reference(PLLCFG2 = 0b1)
Time7
5
PLL Lock
6
Duty Cycle of Reference 8, 9
Unit
MHz
MPC5674F Microcontroller Data Sheet, Rev. 6
36
Freescale Semiconductor
Electrical Characteristics
Table 18. FMPLL Electrical Specifications1 (continued)
(VDDSYN = 3.0 V to 3.6 V, VSS = VSSSYN = 0 V, TA = TL to TH)
Spec
Characteristic
Symbol
Min
Max
Unit
7
Frequency un-LOCK Range
fUL
–4.0
4.0
% fsys
8
Frequency LOCK Range
fLCK
–2.0
2.0
% fsys
9
D_CLKOUT Period Jitter10, 11 Measured at fSYS Max
Cycle-to-cycle Jitter
CJitter
–5
5
%fclko
10
Peak-to-Peak Frequency Modulation Range Limit 12,13
(fsys Max must not be exceeded)
Cmod
0
4
%fsys
11
FM Depth Tolerance14
Cmod_err
–0.25
0.25
%fsys
12
VCO Frequency
fVCO
192
600
MHz
13
Modulation Rate Limits15
fmod
0.400
1
MHz
fprediv
4
10
MHz
14
16
Predivider output frequency range
ut
1
All values given are initial design targets and subject to change.
Crystal and External reference frequency limits depend on device relying on PLL to lock prior to release of reset, default
PREDIV/EPREDIV, MFD/EMFD default settings, and VCO frequency range. Absolute minimum loop frequency is 4 MHz.
3 Upper tolerance of less than 1% is allowed on 40MHz crystal.
4 All internal registers retain data at 0 Hz.
5 “Loss of Reference Frequency” is the reference frequency detected internally, which transitions the PLL into self clocked mode.
6 Self clocked mode frequency is the frequency that the PLL operates at when the reference frequency falls below f
LOR. This
frequency is measured at D_CLKOUT with the divider set to divide-by-2 of the system clock. NOTE: in SCM, the PLL is running
open loop at a centercode 0x4. The MFD has no effect and the RFD is bypassed.
7 This specification applies to the period required for the PLL to re-lock after changing the MFD frequency control bits in the
synthesizer control register (SYNCR). From power up with crystal oscillator reference, lock time will be additive with crystal
startup time.
8 For Flexray operation, duty cycle requirements are higher.
9 Duty cycle can be 20–80% when PLL is used with a pre-divider greater than 1.
10 Jitter is the average deviation from the programmed frequency measured over the specified interval at maximum f .
sys
Measurements are made with the device powered by filtered supplies and clocked by a stable external clock signal. Noise
injected into the PLL circuitry via VDDSYN and VSSSYN and variation in crystal oscillator frequency increase the Cjitter
percentage for a given interval. D_CLKOUT divider set to divide-by-2.
11
Values are with frequency modulation disabled. If frequency modulation is enabled, jitter is the sum of Cjitter + Cmod.
12 Modulation depth selected must not result in f value greater than the f maximum specified value.
pll
pll
13 Maximum and minimum variation from programmed modulation depth is pending characterization. Depth settings available in
control register are: 1%, 2%, 3%, and 4% peak-to-peak.
14 Depth tolerance is the programmed modulation depth ±0.25% of F . Initial design target pending silicon evaluation.
sys
15
Modulation rates less than 400 kHz will result in exceedingly long FM calibration durations. Modulation rates greater than 1 MHz
will result in reduced calibration accuracy.
16
Violating this range will cause the VCO max/min range to be violated with the default MFD settings out of reset.
2
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
37
Electrical Characteristics
Table 19. Oscillator Electrical Specifications1
(VDDSYN = 3.0 V to 3.6 V, VSS = VSSSYN = 0 V, TA = TL to TH)
Spec
Characteristic
Symbol
Min
Max
Unit
1
Crystal Mode Differential Amplitude2
(Min differential voltage between EXTAL and XTAL)
Vcrystal_diff_amp
| Vextal – Vxtal |
> 0.4 V
—
V
2
Crystal Mode: Internal Differential Amplifier Noise
Rejection
Vcrystal_diff_amp_nr
—
| Vextal – Vxtal |
< 0.2 V
V
3
EXTAL Input High Voltage
Bypass mode, External Reference
VIHEXT
((VDD33/2) + 0.4 V)
—
V
4
EXTAL Input Low Voltage
Bypass mode, External Reference
VILEXT
—
(VDD33/2) – 0.4 V
V
5
XTAL Current3
IXTAL
1
3
mA
6
Total On-chip stray capacitance on XTAL
CS_XTAL
—
1.5
pF
7
Total On-chip stray capacitance on EXTAL
CS_EXTAL
—
1.5
pF
8
Crystal manufacturer’s recommended capacitive
load
CL
See crystal spec
See crystal spec
pF
9
Discrete load capacitance to be connected to EXTAL
CL_EXTAL
—
(2 × CL – CS_EXTAL
– CPCB_EXTAL4)
pF
10
Discrete load capacitance to be connected to XTAL
CL_XTAL
—
(2 × CL – CS_XTAL
– CPCB_XTAL4)
pF
1
All values given are initial design targets and subject to change.
This parameter is meant for those who do not use quartz crystals or resonators, but instead use CAN oscillators in crystal mode.
In that case, Vextal – Vxtal ≥ 400 mV criterion has to be met for oscillator’s comparator to produce output clock.
3 I
xtal is the oscillator bias current out of the XTAL pin with both EXTAL and XTAL pins grounded.
4 C
PCB_EXTAL and CPCB_XTAL are the measured PCB stray capacitances on EXTAL and XTAL, respectively.
2
MPC5674F Microcontroller Data Sheet, Rev. 6
38
Freescale Semiconductor
Electrical Characteristics
4.9
eQADC Electrical Characteristics
Table 20. eQADC Conversion Specifications (Operating)
Spec
1
2
3
4
5
6
7
8
Characteristic
Symbol
Min
Max
Unit
fADCLK
2
16
MHz
2 + 14
128 + 14
2 + 12
128 + 12
2 + 10
128 + 10
1
ADC Clock (ADCLK) Frequency
2
Conversion Cycles
Single Ended Conversion Cycles 12 bit
resolution
Single Ended Conversion Cycles 10 bit
resolution
Single Ended Conversion Cycles 8 bit
resolution
Note: Differential conversion (min) is one clock
cycle less than the single-ended
conversion values listed here.
CC
3
Stop Mode Recovery Time1
TSR
10
—
μs
4
Resolution2
—
1.25
—
mV
5
INL: 8 MHz ADC Clock3
INL8
–44
44
LSB5
6
INL: 16 MHz ADC Clock3
INL16
–84
84
LSB
7
DNL: 8 MHz ADC Clock3
DNL8
–34
34
LSB
8
DNL: 16 MHz ADC Clock3
DNL16
–34
34
LSB
9
Offset Error without Calibration
OFFNC
04
1004
LSB
10
Offset Error with Calibration
OFFWC
–44
44
LSB
11
Full Scale Gain Error without Calibration
GAINNC
–1204
04
LSB
12
Full Scale Gain Error with Calibration
GAINWC
–44,6
44,6
LSB
13
Non-Disruptive Input Injection Current
7, 8, 9, 10
IINJ
–3
3
mΑ
14
Incremental Error due to injection current11, 12
EINJ
—
+44
Counts
15
TUE value at 8 MHz 13, 14 (with calibration)
TUE8
—
+44,6
Counts
16
TUE value at 16 MHz 13, 14 (with calibration)
TUE16
—
+8
Counts
ADCLK cycles
Stop mode recovery time is the time from the setting of either of the enable bits in the ADC Control Register to the time that
the ADC is ready to perform conversions.Delay from power up to full accuracy = 8 ms.
At VRH – VRL = 5.12 V, one count = 1.25 mV without using pregain.
INL and DNL are tested from VRL + 50 LSB to VRH – 50 LSB. The eQADC is guaranteed to be monotonic at 10 bit accuracy
(12 bit resolution selected).
New design target. Actual specification will change following characterization. Margin for manufacturing has not been fully
included.
At VRH – VRL = 5.12 V, one LSB = 1.25 mV.
The value is valid at 8 MHz, it is ±8 counts at 16 Mhz.
Below disruptive current conditions, the channel being stressed has conversion values of $3FF for analog inputs greater than
VRH and $000 for values less than VRL. Other channels are not affected by non-disruptive conditions.
Exceeding limit may cause conversion error on stressed channels and on unstressed channels. Transitions within the limit do
not affect device reliability or cause permanent damage.
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
39
Electrical Characteristics
9
Input must be current limited to the value specified. To determine the value of the required current-limiting resistor, calculate
resistance values using VPOSCLAMP = VDDA + 0.5 V and VNEGCLAMP = –0.3 V, then use the larger of the calculated values.
10
Condition applies to two adjacent pins at injection limits.
11
Performance expected with production silicon.
12
All channels have same 10 kΩ < Rs < 100 kΩ Channel under test has Rs = 10 kΩ, IINJ=IINJMAX,IINJMIN.
13
The TUE specification is always less than the sum of the INL, DNL, offset, and gain errors due to cancelling errors.
14 TUE does not apply to differential conversions.
4.9.1
ADC Internal Resource Measurements
Table 21. Power Management Control (PMC) Specification
Spec
Characteristic
Symbol
Min
Typical
Max
Unit
PMC Normal Mode
1
Bandgap 0.62 V
ADC0 channel 145
VADC145
—
0.62
—
V
2
Bandgap 1.2 V
ADC0 channel 146
VADC146
—
1.22
—
V
3
Vreg1p2 Feedback
ADC0 channel 147
VADC147
—
VDD / 2.045
—
V
4
LVD 1.2 V
ADC0 channel 180
VADC180
—
VDD / 1.774
—
V
5
Vreg3p3 Feedback
ADC0 channel 181
VADC181
—
Vreg3p3 / 5.460
—
V
6
LVD 3.3 V
ADC0 channel 182
VADC182
—
Vreg3p3 / 4.758
—
V
7
LVD 5.0 V
ADC0 channel 183
— LDO mode
— SMPS mode
VADC183
—
—
V
VDDREG / 4.758
VDDREG/7.032
Table 22. Standby RAM Regulator Electrical Specifications
Spec
Characteristic
Symbol
Min
Typ
Max
Unit
Normal Mode
1
Standby Regulator Output
ADC1 channel 194
VADC194
—
1.2
—
V
2
Standby Source Bias
150 mV to 360 mV (30mV Increment @
vref_sel)
ADC1 channel 195
Default Value 150 mV (@vref_sel = 1 1 1)
VADC195
150
—
360
mV
3
Standby Brownout Reference
ADC1 channel 195
VADC195
500
850
mV
MPC5674F Microcontroller Data Sheet, Rev. 6
40
Freescale Semiconductor
Electrical Characteristics
Table 23. ADC Band Gap Reference / LVI Electrical Specifications
Spec
Characteristic
Symbol
Min
Typ
Max
Unit
1
4.75 LVD (from VDDA)
ADC1 channel 196
VADC196
—
4.75
—
V
2
ADC Bandgap
ADC0 channel 45
ADC1 channel 45
VADC45
—
1.220
—
V
Table 24. Temperature Sensor Electrical Specifications
Spec
1
Characteristic
1
Slope
–40 °C to 100 °C ±1.0 °C
100 °C to 150 °C ±1.6 °C
ADC0 channel 128
ADC1 channel 128
2
Accuracy
–40 °C to 150 °C
ADC0 channel 128
ADC1 channel 128
Symbol
Min
Typ
Max
Unit
VSADC128 1
—
5.8
—
mV/ °C
—
—
—
°C
±10.0
Slope is the measured voltage change per °C.
4.10
C90 Flash Memory Electrical Characteristics
Table 25. Flash Program and Erase Specifications1
Spec
Characteristic
Symbol
Min
Initial
Max2
Max3
Unit
1
Double Word (64 bits) Program Time4
tdwprogram
—
—
500
μs
2
Page Program Time4,5
tpprogram
—
160
500
μs
3
16 KB Block Pre-program and Erase Time
t16kpperase
—
1000
5000
ms
4
64 KB Block Pre-program and Erase Time
t64kpperase
—
1800
5000
ms
5
128 KB Block Pre-program and Erase Time
t128kpperase
—
2600
7500
ms
6
256 KB Block Pre-program and Erase Time
t256kpperase
—
5200
15000
ms
7
Minimum operating frequency
—
250
—
—
kHz
1
Typical program and erase times assume nominal supply values and operation at 25 oC. All times are subject to change
pending device characterization.
2 Initial factory condition: ≤ 100 program/erase cycles, 25 oC, typical supply voltage, 80 MHz minimum system frequency.
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
41
Electrical Characteristics
3
The maximum erase time occurs after the specified number of program/erase cycles. This maximum value is characterized
but not guaranteed.
4
Actual hardware programming times. This does not include software overhead.
5
Page size is 128 bits (4 words).
Table 26. Flash EEPROM Module Life
Spec
Characteristic
Symbol
Min
Typical1
Unit
1
Number of Program/Erase cycles per block for 16 KB and 64
KB blocks over the operating temperature range (TJ)
P/E
100,000
—
cycles
2
Number of Program/Erase cycles per block for 128 KB and
256 KB blocks over the operating temperature range (TJ)
P/E
1,000
100,000
cycles
3
Minimum Data Retention at 25 °C ambient temperature2
Blocks with 0–1,000 P/E cycles
Blocks with 1,001–10,000 P/E cycles
Blocks with 10,001–100,000 P/E cycles
20
10
1–5
—
Retention
years
1
Typical endurance is evaluated at 25 °C. Product qualification is performed to the minimum specification. For additional
information on the Freescale definition of Typical Endurance, please refer to Engineering Bulletin EB619, Typical Endurance
for Nonvolatile Memory.
2 Ambient temperature averaged over duration of application, not to exceed product operating temperature range.
Table 27 shows the Platform Flash Configuration Register 1 (PFCPR1) settings versus frequency of operation. Refer to the
device reference manual for definitions of these bit fields.
Table 27. PFCPR1 Settings vs. Frequency of Operation1
Spec
Clock
Mode
Maximum Frequency2
(MHz)
Core
fsys
264 MHz6
APC =
RWSC
WWSC
132 MHz6
0b1007
Platform
fplatf
DPFEN3
IPFEN3
PFLIM4
BFEN5
0b01
0b0
0b1
0b0
0b1
0b00
0b01
0b1x
0b0
0b1
1
Enhanced
2
Enhanced/ 200 MHz
Full
100 MHz
0b0107
0b01
0b0
0b1
0b0
0b1
0b00
0b01
0b1x
0b0
0b1
3
Enhanced/ 180 MHz
Full
90 MHz
0b0107
0b01
0b0
0b1
0b0
0b1
0b00
0b01
0b1x
0b0
0b1
4
Legacy
132 MHz
0b0117
0b01
0b0
0b1
0b0
0b1
0b00
0b01
0b1x
0b0
0b1
0b111
0b11
0b00
0b00
0b00
0b0
132 MHz
Default setting after reset:
1
Illegal combinations exist. Use entries from the same row in this table.
This is the nominal maximum frequency of operation: platform runs at fsys/2 in Enhanced Mode .
3 For maximum flash performance, set to 0b1.
4
For maximum flash performance, set to 0b10.
2
MPC5674F Microcontroller Data Sheet, Rev. 6
42
Freescale Semiconductor
Electrical Characteristics
5
For maximum flash performance, set to 0b1.
This is the nominal maximum frequency of operation in Enchanced Mode. Max speed is the maximum speed
allowed including frequency modulation (FM). 270 MHz parts allow for 264 MHz system core clock(fsys)+ 2% FM
and 132 Mhz platform clock (fplatf)+ 2% FM.
7
Preliminary setting. Final setting pending characterization.
6
4.11
AC Specifications
4.11.1
Clocking
The Figure 16 shows the operating frequency domains of various blocks on MPC5674F.
PLLCFG[0:1]
CORE
EXTAL
SYSDIV
÷X
PLL
fsys
÷2
IPG DIV SEL
SIU_SYSDIV[SYSCLKDIV[0:1]]
X = 2, 4, 8, or 16
ETPU DIV SEL
SIU_SYSDIV[BYPASS]
X=1
SIU_SYSDIV[IPCLKDIV[0:1]]
PLATFORM /
BLOCKS /
FLASH
fplatf
fperiph
fetpu
DIV
eTPU /
NDEDI
febi_cal
EBI
CAL BUS
SIU_ECCR[EBDF[0:1]]
Note: tcycsys = 1 / fsys
tcyc = 1 / fplatf
÷ 2 = divide-by-2
÷ X = divide-by-X, depending on SIU_SYSDIV[BYPASS]
and SIU_SYSDIV[SYSCLKDIV].
D_CLKOUT
(D_CLKOUT is not available
on all packages and cannot
be programmed for faster
than fsys/2.)
Figure 16. MPC5674F Block Operating Frequency Domain Diagram
Table 28 shows the operating frequencies of various blocks depending on the device’s clocking mode configuration settings (see
Table 29 and Table 30 for descriptions of bit settings).
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
43
Electrical Characteristics
Table 28. MPC5674F Operating Frequencies1, 2
fplatf
fsys
SIU_ECCR
[EBDF[0:1]]3
(core)
Enhanced
01
11
264
264
132
132
Full
01
11
200
200
Legacy
01
11
132
132
Mode
1
2
3
4
5
fetpu
febi_cal4,5
Unit
132
132
66
33
MHz
100
100
200
200
50
25
MHz
132
132
132
132
66
33
MHz
(platform and all blocks (eTPU, eTPU RAM,
except eTPU)
and NDEDI)
The values in the table are specified at:
VDD = 1.02 V to 1.32 V
VDDE = 3.0 V to 3.6 V
VDDEH = 4.5 V to 5.5 V
VDD33 and VDDSYN = 3.0 V to 3.6 V
TA = TL to TH.
Up to the maximum frequency rating of the device (refer to Table 1). The fsys speed is the nominal maximum frequency.
270 Mhz parts allow for 264 Mhz system clock + 2% FM.
See the MPC5674F Reference Manual for full description as not all bit combinations are valid.
EBI/Calibration bus is not available in all packages.
The EBI/Calibration Bus operating frequency, febi_cal , depends on clock divider settings of block’s max allowed
frequency of operation. Normally febi_cal = fplatf /2, but can be limited to < fplatf /2 in Full Mode.
Table 29. IPCLKDIV Settings
SIU_SYSDIV
[IPCLKDIV[0:1]]
Mode
00
Enhanced
01
Full
10
—
11
Legacy
Description
CPU frequency is doubled (Max 264Mhz). Platform,
peripheral, and eTPU clocks are 1/2 of CPU frequency
CPU and eTPU frequency is doubled (Max 200Mhz).
Platform and peripheral clocks are 1/2 of CPU frequency.
Reserved
CPU, eTPU, platform, and peripheral’s clocks all run at
same speed (Max 132Mhz).
Table 30. SYSCLKDIV Settings
SIU_SYSDIV
[SYSCLKDIV[0:1]]
Description
00
Divide by 2.
01
Divide by 4.
10
Divide by 8.
11
Divide by 16.
