HOLTEK HT72B25

HT72Bxx
High PSRR 300mA LDO Regulator
Features
General Description
• Output Voltage: 1.5V/1.8V/2.5V/2.8V/
3.0V/3.3V/5V
The HT72Bxx series are CMOS-based voltage
regulator ICs with high output voltage accuracy, low
quiescent current, low on Resistance, and high ripple
rejection. Each of these ICs consists of a voltage
reference unit, an error amplifier, resistor-net for
voltage setting, a current limit circuit, a chip enable
circuit, and so on.
• High Output Voltage Accuracy: ±2%
• HT72B25 Low Voltage Drop: 0.34V (Typ.)
(VOUT=2.5V @ IOUT=300mA)
• Maximum Input Voltage: 7.0V
• Guaranteed Output Current: 300mA
The HT72Bxx’s current limiters' fold back circuit
also operates as a short circuit protect function for the
output current limiter.
• Low Power Consumption: 18uA (Typ.)
• High Ripple Rejection: 70dB (1kHz@IOUT=30mA)
• Power-saving Shutdown Mode
These ICs perform with low dropout voltage and the
chip-enable function. The quiescent current of this IC
is only 18μA, and the line transient response and the
load transient response of HT72Bxx are excellent,
thus these ICs are very suitable for the power supply
for hand-held communication equipment.
• Over Temperature Protection
• Current Limiting
• SOT23-5, SOT89 Package
Applications
The space-saving SOT23-5, SOT89 package will be
an attractive additional feature for pocket and handheld applications.
• Portable communication equipment
• Portable music player
• Electrical appliances such as cameras, VCRs and
camcorders
• Battery-powered equipment
Selection Table
Rev. 1.00
Part No.
Output Voltage
HT72B15
1.5V
HT72B18
1.8V
HT72B25
2.5V
HT72B28
2.8V
HT72B30
3.0V
HT72B33
3.3V
HT72B50
5.0V
1
Tolerance
Package
±2%
SOT23-5
SOT89
August 24, 2011
HT72Bxx
Block Diagram
VIN
VOUT
Short Current
Shutdown
CE
Vref
GND
Absolute Maximum Ratings (Note 1)
Maximum Input Supply Voltage...........................................................................................................................7.5V
Ambient Temperature Range................................................................................................................... -40°C~+85°C
Thermal Information
Symbol
θJA
PD
Parameter
Thermal Resistance
(Junction to Ambient)
(Assume no ambient airflow,
no heat sink)
Package
Max.
Unit
SOT23-5
500
°C/W
SOT89
200
°C/W
SOT23-5
0.20
W
SOT89
0.50
W
Power Dissipation
Note: PD is measured at Ta= 25°C
Rev. 1.00
2
August 24, 2011
HT72Bxx
Pin Assignment
Pin Descriptions
SOT23-5 Pin Descriptions
Pin No.
Symbol
1
VIN
Input Pin
Description
2
GND
Ground Pin
3
CE
Chip Enable Pin, high enable
4
NC
No Connection
5
VOUT
Pin No.
Symbol
1
GND
Ground Pin
2
VIN
Input Pin
3
VOUT
Output Pin
SOT89 Pin Descriptions
Rev. 1.00
Description
Output Pin
3
August 24, 2011
HT72Bxx
Electrical Characteristics
Symbol
Ta=25°C, VIN=VOUT+1V, IOUT=30mA, unless otherwise specified(Note 2)
Parameter
Test Conditions
Min.
Typ. Max.
