FAIRCHILD FSA3031UMX

FSA3031 — Dual High-Speed USB2.0 with Mobile
High-Definition Link (MHL™)
Description
Features

Low On Capacitance: 4.6 pF/6.75 pF MHL/USB
(Typical)



Low Power Consumption: 30 μA Maximum



MHL Data Rate: ≥4.7Gbps with Ideal Input Source
Supports MHL Rev. 2.0
Passes 1080 p/60 fps (3 Gbps) MHL Data Eye
Diagram Mask Compliance
Packaged in 12-Lead UMLP (1.8 x 1.8 mm)
Over-Voltage Tolerance (OVT) on all USB Ports
Up to 5.25 V without External Components
Applications

Cell Phones and Digital Cameras
The FSA3031 is a bi-directional, low-power, high-speed,
3:1, dual USB2.0 and MHL switch. Configured as a
double-pole, triple-throw (DP3T) switch; it is optimized
for switching between dual high- or full-speed USB and
Mobile High-Definition Link sources (MHL™ Rev. 2.0
specification).
The FSA3031 contains special circuitry on the switch
I/O pins, for applications where the VCC supply is
powered off (VCC=0), that allows the device to withstand
an over-voltage condition. This switch is designed to
minimize current consumption even when the control
voltage applied to the control pins is lower than the
supply voltage (VCC). This feature is especially valuable
to mobile applications, such as cell phones; allowing
direct interface with the general-purpose I/Os of the
baseband processor. Other applications include
switching and connector sharing in portable cell phones,
digital cameras, and notebook computers.
IMPORTANT NOTE:
For additional performance information, please contact
[email protected]
Ordering Information
Part Number
FSA3031UMX
Top Mark Operating Temperature Range
LX
-40 to +85°C
Package
12-Lead, Ultrathin Molded Leadless Package
(UMLP), 1.8 mm x 1.8 mm
Figure 1. Typical Application
All trademarks are the property of their respective owners.
© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4
www.fairchildsemi.com
FSA3031 — Dual High-Speed USB2.0 Switch with Mobile High-Definition Link (MHL™) Switch
November 2012
1.80
0.10 C
A
(11X)
2.10
B
0.563
0.588
2X
1
1.80
0.40
2.10
PIN#1 IDENT
TOP VIEW
0.55 MAX.
0.10 C
0.10 C
(12X) 0.20
2X
RECOMMENDED
LAND PATTERN
0.152
0.45
0.35
0.08 C
0.05
0.00
0.10
SEATING C
PLANE
SIDE VIEW
0.10
0.10
DETAIL A
SCALE : 2X
NOTES:
0.35
(11X)
0.45
3
A. PACKAGE DOES NOT FULLY CONFORM TO
JEDEC STANDARD.
B. DIMENSIONS ARE IN MILLIMETERS.
6
0.40
DETAIL A
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994.
1
PIN#1 IDENT
12
9
BOTTOM VIEW
D. LAND PATTERN RECOMMENDATION IS
BASED ON FSC DESIGN ONLY.
0.25
0.15 (12X)
0.10 C A B
0.05 C
E. DRAWING FILENAME: MKT-UMLP12Arev4.
PACKAGE
EDGE
LEAD
OPTION 1
SCALE : 2X
LEAD
OPTION 2
SCALE : 2X
FSA3031 — Dual High-Speed USB2.0 Switch with Mobile High-Definition Link (MHL™) Switch
Physical Dimensions
Figure 20. 12-Lead, Ultrathin Molded Leadless Package (UMLP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4
www.fairchildsemi.com
12
FSA3031 — Dual High-Speed USB2.0 Switch with Mobile High-Definition Link (MHL™) Switch
13
www.fairchildsemi.com
© 2011 Fairchild Semiconductor Corporation
FSA3031 • Rev. 1.0.4