VICOR BCM384T480T325A00

BCM384 x 480 T 325A00
BCM™
Bus Converter
S
C
FEATURES
• 384 Vdc – 48 Vdc 325 W Bus Converter
• High efficiency (>95%) reduces system power
consumption
• High power density (>1000 W/in3)
reduces power system footprint by >40%
• “Full Chip” V•I Chip package enables surface mount,
low impedance interconnect to system board
• Contains built-in protection features: undervoltage,
overvoltage lockout, overcurrent protection, short
circuit protection, overtemperature protection.
• Provides enable/disable control, internal temperature
monitoring
• ZVS/ZCS Resonant Sine Amplitude Converter topology
• Can be paralleled to create multi-kW arrays
TYPICAL APPLICATIONS
• High End Computing Systems
• Automated Test Equipment
• Telecom Base Stations
• High Density Power Supplies
• Communications Systems
NRTL
US
DESCRIPTION
The V•I Chip™ bus converter is a high efficiency (>95%) Sine
Amplitude Converter™ (SAC™) operating from a 360 to 400
Vdc primary bus to deliver an isolated 45 – 50 V nominal,
unregulated secondary. The SAC offers a low AC impedance
beyond the bandwidth of most downstream regulators,
meaning that input capacitance normally located at the input
of a regulator can be located at the input to the SAC. Since the
K factor of the BCM384F480T325A00 is 1/8, that capacitance
value can be reduced by a factor of 64x, resulting in savings of
board area, materials and total system cost.
The BCM384F480T325A00 is provided in a V•I Chip package
compatible with standard pick-and-place and surface mount
assembly processes. The V•I Chip package provides flexible
thermal management through its low junction-to-case and
junction-to-board thermal resistance. With high conversion
efficiency the BCM384F480T325A00 increases overall system
efficiency and lowers operating costs compared to
conventional approaches.
VIN = 360 – 400 V
POUT = 325 W(NOM)
VOUT = 45 – 50 V (NO LOAD)
K = 1/8
PART NUMBERING
PART NUMBER
PACKAGE STYLE
PRODUCT GRADE
F = J-Lead
BCM384 x 480 T325A00
T = Through hole
T = -40° to 125°C
For Storage and Operating Temperatures see Section 6.0 General Characteristics
TYPICAL APPLICATION
VC
SG
OS
CD
PR
PC
TM
enable / disable
switch
PC
TM
IL
BCM
SW1
VC
PC
TM
PRM
VTM
F1
VIN
C1
+In
+Out
+In
+Out
+In
+Out
-In
-Out
-In
-Out
-In
-Out
1 µF
V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
L
O
A
D
Rev. 1.9
4/2011
Page 1 of 18
v i c o r p o w e r. c o m
PRELIMINARY DATASHEET
BCM384 x 480 T 325A00
ABSOLUTE MAXIMUM RATINGS
CONTROL PIN SPECIFICATIONS
+IN to –IN . . . . . . . . . . . . . . . . . . . . . . . . -1.0 Vdc – +440 Vdc
PC to –IN . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 Vdc – +20 Vdc
TM to –IN . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 Vdc – +7 Vdc
+IN/-IN to +OUT/-OUT . . . . . . . . . . . . . . . . . . . 4242 V (Hi Pot)
+IN/-IN to +OUT/-OUT . . . . . . . . . . . . . . . . . . . 500 V (working)
+OUT to –OUT . . . . . . . . . . . . . . . . . . . . . . -1.0 Vdc - +60 Vdc
Temperature during reflow . . . . . . . . . . . . . . . . 245°C (MSL 6)
See section 5.0 for further application details and guidelines.
PACKAGE ORDERING INFORMATION
4
3
2
+Out
B
B
C
C
D
D
+In
E
E
-Out
1
A
A
F
G
H
TM
PC (BCM™ Primary Control)
The PC pin can enable and disable the BCM™ bus converter.
When held below VPC_DIS the BCM module shall be disabled.
When allowed to float with an impedance to –IN of greater
than 50 kΩ the module will start. When connected to another
bus converter PC pin, the modules will start simultaneously
when enabled. The PC pin is capable of being driven high by
an either external logic signal or internal pull up to 5 V (operating).
TM (BCM™ Temperature Monitor)
The TM pin monitors the internal temperature of the module
within an accuracy of +5/-5°C. It has a room temperature
setpoint of ~3.0 V and an approximate gain of 10 mV/°C. It
can source up to 100 µA and may also be used as a “Power
Good” flag to verify that the bus converter is operating.
