SAMSUNG K8S5615ETC

Rev. 1.0, Nov. 2010
K8S5615ETC
256Mb C-die NOR Flash
44FBGA, Muxed Burst, Multi Bank SLC
16M x16, 1.7V ~ 1.95V
datasheet
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-1-
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
Revision History
Revision No.
History
Draft Date
Remark
Editor
0.0
- First version for target specification.
7, May, 2010
Target
-
0.5
- Preliminary datasheet.
14, Oct. 2010
Preliminary
-
0.6
- Added NOTE "Not 100% tested." for parameter "32-word Buffer Programming
Time" in 18.5 Erase/Program Performance table.
2, Nov. 2010
Preliminary
-
1.0
- Specification is finalized.
18, Nov. 2010
Final
-
-2-
Rev. 1.0
K8S5615ETC
datasheetNOR FLASH MEMORY
256Mb C-die NOR Flash 1
1.0 FEATURES................................................................................................................................................................. 5
2.0 GENERAL DESCRIPTION ......................................................................................................................................... 5
3.0 PIN DESCRIPTION .................................................................................................................................................... 5
4.0 44Ball FBGA TOP VIEW (BALL DOWN) .................................................................................................................... 6
5.0 FUNCTIONAL BLOCK DIAGRAM .............................................................................................................................. 7
6.0 ORDERING INFORMATION ...................................................................................................................................... 8
7.0 PRODUCT INTRODUCTION...................................................................................................................................... 11
8.0 COMMAND DEFINITIONS ......................................................................................................................................... 12
9.0 DEVICE OPERATION ................................................................................................................................................ 14
9.1 Read Mode .............................................................................................................................................................. 14
9.1.1 Asynchronous Read Mode................................................................................................................................ 14
9.1.2 Synchronous (Burst) Read Mode...................................................................................................................... 14
9.1.3 Continuous Linear Burst Read .......................................................................................................................... 14
9.2 Programmable Wait State ....................................................................................................................................... 15
9.3 Handshaking............................................................................................................................................................ 15
9.4 Set Burst Mode Configuration Register ................................................................................................................... 15
9.4.1 Programmable Wait State Configuration........................................................................................................... 15
9.4.2 Burst Read Mode Setting .................................................................................................................................. 15
9.4.3 RDY Configuration ............................................................................................................................................ 15
9.5 Autoselect Mode...................................................................................................................................................... 17
9.6 Standby Mode ......................................................................................................................................................... 17
9.7 Automatic Sleep Mode ............................................................................................................................................ 17
9.8 Output Disable Mode ............................................................................................................................................... 17
9.9 Block Protection & Unprotection.............................................................................................................................. 17
9.10 Hardware Reset..................................................................................................................................................... 17
9.11 Software Reset ...................................................................................................................................................... 18
9.12 Program ................................................................................................................................................................. 18
9.13 Accelerated Program ............................................................................................................................................. 18
9.14 Write Buffer Programming ..................................................................................................................................... 18
9.15 Accelerated Write Buffer Programming ................................................................................................................. 19
9.16 Chip Erase ............................................................................................................................................................. 19
9.17 Block Erase ........................................................................................................................................................... 19