MPC5674F Microcontroller Data Sheet, Rev. 6
44
Freescale Semiconductor
Electrical Characteristics
4.11.2
Pad AC Specifications
Table 31. Pad AC Specifications (VDDEH = 5.0 V, VDDE = 3.3 V)1
Spec
Pad
SRC/DSC
Out Delay2,4
L → H/H → L (ns)
1
Medium5
00
152/165
70/74
50
205/220
96/96
200
2
3
01
4
5
11
6
Fast6
7
01
9
10
10
11
Fast with Slew Rate
00
12
13
01
14
15
10
16
17
11
18
1
2
3
4
5
6
Load Drive
(pF)
28/34
12/15
50
52/59
28/31
200
12/12
5.3/5.9
50
32/32
22/22
200
00
8
11
Rise/Fall3,4
(ns)
10
2.5
1.2
20
30
50
40/40
16/16
50
50/50
21/21
200
13/13
5/5
50
19/19
8/8
200
8/8
2.4/2.4
50
12/12
5/5
200
5/5
1.1/1/1
50
8/8
2.6
2.6
19
Pull Up/Down (3.6 V max)
—
—
7500
50
20
Pull Up/Down (5.25 V max)
—
6000
5000/5000
50
These are worst case values that are estimated from simulation and not tested. The values in the table are simulated at
VDD = 1.02 V to 1.32 V, VDDE = 3.0 V to 3.6 V, VDDEH = 4.75 V to 5.25 V, VDD33 and VDDSYN = 3.0 V to 3.6 V, TA = TL to TH.
This parameter is supplied for reference and is not guaranteed by design and not tested.
This parameter is guaranteed by characterization before qualification rather than 100% tested.
Delay and rise/fall are measured to 20% or 80% of the respective signal.
Out delay is shown in Figure 17. Add a maximum of one system clock to the output delay for delay with respect to system clock.
Out delay is shown in Figure 17. Add a maximum of one system clock to the output delay for delay with respect to system clock.
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
45
Electrical Characteristics
Table 32. Derated Pad AC Specifications (VDDEH = 3.3 V)1
Spec
Pad
SRC/DSC
Out Delay2,3
L → H/H → L (ns)
Rise/Fall4,3
(ns)
Load Drive
(pF)
1
Medium5
00
200/210
86/86
50
270/285
120/120
200
37/45
15.5/19
50
69/82
38/43
200
18/17
7.6/8.5
50
46/49
30/34
200
2
3
01
4
5
11
6
1
2
3
4
5
These are worst case values that are estimated from simulation and not tested. The values in the table are simulated at
VDD = 1.08 V to 1.32 V, VDDE = 3.0 V to 3.6 V, VDDEH = 3.0 V to 3.6 V, VDD33 and VDDSYN = 3.0 V to 3.6 V, TA = TL to TH.
This parameter is supplied for reference and is not guaranteed by design and not tested.
Delay and rise/fall are measured to 20% or 80% of the respective signal.
This parameter is guaranteed by characterization before qualification rather than 100% tested.
Out delay is shown in Figure 17. Add a maximum of one system clock to the output delay for delay with respect to system clock.
VDDEn / 2
VDDEHn / 2
Pad
Data Input
Rising
Edge
Output
Delay
Falling
Edge
Output
Delay
VOH
Pad
Output
VOL
Figure 17. Pad Output Delay
4.12
4.12.1
AC Timing
Generic Timing Diagrams
The generic timing diagrams in Figure 18 and Figure 19 apply to all I/O pins with pad types F and MH. See Appendix A, Signal
Properties and Muxing, for the pad type for each pin.
MPC5674F Microcontroller Data Sheet, Rev. 6
46
Freescale Semiconductor
Electrical Characteristics
D_CLKOUT
VDDE / 2
A
B
I/O Outputs
VDDEn / 2
VDDEHn / 2
A – Maximum Output Delay Time
B – Minimum Output Hold Time
Figure 18. Generic Output Delay/Hold Timing
D_CLKOUT
VDDE / 2
B
A
I/O Inputs
VDDEn / 2
VDDEHn / 2
A – Minimum Input Setup Time
B – Minimum Input Hold Time
Figure 19. Generic Input Setup/Hold Timing
4.12.2
Reset and Configuration Pin Timing
Table 33. Reset and Configuration Pin Timing1
Spec
Characteristic
Symbol
Min
Max
Unit
1
RESET Pulse Width
tRPW
10
—
tcyc2
2
RESET Glitch Detect Pulse Width
tGPW
2
—
tcyc2
3
PLLCFG, BOOTCFG, WKPCFG Setup Time to RSTOUT
Valid
tRCSU
10
—
tcyc2
4
PLLCFG, BOOTCFG, WKPCFG Hold Time to RSTOUT Valid
tRCH
0
—
tcyc2
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
47
Electrical Characteristics
1
Reset timing specified at: VDDEH = 3.0 V to 5.25 V, VDD = 1.08 V to 1.32 V, TA = TL to TH.
See Notes on tcyc on Figure 16 and Table 28 in Section 4.11.1, “Clocking.”
2
2
RESET
1
RSTOUT
3
PLLCFG
BOOTCFG
WKPCFG
4
Figure 20. Reset and Configuration Pin Timing
4.12.3
IEEE 1149.1 Interface Timing
Table 34. JTAG Pin AC Electrical Characteristics1
Spec
Characteristic
Symbol
Min
Max
Unit
1
TCK Cycle Time
tJCYC
100
—
ns
2
TCK Clock Pulse Width (Measured at VDDE / 2)
tJDC
40
60
ns
3
TCK Rise and Fall Times (40%–70%)
tTCKRISE
—
3
ns
4
TMS, TDI Data Setup Time
tTMSS, tTDIS
5
—
ns
5
TMS, TDI Data Hold Time
tTMSH, tTDIH
25
—
ns
6
TCK Low to TDO Data Valid
tTDOV
—
10
ns
7
TCK Low to TDO Data Invalid
tTDOI
0
—
ns
8
TCK Low to TDO High Impedance
tTDOHZ
—
20
ns
9
JCOMP Assertion Time
tJCMPPW
100
—
ns
10
JCOMP Setup Time to TCK Low
tJCMPS
40
—
ns
11
TCK Falling Edge to Output Valid
tBSDV
—
50
ns
MPC5674F Microcontroller Data Sheet, Rev. 6
48
Freescale Semiconductor
Electrical Characteristics
Table 34. JTAG Pin AC Electrical Characteristics1 (continued)
Spec
1
Characteristic
Symbol
Min
Max
Unit
12
TCK Falling Edge to Output Valid out of High Impedance
tBSDVZ
—
50
ns
13
TCK Falling Edge to Output High Impedance
tBSDHZ
—
50
ns
14
Boundary Scan Input Valid to TCK Rising Edge
tBSDST
50
—
ns
15
TCK Rising Edge to Boundary Scan Input Invalid
tBSDHT
50
—
ns
JTAG timing specified at VDD = 1.08 V to 1.32 V, VDDE = 3.0 V to 3.6 V, VDD33 and VDDSYN = 3.0 V to 3.6 V, TA = TL to TH, and
CL = 30 pF with DSC = 0b10, SRC = 0b00. These specifications apply to JTAG boundary scan only. See Table 35 for functional
specifications.
TCK
2
2
3
1
3
Figure 21. JTAG Test Clock Input Timing
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
49
Electrical Characteristics
TCK
4
5
TMS, TDI
6
8
7
TDO
Figure 22. JTAG Test Access Port Timing
TCK
10
JCOMP
9
Figure 23. JTAG JCOMP Timing
MPC5674F Microcontroller Data Sheet, Rev. 6
50
Freescale Semiconductor
Electrical Characteristics
TCK
11
13
Output
Signals
12
Output
Signals
14
15
Input
Signals
Figure 24. JTAG Boundary Scan Timing
4.12.4
Nexus Timing
Table 35. Nexus Debug Port Timing1
Spec
Characteristic
1
MCKO Cycle Time
2
MCKO Duty Cycle
Valid4
Symbol
Min
Max
Unit
tMCYC
22
8
tCYC3
tMDC
40
60
%
3
MCKO Low to MDO Data
4
MCKO Low to MSEO Data Valid4
5
MCKO Low to EVTO Data
Valid4
6
EVTI Pulse Width
7
EVTO Pulse Width
tEVTOPW
tMDOV
–0.1
0.2
tMCYC
tMSEOV
–0.1
0.2
tMCYC
tEVTOV
–0.1
0.2
tMCYC
tEVTIPW
4.0
—
tTCYC3
1
—
tMCYC
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
51
Electrical Characteristics
Table 35. Nexus Debug Port Timing1 (continued)
Spec
Characteristic
Symbol
Min
Max
Unit
5
8
TCK Cycle Time
tTCYC
4
—
tCYC3
9
TCK Duty Cycle
tTDC
40
60
%
10
TDI, TMS Data Setup Time
tNTDIS, tNTMSS
8
—
ns
11
TDI, TMS Data Hold Time
TNTDIH, tNTMSH
5
—
ns
tNTDOV
0
10
ns
—
—
—
—
12
TCK Low to TDO Data Valid
13
RDY Valid to MCKO6
1
2
3
4
5
6
All Nexus timing relative to MCKO is measured from 50% of MCKO and 50% of the respective signal. Nexus timing specified
at VDD = 1.08 V to 1.32 V, VDDE = 3.0 V to 3.6 V, VDD33 and VDDSYN = 3.0 V to 3.6 V, TA = TL to TH, and CL = 30 pF with
DSC = 0b10.
The Nexus AUX port runs up to 82 MHz (pending characterization). Set NPC_PCR[MKCO_DIV] to correct division depending
on the system frequency, not to exceed maximum Nexus AUX port frequency.
See Notes on tcyc on Figure 16 and Table 28 in Section Section 4.11.1 Clocking.
MDO, MSEO, and EVTO data is held valid until next MCKO low cycle.
Lower frequency is required to be fully compliant to standard.
The RDY pin timing is asynchronous to MCKO. The timing is guaranteed by design to function correctly.
1
2
MCKO
3
4
5
MDO
MSEO
EVTO
Output Data Valid
7
EVTI
6
Figure 25. Nexus Timings
MPC5674F Microcontroller Data Sheet, Rev. 6
52
Freescale Semiconductor
Electrical Characteristics
8
9
TCK
10
11
TMS, TDI
12
TDO
Figure 26. Nexus TCK, TDI, TMS, TDO Timing
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
53
Electrical Characteristics
4.12.5
External Bus Interface (EBI) Timing
Table 36. Bus Operation Timing 1
66 MHz (Ext. Bus Freq)2 3
Spec
Characteristic
Symbol
Min
Unit
Notes
Signals are measured at 50% VDDE.
Max
1
D_CLKOUT Period
tC
15.2
—
ns
2
D_CLKOUT Duty Cycle
tCDC
45%
55%
tC
3
D_CLKOUT Rise Time
tCRT
—
—4
ns
4
D_CLKOUT Fall Time
tCFT
—
—4
ns
5
D_CLKOUT Posedge to Output
Signal Invalid or High Z (Hold Time)
tCOH
1.0/1.5
—
ns
Hold time selectable via
SIU_ECCR[EBTS] bit:
EBTS = 0: 1.0 ns
EBTS = 1: 1.5 ns
tCOV
—
7.0/7.5
ns
Output valid time selectable via
SIU_ECCR[EBTS] bit:
EBTS = 0: 7.0 ns
EBTS = 1: 7.5 ns
tCIS
5.0/4.5
—
ns
Input setup time selectable via
SIU_ECCR[EBTS] bit:
EBTS = 0; 5.0ns
EBTS = 1; 4.5ns
tCIH
1.0
—
ns
D_ADD[9:30]
D_BDIP
D_CS[0:3]
D_DAT[0:15]
D_OE
D_RD_WR
D_TA
D_TS
D_WE[0:3]/D_BE[0:3]
6
D_CLKOUT Posedge to Output
Signal Valid (Output Delay)
D_ADD[9:30]
D_BDIP
D_CS[0:3]
D_DAT[0:15]
D_OE
D_RD_WR
D_TA
D_TS
D_WE[0:3]/D_BE[0:3]
7
Input Signal Valid to D_CLKOUT
Posedge (Setup Time)
D_ADD[9:30]
D_DAT[0:15]
D_RD_WR
D_TA
D_TS
8
D_CLKOUT Posedge to Input
Signal Invalid (Hold Time)
D_ADD[9:30]
D_DAT[0:15]
D_RD_WR
D_TA
D_TS
MPC5674F Microcontroller Data Sheet, Rev. 6
54
Freescale Semiconductor
Electrical Characteristics
Table 36. Bus Operation Timing 1 (continued)
66 MHz (Ext. Bus Freq)2 3
Spec
1
2
3
4
5
Characteristic
Symbol
Unit
Min
Max
Notes
9
D_ALE Pulse Width
tAPW
6.5
—
ns
The timing is for Asynchronous
external memory system.
10
D_ALE Negated to Address Invalid
tAAI
2.0/1.0 5
—
ns
The timing is for Asynchronous
external memory system.
ALE is measured at 50% of VDDE.
EBI timing specified at VDD = 1.08 V to 1.32 V, VDDE = 3.0 V to 3.6 V, VDD33 and VDDSYN = 3.0 V to 3.6 V, TA = TL to TH, and
CL = 30 pF with DSC = 0b10.
Speed is the nominal maximum frequency. Max speed is the maximum speed allowed including frequency modulation (FM).
270 MHz parts allow for 264 MHz system clock + 2% FM.
Depending on the internal bus speed, set the SIU_ECCR[EBDF] bits correctly not to exceed maximum external bus frequency.
The maximum external bus frequency is 66 MHz.
Refer to Fast pad timing in Table 31 and Table 32.
ALE hold time spec is temperature dependant. 1.0ns spec applies for temperature range -40 to 0 C. 2.0ns spec applies to
temperatures > 0 C. This spec has no dependency on SIU_ECCR[EBTS] bit.
VOH_F
VDDE / 2
D_CLKOUT
VOL_F
3
2
2
4
1
Figure 27. D_CLKOUT Timing
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
55
Electrical Characteristics
VDDE / 2
D_CLKOUT
6
5
5
Output
Bus
VDDE / 2
6
5
5
Output
Signal
VDDE / 2
6
Output
Signal
VDDE / 2
Figure 28. Synchronous Output Timing
MPC5674F Microcontroller Data Sheet, Rev. 6
56
Freescale Semiconductor
Electrical Characteristics
D_CLKOUT
VDDE / 2
7
8
Input
Bus
VDDE / 2
7
8
Input
Signal
VDDE / 2
Figure 29. Synchronous Input Timing
ipg_clk
D_CLKOUT
D_ALE
D_TS
D_ADD/D_DAT
DATA
ADDR
9
10
Figure 30. ALE Signal Timing
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
57
Electrical Characteristics
4.12.6
External Interrupt Timing (IRQ Pin)
Table 37. External Interrupt Timing1
Spec
Characteristic
1
IRQ Pulse Width Low
2
IRQ Pulse Width High
3
IRQ Edge to Edge Time
3
Symbol
Min
Max
Unit
tIPWL
3
—
tcyc2
tIPWH
3
—
tcyc2
tICYC
6
—
tcyc2
1
IRQ timing specified at VDD = 1.08 V to 1.32 V, VDDEH = 3.0 V to 5.5 V, VDD33 and VDDSYN = 3.0 V to 3.6 V, TA = TL
to TH.
2
See Notes on tcyc on Figure 16 and Table 28 in Section 4.11.1 Clocking.
3 Applies when IRQ pins are configured for rising edge or falling edge events, but not both.
IRQ
2
1
3
Figure 31. External Interrupt Timing
4.12.7
eTPU Timing
Table 38. eTPU Timing1
Spec
1
2
Characteristic
eTPU Input Channel Pulse Width
eTPU Output Channel Pulse Width
Symbol
Min
Max
Unit
tICPW
4
—
tcyc2
tOCPW
13
—
tcyc2
1
eTPU timing specified at VDD = 1.08 V to 1.32 V, VDDEH = 3.0 V to 5.5 V, VDD33 and VDDSYN = 3.0 V to 3.6 V, TA = TL to TH,
and CL = 200 pF with SRC = 0b00.
2 See Notes on t
cyc on Figure 16 and Table 28 in Section 4.11.1 Clocking.
3 This specification does not include the rise and fall times. When calculating the minimum eTPU pulse width, include the rise
and fall times defined in the slew rate control fields (SRC) of the pad configuration registers (PCR).
MPC5674F Microcontroller Data Sheet, Rev. 6
58
Freescale Semiconductor
Electrical Characteristics
eTPU Input
and TCRCLK
1
2
eTPU
Output
Figure 32. eTPU Timing
4.12.8
eMIOS Timing
Table 39. eMIOS Timing1
Spec
1
2
Characteristic
eMIOS Input Pulse Width
eMIOS Output Pulse Width
Symbol
Min
Max
Unit
tMIPW
4
—
tcyc2
tMOPW
13
—
tcyc2
1
eMIOS timing specified at VDD = 1.08 V to 1.32 V, VDDEH = 3.0 V to 5.5 V, VDD33 and VDDSYN = 3.0 V to 3.6 V, TA = TL to TH,
and CL = 50 pF with SRC = 0b00.
2 See Notes on t
cyc on Figure 16 and Table 28 in Section 4.11.1 Clocking.
3 This specification does not include the rise and fall times. When calculating the minimum eMIOS pulse width, include the rise
and fall times defined in the slew rate control fields (SRC) of the pad configuration registers (PCR).
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
59
Electrical Characteristics
eMIOS Input
1
2
eMIOS
Output
Figure 33. eMIOS Timing
4.12.9
DSPI Timing
Table 40. DSPI Timing1 2
Spec
Characteristic
Symbol
Peripheral Bus Freq:
132 MHz
Min
Max
Unit
1
DSPI Cycle Time3, 4
Master (MTFE = 0)
Slave (MTFE = 0)
Master (MTFE = 1)
Slave (MTFE = 1)
tSCK
tSYS * 2
tSYS*32768*7
ns
2
PCS to SCK Delay5
tCSC
12
—
ns
3
After SCK Delay6
Master mode
Slave mode
tASC
tSYS * 2
tSYS *3 –
constraints 7
—
4
SCK Duty Cycle
tSDC
0.33 * tSCK
0.66 * tSCK
ns
5
Slave Access Time
(SS active to SOUT valid)
tA
—
25
ns
6
Slave SOUT Disable Time
(SS inactive to SOUT High-Z or invalid)
tDIS
—
25
ns
7
PCSx to PCSS time
tPCSC
tSYS * 2
tSYS * 7
ns
8
PCSS to PCSx time
tPASC
tSYS * 2
tSYS * 7
ns
ns
MPC5674F Microcontroller Data Sheet, Rev. 6
60
Freescale Semiconductor
Electrical Characteristics
Table 40. DSPI Timing1 2 (continued)
Spec
Characteristic
9
10
11
12
1
2
3
4
5
6
7
8
Peripheral Bus Freq:
132 MHz
Symbol
Data Setup Time for Inputs
Master (MTFE = 0)
Slave
Master (MTFE = 1, CPHA = 0)8
Master (MTFE = 1, CPHA = 1)
tSUI
Data Hold Time for Inputs
Master (MTFE = 0)
Slave
Master (MTFE = 1, CPHA = 0)8
Master (MTFE = 1, CPHA = 1)
tHI
Data Valid (after SCK edge)
Master (MTFE = 0)
Slave
Master (MTFE = 1, CPHA = 0)
Master (MTFE = 1, CPHA = 1)
tSUO
Data Hold Time for Outputs
Master (MTFE = 0)
Slave
Master (MTFE = 1, CPHA = 0)
Master (MTFE = 1, CPHA = 1)
tHO
Unit
Min
Max
20
4
6
20
—
—
—
—
ns
ns
ns
ns
–3
7
12
–3
—
—
—
—
ns
ns
ns
ns
—
—
—
—
5
25
13
5
ns
ns
ns
ns
–5
2.5
3
–5
—
—
—
—
ns
ns
ns
ns
DSPI timing specified at VDD = 1.08 V to 1.32 V, VDDEH = 3.0 V to 5.5 V, VDD33 and VDDSYN = 3.0 V to 3.6 V, and TA = TL to TH
Speed is the nominal maximum frequency of platform clock (fplatf). Max speed is the maximum speed allowed including
frequency modulation (FM). 270 MHz parts allow for 264 Mhz for system core clock (fsys) + 2% FM.
