STMICROELECTRONICS M48Z35AV

M48Z35AV
5.0V or 3.3V, 256Kbit (32Kbit x 8) ZEROPOWER® SRAM
Features
■
Integrated, ultra low power SRAM, power-fail
control circuit, and battery
■
READ cycle time equals WRITE cycle time
■
Battery low flag (BOK)
■
Automatic power-fail chip deselect and WRITE
protection
■
WRITE protect voltage:
(VPFD = Power-fail deselect voltage)
– M48Z35AV: 2.7V ≤ VPFD ≤ 3.0V
■
Self-contained battery in the CAPHAT™ DIP
package
■
Packaging includes a 28-lead SOIC and
SNAPHAT® top (to be ordered separately)
■
Pin and function compatible with JEDEC
standard 32Kbit x 8 SRAMs
■
SOIC package provides direct connection for a
SNAPHAT top which contains the battery
■
28
1
PCDIP28 (PC)
Battery CAPHAT
SNAPHAT (SH)
battery
28
1
RoHS compliant
–
Lead-free second level interconnect
November 2007
SOH28 (MH)
Rev 6
1/24
www.st.com
1
Contents
M48Z35AV
Contents
1
Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1
Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2
Write mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.3
Data retention mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2.4
VCC noise and negative going transients . . . . . . . . . . . . . . . . . . . . . . . . . 13
3
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4
DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
6
Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2/24
M48Z35AV
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Table 11.
Table 12.
Table 13.
Table 14.
Table 15.
Table 16.
Table 17.
Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Read mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Write mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Operating and AC measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Power down/up AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Power down/up trip points DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
PMDIP28 – 28-pin plastic DIP, battery CAPHAT™, pack. mech. data. . . . . . . . . . . . . . . . 18
SOH28 – 28-lead plastic small outline, battery SNAPHAT, pack. mech. data . . . . . . . . . . 19
SH – 4-pin SNAPHAT housing for 48mAh battery, pack. mech. data . . . . . . . . . . . . . . . . 20
SH – 4-pin SNAPHAT housing for 120 mAh battery, pack. mech. data . . . . . . . . . . . . . . . 21
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
SNAPHAT battery table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3/24
List of figures
M48Z35AV
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
4/24
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
DIP connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
SOIC connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Read mode AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Write enable controlled, write mode AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Chip enable controlled, write mode AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
BOK check routine example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Supply voltage protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
AC measurement load circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Power down/up mode AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
PCDIP28 – 28-pin plastic DIP, battery CAPHAT™, package outline . . . . . . . . . . . . . . . . . 18
SOH28 – 28-lead plastic small outline, battery SNAPHAT, package outline . . . . . . . . . . . 19
SH – 4-pin SNAPHAT housing for 48mAh battery, package outline. . . . . . . . . . . . . . . . . . 20
SH – 4-pin SNAPHAT housing for 120mAh battery, package outline. . . . . . . . . . . . . . . . . 21
M48Z35AV
1
Summary
Summary
The M48Z35AV ZEROPOWER® RAM is a 32Kbit x 8, non-volatile static RAM that integrates
power-fail deselect circuitry and battery control logic on a single die. The monolithic chip is
available in two special packages to provide a highly integrated battery backed-up memory
solution.
The M48Z35AV is a non-volatile pin and function equivalent to any JEDEC standard 32K x8
SRAM. It also easily fits into many ROM, EPROM, and EEPROM sockets, providing the
non-volatility of PROMs without any requirement for special WRITE timing or limitations on
the number of WRITEs that can be performed. The 28 pin 600mil DIP CAPHAT™ houses
the M48Z35AV silicon with a long life lithium button cell in a single package.
The 28-pin, 330mil SOIC provides sockets with gold plated contacts at both ends for direct
connection to a separate SNAPHAT® housing containing the battery. The unique design
allows the SNAPHAT battery package to be mounted on top of the SOIC package after the
completion of the surface mount process. Insertion of the SNAPHAT housing after reflow
prevents potential battery damage due to the high temperatures required for device surfacemounting. The SNAPHAT housing is keyed to prevent reverse insertion.
The SOIC and battery packages are shipped separately in plastic anti-static tubes or in Tape
& Reel form.
For the 28-lead SOIC, the battery package (e.g., SNAPHAT) part number is “M4Z28BR00SH1.”
Figure 1.
Logic diagram
VCC
15
8
A0-A14
W
DQ0-DQ7
M48Z35AV
E
G
VSS
AI02781B
5/24
Summary
M48Z35AV
Table 1.