9.18 Unlock Bypass....................................................................................................................................................... 19
9.19 Erase Suspend / Resume...................................................................................................................................... 20
9.20 Program Suspend / Resume ................................................................................................................................. 20
9.21 Read While Write Operation .................................................................................................................................. 20
9.22 OTP Block Region ................................................................................................................................................. 20
9.23 Low VCC Write Inhibit ........................................................................................................................................... 20
9.24 Write Pulse “Glitch” Protection .............................................................................................................................. 21
9.25 Logical Inhibit......................................................................................................................................................... 21
10.0 FLASH MEMORY STATUS FLAGS ......................................................................................................................... 22
11.0 Deep Power Down .................................................................................................................................................... 24
12.0 Common Flash Memory Interface............................................................................................................................. 25
13.0 ABSOLUTE MAXIMUM RATINGS ..................................................................................................................... 27
14.0 RECOMMENDED OPERATING CONDITIONS ( Voltage reference to GND )......................................................... 27
15.0 DC CHARACTERISTICS................................................................................................................................... 28
16.0 CAPACITANCE (TA = 25 °C, VCC = 1.8V, f = 1.0MHz)........................................................................................... 30
17.0 AC TEST CONDITION ...................................................................................................................................... 30
18.0 AC CHARACTERISTICS .......................................................................................................................................... 30
18.1 Synchronous/Burst Read.................................................................................................................................30
18.2 Asynchronous Read ........................................................................................................................................34
18.3 Hardware Reset(RESET) ...................................................................................................................................... 36
18.4 Erase/Program Operation...................................................................................................................................... 37
18.5 Erase/Program Performance ...........................................................................................................................38
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Rev. 1.0
K8S5615ETC
datasheetNOR FLASH MEMORY
19.0 CROSSING OF FIRST WORD BOUNDARY IN BURST READ MODE ................................................................... 45
-4-
Rev. 1.0
K8S5615ETC
datasheet NOR FLASH MEMORY
256M Bit (16M x16) Muxed Burst / Multi Bank SLC NOR Flash Memory
1.0 FEATURES
2.0 GENERAL DESCRIPTION
• Single Voltage, 1.7V to 1.95V for Read and Write operations
• Organization
- 16,777,216 x 16 bit ( Word Mode Only)
• Multiplexed Data and Address for reduction of interconnections
- A/DQ0 ~ A/DQ15
• Read While Program/Erase Operation
• Multiple Bank Architecture
- 16 Banks (16Mb Partition)
• OTP Block : Extra 512-Word block
• Read Access Time (@ CL=30pF)
- Asynchronous Random Access Time : 100ns
- Synchronous Random Access Time :95ns
- Burst Access Time :
11ns (66MHz) / 9ns (83MHz) / 7ns (108MHz) /6ns (133MHz)
• Burst Length :
- Continuous Linear Burst
- Linear Burst : 8-word & 16-word with Wrap
• Block Architecture
- Uniform block part (K8S(54/55/56/57)15EZC) : Two hundred fifty six
64Kword blocks
- Boot block part (K8S(54/55/56/57)15ET(B)C) : Four 16Kword blocks
and two hundred fifty five 64Kword blocks (Bank 0 contains four 16 Kword
blocks and fifteen 64Kword blocks, Bank 1 ~ Bank 15 contain two hundred
forty 64Kword blocks)
The K8S(54/55/56/57)15E featuring single 1.8V power supply is a 256Mbit
Muxed Burst Multi Bank Flash Memory organized as 16Mx16. The memory
architecture of the device is designed to divide its memory arrays into
256blocks(Uniform block part)/259 blocks(Boot block part) with independent hardware protection. This block architecture provides highly flexible
erase and program capability. The K8S(54/55/56/57)15E NOR Flash consists of sixteen banks. This device is capable of reading data from one bank
while programming or erasing in the other bank. Regarding read access
time, the K8S54/5615E provides an 11ns burst access time and an 95ns
initial access time at 66MHz. At 83MHz, the K8S54/5615E provides an 9ns
burst access time and an 95ns initial access time. At 108MHz, the K8S55/
5715E provides an 7ns burst access time and an 95ns initial access time.
At 133MHz, the K8S55/5715E provides an 6ns burst access time and an
95ns initial access time. The device performs a program operation in units
of 16 bits (Word) and erases in units of a block. Single or multiple blocks
can be erased. The block erase operation is completed within typically
0.6sec. The device requires 25mA as program/erase current in the
extended temperature ranges.
The K8S(54/55/56/57)15E NOR Flash Memory is created by using Samsung's advanced CMOS process technology.
