HT78Bxx High PSRR 500mA LDO Regulator Features General Description • Output Voltage: 1.5V/1.8V/2.5V/2.8V/ 3.0V/3.3V/5V The HT78Bxx series are CMOS-based voltage regulator ICs with high output voltage accuracy, low quiescent current, low on Resistance, and high ripple rejection. Each of these ICs consists of a voltage reference unit, an error amplifier, resistor-net for voltage setting, a current limit circuit, a chip enable circuit, and so on. • High Output Voltage Accuracy: ±2% • HT78B25 Low Voltage Drop: 0.64V (Typ.) (VOUT=2.5V @ IOUT=500mA) • Maximum Input Voltage: 7.0V • Guaranteed Output Current: 500mA The HT78Bxx’s current limiters' fold back circuit also operates as a short circuit protect function for the output current limiter. • Low Power Consumption: 18µA (Typ.) • High Ripple Rejection: 70dB (1kHz@IOUT=30mA) • Power-Saving Shutdown Mode These ICs perform with low dropout voltage and the chip-enable function. The quiescent current of this IC is only 18μA, and the line transient response and the load transient response of HT78Bxx are excellent, thus these ICs are very suitable for the power supply for hand-held communication equipment. • Over Temperature Protection • Current Limiting • SOT-23-5, SOT223, SOT89 Package Applications The space-saving SOT23-5, SOT223 and SOT89 package will be an attractive additional feature for pocket and hand-held applications. • Portable communication equipment • Portable music player • Electrical appliances such as cameras, VCRs and camcorders • Battery-powered equipment Selection Table Rev. 1.00 Part No. Output Voltage HT78B15 1.5V HT78B18 1.8V HT78B25 2.5V HT78B28 2.8V HT78B30 3.0V HT78B33 3.3V HT78B50 5.0V 1 Tolerance Package ±2% SOT23-5 SOT223 SOT89 August 25, 2011 HT78Bxx Block Diagram VIN VOUT Short Current Shutdown CE Vref GND Absolute Maximum Ratings (Note 1) Maximum Input Supply Voltage...........................................................................................................................7.5V Ambient Temperature Range................................................................................................................... -40°C~+85°C Thermal Information Symbol θJA PD Parameter Thermal Resistance (Junction to Ambient) (Assume no ambient airflow, no heat sink) Power Dissipation Package Max. Unit SOT23-5 500 °C/W SOT223 134 °C/W SOT89 200 °C/W SOT23-5 0.20 W SOT223 0.75 W SOT89 0.50 W Note: PD is measured at Ta= 25°C Rev. 1.00 2 August 25, 2011 HT78Bxx Pin Assignment Pin Descriptions SOT23-5 Pin Descriptions Pin No. Symbol 1 VIN Input Pin Description 2 GND Ground Pin 3 