Signal names
A0-A14
Address inputs
DQ0-DQ7
Figure 2.
Data inputs / outputs
E
Chip enable input
G
Output enable input
W
WRITE enable input
VCC
Supply voltage
VSS
Ground
DIP connections
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
1
2
3
4
5
6
7
M48Z35AV
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VCC
W
A13
A8
A9
A11
G
A10
E
DQ7
DQ6
DQ5
DQ4
DQ3
AI02782B
Figure 3.
SOIC connections
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
DQ0
DQ1
DQ2
VSS
1
2
3
4
5
6
7
M48Z35AV
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
AI02783
6/24
VCC
W
A13
A8
A9
A11
G
A10
E
DQ7
DQ6
DQ5
DQ4
DQ3
M48Z35AV
Figure 4.
Summary
Block diagram
A0-A14
LITHIUM
CELL
POWER
VOLTAGE SENSE
AND
SWITCHING
CIRCUITRY
32K x 8
SRAM ARRAY
DQ0-DQ7
E
VPFD
W
G
VCC
VSS
AI01619B
7/24
Operating modes
2
M48Z35AV
Operating modes
The M48Z35AV also has its own Power-fail Detect circuit. The control circuitry constantly
monitors the single power supply for an out of tolerance condition. When VCC is out of
tolerance, the circuit write protects the SRAM, providing a high degree of data security in the
midst of unpredictable system operation brought on by low VCC. As VCC falls below
approximately VSO, the control circuitry connects the battery which maintains data until valid
power returns.
Table 2.
Operating modes
Mode
VCC
Deselect
WRITE
READ
3.0 to 3.6V
READ
Deselect
VSO to VPFD
Deselect
(min)(1)
≤ VSO(1)
E
G
W
DQ0-DQ7
Power
VIH
X
X
High Z
Standby
VIL
X
VIL
DIN
Active
VIL
VIL
VIH
DOUT
Active
VIL
VIH
VIH
High Z
Active
X
X
X
High Z
CMOS standby
X
X
X
High Z
Battery back-up
mode
1. See Table 10 on page 17 for details.
Note:
X = VIH or VIL; VSO = Battery back-up switchover voltage.
2.1
Read mode
The M48Z35AV is in the READ Mode whenever W (WRITE Enable) is high, E (Chip Enable)
is low. The device architecture allows ripple-through access of data from eight of 264,144
locations in the static storage array. Thus, the unique address specified by the 15 Address
Inputs defines which one of the 32,768 bytes of data is to be accessed. Valid data will be
available at the Data I/O pins within Address Access time (tAVQV) after the last address input
signal is stable, providing that the E and G access times are also satisfied. If the E and G
access times are not met, valid data will be available after the latter of the Chip Enable
Access time (tELQV) or Output Enable Access time (tGLQV).
The state of the eight three-state Data I/O signals is controlled by E and G. If the outputs are
activated before tAVQV, the data lines will be driven to an indeterminate state until tAVQV. If
the Address Inputs are changed while E and G remain active, output data will remain valid
for Output Data Hold time (tAXQX) but will go indeterminate until the next Address Access.
8/24
M48Z35AV
Figure 5.
Operating modes
Read mode AC waveforms
tAVAV
VALID
A0-A14
tAVQV
tAXQX
tELQV
tEHQZ
E
tELQX
tGLQV
tGHQZ
G
tGLQX
DQ0-DQ7
VALID
AI00925
Note:
WRITE enable (W) = High.
Table 3.
Read mode AC characteristics
M48Z35AV
Parameter(1)
Symbol
–100
Min
Unit
Max
tAVAV
READ cycle time
tAVQV
Address valid to output valid
100
ns
tELQV
Chip enable low to output valid
100
ns
tGLQV
Output enable low to output valid
50
ns
(2)
100
ns
Chip enable low to output transition
10
ns
tGLQX(2)
tEHQZ(2)
tGHQZ(2)
Output enable low to output transition
5
ns
tAXQX
Address transition to output transition
tELQX
Chip enable high to output Hi-Z
50
ns
Output enable high to output Hi-Z
40
ns
10
ns
1. Valid for ambient operating temperature: TA = 0 to 70°C; VCC = 3.0 to 3.6V (except where noted).
2. CL = 5pF (see Figure 10 on page 15).
2.2
Write mode
The M48Z35AV is in the WRITE Mode whenever W and E are low. The start of a WRITE is
referenced from the latter occurring falling edge of W or E. A WRITE is terminated by the
earlier rising edge of W or E. The addresses must be held valid throughout the cycle. E or W
must return high for a minimum of tEHAX from Chip Enable or tWHAX from WRITE Enable
prior to the initiation of another READ or WRITE cycle. Data-in must be valid tDVWH prior to
the end of WRITE and remain valid for tWHDX afterward. G should be kept high during
9/24
Operating modes
M48Z35AV
WRITE cycles to avoid bus contention; although, if the output bus has been activated by a
low on E and G, a low on W will disable the outputs tWLQZ after W falls.
