LTC4370 Two-Supply Diode-OR Current Balancing Controller Features Description Shares Load Between Two Supplies n Eliminates Need for Active Control of Input Supplies n No Share Bus Required n Blocks Reverse Current n No Shoot-Through Current During Start-Up or Faults n0V to 18V High Side Operation n Enable Inputs n MOSFET On Status Outputs n Dual Ideal Diode Mode n16-Lead DFN (4mm × 3mm) and MSOP Packages The LTC®4370 is a two-supply current sharing controller which incorporates MOSFET ideal diodes. The diodes block reverse and shoot-through currents during start-up and fault conditions. Their forward voltage is adjusted to share the load currents between supplies. Unlike other sharing methods, neither a share bus nor trim pins on the supply are required. n Applications Redundant Power Supplies n High Availability Systems and Servers n Telecom and Network Infrastructure n L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks and PowerPath and ThinSOT are trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. Protected by U.S. Patents, including 7920013 and 8022679. Additional patent pending. The maximum MOSFET voltage drop can be set with a resistor. A fast gate turn-on reduces the load voltage droop during supply switchover. If the input supply fails or is shorted, a fast turn-off minimizes reverse current transients. The controller operates with supplies from 2.9V to 18V. For lower rail voltages, an external supply is needed at the VCC pin. Enable inputs can be used to turn off the MOSFET and put the controller in a low current state. Status outputs indicate whether the MOSFETs are on or off. The load sharing function can be disabled to turn the LTC4370 into a dual ideal diode controller. Typical Application 12V, 10A Load Share SUM85N03-06P EN1 CPO1 0.1µF NC 20 39nF* VIN1 GATE1 OUT1 VCC LTC4370 GND RANGE FETON1 2mΩ FETON2 2mΩ OUT2 EN2 CPO2 VIN2 GATE2 COMP 0.18µF 39nF* VINB 12V OUT 12V, 10A SHARING ERROR (IVINA – IVINB)/ IL (%) VINA 12V Current Sharing Error vs Supply Difference 15 10 5 0 –5 –10 –15 –20 –750 SUM85N03-06P 4370 TA01 –500 –250 0 250 VINA – VINB (mV) 500 750 4370 TA01b *OPTIONAL, FOR FAST TURN-ON 4370f 1 LTC4370 Absolute Maximum Ratings (Notes 1, 2) VIN1, VIN2, OUT1, OUT2 Voltages....................−2V to 24V VCC Voltage................................................ −0.3V to 6.5V GATE1, GATE2 Voltages (Note 3)................ −0.3V to 34V CPO1, CPO2 Voltages (Note 3).................... −0.3V to 34V RANGE Voltage.................................−0.3V to VCC + 0.3V COMP Voltage............................................... −0.3V to 3V EN1, EN2, FETON1, FETON2 Voltages..........−0.3V to 24V CPO1, CPO2 Average Current..................................10mA FETON1, FETON2 Currents........................................5mA Operating Ambient Temperature Range LTC4370C................................................. 0°C to 70°C LTC4370I.............................................. −40°C to 85°C Storage Temperature Range................... −65°C to 150°C Lead Temperature (Soldering, 10 sec) MS Package....................................................... 300°C Pin Configuration TOP VIEW EN2 1 RANGE 2 COMP 3 VIN2 4 GATE2 5 CPO2 6 OUT2 7 FETON2 8 16 EN1 15 GND 17 TOP VIEW EN2 RANGE COMP VIN2 GATE2 CPO2 OUT2 FETON2 14 VCC 13 VIN1 12 GATE1 11 CPO1 10 OUT1 9 FETON1 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 EN1 GND VCC VIN1 GATE1 CPO1 OUT1 FETON1 MS PACKAGE 16-LEAD PLASTIC MSOP DE PACKAGE 16-LEAD (4mm × 3mm) PLASTIC DFN TJMAX = 125°C, θJA = 125°C/W TJMAX = 125°C, θJA = 43°C/W EXPOSED PAD (PIN 17) PCB GND CONNECTION IS OPTIONAL Order Information LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE LTC4370CDE#PBF LTC4370CDE#TRPBF 4370 16-Lead (4mm × 3mm) Plastic DFN 0°C to 70°C LTC4370IDE#PBF LTC4370IDE#TRPBF 4370 16-Lead (4mm × 3mm) Plastic DFN –40°C to 85°C LTC4370CMS#PBF LTC4370CMS#TRPBF 4370 16-Lead Plastic MSOP 0°C to 70°C LTC4370IMS#PBF LTC4370IMS#TRPBF 4370 16-Lead Plastic MSOP –40°C to 85°C Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/ 4370f 2 LTC4370 Electrical Characteristics The l denotes those specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. VIN1 = VIN2 = 12V, OUT = VIN, VCC open, unless otherwise noted. SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS Supplies VIN VIN1, VIN2 Operating Range VCC(EXT) VCC External Supply Operating Range VCC(REG) VCC Regulated Voltage IIN VIN1, VIN2 Current Enabled, Higher Supply Enabled, Lower Supply Pull-Up Disabled Other VIN = 11.7V, Both EN = 0V Other VIN = 12.3V, Both EN = 0V Both VIN = 0V, VCC = 5V, Both EN = 0V Both EN = 1V VCC Current Enabled Disabled VCC = 5V, Both VIN = 1.2V, Both EN = 0V VCC = 5V, Both VIN = 1.2V, Both EN = 1V VCC(UVLO) VCC Undervoltage Lockout Threshold VCC Rising