H
J
RSV
J
K
PC
K
+Out
-Out
L
L
M
M
N
N
P
P
R
R
-In
T
T
Bottom View
Signal
Name
+In
–In
TM
RSV
PC
+Out
–Out
Designation
A1-E1, A2-E2
L1-T1, L2-T2
H1, H2
J1, J2
K1, K2
A3-D3, A4-D4,
J3-M3, J4-M4
E3-H3, E4-H4,
N3-T3, N4-T4
V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Rev. 1.9
4/2011
Page 2 of 18
v i c o r p o w e r. c o m
PRELIMINARY DATASHEET
BCM384 x 480 T 325A00
1.0 ELECTRICAL CHARACTERISTICS
Specifications apply over all line and load conditions unless otherwise noted; Boldface specifications apply over the
temperature range of -40°C < TJ < 125°C (T-Grade); All other specifications are at TJ = 25ºC unless otherwise noted
ATTRIBUTE
SYMBOL
Voltage range
dV/dt
Quiescent power
VIN
dVIN /dt
PQ
No load power dissipation
PNL
Inrush current peak
IINR_P
DC input current
IIN_DC
K factor
( )
VOUT
CONDITIONS / NOTES
MIN
TYP
MAX
UNIT
360
384
400
1
410
10
13.5
Vdc
V/µs
mW
4
A
1
A
325
300
W
495
W
50
7.05
V
A
PC connected to -IN
VIN = 384 V
VIN = 360 to 400 V
VIN = 400 V COUT = 100 µF,
POUT = 325 W
POUT = 325 W
395
6.5
2
K
VIN
1/8
Efficiency (ambient)
η
Efficiency (hot)
Minimum efficiency
(over load range)
Output resistance (ambient)
Output resistance (hot)
Output resistance (cold)
Load capacitance
Switching frequency
Ripple frequency
η
VIN = 384 VDC; See Figure 14
VIN = 360 – 400 VDC; See Figure 14
VIN = 384 VDC
Average POUT < = 325 W, Tpeak < 5 ms
Section 3.0 No load
Pout < = 325 W
VIN = 384 V, POUT = 325 W
VIN = 360 V to 400 V, POUT = 325 W
VIN = 384 V, TJ = 100° C,POUT = 325 W
η
60 W < POUT < 325 W Max
90
ROUT
ROUT
ROUT
COUT
FSW
FSW_RP
TJ = 25° C
TJ = 125° C
TJ = -40° C
100
150
60
170
235
130
1.66
3.33
Output voltage ripple
VOUT_PP
Output power (average)
POUT
Output power (peak)
POUT_P
Output voltage
Output current (average)
VOUT
IOUT
VIN to VOUT (application of VIN )
TON1
PC
PC voltage (operating)
PC voltage (enable)
PC voltage (disable)
PC source current (start up)
PC source current (operating)
PC internal resistance
PC capacitance (internal)
PC capacitance (external)
