ICS ICS664G

ICS664-04
PECL Digital Video Clock Source
Description
Features
The ICS664-04 provides clock generation and
conversion for clock rates commonly needed in HDTV
digital video equipment. The ICS664-04 uses the latest
Phase-Locked Loop (PLL) technology to provide
excellent phase noise and long-term jitter performance
for superior synchronization and S/N ratio.
•
•
•
•
•
•
•
•
•
For audio sampling clocks generated from 27 MHz, use
the ICS661.
Please contact ICS if you have a requirement for an
input and output frequency not included in this
document. ICS can rapidly modify this product to meet
special requirements.
Packaged in 16-pin TSSOP
Available in Pb (lead) free package
Clock or crystal input
Low phase noise
Low jitter
Exact (0 ppm) multiplication ratios
Power-down control
Improved phase noise over ICS660
Differential outputs
Block Diagram
VDD (P2)
VDD (P3)
VDDO
VDD (P10)
X2
Crystal
Oscillator
X1/REFIN
SELIN
S3:0
PLL Clock
Synthesis
CLK
CLK
4
GND (P6)
1
MDS 664-04 A
Integrated Circuit Systems, Inc.
GND (P12)
GND (P5)
●
525 Race Street, San Jose, CA 95126
Revision 040805
●
tel (408) 297-1201
●
www.icst.com
ICS664-04
PECL Digital Video Clock Source
Pin Assignment
Output Clock Selection Table
X1/REFIN
1
16
X2
VDD
2
15
VDDO
VDD
3
14
CLK
S0
4
13
Input
Frequency
(MHz)
Output
Frequency
(MHz)
S3
S2
S1
S0
0
0
0
0
0
0
0
1
Pass thru
CLK
0
0
1
0
27
74.25
0
1
1
27
74.175824
Power down
Input Freq
GND
5
12
GND
0
GND
6
0
1
0
0
13.5
74.25
11
SELIN
0
1
0
1
13.5
74.175824
S3
7
10
VDD
0
1
1
0
27
148.5
S2
8
9
0
1
1
1
27
148.351648
1
0
0
0
74.25
54
1
0
0
1
74.175824
54
1
0
1
0
74.25
27
1
0
1
1
74.175824
27
1
1
0
0
54
74.25
1
1
0
1
54
74.175824
1
1
1
0
54
13.5
1
1
1
1
27
13.5
S1
16-pin 4.40 mil body, 0.65 mm pitch TSSOP
Pin Descriptions
Pin
Number
Pin
Name
Pin
Type
1
X1/REFIN
Input
Connect this pin to a crystal or clock input
2
VDD
Power
Power supply for crystal oscillator.
3
VDD
Power
Power supply for PLL.
4
S0
Input
Output frequency selection. Determines output frequency per table above. On chip pull-up.
5
GND
Power
Ground for PLL.
6
GND
Power
Ground for oscillator.
7
S3
Input
Output frequency selection. Determines output frequency per table above. On chip pull-up.
8
S2
Input
Output frequency selection. Determines output frequency per table above. On chip pull-up.
9
S1
Input
Output frequency selection. Determines output frequency per table above. On chip pull-up.
10
VDD
Power
Power supply.
11
SELIN
Input
Low for clock input, high for crystal. On chip pull-up.
12
GND
Power
Ground for output stage
13
CLK
Output
Complimentary clock output.
14
CLK
Output
Clock output.
15
VDDO
Power
Power supply for output stage.
16
X2
Input
Connect this pin to a crystal. Leave open if using a clock input.
MDS 664-04 A
Pin Description
2
Integrated Circuit Systems, Inc. ● 525 Race Street, San Jose, CA 95126
Revision 040805
●
tel (408) 297-1201
●
www.icst.com
ICS664-04
PECL Digital Video Clock Source
Application Information
Termination Resistor
adjust the stray capacitance of the board to match the
nominally required crystal load capacitance. To reduce
possible noise pickup, use very short PCB traces (and
no vias) been the crystal and device.
Terminate the outputs with 50Ω to ground.
Decoupling Capacitors
As with any high-performance mixed-signal IC, the
ICS664-04 must be isolated from system power supply
noise to perform optimally.