l 2.3 2.55 2.7 V ΔVCC(HYST) VCC Undervoltage Lockout Hysteresis l 40 120 300 mV l 0 ±2 mV ICC With External VCC Supply l l 2.9 0 18 VCC V V VIN1, VIN2 ≤ VCC l 2.9 6 V l 4.5 5 5.5 V l l l l 2.1 320 –110 80 3 450 –180 180 mA µA µA µA l l 2 105 2.8 220 mA µA Load Share VEA(OS) Error Amplifier Input Offset gm(EA) Error Amplifier Gain (–ΔICOMP /ΔVOUT) VFR(MIN) Minimum Forward Regulation Voltage (VIN – OUT) VIN = 1.2V, VCC = 5V VIN = 12V l l 2 2 12 25 25 50 mV mV VFR(MAX) Maximum Forward Regulation Voltage (VIN – OUT) RRANGE = 4.99k, VIN = 1.2V, VCC = 5V RRANGE = 4.99k, VIN = 12V RRANGE = 49.9k, VIN = 1.2V, VCC = 5V RRANGE = 49.9k, VIN = 12V l l l l 40 45 425 440 62 75 511 524 82 100 575 590 mV mV mV mV IRANGE RANGE Pull-Up Current RANGE = 0.2V l –8.8 –10 –11.2 µA VRANGE(TH) RANGE Load Share Disable Threshold 150 l µS VCC – 0.5 VCC – 0.3 VCC – 0.1 V Gate Drive ΔVGATE MOSFET Gate Drive (GATE – VIN) VFWD = 0.2V; I = 0, −1μA; Highest VIN = 12V VFWD = 0.2V; I = 0, −1μA; Highest VIN = 2.9V l l 10 4.5 12 7 14 9 V V tON(GATE) GATE1, GATE2 Turn-On Propagation Delay VFWD (= VIN – OUT) Step: –0.3V 0.3V l 0.4 1 µs tOFF(GATE) GATE1, GATE2 Turn-Off Propagation Delay VFWD Step: 0.3V –0.3V l IGATE(PK) GATE1, GATE2 Peak Pull-Up Current GATE1, GATE2 Peak Pull-Down Current VFWD = 0.4V, ΔVGATE = 0V, CPO = 17V VFWD = −2V, ΔVGATE = 5V l l –0.9 0.9 0.4 1 µs –1.4 1.4 –1.9 1.9 A A IGATE(OFF) GATE1, GATE2 Off Pull-Down Current Corresponding EN = 1V, ΔVGATE = 2.5V l 65 110 160 µA EN Falling l l 580 600 620 mV 2 8 20 mV 0 ±1 µA 16 260 40 µA µA –70 –115 µA 0.4 1.2 V V Input/Output Pins VEN(TH) EN1, EN2 Threshold Voltage ΔVEN(TH) EN1, EN2 Threshold Hysteresis IEN EN1, EN2 Current At 0.6V l IOUT OUT1, OUT2 Current Enabled Disabled OUTn = 0V, 12V; Both EN = 0V Both EN = 1V l l –70 ICPO(UP) CPO1, CPO2 Pull-Up Current CPO = VIN l –40 VOL FETON1, FETON2 Output Low Voltage I = 1mA I = 3mA l l 0.12 0.36 VOH FETON1, FETON2 Output High Voltage I = −1μA, VFWD = 1V l VCC – 1.4 VCC – 0.9 VCC – 0.5 V 4370f 3 LTC4370 Electrical Characteristics SYMBOL PARAMETER CONDITIONS MIN IFETON FETON1, FETON2 Leakage Current At 12V l ΔVGATE(ON) MOSFET On Detect Threshold (GATE – VIN) FETON Transitions High l Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to GND unless otherwise specified. 300 OTHER VIN = 0V 2.5 µA 0.7 1.1 V VCC = 6V OTHER VIN = 0V BOTH VIN = 0V 2 150 1 100 ICC (mA) 1.5 IIN (µA) IIN (mA) ±1 VCC Current vs Voltage 2.5 200 2 50 0 0.5 OTHER VIN = 12V –50 0 –0.5 VIN Current vs Voltage with External VCC 250 0 0.28 UNITS TA = 25°C, VIN1 = VIN2 = 12V, OUT = VIN, VCC open, unless otherwise noted. 3 MAX Note 3: Internal clamps limit the GATE and CPO pins to a minimum of 10V above, and a diode below the corresponding VIN pin. Driving these pins to voltages beyond the clamp may damage the device. Typical Performance Characteristics VIN Current vs Voltage TYP 1.5 1 0.5 –100 0 3 6 9 VIN (V) 12 15 –150 18 0 1 4370 G01 2 3 VIN (V) 4 5 OUT Current vs Voltage 30 250 25 VFR(MIN) (mV) IOUT (µA) 150 100 50 1 2 3 VCC (V) 4 5 6 4370 G03 Minimum Forward Regulation Voltage vs VIN Voltage with External VCC 20 VCC = 5V VCC = 3.3V 15 10 5 0 –50 0 4370 G02 300 200 0 6 0 3 6 9 VOUT (V) 12 15 18 4370 G04 0 0 1 2 3 VIN (V) 4 5 4370 G05 4370f 4 LTC4370 Typical Performance Characteristics unless otherwise noted. 15 �VGATE Voltage vs Current 14 VIN = 18V 6 VIN = 2.9V 3 8 6 VCC 4 0 2 0 –20 –40 –60 –80 IGATE (µA) –100 0 –120 0 3 4370 G06 6 9 VIN (V) 12 15 18 4370 G07 Error Amplifier Transfer Characteristic Maximum Forward Regulation Voltage vs RANGE Resistor 700 30 600 20 500 10 ICOMP (µA) VFR(MAX) (mV) ∆VGATE 10 VGATE – VIN, VCC (V) VGATE – VIN (V) 9 400 300 0 –10 200 –20 100 0 �VGATE and VCC Voltages vs VIN Voltage 12 12 –3 TA = 25°C, VIN1 = VIN2 = 12V, OUT = VIN, VCC open, 0 20 40 60 RRANGE (kΩ) 80 100 –30 –300 –200 4370 G08 FETON Output Low Voltage vs Current –100 0 100 VOUT1 – VOUT2 (mV) 200 300 4370 G09 FETON Output High Voltage vs Current 700 5 600 4 400 VOH (V) VOL (mV) 500 300 3 2 200 1 100 0 0 1 2 3 IFETON (mA) 4 5 4370 G10 0 0 –2 –4 –6 IFETON (µA) –8 –10 4370 G11 4370f 5 LTC4370 Pin Functions COMP: Error Amplifier Compensation. Connect a capacitor from this pin to GND. The value of this capacitor should be approximately 10 to 50 times the gate capacitance (CISS) of the MOSFET switch. Maintain low board leakage on this pin for best load sharing accuracy. For example, 100nA of leakage current (equal to 1V across 10MΩ) increases the error amplifier offset by 0.7mV. Leave this pin open if only using ideal diode mode. CPO1, CPO2: Charge Pump Output. Connect a capacitor from this pin to the corresponding VIN pin. The value of this capacitor should be approximately 10× the gate capacitance (CISS) of the MOSFET switch. The charge stored on this capacitor is