External PC resistance
PC external toggle rate
VPC
VPC_EN
VPC_DIS
IPC_EN
IPC_OP
RPC_SNK
CPC_INT
CPC_EXT
RPC
FPC_TOG
PC to VOUT with PC released
PC to VOUT, disable PC
Ton2
TPC_DIS
W
COUT = 0 µF, POUT = 325 W, VIN = 384 V,
Section 8.0
VIN = 384 V, CPC = 0; See Figure 16
Internal pull down resistor
Section 5.0
External capacitance delays PC enable time
Connected to –VIN
VIN = 384 V, pre-applied
CPC = 0, COUT = 0; See Figure 16
VIN = 384 V, pre-applied
CPC = 0, COUT = 0; See Figure 16
45
94.2
94.2
94
95.5
%
95
%
%
1.75
3.5
200
270
180
100
1.83
3.66
mΩ
mΩ
mΩ
uF
MHz
MHz
160
400
mV
460
540
620
ms
4.7
2
5
2.5
50
2
50
100
3.5
150
5.3
3
1.95
300
5
400
1000
1000
1
V
V
V
uA
mA
kΩ
pF
pF
kΩ
Hz
100
150
µs
4
10
µs
50
50
V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Rev. 1.9
4/2011
Page 3 of 18
v i c o r p o w e r. c o m
PRELIMINARY DATASHEET
BCM384 x 480 T 325A00
1.0 ELECTRICAL CHARACTERISTICS (CONT.)
Specifications apply over all line and load conditions unless otherwise noted; Boldface specifications apply over the
temperature range of -40°C < TJ < 125°C (T-Grade); All other specifications are at TJ = 25ºC unless otherwise noted
ATTRIBUTE
SYMBOL
TM
TM accuracy
TM gain
TM source current
TM internal resistance
External TM capacitance
TM voltage ripple
CONDITIONS / NOTES
ACTM
ATM
ITM
RTM_SNK
CTM
VTM_PP
PROTECTION
Negative going OVLO
Positive going OVLO
Negative going UVLO
Positive going UVLO
Output overcurrent trip
Short circuit protection
trip current
Short circuit protection
response time
Thermal shutdown
junction setpoint
VIN_OVLOVIN_OVLO+
VIN_UVLOVIN_UVLO+
IOCP
MIN
TYP
-5
+5
ºC
mV/°C
uA
kΩ
pF
mV
V
V
V
V
A
100
25
40
CTM = 0µF, VIN = 400 V, POUT = 325 W
200
400
50
50
500
VIN = 384 V, 25°C
400
420
270
290
9
420
430
285
310
11
430
440
304
330
14
14
A
1.2
us
130
135
°C
660
500
800
TSCP
Agency approvals /standards
UNIT
10
ISCP
GENERAL SPECIFICATION
Isolation voltage (hi-pot)
Working voltage (IN – OUT)
Isolation capacitance
Isolation resistance
MTBF
MAX
TJ_OTP
125
VHIPOT
VWORKING
CIN_OUT
RIN_OUT
4242
Unpowered unit
MIL HDBK 217F, 25° C, GB
cTUVus
CE Mark
ROHS 6 of 6
500
10
4.2
V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
V
V
pF
MΩ
Mhrs
Rev. 1.9
4/2011
Page 4 of 18
v i c o r p o w e r. c o m
PRELIMINARY DATASHEET
BCM384 x 480 T 325A00
1.1 APPLICATION CHARACTERISTICS
All specifications are at TJ = 25ºC unless otherwise noted. See associated figures for general trend data.
ATTRIBUTE
SYMBOL
No load power
Inrush current peak
Efficiency (ambient)
Efficiency (hot – 100°C)
Output resistance (-40°C)
Output resistance (25°C)
Output resistance (100°C)
Output voltage ripple
PNL
INR_P
η
η
ROUT
ROUT
ROUT
VOUT_PP
VOUT transient (positive)
VOUT_TRAN+
VOUT transient (negative)
VOUT_TRAN-
Undervoltage lockout
response time constant
Output overcurrent
response time constant
Overvoltage lockout
response time constant
TM voltage (ambient)
CONDITIONS / NOTES
TYP
UNIT
VIN = 384 V, PC enabled; See Figure 1
COUT = 100 µF, POUT = 325 W
VIN = 384 V, POUT = 325 W
VIN = 384 V, POUT = 325 W
VIN = 384 V
VIN = 384 V
VIN = 384 V
COUT = 0 uF, POUT = 325 W @ VIN = 384,
VIN = 384 V
IOUT_STEP = 0 TO 7.07 A,
ISLEW >10 A /us; See Figure 11
IOUT_STEP = 7.07 A to 0 A,
ISLEW > 10 A /us; See Figure 12
6.5
2
95.5
95
130
170
235
W
A
%
%
mΩ
mΩ
mΩ
160
mV
1.5
mV
1.5
mV
150
µs
5
ms
120
µs
3
V
TUVLO
TOCP
9 < IOCP < 14 A
TOVLO
VTM_AMB
TJ ≅ 27°C
V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Rev. 1.9
4/2011
Page 5 of 18
v i c o r p o w e r. c o m
BCM384 x 480 T 325A00
PRELIMINARY DATASHEET
No Load Power Dissipation vs Line
Full Load Efficiency vs Temperature
97
12
96.5
Efficiency (%)
10
8
6
4
2
0
96
95.5
95
94.5
355
360
365
370
375
380
385