Figure 6.
Write enable controlled, write mode AC waveforms
tAVAV
A0-A14
VALID
tAVWH
tWHAX
tAVEL
E
tWLWH
tAVWL
W
tWLQZ
tWHQX
tWHDX
DQ0-DQ7
DATA INPUT
tDVWH
AI00926
Figure 7.
Chip enable controlled, write mode AC waveforms
tAVAV
VALID
A0-A14
tAVEH
tAVEL
tELEH
tEHAX
E
tAVWL
W
tEHDX
DQ0-DQ7
DATA INPUT
tDVEH
AI00927
10/24
M48Z35AV
Operating modes
Table 4.
Write mode AC characteristics
M48Z35AV
Parameter(1)
Symbol
–100
Min
tAVAV
WRITE cycle time
tAVWL
Unit
Max
100
ns
Address valid to WRITE enable low
0
ns
tAVEL
Address valid to chip enable low
0
ns
tWLWH
WRITE enable pulse width
80
ns
tELEH
Chip enable low to chip enable high
80
ns
tWHAX
WRITE enable high to address transition
10
ns
tEHAX
Chip enable high to address transition
10
ns
tDVWH
Input valid to WRITE enable high
50
ns
tDVEH
Input valid to chip enable high
50
ns
tWHDX
WRITE enable high to input transition
5
ns
tEHDX
Chip enable high to input transition
5
ns
tWLQZ
(2)(3)
WRITE enable low to output Hi-Z
50
ns
tAVWH
Address valid to WRITE enable high
80
ns
tAVEH
Address valid to chip enable high
80
ns
WRITE enable high to output transition
10
ns
tWHQX(2)(3)
1. Valid for ambient operating temperature: TA = 0 to 70°C; VCC = 3.0 to 3.6V (except where noted).
2. CL = 5pF (see Figure 10 on page 15).
3. If E goes low simultaneously with W going low, the outputs remain in the high impedance state.
2.3
Data retention mode
With valid VCC applied, the M48Z35AV operates as a conventional BYTEWIDE™ static
RAM. Should the supply voltage decay, the RAM will automatically power-fail deselect, write
protecting itself when VCC falls within the VPFD (max), VPFD (min) window. All outputs
become high impedance, and all inputs are treated as “Don't care.”
Note:
A power failure during a WRITE cycle may corrupt data at the currently addressed location,
but does not jeopardize the rest of the RAM's content. At voltages below VPFD(min), the
user can be assured the memory will be in a write protected state, provided the VCC fall time
is not less than tF. The M48Z35AV may respond to transient noise spikes on VCC that reach
into the deselect window during the time the device is sampling VCC. Therefore, decoupling
of the power supply lines is recommended.
When VCC drops below VSO, the control circuit switches power to the internal battery which
preserves data. The internal button cell will maintain data in the M48Z35AV for an
accumulated period of at least 10 years (at 25°C) when VCC is less than VSO.
As system power returns and VCC rises above VSO, the battery is disconnected, and the
power supply is switched to external VCC. Write protection continues until VCC reaches
VPFD(min) plus tREC(min). Normal RAM operation can resume tREC after VCC exceeds
VPFD(max).
11/24
Operating modes
M48Z35AV
Also, as VCC rises, the battery voltage is checked. If the voltage is less than approximately
2.5V, an internal Battery Not OK (BOK) flag will be set. The BOK flag can be checked after
power up. If the BOK flag is set, the first WRITE attempted will be blocked. The flag is
automatically cleared after the first WRITE, and normal RAM operation resumes. Figure 8
illustrates how a BOK check routine could be structured.
For more information on Battery Storage Life refer to the Application Note AN1012.
Figure 8.
BOK check routine example
POWER-UP
READ DATA
AT ANY ADDRESS
WRITE DATA
COMPLEMENT BACK
TO SAME ADDRESS
READ DATA
AT SAME
ADDRESS AGAIN
IS DATA
COMPLEMENT
OF FIRST
READ?