Unit
VIN
Input Voltage
1.5V≤VOUT≤5.0V
2.5
—
7
V
∆VOUT
Output Voltage Tolerance
1mA≤IOUT≤30mA
-2
—
+2
%
∆VLINE
Line Regulation
VOUT+0.5V≤VIN≤7V IOUT=10mA
%/V
∆VLOAD
Load Regulation(Note 3)
—
0.02
0.1
1.5V≤VOUT≤1.8V
—
13
30
1mA≤IOUT≤300mA 2.5V≤VOUT≤3.0V
—
14
35
VOUT≥3.3V
—
15
40
1.5V≤VOUT≤1.8V
—
0.6
0.9
2.5V≤VOUT≤5.0V
—
0.34
0.64
mV
VDROP
Dropout Voltage(Note 4)
∆VOUT=2%
IOUT=300mA
ISHORT
Short Current Limit
VOUT=0V
—
90
—
mA
ISS
Supply Current
IOUT=0mA
—
18
30
μA
ISD
Shutdown Current
CE=GND
—
0.1
1
μA
VIH
CE Input High Threshold
VOUT+1V≤VIN≤7V
1
—
7
V
VIL
CE Input Low Threshold
VOUT+1V≤VIN≤7V
0
—
0.3
V
f=1kHz
—
70
—
V
RR
Ripple Rejection
IOUT=30mA
f=10kHz
—
53
—
dB
VNOISE
Output Noise
Bandwidth=10Hz to 100KHz
—
30
—
μVrms
TC
Temperature Coefficient
∆VOUT
TC=
, I =30mA, -40°C≤Ta≤85°C
∆Ta • VOUT OUT
—
±100
—
ppm/°C
TSD
Thermal Shutdown Temperature
—
—
150
—
°C
Note: 1. Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating
Ratings indicate conditions for which the device is intended to be functional, but do not guarantee
specific performance limits. The guaranteed specifications apply only for the test conditions listed.
2. Specifications are production tested at TA=room temperature. Specifications over the -40°C to 85°C
operating temperature range are assured by design, characterization and correlation with Statistical
Quality Controls (SQC).
3. Load regulation is measured at constant junction temperature, using pulse testing with a short ON time.
Guaranteed up to the maximum power dissipation. Power dissipation is determined by the input/output
differential voltage and the output current. Guaranteed maximum power dissipation will not be available
over the full input/output range. The maximum allowable power dissipation at any ambient temperature
is PD=(TJ(MAX)–TA)/θJA.
4. Dropout voltage is the minimum input to output voltage differential needed to maintain regulation at a
specified output current. In dropout, the output voltage will be equal to: VIN–VDROP.
Rev. 1.00
4
August 24, 2011
HT72Bxx
Application Circuit
VIN
VIN
CIN
1uF
HT72Bxx
series
VOUT
VOUT
COUT
1uF
GND
GND
GND
VIN
VIN
CIN
1uF
CE
HT72Bxx
series
GND
GND
Rev. 1.00
VOUT
VOUT
COUT
1uF
GND
5
August 24, 2011
Output V
文件號碼：
DOC.NO.：
Characteristics
TYPICALTypical
CHARACTERISTICS
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0.6
0.4
HT72Bxx
0.2
頁碼： PAGE：
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REV.：
1mA
150mA
0.8
0.0
頁碼：
PAGE：
0
1
2
3
4
5
6
7
Input Voltage (V)
1.
SupplyCHARACTERISTICS
Current vs.
Input Current
Supply
Current
vs. Input Current
TYPICAL
SupplyCurrent(uA)
Supply
Current (uA)
HT75B25
HT72B25
4.0 6.25
4.5
Output Voltage (V)
1.5
1mA
150mA
1.0
0.5
0
1
2
3
4
5
6
7
Input Voltage (V)
11
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REV.：
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Voltage
vs. Temperature
3.本資料為盛群半導體股份有限公司專有之財產，非經書面許可不准透露或使用本資料，亦不准複印、複製或轉變成任何其他形式使用。
Output Output
Voltage vs.
Temperature(使用的是
HT78BXX 參數)
THEINFORMATIONCONTAINEDHEREINISTHEEXCLUSIVEPROPERTYOFHOLTEKANDSHALLNOTBEDISTRIBUTED,REPRODUCED,OR
3.
Output
Voltage
vs.