Decoupling capacitors of 0.01µF must be connected
between each VDD and the PCB ground plane. To
further guard against interfering system supply noise,
the ICS664-04 should use one common connection to
the PCB power plane as shown in the diagram on the
next page. The ferrite bead and bulk capacitor help
reduce lower frequency noise in the supply that can
lead to output clock phase modulation.
Recommended Power Supply Connection for
Optimal Device Performance
V D D P in
C onnection to 3.3V
P ow er P lane
Ferrite
Bead
B ulk D ecoupling C apacitor
(such as 1 F Tantalum )
0.01
V D D P in
V D D P in
The value of the load capacitors can be roughly
determined by the formula C = 2(CL - 6) where C is the
load capacitor connected to X1 and X2, and CL is the
specified value of the load capacitance for the crystal.
A typical crystal CL is 18 pF, so C = 2(18 - 6) = 24 pF.
Because these capacitors adjust the stray capacitance
of the PCB, check the output frequency using your final
layout to see if the value of C should be changed.
PCB Layout Recommendations
For optimum device performance and lowest output
phase noise, the following guidelines should be
observed.
1) Each 0.01µF decoupling capacitor should be
mounted on the component side of the board as close
to the VDD pin as possible. No vias should be used
between decoupling capacitor and VDD pin. The PCB
trace to VDD pin should be kept as short as possible,
as should the PCB trace to the ground via. Distance of
the ferrite bead and bulk decoupling from the device is
less critical.
2) The external crystal should be mounted next to the
device with short traces. The X1 and X2 traces should
not be routed next to each other with minimum spaces,
instead they should be separated and away from other
traces.
F D ecoupling C apacitors
All power supply pins must be connected to the same
voltage, except VDDO, which may be connected to a
lower voltage in order to change the output level.
3) To minimize EMI, and obtain the best signal integrity,
the 50Ω series termination resistor should be placed
close to the clock output.
To achieve the absolute minimum jitter, power the part
with a dedicated LDO regulator, which will provide high
isolation from power supply noise. Many companies
produce very small, inexpensive regulators; an
example is the National Semiconductor LP2985.
4) An optimum layout is one with all components on the
same side of the board, minimizing vias through other
signal layers (the ferrite bead and bulk decoupling
capacitor can be mounted on the back). Other signal
traces should be routed away from the ICS664-04. This
includes signal traces just underneath the device, or on
layers adjacent to the ground plane layer used by the
device.
Crystal Load Capacitors
If a crystal is used, the device crystal connections
should include pads for capacitors from X1 to ground
and from X2 to ground. These capacitors are used to
MDS 664-04 A
3
Integrated Circuit Systems, Inc. ● 525 Race Street, San Jose, CA 95126
Revision 040805
●
tel (408) 297-1201
●
www.icst.com
ICS664-04
PECL Digital Video Clock Source
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICS664-04. These ratings,
which are standard values for ICS commercially rated parts, are stress ratings only. Functional operation of
the device at these or any other conditions above those indicated in the operational sections of the
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can
affect product reliability. Electrical parameters are guaranteed only over the recommended operating
temperature range.
Item
Rating
Supply Voltage, VDD
5.5 V
All Inputs and Outputs
-0.5V to VDD+0.5 V
Ambient Operating Temperature
0 to +70° C
Storage Temperature
-65 to +150° C
Junction Temperature
125° C
Soldering Temperature
260° C
Recommended Operation Conditions
Parameter
Min.
Ambient Operating Temperature
Power Supply Voltage (measured in respect to GND)
Typ.
Max.
Units
0
+70
°C
+3.0
+3.6
V
DC Electrical Characteristics
Unless stated otherwise, VDD = 3.3 V ±10%, Ambient Temperature 0 to +70° C
Parameter
Symbol
Conditions
Min.
VDD
Operating Voltage
Supply Current
Standby Supply Current
3.0
VDDO
IDD
Typ.
2.5
No Load
IDDPD
Max.