CE Chip Enable Pin, high enable 4 NC No Connection 5 VOUT Output Pin SOT223 Pin Descriptions Pin No. Symbol 1 GND Ground Pin Description 2 VIN Input Pin 3 VOUT Output Pin SOT89 Pin Descriptions Pin No. Symbol 1 GND Ground Pin 2 VIN Input Pin 3 VOUT Rev. 1.00 Description Output Pin 3 August 25, 2011 HT78Bxx Electrical Characteristics Symbol Ta=25°C, VIN=VOUT+1V, IOUT=30mA, unless otherwise specified(Note 2) Parameter Test Conditions Min. Typ. Max. Unit VIN Input Voltage 1.5V≤VOUT≤5.0V 2.5 — 7 V ∆VOUT Output Voltage Tolerance 1mA≤IOUT≤30mA -2 — +2 % ∆VLINE Line Regulation VOUT+0.5V≤VIN≤7V, IOUT=10mA %/V ∆VLOAD Load Regulation(Note 3) 1mA≤IOUT≤500mA — 0.02 0.1 1.5V≤VOUT≤1.8V — 28 55 2.5V≤VOUT≤3.0V — 33 66 VOUT≥3.3V — 35 80 1.5V≤VOUT≤1.8V — 1 1.3 2.5V≤VOUT≤5.0V — mV VDROP Dropout Voltage(Note 4) ∆VOUT= 2%, IOUT=500mA ISHORT Short Current Limit VOUT=0V — 90 — mA ISS Supply Current IOUT=0mA — 18 30 μA ISD Shutdown Current CE=GND — 0.1 1 μA VIH CE Input High Threshold VOUT+1V≤VIN≤7V 1 — 7 V VIL CE Input Low Threshold VOUT+1V≤VIN≤7V 0 — 0.3 V RR Ripple Rejection IOUT=30mA f=1kHz — 70 — f=10kHz — 53 — VNOISE Output Noise Bandwidth=10Hz to 100KHz — 30 — μVrms TC Temperature Coefficient ∆VOUT TC= , I =30mA, -40°C≤Ta≤85°C ∆Ta • VOUT OUT — ±100 — ppm/°C TSD Thermal Shutdown Temperature — — 150 — °C 0.64 0.94 V dB Note: 1. Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. The guaranteed specifications apply only for the test conditions listed. 2. Specifications are production tested at TA=room temperature. Specifications over the -40°C to 85°C operating temperature range are assured by design, characterization and correlation with Statistical Quality Controls (SQC). 3. Load regulation is measured at constant junction temperature, using pulse testing with a short ON time. Guaranteed up to the maximum power dissipation. Power dissipation is determined by the input/output differential voltage and the output current. Guaranteed maximum power dissipation will not be available over the full input/output range. The maximum allowable power dissipation at any ambient temperature is PD=(TJ(MAX)–TA)/θJA. 4. Dropout voltage is the minimum input to output voltage differential needed to maintain regulation at a specified output current. In dropout, the output voltage will be equal to: VIN–VDROP. Rev. 1.00 4 August 25, 2011 HT78Bxx Application Circuit VIN VIN CIN 1uF HT78Bxx series VOUT VOUT COUT 1uF GND GND GND VIN VIN CIN 1uF CE HT78Bxx series GND GND Rev. 1.00 VOUT VOUT COUT 1uF GND 5 August 25, 2011 HT78Bxx 文件號碼： DOC.NO.： 文件號碼： 版別： REV.： 頁碼： PAGE： REV.