(BATTERY OK)
YES
NO (BATTERY LOW)
NOTIFY SYSTEM
OF LOW BATTERY
(DATA MAY BE
CORRUPTED)
WRITE ORIGINAL
DATA BACK TO
SAME ADDRESS
CONTINUE
AI00607
12/24
M48Z35AV
2.4
Operating modes
VCC noise and negative going transients
ICC transients, including those produced by output switching, can produce voltage
fluctuations, resulting in spikes on the VCC bus. These transients can be reduced if
capacitors are used to store energy which stabilizes the VCC bus. The energy stored in the
bypass capacitors will be released as low going spikes are generated or energy will be
absorbed when overshoots occur. A ceramic bypass capacitor value of 0.1µF (see Figure 9)
is recommended in order to provide the needed filtering.
In addition to transients that are caused by normal SRAM operation, power cycling can
generate negative voltage spikes on VCC that drive it to values below VSS by as much as
one volt. These negative spikes can cause data corruption in the SRAM while in battery
backup mode. To protect from these voltage spikes, ST recommends connecting a schottky
diode from VCC to VSS (cathode connected to VCC, anode to VSS). (Schottky diode 1N5817
is recommended for through hole and MBRS120T3 is recommended for surface mount).
Figure 9.
Supply voltage protection
VCC
VCC
0.1μF
DEVICE
VSS
AI02169
13/24
Maximum rating
3
M48Z35AV
Maximum rating
Stressing the device above the rating listed in the “Absolute Maximum Ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 5.
Absolute maximum ratings
Symbol
TA
Parameter
Value
Unit
0 to 70
°C
SNAPHAT
–40 to 85
°C
®
CAPHAT DIP
–40 to 85
°C
SOIC
–55 to 125
°C
260
°C
Ambient operating temperature
® top
TSTG
TSLD(1)(2)
Storage temperature (VCC off, oscillator
off)
Lead solder temperature for 10 seconds
VIO
Input or output voltages
–0.3 to 4.6
V
VCC
Supply voltage
–0.3 to 4.6
V
IO
Output current
20
mA
PD
Power dissipation
1
W
1. For DIP package: Soldering temperature not to exceed 260°C for 10 seconds (total thermal budget not to
exceed 150°C for longer than 30 seconds).
2. For SO package, Lead-free (Pb-free) lead finish: Reflow at peak temperature of 260°C (total thermal
budget not to exceed 245°C for greater than 30 seconds).
Caution:
Negative undershoots below –0.3V are not allowed on any pin while in the battery back-up
mode.
Caution:
Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.
14/24
M48Z35AV
4
DC and AC parameters
DC and AC parameters
This section summarizes the operating and measurement conditions, as well as the DC and
AC characteristics of the device. The parameters in the following DC and AC Characteristic
tables are derived from tests performed under the Measurement Conditions listed in Table 6:
Operating and AC measurement conditions. Designers should check that the operating
conditions in their projects match the measurement conditions when using the quoted
parameters.
Table 6.
Operating and AC measurement conditions
Parameter
M48Z35AV
Unit
3.0 to 3.6
V
0 to 70
°C
Load capacitance (CL)
50
pF
Input rise and fall times
≤5
ns
0 to 3
V
1.5
V
Supply voltage (VCC)
Ambient operating temperature (TA)
Input pulse voltages
Input and output timing ref. voltages
Note:
Output Hi-Z is defined as the point where data is no longer driven.
Figure 10. AC measurement load circuit
645Ω
DEVICE
UNDER
TEST
CL = 100pF or
5pF
CL includes JIG capacitance
Note:
1.75V
AI03211
50pF for M48Z35AV.
Table 7.
Capacitance
Parameter(1)(2)
Symbol
CIN
CIO
(3)
Min
Max
Unit
Input capacitance
10
pF
Input / output capacitance
10
pF
1. Effective capacitance measured with power supply at 5V. Sampled only, not 100% tested.
2. At 25°C, f = 1MHz.
3. Outputs deselected.
15/24
DC and AC parameters
Table 8.