390
395
400
94
-60
405
Input Voltage
TCASE:
-40
25
100
PD
15
13
70
11
65
60
2
3
4
5
6
360
384
400
384
86
9
84
7
82
0
1
14
PD
12
86
10
84
8
82
6
2
3
4
5
6
7
360
384
400
360
3
4
5
6
7
8
5
384
400
360
384
400
Figure 4 — Efficiency and power dissipation at 25°C (case); VIN
8
240
4
220
200
180
160
140
120
100
-60
-40
-20
0
20
40
60
80
100
120
Temperature (ºC)
Output Load (A)
VIN :
2
360
Rout (mohm)
16
1
1
Output Load (A)
Power Dissipation (W)
Efficiency (%)
η
0
1
PD
Rout vs Case Temperature
18
92
80
15
88
20
88
400
13
Efficiency & Power Dissipation 100ºC Case
90
120
400
98
94
384
90
VIN :
360
360
η
92
80
Figure 3 — Efficiency and power dissipation at -40°C (case); VIN
96
100
17
94
9
8
7
Output Load (A)
VIN :
80
96
Efficiency (%)
17
Power Dissipation (W)
Efficiency (%)
19
1
60
Efficiency & Power Dissipation 25ºC Case
85
0
40
98
21
75
20
Figure 2 — Full load efficiency vs. temperature; VIN
η
80
0
VIN :
Efficiency & Power Dissipation -40°C Case
90
-20
Case Temperature (ºC)
Figure 1 — No load power dissipation vs. VIN ; TCASE
95
-40
Power Dissipation (W)
No Load Power Dissipation (W)
14
384
400
Figure 5 — Efficiency and power dissipation at 100°C (case); VIN
I OUT:
0.7
7.05
Figure 6 — ROUT vs. temperature vs. IOUT
V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Rev. 1.9
4/2011
Page 6 of 18
v i c o r p o w e r. c o m
PRELIMINARY DATASHEET
BCM384 x 480 T 325A00
Output Voltage Ripple at 25ºC vs. Iout
180
Vripple (mV)
160
140
120
100
80
60
40
20
0
0
1
2
3
4
5
6
7
8
Iout (A)
Figure 7 — Vripple vs. IOUT ; 384 VIN , no external capacitance
Figure 8 — PC to VOUT start up waveform
Figure 9 — VIN to VOUT start up waveform
Figure 10 — Output voltage and input current ripple,
384 VIN, 325 W no COUT
Figure 11 — Positive load transient (0 – 7.07 A)
Figure 12 — Negative load transient (7.07 A – 0 A)
V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Rev. 1.9
4/2011
Page 7 of 18
v i c o r p o w e r. c o m
BCM384 x 480 T 325A00
PRELIMINARY DATASHEET
Safe Operating Area
Output Power (W)
600
500
400
300
200
100
0
43.85
44.85
45.85
46.85
47.85
48.85
49.85
50.85
Output Voltage (V)
Steady State
Figure 13 — PC disable waveform, 384 VIN , 100 µF COUT full load
5mS 325W Ave
Figure 14 — Safe Operating Area vs. VOUT
2.0 PACKAGE/MECHANICAL SPECIFICATIONS
All specifications are at TJ = 25ºC unless otherwise noted. See associated figures for general trend data.
ATTRIBUTE
SYMBOL
L
W
H
Vol
F
No heat sink
No heat sink
Power density
PD
No heat sink
Weight
W
Operating temperature
Storage temperature
Thermal capacity
Peak compressive force
applied to case (Z-axis)
TJ
TST
TYP
MAX
UNIT
32.5 / 1.28
22.0 / 0.87
6.73 / 0.265
4.81 / 0.295
7.3 / 1.1
1100
68
0.5/14
32.6 / 1.29
22.3 / 0.89
6.98 / 0.275
mm/in
mm/in
mm/in
cm3/in3
cm2/in2
W/in3
W/cm3
oz/g
µm
-40
-40
125
125
°C
°C
Ws/°C
6
lbs
9
No J-lead support
ESDHBM
ESDMM
ESD rating
Peak temperature during reflow
Peak time above 183°C
Peak heating rate during reflow
Peak cooling rate post reflow
Thermal impedance
[b]
MIN
32.4 / 1.27
21.7 / 0.85
6.48 / 0.255
Nickel (0.51-2.03 µm)
Palladium (0.02-0.15 µm)
Gold (0.003-0.05 µm)
Lead finish
[a]
CONDITIONS / NOTES
Length
Width
Height
Volume
Footprint
ØJC
Human Body Model
Machine Model[b]
MSL 5
MSL 6
5
[a]
Min board heat sinking
1500
400
VDC
1.5
1.5
1.1
225
245
150
3
6
1.5
°C
°C
s
°C/s
°C/s
°CW
JEDEC JESD 22-A114C.01
JEDED JESD 22-A115-A
V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Rev. 1.9
4/2011
Page 8 of 18
v i c o r p o w e r. c o m
BCM384 x 480 T 325A00
PRELIMINARY DATASHEET
2.1 J-LEAD PACKAGE MECHANICAL DRAWING & RECOMMENDED LAND PATTERN
TOP VIEW ( COMPONENT SIDE )
BOTTOM VIEW
RECOMMENDED LAND PATTERN
( COMPONENT SIDE SH OWN )
NOTES:
mm
2. DIMENSIONS ARE inch .
UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
3. .X / [.XX] = +/-0.25 / [.01]; .XX / [.XXX] = +/-0.13 / [.005]
4. PRODUCT MARKING ON TOP SURFACE
DXF and PDF files are available on vicorpower.com
V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Rev. 1.9
4/2011
Page 9 of 18
v i c o r p o w e r. c o m
PRELIMINARY DATASHEET
2.2.1 THROUGH-HOLE PACKAGE MECHANICAL DRAWING
BCM384 x 480 T 325A00
Click here to view original mechanical drawings on the Vicor website.
mm
(inch)
TOP VIEW ( COMPONENT SIDE )
NOTES:
BOTTOM VIEW
(mm)
1. DIMENSIONS ARE inch .
2. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE:
X.X [X.XX] = ±0.25 [0.01]; X.XX [X.XXX] = ±0.13 [0.005]
3. RoHS COMPLIANT PER CST-0001 LATEST REVISION
DXF and PDF files are available on vicorpower.com
2.2.2 THROUGH-HOLE PACKAGE RECOMMENDED LAND PATTERN
NOTES:
(mm)
1. DIMENSIONS ARE inch .
2. UNLESS OTHERWISE SPECIFIED TOLERANCES ARE:
X.X [X.XX] = ±0.25 [0.01]; X.XX [X.XXX] = ±0.13 [0.005]
RECOMMENDED HOLE PATTERN
( COMPONENT SIDE SHOWN )
3. RoHS COMPLIANT PER CST-0001 LATEST REVISION
DXF and PDF files are available on vicorpower.com
V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Rev. 1.9
4/2011
Page 10 of 18
v i c o r p o w e r. c o m
PRELIMINARY DATASHEET
BCM384 x 480 T 325A00
2.3 RECOMMENDED HEAT SINK PUSH PIN LOCATION
RECOMMENDED LAND PATTERN
(NO GROUNDING CLIPS)
TOP SIDE SHOWN
NOTES:
1. MAINTAIN 3.50 [0.138] DIA. KEEP-OUT ZONE
FREE OF COPPER, ALL PCB LAYERS.
2. (A) MINIMUM RECOMMENDED PITCH IS 39.50 [1.555],
THIS PROVIDES 7.00 [0.275] COMPONENT
EDGE-TO-EDGE SPACING, AND 0.50 [0.020]
CLEARANCE BETWEEN VICOR HEAT SINKS.
(B) MINIMUM RECOMMENDED PITCH IS 41.00 [1.614],
THIS PROVIDES 8.50 [0.334] COMPONENT
EDGE-TO-EDGE SPACING, AND 2.00 [0.079]
CLEARANCE BETWEEN VICOR HEAT SINKS.
RECOMMENDED LAND PATTERN
(With GROUNDING CLIPS)
3. V•I CHIP™ MODULE LAND PATTERN SHOWN FOR REFERENCE ONLY;
ACTUAL LAND PATTERN MAY DIFFER.
DIMENSIONS FROM EDGES OF LAND PATTERN
TO PUSH-PIN HOLES WILL BE THE SAME FOR
ALL FULL SIZE V•ICHIP PRODUCTS.
TOP SIDE SHOWN
4. RoHS COMPLIANT PER CST-0001 LATEST REVISION.
5. UNLESS OTHERWISE SPECIFIED:
DIMENSIONS ARE MM [INCH].
TOLERANCES ARE:
X.X [X.XX] = ±0.3 [0.01]
X.XX [X.XXX] = ±0.13 [0.005]
6. PLATED THROUGH HOLES FOR GROUNDING CLIPS (33855)
SHOWN FOR REFERENCE. HEAT SINK ORIENTATION AND
DEVICE PITCH WILL DICTATE FINAL GROUNDING SOLUTION.
V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Rev. 1.9
4/2011
Page 11 of 18
v i c o r p o w e r. c o m
BCM384 x 480 T 325A00
PRELIMINARY DATASHEET
3.0 POWER, VOLTAGE, EFFICIENCY RELATIONSHIPS
Because of the high frequency, fully resonant SAC topology,
power dissipation and overall conversion efficiency of bus
converters can be estimated as shown below.
