MICREL SY89295UTG

SY89295U
2.5V/3.3V 1.5GHz Precision LVPECL
Programmable Delay
General Description
The SY89295U is a programmable delay line that delays
the input signal using a digital control signal. The delay
can vary from 3.2ns to 14.8ns in 10ps increments. In
addition, the input signal is LVPECL, uses either a 2.5V
±5% or 3.3V ±10% power supply, and is guaranteed over
the full industrial temperature range (–40°C to +85°C).
The delay varies in discrete steps based on a control word.
The control word is 10-bits long and controls the delay in
10ps increments. The eleventh bit is D[10] and is used to
simultaneously cascade the SY89295U which allows for a
larger delay range. In addition, the input pins IN and /IN
default to an equivalent low state when left floating.
Further, for maximum flexibility, the control register
interface accepts CMOS or TTL level signals.
For applications that require an analog delay input, see the
SY89296L which is a programmable delay chip with fine
tune control. The SY89295U and SY89296U are part of
®
Micrel’s high-speed, Precision Edge product line.
Data sheets and support documentation can be found on
Micrel’s web site at: www.micrel.com.
Precision Edge®
Features
• Precision LVPECL programmable delay line
• Guaranteed AC performance over temperature and
voltage:
− >1.5GHz fMAX
− <160ps rise/fall times
• Low-jitter design:
− <10psPP total jitter
− <2psRMS cycle-to-cycle jitter
− <1psRMS random jitter
• Programmable delay range: 3.2ns to 14.8ns in 10ps
increments
• Increased monotonicity over the MIC100EP195
• ±10ps INL
• VBB output reference voltage
•
•
•
•
Parallel inputs accepts LVPECL or CMOS/LVTTL
Low voltage operation: 2.5V ±5% and 3.3V ±10%
Industrial –40°C to +85°C temperature range
Available in 32-pin (5mm × 5mm) MLF® and
32-pin TQFP packages
Applications
• Clock de-skewing
• Timing adjustments
• Aperture centering
Precision Edge is a registered trademark of Micrel, Inc
MicroLeadFrame and MLF are registered trademarks of Amkor, Inc.
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
March 2011
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SY89295U
Ordering Information(1)
Part Number
Package Type
Operating Range
Package Marking
Lead Finish
SY89295UMI
MLF-32
Industrial
SY89295U
Sn-Pb
MLF-32
Industrial
SY89295U
Sn-Pb
(2)
SY89295UMI TR
SY89295UTI
T32-1
Industrial
SY89295U
Sn-Pb
SY89295UTITR(2)
T32-1
Industrial
SY89295U
Sn-Pb
SY89295UMG(3)
MLF-32
Industrial
SY89295U with
Pb-Free bar-line indicator
Pb-Free NiPd Au
SY89295UMGTR(2, 3)
MLF-32
Industrial
SY89295U with
Pb-Free bar-line indicator
Pb-Free
NiPd Au
SY89295UTG(3)
T32-1
Industrial
SY89295U with
Pb-Free bar-line indicator
Pb-Free
NiPd Au
SY89295UTGTR(2, 3)
T32-1
Industrial
SY89295U with
Pb-Free bar-line indicator
Pb-Free
NiPd Au
Notes:
1. Contact factory for die availability. Dice are guaranteed at TA = 25°C, DC electricals only.
2. Tape and Reel.
3. Pb-Free package is recommended for new designs.
Pin Configuration
32-Pin MLF® (MLF-32)
March 2011
32-Pin TQFP (T32-1)
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Truth Tables
Input/Output
Inputs
IN
0
1
Digital Control Latch
LEN
0
1
Input Enable
/EN
0
1
March 2011
Outputs
/IN
1
0
OUT
0
1
/OUT
1
0
Latch Action
Pass Through D[10:0]
Latched
Q, /Q
IN, /IN Delayed
Latched D[10:0]
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Functional Block Diagram
SY89295U Block Diagram
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Pin Description
Pin Number
Pin Name
Pin Function
CMOS, ECL, or TTL Control Bits: These control signals adjust the delay from IN to Q. See
“AC Electrical Characteristics” for delay values. In addition, see “Interface Applications”
section which illustrates the proper interfacing techniques for different logic standards.