used to pull up the gate during a fast turn-on. Leave this pin open if fast turn-on is not needed. EN1, EN2: Enable Input. Keep this pin below 0.6V to enable sharing and diode control on the corresponding supply. Driving this pin high shuts off the MOSFET gate (current can still flow through its body diode). The comparator has a built-in hysteresis of 8mV. Having both EN pins high lowers the current consumption of the device. Exposed Pad (DE Package Only): The exposed pad may be left open or connected to device ground. FETON1, FETON2: MOSFET Status Output. This pin is pulled low by an internal switch when GATE is less than 0.7V above VIN to indicate an off MOSFET. Because of this, it may also signal off if small currents are flowing through a high-gm MOSFET with a large forward voltage across it. An internal 500k resistor pulls this pin up to a diode below VCC. It may be pulled above VCC using an external pull-up. Tie to GND or leave open if unused. GATE1, GATE2: MOSFET Gate Drive Output.Connect this pin to the gate of the external N-channel MOSFET switch. An internal clamp limits the gate voltage to 12V above, and a diode below the input supply. During fast turn-on, a 1.4A pull-up current charges GATE to CPO. During fast turn-off, a 1.4A pull-down current discharges GATE to VIN. GND: Device Ground. OUT1, OUT2: Output Voltage and Current Sense Input. Connect this pin to the input side of the supply’s current sense resistor. A Kelvin connection is important for accurate current sharing. The voltage sensed at this pin is used to control the MOSFET gate. RANGE: Supply Differential Voltage Load Sharing Range. Connect a resistor (below 60k) from this pin to GND. A 10μA internal pull-up current source into this resistor sets the pin voltage VRANGE. The two supplies will typically share the load current if their voltage difference is within ±VRANGE. The maximum sharing range is ±0.6V, obtained by leaving RANGE open. Connecting this pin to VCC disables load share control and the device behaves as a dual ideal diode controller. VCC : Low Voltage Supply. Connect a 0.1μF capacitor from this pin to ground. For VIN ≥ 2.9V this pin provides decoupling for an internal regulator that generates a 5V supply. For applications where both VIN < 2.9V, also connect an external supply in the 2.9V to 6V range to this pin. VIN1, VIN2 : Voltage Sense and Supply Input. Connect this pin to the supply side of the MOSFET. The low voltage supply VCC is generated from the higher of VIN1 and VIN2. The voltage sensed at this pin is used to control the MOSFET gate. 4370f 6 LTC4370 Functional Diagram R1 M1 VSUPPLY1 C1 13 12 VIN1 16 0.6V – EN1 + 11 GATE1 10 CPO1 OUT1 VCC DISABLE1 500k CP1 VIN2 SA1 + – VFR1 14 VCC 2.55V + + – CHARGE PUMP2 f = 3MHz + + – VCC RANGE 2 R3 VCC 500k CP5 FETON2 + VIN2 8 GATE2 EXPOSED PAD* 17 VIN2 4 GATE2 5 – OUT2 CPO2 6 + – 0.7V Z 15 TO LOAD VCC 0.3V DISABLE LOAD SHARE CP3 GND OUT2 + VFR2 – EN2 – + – 1 OUT1 10µA SA2 DISABLE2 CC + gm = 150µS GATE2 OFF – 3 EA SERVO ADJUST CP2 0.6V CP4 COMP GATE1 OFF – VCC LOW CVCC – + – LDO 9 0.7V GATE1 + – VIN1 FETON1 + VIN1 CHARGE PUMP1 f = 3MHz CP6 7 C2 *DE PACKAGE ONLY R2 VSUPPLY2 M2 4370 BD 4370f 7 LTC4370 Operation The LTC4370 controls N-channel MOSFETs, M1 and M2, to share the load between two supplies. Error amplifier EA compares OUT1 to OUT2 and sets the servo command voltages, VFR1 and VFR2, for servo amplifiers, SA1 and SA2. When enabled, each servo amplifier controls the gate of the external MOSFET to regulate its forward voltage drop (VFWD = VIN – OUT) to VFR. The combined action of EA and SA forces OUT1 to equal OUT2. Having the power path resistance from OUT1 to the load (R1) equal that from OUT2 to the load (R2) forces each supply to source half of the load current. The lower limit of VFR adjustment is 25mV at higher supply voltages (reducing to 12mV at lower voltages to conserve power and voltage drop). The upper limit is VRANGE + 25mV (or VRANGE + 12mV). VRANGE itself is set by the 10µA pullup current source into resistor R3. The servo adjust block ensures that only the higher supply’s VFR is adjusted up while the other is pinned to the minimum. Tying RANGE to VCC (CP5) forces both VFR to the minimum, transforming the device into a dual ideal diode controller. The servo amplifier raises the gate voltage to enhance the MOSFET whenever the load current causes the drop to exceed VFR. For large output currents the MOSFET gate is driven fully on and the voltage drop is equal to IFET • RDS(ON). In the case of an input supply short-circuit, when the MOSFET is conducting, a large reverse current starts flowing from the load towards the input. SA detects this failure condition as soon as it appears and turns off the MOSFET by rapidly pulling down its