： 頁碼： PAGE： 文件號碼： DOC.NO.： Typical Characteristics 版別： TYPICAL DOC.NO.： CHARACTERISTICS Supply Current vs. Input Current 1. Supply Current vs. Input Current TYPICAL CHARACTERISTICS 文件號碼： DOC.NO.： HT78B15 5 Output Voltage (V) 3.0 3.5 3.0 3.5 22 21 20 22 19 21 18 20 17 19 16 18 15 17 14 16 13 15 12 14 11 13 10 12 116.00 10 6.00 4.0 4.5 5.0 5.5 6.0 InputVoltage(V) 4.0 4.5 5.0 HT78B50 6 5.5 6.5 6.0 HT75B50 InputVoltage(V) 6.5 4 3 1mA 150mA 2 1 0 7.0 0 1 2 3 4 5 7.0 文件號碼： Output Voltage vs. Temperature 3. Output Voltage vs. Temperature HT78B15 1.60 1.58 6.50 7 頁碼： PAGE： 版別： REV.： DOC.NO.： HT78B50 6.25 6 Input Voltage (V) 6.75 Output Voltage (V) SupplyCurrent(uA) SupplyCurrent(uA) SupplyCurrent(uA) SupplyCurrent(uA) HT78B15 1. Supply Current vs. Input Current 22 21 20 22 19 21 18 20 17 19 16 18 15 17 14 16 13 15 12 14 11 13 10 12 112.5 10 2.5 頁碼： PAGE： 版別： REV.： 7.00 頁碼： PAGE： 7.00 版別： InputVoltage(V) 6.25 6.50 REV.： 6.75 IOUT=30mA 1.56 1.54 1.52 1.50 1.48 1.46 1.44 1.42 1.40 InputVoltage(V) -50 -25 2. Output Output Voltage vs. Input Voltage Voltage vs. Input Voltage 0 25 50 75 100 o Temperature ( C) 9 本資料為盛群半導體股份有限公司專有之財產，非經書面許可不准透露或使用本資料，亦不准複印、複製或轉變成任何其他形式使用。 THEINFORMATIONCONTAINEDHEREINISTHEEXCLUSIVEPROPERTYOFHOLTEKANDSHALLNOTBEDISTRIBUTED,REPRODUCED,OR DISCLOSEDINWHOLEORINPARTWITHOUTPRIORWRITTENPERMISSIONOFHOLTEK. 9 HT78B15 HT78B25 1.8 本資料為盛群半導體股份有限公司專有之財產，非經書面許可不准透露或使用本資料，亦不准複印、複製或轉變成任何其他形式使用。 11 THEINFORMATIONCONTAINEDHEREINISTHEEXCLUSIVEPROPERTYOFHOLTEKANDSHALLNOTBEDISTRIBUTED,REPRODUCED,OR DISCLOSEDINWHOLEORINPARTWITHOUTPRIORWRITTENPERMISSIONOFHOLTEK. 本資料為盛群半導體股份有限公司專有之財產，非經書面許可不准透露或使用本資料，亦不准複印、複製或轉變成任何其他形式使用。 I =30mA 1.6 2.60 1.4 Output Voltage (V) Output Voltage (V) 2.58 1.2 1.0 1mA 150mA 0.8 0.6 0.4 0.2 0.0 0 1 2 2.54 2.52 2.50 2.48 2.46 2.44 3 4 5 6 2.40 7 -50 -25 0 25 50 75 100 o Temperature ( C) HT78B15 1.8 1.6 Output Voltage (V) 2.56 2.42 Input Voltage (V) 12 本資料為盛群半導體股份有限公司專有之財產，非經書面許可不准透露或使用本資料，亦不准複印、複製或轉變成任何其他形式使用。 THEINFORMATIONCONTAINEDHEREINISTHEEXCLUSIVEPROPERTYOFHOLTEKANDSHALLNOTBEDISTRIBUTED,REPRODUCED,OR DISCLOSEDINWHOLEORINPARTWITHOUTPRIORWRITTENPERMISSIONOFHOLTEK. 1.4 1.2 1.0 Rev. 1.00 6 1mA 150mA 0.8 0.6 0.4 0.2 0.0 OUT THEINFORMATIONCONTAINEDHEREINISTHEEXCLUSIVEPROPERTYOFHOLTEKANDSHALLNOTBEDISTRIBUTED,REPRODUCED,OR DISCLOSEDINWHOLEORINPARTWITHOUTPRIORWRITTENPERMISSIONOFHOLTEK. 0 1 2 3 4 5 6 7 August 25, 2011 HT78Bxx 文件號碼： DOC.NO.： 頁碼： 文件號碼： PAGE： DOC.NO.： 版別： REV.： HT78B50 5.10 IOUT=30mA 5.06 Supply Current (uA) Output Voltage (V) 5.08 5.04 5.02 5.00 4.98 4.96 4.94 4.92 4.90 -50 -25 0 25 50 75 100 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 HT78B50 VIN=6.0V -50 -25 0 o Supply Current vs. Temperature DropoutVoltage(V) Supply Current (uA) HT78B15 1.2 VIN=2.5V 0 25 50 100 頁碼： PAGE： 版別： REV.