D[9:0] contains pull-downs and defaults LOW when left floating. D0 (LSB), and D9 (MSB).
See “Typical Operating Characteristics” for delay information.
23, 25, 26, 27, 29,
30, 31, 32, 1, 2
D[9:0]
3
D10
CMOS, ECL, or TTL Control Bit: This bit is used to cascade devices for an extended
delay range. In addition, it drives CASCADE, and /CASCADE. Further, D[10] contains a
pull-down and defaults LOW when left floating.
4, 5
IN, /IN
LVPECL/ECL Signal Input: Input signal to be delayed. IN contains a 75ký pull-down and
will default to a logic LOW if left floating.
6
(1)
VBB
Reference Voltage Output: When using a single-ended input signal source to IN or /IN,
connect the unused input of the differential pair to this pin. This pin can also be used to
re-bias AC-coupled inputs to IN and /IN. When used, de-couple to VCC using a 0.01µF
capacitor, otherwise leave floating if not used. Maximum sink/source is ±0.5mA.
Reference Voltage Output: Connect this pin to VCF when D[9:0], and D[10] is ECL..
7
VEF
Logic Standard
VCF Connects to:
LVPECL
VEF,(1)
CMOS
No Connect
TTL
1.5V Source
8
VCF
Reference Voltage Input: The voltage driven on VCF sets the logic transition threshold for
D[9:0], and D[10].
9, 24, 28
GND,
Exposed Pad(2)
®
Negative Supply: For MLF package, exposed pad must be connected to a ground plane
that is the same potential as the ground pin.
10
LEN
ECL Control Input: When HIGH latches the D[9:0] and D[10] bits. When LOW, the D[9:0]
and D[10] latches are transparent.
11
SETMIN
ECL Control Input: When HIGH, D[9:0] registers are reset. When LOW, the delay is set by
SETMAX or D[9:0] and D[10]. SETMIN contains a pull-down and defaults LOW when left
floating.
12
SETMAX
ECL Control Input: When SETMAX is set HIGH and SETMIN is set LOW, D[9:0] =
1111111111. When SETMAX is LOW, the delay is set by SETMIN or D[9:0] and D[10].
SETMAX contains a pull-down and defaults LOW when left floating.
13, 18, 19, 22
VCC
14, 15
/Cascade,
Cascade
16
/EN
20, 21
/Q, Q
17
NC
Positive Power Supply: Bypass with 0.1µF and 0.01µF low ESR capacitors.
LVPECL Differential Output: The outputs are used when cascading two or more
SY89295U to extend the delay range.
LVPECL Single-Ended Control Input: When LOW, Q is delayed from IN. When HIGH, Q is
a differential LOW. /EN contains a pull-down and defaults LOW when left floating.
LVPECL Differential Output: Q is a delayed version of IN. Always terminate the output
with 50Ω to VCC – 2V. See “Output Interface Applications” section.
No Connect.
Notes:
1. Single-ended operation is only functional at 3.3V.
®
2. MLF package only.
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Absolute Maximum Ratings(1)
Operating Ratings(2)
Supply Voltage (VCC) ................................... –0.5V to +4.0V
Input Voltage (VIN) .......................................... –0.5V to VCC
LVPECL Output Current (IOUT)
Continuous............................................................50mA
Surge ..................................................................100mA
Lead Temperature (soldering, 20 sec.).................... +260°C
Storage Temperature Range (TS).............–65°C to +150°C
DC Electrical Characteristics(4)
Supply Voltage (VCC) ............................... +2.375V to +3.6V
Ambient Temperature (TA).......................... –40°C to +85°C
Package Thermal Resistance(3)
MLF® (θJA)
Still-Air ...............................................................................35°C/W
MLF® (ψJB)
Junction-to-Board ..........................................................28°C/W
TQFP (θJA)
Still-Air ...............................................................................28°C/W
TQFP (ψJB)
Junction-to-Board ..........................................................20°C/W
TA = –40°C to +85°C, unless noted.