The minimum DSPI Cycle Time restricts the baud rate selection for given system clock rate. These numbers are calculated
based on two devices communicating over a DSPI link.
The actual minimum SCK cycle time is limited by pad performance.
The maximum value is programmable in DSPI_CTARn[PSSCK] and DSPI_CTARn[CSSCK].
The maximum value is programmable in DSPI_CTARn[PASC] and DSPI_CTARn[ASC].
For example, external master should start SCK clock not earlier than 3 system clock periods after assertion SS
This number is calculated assuming the SMPL_PT bitfield in DSPI_MCR is set to 0b10.
The DSPI in this device can be configured to serialize data to an external device that implements the Microsecond Bus protocol.
DSPI pins support 5 V logic levels or Low Voltage Differential Signalling (LVDS) for data and clock signals to improve high
speed operation.
Table 41. DSPI LVDS Timing1, 2
Characteristic
LVDS Clock to Data/Chip Select Outputs
1
2
Symbol
Min
Max
Unit
tLVDSDATA
–0.25 ×
tSCYC
+0.25 ×
tSCYC
ns
These are typical values that are estimated from simulation.
See DSPI LVDS Pad related data in Table 17.
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
61
Electrical Characteristics
2
3
PCSx
1
4
SCK Output
(CPOL = 0)
4
SCK Output
(CPOL = 1)
9
SIN
10
First Data
Last Data
Data
12
SOUT
First Data
11
Data
Last Data
Figure 34. DSPI Classic SPI Timing — Master, CPHA = 0
PCSx
SCK Output
(CPOL=0)
10
SCK Output
(CPOL=1)
9
SIN
Data
First Data
12
SOUT
First Data
Last Data
11
Data
Last Data
Figure 35. DSPI Classic SPI Timing — Master, CPHA = 1
MPC5674F Microcontroller Data Sheet, Rev. 6
62
Freescale Semiconductor
Electrical Characteristics
3
2
SS
1
4
SCK Input
(CPOL = 0)
4
SCK Input
(CPOL = 1)
5
First Data
SOUT
9
6
Data
Last Data
Data
Last Data
10
First Data
SIN
11
12
Figure 36. DSPI Classic SPI Timing — Slave, CPHA = 0
SS
SCK Input
(CPOL = 0)
SCK Input
(CPOL = 1)
11
5
12
SOUT
First Data
9
SIN
Data
Last Data
Data
Last Data
6
10
First Data
Figure 37. DSPI Classic SPI Timing — Slave, CPHA = 1
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
63
Electrical Characteristics
3
PCSx
4
1
2
SCK Output
(CPOL = 0)
4
SCK Output
(CPOL = 1)
9
SIN
10
First Data
Last Data
Data
12
SOUT
11
First Data
Last Data
Data
Figure 38. DSPI Modified Transfer Format Timing — Master, CPHA = 0
PCSx
SCK Output
(CPOL = 0)
SCK Output
(CPOL = 1)
10
9
SIN
First Data
Data
12
SOUT
First Data
Data
Last Data
11
Last Data
Figure 39. DSPI Modified Transfer Format Timing — Master, CPHA = 1
MPC5674F Microcontroller Data Sheet, Rev. 6
64
Freescale Semiconductor
Electrical Characteristics
3
2
SS
1
SCK Input
(CPOL = 0)
4
4
SCK Input
(CPOL = 1)
12
11
5
First Data
SOUT
Data
Last Data
10
9
Data
First Data
SIN
6
Last Data
Figure 40. DSPI Modified Transfer Format Timing — Slave, CPHA = 0
SS
SCK Input
(CPOL = 0)
SCK Input
(CPOL = 1)
11
5
6
12
First Data
SOUT
9
Last Data
Data
Last Data
10
First Data
SIN
Data
Figure 41. DSPI Modified Transfer Format Timing — Slave, CPHA = 1
7
8
PCSS
PCSx
Figure 42. DSPI PCS Strobe (PCSS) Timing
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
65
Package Information
5
Package Information
The latest package outline drawings are available on the product summary pages on our website:
http://www.freescale.com/powerarchitecture. The following table lists the package case number. Use these numbers in the
webpage’s keyword search engine to find the latest package outline drawings.
Table 42. Package Information
Package Type
Case Outline Number
324 TEPBGA
98ASS23840W
416 TEPBGA
98ARE10523D
516 TEPBGA
98ARS10503D
MPC5674F Microcontroller Data Sheet, Rev. 6
66
Freescale Semiconductor
Package Information
5.1
324-Pin Package
The package drawings of the 324-pin TEPBGA package are shown in Figure 43 and Figure 44.
Figure 43. 324 TEPBGA Package (1 of 2)
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
67
Package Information
Figure 44. 324 TEPBGA Package (2 of 2)
MPC5674F Microcontroller Data Sheet, Rev. 6
68
Freescale Semiconductor
Package Information
5.2
416-Pin Package
The package drawings of the 416-pin TEPBGA package are shown in Figure 45 and Figure 46.
Figure 45. 416 TEPBGA Package (1 of 2)
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
69
Package Information
Figure 46. 416 TEPBGA Package (2 of 2)
MPC5674F Microcontroller Data Sheet, Rev. 6
70
Freescale Semiconductor
Package Information
5.3
516-Pin Package
The package drawings of the 516-pin TEPBGA package are shown in Figure 47 and Figure 48.
Figure 47. 516 TEPBGA Package (1 of 2)
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
71
Package Information
Figure 48. 516 TEPBGA Package (2 of 2)
MPC5674F Microcontroller Data Sheet, Rev. 6
72
Freescale Semiconductor
Product Documentation
6
Product Documentation
This data sheet is labeled as a particular type: Product Preview, Advance Information, or Technical Data. Definitions of these
types are available at: http://www.freescale.com.
The following documents are required for a complete description of the device and are necessary to design properly with the
parts:
•
MPC5674F Microprocessor Reference Manual (document number MPC5674FRM).
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
73
Signal Properties and Muxing
Appendix A Signal Properties and Muxing
The following table shows the signals properties for each pin on the MPC5674F. For each port pin that has an associated
SIU_PCRn register to control its pin properties, the supported functions column lists the functions associated with the
programming of the SIU_PCRn[PA] bit in the order: Primary function (P), Function 2 (F2), Function 3 (F3), and GPIO (G). See
Figure 49.
U
Table 2. Signal Properties Summary
Primary Functions
are listed First
GPIO/
PCR1
113
Signal Name2
P/
F/
G
TCRCLKA_IRQ7_GPIO113 P
Function3
Function Summary
I/O
Pad
Type
5V M
TCRCLKA
eTPU A TCR clock
I
I
Secondary Functions
are alternate functions
A1
IRQ7
External interrupt request
A2
—
—
—
GPIO Functions are
listed Last
G
GPIO113
GPIO
I/O
Function not implemented on this device
Figure 49. Supported Functions Example
MPC5674F Microcontroller Data Sheet, Rev. 6
74
Freescale Semiconductor
Freescale Semiconductor
Voltage6
324
416
516
Function Summary
Pad Type5
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Table 43. Signal Properties and Muxing Summary
I
MH
VDDEH1
—/Up
—/Up
K1
L1
K4
MH
VDDEH1
—/WKPCFG
—/WKPCFG
K2
L2
L6
MH
VDDEH1
—/WKPCFG
—/WKPCFG
J1
L3
J1
MH
VDDEH1
—/WKPCFG
—/WKPCFG
J2
L4
J2
MH
VDDEH1
—/WKPCFG
—/WKPCFG
J3
K1
H4
MH
VDDEH1
—/WKPCFG
—/WKPCFG
J4
K2
J4
Package Location
State during
State
RESET7
after RESET8
eTPU_A
113 TCRCLKA_IRQ7_
GPIO113
MPC5674F Microcontroller Data Sheet, Rev. 6
114 ETPUA0_ETPUA12_
GPIO114
115 ETPUA1_ETPUA13_
GPIO115
116 ETPUA2_ETPUA14_
GPIO116
117 ETPUA3_ETPUA15_
GPIO117
118 ETPUA4_ETPUA16_
GPIO118
P
TCRCLKA
eTPU A TCR clock
A1
IRQ7
External interrupt request
I
A2
—
—
—
G
GPIO113
GPIO
I/O
P
ETPUA0
eTPU A channel
I/O
A1
ETPUA12
eTPU A channel (output only)
O
A2
—
—
—
G
GPIO114
GPIO
I/O
P
ETPUA1
eTPU A channel
I/O
A1
ETPUA13
eTPU A channel (output only)
O
A2
—
—
—
G
GPIO115
GPIO
I/O
P
ETPUA2
eTPU A channel
I/O
A1
ETPUA14
eTPU A channel (output only)
O
A2
—
—
—
G
GPIO116
GPIO
I/O
P
ETPUA3
eTPU A channel
I/O
A1
ETPUA15
eTPU A channel (output only)
O
A2
—
—
—
G
GPIO117
GPIO
I/O
P
ETPUA4
eTPU A channel
I/O
A1
ETPUA16
eTPU A channel (output only)
O
A2
—
—
—
G
GPIO118
GPIO
I/O
75
124 ETPUA10_ETPUA22_
GPIO124
516
123 ETPUA9_ETPUA21_
GPIO123
416
122 ETPUA8_ETPUA20_
GPIO122
324
MPC5674F Microcontroller Data Sheet, Rev. 6
121 ETPUA7_ETPUA19_
GPIO121
Voltage6
120 ETPUA6_ETPUA18_
GPIO120
Function Summary
Pad Type5
119 ETPUA5_ETPUA17_
GPIO119
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
MH
VDDEH1
—/WKPCFG
—/WKPCFG
H1
K3
H1
MH
VDDEH1
—/WKPCFG
—/WKPCFG
H2
K4
K5
MH
VDDEH1
—/WKPCFG
—/WKPCFG
—
J1
H2
MH
VDDEH1
—/WKPCFG
—/WKPCFG
—
J2
H3
MH
VDDEH1
—/WKPCFG
—/WKPCFG
H3
J3
J3
MH
VDDEH1
—/WKPCFG
—/WKPCFG
G1
J4
K6
P
ETPUA5
eTPU A channel
A1
ETPUA17
eTPU A channel (output only)
O
A2
—
—
—
G
GPIO119
GPIO
I/O
P
ETPUA6
eTPU A channel
I/O
A1
ETPUA18
eTPU A channel (output only)
O
A2
—
—
—
G
GPIO120
GPIO
I/O
P
ETPUA7
eTPU A channel
I/O
A1
ETPUA19
eTPU A channel (output only)
O
A2
—
—
—
G
GPIO121
GPIO
I/O
P
ETPUA8
eTPU A channel
I/O
A1
ETPUA20
eTPU A channel (output only)
O
A2
—
—
—
G
GPIO122
GPIO
I/O
P
ETPUA9
eTPU A channel
I/O
A1
ETPUA21
eTPU A channel (output only)
O
A2
—
—
—
G
GPIO123
GPIO
I/O
P
ETPUA10
eTPU A channel
I/O
A1
ETPUA22
eTPU A channel (output only)
O
A2
—
—
—
G
GPIO124
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
76
130 ETPUA16_PCSD1_
GPIO130
516
129 ETPUA15_PCSB5_
GPIO129
416
128 ETPUA14_PCSB4_
GPIO128
324
MPC5674F Microcontroller Data Sheet, Rev. 6
127 ETPUA13_PCSB3_
GPIO127
Voltage6
126 ETPUA12_PCSB1_
GPIO126
Function Summary
Pad Type5
125 ETPUA11_ETPUA23_
GPIO125
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
MH
VDDEH1
—/WKPCFG
—/WKPCFG
G2
H1
G1
MH
VDDEH1
—/WKPCFG
—/WKPCFG
G3
H2
J5
MH
VDDEH1
—/WKPCFG
—/WKPCFG
F1
H4
G2
MH
VDDEH1
—/WKPCFG
—/WKPCFG
F2
H3
H5
MH
VDDEH1
—/WKPCFG
—/WKPCFG
F3
G1
G3
MH
VDDEH1
—/WKPCFG
—/WKPCFG
H4
G2
H6
P
ETPUA11
eTPU A channel
A1
ETPUA23
eTPU A channel (output only)
O
A2
—
—
—
G
GPIO125
GPIO
I/O
P
ETPUA12
eTPU A channel
I/O
A1
PCSB1
DSPI B peripheral chip select
O
A2
—
—
—
G
GPIO126
GPIO
I/O
P
ETPUA13
eTPU A channel
I/O
A1
PCSB3
DSPI B peripheral chip select
O
A2
—
—
—
G
GPIO127
GPIO
I/O
P
ETPUA14
eTPU A channel
I/O
A1
PCSB4
DSPI B peripheral chip select
O
A2
—
—
—
G
GPIO128
GPIO
I/O
P
ETPUA15
eTPU A channel
I/O
A1
PCSB5
DSPI B peripheral chip select
O
A2
—
—
—
G
GPIO129
GPIO
I/O
P
ETPUA16
eTPU A channel
I/O
A1
PCSD1
DSPI D peripheral chip select
O
A2
—
—
—
G
GPIO130
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
77
136 ETPUA22_IRQ10_
GPIO136
516
135 ETPUA21_IRQ9_
GPIO135
416
134 ETPUA20_IRQ8_
GPIO134
324
MPC5674F Microcontroller Data Sheet, Rev. 6
133 ETPUA19_PCSD4_
GPIO133
Voltage6
132 ETPUA18_PCSD3_
GPIO132
Function Summary
Pad Type5
131 ETPUA17_PCSD2_
GPIO131
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
MH
VDDEH1
—/WKPCFG
—/WKPCFG
G4
G3
G4
MH
VDDEH1
—/WKPCFG
—/WKPCFG
—
G4
G5
MH
VDDEH1
—/WKPCFG
—/WKPCFG
—
F1
F1
MH
VDDEH1
—/WKPCFG
—/WKPCFG
E1
F2
F2
MH
VDDEH1
—/WKPCFG
—/WKPCFG
C1
F3
F3
MH
VDDEH1
—/WKPCFG
—/WKPCFG
E2
F4
F4
P
ETPUA17
eTPU A channel
A1
PCSD2
DSPI D peripheral chip select
O
A2
—
—
—
G
GPIO131
GPIO
I/O
P
ETPUA18
eTPU A channel
I/O
A1
PCSD3
DSPI D peripheral chip select
O
A2
—
—
—
G
GPIO132
GPIO
I/O
P
ETPUA19
eTPU A channel
I/O
A1
PCSD4
DSPI D peripheral chip select
O
A2
—
—
—
G
GPIO133
GPIO
I/O
P
ETPUA20
eTPU A channel
I/O
A1
IRQ8
External interrupt request
A2
—
—
—
G
GPIO134
GPIO
I/O
P
ETPUA21
eTPU A channel
I/O
A1
IRQ9
External interrupt request
A2
—
—
—
G
GPIO135
GPIO
I/O
P
ETPUA22
eTPU A channel
I/O
A1
IRQ10
External interrupt request
A2
—
—
—
G
GPIO136
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
I
I
I
78
142 ETPUA28_PCSC1_
GPIO142
516
141 ETPUA27_IRQ15_
GPIO141
416
140 ETPUA26_IRQ14_
GPIO140
324
MPC5674F Microcontroller Data Sheet, Rev. 6
139 ETPUA25_IRQ13_
GPIO139
Voltage6
138 ETPUA24_IRQ12_
GPIO138
Function Summary
Pad Type5
137 ETPUA23_IRQ11_
GPIO137
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
MH
VDDEH1
—/WKPCFG
—/WKPCFG
D1
E1
E1
MH
VDDEH1
—/WKPCFG
—/WKPCFG
E3
E2
E2
MH
VDDEH1
—/WKPCFG
—/WKPCFG
D2
E3
E3
MH
VDDEH1
—/WKPCFG
—/WKPCFG
C2
E4
E4
MH
VDDEH1
—/WKPCFG
—/WKPCFG
F4
D1
D1
MH
VDDEH1
—/WKPCFG
—/WKPCFG
—
D2
D2
P
ETPUA23
eTPU A channel
A1
IRQ11
External interrupt request
A2
—
—
—
G
GPIO137
GPIO
I/O
P
ETPUA24
eTPU A channel
I/O
A1
IRQ12
External interrupt request
A2
—
—
—
G
GPIO138
GPIO
I/O
P
ETPUA25
eTPU A channel
I/O
A1
IRQ13
External interrupt request
A2
—
—
—
G
GPIO139
GPIO
I/O
P
ETPUA26
eTPU A channel
I/O
A1
IRQ14
External interrupt request
A2
—
—
—
G
GPIO140
GPIO
I/O
P
ETPUA27
eTPU A channel
I/O
A1
IRQ15
External interrupt request
A2
—
—
—
G
GPIO141
GPIO
I/O
P
ETPUA28
eTPU A channel
I/O
A1
PCSC1
DSPI C peripheral chip select
O
A2
—
—
—
G
GPIO142
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
I
I
I
I
I
79
324
416
516
MPC5674F Microcontroller Data Sheet, Rev. 6
145 ETPUA31_PCSC4_
GPIO145
Voltage6
144 ETPUA30_PCSC3_
GPIO144
Function Summary
Pad Type5
143 ETPUA29_PCSC2_
GPIO143
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
MH
VDDEH1
—/WKPCFG
—/WKPCFG
—
D3
D3
MH
VDDEH1
—/WKPCFG
—/WKPCFG
E4
C1
C1
MH
VDDEH1
—/WKPCFG
—/WKPCFG