OUTPUT
POWER
INPUT
POWER
Key relationships to be considered are the following:
1. Transfer Function
P R OUT
a. No load condition
P NL
VOUT = VIN • K
Eq. 1
Figure 15 — Power transfer diagram
Where K (transformer turns ratio) is constant
for each part number
b. Loaded condition
VOUT = Vin • K – IOUT • ROUT
Eq. 2
2. Dissipated Power
The two main terms of power losses in the
BCM™ bus converter are:
- No load power dissipation (PNL) defined as the power
used to power up the module with an enabled power
train at no load.
- Resistive loss (ROUT) refers to the power loss across
the bus converter modeled as pure resistive impedance.
~ PNL + PR
PDISSIPATED ~
OUT
Eq. 3
Therefore, with reference to the diagram shown in Figure 15
POUT = PIN – PDISSIPATED = PIN – PNL – PROUT
Eq. 4
Notice that ROUT is temperature and input voltage dependent
and PNL is temperature dependent (See Figure 15).
The above relations can be combined to calculate the overall module efficiency:
η =
POUT
PIN
=
PIN – PNL – PROUT
PIN
=
VIN • IIN – PNL – (IOUT)2 • ROUT
VIN • IIN
=1–
(
PNL + (IOUT)2 • ROUT
VIN • IIN
V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
)
Eq. 5
Rev. 1.9
4/2011
Page 12 of 18
v i c o r p o w e r. c o m
v i c o r p o w e r. c o m
NL
5V
2.5 V
5V
3V
PC
VUVLO+
VUVLO–
V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
1
A
E: TON2
F: TOCP
G: TPC–DIS
H: TSSP**
B
D
1: Controller start
2: Controller turn off
3: PC release
C
*Min value switching off
**From detection of error to power train shutdown
A: TON1
B: TOVLO*
C: Max recovery time
D:TUVLO
0.4 V
3 V @ 27°C
TM
LL • K
Vout
C
500mS
before retrial
3V
VIN
VOVLO+
VOVLO–
2
F
4: PC pulled low
5: PC released on output SC
6: SC removed
IOCP
ISSP
IOUT
E
3
G
4
Notes:
H
5
– Timing and voltage is not to scale
– Error pulse width is load dependent
6
PRELIMINARY DATASHEET
BCM384 x 480 T 325A00
4.0 OPERATING
Figure 16 — Timing diagram
Rev. 1.9
4/2011
Page 13 of 18
PRELIMINARY DATASHEET
5.0 USING THE CONTROL SIGNALS TM AND PC
The PC control pin can be used to accomplish the following
functions:
• Delayed start: At startup, PC pin will source a constant
100 uA current to the internal RC network. Adding an
external capacitor will allow further delay in reaching the
2.5 V threshold for module start.
• Synchronized start up: In a parallel module array, PC pins
shall be connected in order to ensure synchronous start of all
the units. While every controller has a calibrated 2.5 V
reference on PC comparator, many factors might cause
different timing in turning on the 100 uA current source on
each module, i.e.:
– Different VIN slew rate
– Statistical component value distribution
By connecting all PC pins, the charging transient will be
shared and all the modules will be enabled synchronously.
• Auxiliary voltage source: Once enabled in regular
operational conditions (no fault), each BCM™ bus converter
PC provides a regulated 5 V, 2 mA voltage source.
• Output Disable: PC pin can be actively pulled down in order
to disable module operations. Pull down impedance shall be
lower than 400 Ω and toggle rate lower than 1 Hz.
• Fault detection flag: The PC 5 V voltage source is internally
turned off as soon as a fault is detected. After a minimum
disable time, the module tries to re-start, and PC voltage is
re-enabled. For system monitoring purposes (microcontroller
interface) faults are detected on falling edges of PC signal.
It is important to notice that PC doesn’t have current sink
capability (only 150 kΩ typical pull down is present),
therefore, in an array, PC line will not be capable of disabling
all the modules if a fault occurs on one of them.
BCM384 x 480 T 325A00
6.0 FUSE SELECTION
V•I Chip™ products are not internally fused in order to provide
flexibility in configuring power systems. Input line fusing of
V•I Chip modules is recommended at system level, in order to
provide thermal protection in case of catastrophic failure.