Symbol
Parameter
Condition
Min.
Typ.
Max.
VCC
Power Supply
VCC = 2.5V
2.375
2.5
2.625
VCC = 3.3V
3
3.3
3.6
IEE
Power Supply Current
No load, max. VCC
VIN
Input Voltage Swing (IN, /IN)
See Figure 1a.
VDIFF_IN
Differential Input Voltage Swing
(IN, /IN)
See Figure 1b.
VIHCMR
Input High Common Mode Range
IN, /IN
Units
V
220
mA
150
1200
mV
300
2400
mV
VEE + 1.2
VCC
V
Max.
Units
VCC = 3.3V, TA = –40°C to 85°C, unless otherwise stated.
Symbol
Parameter
Condition
Min.
Typ.
VIH
Input High Voltage (IN, /IN)
2.075
2.420
V
VIL
Input Low High Voltage (IN, /IN)
1.355
1.675
V
VBB
Output Voltage Reference
1.775
1.875
1.975
V
VEF
Mode Connection
1.9
2.0
2.1
V
VCF
Input Select Voltage
1.55
1.65
1.75
V
Notes:
1. Permanent device damage may occur if “Absolute Maximum Ratings” are exceeded. This is a stress rating only and functional operation is not implied at
conditions other than those detailed in the operational sections of this data sheet. Exposure to “Absolute Maximum Rating” conditions for extended periods may
affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
®
3. Thermal performance on MLF packages assumes exposed pad is soldered (or equivalent) to the device most negative potential (GND).
4. The circuit is designed to meet the DC specifications shown in the table above after thermal equilibrium has been established. Input and output
parameters vary 1:1 with VCC, with the exception of VCF.
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DC Electrical Characteristics(4) (Continued)
VCC = 2.5V, TA = –40°C to 85°C, unless otherwise stated.
Symbol
Parameter
VIH
Input High Voltage (IN, /IN)
VIL
Condition
Min.
Typ.
Max.
Units
1.275
1.62
V
Input Low High Voltage (IN, /IN)
0.555
0.875
V
VBB
Output Voltage Reference
1.175
1.075
0.975
V
VEF
Mode Connection
1.10
1.20
1.30
V
VCF
Input Select Voltage
1.15
1.25
1.35
V
LVPECL Outputs DC Electrical Characteristics(4)
VCC = 3.3V; RLOAD = 50Ω to VCC−2V; TA = –40°C to +85°C, unless noted.
Symbol
Parameter
VOH
Condition
Min.
Typ.
Max.
Units
Output HIGH Voltage (Q, /Q)
2.155
2.280
2.405
V
VOL
Output LOW Voltage (Q, /Q)
1.355
1.480
1.605
V
VOUT
Output Voltage Swing (Q, /Q)
See Figure 1a.
550
800
mV
VDIFF_OUT
Differential Output Voltage Swing
(Q, /Q)
See Figure 1b.
1.1
1.6
V
Min.
Typ.
Max.
Units
LVPECL Outputs DC Electrical Characteristics(5)
VCC = 2.5V; RLOAD = 50Ω to VCC−2V; TA = –40°C to +85°C, unless noted.
Symbol
Parameter
Condition
VCC
Output HIGH Voltage (Q, /Q)
1.355
1.480
1.605
V
IEE
Output LOW Voltage (Q, /Q)
0.555
0.68
0.805
V
VIN
Output Voltage Swing (Q, /Q)
See Figure 1a.
550
800
mV
VDIFF_OUT
Differential Output Voltage Swing
(Q, /Q)
See Figure 1b.
1.1
1.6
V
Min
Typ
LVTTL/CMOS DC Electrical Characteristics(6)
VCC = 2.5V ±5% or 3.3V ±10%; TA = –40°C to +85°C, unless noted.