gate. SA quickly pulls up the gate whenever it senses a large forward voltage drop. An external capacitor (C1, C2) between the CPO and VIN pins is needed for fast gate pull-up. This capacitor is charged up, at device power-up, by the internal charge-pump. The stored charge is used for the fast gate pull-up. The GATE pin sources current from the CPO pin and sinks current to the VIN and GND pins. Clamps limit the GATE and CPO voltages to 12V above and a diode below VIN. Internal switches pull the FETON pins low when the GATE to VIN voltage is below 0.7V to indicate that the external MOSFET is off (body diode could still conduct). LDO is a low dropout regulator that generates a 5V supply at the VCC pin from the highest VIN input. When supplies below 2.9V are being shared, an external supply in the 2.9V to 6V range is required at the VCC pin. VCC and EN pin comparators, CP1 to CP3, control power passage. The MOSFET is held off whenever the EN pin is above 0.6V, or the VCC pin is below 2.55V. A high on both EN pins lowers the current consumption of the device. 4370f 8 LTC4370 Applications Information High availability systems often employ parallel-connected power supplies or battery feeds to achieve redundancy and enhance system reliability. ORing diodes have been a popular means of connecting these supplies at the point of load. System uptime improves further if these paralleled supplies also share the load current. VINA 5V M1 SUM85N03-06P C1 39nF EN1 CPO1 VIN1 GATE1 VCC CVCC 0.1µF GND LTC4370 RANGE R3 30.1k EN2 VINB 5V OUT1 FETON1 FETON2 OUT2 CPO2 VIN2 GATE2 COMP C2 39nF D1 R4 820Ω R1 2.5mΩ OUT 10A R2 2.5mΩ SHARE OFF CC 0.18µF M2 SUM85N03-06P D1: RED LED LN1251C 4370 F01 Figure 1. 5V Diode-OR Load Share with Status Light NORMALIZED CURRENT I2 VRANGE = 500mV I1 1 Current Sharing Characteristic The LTC4370 load shares the two supplies by dropping their voltage difference across the MOSFETs in series with them (see Figure 1). The MOSFET on the lower supply drops the minimum servo voltage VFR(MIN) (12mV or 25mV depending on supply voltage levels), while the other MOSFET drops VFR(MIN) plus the supply voltage difference. This equalizes both the OUT pin voltages, and by Ohm’s law the current that flows through the sense resistors. Figure 2a illustrates this. It shows the higher supply’s MOSFET forward voltage drop, VFWD, increasing to compensate the supply difference up to ±500mV. The upper limit of the servo command adjustment is the minimum servo plus the RANGE pin voltage (500mV in Figure 2). Hence, when the two supplies differ by a voltage equal to VRANGE, the higher supply’s VFWD is pinned at the maximum servo voltage VFR(MAX). If the supplies diverge by more than VRANGE, the OUT pin voltages start NORMALIZED CURRENT I2 VRANGE = 500mV 1 1 = 2RS SLOPE I1 1 = 2RS SLOPE 2RS + RDS(ON) 0.5 0.5 VFR(MIN) I1 I2 0 –500mV 0 VIN1 – VIN2 500mV SHARING CAPTURE RANGE ±∆VIN(SH) MAXIMUM M2 MOSFET POWER DISSIPATION –400mV MOSFET FORWARD DROP 525mV VFWD1 VFR(MIN) 0 0 400mV SHARING CAPTURE RANGE ±∆VIN(SH) MAXIMUM M1 MOSFET POWER DISSIPATION MOSFET FORWARD DROP VFR(MAX) I2 0 IL • RS VFWD2 –500mV IL • RDS(ON) I1 VIN1 – VIN2 100mV + IL • RS 525mV VFWD2 VFWD1 0.5IL • RDS(ON) 125mV 25mV 25mV 500mV VIN1 – VIN2 –400mV 0 400mV DRAWING IS NOT TO SCALE! (2a) Low RDS(ON): Can Servo 25mV Minimum Forward Regulation Voltage at Half Load VIN1 – VIN2 4370 F02 (2b) High RDS(ON): Fully-On MOSFET Drops 125mV at Half Load Figure 2. Load Sharing Characteristics 4370f 9 LTC4370 Applications Information diverging, and so too, the supply currents. As the supply voltages separate, the entire load current is steered to the higher supply. Now, the servo command across the higher supply’s MOSFET is folded back from the maximum to the minimum servo to minimize power dissipated in the MOSFET. The sharing capture range, ΔVIN(SH), in Figure 2a is ±500mV, set by VRANGE. Figure 2b will be discussed later in the MOSFET Selection section. RANGE Pin Configuration The RANGE pin resistor is decided by the design trade-off between the sharing capture range and the power dissipated in the MOSFET. A larger RRANGE increases the capture range at the expense of enhanced power dissipation and reduced load voltage. On the other hand, supplies with tight tolerances can afford a smaller capture range and therefore cooler operation of the MOSFETs. As mentioned, the upper limit of the servo command adjustment is VRANGE plus the minimum forward regulation voltage. Since an internal 10μA pull-up current flowing through the external resistor sets VRANGE: VFR(MAX) = 10µA • RRANGE + VFR(MIN) (1) If RRANGE is larger than 60k (including the pin open state), the internal limit for the first term on the righthand side of Equation 1 is 600mV, setting VFR(MAX) to 612mV or 