Temperature(使用的是
HT78BXX 參數)
DISCLOSEDINWHOLEORINPARTWITHOUTPRIORWRITTENPERMISSIONOFHOLTEK. 5.06.50 5.5
6.75 6.5
6.0
1.60
1.60
1.58
1.58
1.56
1.56
1.54
1.54
1.52
1.52
1.50
1.50
1.48
1.48
1.46
1.46
1.44
1.44
1.42
1.42
1.40
1.40
-50
-50
7.00
7.0
頁碼： PAGE：
版別：
REV.：
9
2.0
0.0
InputVoltage(V)
Input
Voltage (V)
文件號碼：
DOC.NO.：
2.5
文件號碼：
文件號碼：
DOC.NO.：
DOC.NO.：
Input Voltage (V)
22
22
21
21
20
20
19
19
18
18
17
17
16
16
15
15
14
14
13
13
12
12
11
11
10
10
6.00
3.5
HT72B25
3.0
22
21
HT72B15
22
20
21
19
20
18
19
17
18
16
17
15
16
14
15
13
14
12
13
11
12
10
112.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
10
InputVoltage(V)
2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
HT72B15
HT72B15
IOUT=30mA
IOUT=30mA
OutputVoltage
Voltage(V)
(V)
Output
SupplySupplyCurrent(uA)
Current (uA)
HT72B15
1. Supply Current vs. Input Current
-25
-25
Outputvs.
Voltage
vs. Input Voltage
2.
Output Voltage
Input Voltage
THEINFORMATIONCONTAINEDHEREINISTHEEXCLUSIVEPROPERTYOFHOLTEKANDSHALLNOTBEDISTRIBUTED,REPRODUCED,OR
本資料為盛群半導體股份有限公司專有之財產，非經書面許可不准透露或使用本資料，亦不准複印、複製或轉變成任何其他形式使用。
0
0
25
25
o
50
50
Temperature ( C)
Temperature ( C)
75
75
100
100
o
DISCLOSEDINWHOLEORINPARTWITHOUTPRIORWRITTENPERMISSIONOFHOLTEK. 10
HT72B15
HT78B25
HT72B25
本資料為盛群半導體股份有限公司專有之財產，非經書面許可不准透露或使用本資料，亦不准複印、複製或轉變成任何其他形式使用。
THEINFORMATIONCONTAINEDHEREINISTHEEXCLUSIVEPROPERTYOFHOLTEKANDSHALLNOTBEDISTRIBUTED,REPRODUCED,OR
1.8
DISCLOSEDINWHOLEORINPARTWITHOUTPRIORWRITTENPERMISSIONOFHOLTEK. 2.60
2.60
2.58
2.58
2.56
2.56
2.54
2.54
2.52
2.52
1.4
1.2
1.0
2.50
2.50
2.48
2.48
1mA
150mA
0.8
0.6
2.46
2.46
2.44
2.44
0.4
0.2
0.0
0
1
2
3
4
5
6
2.42
2.42
2.40
2.40
-50
-50
7
InputVoltage(V)
00
25
25
o
50
50
o
Temperature
Temperature((C)
C)
75
75
100
100
12
12
2.5
OutputVoltage(V)
-25
-25
HT72B50
3.0
本資料為盛群半導體股份有限公司專有之財產，非經書面許可不准透露或使用本資料，亦不准複印、複製或轉變成任何其他形式使用。
本資料為盛群半導體股份有限公司專有之財產，非經書面許可不准透露或使用本資料，亦不准複印、複製或轉變成任何其他形式使用。
THEINFORMATIONCONTAINEDHEREINISTHEEXCLUSIVEPROPERTYOFHOLTEKANDSHALLNOTBEDISTRIBUTED,REPRODUCED,OR
THEINFORMATIONCONTAINEDHEREINISTHEEXCLUSIVEPROPERTYOFHOLTEKANDSHALLNOTBEDISTRIBUTED,REPRODUCED,OR
DISCLOSEDINWHOLEORINPARTWITHOUTPRIORWRITTENPERMISSIONOFHOLTEK.
DISCLOSEDINWHOLEORINPARTWITHOUTPRIORWRITTENPERMISSIONOFHOLTEK. 2.0
Rev.