D3
C2
C2
MH
VDDEH6
—/Up
—/Up
P19
T23
V25
MH
VDDEH6
—/WKPCFG
—/WKPCFG
N19
T24
V26
MH
VDDEH6
—/WKPCFG
—/WKPCFG
R19
T25
U22
P
ETPUA29
eTPU A channel
A1
PCSC2
DSPI C peripheral chip select
O
A2
—
—
—
G
GPIO143
GPIO
I/O
P
ETPUA30
eTPU A channel
I/O
A1
PCSC3
DSPI C peripheral chip select
O
A2
—
—
—
G
GPIO144
GPIO
I/O
P
ETPUA31
eTPU A channel
I/O
A1
PCSC4
DSPI C peripheral chip select
O
A2
—
—
—
G
GPIO145
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
eTPU_B
146 TCRCLKB_IRQ6_
GPIO146
147 ETPUB0_ETPUB16_
GPIO147
148 ETPUB1_ETPUB17_
GPIO148
P
TCRCLKB
eTPU B TCR clock
I
A1
IRQ6
External interrupt request
I
A2
—
—
—
G
GPIO146
GPIO
I/O
P
ETPUB0
eTPU B channel
I/O
A1
ETPUB16
eTPU B channel (output only)
O
A2
—
—
—
G
GPIO147
GPIO
I/O
P
ETPUB1
eTPU B channel
I/O
A1
ETPUB17
eTPU B channel (output only)
O
A2
—
—
—
G
GPIO148
GPIO
I/O
80
154 ETPUB7_ETPUB23_
GPIO154
516
153 ETPUB6_ETPUB22_
GPIO153
416
152 ETPUB5_ETPUB21_
GPIO152
324
MPC5674F Microcontroller Data Sheet, Rev. 6
151 ETPUB4_ETPUB20_
GPIO151
Voltage6
150 ETPUB3_ETPUB19_
GPIO150
Function Summary
Pad Type5
149 ETPUB2_ETPUB18_
GPIO149
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
MH
VDDEH6
—/WKPCFG
—/WKPCFG
R22
T26
U23
MH
VDDEH6
—/WKPCFG
—/WKPCFG
R21
R23
T22
MH
VDDEH6
—/WKPCFG
—/WKPCFG
P22
R24
U24
MH
VDDEH6
—/WKPCFG
—/WKPCFG
P21
R25
U25
MH
VDDEH6
—/WKPCFG
—/WKPCFG
N22
R26
U26
MH
VDDEH6
—/WKPCFG
—/WKPCFG
M19
P23
T23
P
ETPUB2
eTPU B channel
A1
ETPUB18
eTPU B channel (output only)
O
A2
—
—
—
G
GPIO149
GPIO
I/O
P
ETPUB3
eTPU B channel
I/O
A1
ETPUB19
eTPU B channel (output only)
O
A2
—
—
—
G
GPIO150
GPIO
I/O
P
ETPUB4
eTPU B channel
I/O
A1
ETPUB20
eTPU B channel (output only)
O
A2
—
—
—
G
GPIO151
GPIO
I/O
P
ETPUB5
eTPU B channel
I/O
A1
ETPUB21
eTPU B channel (output only)
O
A2
—
—
—
G
GPIO152
GPIO
I/O
P
ETPUB6
eTPU B channel
I/O
A1
ETPUB22
eTPU B channel (output only)
O
A2
—
—
—
G
GPIO153
GPIO
I/O
P
ETPUB7
eTPU B channel
I/O
A1
ETPUB23
eTPU B channel (output only)
O
A2
—
—
—
G
GPIO154
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
81
160 ETPUB13_ETPUB29_
GPIO160
516
159 ETPUB12_ETPUB28_
GPIO159
416
158 ETPUB11_ETPUB27_
GPIO158
324
MPC5674F Microcontroller Data Sheet, Rev. 6
157 ETPUB10_ETPUB26_
GPIO157
Voltage6
156 ETPUB9_ETPUB25_
GPIO156
Function Summary
Pad Type5
155 ETPUB8_ETPUB24_
GPIO155
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
MH
VDDEH6
—/WKPCFG
—/WKPCFG
N21
P24
T24
MH
VDDEH6
—/WKPCFG
—/WKPCFG
M22
P25
R22
MH
VDDEH6
—/WKPCFG
—/WKPCFG
M20
P26
T25
MH
VDDEH6
—/WKPCFG
—/WKPCFG
M21
N24
T26
MH
VDDEH6
—/WKPCFG
—/WKPCFG
L19
N25
R23
MH
VDDEH6
—/WKPCFG
—/WKPCFG
L20
N26
P22
P
ETPUB8
eTPU B channel
A1
ETPUB24
eTPU B channel (output only)
O
A2
—
—
—
G
GPIO155
GPIO
I/O
P
ETPUB9
eTPU B channel
I/O
A1
ETPUB25
eTPU B channel (output only)
O
A2
—
—
—
G
GPIO156
GPIO
I/O
P
ETPUB10
eTPU B channel
I/O
A1
ETPUB26
eTPU B channel (output only)
O
A2
—
—
—
G
GPIO157
GPIO
I/O
P
ETPUB11
eTPU B channel
I/O
A1
ETPUB27
eTPU B channel (output only)
O
A2
—
—
—
G
GPIO158
GPIO
I/O
P
ETPUB12
eTPU B channel
I/O
A1
ETPUB28
eTPU B channel (output only)
O
A2
—
—
—
G
GPIO159
GPIO
I/O
P
ETPUB13
eTPU B channel
I/O
A1
ETPUB29
eTPU B channel (output only)
O
A2
—
—
—
G
GPIO160
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
82
166 ETPUB19_PCSA4_
GPIO166
516
165 ETPUB18_PCSA3_
GPIO165
416
164 ETPUB17_PCSA2_
GPIO164
324
MPC5674F Microcontroller Data Sheet, Rev. 6
163 ETPUB16_PCSA1_
GPIO163
Voltage6
162 ETPUB15_ETPUB31_
GPIO162
Function Summary
Pad Type5
161 ETPUB14_ETPUB30_
GPIO161
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
MH
VDDEH6
—/WKPCFG
—/WKPCFG
L21
M25
R24
MH
VDDEH6
—/WKPCFG
—/WKPCFG
—
M24
R25
MH
VDDEH6
—/WKPCFG
—/WKPCFG
P20
U26
V24
MH
VDDEH6
—/WKPCFG
—/WKPCFG
R20
U25
T21
MH
VDDEH6
—/WKPCFG
—/WKPCFG
T20
U24
W26
MH
VDDEH6
—/WKPCFG
—/WKPCFG
T19
U23
W25
P
ETPUB14
eTPU B channel
A1
ETPUB30
eTPU B channel (output only)
O
A2
—
—
—
G
GPIO161
GPIO
I/O
P
ETPUB15
eTPU B channel
I/O
A1
ETPUB31
eTPU B channel (output only)
O
A2
—
—
—
G
GPIO162
GPIO
I/O
P
ETPUB16
eTPU B channel
I/O
A1
PCSA1
DSPI A peripheral chip select
O
A2
—
—
—
G
GPIO163
GPIO
I/O
P
ETPUB17
eTPU B channel
I/O
A1
PCSA2
DSPI A peripheral chip select
O
A2
—
—
—
G
GPIO164
GPIO
I/O
P
ETPUB18
eTPU B channel
I/O
A1
PCSA3
DSPI A peripheral chip select
O
A2
—
—
—
G
GPIO165
GPIO
I/O
P
ETPUB19
eTPU B channel
I/O
A1
PCSA4
DSPI A peripheral chip select
O
A2
—
—
—
G
GPIO166
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
83
172 ETPUB25_
GPIO172
516
171 ETPUB24_
GPIO171
416
170 ETPUB23_
GPIO170
324
MPC5674F Microcontroller Data Sheet, Rev. 6
169 ETPUB22_
GPIO169
Voltage6
168 ETPUB21_
GPIO168
Function Summary
Pad Type5
167 ETPUB20_
GPIO167
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
MH
VDDEH6
—/WKPCFG
—/WKPCFG
—
V26
W24
MH
VDDEH6
—/WKPCFG
—/WKPCFG
—
V25
V22
MH
VDDEH6
—/WKPCFG
—/WKPCFG
—
V24
V23
MH
VDDEH6
—/WKPCFG
—/WKPCFG
—
W26
U21
MH
VDDEH6
—/WKPCFG
—/WKPCFG
—
W25
Y25
MH
VDDEH6
—/WKPCFG
—/WKPCFG
—
W24
W21
P
ETPUB20
eTPU B channel
A1
—
—
—
A2
—
—
—
G
GPIO167
GPIO
I/O
P
ETPUB21
eTPU B channel
I/O
A1
—
—
—
A2
—
—
—
G
GPIO168
GPIO
I/O
P
ETPUB22
eTPU B channel
I/O
A1
—
—
—
A2
—
—
—
G
GPIO169
GPIO
I/O
P
ETPUB23
eTPU B channel
I/O
A1
—
—
—
A2
—
—
—
G
GPIO170
GPIO
I/O
P
ETPUB24
eTPU B channel
I/O
A1
—
—
—
A2
—
—
—
G
GPIO171
GPIO
I/O
P
ETPUB25
eTPU B channel
I/O
A1
—
—
—
A2
—
—
—
G
GPIO172
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
84
178 ETPUB31_
GPIO178
516
177 ETPUB30_
GPIO177
416
176 ETPUB29_
GPIO176
324
MPC5674F Microcontroller Data Sheet, Rev. 6
175 ETPUB28_
GPIO175
Voltage6
174 ETPUB27_
GPIO174
Function Summary
Pad Type5
173 ETPUB26_
GPIO173
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
MH
VDDEH6
—/WKPCFG
—/WKPCFG
—
V23
Y23
MH
VDDEH6
—/WKPCFG
—/WKPCFG
—
Y25
Y24
MH
VDDEH6
—/WKPCFG
—/WKPCFG
—
Y24
AA24
MH
VDDEH6
—/WKPCFG
—/WKPCFG
—
Y23
W22
MH
VDDEH6
—/WKPCFG
—/WKPCFG
U20
AA24
AB24
MH
VDDEH6
—/WKPCFG
—/WKPCFG
U19
AB24
Y22
P
ETPUB26
eTPU B channel
A1
—
—
—
A2
—
—
—
G
GPIO173
GPIO
I/O
P
ETPUB27
eTPU B channel
I/O
A1
—
—
—
A2
—
—
—
G
GPIO174
GPIO
I/O
P
ETPUB28
eTPU B channel
I/O
A1
—
—
—
A2
—
—
—
G
GPIO175
GPIO
I/O
P
ETPUB29
eTPU B channel
I/O
A1
—
—
—
A2
—
—
—
G
GPIO176
GPIO
I/O
P
ETPUB30
eTPU B channel
I/O
A1
—
—
—
A2
—
—
—
G
GPIO177
GPIO
I/O
P
ETPUB31
eTPU B channel
I/O
A1
—
—
—
A2
—
—
—
G
GPIO178
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
85
Voltage6
324
416
516
Function Summary
Pad Type5
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
MH
VDDEH7
—/Up
—/Up
B22
B26
F22
MH
VDDEH7
—/WKPCFG
—/WKPCFG
C21
C25
C25
MH
VDDEH7
—/WKPCFG
—/WKPCFG
D20
C26
C26
MH
VDDEH7
—/WKPCFG
—/WKPCFG
D22
D25
D25
MH
VDDEH7
—/WKPCFG
—/WKPCFG
D21
D26
D26
MH
VDDEH7
—/WKPCFG
—/WKPCFG
E22
E24
E24
Package Location
State during
State
RESET7
after RESET8
GPIO, IRQ, FlexRay
440 TCRCLKC_
GPIO4409
MPC5674F Microcontroller Data Sheet, Rev. 6
441 ETPUC0_
GPIO4419
442 ETPUC1_
GPIO4429
443 ETPUC2_
GPIO4439
444 ETPUC3_
GPIO4449
445 ETPUC4_
GPIO4459
P
—
—
—
A1
—
—
—
A2
—
—
—
G
GPIO440
GPIO
I/O
P
—
—
—
A1
—
—
—
A2
—
—
—
G
GPIO441
GPIO
I/O
P
—
—
—
A1
—
—
—
A2
—
—
—
G
GPIO442
GPIO
I/O
P
—
—
—
A1
—
—
—
A2
—
—
—
G
GPIO443
GPIO
I/O
P
—
—
—
A1
—
—
—
A2
—
—
—
G
GPIO444
GPIO
I/O
P
—
—
—
A1
—
—
—
A2
—
—
—
G
GPIO445
GPIO
I/O
86
451 ETPUC10__IRQ1_
GPIO4519
516
450 ETPUC9_IRQ0_
GPIO4509
416
449 ETPUC8_
GPIO4499
324
MPC5674F Microcontroller Data Sheet, Rev. 6
448 ETPUC7_
GPIO4489
Voltage6
447 ETPUC6_
GPIO4479
Function Summary
Pad Type5
446 ETPUC5_
GPIO4469
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
MH
VDDEH7
—/WKPCFG
—/WKPCFG
E19
E25
E25
MH
VDDEH7
—/WKPCFG
—/WKPCFG
—
E26
E26
MH
VDDEH7
—/WKPCFG
—/WKPCFG
—
F23
F23
MH
VDDEH7
—/WKPCFG
—/WKPCFG
—
F24
F24
MH
VDDEH7
—/WKPCFG
—/WKPCFG
F22
F25
F25
MH
VDDEH7
—/WKPCFG
—/WKPCFG
E20
F26
F26
P
—
—
A1
—
—
—
A2
—
—
—
G
GPIO446
GPIO
I/O
P
—
—
I/O
A1
—
—
—
A2
—
—
—
G
GPIO447
GPIO
I/O
P
—
—
I/O
A1
—
—
—
A2
—
—
—
G
GPIO448
GPIO
I/O
P
—
—
I/O
A1
—
—
—
A2
—
—
—
G
GPIO449
GPIO
I/O
P
—
—
—
A1
IRQ0
External interrupt request
A2
—
—
—
G
GPIO450
GPIO
I/O
P
—
—
—
A1
IRQ1
External interrupt request
A2
—
—
—
G
GPIO451
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
I
I
87
457 ETPUC16_FR_A_TX_
GPIO4579
516
456 ETPUC15__
GPIO4569
416
455 ETPUC14_4_IRQ5_
GPIO4559
324
MPC5674F Microcontroller Data Sheet, Rev. 6
454 ETPUC13_3_IRQ4_
GPIO4549
Voltage6
453 ETPUC12_IRQ3_
GPIO4539
Function Summary
Pad Type5
452 ETPUC11_IRQ2_
GPIO4529
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
—
MH
VDDEH7
—/WKPCFG
—/WKPCFG
E21
G23
G22
MH
VDDEH7
—/WKPCFG
—/WKPCFG
F19
G24
G23
MH
VDDEH7
—/WKPCFG
—/WKPCFG
F21
G25
G24
MH
VDDEH7
—/WKPCFG
—/WKPCFG
F20
G26
G25
MH
VDDEH7
—/WKPCFG
—/WKPCFG
—
H23
G26
MH
VDDEH7
—/WKPCFG
—/WKPCFG
—
H24
H22
P
—
—
A1
IRQ2
External interrupt request
A2
—
—
—
G
GPIO452
GPIO
I/O
P
—
—
—
A1
IRQ3
External interrupt request
A2
—
—
—
G
GPIO453
GPIO
I/O
P
—
—
—
A1
IRQ4
External interrupt request
A2
—
—
—
G
GPIO454
GPIO
I/O
P
—
—
—
A1
IRQ5
External interrupt request
A2
—
—
—
G
GPIO455
GPIO
I/O
P
—
—
—
A1
—
—
—
A2
—
—
—
G
GPIO456
GPIO
I/O
P
—
—
—
A1
FR_A_TX
FlexRay A transfer
O
A2
—
—
—
G
GPIO457
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
I
I
I
I
88
463 ETPUC22_RXDB_
GPIO4639
516
462 ETPUC21_TXDB_
GPIO4629
416
461 ETPUC20_RXDA _
GPIO4619
324
MPC5674F Microcontroller Data Sheet, Rev. 6
460 ETPUC19_TXDA_
GPIO4609
Voltage6
459 ETPUC18_FR_A_TX_EN_
GPIO4599
Function Summary
Pad Type5
458 ETPUC17_FR_A_RX_
GPIO4589
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
—
MH
VDDEH7
—/WKPCFG
—/WKPCFG
G22
H25
H23
MH
VDDEH7
—/WKPCFG
—/WKPCFG
G20
H26
H24
MH
VDDEH7
—/WKPCFG
—/WKPCFG
G21
J23
H21
MH
VDDEH7
—/WKPCFG
—/WKPCFG
G19
J24
H25
MH
VDDEH7
—/WKPCFG
—/WKPCFG
H22
J25
H26
MH
VDDEH7
—/WKPCFG
—/WKPCFG
H21
J26
J22
P
—
—
A1
FR_A_RX
FlexRay A receive
A2
—
—
—
G
GPIO458
GPIO
I/O
P
—
—
—
A1
FR_A_TX_EN
FlexRay A transfer enable
O
A2
—
—
—
G
GPIO459
GPIO
I/O
P
—
—
—
A1
TXDA
eSCI A transmit
O
A2
—
—
—
G
GPIO460
GPIO
I/O
P
—
—
—
A1
RXDA
eSCI A receive
A2
—
—
—
G
GPIO461
GPIO
I/O
P
—
—
—
A1
TXDB
eSCI B transmit
O
A2
—
—
—
G
GPIO462
GPIO
I/O
P
—
—
—
A1
RXDB
eSCI B receive
A2
—
—
—
G
GPIO463
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
I
I
I
89
469 ETPUC28_PCSD0_
GPIO4699
516
468 ETPUC27_PCSD1_
GPIO4689
416
467 ETPUC26_PCSD2_
GPIO4679
324
466 ETPUC25_PCSD3_
GPIO4669
Voltage6
MPC5674F Microcontroller Data Sheet, Rev. 6
465 ETPUC24_PCSD4_
GPIO4659
Function Summary
Pad Type5
464 ETPUC23_PCSD5_
GPIO4649
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
—
MH
VDDEH7
—/WKPCFG
—/WKPCFG
H20
K23
J23
MH
VDDEH7
—/WKPCFG
—/WKPCFG
J22
K24
J24
MH
VDDEH7
—/WKPCFG
—/WKPCFG
K22
K25
K21
MH
VDDEH7
—/WKPCFG
—/WKPCFG
J21
K26
J25
MH
VDDEH7
—/WKPCFG
—/WKPCFG
J19
L23
J26
MH
VDDEH7
—/WKPCFG
—/WKPCFG
J20
L24
K22
90
P
—
—
A1
PCSD5
DSPI D peripheral chip select
O
A2
MAA0
ADC A Mux Address 0
O
A3
MAB0
ADC B Mux Address 0
O
G
GPIO464
GPIO
I/O
P
—
—
—
A1
PCSD4
DSPI D peripheral chip select
O
A2
MAA1
ADC A Mux Address 1
O
A4
MAB1
ADC B Mux Address 1
O
G
GPIO465
GPIO
I/O
P
—
—
—
A1
PCSD3
DSPI D peripheral chip select
O
A2
MAA2
ADC A Mux Address 2
O
A3
MAB2
ADC B Mux Address 2
O
G
GPIO466
GPIO
I/O
P
—
—
—
A1
PCSD2
DSPI D peripheral chip select
O
A2
—
—
—
G
GPIO467
GPIO
I/O
P
—
—
—
A1
PCSD1
DSPI D peripheral chip select
O
A2
—
—
—
G
GPIO468
GPIO
I/O
P
—
—
—
A1
PCSD0
DSPI D peripheral chip select
O
A2
—
—
—
G
GPIO469
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
324
416
516
MPC5674F Microcontroller Data Sheet, Rev. 6
472 ETPUC31_SIND_
GPIO4729
Voltage6
471 ETPUC30_SOUTD_
GPIO4719
Function Summary
Pad Type5
470 ETPUC29_SCKD_
GPIO4709
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
—
MH
VDDEH7
—/WKPCFG
—/WKPCFG
K21
L25
K23
MH
VDDEH7
—/WKPCFG
—/WKPCFG
K20
L26
K24
MH
VDDEH7
—/WKPCFG
—/WKPCFG
K19
M23
K25
MH
VDDEH4
—/WKPCFG
—/WKPCFG
AA9
AE10
AC13
MH
VDDEH4
—/WKPCFG
—/WKPCFG
AB9
AF10
AB13
MH
VDDEH4
—/WKPCFG
—/WKPCFG
Y10
AD11
AD13
P
—
—
A1
SCKD
DSPI D clock
I/O
A2
—
—
—
G
GPIO470
GPIO
I/O
P
—
—
—
A1
SOUTD
DSPI D data output
O
A2
—
—
—
G
GPIO471
GPIO
I/O
P
—
—
—
A1
SIND
DSPI D data input
A2
—
—
—
G
GPIO472
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
I
eMIOS
179 EMIOS0_ETPUA0_
GPIO179
180 EMIOS1_ETPUA1_
GPIO180
181 EMIOS2_ETPUA2_
GPIO181
P
EMIOS0
eMIOS channel
I/O
A1
ETPUA0
eTPU A channel
O
A2
—
—
—
G
GPIO179
GPIO
I/O
P
EMIOS1
eMIOS channel
I/O
A1
ETPUA1
eTPU A channel
O
A2
—
—
—
G
GPIO180
GPIO
I/O
P
EMIOS2
eMIOS channel
I/O
A1
ETPUA2
eTPU A channel
O
A2
—
—
—
G
GPIO181