625mV. Note that servo voltages nearing the MOSFET’s body diode voltage may divert some or all current to the diode especially at hot temperatures. This may either cause FETON to go low if VGS falls below 0.7V, or M1 0V TO VCC OPTIONAL OR VIN1 2.9V TO 6V HERE CVCC 0.1µF 0V TO VCC VCC loss of sharing control. Also note that an open RANGE pin biases itself to a voltage greater than 600mV. Connecting the RANGE pin to VCC disables the load sharing loop. The servo voltages for both MOSFETs are fixed at the minimum with no adjustment. The device now behaves as a dual ideal diode controller. This is handy for testing purposes. Use the LTC4353 if only a dual ideal diode controller is needed. Power Supply Configuration The LTC4370 can load share high side supplies down to 0V rail voltage. This requires powering the VCC pin with an early external supply in the 2.9V to 6V range. In this range of operation VIN should be lower than VCC. If VCC powers up after VIN, and backfeeding of VCC by the internal 5V LDO is a concern, then a series resistor (few 100Ω) or Schottky diode limits device power dissipation and backfeeding of a low VCC supply when any VIN is high. A 0.1µF bypass capacitor should also be connected between the VCC and GND pins, close to the device. Figure 3 illustrates this. If either VIN operates above 2.9V, then the external supply at VCC is not needed. The 0.1µF capacitor is still required for bypassing. Start of Sharing When currents are not being shared either because the load current or one of the supplies is off, the COMP voltage is railed towards 0V or 2V depending on the input signal to the error amplifier and its offset. For example, GATE1 VIN1 LTC4370 VIN2 M1 2.9V TO 18V (0V TO 18V) CVCC 0.1µF GATE2 M2 0V TO 18V (2.9V TO 18V) VCC GATE1 LTC4370 VIN2 GATE2 M2 4370 F03 Figure 3. Power Supply Configurations 4370f 10 LTC4370 Applications Information in the absence of load current the differential input voltage to the error amplifier is zero and the COMP current is gm(EA) • VEA(OS). Before sharing can start, the COMP voltage has to slew towards its operating point of 0.7V (when VIN1 < VIN2) or 1.24V (VIN1 > VIN2). This delay is determined by the differential input signal to the error amplifier (which is ΔVOUT = OUT1 – OUT2 = (I1 − I2) • RS), its gm and the COMP capacitor value. Depending on how the currents split before converging, the delay can vary from 1 to 5 times: CC • ΔVCOMP g •I •R m(EA) L S Figure 4a shows the case where a 5.1V VIN1 is turned on while VIN2 is at 4.9V supplying 10A. Initially, COMP is railed low to 0.1V since ΔVOUT (−I2 • RS) is negative, and needs to rise to 1.24V as the final VIN1 is higher than VIN2. With VIN1 off, ΔVIN is large and negative, causing the forward regulation voltage of the second supply VFR2 to be folded back to the minimum VFR(MIN) (travelling from left to right in Figure 2a). As the ΔVIN magnitude decreases, VFR2 rises to the maximum VFR(MAX), lowering I2 and the load voltage. COMP is around 0.7V when VFR2 is being adjusted. When COMP reaches 1.24V, VFR2 is kept at the minimum and VFR1 is adjusted appropriately to compensate for the 0.2V of ΔVIN. The sharing closure is smoother for the case where VIN1 < VIN2 since COMP only has to slew to 0.7V to lower VFR2 (Figure 4b). VIN1 = 5.1V VIN2 = 4.9V IL = 10A I2 CURRENT 5A/DIV VOLTAGE 2V/DIV MOSFET Selection The LTC4370 drives N-channel MOSFETs to conduct the load current. The important parameters of the MOSFET are its maximum drain-source voltage BVDSS, maximum gate-source voltage VGS(MAX), on-resistance RDS(ON), and maximum power dissipation PD(MAX). If an input is connected to ground, the full supply voltage can appear across the MOSFET. To survive this, the BVDSS must be higher than the supply voltages. The VGS(MAX) rating of the MOSFET should exceed 14V since that is the upper limit of the internal GATE to VIN clamp. To obtain the maximum sharing capture range, the RDS(ON) should be low enough for the servo amplifier to regulate the minimum forward regulation voltage across the MOSFET while it’s conducting half of the load current. If it cannot, the gate voltage will be railed high. Hence, the RDS(ON) value in the MOSFET data sheet should be looked up for 10V or 4.5V gate drive depending on the VIN voltage. Since the OUT voltages are equal, the breakpoint for exact sharing in the higher RDS(ON) case is: ΔVIN(SH) = VFR(MAX) – 0.5IL • RDS(ON) CURRENT 5A/DIV I1 OUT OUT VIN1 VOLTAGE 2V/DIV COMP (1V/DIV) 25ms/DIV VIN1 = 4.9V VIN2 = 5.1V IL = 10A I2 I1 VIN1 4370 F04a (4a) VIN1 > VIN2 (2) COMP (0.5V/DIV) 25ms/DIV 4370 F04b (4b) VIN1 < VIN2 Figure 4. Start of Sharing at VIN1 Turn-On 4370f 11 LTC4370 Applications Information In Figure 2b, 0.5IL • RDS(ON) is 125mV. The higher RDS(ON) rails the servo