ASM3P2111B Peak EMI Reducing Solution Features • Generates an EMI optimized clock at the output. • Input frequency: 25MHz. • Frequency outputs: o 60MHz (unmodulated) o 2 x 48MHz (unmodulated) o 66.6MHz (modulated): -1.7% down spread • Modulation rate: 30KHz. • Supply voltage range: 3.3V ± 0.3V. number of circuit board layers and shielding that are required to pass EMI regulations. The ASM3P2111B modulates the output of PLL in order to spread the bandwidth of a synthesized clock, thereby decreasing the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most clock generators. Lowering EMI by increasing a signal’s bandwidth is called spread spectrum clock generation. • Available in 8-pin SOIC Package. Applications • RoHS Compliant ASM3P2111B is targeted towards EMI management for high speed digital applications such as PC peripheral devices, consumer electronics and embedded controller systems. Product Description The ASM3P2111B is a versatile spread spectrum frequency modulator that reduces electromagnetic interference (EMI) at the clock source. The ASM3P2111B allows significant system cost savings by reducing the Block Diagram VDD 60MHz XIN / CLKIN Crystal Oscillator PLL1 48MHz_1 XOUT 48MHz_2 48MHz_1 PLL2 66.6MHz Modulated VSS ©2010 SCILLC. All rights reserved. JANUARY 2010 – Rev. 1 Publication Order Number: ASM3P2111/D ASM3P2111B Pin Configuration XIN/ CLKIN 1 XOUT 2 8 VSS 7 66.6MHz ASM3P2111B VDD 3 6 48MHz_1 60MHz 4 5 48MHz_2 Pin Description Description Pin # Pin Name Type 1 XIN / CLKIN I Connection to crystal 2 XOUT O Connection to crystal 3 VDD P Power supply for the analog and digital blocks (+3.3V) 4 60MHz O Clock output-1 60MHz un-modulated 5 48MHz_2 O Clock output-2 48MHz_2 un-modulated 6 48MHz_1 O Clock output-3 48MHz_1 un-modulated 7 66.6MHz O Clock output-4 66.6MHz modulated 8 VSS P Ground to entire chip. Connect to System Ground Rev. 1 | Page 2 of 7 | www.onsemi.com ASM3P2111B Absolute Maximum Ratings Symbol VDD, VIN TSTG Rating Unit Voltage on any pin with respect to Ground Parameter -0.5 to +4.6 V Storage temperature -65 to +125 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature Static Discharge Voltage (As per JEDEC STD22- A114-B) 150 °C 2 KV TDV Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. Operating Conditions Symbol Parameter VDD Supply Voltage FXIN Crystal Resonator Frequency Min Typ Max 3 3.3 3.6 25 TA Operating Temperature -40 CL Output Driver Load Capacitance Rev. 1 | Page 3 of 7 | www.onsemi.com Unit V MHz +85 °C 15 pF ASM3P2111B DC Electrical Characteristics Parameter Symbol Conditions / Description Min Typ Max Unit IDD VDD = 3.3V, FCLK = 25MHz, CL = 15pF 41 48 62 mA IDDL VDD = 3.3V, Clock Input = 0 20 25 35 mA VIH VDD = 3.3V 2.0 VDD+0.3 V VIL VDD =3.3V VSS-0.3 0.8 V IIH -1 1 µA IIL -20 -80 µA Overall Supply Current, Dynamic Supply Current, Static All input pins High-Level Input Voltage Low-Level Input Voltage High-Level Input Current Low-Level Input Current (pull-up) High-Level Output Source Current Low-Level Output Sink Current -36 IxOH VDD = V (XIN) = 3.3V, VO= 0.4V 3 mA IxOL VDD = 3.3V, V (XIN) = VO = 2.5V 3 mA IOH VO = 2.5V -20 mA IOL VO = 0.4V 23 mA ZOH VO = 0.5 VDD; output driving high 29 ZOL VO = 0.5 VDD; output driving low 27 Ω Clock Outputs High-Level Output Source Current Low-Level Output Sink Current Output Impedance AC Electrical Characteristics Parameter Symbol Rise Time tr Fall Time tf Clock Duty Cycle Conditions / Description VO = 0.8V to 2.0V; CL = 15pF VO = 2.0V to 0.8V; CL = 15pF Min Typ Max Unit 300 800 900 pS 360 800 900 pS 55 % Ratio of pulse width (as measured from rising edge to next falling edge at VDD /2) to one clock period Note: 1. CL = 15pF, Input clock frequency = 25MHz. Rev. 1 | Page 4 of 7 | www.onsemi.com 45 ASM3P2111B Typical Crystal Specifications Fundamental AT cut parallel resonant crystal Nominal frequency 25MHz Frequency tolerance ± 50 ppm or better at 25°C Operating temperature range -25°C to +85°C Storage temperature -40°C to +85°C Load capacitance(CP) 18pF Shunt capacitance 7pF maximum ESR 25 Ω Note: Note: CL is Load Capacitance and Rx is used to prevent oscillations at overtone frequency of the Fundamental frequency. Typical Crystal Interface Circuit R Crystal CL Rx CL CL = 2*(CP – CS), Where CP = Load capacitance of crystal CS = Stray capacitance due to CIN, PCB, Trace etc. Rev. 1 | Page 5 of 7 | www.onsemi.com ASM3P2111B Package Information 8-lead (150-mil) SOIC Package H E D A2 A θ C D e A1 L B Dimensions Symbol Inches Min Max Millimeters Min Max A1 0.004 0.010 0.10 0.25 A 0.053 0.069 1.35 1.75 A2 0.049 0.059 1.25 1.50 B 0.012 0.020 0.31 0.51 C 0.007 0.010 0.18 0.25 D 0.193 BSC 4.90 BSC E 0.154 BSC 3.91 BSC e 0.050 BSC 1.27 BSC H 0.236 BSC 6.00 BSC L 0.016 0.050 θ 0° 8° 0.41 1.27 0° 8° Rev. 1 | Page 6 of 7 | www.onsemi.com ASM3P2111B Ordering Codes Part number Marking ASM3P2111BG-08SR Package Configuration AEI Temperature Range 8-pin SOIC TAPE & REEL, Green 0°C to +70°C A “microdot” placed at the end of last row of marking or just below the last row toward the center of package indicates Pb-free Licensed under US patent #5,488,627, #6,646,463 and #5,631,920. Note: This product utilizes US Patent #6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003. are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes ON Semiconductor and without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. 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