M48Z35AV
DC characteristics
Symbol
ILI(2)
Test condition(1)
Parameter
Input leakage current
ILO((2)
Output leakage current
Min
Max
Unit
0V ≤ VIN ≤ VCC
±1
µA
0V ≤ VOUT ≤ VCC
±5
µA
Outputs open
50
mA
E = VIH
3
mA
E = VCC – 0.2V
3
mA
ICC
Supply current
ICC1
Supply current (TTL standby)
ICC2
Supply current (CMOS standby)
VIL
Input low voltage
–0.3
0.8
V
VIH
Input high voltage
2.2
VCC + 0.3
V
VOL
Output low voltage
IOL = 2.1mA
VOH
Output high voltage
IOH = –1mA
0.4
V
2.4
V
1. Valid for ambient operating temperature: TA = 0 to 70°C; VCC = 3.0 to 3.6V (except where noted).
2. Outputs deselected.
Figure 11. Power down/up mode AC waveforms
VCC
VPFD (max)
VPFD (min)
VSO
tF
tR
tFB
tDR
tPD
INPUTS
tRB
RECOGNIZED
trec
DON'T CARE
RECOGNIZED
HIGH-Z
OUTPUTS
VALID
VALID
(PER CONTROL INPUT)
(PER CONTROL INPUT)
AI01168C
Table 9.
Symbol
tPD
tF
(2)
tFB
(3)
Power down/up AC characteristics
Parameter(1)
E or W at VIH before power down
Min
Max
Unit
0
µs
VPFD (max) to VPFD (min) VCC fall time
300
µs
VPFD (min) to VSS VCC fall time
10
µs
tR
VPFD (min) to VPFD (max) VCC rise time
10
µs
tRB
VSS to VPFD (min) VCC rise time
1
µs
trec
VPFD (max) to inputs recognized
40
200
ms
1. Valid for ambient operating temperature: TA = 0 to 70°C; VCC = 3.0 to 3.6V (except where noted).
2. VPFD (max) to VPFD (min) fall time of less than tF may result in deselection/write protection not occurring until 200µs after
VCC passes VPFD (min).
3. VPFD (min) to VSS fall time of less than tFB may cause corruption of RAM data.
16/24
M48Z35AV
Table 10.
DC and AC parameters
Power down/up trip points DC characteristics
Parameter(1)(2)
Symbol
VPFD
Power-fail deselect voltage
VSO
Battery back-up switchover voltage
tDR(3)
Expected data retention time
Min
Typ
Max
Unit
2.7
2.9
3.0
V
VPFD – 100mV
10
V
YEARS
1. All voltages referenced to VSS.
2. Valid for ambient operating temperature: TA = 0 to 70°C; VCC = 3.0 to 3.6V (except where noted).
3. At 25°C, VCC = 0V.
17/24
Package mechanical data
5
M48Z35AV
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 12. PCDIP28 – 28-pin plastic DIP, battery CAPHAT™, package outline
A2
A1
B1
B
A
L
C
e1
eA
e3
D
N
E
1
Note:
PCDIP
Drawing is not to scale.
Table 11.
PMDIP28 – 28-pin plastic DIP, battery CAPHAT™, pack. mech. data
mm
inches
Symbol
Typ
18/24
Min
Max
A
8.89
A1
Typ
Min
Max
9.65
0.350
0.380
0.38
0.76
0.015
0.030
A2
8.38
8.89
0.330
0.350
B
0.38
0.53
0.015
0.021
B1
1.14
1.78
0.045
0.070
C
0.20
0.31
0.008
0.012
D
39.37
39.88
1.550
1.570
E
17.83
18.34
0.702
0.722
e1
2.29
2.79
0.090
0.110
e3
29.72
36.32
1.170
1.430
eA
15.24
16.00
0.600
0.630
L
3.05
3.81
0.120
0.150
N
28
28
M48Z35AV
Package mechanical data
Figure 13. SOH28 – 28-lead plastic small outline, battery SNAPHAT, package outline
A2
A
C
B
eB
e
CP
D
N
E
H
A1
α
L
1
SOH-A
Note:
Drawing is not to scale.
Table 12.
SOH28 – 28-lead plastic small outline, battery SNAPHAT, pack. mech.
data
mm
inches
Symbol
Typ
Min
A
Max
Typ
Min
Max
3.05
0.120
A1
0.05
0.36
0.002
0.014
A2
2.34
2.69
0.092
0.106
B
0.36
0.51
0.014
0.020
C
0.15
0.32
0.006
0.012
D
17.71
18.49
0.697
0.728
E
8.23
8.89
0.324
0.350
–
–
–
–
e
1.27
0.050
eB
3.20
3.61
0.126
0.142
H
11.51
12.70
0.453
0.500
L
0.41
1.27
0.016
0.050
a
0°
8°
0°
8°
N
28
CP
28
0.10
0.004
19/24
Package mechanical data
M48Z35AV
Figure 14. SH – 4-pin SNAPHAT housing for 48mAh battery, package outline
A1
A2
A
eA
A3
B
L
eB
D
E
SHZP-A
Note:
Drawing is not to scale.