amplifier high as it cannot regulate the 25mV VFR(MIN) across the lower supply’s MOSFET. Compared to Figure 2a, the sharing capture range shrinks by 100mV (125mV – 25mV) to ±400mV. However, the ΔVIN over which currents are shared partially stays the same at 500mV + IL • RS. Even when not maximizing sharing range, IL • RDS(ON) should be kept below 75mV for optimum performance. The peak power dissipation in the MOSFET occurs when the entire load current is being sourced by one supply with the maximum forward regulation voltage dropped across the MOSFET (as shown in Figure 2a). Therefore, the PD(MAX) rating of the MOSFET should satisfy: PD(MAX) ≥ IL • VFR(MAX) (3) Table 1 provides starting guidelines for the type of MOSFET package and heat sink required at various levels of power dissipation. These are typical ranges for a room temperature ambient with no air flow. Table 1. Guidelines for MOSFET Power Dissipation MAXIMUM POWER DISSIPATED 0.5W to 1W MOSFET PACKAGE HEAT SINK SO-8 PCB SO-8 With Exposed Pad, D-Pak (TO-252) PCB TO-220 Standing in Free Air 2W to 4W DD-Pak (TO-263), TO-220 PCB 4W to 10W TO-220 Stamping 10W to 20W TO-220 Casting, Extrusion 20W to 50W TO-247, TO-3P Extrusion 1W to 2W Sense Resistor Selection The sense resistor voltage drop dictates the current sharing accuracy. Sharing error, due to the error amplifier input offset, decreases with increasing sense voltage as: | VEA(OS)| ΔI |I – I | 2mV = 1 2 = = I L • RS IL I L • RS IL (4) I1 and I2 are the two supply currents, IL is the load current (I1 + I2 = IL), RS is the sense resistor value, and VEA(OS) is the input offset of the internal error amplifier. A 25mV sense resistor voltage drop with half of the load current flowing through it (i.e., IL • RS = 50mV) gives a 4% sharing error. A larger sense resistance may also be needed if there is a connector in between the OUT pins and the load to minimize the effect of its resistance. At larger sense voltages the accuracy will be limited by the sense resistor tolerance. If sharing accuracy requirements can be relaxed, power dissipated in the sense resistor can be reduced by selecting a lower resistance. Worst-case power dissipation happens at full load, i.e., when load current is not being shared. While reducing the sense resistance, note that the sharing loop does not close for load currents below VEA(OS)/RS. The two sense resistors can have different values if the application does not require the load current to be shared equally between the supplies. In such a case: RS1 I = 2 I1 RS2 (5) CPO Capacitor Selection The recommended value of the capacitor between the CPO and VIN pins is approximately 10× the input capacitance CISS of the MOSFET. A larger capacitor takes a correspondingly longer time to be charged by the internal charge pump. A smaller capacitor suffers more voltage drop during a fast gate turn-on event as it shares charge with the MOSFET gate capacitance. 4370f 12 LTC4370 Applications Information External CPO Supply The internal charge pump takes milliseconds to charge up the CPO capacitor especially during device power-up. This time can be shortened by connecting an external supply to the CPO pin. A series resistor is needed to limit the current into the internal clamp between the CPO and VIN pins. The CPO supply should also be higher than the main input supply to meet the gate drive requirements of the MOSFET. Figure 5 shows such a 3.3V load share application, where a 12V supply is connected to the CPO pins through a 1k resistor. The 1k limits the current into the CPO pin when the VIN pin is grounded. For the 8.7V of gate drive (12V – 3.3V), logic-level MOSFETs would be an appropriate choice for M1 and M2. Loop Stability The servo amplifier loop is compensated by the gate capacitance of the N-channel power MOSFET. No further compensation components are normally required. In the case when a MOSFET with less than 1nF gate capacitance is chosen, a 1nF compensation capacitor connected across the gate and source might be required. The load sharing control loop is compensated by the capacitor from the COMP pin to ground. This capacitor should be at least 50× the input capacitance CISS of the MOSFET. A larger capacitor improves stability at the exVINA 3.3V M1 C1 39nF pense of increased sharing closure delay, while a smaller capacitor can cause the two supply currents to switch back and forth before settling. The COMP capacitor can be just 10× CISS when a CPO capacitor is omitted, i.e., when fast gate turn-on is not used (see Figure 6). Input and Output Capacitance for Pulsed Loads For pulsed loads, the load current will be shared every cycle at frequencies below 100Hz. At higher frequencies, each cycle’s current may not be shared but the time average of the currents