GPIO
I/O
91
187 EMIOS8_ETPUA8_
GPIO187
516
186 EMIOS7_ETPUA7_
GPIO186
416
185 EMIOS6_ETPUA6_
GPIO185
324
MPC5674F Microcontroller Data Sheet, Rev. 6
184 EMIOS5_ETPUA5_
GPIO184
Voltage6
183 EMIOS4_ETPUA4_
GPIO183
Function Summary
Pad Type5
182 EMIOS3_ETPUA3_
GPIO182
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
MH
VDDEH4
—/WKPCFG
—/WKPCFG
AA10
AE11
AE13
MH
VDDEH4
—/WKPCFG
—/WKPCFG
AB10
AF11
AF13
MH
VDDEH4
—/WKPCFG
—/WKPCFG
Y11
AD12
AF14
MH
VDDEH4
—/WKPCFG
—/WKPCFG
—
AE12
AE14
MH
VDDEH4
—/WKPCFG
—/WKPCFG
AB11
AF12
AD14
MH
VDDEH4
—/WKPCFG
—/WKPCFG
W10
AC13
AC14
P
EMIOS3
eMIOS channel
A1
ETPUA3
eTPU A channel
O
A2
—
—
—
G
GPIO182
GPIO
I/O
P
EMIOS4
eMIOS channel
I/O
A1
ETPUA4
eTPU A channel
O
A2
—
—
—
G
GPIO183
GPIO
I/O
P
EMIOS5
eMIOS channel
I/O
A1
ETPUA5
eTPU A channel
O
A2
—
—
—
G
GPIO184
GPIO
I/O
P
EMIOS6
eMIOS channel
I/O
A1
ETPUA6
eTPU A channel
O
A2
—
—
—
G
GPIO185
GPIO
I/O
P
EMIOS7
eMIOS channel
I/O
A1
ETPUA7
eTPU A channel
O
A2
—
—
—
G
GPIO186
GPIO
I/O
P
EMIOS8
eMIOS channel
I/O
A1
ETPUA8
eTPU A channel
O
A2
—
—
—
G
GPIO187
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
92
193 EMIOS14_IRQ0_
GPIO193
516
192 EMIOS13_SOUTD_
GPIO192
416
191 EMIOS12_SOUTC_
GPIO191
324
MPC5674F Microcontroller Data Sheet, Rev. 6
190 EMIOS11_SIND_
GPIO190
Voltage6
189 EMIOS10_SCKD_
GPIO189
Function Summary
Pad Type5
188 EMIOS9_ETPUA9_
GPIO188
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
MH
VDDEH4
—/WKPCFG
—/WKPCFG
W11
AD13
AF15
MH
VDDEH4
—/WKPCFG
—/WKPCFG
AA11
AE13
AE15
MH
VDDEH4
—/WKPCFG
—/WKPCFG
AB12
AF13
AB14
MH
VDDEH4
—/WKPCFG
—/WKPCFG
AB13
AF14
AD15
MH
VDDEH4
—/WKPCFG
—/WKPCFG
AA12
AE14
AC15
MH
VDDEH4
—/WKPCFG
—/WKPCFG
Y12
AC14
AF17
P
EMIOS9
eMIOS channel
A1
ETPUA9
eTPU A channel
O
A2
—
—
—
G
GPIO188
GPIO
I/O
P
EMIOS10
eMIOS channel
I/O
A1
SCKD
DSPI D clock
O
A2
—
—
—
G
GPIO189
GPIO
I/O
P
EMIOS11
eMIOS channel
I/O
A1
SIND
DSPI D data input
A2
—
—
—
G
GPIO190
GPIO
I/O
P
EMIOS12
eMIOS channel
O
A1
SOUTC
DSPI C data output
O
A2
—
—
—
G
GPIO191
GPIO
I/O
P
EMIOS13
eMIOS channel
O
A1
SOUTD
DSPI D data output
O
A2
—
—
—
G
GPIO192
GPIO
I/O
P
EMIOS14
eMIOS channel
O
A1
IRQ0
External interrupt request
I
A2
CNTXD
FlexCAN D transmit
O
G
GPIO193
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
I
93
199 EMIOS20_ETPUB4_
GPIO199
516
198 EMIOS19_ETPUB3_
GPIO198
416
197 EMIOS18_ETPUB2_
GPIO197
324
MPC5674F Microcontroller Data Sheet, Rev. 6
196 EMIOS17_ETPUB1_
GPIO196
Voltage6
195 EMIOS16_ETPUB0_
GPIO195
Function Summary
Pad Type5
194 EMIOS15_IRQ1_
GPIO194
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
O
MH
VDDEH4
—/WKPCFG
—/WKPCFG
Y13
AD14
AE16
MH
VDDEH4
—/WKPCFG
—/WKPCFG
AB14
AF15
AD16
MH
VDDEH4
—/WKPCFG
—/WKPCFG
AA13
AE15
AB15
MH
VDDEH4
—/WKPCFG
—/WKPCFG
W12
AC15
AD17
MH
VDDEH4
—/WKPCFG
—/WKPCFG
Y14
AD15
AB16
MH
VDDEH4
—/WKPCFG
—/WKPCFG
AB15
AF16
AF16
P
EMIOS15
eMIOS channel
A1
IRQ1
External interrupt request
I
A2
CNRXD
FlexCAN D receive
I
G
GPIO194
GPIO
I/O
P
EMIOS16
eMIOS channel
I/O
A1
ETPUB0
eTPU B channel
O
A2
FR_DBG[3]
FlexRay debug
O
G
GPIO195
GPIO
I/O
P
EMIOS17
eMIOS channel
I/O
A1
ETPUB1
eTPU B channel
O
A2
FR_DBG[2]
FlexRay debug
O
G
GPIO196
GPIO
I/O
P
EMIOS18
eMIOS channel
I/O
A1
ETPUB2
eTPU B channel
O
A2
FR_DBG[1]
FlexRay debug
O
G
GPIO197
GPIO
I/O
P
EMIOS19
eMIOS channel
I/O
A1
ETPUB3
eTPU B channel
O
A2
FR_DBG[0]
FlexRay debug
O
G
GPIO198
GPIO
I/O
P
EMIOS20
eMIOS channel
I/O
A1
ETPUB4
eTPU B channel
O
A2
—
—
—
G
GPIO199
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
94
432 EMIOS26_PCSB2_
GPIO432
516
204 EMIOS25_PCSB1_
GPIO204
416
203 EMIOS24_PCSB0_
GPIO203
324
MPC5674F Microcontroller Data Sheet, Rev. 6
202 EMIOS23_ETPUB7_
GPIO202
Voltage6
201 EMIOS22_ETPUB6_
GPIO201
Function Summary
Pad Type5
200 EMIOS21_ETPUB5_
GPIO200
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
MH
VDDEH4
—/WKPCFG
—/WKPCFG
AA14
AE16
AE17
MH
VDDEH4
—/WKPCFG
—/WKPCFG
W13
AC16
AC16
MH
VDDEH4
—/WKPCFG
—/WKPCFG
Y15
AD16
AA16
MH
VDDEH4
—/WKPCFG
—/WKPCFG
AB16
AF17
AC17
MH
VDDEH4
—/WKPCFG
—/WKPCFG
AA15
AE17
AF18
MH
VDDEH4
—/WKPCFG
—/WKPCFG
Y16
AD17
AE18
P
EMIOS21
eMIOS channel
A1
ETPUB5
eTPU B channel
O
A2
—
—
—
G
GPIO200
GPIO
I/O
P
EMIOS22
eMIOS channel
I/O
A1
ETPUB6
eTPU B channel
O
A2
—
—
—
G
GPIO201
GPIO
I/O
P
EMIOS23
eMIOS channel
I/O
A1
ETPUB7
eTPU B channel
O
A2
—
—
—
G
GPIO202
GPIO
I/O
P
EMIOS24
eMIOS channel
I/O
A1
PCSB0
DSPI B peripheral chip select
O
A2
—
—
—
G
GPIO203
GPIO
I/O
P
EMIOS25
eMIOS channel
I/O
A1
PCSB1
DSPI B peripheral chip select
O
A2
—
—
—
G
GPIO204
GPIO
I/O
P
EMIOS26
eMIOS channel
I/O
A1
PCSB2
DSPI B peripheral chip select
O
A2
—
—
—
G
GPIO432
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
95
516
437 EMIOS31_PCSC5_
GPIO437
416
436 EMIOS30_PCSC2_
GPIO436
324
MPC5674F Microcontroller Data Sheet, Rev. 6
435 EMIOS29_PCSC1_
GPIO435
Voltage6
434 EMIOS28_PCSC0_
GPIO434
Function Summary
Pad Type5
433 EMIOS27_PCSB3_
GPIO433
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
MH
VDDEH4
—/WKPCFG
—/WKPCFG
W14
AC17
AD18
MH
VDDEH4
—/WKPCFG
—/WKPCFG
AA16
AF18
AC18
MH
VDDEH4
—/WKPCFG
—/WKPCFG
AA17
AE18
AB17
MH
VDDEH4
—/WKPCFG
—/WKPCFG
Y17
AD18
AF19
MH
VDDEH4
—/WKPCFG
—/WKPCFG
W15
AC18
AA17
P
EMIOS27
eMIOS channel
A1
PCSB3
DSPI B peripheral chip select
O
A2
—
—
—
G
GPIO433
GPIO
I/O
P
EMIOS28
eMIOS channel
I/O
A1
PCSC0
DSPI C peripheral chip select
O
A2
—
—
—
G
GPIO434
GPIO
I/O
P
EMIOS29
eMIOS channel
I/O
A1
PCSC1
DSPI C peripheral chip select
O
A2
—
—
—
G
GPIO435
GPIO
I/O
P
EMIOS30
eMIOS channel
I/O
A1
PCSC2
DSPI C peripheral chip select
O
A2
—
—
—
G
GPIO436
GPIO
I/O
P
EMIOS31
eMIOS channel
I/O
A1
PCSC5
DSPI C peripheral chip select
O
A2
—
—
—
G
GPIO437
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
eQADC
—
ANA0
P
ANA0
eQADC A analog input
I
AE/updown
VDDA_A1
ANA0
ANA0
A4
A4
A4
—
ANA1
P
ANA1
eQADC A analog input
I
AE/updown
VDDA_A1
ANA1
ANA1
A5
B5
B5
—
ANA2
P
ANA2
eQADC A analog input
I
AE/updown
VDDA_A1
ANA2
ANA2
B5
C5
C5
96
Voltage6
324
416
516
—
ANA3
P
ANA3
eQADC A analog input
I
AE/updown
VDDA_A1
ANA3
ANA3
B6
D6
D6
—
ANA4
P
ANA4
eQADC A analog input
I
AE/updown
VDDA_A1
ANA4
ANA4
A6
A5
A5
—
ANA5
P
ANA5
eQADC A analog input
I
AE/updown
VDDA_A1
ANA5
ANA5
A7
B6
B6
—
ANA6
P
ANA6
eQADC A analog input
I
AE/updown
VDDA_A1
ANA6
ANA6
B7
C6
C6
—
ANA7
P
ANA7
eQADC A analog input
I
AE/updown
VDDA_A1
ANA7
ANA7
B8
D7
C7
—
ANA8
P
ANA8
eQADC A analog input
I
AE
VDDA_A1
ANA8
ANA8
C5
A6
D7
—
ANA9
P
ANA9
eQADC A analog input
I
AE
VDDA_A1
ANA9
ANA9
C7
C7
A6
—
ANA10
P
ANA10
eQADC A analog input
I
AE
VDDA_A1
ANA10
ANA10
C6
B7
B7
—
ANA11
P
ANA11
eQADC A analog input
I
AE
VDDA_A1
ANA11
ANA11
D6
A7
A7
—
ANA12
P
ANA12
eQADC A analog input
I
AE
VDDA_A1
ANA12
ANA12
D7
D8
D8
—
ANA13
P
ANA13
eQADC A analog input
I
AE
VDDA_A1
ANA13
ANA13
C8
C8
C8
—
ANA14
P
ANA14
eQADC A analog input
I
AE
VDDA_A1
ANA14
ANA14
D8
B8
B8
—
ANA15
P
ANA15
eQADC A analog input
I
AE
VDDA_A1
ANA15
ANA15
A8
A8
A8
—
ANA16
P
ANA16
eQADC A analog input
I
AE
VDDA_A1
ANA16
ANA16
D9
D9
D9
—
ANA17
P
ANA17
eQADC A analog input
I
AE
VDDA_A1
ANA17
ANA17
C9
C9
C9
—
ANA18
P
ANA18
eQADC A analog input
I
AE
VDDA_A1
ANA18
ANA18
D10
D10
D10
—
ANA19
P
ANA19
eQADC A analog input
I
AE
VDDA_A1
ANA19
ANA19
C10
C10
C10
—
ANA20
P
ANA20
eQADC A analog input
I
AE
VDDA_A1
ANA20
ANA20
D11
D11
D11
—
ANA21
P
ANA21
eQADC A analog input
I
AE
VDDA_A1
ANA21
ANA21
C11
C11
C11
—
ANA22
P
ANA22
eQADC A analog input
I
AE
VDDA_A1
ANA22
ANA22
D12
D12
C12
—
ANA23
P
ANA23
eQADC A analog input
I
AE
VDDA_A1
ANA23
ANA23
C12
C12
D12
—
AN24
P
AN24
eQADC A and B shared analog input
I
AE
VDDA_A0
AN24
AN24
—
B12
B12
—
AN25
P
AN25
eQADC A and B shared analog input
I
AE
VDDA_A0
AN25
AN25
—
D13
C13
—
AN26
P
AN26
eQADC A and B shared analog input
I
AE
VDDA_A0
AN26
AN26
—
C13
D13
Signal
Name2
P/A/G3
Pad Type5
MPC5674F Microcontroller Data Sheet, Rev. 6
97
Direction
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
Function4
Function Summary
Package Location
State during
State
RESET7
after RESET8
Voltage6
324
416
516
—
AN27
P
AN27
eQADC A and B shared analog input
I
AE
VDDA_A0
AN27
AN27
—
B13
B13
—
AN28
P
AN28
eQADC A and B shared analog input
I
AE
VDDA_A0
AN28
AN28
—
A13
A13
—
AN29
P
AN29
eQADC A and B shared analog input
I
AE
VDDA_A0
AN29
AN29
—
B14
A14
—
AN30
P
AN30
eQADC A and B shared analog input
I
AE
VDDA_B1
AN30
AN30
—
C14
B14
—
AN31
P
AN31
eQADC A and B shared analog input
I
AE
VDDA_B1
AN31
AN31
—
D14
C14
—
AN32
P
AN32
eQADC A and B shared analog input
I
AE
VDDA_B1
AN32
AN32
—
A14
B15
—
AN33
P
AN33
eQADC A and B shared analog input
I
AE
VDDA_B0
AN33
AN33
—
B15
D14
—
AN34
P
AN34
eQADC A and B shared analog input
I
AE
VDDA_B0
AN34
AN34
—
C15
C15
—
AN35
P
AN35
eQADC A and B shared analog input
I
AE
VDDA_B0
AN35
AN35
—
D15
D15
—
AN36
P
AN36
eQADC A and B shared analog input
I
AE
VDDA_B1
AN36
AN36
—
A15
A15
—
AN37
P
AN37
eQADC A and B shared analog input
I
AE
VDDA_B0
AN37
AN37
—
C16
C17
—
AN38
P
AN38
eQADC A and B shared analog input
I
AE
VDDA_B0
AN38
AN38
—
C17
D16
—
AN39
P
AN39
eQADC A and B shared analog input
I
AE
VDDA_B0
AN39
AN39
—
D16
C16
—
ANB0
P
ANB0
eQADC B analog input
I
AE/updown
VDDA_B0
ANB0
ANB0
B15
C18
C18
—
ANB1
P
ANB1
eQADC B analog input
I
AE/updown
VDDA_B0
ANB1
ANB1
B16
D17
D17
—
ANB2
P
ANB2
eQADC B analog input
I
AE/updown
VDDA_B0
ANB2
ANB2
A17
D18
D18
—
ANB3
P
ANB3
eQADC B analog input
I
AE/updown
VDDA_B0
ANB3
ANB3
A18
D19
D19
—
ANB4
P
ANB4
eQADC B analog input
I
AE/updown
VDDA_B0
ANB4
ANB4
B17
C19
B19
—
ANB5
P
ANB5
eQADC B analog input
I
AE/updown
VDDA_B0
ANB5
ANB5
B18
C20
A20
—
ANB6
P
ANB6
eQADC B analog input
I
AE/updown
VDDA_B0
ANB6
ANB6
A19
B19
C20
—
ANB7
P
ANB7
eQADC B analog input
I
AE/updown
VDDA_B0
ANB7
ANB7
A20
A20
C19
—
ANB8
P
ANB8
eQADC B analog input
I
AE
VDDA_B0
ANB8
ANB8
D13
B20
B20
Signal
Name2
P/A/G3
Pad Type5
MPC5674F Microcontroller Data Sheet, Rev. 6
98
Direction
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
Function4
Function Summary
Package Location
State during
State
RESET7
after RESET8
Voltage6
324
416
516
—
ANB9
P
ANB9
eQADC B analog input
I
AE
VDDA_B0
ANB9
ANB9
C14
D20
A21
—
ANB10
P
ANB10
eQADC B analog input
I
AE
VDDA_B0
ANB10
ANB10
C13
B21
B21
—
ANB11
P
ANB11
eQADC B analog input
I
AE
VDDA_B0
ANB11
ANB11
C15
A21
C21
—
ANB12
P
ANB12
eQADC B analog input
I
AE
VDDA_B0
ANB12
ANB12
C16
C21
A22
—
ANB13
P
ANB13
eQADC B analog input
I
AE
VDDA_B0
ANB13
ANB13
D14
D21
B22
—
ANB14
P
ANB14
eQADC B analog input
I
AE
VDDA_B0
ANB14
ANB14
C17
A22
D20
—
ANB15
P
ANB15
eQADC B analog input
I
AE
VDDA_B0
ANB15
ANB15
D15
B22
C22
—
ANB16
P
ANB16
eQADC B analog input
I
AE
VDDA_B0
ANB16
ANB16
C18
C22
D21
—
ANB17
P
ANB17
eQADC B analog input
I
AE
VDDA_B0
ANB17
ANB17
D16
A23
D22
—
ANB18
P
ANB18
eQADC B analog input
I
AE
VDDA_B0
ANB18
ANB18
D17
B23
A23
—
ANB19
P
ANB19
eQADC B analog input
I
AE
VDDA_B0
ANB19
ANB19
B19
C23
B23
—
ANB20
P
ANB20
eQADC B analog input
I
AE
VDDA_B0
ANB20
ANB20
C19
D22
C23
—
ANB21
P
ANB21
eQADC B analog input
I
AE
VDDA_B0
ANB21
ANB21
D18
A24
A24
—
ANB22
P
ANB22
eQADC B analog input
I
AE
VDDA_B0
ANB22
ANB22
A21
B24
B24
—
ANB23
P
ANB23
eQADC B analog input
I
AE
VDDA_B0
ANB23
ANB23
B20
A25
E20
—
VRH_A
P
VRH_A
ADC A Voltage reference high
I
VDDINT
VRH_A
VRH_A
VRH_A
A10
A12
A12
—
VRL_A
P
VRL_A
ADC A Voltage reference low
I
VSSINT
VRL_A
VRL_A
VRL_A
A11
A11
A11
—
VRH_B
P
VRH_B
ADC B Voltage reference high
I
VDDINT
VRH_B
VRH_B
VRH_B
A16
A19
A19
—
VRL_B
P
VRL_B
ADC B Voltage reference low
I
VSSINT
VRL_B
VRL_B
VRL_B
A15
A18
A18
—
REFBYPCB
P
REFBYPCB
ADC B Reference bypass capacitor
I
AE
VDDA_B0
REFBYPCB
REFBYPCB
B12
B18
B18
—
REFBYPCA
P
REFBYPCA
ADC A Reference bypass capacitor
I
AE
VDDA_A1
REFBYPCA
REFBYPCA
B11
B11
B11
—
VDDA_A0
P
VDDA_A
Internal logic supply input
I
VDDE
VDDA_A0
VDDA_A0
VDDA_A0
A9
A9
A9
—
VDDA_A1
P
VDDA_A
Internal logic supply input
I
VDDE
VDDA_A1
VDDA_A1
VDDA_A1
B9
B9
B9
—
REFBYPCA1
P
REFBYPCA1
ADC A Reference bypass capacitor
I
AE
VDDA_A1
REFBYPCA1
REFBYPCA1
A12
A10
A10
—
VSSA_A1
P
VSSA_A
Ground
I
VSSE
VSSA_A1
VSSA_A1
VSSA_A1
B10
B10
B10
—
VDDA_B0
P
VDDA_B
Internal logic supply input
I
VDDE
VDDA_B0
VDDA_B0
VDDA_B0
A13
A16
A16
—
VDDA_B1
P
VDDA_B
Internal logic supply input
I
VDDE
VDDA_B1
VDDA_B1
VDDA_B1
B13
B16
B16
Signal
Name2
P/A/G3
Pad Type5
MPC5674F Microcontroller Data Sheet, Rev. 6
99
Direction
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
Function4
Function Summary
Package Location
State during
State
RESET7
after RESET8
Pad Type5
Voltage6
324
416
516
—
VSSA_B0