Symbol
Parameter
Condition
Max
Units
VIH
Input HIGH Voltage
VIL
Input LOW Voltage
0.8
V
IIH
Input HIGH Current
40
µA
IIL
Input LOW Current
2.0
V
−300
µA
Notes:
5.
The circuit is designed to meet the DC specifications shown in the table above after thermal equilibrium has been established. VOH and VOL
parameters vary 1:1 with VCC.
6.
The circuit is designed to meet the DC specifications shown in the table above after thermal equilibrium has been established.
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AC Electrical Characteristics(7)
TA = –40°C to +85°C, unless noted.
Symbol
Parameter
Condition
fMAX
Maximum Operating Frequency
Clock
Min.
VOUT ≥ 400mV
Typ.
Max.
1.5
Units
GHz
Propagation Delay
IN to Q; D[0–10]=0
IN to Q; D[0–10]=1023
/EN to Q: D[0–10]=0
D10 to CASCADE
3200
11500
3400
350
tRANGE
Programmable Range
tpd (max.) – tpd (min)
8300
tSKEW
Duty Cycle Skew
tpd
tPHL – tPLH
4200
14800
4400
670
ps
ps
Note 8
25
ps
Step Delay
D0 High
D1 High
D2 High
D3 High
D4 High
D5 High
D6 High
D7 High
D8 High
D9 High
D0-D9 High
Δt
INL
Note 9
Integral Non-Linearity
10
15
35
70
145
290
575
1150
2300
4610
9220
ps
±10
ps
Setup Time
tS
D to LEN
D to IN
/EN to IN
Note 10
Note 11
200
350
300
ps
LEN to D
IN to /EN
Note 12
200
400
ps
Hold Time
tH
Notes:
7.
High-frequency AC electricals are guaranteed by design and characterization.
8.
Duty cycle skew guaranteed only for differential operation measured from the cross point of the input to the crosspoint of the output.
9.
INL (Integral Non-Linearity) is defined from its corresponding point on the ideal delay versus D[9:0] curve as the deviation from its ideal delay. The
maximum difference is the INL. Theoretical Ideal Linearity (TIL) = (measured maximum delay – measured minimum delay) ÷ 1024. INL = measured
delay – measured minimum delay + (step number ∞ TIL).
10. This setup time defines the amount of time prior to the input signal. The delay tap of the device must be set.
11. This setup time defines the amount of the time that /EN must be asserted prior to the next transition of IN, /IN to prevent an output response greater
than ±75mV to the IN, /IN transition.
12. Hold time is the minimum time that /EN must remain asserted after a negative going IN or a positive going /IN to prevent an output response
greater than ±75mV to the IN, /IN transition.
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AC Electrical Characteristics
(7)
TA = –40°C to +85°C, unless noted.
Symbol
Parameter
Condition
Min.
Typ.
Max.
Units
Release Time
/EN to IN
SETMAX to LEN
SETMIN to LEN
tR
500
500
450
tJITTER
Cycle-to-Cycle Jitter
Total Jitter
Random Jitter
Note 13
Note 14
Note 15
tr, tf
Output Rise/Fall Time
20% to 80% (Q)
20% to 80% (Cascade)
Duty Cycle
50
90
ps
85
45
2
10
1
psRMS
psPP
psRMS
160
300
ps
55
%
Notes:
13. Cycle-to-cycle jitter definition: The variation of periods between adjacent cycles over a random sample of adjacent cycle pairs.
Tjitter_cc = Tn – Tn+1, where T is the time between rising edges of the output signal.
14. Total jitter definition: With an ideal clock input, no more than one output edge in 1012 output edges will deviate by more than the specified peak-topeak jitter value.
15. Random jitter definition: Jitter that is characterized by a Gaussian distribution, unbounded and is quantified by its standard deviation and mean.
Random jitter is measured with a K28.7 comma defect pattern, measured at 1.5Gbps.
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Typical Operating Characteristics
VCC = 3.3V, GND = 0, DIN = 100mV, TA = 25ºC, unless otherwise stated.