will be. Bypassing capacitance on the inputs should be provided to minimize glitches and ripple. This is important since the controller tries to compensate for the supply voltage differences to achieve load sharing. Sufficient load capacitance should also be provided to enhance the DC component of the load current presented to the load share circuit. It is also important to design IL • RDS(ON) below 75mV, as mentioned earlier. With very low duty cycle or very low frequency loads, the COMP voltage will rail whenever the load current falls below the sharing threshold of VEA(OS) /RS for hundreds of milliseconds. At the start of the next load cycle there will be a sharing closure delay as COMP slews to its operating point around 0.7V or 1.24V. To avoid this delay, maintain the load current above VEA(OS) /RS. M1 SUM85N03-06P VINA 12V TO SENSE RESISTOR NC EN1 VIN1 1k 12V 1k GATE1 CPO1 LTC4370 R3 47.5k CPO2 VIN2 GATE2 C2 39nF VINB 3.3V CVCC 0.1µF Figure 5. 3.3V Load Share with External 12V Supply Powering CPO for Faster Start-Up and Refresh LTC4370 RANGE EN2 GATE1 OUT1 GND R4 2.7k FETON1 FETON2 D1 R1 2.5mΩ OUT 10A R2 2.5mΩ OUT2 CPO2 VIN2 GATE2 COMP NC VINB 12V TO SENSE RESISTOR VIN1 VCC 4370 F05 M2 CPO1 M2 SUM85N03-06P CC 0.039µF 4370 F06 D1: RED LED, LN1251C Figure 6. Current Sharing 12V Supplies 4370f 13 LTC4370 Applications Information Input Transient Protection When the capacitances at the input and output are very small, rapid changes in current can cause transients that exceed the 24V absolute maximum rating of the VIN and OUT pins. In ORing applications, one surge suppressor connected from OUT to ground clamps all the inputs. In the absence of a surge suppressor, an output capacitance of 10μF is sufficient in most applications to prevent the transient from exceeding 24V. 12V Design Example This design example demonstrates the selection of components in a 12V system with a 10A maximum load current and ±2% tolerance supplies (Figure 6). That is followed by the recalculations involved for a similar 5V system (Figure 1). First, calculate the RDS(ON) of the MOSFET to achieve the desired forward drop at full load. Assuming a VFWD of 50mV: RDS(ON) ≤ VFWD 50mV = = 5mΩ ILOAD 10A The SUM85N03-06P offers a good solution in a DD-Pak (TO-263) sized package with a 4.5mΩ RDS(ON), 30V BVDSS and 20V VGS(MAX). Since 0.5IL • RDS(ON) is 22.5mV, the servo amplifier will be able to regulate the 25mV minimum forward regulation voltage leading to the maximum possible sharing range set by VRANGE. 2% of 12V is 240mV. The sharing capture range, ΔVIN(SH), needs to be about 2× 240mV (±480mV) to work for most supply voltage differences. A 47.5k R3 sets VRANGE to 475mV. Equation 1 is used to calculate the maximum forward regulation voltage: Equation 3 gives the maximum power dissipation in the MOSFET to be: PD(MAX) = 10A • 500mV = 5W Sufficient PCB area with air flow needs to be provided around the MOSFET drain to keep its junction temperature below the 175°C maximum. A 2.5mΩ sense resistor drops 25mV at full load and yields an error amplifier offset induced sharing error of 2mV/(10A • 2.5mΩ) or 8% (Equation 4). At full load, the sense resistor dissipates 10A2 • 2.5mΩ or 250mW. Since a 12V supply is large enough to tolerate a diode drop, fast gate turn-on is not needed. Hence, the CPO capacitor is omitted. The input capacitance, CISS, of the MOSFET is about 3800pF. Since fast turn-on is not used, the COMP capacitor CC can be just 10× CISS at 0.039µF. Red LED, D1, turns on when any one of the MOSFETs is off, indicating a break in sharing. It requires around 3mA for good luminous intensity. Accounting for a 2V diode drop and 0.6V VOL, R4 is set to 2.7k. 5V Design Example For a 5V, 10A system with ±3% tolerance supplies and fast gate turn-on (Figure 1), the following components need to be recalculated: R3, C1, C2, CC, and R4. R3 is set to 30.1k to account for possible supply differences (2 • 3% • 5V yields ±300mV). C1 and C2 are set to 10× CISS at 0.039µF. With fast turn-on, CC is selected closer to 50× CISS at 0.18µF. With the 5V supply, R4 needs to be 820Ω to allow 3mA into the LED. VFR(MAX) = 10µA • 47.5k + 25mV = 500mV 4370f 14 LTC4370 Applications Information PCB Layout Considerations Kelvin connection of the OUT pins to the sense resistors is important for accurate current sharing. Place the MOSFET as close as possible to the sense resistor. Keep the traces to the MOSFET wide and short to minimize resistive losses. The PCB traces associated with the power path through the MOSFET should have low resistance. Thermal management techniques such as sufficient drain copper area or heat sinks should be considered for optimal MOSFET power dissipation. See Figure 7. It is also important to put CVCC, the bypass capacitor, as