1.5 1.00
6
1mA
150mA
1.0
0.5
0.0
IOUT=30mA
IOUT=30mA
OutputVoltage
Voltage(V)
(V)
Output
OutputVoltage(V)
1.6
0
1
2
3
4
5
6
7
August 24, 2011
HT72Bxx
文件號碼：
DOC.NO.：
版別：
REV.：
頁碼：
PAGE：
Supply Current (uA)
vs. Temperature
4. SupplySupply
Current Current
vs. Temperature(使用的是
HT78BXX 參數)
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
0
Load Transient Response
HT72B15
VIN=2.5V
-50
-25
0
25
50
75
100
o
Temperature ( C)
HT72B15 VIN=2.5V, CIN=COUT=1μF, CH1=VOUT(ac),
Supply Current (uA)
CH2=IOUT
30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
0
HT72B25
VIN=3.5V
-50
-25
0
25
50
75
100
o
Temperature ( C)
HT72B15 VIN=2.5V, CIN=COUT=1μF, CH1=VOUT(ac),
CH2=IOUT
Ripple Rejection vs. Frequency
13
本資料為盛群半導體股份有限公司專有之財產，非經書面許可不准透露或使用本資料，亦不准複印、複製或轉變成任何其他形式使用。
THEINFORMATIONCONTAINEDHEREINISTHEEXCLUSIVEPROPERTYOFHOLTEKANDSHALLNOTBEDISTRIBUTED,REPRODUCED,OR
DISCLOSEDINWHOLEORINPARTWITHOUTPRIORWRITTENPERMISSIONOFHOLTEK. HT72B15 VIN=2.5V (IOUT=30, 80, 150mA)
HT72B25 VIN=3.5V, CIN=COUT=1μF, CH1=VOUT(ac),
CH2=IOUT
Rev. 1.00
7
August 24, 2011
HT72Bxx
HT72B25 VIN=3.5V, CIN=COUT=1μF, CH1=VOUT(ac),
CH2=IOUT
Rev. 1.00
8
August 24, 2011
HT72Bxx
Package Information
5-pin SOT23-5 Outline Dimensions
Symbol
Dimensions in inch
Min.
Nom.
Max.
0.039
―
0.051
A1
―
―
0.004
A2
0.028
―
0.035
b
0.014
―
0.020
C
0.004
―
0.010
D
0.106
―
0.122
E
0.055
―
0.071
e
―
0.075
―
H
0.102
―
0.118
L
0.015
―
―
θ
0°
―
9°
A
Symbol
Rev. 1.00
Dimensions in mm
Min.
Nom.
Max.
A
1.00
―
1.30
A1
―
―
0.10
A2
0.70
―
0.90
b
0.35
―
0.50
C
0.10
―
0.25
D
2.70
―
3.10
E
1.40
―
1.80
e
―
1.90
―
H
2.60
―
3.0
L
0.37
―
―
θ
0°
―
9°
9
August 24, 2011
HT72Bxx
3-pin SOT89 Outline Dimensions
Symbol
Dimensions in inch
Min.
Nom.
Max.
A
0.173
―
0.181
B
0.059
―
0.072
C
0.090
―
0.102
D
0.035
―
0.047
E
0.155
―
0.167
F
0.014
―
0.019
G
0.017
―
0.022
H
―
0.059
―
I
55
―
63
J
14
―
17
Symbol
Rev. 1.00
Dimensions in mm
Min.
Nom.
Max.
