VICOR 16808

4
PCB Layout Drawing
for Mini Size Module
PIN LEGEND
SOLDER MASK KEEP-OUT AREA
EXCEPT ON PADS
0.254
Mini
0.131
0.027
0.050
TYP
0.115
0.328
0.050
TYP
1
2
3
4
5
6
7
8
9
+
PC
PR
–
–
–S
SC
+S
+
Ø 0.016 NON PLATED THRU
7 PL
0.102
0.265
Symbol
7 x Ø 0.233
FREE OF SOLDER MASK
0.230
0.027
Pin
Number
0.138
0.467
0.266
0.340
0.313
2.096
53,24
w
38°
FARM
Function
Symbol
SEE DETAIL A
w
0.027
w
Ø 0.032 ± 0.003
16 VIA HOLES
SURFMATE INPUT
CONNECTOR
0.250
6,36
.
v
i
(MIRROR IMAGE TO OTHER SIDE)
ALL DIMENSIONS IN INCHES
1.900
48,26
c
r
0.230
TYP
0.226
.
0.034
0.115
0.065
0.063
1,59
0.027
c
o
0.202
0.069
6
7
8
0.300
7,62
m
0.277
7 x Ø 0.016
0.050
TYP
0.400
10,16
0.700
17,78
SEE DETAIL B
1.000
25,4
0.027
0.050
TYP
0.034
SOLDER MASK KEEP-OUT AREA
EXCEPT ON PADS
0.159
0.318
DETAIL B
2 x Ø 0.316
FREE OF SOLDER MASK
4
3
2
5
1.98
50,3
6 7 8
1
0.265
6,73
2.430
61,72
PCB
MODULE
EXCHANGE
TOOLBOTH ENDS
(PARTIAL)
0.06
1,6
9
0.536
13,61
0.350
0.340
4 x ø 0.130 ± 0.003
3,30 ± 0,08
PLATED THRU HOLE
FOR STANDOFF MTG
9
2 x 0.125 ± 0.002
3,18 ± 0,05
0.266
0.440
11,18
MODULE
Ø 0.032 ± 0.003
3 VIA HOLES
0.065
0.604
1
6 x ø0.064 ± 0.003
1,63 ±0,08
(#52 DRILL)
5
0.152
55°
2
1.600
40,64
Ø 0.032 ± 0.003
29 VIA HOLES
0.027
3
Line
– Out
Enable
Strap
BUS OK
+ OUT
0.300
7,62
0.536
13,61
4
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.150 / 3,81
0.080 / 2,03
0.080 / 2,03
0.080 / 2,03
0.150 / 3,81
0.56
MAX
0.063
1,59
DETAIL A
Pin Dia.
(Inches / mm)
Neutral
EMI
2.000
50,8
PCB
0.027
0.069
Ø 0.032 ± 0.003
3 VIA HOLES
0.065
0.027
Function
+IN
N
Prim. Control EMI GRD
Parallel
NC
–IN
L
–OUT
–
– Sense
EN
Sec. Control
ST
+Sense
BOK
+Out
+
0.097
2,47
0.80
20,3
0.251
6,36
0.491
12,47
0.250
6,35
1.400
35,56
1.900 ± 0.002
48,26 ± 0,05
MODULE
EXCHANGE
TOOL
3
1
2
0.80 ± 0.03
20,3 ± 0,8
0.15
3,8
EXCHANGE TOOL
HOOK AREA, 4 PLCS
(BOTH ENDS-SEE VIEWS)
0.38
9,5
PCB
15°
1.25
31,6
SURFMATE OUTPUT
CONNECTOR
0.006
REF
0,15
PCB MOUNTING SPECIFICATIONS
(ALSO SEE EXCHANGE TOOL DETAILS IN RIGHT VIEWS)
(MIRROR IMAGE TO OTHER SIDE)
ALL DIMENSIONS IN INCHES
All dimensions are Inch or Inch / Metric
ANSI / IPC-D-300 specifications apply for Class “B” boards.
Recommended PCB construction:
Multilayer 3oz Cu with internal power and ground planes. Pad geometry and minimum number
of via holes for connection to power and ground planes shown in Details “A” & “B” for high
current applications. Pads to be covered with solder mask except in circular area shown in
Detail “A” & “B”. Final pad height above laminate to be 0.004" +/- 0.0004".
Light gray area denotes stencil aperture (should include circular solder mask keep-out area on each pad).
MODULE
BASEPLATE
BOTTOM OF
CAP TO TOP
OF PCB
DETAIL C
PRODUCT APPLICATION SPECIFICATIONS