The fuse shall be selected by closely matching system
requirements with the following characteristics:
• Current rating
(usually greater than maximum bus converter current)
• Maximum voltage rating
(usually greater than the maximum possible input voltage)
• Ambient temperature
• Nominal melting I2t
• Recommended fuse: ≤2.5 A Bussmann PC-Tron or
SOC type 36CFA.
The temperature monitor (TM) pin provides a voltage proportional to the absolute temperature of the converter control IC.
It can be used to accomplish the following functions:
• Monitor the control IC temperature: The temperature in
Kelvin is equal to the voltage on the TM pin scaled
by x100. (i.e. 3.0 V = 300 K = 27ºC). It is important to
remember that V•I Chip™ products are multi-chip modules,
whose temperature distribution greatly vary for each part
number as well with input/output conditions, thermal
management and environmental conditions. Therefore, TM
cannot be used to thermally protect the system.
• Fault detection flag: The TM voltage source is internally
turned off as soon as a fault is detected. After a minimum
disable time, the module tries to re-start, and TM voltage is
re-enabled.
V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Rev. 1.9
4/2011
Page 14 of 18
v i c o r p o w e r. c o m
PRELIMINARY DATASHEET
BCM384 x 480 T 325A00
7.0 CURRENT SHARING
The SAC topology bases its performance on efficient transfer
of energy through a transformer, without the need of closed
loop control. For this reason, the transfer characteristic can be
approximated by an ideal transformer with some resistive drop
and positive temperature coefficient.
This type of characteristic is close to the impedance characteristic
of a DC power distribution system, both in behavior
(AC dynamic) and absolute value (DC dynamic).
When connected in an array (with same K factor), the BCM™
module will inherently share the load current with parallel
units, according to the equivalent impedance divider that the
system implements from the power source to the point of load.
It is important to notice that, when successfully started,
BCM™ bus converter modules are capable of bidirectional
operations (reverse power transfer is enabled if the module
input falls within its operating range and the bus conveter is
otherwise enabled). In parallel arrays, because of the resistive
behavior, circulating currents are never experienced (energy
conservation law).
General recommendations to achieve matched array impedances
are (see also AN016 for further details):
• to dedicate common copper planes within the PCB to
deliver and return the current to the modules
• to make the PCB layout as symmetric as possible
• to apply same input/output filters (if present) to each unit
Figure 17 — BCM™ module array
V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Rev. 1.9
4/2011
Page 15 of 18
v i c o r p o w e r. c o m
PRELIMINARY DATASHEET
BCM384 x 480 T 325A00
8.0 INPUT AND OUTPUT FILTER DESIGN
A major advantage of SAC™ systems versus conventional
PWM converters is that the transformers do not require large
functional filters. The resonant LC tank, operated at extreme
high frequency, is amplitude modulated as a function of input
voltage and output current, and efficiently transfers charge
through the isolation transformer. A small amount of
capacitance, embedded in the input and output stages of the
module, is sufficient for full functionality and is key to achieve
power density.
This paradigm shift requires system design to carefully evaluate
external filters in order to:
1.Guarantee low source impedance:
To take full advantage of the BCM™ bus conveter dynamic
response, the impedance presented to its input terminals
must be low from DC to approximately 5 MHz. The
connection of the module to its power source should be
implemented with minimal distribution inductance. If the
interconnect inductance exceeds 100 nH, the input should
be bypassed with a RC damper to retain low source
impedance and stable operation. With an interconnect
inductance of 200 nH, the RC damper may be as high as
1 µF in series with 0.3 Ω. A single electrolytic or equivalent
low-Q capacitor may be used in place of the series RC
bypass.
Total load capacitance at the output of the bus converter shall
not exceed the specified maximum. Owing to the wide
bandwidth and low output impedance of the module, low
frequency bypass capacitance and significant energy storage
may be more densely and efficiently provided by adding
capacitance at the input of the module. At frequencies <500
kHz the module appears as an impedance of ROUT between the
source and load.
Within this frequency range capacitance at the input appears
as effective capacitance on the output per the relationship
defined in Eq. 5.
COUT =
CIN
K2
Eq. 6
This enables a reduction in the size and number of capacitors
used in a typical system.
2.Further reduce input and/or output voltage ripple without
sacrificing dynamic response:
Given the wide bandwidth of the bus converter, the source
response is generally the limiting factor in the overall
system response. Anomalies in the response of the source
will appear at the output of the module multiplied by its
K factor. This is illustrated in Figures 11 and 12.