： HT78B15 -25 75 Voltage Output Current 5. DropoutDropout Voltage vs. Outputvs. Current 4. Supply Current vs. Temperature -50 50 Temperature ( C) 頁碼： PAGE： 文件號碼： DOC.NO.： 版別： REV.： 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 25 o Temperature ( C) 文件號碼： DOC.NO.： 頁碼： PAGE： 版別： REV.： 75 1.0 0.6 0.4 0.2 0.0 100 o 85 C o 25 C o -40 C 0.8 0 100 200 o Temperature ( C) 300 400 500 OutputCurrent(mA) DropoutVoltage(V) Supply Current (uA) HT78B25 HT78B25 13 0.9 15 30 本資料為盛群半導體股份有限公司專有之財產，非經書面許可不准透露或使用本資料，亦不准複印、複製或轉變成任何其他形式使用。 本資料為盛群半導體股份有限公司專有之財產，非經書面許可不准透露或使用本資料，亦不准複印、複製或轉變成任何其他形式使用。 28 THEINFORMATIONCONTAINEDHEREINISTHEEXCLUSIVEPROPERTYOFHOLTEKANDSHALLNOTBEDISTRIBUTED,REPRODUCED,OR 0.8 VIN=3.5V THEINFORMATIONCONTAINEDHEREINISTHEEXCLUSIVEPROPERTYOFHOLTEKANDSHALLNOTBEDISTRIBUTED,REPRODUCED,OR 26 DISCLOSEDINWHOLEORINPARTWITHOUTPRIORWRITTENPERMISSIONOFHOLTEK. DISCLOSEDINWHOLEORINPARTWITHOUTPRIORWRITTENPERMISSIONOFHOLTEK. 24 0.7 85 C 22 25 C 0.6 20 -40 C 18 0.5 16 14 0.4 12 0.3 10 8 0.2 6 4 0.1 2 0.0 0 0 100 200 300 400 500 -50 -25 0 25 50 75 100 o o o o OutputCurrent(mA) Temperature ( C) 14 本資料為盛群半導體股份有限公司專有之財產，非經書面許可不准透露或使用本資料，亦不准複印、複製或轉變成任何其他形式使用。 16 THEINFORMATIONCONTAINEDHEREINISTHEEXCLUSIVEPROPERTYOFHOLTEKANDSHALLNOTBEDISTRIBUTED,REPRODUCED,OR DISCLOSEDINWHOLEORINPARTWITHOUTPRIORWRITTENPERMISSIONOFHOLTEK. 本資料為盛群半導體股份有限公司專有之財產，非經書面許可不准透露或使用本資料，亦不准複印、複製或轉變成任何其他形式使用。 THEINFORMATIONCONTAINEDHEREINISTHEEXCLUSIVEPROPERTYOFHOLTEKANDSHALLNOTBEDISTRIBUTED,REPRODUCED,OR DISCLOSEDINWHOLEORINPARTWITHOUTPRIORWRITTENPERMISSIONOFHOLTEK. Rev. 1.00 7 August 25, 2011 HT78Bxx 版別： REV.： DropoutVoltage(V) 文件號碼： DOC.NO.： 0.60 0.55 0.50 0.45 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 頁碼： PAGE： HT78B50 o 85 C o 25 C o -40 C 0 50 100 150 200 250 300 350 400 450 500 OutputCurrent(mA) Ripple Rejection vs. Frequency HT78B25 CIN=0μF, COUT =1μF, CH1=VOUT(ac), CH2=VIN HT78B15 VOUT=1.5V, VIN=2.5V (IOUT=30, 80, 200mA) HT78B50 CIN=0μF, COUT=1μF, CH1=VOUT(ac), CH2=VIN Input Transient Response 17 本資料為盛群半導體股份有限公司專有之財產，非經書面許可不准透露或使用本資料，亦不准複印、複製或轉變成任何其他形式使用。 