MCC TM Micro Commercial Components omponents 20736 Marilla Street Chatsworth !"# $ % !"# 20 Amp High Voltage Features • x MBR20150CT Power Schottky High Junction Temperature Capability Case Material: Molded Plastic. UL Flammability Classification Rating 94V-0 Low Leakage Current Marking : type number • x Barrier Rectifier 150Volts Maximum Ratings • • • • Operating J unction Temperature : 150°C Storage Temperature: - 5 0°C to +150°C Per d iode Thermal Resistance 2.2°C/W Junction to Case Total Thermal Resistance 1.3°C/W Junction to Case MCC Catalog Number MBR 20150 CT Maximum Recurrent Peak Reverse Voltage 150 V Maximum RMS Voltage 105V TO-220AB B L M C Maximum DC Blocking Voltage 150 V D A K PIN 1 3 F G I J N H H Electrical Characteristics @ 25°C Unless Otherwise Specified Average Forward Current Peak Forward Surge Current Maximum Instantaneous Forward Voltage MBR20150CT Maximum Reverse Current At Rated DC Blocking Voltage IF(AV) IFSM 20 A 180A VF .92V VF .75V IR 25 µ A 5m A PIN 1 TC = 155 °C 8.3ms, half sine wave IFM = 10A TJ = 25°C I FM = 10A TJ = 125°C PIN 2 CASE PIN 3 A B C D F G H I J K L M N INCHES .560 .625 .380 .420 .100 .135 .230 .270 -----.250 .500 .580 .090 .110 .020 .045 .012 .025 .139 .161 .140 .190 .045 .055 .080 .115 MM 14.22 9.65 2.54 5.84 -----12.70 2.29 0.51 0.30 3.53 3.56 1.14 2.03 15.88 10.67 3.43 6.86 6.35 14.73 2.79 1.14 0.64 4.09 4.83 1.40 2.92 TJ = 25°C TJ = 125°C * Pulse Test: Pulse Width380µsec, Duty Cycle 2% www.mccsemi.com Revision: 4 1 of 4 2007/07/18 MCC MBR20150CT TM Micro Commercial Components Fig. 1: Average forward power dissipation versus average forward current (per diode). Fig. 2: Average forward current versus ambient temperature (δ = 0.5, per diode). PF(av)(W) 10 9 8 7 6 5 4 3 2 1 0 IF(av)(A) δ = 0.05 δ = 0.1 δ = 0.2 12 δ = 0.5 Rth(j-a)=Rth(j-c) 10 δ=1 8 6 Rth(j-a)=15°C/W 4 T T 2 IF(av) (A) 0 1 2 3 4 5 6 7 δ=tp/T 8 9 δ=tp/T tp 10 11 12 Fig. 3: Non repetitive surge peak forward current versus overload duration (maximum values, per diode). 0 0 Tamb(°C) tp 25 50 75 100 125 150 175 Fig. 4: Relative variation of thermal impedance junction to case versus pulse duration (per diode). IM(A) Zth(j-c)/Rth(j-c) 150 1.0 125 0.8 100 0.6 Tc=50°C δ = 0.5 75 0.4 Tc=75°C 50 25 δ = 0.2 δ = 0.1 Tc=125°C IM t t(s) δ=0.5 0 1E-3 0.2 1E-2 1E-1 1E+0 Fig. 5: Reverse leakage current versus reverse voltage applied (typical values, per diode). T Single pulse tp(s) 0.0 1E-3 δ=tp/T 1E-2 tp 1E-1 1E+0 Fig. 6: Junction capacitance versus reverse voltage applied (typical values, per diode). IR(µA) C(pF) 1E+5 1000 F=1MHz Tj=25°C Tj=175°C 1E+4 Tj=150°C 1E+3 Tj=125°C 1E+2 100 Tj=100°C 1E+1 1E+0 1E-1 Tj=25°C VR(V) VR(V) 0 25 50 75 100 125 150 10 1 2 5 10 20 50 100 200 www.mccsemi.com Revision: 4 2 of 4 2007/07/18 MCC MBR20150CT Micro Commercial Components Fig. 7: Forward voltage drop versus forward current (maximum values, per diode). Fig. 8: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board, copper thickness: 35µm) (STPS20150CG only). IFM(A) Rth(j-a) (°C/W) 100.0 80 70 Tj=125°C Typical values 60 10.0 50 Tj=125°C Tj=25°C 40 30 1.0 20 VFM(V) 0.1 0.0 0.2 0.4 0.6 0.8 1.0 10 1.2 1.4 1.6 0 1.8 S(cm²) 0 2 4 6 8 10 12 14 16 18 20 www.mccsemi.com Revision: 4 3 of 4 2007/07/18 TM MCC TM Micro Commercial Components ***IMPORTANT NOTICE*** Micro Commercial Components Corp . reserves the right to make changes without further notice to any product herein to make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components Corp . does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights ,nor the rights of others . The user of products in such applications shall assume all risks of such use and will agree to hold Micro Commercial Components Corp . and all the companies whose products are represented on our website, harmless against all damages. ***APPLICATIONS DISCLAIMER*** Products offer by Micro Commercial Components Corp . are not intended for use in Medical, Aerospace or Military Applications. www.mccsemi.com Revision: 4 4 of 4 2007/07/18