Units
3.6
V
VDD
V
25
mA
75
µA
Input High Voltage
VIH
Input Low Voltage
VIL
Output High Voltage
VOH
Output Low Voltage
VOL
Input Capacitance
CIN
Input pins
7
pF
Internal Pull-up Resistor
RPU
Input pins
120
kΩ
MDS 664-04 A
2
V
0.8
V
VDDO-1.5
VDDO-1.1
V
VDDO-2.0
VDDO-1.8
V
4
Integrated Circuit Systems, Inc. ● 525 Race Street, San Jose, CA 95126
Revision 040805
●
tel (408) 297-1201
●
www.icst.com
ICS664-04
PECL Digital Video Clock Source
AC Electrical Characteristics
Unless stated otherwise, VDD = 3.3 V ±10%, Ambient Temperature 0 to +70° C
Parameter
Symbol
Conditions
Min.
Typ.
Crystal Frequency
Max.
Units
28
MHz
Output Clock Rise Time
tOR
20% to 80%, CL=5 pF
1.5
ns
Output Clock Fall Time
tOF
80% to 20%, CL=5 pF
1.5
ns
Output Duty Cycle
tOD
at VDD/2, CL=5 pF
60
%
Power-up Time
tPU
Inputs out of PD state
to clocks stable
10
ms
Power-down Time
tPD
Inputs in PD state to
clocks off
1
µs
40
Peak-to-peak Jitter, Short
term
49 to 51
70
ps
Peak-to-peak Jitter, Long
term
10 µs delay
300
ps
Single Sideband Phase
Noise
10 kHz offset
-120
dBc
0
ppm
Actual Mean Frequency
Error versus Target
Thermal Characteristics
Parameter
Thermal Resistance Junction to
Ambient
Thermal Resistance Junction to Case
Symbol
Conditions
Min.
Typ.
Max. Units
θJA
Still air
78
°C/W
θJA
1 m/s air flow
70
°C/W
θJA
3 m/s air flow
68
°C/W
37
°C/W
θJC
Typical Output Termination
ICS664-04
CLK
50 Ohm
MDS 664-04 A
5
Integrated Circuit Systems, Inc. ● 525 Race Street, San Jose, CA 95126
Revision 040805
●
tel (408) 297-1201
●
www.icst.com
ICS664-04
PECL Digital Video Clock Source
Package Outline and Package Dimensions (16-pin TSSOP, 4.40 mm Body, 0.65 mm Pitch)
Package dimensions are kept current with JEDEC Publication No. 95, MO-153
Millimeters
16
Symbol
E1
E
IN D EX
AR EA
1
2
D
A
2
Min
A
A1
A2
b
C
D
E
E1
e
L
α
aaa
Inches
Max
-1.20
0.05
0.15
0.80
1.05
0.19
0.30
0.09
0.20
4.90
5.1
6.40 BASIC
4.30
4.50
0.65 Basic
0.45
0.75
0°
8°
-0.10
Min
Max
-0.047
0.002
0.006
0.032
0.041
0.007
0.012
0.0035 0.008
0.193
0.201
0.252 BASIC
0.169
0.177
0.0256 Basic
0.018
0.030
0°
8°
-0.004
A
A
1
c
-C e
S E A T IN G
P LA N E
b
L
aaa C
Ordering Information
Part / Order Number
Marking
Shipping Packaging
Package
Temperature
ICS664G-04
664G-04
Tubes
16-pin TSSOP
0 to +70° C
ICS664G-04TR
664G-04
Tape and Reel
16-pin TSSOP
0 to +70° C
ICS664G-04LF
664G-04L
Tubes
16-pin TSSOP
0 to +70° C
ICS664G-04LFTR
664G-04L
Tape and Reel
16-pin TSSOP
0 to +70° C
Parts that are ordered with a "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.
While the information presented herein has been checked for both accuracy and reliability, Integrated Circuit Systems (ICS)
assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would
result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial
applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary
environmental requirements are not recommended without additional processing by ICS. ICS reserves the right to change any
circuitry or specifications without notice. ICS does not authorize or warrant any ICS product for use in life support devices or
critical medical instruments.
MDS 664-04 A
6
Integrated Circuit Systems, Inc. ● 525 Race Street, San Jose, CA 95126
Revision 040805
●
tel (408) 297-1201
●
www.icst.com