THEINFORMATIONCONTAINEDHEREINISTHEEXCLUSIVEPROPERTYOFHOLTEKANDSHALLNOTBEDISTRIBUTED,REPRODUCED,OR DISCLOSEDINWHOLEORINPARTWITHOUTPRIORWRITTENPERMISSIONOFHOLTEK. Load Transient Response HT78B15 CIN=0μF, COUT =1μF, CH1=VOUT(ac), CH2=VIN HT78B15 VIN=2.5V, CIN=COUT=1μF, CH1=VOUT(ac), CH2=IOUT Rev. 1.00 8 August 25, 2011 HT78Bxx HT78B25 VIN=3.5V, CIN=COUT=1μF, CH1=VOUT(ac), CH2=IOUT HT78B50 IOUT=150mA, VIN=6.0V, CIN=COUT=1μF, CH1=VCE, CH2=VOUT HT78B50 VIN=6.0V, CIN=COUT=1μF, CH1=VOUT(ac), CH2=IOUT Turn-on/off speed with CE pin HT78B50 IOUT=150mA, VIN=6.0V, CIN=COUT=1μF, CH1=VCE, CH2=VOUT Rev. 1.00 9 August 25, 2011 HT78Bxx Package Information 5-pin SOT23-5 Outline Dimensions Symbol Dimensions in inch Min. Nom. Max. 0.039 ― 0.051 A1 ― ― 0.004 A2 0.028 ― 0.035 b 0.014 ― 0.020 C 0.004 ― 0.010 D 0.106 ― 0.122 E 0.055 ― 0.071 e ― 0.075 ― H 0.102 ― 0.118 L 0.015 ― ― θ 0° ― 9° A Symbol Rev. 1.00 Dimensions in mm Min. Nom. Max. A 1.00 ― 1.30 A1 ― ― 0.10 A2 0.70 ― 0.90 b 0.35 ― 0.50 C 0.10 ― 0.25 D 2.70 ― 3.10 E 1.40 ― 1.80 e ― 1.90 ― H 2.60 ― 3.0 L 0.37 ― ― θ 0° ― 9° 10 August 25, 2011 HT78Bxx 3-pin SOT223 Outline Dimensions Symbol Rev. 1.00 Dimensions in inch Min. Nom. Max. A ― ― 1.8 A1 0.02 ― 0.1 A2 1.5 ― 1.7 b 0.66 ― 0.84 C 0.23 ― 0.35 D 6.3 ― 6.7 E 6.7 ― 7.3 E1 3.3 ― 3.7 e ― 2.3 ― e1 ― 4.6 ― L 0.75 ― ― θ 0° ― 10° 11 August 25, 2011 HT78Bxx 3-pin SOT89 Outline Dimensions Symbol Dimensions in inch Min. Nom. Max. A 0.173 ― 0.181 B 0.059 ― 0.072 C 0.090 ― 0.102 D 0.035 ― 0.047 E 0.155 ― 0.167 F 0.014 ― 0.019 G 0.017 ― 0.022 H ― 0.059 ― I 55 ― 63 J 14 ― 17 Symbol Rev. 1.00 Dimensions in mm Min. Nom. Max. A 4.39 ― 4.60 B 1.50 ― 1.83 C 2.29 ― 2.59 D 0.89 ― 1.19 E 3.94 ― 4.24 F 0.36 ― 0.48 G 0.43 ― 0.56 H ― 1.50 ― I 1.40 ― 1.60 J 0.36 ― 0.43 12 August 25, 2011 HT78Bxx Reel Dimensions SOT23-5 Symbol Description Dimensions in mm A Reel Outer Diameter 178.0±1.0 B Reel Inner Diameter 62.0±1.0 C Spindle Hole Diameter 13.0±0.2 D Key Slit Width 2.50±0.25 T1 Space Between Flang 8.4+1.5/-0.0 T2 Reel Thickness 11.4+1.5/-0.0 SOT223 Symbol Description Dimensions in mm A Reel Outer Diameter 330±1 B Reel Inner Diameter 62±1.5 C Spindle Hole Diameter 12.75±0.15 D Key Slit Width T1 Space Between Flang 12.4+0.2 2+0.6 T2 Reel Thickness 16.4−0.4 SOT89-3 Symbol Rev. 1.00 Description A Reel Outer Diameter B Reel Inner Diameter C Spindle Hole Diameter Dimensions in mm 180.0±1.0 62.0±1.5 12.75 +0.15/-0.00 D Key Slit Width T1 Space Between Flang 12.4 +0.2/-0.0 1.9±0.15 T2 Reel Thickness 17.0 +0.0/-0.4 13 August 25, 2011 HT78Bxx Carrier Tape Dimensions SOT23-5 Symbol Description W Carrier Tape Width Dimensions in mm 8.0±0.3 P Cavity Pitch E Perforation Position 1.75±0.10 4.0±0.1 3.50±0.05 F Cavity to Perforation(Width Direction) D Perforation Diameter 1.5+0.1/-0.0 D1 Cavity Hole Diameter 1.5+0.1/-0.0 P0 Perforation Pitch P1 Cavity to Perforation(Length Direction) 2.00±0.05 A0 Cavity Length 3.15±0.10 B0 Cavity Width 3.2±0.1 K0 Cavity