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Timing Diagrams
Single-Ended and Differential Swings
Figure 1a. Single-Ended Voltage Swing
Figure 1b. Differential Voltage Swing
Input and Output Stages
Figure 2a. Differential Input Stage
March 2011
Figure 2b. Single-Ended Input Stage
11
Figure 3. LVPECL Output Stage
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Output Interface Applications
Figure 5. Y-Termination
Figure 4. Parallel Termination
Figure 6. Terminating Unused I/O
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Applications Information
For best performance, use good high-frequency layout
techniques, filter VCC supplies, and keep ground
connections short. Use multiple vias where possible.
Also, use controlled impedance transmission lines to
interface with the SY89295U data inputs and outputs.
Setting D Input Logic Thresholds
In all designs where the SY89295U GND supply is at
zero volts, the D inputs can accommodate CMOS and
TTL level signals, as well as PECL or LVPECL. Figures
11, 12 and 14 show how to connect VCF and VEF for all
possible cases.
VBB Reference
The VBB pin is an internally generated reference and is
available for use only by the SY89295U. When unused,
this pin should be left unconnected. Two common uses
for VBB are to handle a single-ended PECL input, and to
re-bias inputs for AC-coupling applications.
If IN and /IN are driven by a single-ended output, VBB is
used to bias the unused input. Please refer to Figure 10.
The PECL signal driving the SY89295U may optionally
be inverted in this case.
When the signal is AC-coupled, VBB is used, as shown
in Figure 13, to re-bias IN and /IN. This ensures that
SY89295U inputs are within acceptable common mode
range.
In all cases, VBB current sinking or sourcing must be
limited to 0.5mA or less.
March 2011
Cascading
Two or more SY89295U may be cascaded in order to
extend the range of delays permitted. Each additional
SY89295U adds about 3.2ns to the minimum delay and
adds another 10240ps to the delay range.
Internal cascade circuitry has been included in the
SY89295U. Using this internal circuitry, the SY89295U
may be cascaded without any external gating.
Examples of cascading 2, 3, or 4 SY89295U appear in
Figures 7, 8, and 9.
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Figure 7. Cascading Two SY89295U
Figure 8. Cascading Three SY89295U
Figure 8. Cascading Four SY89295U
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Interface Applications
Figure 10. Interfacing to a
Single-Ended LVPECL Signal
Figure 11. VCF/VEF Biasing for
LVPECL Control (D) Input
Figure 13. Re-Biasing an
AC-Coupled Signal
Figure 12. VCF/VEF Biasing for
CMOS (D) Input
Figure 14. VCF/VEF Biasing for
LVTTL Control (D) Input
Related Product and Support Documentation
Part Number
Function
Datasheet Link
SY89295U
2.5/3.3V 1.5GHz Precision LVPECL
Programmable Delay
www.micrel.com/product-info/products/sy89295u.shtml
SY89296U
2.5/3.3V 1.5GHz Precision LVPECL
Programmable Delay with Fine Tune Control
www.micrel.com/product-info/products/sy89296u.shtml
16-MLF Manufacturing Guidelines Exposed
Pad Application Note
www.amkor.com/products/notes_papers/MLF_appnote_0902.pdf
HBW Solutions
http://www.micrel.com/product-info/as/solutions.shtml
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Package Information
PCB Thermal Consideration for 32-Pin MLF® Package
(Always solder, or equivalent, the exposed pad to the PCB)
Package Notes:
1. Package meets Level 2 qualifications
2. All parts are dry-packed before shipment.
3. Exposed pads must be soldered to a ground for proper thermal management.
®
32-Pin MLF (MLF-32)
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Package Information (Continued)
32-Pin TQFP (T32-1)
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com
Micrel makes no representations or warranties with respect to the accuracy or completeness of the information furnished in this data sheet. This
information is not intended as a warranty and Micrel does not assume responsibility for its use. Micrel reserves the right to change circuitry,
specifications and descriptions at any time without notice. No license, whether express, implied, arising by estoppel or otherwise, to any intellectual
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relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right.
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© 2006 Micrel, Incorporated.
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