3.Protect the module from overvoltage transients imposed
by the system that would exceed maximum ratings and
cause failures:
The V•I Chip™ module input/output voltage ranges shall
not be exceeded. An internal overvoltage lockout function
prevents operation outside of the normal operating input
range. Even during this condition, the powertrain is exposed
to the applied voltage and power MOSFETs must withstand
it. A criterion for protection is the maximum amount of
energy that the input or output switches can tolerate if
avalanched.
V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Rev. 1.9
4/2011
Page 16 of 18
v i c o r p o w e r. c o m
v i c o r p o w e r. c o m
PC
-VIN
+VIN
1000 pF
2.5 V
100 µA
2.5 V
150 K
1.5 k
PC Pull-Up
& Source
18.5 V
2 mA
5V
320/540 ms
One shot
delay
Wake-Up Power
and Logic
Adaptive
Soft
Start
UVLO
OVLO
VIN
Gate
Drive
Supply
Start up &
Fault Logic
Enable
Modulator
Primary
Current Sensing
Primary
Gate Drive
Lr
Cr
C4
C3
Cr
2.50 V
CS2
Q4
Q3
Q2
Q1
Over
Temperature
Protection
Lr
Primary Stage &
C2 Resonant Tank
C1
Lp2
Vref
Secondary
Gate Drive
Over-Current
Protection
Temperature
dependent voltage
source
Slow
current
limit
Fast
current
limit
Ls2
Ls1
Power
Transformer
Vref
(125ºC)
Lp1
Q5
Synchronous
Rectification
40 K
Q6
TM
COUT
-VOUT
+VOUT
PRELIMINARY DATASHEET
BCM384 x 480 T 325A00
Figure 18 – BCM™ module block diagram
V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Rev. 1.9
4/2011
Page 17 of 18
PRELIMINARY DATASHEET
BCM384 x 480 T 325A00
Warranty
Vicor products are guaranteed for two years from date of shipment against defects in material or workmanship when in
normal use and service. This warranty does not extend to products subjected to misuse, accident, or improper application or maintenance. Vicor shall not be liable for collateral or consequential damage. This warranty is extended to the
original purchaser only.
EXCEPT FOR THE FOREGOING EXPRESS WARRANTY, VICOR MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING,
BUT NOT LIMITED TO, THE WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
Vicor will repair or replace defective products in accordance with its own best judgement. For service under this warranty, the buyer must contact Vicor to obtain a Return Material Authorization (RMA) number and shipping instructions.
Products returned without prior authorization will be returned to the buyer. The buyer will pay all charges incurred in returning the product to the factory. Vicor will pay all reshipment charges if the product was defective within the terms of
this warranty.
Information published by Vicor has been carefully checked and is believed to be accurate; however, no responsibility is
assumed for inaccuracies. Vicor reserves the right to make changes to any products without further notice to improve
reliability, function, or design. Vicor does not assume any liability arising out of the application or use of any product or
circuit; neither does it convey any license under its patent rights nor the rights of others. Vicor general policy does not
recommend the use of its components in life support applications wherein a failure or malfunction may directly threaten
life or injury. Per Vicor Terms and Conditions of Sale, the user of Vicor components in life support applications assumes
all risks of such use and indemnifies Vicor against all damages.
Vicor’s comprehensive line of power solutions includes high density AC-DC
and DC-DC modules and accessory components, fully configurable AC-DC
and DC-DC power supplies, and complete custom power systems.
Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for
its use. Vicor components are not designed to be used in applications, such as life support systems, wherein a failure or
malfunction could result in injury or death. All sales are subject to Vicor’s Terms and Conditions of Sale, which are
available upon request.
Specifications are subject to change without notice.
Intellectual Property Notice
Vicor and its subsidiaries own Intellectual Property (including issued U.S. and Foreign Patents and pending patent
applications) relating to the products described in this data sheet. Interested parties should contact Vicor's Intellectual Property Department.
The products described on this data sheet are protected by the following U.S. Patents Numbers:
5,945,130; 6,403,009; 6,710,257; 6,911,848; 6,930,893; 6,934,166; 6,940,013; 6,969,909; 7,038,917;
7,166,898; 7,187,263; 7,361,844; D496,906; D505,114; D506,438; D509,472; and for use under 6,975,098
and 6,984,965
Vicor Corporation
25 Frontage Road
Andover, MA, USA 01810
Tel: 800-735-6200
Fax: 978-475-6715
email
Customer Service: [email protected]
Technical Support: [email protected]
V•I CHIP CORP. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Rev. 1.9
4/2011
Page 18 of 18
v i c o r p o w e r. c o m