Table 13.
SH – 4-pin SNAPHAT housing for 48mAh battery, pack. mech. data
mm
inches
Symbol
Typ
Min
A
Typ
Min
9.78
Max
0.385
A1
6.73
7.24
0.265
0.285
A2
6.48
6.99
0.255
0.275
A3
20/24
Max
0.38
0.015
B
0.46
0.56
0.018
0.022
D
21.21
21.84
0.835
0.860
E
14.22
14.99
0.560
0.590
eA
15.55
15.95
0.612
0.628
eB
3.20
3.61
0.126
0.142
L
2.03
2.29
0.080
0.090
M48Z35AV
Package mechanical data
Figure 15. SH – 4-pin SNAPHAT housing for 120mAh battery, package outline
A1
A2
A3
A
eA
B
L
eB
D
E
SHZP-A
Note:
Drawing is not to scale.
Table 14.
SH – 4-pin SNAPHAT housing for 120 mAh battery, pack. mech. data
mm
inches
Symb
Typ
Min
A
Max
Typ
Min
10.54
Max
0.415
A1
8.00
8.51
0.315
0.335
A2
7.24
8.00
0.285
0.315
A3
0.38
0.015
B
0.46
0.56
0.018
0.022
D
21.21
21.84
0.835
0.860
E
17.27
18.03
0.680
0.710
eA
15.55
15.95
0.612
0.628
eB
3.20
3.61
0.126
0.142
L
2.03
2.29
0.080
0.090
21/24
Part numbering
6
M48Z35AV
Part numbering
Table 15.
Ordering information scheme
Example:
M48Z
35AV
–10
MH
1
E
Device type
M48Z
Supply voltage and write protect voltage
35AV = VCC = 3.0 to 3.6V; VPFD = 2.7 to 3.0V
Speed
–10 = 100ns (35AV)
Package
PC = PCDIP28
MH(1) = SOH28
Temperature range
1 = 0 to 70°C
Shipping method
For SOH28:
E = Lead-free package (ECOPACK®), tubes
F = Lead-free package (ECOPACK®), tape & reel
For PCDIP28:
blank = tubes
1. The SOIC package (SOH28) requires the SNAPHAT® battery package which is ordered separately under
the part number “M4Zxx-BR00SH1” in plastic tubes (see Table 16).
Caution:
Do not place the SNAPHAT battery package “M4Zxx-BR00SH1” in conductive foam as it will
drain the lithium button-cell battery.
For other options, or for more information on any aspect of this device, please contact the
ST sales office nearest you.
Table 16.
SNAPHAT battery table
Part number
22/24
Description
Package
M4Z28-BR00SH1
Lithium battery (48mAh) SNAPHAT
SH
M4Z32-BR00SH1
Lithium battery (120mAh) SNAPHAT
SH
M48Z35AV
7
Revision history
Revision history
Table 17.
Document revision history
Date
Revision
Changes
Sep-1999
1.0
First Issue
20-Apr-2000
1.1
SH and SH28 packages for 2-pin and 2-socket removed
22-Jun-2001
2.0
Reformatted; added temperature information (Table 7, 8, 3, 4, 9, 10)
05-Jul-2001
2.1
Removed reference to “Crystal” in Features Summary
17-Dec-2001
2.2
Changed speed grade designator to “–10” (Table 15)
29-May-2002
2.3
Modified reflow time and temperature footnotes (Table 5)
03-Oct-2002
2.4
Update VCC for Supply Voltage (Table 5)
07-Nov-2002
2.5
Update Absolute Maximum Ratings (Table 5)
02-Apr-2003
3.0
v2.2 template applied; test condition updated (Table 10)
24-Mar-2004
4.0
Reformatted; updated Lead-free information (Table 5, 15)
09-Jun-2005
5
Removal of SNAPHAT, Industrial temperature sales types (Table 3, 4, 5,
6, 8, 9, 10, 15)
6
Reformatted document; added lead-free second level interconnect
information to cover page and Section 5: Package mechanical data;
removed M48Z35AY and references throughout document; updated
Table 2, 3, 4, 5, 6, 8, 9, 15 and 16.
05-Nov-2007
23/24
M48Z35AV
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2007 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
24/24