Depth 4.0±0.1 1.4±0.1 t Carrier Tape Thickness C Cover Tape Width 0.20±0.03 5.3±0.1 SOT223 Symbol Rev. 1.00 Description W Carrier Tape Width Dimensions in mm 12±0.3 P Cavity Pitch E Perforation Position 1.75±0.1 8±0.1 F Cavity to Perforation (Width Direction) 5.5±0.05 D Perforation Diameter 1.5+0.1 D1 Cavity Hole Diameter 1.5+0.1 P0 Perforation Pitch 4±0.1 P1 Cavity to Perforation (Length Direction) 2±0.05 A0 Cavity Length 6.9±0.1 B0 Cavity Width 7.5±0.1 K0 Cavity Depth 2.1±0.1 t Carrier Tape Thickness 0.3±0.05 C Cover Tape Width 9.3 14 August 25, 2011 HT78Bxx SOT89-3 Symbol Rev. 1.00 Description W Carrier Tape Width Dimensions in mm 12.0 +0.3/-0.1 P Cavity Pitch E Perforation Position 1.75±0.10 8.0±0.1 F Cavity to Perforation(Width Direction) 5.50±0.05 D Perforation Diameter 1.5+0.1 D1 Cavity Hole Diameter 1.5+0.1 P0 Perforation Pitch 4.0±0.1 P1 Cavity to Perforation(Length Direction) 2.0±0.1 A0 Cavity Length 4.8±0.1 B0 Cavity Width 4.5±0.1 K0 Cavity Depth 1.8±0.1 t Carrier Tape Thickness C Cover Tape Width 0.300±0.013 9.3±0.1 15 August 25, 2011 HT78Bxx Holtek Semiconductor Inc. (Headquarters) No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan Tel: 886-3-563-1999 Fax: 886-3-563-1189 http://www.holtek.com.tw Holtek Semiconductor Inc. (Taipei Sales Office) 4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan Tel: 886-2-2655-7070 Fax: 886-2-2655-7373 Fax: 886-2-2655-7383 (International sales hotline) Holtek Semiconductor Inc. (Shenzhen Sales Office) 5F, Unit A, Productivity Building, No.5 Gaoxin M 2nd Road, Nanshan District, Shenzhen, China 518057 Tel: 86-755-8616-9908, 86-755-8616-9308 Fax: 86-755-8616-9722 Holtek Semiconductor (USA), Inc. (North America Sales Office) 46729 Fremont Blvd., Fremont, CA 94538, USA Tel: 1-510-252-9880 Fax: 1-510-252-9885 http://www.holtek.com Copyright© 2011 by HOLTEK SEMICONDUCTOR INC. The information appearing in this Data Sheet is believed to be accurate at the time of publication. However, Holtek assumes no responsibility arising from the use of the specifications described. The applications mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or representation that such applications will be suitable without further modification, nor recommends the use of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek's products are not authorized for use as critical components in life support devices or systems. Holtek reserves the right to alter its products without prior notification. For the most up-to-date information, please visit our web site at http://www.holtek.com.tw. Rev. 1.00 16 August 25, 2011