P
VSSA_B
Ground
I
VSSE
VSSA_B0
VSSA_B0
VSSA_B0
B14
B17
B17
—
REFBYPCB1
P
REFBYPCB1
ADC B Reference bypass capacitor
I
AE
VDDA_B0
REFBYPCB1
REFBYPCB1
A14
A17
A17
FS
VDDE2
—/Up
—/Up
(–/– for Rev.1 of (–/– for Rev.1 of
the device)
the device)
Y5
AD4
AD4
FS
VDDE2
—/Up
—/Up
(–/– for Rev.1 of (–/– for Rev.1 of
the device)
the device)
AA4
AE3
AE3
FS
VDDE2
—/Up
—/Up
(–/– for Rev.1 of (–/– for Rev.1 of
the device)
the device)
AB3
AF3
AF3
FS
VDDE2
—/Up
—/Up
(–/– for Rev.1 of (–/– for Rev.1 of
the device)
the device)
Y6
AD5
AD5
FS
VDDE2
—/Up
—/Up
(–/– for Rev.1 of (–/– for Rev.1 of
the device)
the device)
AA5
AE4
AE4
Signal
Name2
P/A/G3
Direction
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
Function4
Function Summary
Package Location
State during
State
RESET7
after RESET8
FlexRay
248 FR_A_TX_
GPIO248
MPC5674F Microcontroller Data Sheet, Rev. 6
249 FR_A_RX_
GPIO249
250 FR_A_TX_EN_
GPIO250
251 FR_B_TX_
GPIO251
252 FR_B_RX_
GPIO252
P
FR_A_TX
FlexRay A transfer
O
A1
—
—
—
A2
—
—
—
G
GPIO248
GPIO
I/O
P
FR_A_RX
FlexRay A receive
A1
—
—
—
A2
—
—
—
G
GPIO249
GPIO
I/O
P
FR_A_TX_EN
FlexRay A transfer enable
O
A1
—
—
—
A2
—
—
—
G
GPIO250
GPIO
I/O
P
FR_B_TX
FlexRay B transfer
O
A1
—
—
—
A2
—
—
—
G
GPIO251
GPIO
I/O
P
FR_B_RX
FlexRay B receive
A1
—
—
—
A2
—
—
—
G
GPIO252
GPIO
I/O
I
I
100
Voltage6
O
FS
VDDE2
MH
VDDEH4
—/Up
MH
VDDEH4
MH
FlexRay B transfer enable
A1
—
—
—
A2
—
—
—
G
GPIO253
GPIO
I/O
516
FR_B_TX_EN
416
P
Package Location
State during
State
RESET7
after RESET8
324
Function Summary
Pad Type5
253 FR_B_TX_EN_
GPIO253
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
AB5
AF4
AF4
—/Up
AB17
AF19
AE19
—/Up
—/Up
AA18
AE19
AD19
VDDEH4
—/Up
—/Up
Y18
AD19
AC19
MH
VDDEH4
—/Up
—/Up
W18
AC19
AA19
MH
VDDEH4
—/Up
—/Up
W16
AF20
AF20
—/Up
—/Up
(–/– for Rev.1 of (–/– for Rev.1 of
the device)
the device)
FlexCAN
MPC5674F Microcontroller Data Sheet, Rev. 6
83
84
85
86
87
CNTXA_TXDA_
GPIO83
CNRXA_RXDA_
GPIO84
CNTXB_PCSC3_
GPIO85
CNRXB_PCSC4_
GPIO86
CNTXC_PCSD3_
GPIO87
P
CNTXA
FlexCAN A transmit
O
A1
TXDA
eSCI A transmit
O
A2
—
—
—
G
GPIO83
GPIO
I/O
P
CNRXA
FlexCAN A receive
I
A1
RXDA
eSCI A receive
I
A2
—
—
—
G
GPIO84
GPIO
I/O
P
CNTXB
FlexCAN B transmit
O
A1
PCSC3
DSPI C peripheral chip select
O
A2
—
—
—
G
GPIO85
GPIO
I/O
P
CNRXB
FlexCAN B receive
I
A1
PCSC4
DSPI C peripheral chip select
O
A2
—
—
—
G
GPIO86
GPIO
I/O
P
CNTXC
FlexCAN C transmit
O
A1
PCSD3
DSPI D peripheral chip select
O
A2
—
—
—
G
GPIO87
GPIO
I/O
101
324
416
516
MPC5674F Microcontroller Data Sheet, Rev. 6
247 CNRXD_
GPIO247
Voltage6
246 CNTXD_
GPIO246
Function Summary
Pad Type5
CNRXC_PCSD4_
GPIO88
Function4
Direction
88
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I
MH
VDDEH4
—/Up
—/Up
W17
AE20
AE20
MH
VDDEH4
—/Up
—/Up
AB21
AD20
AD20
MH
VDDEH4
—/Up
—/Up
Y19
AC20
AC20
MH
VDDEH1
—/Up
—/Up
—
M2
K2
MH
VDDEH1
—/Up
—/Up
—
M3
K3
MH
VDDEH1
—/Up
—/Up
—
P1
K1
P
CNRXC
FlexCAN C receive
A1
PCSD4
DSPI D peripheral chip select
O
A2
—
—
—
G
GPIO88
GPIO
I/O
P
CNTXD
FlexCAN D transmit
O
A1
—
—
—
A2
—
—
—
G
GPIO246
GPIO
I/O
P
CNRXD
FlexCAN D receive
A1
—
—
—
A2
—
—
—
G
GPIO247
GPIO
I/O
I
Package Location
State during
State
RESET7
after RESET8
eSCI
89
90
91
TXDA_
GPIO89
RXDA _
GPIO90
TXDB_PCSD1_
GPIO91
P
TXDA
eSCI A transmit
O
A1
—
—
—
A2
—
—
—
G
GPIO89
GPIO
I/O
P
RXDA
eSCI A receive
A1
—
—
—
A2
—
—
—
G
GPIO90
GPIO
I
P
TXDB
eSCI B transmit
O
A1
PCSD1
DSPI D peripheral chip select
O
A2
—
—
—
G
GPIO91
GPIO
I/O
I
102
324
416
516
MPC5674F Microcontroller Data Sheet, Rev. 6
245 RXDC_
GPIO245
Voltage6
244 TXDC_ETRIG0_
GPIO244
Function Summary
Pad Type5
RXDB_PCSD5_
GPIO92
Function4
Direction
92
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I
MH
VDDEH1
—/Up
—/Up
—
N1
L5
MH
VDDEH4
—/Up
—/Up
—
AF23
AF23
MH
VDDEH5
—/Up
—/Up
—
AD22
AD22
MH
VDDEH3
—/Up
—/Up
Y7
AD8
AB8
MH
VDDEH3
—/Up
—/Up
AA7
AF7
AE7
MH
VDDEH3
—/Up
—/Up
AB7
AD7
AC7
P
RXDB
eSCI B receive
A1
PCSD5
DSPI D peripheral chip select
O
A2
—
—
—
G
GPIO92
GPIO
I/O
P
TXDC
eSCI C transmit
O
A1
ETRIG0
eQADC trigger input
I
A2
—
—
—
G
GPIO244
GPIO
I/O
P
RXDC
eSCI C receive
A1
—
—
—
A2
—
—
—
G
GPIO245
GPIO
I/O
I
Package Location
State during
State
RESET7
after RESET8
DSPI
93
94
95
SCKA_PCSC1_
GPIO93
SINA_PCSC2_
GPIO94
SOUTA_PCSC5_
GPIO95
P
SCKA
DSPI A clock
I/O
A1
PCSC1
DSPI C peripheral chip select
O
A2
—
—
—
G
GPIO93
GPIO
I/O
P
SINA
DSPI A data input
I
A1
PCSC2
DSPI C peripheral chip select
O
A2
—
—
—
G
GPIO94
GPIO
I/O
P
SOUTA
DSPI A data output
O
A1
PCSC5
DSPI C peripheral chip select
O
A2
—
—
—
G
GPIO95
GPIO
I/O
103
101 PCSA5_ETRIG1_
GPIO101
516
100 PCSA4_
GPIO100
416
PCSA3_
GPIO99
324
99
PCSA2_
GPIO98
Voltage6
MPC5674F Microcontroller Data Sheet, Rev. 6
98
PCSA1_
GPIO97
Function Summary
Pad Type5
97
PCSA0_PCSD2_
GPIO96
Function4
Direction
96
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
MH
VDDEH3
—/Up
—/Up
AB6
AE6
AD6
MH
VDDEH3
—/Up
—/Up
—
AC6
AC6
MH
VDDEH3
—/Up
—/Up
—
AC7
AF6
MH
VDDEH3
—/Up
—/Up
—
AE7
AD7
MH
VDDEH3
—/Up
—/Up
—
AE5
AE5
MH
VDDEH3
—/Up
—/Up
AA6
AD6
AA8
P
PCSA0
DSPI A peripheral chip select
A1
PCSD2
DSPI D peripheral chip select
O
A2
—
—
—
G
GPIO96
GPIO
I/O
P
PCSA1
DSPI A peripheral chip select
O
A1
—
—
—
A2
—
—
—
G
GPIO97
GPIO
I/O
P
PCSA2
DSPI A peripheral chip select
O
A1
—
—
—
A2
—
—
—
G
GPIO98
GPIO
I/O
P
PCSA3
DSPI A peripheral chip select
O
A1
—
—
—
A2
—
—
—
G
GPIO99
GPIO
I/O
P
PCSA4
DSPI A peripheral chip select
O
A1
—
—
—
A2
—
—
—
G
GPIO100
GPIO
I/O
P
PCSA5
DSPI A peripheral chip select
O
A1
ETRIG1
eQADC trigger input
I
A2
—
—
—
G
GPIO101
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
104
107 PCSB2_SOUTC_
GPIO107
516
106 PCSB1_PCSD0_
GPIO106
416
105 PCSB0_PCSD2_
GPIO105
324
MPC5674F Microcontroller Data Sheet, Rev. 6
104 SOUTB_
GPIO104
Voltage6
103 SINB_
GPIO103
Function Summary
Pad Type5
102 SCKB_
GPIO102
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
MH
VDDEH3
—/Up
—/Up
Y8
AE8
AC8
MH
VDDEH3
—/Up
—/Up
AA8
AE9
AB9
MH
VDDEH3
—/Up
—/Up
AB8
AF9
AA10
MH
VDDEH3
—/Up
—/Up
Y9
AD9
AF8
MH
VDDEH3
—/Up
—/Up
—
AC9
AE8
MH
VDDEH3
—/Up
—/Up
W7
AF8
AD8
P
SCKB
DSPI B clock
A1
—
—
—
A2
—
—
—
G
GPIO102
GPIO
I/O
P
SINB
DSPI B data input
A1
—
—
—
A2
—
—
—
G
GPIO103
GPIO
I/O
P
SOUTB
DSPI B data output
O
A1
—
—
—
A2
—
—
—
G
GPIO104
GPIO
I/O
P
PCSB0
DSPI B peripheral chip select
I/O
A1
PCSD2
DSPI D peripheral chip select
O
A2
—
—
—
G
GPIO105
GPIO
I/O
P
PCSB1
DSPI B peripheral chip select
O
A1
PCSD0
DSPI D peripheral chip select
I/O
A2
—
—
—
G
GPIO106
GPIO
I/O
P
PCSB2
DSPI B peripheral chip select
O
A1
SOUTC
DSPI C data output
O
A2
—
—
—
G
GPIO107
GPIO
I/O
I
Package Location
State during
State
RESET7
after RESET8
105
237 SOUTC_SOUT_C_LVDSP_
GPIO237
516
236 SINC_SCK_C_LVDSM_
GPIO236
416
235 SCKC_SCK_C_LVDSP_
GPIO235
324
MPC5674F Microcontroller Data Sheet, Rev. 6
110 PCSB5_PCSC0_
GPIO110
Voltage6
109 PCSB4_SCKC_
GPIO109
Function Summary
Pad Type5
108 PCSB3_SINC_
GPIO108
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
O
MH
VDDEH3
—/Up
—/Up
—
AD10
AC9
MH
VDDEH3
—/Up
—/Up
—
AC8
AF7
MH
VDDEH3
—/Up
—/Up
—
AF6
AE6
MH+
LVDS
VDDEH4
—/Up
—/Up
AA19
AD21
AD21
MH+
LVDS
VDDEH4
—/Up
—/Up
AA20
AE22
AE22
MH+
LVDS
VDDEH4
—/Up
—/Up
AB18
AF21
AF21
P
PCSB3
DSPI B peripheral chip select
A1
SINC
DSPI C data input
I
A2
—
—
—
G
GPIO108
GPIO
I/O
P
PCSB4
DSPI B peripheral chip select
O
A1
SCKC
DSPI C clock
I/O
A2
—
—
—
G
GPIO109
GPIO
I/O
P
PCSB5
DSPI B peripheral chip select
O
A1
PCSC0
DSPI C peripheral chip select
I/O
A2
—
—
—
G
GPIO110
GPIO
I/O
P
SCKC
DSPI C clock
I/O
A1
SCK_C_LVDSP
LVDS+ downstream signal positive
output clock
O
A2
—
—
—
G
GPIO235
GPIO
I/O
P
SINC
DSPI C data input
I
A1
SCK_C_LVDSM
LVDS– downstream signal negative
output clock
O
A2
—
—
—
G
GPIO236
GPIO
I/O
P
SOUTC
DSPI C data output
O
A1
SOUT_C_LVDSP
LVDS+ downstream signal positive
output data
O
A2
—
—
—
G
GPIO237
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
106
243 PCSC5_GPIO243
516
242 PCSC4_GPIO242
416
241 PCSC3_GPIO241
324
240 PCSC2_GPIO240
Voltage6
MPC5674F Microcontroller Data Sheet, Rev. 6
239 PCSC1_
GPIO239
Function Summary
Pad Type5
238 PCSC0_SOUT_C_LVDSM_
GPIO238
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
MH+
LVDS
VDDEH4
—/Up
—/Up
AB19
AE21
AE21
MH
VDDEH4
—/Up
—/Up
—
AC22
AC22
MH
VDDEH5
—/Up
—/Up
—
AE23
AE23
MH
VDDEH5
—/Up
—/Up
—
AD23
AD23
MH
VDDEH5
—/Up
—/Up
—
AF24
AF24
MH
VDDEH5
—/Up
—/Up
—
AE24
AE24
P
PCSC0
DSPI C peripheral chip select
A1
SOUT_C_LVDSM
LVDS– downstream signal negative
output data
O
A2
—
—
—
G
GPIO238
GPIO
I/O
P
PCSC1
DSPI C peripheral chip select
O
A1
—
—
—
A2
—
—
—
G
GPIO239
GPIO
I/O
P
PCSC2
DSPI C peripheral chip select
O
A1
—
—
—
A2
—
—
—
G
GPIO240
GPIO
I/O
P
PCSC3
DSPI C peripheral chip select
O
A1
—
—
—
A2
—
—
—
G
GPIO241
GPIO
I/O
P
PCSC4
DSPI C peripheral chip select
O
A1
—
—
—
A2
—
—
—
G
GPIO242
GPIO
I/O
P
PCSC5
DSPI C peripheral chip select
O
A1
—
—
—
A2
—
—
—
G
GPIO243
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
107
Voltage6
324
416
516
Function Summary
Pad Type5
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
O
F
VDDE9
—/Up
—/Up
—
—
AD9
F
VDDE8
—/Up
—/Up
—
—
U1
F
VDDE8
—/Up
—/Up
—
—
T6
F
VDDE8
—/Up
—/Up
—
—
R1
F
VDDE8
—/Up
—/Up
—
—
R2
F
VDDE8
—/Up
—/Up
—
—
R3
Package Location
State during
State
RESET7
after RESET8
EBI
256 D_CS0_
GPIO256
MPC5674F Microcontroller Data Sheet, Rev. 6
257 D_CS2_D_ADD_DAT31_
GPIO257
258 D_CS3_D_TEA_
GPIO258
259 D_ADD12_
GPIO259
260 D_ADD13_
GPIO260
261 D_ADD14_
GPIO261
P
D_CS0
EBI chip select 0
A1
—
—
—
A2
—
—
—
G
GPIO256
GPIO
I/O
P
D_CS2
EBI chip select 2
O
A1
D_ADD_DAT31
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A2
—
—
—
G
GPIO257
GPIO
I/O
P
D_CS3
EBI chip select 3
O
A1
D_TEA
EBI transfer error acknowledge
I
A2
—
—
—
G
GPIO258
GPIO
I/O
P
D_ADD12
EBI address bus
I/O
A1
—
—
—
A2
—
—
—
G
GPIO259
GPIO
I/O
P
D_ADD13
EBI address bus
I/O
A1
—
—
—
A2
—
—
—
G
GPIO260
GPIO
I/O
P
D_ADD14
EBI address bus
I/O
A1
—
—
—
A2
—
—
—
G
GPIO261
GPIO
I/O
108
267 D_ADD20_D_ADD_DAT20_
GPIO267
516
266 D_ADD19_D_ADD_DAT19_
GPIO266
416
265 D_ADD18_D_ADD_DAT18_
GPIO265
324
MPC5674F Microcontroller Data Sheet, Rev. 6
264 D_ADD17_D_ADD_DAT17_
GPIO264
Voltage6
263 D_ADD16_D_ADD_DAT16_
GPIO263
Function Summary
Pad Type5
262 D_ADD15_
GPIO262
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
F
VDDE8
—/Up
—/Up
—
—
R4
F
VDDE8
—/Up
—/Up
—
—
R5
F
VDDE8
—/Up
—/Up
—
—
T5
F
VDDE8
—/Up
—/Up
—
—
T2
F
VDDE8
—/Up
—/Up
—
—
T3
F
VDDE8
—/Up
—/Up
—
—
T4
109
P
D_ADD15
EBI address bus
A1
—
—
—
A2
—
—
—
G
GPIO262
GPIO
I/O
P
D_ADD16
EBI address bus
I/O
A1
D_ADD_DAT16
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A2
—
—
—
G
GPIO263
GPIO
I/O
P
D_ADD17
EBI address bus
I/O
A1
D_ADD_DAT17
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A2
—
—
—
G
GPIO264
GPIO
I/O
P
D_ADD18
EBI address bus
I/O
A1
D_ADD_DAT18
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A2
—
—
—
G
GPIO265
GPIO
I/O
P
D_ADD19
EBI address bus
I/O
A1
D_ADD_DAT19
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A2
—
—
—
G
GPIO266
GPIO
I/O
P
D_ADD20
EBI address bus
I/O
A1
D_ADD_DAT20
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A2
—
—
—
G
GPIO267
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
516
272 D_ADD25_D_ADD_DAT25_
GPIO272
416
271 D_ADD24_D_ADD_DAT24_
GPIO271
324
270 D_ADD23_D_ADD_DAT23_
GPIO270
Voltage6
MPC5674F Microcontroller Data Sheet, Rev. 6
269 D_ADD22_D_ADD_DAT22_
GPIO269
Function Summary
Pad Type5
268 D_ADD21_D_ADD_DAT21_
GPIO268
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
F
VDDE9
—/Up
—/Up
—
—
AB11
F
VDDE9
—/Up
—/Up
—
—
AD10
F
VDDE9
—/Up
—/Up
—
—
AE10
F
VDDE9
—/Up
—/Up
—
—
AF10
F
VDDE9
—/Up
—/Up
—
—
AD11
P
D_ADD21
EBI address bus
A1
D_ADD_DAT21
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A2
—
—
—
G
GPIO268
GPIO
I/O
P
D_ADD22
EBI address bus
I/O
A1
D_ADD_DAT22
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A2
—
—
—
G
GPIO269
GPIO
I/O
P
D_ADD23
EBI address bus
I/O
A1
D_ADD_DAT23
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A2
—
—
—
G
GPIO270
GPIO
I/O
P
D_ADD24
EBI address bus
I/O
A1
D_ADD_DAT24
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A2
—
—
—
G
GPIO271
GPIO
I/O
P
D_ADD25
EBI address bus
I/O
A1
D_ADD_DAT25
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A2
—
—
—
G
GPIO272
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
110
516
277 D_ADD30_D_ADD_DAT30_
GPIO277
416
276 D_ADD29_D_ADD_DAT29_
GPIO276
324
275 D_ADD28_D_ADD_DAT28_
GPIO275
Voltage6
MPC5674F Microcontroller Data Sheet, Rev. 6