close as possible between VCC and GND. Place C1 and C2 near the CPO and VIN pins. The COMP pin may need a guard ring to maintain low board leakage. CURRENT FLOW FROM SUPPLY A G W M1 DD-PAK S VIA TO GROUND PLANE TRACK WIDTH W: 0.03 PER AMPERE ON 1oz Cu FOIL D R1 CVCC MSOP-16 LTC4370 TO LOAD DRAWING IS NOT TO SCALE! R2 FROM SUPPLY B G D W M2 DD-PAK S 4370 FO7 CURRENT FLOW Figure 7. Recommended PCB Layout for M1, M2, CVCC, R1, R2 4370f 15 LTC4370 Typical Applications Current Sharing 3.3V Supplies for 20A Output VINA 3.3V ±3% EN1 CVCC 0.1µF R3 20k M1 IRLS3034PBF C1 0.1µF CPO1 GATE1 VIN1 VCC OUT1 GND LTC4370 RANGE FETON1 R1 2mΩ FETON2 R2 2mΩ OUT2 EN2 CPO2 VIN2 GATE2 COMP C2 0.1µF VINB 3.3V ±3% OUT 20A M2 IRLS3034PBF CC 0.47µF 4370 TA02 4370f 16 LTC4370 Typical Applications 12V Ideal Diode-OR by Tying RANGE to VCC (to Compare Against Load Share). Use LTC4353 if Load Share Is Not Desired VINA 12V EN1 M1 SUM85N03-06P NC CPO1 GATE1 VIN1 RANGE CVCC 0.1µF FETON1 VCC LTC4370 COMP GND EN2 VINB 12V OUT1 NC OUT 10A FETON2 CPO2 VIN2 GATE2 OUT2 NC M2 SUM85N03-06P 4370 TA03 4370f 17 LTC4370 Package Description Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. DE Package 16-Lead Plastic DFN (4mm × 3mm) (Reference LTC DWG # 05-08-1732 Rev Ø) 0.70 ±0.05 3.30 ±0.05 3.60 ±0.05 2.20 ±0.05 1.70 ± 0.05 PACKAGE OUTLINE 0.25 ± 0.05 0.45 BSC 3.15 REF RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 4.00 ±0.10 (2 SIDES) R = 0.05 TYP 9 R = 0.115 TYP 0.40 ± 0.10 16 3.30 ±0.10 3.00 ±0.10 (2 SIDES) 1.70 ± 0.10 PIN 1 NOTCH R = 0.20 OR 0.35 × 45° CHAMFER PIN 1 TOP MARK (SEE NOTE 6) 0.200 REF 0.75 ±0.05 (DE16) DFN 0806 REV Ø 8 1 0.23 ± 0.05 0.45 BSC 3.15 REF 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC PACKAGE OUTLINE MO-229 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 4370f 18 LTC4370 Package Description Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. MS Package Package MS 16-Lead Plastic 16-Lead Plastic MSOP MSOP (Reference LTC LTC DWG DWG ## 05-08-1669 (Reference 05-08-1669Rev RevØ)Ø) 0.889 ± 0.127 (.035 ± .005) 5.23 (.206) MIN 3.20 – 3.45 (.126 – .136) 4.039 ± 0.102 (.159 ± .004) (NOTE 3) 0.50 (.0197) BSC 0.305 ± 0.038 (.0120 ± .0015) TYP RECOMMENDED SOLDER PAD LAYOUT 0.254 (.010) DETAIL “A” 3.00 ± 0.102 (.118 ± .004) (NOTE 4) 4.90 ± 0.152 (.193 ± .006) 0° – 6° TYP 0.280 ± 0.076 (.011 ± .003) REF 16151413121110 9 GAUGE PLANE 0.53 ± 0.152 (.021 ± .006) DETAIL “A” 0.18 (.007) SEATING PLANE 1.10 (.043) MAX 0.17 – 0.27 (.007 – .011) TYP 1234567 8 0.50 NOTE: (.0197) 1. DIMENSIONS IN MILLIMETER/(INCH) BSC 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 0.86 (.034) REF 0.1016 ± 0.0508 (.004 ± .002) MSOP (MS16) 1107 REV Ø 4370f Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 19 LTC4370 Typical Application 1.2V Load Share SUM85N03-06P VINA 1.2V EN1 39nF VIN1 CPO1 5V GATE1 OUT1 VCC 0.1µF GND LTC4370 RANGE 7.5k EN2 FETON1 2mΩ FETON2 2mΩ OUT OUT2 CPO2 VIN2 GATE2 COMP 0.18µF 39nF VINB 1.2V SUM85N03-06P 4370 TA04 Related Parts PART NUMBER DESCRIPTION COMMENTS TM LTC1473/ LTC1473L Dual PowerPath Switch Driver N-Channel, 4.75V to 30V/3.3V to 10V, SSOP-16 Package LTC1479 PowerPath Controller for Dual Battery Systems Three N-Channel Drivers, 6V to 28V, SSOP-36 Package LTC4352 Low Voltage Ideal Diode Controller with Monitoring N-Channel, 0V to 18V, UV, OV, MSOP-12 and DFN-12 Packages LTC4353 Dual Low Voltage Ideal Diode Controller Dual N-Channel, 0V to 18V, MSOP-16 and DFN-16 Packages LTC4354 Negative Voltage Diode-OR Controller and Monitor Dual N-Channel, −4.5V to −80V, SO-8 and DFN-8 Packages LTC4355 Positive High Voltage Ideal Diode-OR with Supply and Fuse Monitors Dual N-Channel, 9V to 80V, SO-16 and DFN-14 Packages LTC4357 Positive High Voltage Ideal Diode Controller N-Channel, 9V to 80V, MSOP-8 and DFN-6 Packages LTC4358 5A Ideal Diode Internal N-Channel, 9V to 26.5V, TSSOP-16 and DFN-14 Packages TM LTC4411 2.6A Low Loss Ideal Diode in ThinSOT Internal P-Channel, 2.6V to 5.5V, 40μA IQ, SOT-23 Package LTC4412/ LTC4412HV Low Loss PowerPath Controller in ThinSOT P-Channel, 2.5V to 28V/36V, 11μA IQ, SOT-23 Package LTC4413/ LTC4413-1 Dual 2.6A, 2.5V to 5.5V, Ideal Diodes in DFN-10 Dual Internal P-Channel, 2.5V to 5.5V, DFN-10 Package LTC4414 36V Low Loss PowerPath Controller for Large P-Channel MOSFETs P-Channel, 3V to 36V, 30μA IQ, MSOP-8 Package LTC4415 Dual 4A Ideal Diodes with Adjustable Current Limit Dual P-Channel 50mΩ Ideal Diodes, 1.7V to 5.5V, 15mV Forward Drop, MSOP-16 and DFN-16 Packages LTC4416/ LTC4416-1 36V Low Loss Dual PowerPath Controller for Large P-Channel MOSFETs Dual P-Channel, 3.6V to 36V, 70μA IQ, MSOP-10 Package 4370f 20 Linear Technology Corporation LT 0512 • PRINTED IN USA 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com LINEAR TECHNOLOGY CORPORATION 2012