A
4.39
―
4.60
B
1.50
―
1.83
C
2.29
―
2.59
D
0.89
―
1.19
E
3.94
―
4.24
F
0.36
―
0.48
G
0.43
―
0.56
H
―
1.50
―
I
1.40
―
1.60
J
0.36
―
0.43
10
August 24, 2011
HT72Bxx
Reel Dimensions
SOT23-5
Symbol
Description
Dimensions in mm
A
Reel Outer Diameter
178.0±1.0
B
Reel Inner Diameter
62.0±1.0
C
Spindle Hole Diameter
13.0±0.2
2.50±0.25
D
Key Slit Width
T1
Space Between Flang
8.4+1.5/-0.0
T2
Reel Thickness
11.4+1.5/-0.0
SOT89-3
Symbol
Rev. 1.00
Description
Dimensions in mm
A
Reel Outer Diameter
B
Reel Inner Diameter
180.0±1.0
C
Spindle Hole Diameter
D
Key Slit Width
T1
Space Between Flang
12.4 +0.2/-0.0
T2
Reel Thickness
17.0 +0.0/-0.4
62.0±1.5
12.75 +0.15/-0.00
1.9±0.15
11
August 24, 2011
HT72Bxx
Carrier Tape Dimensions
SOT23-5
Symbol
Description
Dimensions in mm
W
Carrier Tape Width
P
Cavity Pitch
8.0±0.3
E
Perforation Position
1.75±0.10
3.50±0.05
4.0±0.1
F
Cavity to Perforation(Width Direction)
D
Perforation Diameter
1.5+0.1/-0.0
D1
Cavity Hole Diameter
1.5+0.1/-0.0
P0
Perforation Pitch
P1
Cavity to Perforation(Length Direction)
2.00±0.05
A0
Cavity Length
3.15±0.10
B0
Cavity Width
3.2±0.1
K0
Cavity Depth
4.0±0.1
1.4±0.1
t
Carrier Tape Thickness
C
Cover Tape Width
0.20±0.03
5.3±0.1
SOT89-3
Symbol
Rev. 1.00
Description
W
Carrier Tape Width
Dimensions in mm
12.0 +0.3/-0.1
P
Cavity Pitch
E
Perforation Position
1.75±0.10
8.0±0.1
5.50±0.05
F
Cavity to Perforation(Width Direction)
D
Perforation Diameter
1.5+0.1
D1
Cavity Hole Diameter
1.5+0.1
P0
Perforation Pitch
4.0±0.1
P1
Cavity to Perforation(Length Direction)
2.0±0.1
A0
Cavity Length
4.8±0.1
B0
Cavity Width
4.5±0.1
K0
Cavity Depth
t
Carrier Tape Thickness
C
Cover Tape Width
1.8±0.1
0.300±0.013
9.3±0.1
12
August 24, 2011
HT72Bxx
Holtek Semiconductor Inc. (Headquarters)
No.3, Creation Rd. II, Science Park, Hsinchu, Taiwan
Tel: 886-3-563-1999
Fax: 886-3-563-1189
http://www.holtek.com.tw
Holtek Semiconductor Inc. (Taipei Sales Office)
4F-2, No. 3-2, YuanQu St., Nankang Software Park, Taipei 115, Taiwan
Tel: 886-2-2655-7070
Fax: 886-2-2655-7373
Fax: 886-2-2655-7383 (International sales hotline)
Holtek Semiconductor Inc. (Shenzhen Sales Office)
5F, Unit A, Productivity Building, No.5 Gaoxin M 2nd Road, Nanshan District, Shenzhen, China 518057
Tel: 86-755-8616-9908, 86-755-8616-9308
Fax: 86-755-8616-9722
Holtek Semiconductor (USA), Inc. (North America Sales Office)
46729 Fremont Blvd., Fremont, CA 94538, USA
Tel: 1-510-252-9880
Fax: 1-510-252-9885
http://www.holtek.com
Copyright© 2011 by HOLTEK SEMICONDUCTOR INC.
The information appearing in this Data Sheet is believed to be accurate at the time of publication. However,
Holtek assumes no responsibility arising from the use of the specifications described. The applications
mentioned herein are used solely for the purpose of illustration and Holtek makes no warranty or
representation that such applications will be suitable without further modification, nor recommends the use
of its products for application that may present a risk to human life due to malfunction or otherwise. Holtek's
products are not authorized for use as critical components in life support devices or systems. Holtek reserves
the right to alter its products without prior notification. For the most up-to-date information, please visit our
web site at http://www.holtek.com.tw.
Rev. 1.00
13
August 24, 2011