274 D_ADD27_D_ADD_DAT27_
GPIO274
Function Summary
Pad Type5
273 D_ADD26_D_ADD_DAT26_
GPIO273
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
F
VDDE9
—/Up
—/Up
—
—
AE11
F
VDDE9
—/Up
—/Up
—
—
AF11
F
VDDE9
—/Up
—/Up
—
—
AD12
F
VDDE9
—/Up
—/Up
—
—
AB12
F
VDDE9
—/Up
—/Up
—
—
AE12
P
D_ADD26
EBI address bus
A1
D_ADD_DAT26
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A2
—
—
—
G
GPIO273
GPIO
I/O
P
D_ADD27
EBI address bus
I/O
A1
D_ADD_DAT27
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A2
—
—
—
G
GPIO274
GPIO
I/O
P
D_ADD28
EBI address bus
I/O
A1
D_ADD_DAT28
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A2
—
—
—
G
GPIO275
GPIO
I/O
P
D_ADD29
EBI address bus
I/O
A1
D_ADD_DAT29
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A2
—
—
—
G
GPIO276
GPIO
I/O
P
D_ADD30
EBI address bus
I/O
A1
D_ADD_DAT30
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A2
—
—
—
G
GPIO277
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
111
516
282 D_ADD_DAT4_
GPIO282
416
281 D_ADD_DAT3_
GPIO281
324
280 D_ADD_DAT2_
GPIO280
Voltage6
MPC5674F Microcontroller Data Sheet, Rev. 6
279 D_ADD_DAT1_
GPIO279
Function Summary
Pad Type5
278 D_ADD_DAT0_
GPIO278
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
F
VDDE10
—/Up
—/Up
—
—
P25
F
VDDE10
—/Up
—/Up
—
—
P26
F
VDDE10
—/Up
—/Up
—
—
N24
F
VDDE10
—/Up
—/Up
—
—
N25
F
VDDE10
—/Up
—/Up
—
—
N26
P
D_ADD_DAT0
EBI data only in non-mux mode.
Address and data in mux mode.
A1
—
—
—
A2
—
—
—
G
GPIO278
GPIO
I/O
P
D_ADD_DAT1
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A1
—
—
—
A2
—
—
—
G
GPIO279
GPIO
I/O
P
D_ADD_DAT2
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A1
—
—
—
A2
—
—
—
G
GPIO280
GPIO
I/O
P
D_ADD_DAT3
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A1
—
—
—
A2
—
—
—
G
GPIO281
GPIO
I/O
P
D_ADD_DAT4
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A1
—
—
—
A2
—
—
—
G
GPIO282
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
112
516
287 D_ADD_DAT9_
GPIO287
416
286 D_ADD_DAT8_
GPIO286
324
285 D_ADD_DAT7_
GPIO285
Voltage6
MPC5674F Microcontroller Data Sheet, Rev. 6
284 D_ADD_DAT6_
GPIO284
Function Summary
Pad Type5
283 D_ADD_DAT5_
GPIO283
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
F
VDDE10
—/Up
—/Up
—
—
M25
F
VDDE10
—/Up
—/Up
—
—
N22
F
VDDE10
—/Up
—/Up
—
—
M24
F
VDDE10
—/Up
—/Up
—
—
M23
F
VDDE10
—/Up
—/Up
—
—
M22
P
D_ADD_DAT5
EBI data only in non-mux mode.
Address and data in mux mode.
A1
—
—
—
A2
—
—
—
G
GPIO283
GPIO
I/O
P
D_ADD_DAT6
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A1
—
—
—
A2
—
—
—
G
GPIO284
GPIO
I/O
P
D_ADD_DAT7
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A1
—
—
—
A2
—
—
—
G
GPIO285
GPIO
I/O
P
D_ADD_DAT8
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A1
—
—
—
A2
—
—
—
G
GPIO286
GPIO
I/O
P
D_ADD_DAT9
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A1
—
—
—
A2
—
—
—
G
GPIO287
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
113
516
292 D_ADD_DAT14_GPIO292
416
291 D_ADD_DAT13
_GPIO291
324
290 D_ADD_DAT12_
GPIO290
Voltage6
MPC5674F Microcontroller Data Sheet, Rev. 6
289 D_ADD_DAT11_
GPIO289
Function Summary
Pad Type5
288 D_ADD_DAT10_
GPIO288
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
F
VDDE10
—/Up
—/Up
—
—
L26
F
VDDE10
—/Up
—/Up
—
—
L25
F
VDDE10
—/Up
—/Up
—
—
L24
F
VDDE10
—/Up
—/Up
—
—
L23
F
VDDE10
—/Up
—/Up
—
—
L22
P
D_ADD_DAT10
EBI data only in non-mux mode.
Address and data in mux mode.
A1
—
—
—
A2
—
—
—
G
GPIO288
GPIO
I/O
P
D_ADD_DAT11
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A1
—
—
—
A2
—
—
—
G
GPIO289
GPIO
I/O
P
D_ADD_DAT12
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A1
—
—
—
A2
—
—
—
G
GPIO290
GPIO
I/O
P
D_ADD_DAT13
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A1
—
—
—
A2
—
—
—
G
GPIO291
GPIO
I/O
P
D_ADD_DAT14
EBI data only in non-mux mode.
Address and data in mux mode.
I/O
A1
—
—
—
A2
—
—
—
G
GPIO292
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
114
298 D_TS_GPIO298
516
297 D_OE_GPIO297
416
296 D_WE1_GPIO296
324
MPC5674F Microcontroller Data Sheet, Rev. 6
295 D_WE0_GPIO295
Voltage6
294 D_RD_WR_GPIO294
Function Summary
Pad Type5
293 D_ADD_DAT15_GPIO293
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
F
VDDE10
—/Up
—/Up
—
—
K26
F
VDDE10
—/Up
—/Up
—
—
R26
F
VDDE8
—/Up
—/Up
—
—
N1
F
VDDE8
—/Up
—/Up
—
—
P5
F
VDDE10
—/Up
—/Up
—
—
P23
F
VDDE9
—/Up
—/Up
—
—
AE9
P
D_ADD_DAT15
EBI data only in non-mux mode.
Address and data in mux mode.
A1
—
—
—
A2
—
—
—
G
GPIO293
GPIO
I/O
P
D_RD_WR
EBI read/write
O
A1
—
—
—
A2
—
—
—
G
GPIO294
GPIO
I/O
P
D_WE0
EBI write enable
O
A1
—
—
—
A2
—
—
—
G
GPIO295
GPIO
I/O
P
D_WE1
EBI write enable
O
A1
—
—
—
A2
—
—
—
G
GPIO296
GPIO
I/O
P
D_OE
EBI output enable
O
A1
—
—
—
A2
—
—
—
G
GPIO297
GPIO
I/O
P
D_TS
EBI transfer start
O
A1
—
—
—
A2
—
—
—
G
GPIO298
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
115
304 D_WE3_GPIO304
516
303 D_WE2_GPIO303
416
302 D_BDIP_GPIO302
324
MPC5674F Microcontroller Data Sheet, Rev. 6
301 D_CS1_GPIO301
Voltage6
300 D_TA_GPIO300
Function Summary
Pad Type5
299 D_ALE_GPIO299
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
O
F
VDDE10
—/Up
—/Up
—
—
P24
F
VDDE9
—/Up
—/Up
—
—
AF9
F
VDDE9
—/Up
—/Up
—
—
AB10
F
VDDE8
—/Up
—/Up
—
—
M2
F
VDDE8
—/Up
—/Up
—
—
N2
F
VDDE8
—/Up
—/Up
—
—
N3
P
D_ALE
EBI Address Latch Enable
A1
—
—
—
A2
—
—
—
G
GPIO299
GPIO
I/O
P
D_TA
EBI transfer acknowledge
I/O
A1
—
—
—
A2
—
—
—
G
GPIO300
GPIO
I/O
P
D_CS1
EBI chip select
O
A1
—
—
—
A2
—
—
—
G
GPIO301
GPIO
I/O
P
D_BDIP
EBI burst data in progress
O
A1
—
—
—
A2
—
—
—
G
GPIO302
GPIO
I/O
P
D_WE2
EBI write enable
O
A1
—
—
—
A2
—
—
—
G
GPIO303
GPIO
I/O
P
D_WE3
EBI write enable
O
A1
—
—
—
A2
—
—
—
G
GPIO304
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
116
324
416
516
MPC5674F Microcontroller Data Sheet, Rev. 6
307 D_ADD11_GPIO307
Voltage6
306 D_ADD10_GPIO306
Function Summary
Pad Type5
305 D_ADD9_GPIO305
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I/O
F
VDDE8
—/Up
—/Up
—
—
P1
F
VDDE8
—/Up
—/Up
—
—
P2
F
VDDE8
—/Up
—/Up
—
—
P3
P
D_ADD9
EBI address bus
A1
—
—
—
A2
—
—
—
G
GPIO305
GPIO
I/O
P
D_ADD10
EBI address bus
I/O
A1
—
—
—
A2
—
—
—
G
GPIO306
GPIO
I/O
P
D_ADD11
EBI address bus
I/O
A1
—
—
—
A2
—
—
—
G
GPIO307
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
Reset and Clocks
—
RESET
P
RESET
External reset input
I
MH
VDDEH1
RESET/Up
RESET/Up
M2
R2
N5
230 RSTOUT
P
RSTOUT
External reset output
O
MH
VDDEH1
RSTOUT/Low
RSTOUT/
High
A3
A3
A3
211 BOOTCFG0_IRQ2_
GPIO211
P
BOOTCFG0
Boot configuration
I
MH
VDDEH1
—
L4
IRQ2
BOOTCFG/
Down
—
A1
BOOTCFG/
Down
A2
—
—
—
G
GPIO211
GPIO
I/O
P
BOOTCFG1
Boot configuration
I
MH
VDDEH1
Input/Down
L1
N2
L3
A1
IRQ3
External interrupt request
I
BOOTCFG/
Down
A2
—
—
—
G
GPIO212
GPIO
I/O
212 BOOTCFG1_IRQ3_
GPIO212
I
117
324
416
516
MPC5674F Microcontroller Data Sheet, Rev. 6
209 PLLCFG1_IRQ5_
GPIO209
Voltage6
208 PLLCFG0_IRQ4_
GPIO208
Function Summary
Pad Type5
213 WKPCFG_NMI_
GPIO213
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
I
MH
VDDEH1
WKPCFG/Up
Input/Up
—
N3
M5
MH
VDDEH1
PLLCFG/Up
Input/Up
M3
R3
M3
MH
VDDEH1
PLLCFG/Up
Input/Up
(for Rev2 of the
device: —/Up)
L2
P2
L1
P
WKPCFG
Weak pull configuration input
A1
NMI
Critical interrupt to core10
I
A2
—
—
G
GPIO213
GPIO
I
P
PLLCFG0
FMPLL mode configuration input
I
A1
IRQ4
External interrupt request
I
A2
—
—
—
G
GPIO208
GPIO
I/O
P
PLLCFG1
FMPLL mode configuration input
I
A1
IRQ5
External interrupt request
I
A2
SOUTD
DSPI D data output
O
G
GPIO209
GPIO
I/O
Package Location
State during
State
RESET7
after RESET8
—
—
PLLCFG2
P
PLLCFG2
FMPLL mode configuration input
I
MH
VDDEH1
PLLCFG/
Down
PLLCFG/
Down
L3
P3
L2
—
XTAL
P
XTAL
Crystal oscillator output
O
AE
VDD33
XTAL
XTAL
W22
AC26
AC26
—
EXTAL
P
EXTAL
Crystal oscillator input
I
AE
VDD33
EXTAL
EXTAL
V22
AB26
AB26
229 D_CLKOUT
P
D_CLKOUT
EBI system clock output
O
F
VDDE9
CLKOUT/
Enabled
CLKOUT/
Enabled
—
—
AF12
214 ENGCLK
P
ENGCLK
EBI engineering clock output
Note: EXTCLK (External clock input)
selected through SIU register)
O
F
VDDE2
ENGCLK/
Enabled
ENGCLK/
Enabled
AA1
AD1
AD1
JTAG and Nexus
(see footnote11 about resets)
–12
EVTI
Nexus event in
I
F
VDDE2
—/Up
EVTI/Up
N4
T4
V1
227 EVTO
(the BAM uses this pin to
select if auto baud rate is on or
off)
–12
EVTO
Nexus event out
O
F
VDDE2
ABS/Up
EVTO/HI
P1
U1
V2
219 MCKO
–12
MCKO
Nexus message clock out
O
F
VDDE2
O/Low
Disabled13
N2
T2
U4
—
EVTI
118
Voltage6
324
416
516
MPC5674F Microcontroller Data Sheet, Rev. 6
F
VDDE2
O/Low
MDO0/Low
P3
U3
V3
F
VDDE2
O/Low
—/Down
P4
U4
W6
F
VDDE2
O/Low
—/Down
R1
V1
V4
F
VDDE2
O/Low
—/Down
R2
V2
V5
F
VDDE2
O/Low
—/Down
R3
V3
W1
F
VDDE2
O/Low
—/Down
R4
V4
W2
Nexus message data out
—
—
—
—
—
—
G
GPIO220
GPIO
I/O
–12
MDO1
Nexus message data out
O
—
—
—
—
—
—
GPIO221
GPIO
I/O
MDO2
Nexus message data out
O
—
—
—
—
—
—
GPIO222
GPIO
I/O
MDO3
Nexus message data out
O
—
—
—
—
—
—
G
GPIO223
GPIO
I/O
–12
MDO4
Nexus message data out
O
—
—
—
—
—
—
G
GPIO75
GPIO
I/O
–12
MDO5
Nexus message data out
O
—
—
—
—
—
—
GPIO76
GPIO
I/O
G
12
–
222 MDO2_GPIO222
(GPIO function on this pin is
A1
only available on Rev.2 of the
device)
A2
G
12
–
223 MDO3_GPIO223
(GPIO function on this pin is
A1
only available on Rev.2 of the
device)
A2
76
O
MDO0
221 MDO1_GPIO221
(GPIO function on this pin is
A1
only available on Rev.2 of the
device)
A2
75
Function Summary
Pad Type5
–12
220 MDO0_GPIO220
(GPIO function on this pin is
A1
only available on Rev.2 of the
device)
A2
Function4
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
MDO4_GPIO75
(GPIO function on this pin is
A1
only available on Rev.2 of the
device)
A2
MDO5_GPIO76
(GPIO function on this pin is
A1
only available on Rev.2 of the
device)
A2
G
Package Location
State during
State
RESET7
after RESET8
119
324
416
516
82
Voltage6
MPC5674F Microcontroller Data Sheet, Rev. 6
81
F
VDDE2
O/Low
—/Down
T1
W1
W3
F
VDDE2
O/Low
—/Down
T2
W2
Y1
F
VDDE2
O/Low
—/Down
T3
W3
W5
F
VDDE2
O/Low
—/Down
U1
Y1
Y2
F
VDDE2
O/Low
—/Down
U2
Y2
Y3
F
VDDE2
O/Low
—/Down
U3
Y3
Y4
Nexus message data out
—
—
—
—
—
—
G
GPIO77
GPIO
I/O
–12
MDO7
Nexus message data out
O
—
—
—
—
—
—
GPIO78
GPIO
I/O
MDO8
Nexus message data out
O
—
—
—
—
—
—
GPIO79
GPIO
I/O
MDO9
Nexus message data out
O
—
—
—
—
—
—
G
GPIO80
GPIO
I/O
–12
MDO10
Nexus message data out
O
—
—
—
—
—
—
G
GPIO81
GPIO
I/O
–12
MDO11
Nexus message data out
O
—
—
—
—
—
—
GPIO82
GPIO
I/O
MDO7_GPIO78
(GPIO function on this pin is
A1
only available on Rev.2 of the
device)
A2
12
–
MDO8_GPIO79
(GPIO function on this pin is
A1
only available on Rev.2 of the
device)
A2
G
80
O
MDO6
G
79
Function Summary
Pad Type5
78
–12
MDO6_GPIO77
(GPIO function on this pin is
A1
only available on Rev.2 of the
device)
A2
Function4
Direction
77
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
12
–
MDO9_GPIO80
(GPIO function on this pin is
A1
only available on Rev.2 of the
device)
A2
MDO10_GPIO81
(GPIO function on this pin is
A1
only available on Rev.2 of the
device)
A2
MDO11_GPIO82
(GPIO function on this pin is
A1
only available on Rev.2 of the
device)
A2
G
Package Location
State during
State
RESET7
after RESET8
120
Pad Type5
Voltage6
324
416
516
O
F
VDDE2
O/Low
—/Down
V1
AA1
Y5
F
VDDE2
O/Low
—/Down
W2
AA2
AA1
F
VDDE2
O/Low
—/Down
V3
AA3
AA2
F
VDDE2
O/Low
—/Down
U4
Y4
AA3
O
F
VDDE2
O/Low
MSEO/HI
P2
U2
U6
Nexus message start/end out
O
F
VDDE2
O/Low
MSEO/HI
N3
T3
U5
RDY
Nexus ready output
O
F
VDDE2
O/Low
RDY/HI
M4
R4
U3
TCK
JTAG test clock input
I
F
VDDE2
TCK/Down
TCK/Down
Y1
AB2
AB2
Function4
Function Summary
–12
MDO12
Nexus message data out
A1
—
—
—
A2
—
—
—
G
GPIO231
GPIO
I/O
–12
MDO13
Nexus message data out
O
A1
—
—
—
A2
—
—
—
G
GPIO232
GPIO
I/O
MDO14
Nexus message data out
O
A1
—
—
—
A2
—
—
—
G
GPIO233
GPIO
I/O
MDO15
Nexus message data out
O
A1
—
—
—
A2
—
—
—
G
GPIO234
GPIO
I/O
224 MSEO0
–12
MSEO0
Nexus message start/end out
225 MSEO1
–
12
MSEO1
–
12
TCK
–
12
TDI
–12
231 MDO12_GPIO231
232 MDO13_GPIO232
MPC5674F Microcontroller Data Sheet, Rev. 6
Direction
Signal
Name2
P/A/G3
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
233 MDO14_GPIO233
234 MDO15_GPIO234
226 RDY
—
—
–
–
12
12
Package Location
State during
State
RESET7
after RESET8
TDI
JTAG test data input
I
F
VDDE2
TDI/Up
TDI/Up
Y2
AC2
AC2
–
12
TDO
JTAG test data output
O
F
VDDE2
TDO/Up
TDO/Up
W1
AB1
AB1
TMS
–
12
TMS
JTAG test mode select input
I
F
VDDE2
TMS/Up
TMS/Up
W3
AB3
AB3
—
JCOMP
–12
JCOMP
JTAG TAP controller enable
I
F
VDDE2
JCOMP/Down
JCOMP/Down
M1
R1
U2
—
TEST
—
TEST
Test mode select (not for customer
use)
I
F
VDDEH1
TEST/Down
TEST/Down
B4
B4
B4
—
VDDSYN
—
VDDSYN
Clock synthesizer power input
I
VDDE
VDDSYN
VDDSYN
VDDSYN
Y22
AD26
AD26
228 TDO
—
121
Voltage6
324
416
516
—
VSSSYN
—
VSSSYN
Clock synthesizer ground input
I
VSSE
VDDSYN
VSSSYN
VSSSYN
U22
AA26
AA26
—
VSTBY
—
VSTBY
SRAM standby power input
I
VHV
VDDEH1
VSTBY
VSTBY
K4
M4
M4
—
REGSEL
—
REGSEL
Selects regulator mode (Linear/Switch
mode)
I
AE
VDDREG
REGSEL
REGSEL
V20
W23
W23
—
REGCTL
—
REGCTL
Regulator controller output to
base/gate of power transistor
O
AE
VDDREG
REGCTL
REGCTL
T22
Y26
Y26
—
VSSFL
—
VSSFL
Tie to VSS
I
VSS
VDDREG
VSSFL
VSSFL
V21
AB25
AB25
—
VDDREG
—
VDDREG
Source voltage for on-chip regulators
and Low voltage detect circuits
I
VDDINT
VDDREG
VDDREG
VDDREG
U21
AA25
AA25
Signal
Name2
P/A/G3
Pad Type5
MPC5674F Microcontroller Data Sheet, Rev. 6
1
Direction
GPIO/PCR1
Freescale Semiconductor
Table 43. Signal Properties and Muxing Summary (continued)
Function4
Function Summary
Package Location
State during
State
RESET7
after RESET8
The GPIO number is the same as the corresponding pad configuration register (SIU_PCRn) number in pins that have GPIO functionality. For pins that do not have GPIO
functionality, this number is the PCR number.
2 The primary signal name is used as the pin label on the BGA map for identification purposes. However, the primary signal function is not available on all devices and is
indicated by a dash in the following table columns: Signal Functions, P/F/G, and I/O Type.
3 P/A/G stands for Primary/Alternate/GPIO . This column indicates which function on a pin is Primary, Alternate 1, Alternate 2, (Alternate n) and GPIO.
4 Each line in the Function column corresponds to a separate signal function on the pin. For all device I/O pins, the primary, alternate, or GPIO signal functions are
designated in the PA field of the SIU_PCRn registers except where explicitly noted.
5 MH = High voltage, medium speed
F = Fast speed
FS = Fast speed with slew
AE = Analog with ESD protection circuitry (up/down = pull up and pull down circuits included in the pad)
VHV = Very high voltage
6 VDDE (fast I/O) and VDDEH (slow I/O) power supply inputs are grouped into segments. Each segment of VDDEH pins can connect to a separate 3.3–5.0 V (+5%/–10%)
power supply input. Each segment of VDDE pins can connect to a separate 3.3 V (±10%) power supply.
7 The Status During Reset pin is sampled after the internal POR is negated. Prior to exiting POR, the signal has a high impedance. The terminology used in this column
is: O – output, I – input, Up – weak pull up enabled, Down – weak pulldown enabled, Low – output driven low, High – output driven high, ABS — Auto Baud Select (during
Reset or until JCOMP assertion). A dash on the left side of the slash denotes that both the input and output buffers for the pin are off. A dash on the right side of the
slash denotes that there is no weak pull up/down enabled on the pin. The signal name to the left or right of the slash indicates the pin is enabled.
8 The Function After Reset of a GPI function is general purpose input. A dash on the left side of the slash denotes that both the input and output buffers for the pin are
off. A dash on the right side of the slash denotes that there is no weak pull up/down enabled on the pin.
9 This signal name includes eTPU_C functionality that this device does not have. This is for forward compatibility with devices that have an eTPU_C.
10 NMI does not have a PCR PA configuration; it is enabled when NMI is enabled through the SIU_IREER and SIU_IFEER registers.
11 Nexus reset is different than system reset; MDO 1-11 are enabled when trace (RPM or FPM) is enabled, and MDO 12-15 when FPM trace is enabled. MSEO and MCKO
are also dependent on trace (RPM or FPM) being enabled.
122
12 The
Freescale Semiconductor
Nexus pins don’t have a “primary” function as they are not configured by the SIU. The pins are selected by asserting JCOMP and configuring the NPC. SIU values
have no effect on the function of these pins once enabled.
13 MCKO is disabled from reset; it can be enabled from the tool (controlled by Nexus NPC_PCR register).
MPC5674F Microcontroller Data Sheet, Rev. 6
123
Freescale Semiconductor
Table 44 lists the pin locations of the power and ground signals on the 324 TEPBGA package.
Table 44. 324-pin Power Supply Locations
VDD
A2
B3
C4
D5
K3
V19
W5
W9
W20
Y4
N1
N10
N9
P10
P9
T4
W6
V2
Y21
AA3
AA22
AB2
VDD33
W21
V4
VDDE2
AB4
M9
MPC5674F Microcontroller Data Sheet, Rev. 6
VDDEH1
B1
VDDEH4
L4
VDDEH6
AB20
W8
VDDEH7
N20
T21
C22
H19
L22
VSS
A1
A22
AA2
AA21
AB1
AB22
B2
B21
C20
C3
D19
D4
J10
J11
J12
J13
J14
J9
K10
K11
K12
K13
K14
K9
L10
L11
L12
L13
L14
L9
M10
M11
M12
M13
M14
N11
N12
N13
N14
P11
P12
P13
P14
W19
W4
Y20
Y3
124
Signal Properties and Muxing
Table 45 lists the pin locations of the power and ground signals on the 416 TEPBGA package.
Table 45. 416-pin Power Supply Locations
VDD
A2
B3
C4
AA4
AA23
P10
P11
D5
N4
AB4
AB23
AC3
R10
R11
T1
T10
T11
AC12 AC24
AD2
AD25
AE1
AE26
U11
U12
W4
AC1
VDD33
M1
VDDE2
N10
VDDEH1
B1
P4
VDDEH6
N23
T12
U10
VDDEH3
VDDEH4
VDDEH5
AC10
AC11
AF22
AC21 AF25
AF5
AC5
AF2
VDDEH7
AC25
D24
E23
M26
VSS
A1
A26
B2
B25
C3
C24
D4
D23
K10
K11
K12
K13
K14
K15
K16
K17
L10
L11
L12
L13
L14
L15
L16
L17
M10
M11
M12
M13
M14
M15
M16
M17
N11
N12
N13
N14
N15
N16
N17
P12
P13
P14
P15
P16
P17
R12
R13
R14
R15
R16
R17
T13
T14
T15
T16
T17
U13
U14
U15
U16
U17
AC4
AC23
AD3
AD24
AE2
AE25
AF1
AF26
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
125
Signal Properties and Muxing
Table 46 lists the pin locations of the power and ground signals on the 516 TEPBGA package.
Table 46. 516-pin Power Supply Locations
VDD
A2
B3
C4
D5
E6
N4
AB4
AB23
VDD33
M1
AC3
AC12 AC24
AD2
AD25
AE1
AE26
VDDE10
P6
L21 AA4 AA11 AA14 AA23
P10
P11 R10
F16
F17
F19
F21
N21
P21
AA22
T12
U10
U11
U12
W4
AC1
AC5
AB6
AB7
AB18
AB19
VDDE2
N10
R11
T1
T10
T11
VDDE8
F6
VDDE9
F8
F10
F11
VDDEH1
B1
AF2
P4
VDDEH6
N6
AA5
AA13
AB20 AB21
VDDEH3
VDDEH4
VDDEH5
AC10
AC11
AF22
AC21
AF25
AF5
VDDEH7
N23 AC25
D24
E23
M26
VSS
A25
B2
B25
B26
C3
C24
D4
D23
E5
E7
E8
E9
E10
E11
E12
E13
E14
E15
E16
E17
E18
E19
E21
E22
F5
F13
F14
K10
K11
K12
K13
K14
K15
K16
K17
L10
L11
L12
L13
L14
L15
L16
L17
M10
M11
M12
M13
M14
M15
M16
M17
N11
N12
N13
N14
N15
N16 N17
P12
P13
P14
P15
P16
P17
R12
R13
R14
R15
R16
R17
T13
T14
T15
T16
T17 U13
U14
U15
U16
U17
AA6
AA21
AB5
AB22
AC4
AC23
AD3
AD24
AE2
AE25
MPC5674F Microcontroller Data Sheet, Rev. 6
126
Freescale Semiconductor
Signal Properties and Muxing
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
127
Revision History
Appendix B Revision History
Table 47 describes the changes made to this document between revisions.
Table 47. Revision History
Revision
(Date)
Description of changes
2
Initial release, NDA Required.
(Sept 2008)
3
(Nov 2009)
Changes between Rev.2 and Rev. 3:
Added 516-pin package figures.
Signals table: Updates throughout entire table.
Updated Section 4.6, “Power Up/Down Sequencing”
Updated features list.
Updated flash PFCPR1 settings table.
Fixed JTAG Test Clock Input Timing figure so the spec #’s in table matched figure.
Updated Orderable Part numbers table.
Moved signals table to be an appendix.
Added 324-pin package thermals.
Updated part numbers in orderable parts table (missing F: MPC5674F).
FMPLL Electrical Spec table:
Spec #1 changed min values of 4 to 8
Removed last sentence of footnote 2
Added note "Upper tolerance of less than 1% is allowed on 40MHz crystal."
Oscillator Electrical Spec table:
Moved predivider op. frequency spec from this table to the FMPLL Electrical Spec table
Removed footnote #3 (since VDDE9 is an external supply and has no relation to the oscillator, PMC, or PLL).
Added maximum solder temperature to Absolute Max Ratings table.
PMC Operating Conditions table:
Removed JTemp row.
Changed VDDR to VDDREG (naming consistency)
Changed VDD12 to VDD (naming consistency)
PMC Electrical Spec table:
Added VDDREG to this parameter “Trimmed bandgap reference voltage / voltage dependence (VDDREG)”
Changed VDDSTEP to LVDSTEP12 (naming consistency)
Added two conditons to the opening statements of Section 4.6, “Power Up/Down Sequencing.”
DC Electrical Specifications table:
spec #9 (Fast I/O Input High Voltage)
spec #10 (Fast I/O Input Low Voltage)
spec #24 (Operating Current 1.2 V Supplies; IDD)
spec #25 (Operating Current 3.3 V Supplies; IDDSYN)
spec #32 (Analog Input Current, Channel Off; IINACT_A)
footnote #12 ("IOH_S = {11.6} mA...")
MPC5674F Microcontroller Data Sheet, Rev. 6
128
Freescale Semiconductor
Revision History
Table 47. Revision History (continued)
Revision
(Date)
3
(cont.)
Description of changes
eQADC Conversion Specifications table:
Spec #7, 8: both +/-3, no dependency on frequency
Spec #15, 16: added "(with calibration)" to both
Flash Program and Erase Specifications table:
Added footnote 4 to spec #2.
Updated all initial max value times.
Updated entire AC Specifications: Clocking section.
Pad AC Specifications table: updated Medium pad specs
Derated Pad AC Specifications table: updated all specs
Updated entire Section 4.6, “Power Up/Down Sequencing.”
Updated Absolute Maximum Ratings (AMR) specs 1–11, 15, 16.
Changed name of IDDC to IREGCTL since it is the REGCTL max drive current.
Added two EMC Radiated Emissions Operating Behaviors tables and removed “EMI Testing Specifications”
table.
PMC Electrical Specifications table:
1b: Changed 1% to 2%
1c: Changed 150 to 300 ppm/C
2b: added footnote
2c: Changed from "Trimming step VDD" to "Trimming step VDD12OUT"
DC Electrical Specifications table:
6: Updated min value and added keep-out range
Standby RAM Regulator Electrical Specifications table:
Added brownout spec
PMC electrical spec table, added new specs: SMPS regulator output resistance, SPMS regulator clock
frequency, SMPS regulator overshoot at start-up, SMPS max output current, and voltage variation on current
step.
Added LVD VDDA specs to the PMC electrical spec table.
Removed specs for VDDF and VFLASH since those supplies are shorted with others in the package.
4
(Aug 2010)
Changes between Rev.3 and Rev.4:
Table “Derated Pad AC Specifications”, Spec #1: Changed 20ns to 200ns.
Added “324-ball TEPBGA Pin Assignments” section and mechanical drawings.
Appendix A (Signals):
Added “(the BAM uses this pin to select if auto baud rate is on or off)” to the EVTO pin description.
Added 324 pinout column.
Changed footnote from “NMI does not have a PCR PA configuration; it is enabled when NMI is enabled through
the SIU DIRER register.“ to “NMI does not have a PCR PA configuration; it is enabled when NMI is enabled
through the SIU_IREER and SIU_IFEER registers.”
Updated eQADC signals to show that eQADC A and B each have dedicated channels (ANx0-23) and shared
channels (AN24-39).
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
129
Revision History
Table 47. Revision History (continued)
Revision
(Date)
Description of changes
4
(cont)
“Temperature Sensor Electrical Specifications” table: Changed spec #2 to have one temperature range (-40 - 150
C) and changed spec value from ±1.0 to ±10.0 C.
“eQADC Conversion Specifications (Operating)” table: Changed spec #13 (non-disruptive injection current)
values from ±1 to ±3.
"IPCLKDIV Settings" table, removed footnote "eMIOS and DMA are not considered peripherals here."
5
Note 4 in Maximum Ratings updated from 2.0 V to 1.65 V.
(Feb-2011) Changed I/O Supply Voltage spec in DC Electrical specs, Spec 2, from 1.62 V min to 3.0 V min.
Changed the APC=RWSC value in line 1 of PFCPR1 Settings vs. Frequency of Operation table from 0b011 to
0b100
Changed note 1 for Pad AC Specifications table from Vdde = 1.62 V to 1.98 V to read Vdde = 3.0 V to 3.6 V
Changed note 6 for Signal Properties and Muxing Summary table by removing the voltage range 1.8 V - 3.3 V to
have 3.3 V instead of the range.
Spec 2 in Table 9 “ESD Ratings“ the spec for “ESD for Charged Device Model (CDM)” changed to 250 V (other)
from 500 V (other)
Removed voltage ranges 1.62-1.98 V and 2.25-2.75 V from spec 28 in Table 14
MPC5674F Microcontroller Data Sheet, Rev. 6
130
Freescale Semiconductor
Revision History
MPC5674F Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
131
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Document Number: MPC5674F
Rev. 6
2/2011