• Reduce program time using the VPP
• Support 32-word Buffer Program
• Power Consumption (Typical value, CL=30pF)
- Synchronous Read Current : 35mA at 133MHz
- Program/Erase Current : 25mA
- Read While Program/Erase Current : 45mA
- Standby Mode/Auto Sleep Mode : 30uA
• Block Protection/Unprotection
- Using the software command sequence
- Last two boot blocks are protected by WP=VIL
(Boot block part : K8S(54/55/56/57)15ET(B)C)
- Last one block (BA255) is protected by WP=VIL
(Uniform block part : K8S(54/55/56/57)15EZC)
- All blocks are protected by VPP=VIL
• Handshaking Feature
- Provides host system with minimum latency by monitoring RDY
• Erase Suspend/Resume
• Program Suspend/Resume
• Unlock Bypass Program/Erase
• Hardware Reset (RESET)
• Deep Power Down Mode
• Data Polling and Toggle Bits
- Provides a software method of detecting the status of program
or erase completion
• Endurance
- 100K Program/Erase cycles
• Extended Temperature : -25°C ~ 85°C
• Support Common Flash Memory Interface
• Low Vcc Write Inhibit
• Output Driver Control by Configuration Register
• Package : 44-Ball FBGA type (7.7mm x 6.2mm), 0.5mm ball pitch
1.0mm(Max.)Thickness
3.0 PIN DESCRIPTION
Pin Name
-5-
Pin Function
A16 - A23
Address Inputs
A/DQ0 - A/DQ15
Multiplexed Address/Data input/output
CE
Chip Enable
OE
Output Enable
RESET
Hardware Reset
VPP
Accelerates Programming
WE
Write Enable
WP
Hardware Write Protection Input
CLK
Clock
RDY
Ready Output
AVD
Address Valid Input
DPD
Deep Power Down
Vcc
Power Supply
VSS
Ground
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
4.0 44Ball FBGA TOP VIEW (BALL DOWN)
1
2
3
4
5
6
7
8
9
10
A
RDY
A21
VSS
CLK
VCC
WE
VPP
A19
A17
A22
B
VCC
A16
A20
AVD
A23
RESET
WP
A18
CE
VSS
C
VSS
A/DQ7
A/DQ6
A/DQ13
A/DQ12
A/DQ3
A/DQ2
A/DQ9
A/DQ8
OE
D
A/DQ15
A/DQ14
VSS
A/DQ5
A/DQ4
A/DQ11
A/DQ10
VCC
A/DQ1
A/DQ0
-6-
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
5.0 FUNCTIONAL BLOCK DIAGRAM
Bank 0
Address
X
Dec
Vcc
Vss
Vpp
CLK
CE
OE
WE
WP
RESET
RDY
AVD
DPD
I/O
Interface
&
Bank
Control
Bank 0
Cell Array
Y Dec
Latch &
Control
Y Dec
Latch &
Control
Bank 1
Address
X
Dec
Bank 1
Cell Array
Bank 15
Address
X
Dec
Bank 15
Cell Array
Y Dec
A16~A23
A/DQ0~
A/DQ15
Erase
Control
Block
Inform
Program
Control
-7-
Latch &
Control
High
Voltage
Gen.
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
6.0 ORDERING INFORMATION
K8 S 56 15 E T B - S E 1F
Samsung
NOR Flash Memory
Access Time
1F : Refer to Table 1
Device Type
S : Multiplexed Burst
Operating Temperature Range
C : Commercial Temp. (0 °C to 70 °C)
E : Extended Temp. (-25 °C to 85 °C)
Density(*Note)
54 : 256Mbits for 66/83MHz(Sync MRS)
55 : 256Mbits for 108/133MHz(Sync MRS)
56 : 256Mbits for 66/83MHz(No option)
57 : 256Mbits for 108/133MHz(No option)
Package
S : FBGA (Lead Free,OSP)
F : FBGA
D : FBGA(Lead Free)
Version
B : 3rd Generation
Organization
15 : x16 Organization
Block Architecture
T : Top Boot Block, B : Bottom Boot Block
Z : Uniform Block
Operating Voltage Range
E : 1.7 V to 1.95V
NOTE
Density : (1) 54 : 256Mb for 66/83Mhz with the Sync MRS option
(2) 55 : 256Mb for 108/133Mhz with the Sync MRS option
(3) 56 : 256Mb for 66/83Mhz with no option
(4) 57 : 256Mb for 108/133Mhz with no option
[Table 1] PRODUCT LINE-UP
K8S(54/55/56/57)15E
Speed Option
1C
(66MHz)
1D
(83MHz)
1E
(108MHz)
1F
(133MHz)
Max. Initial Access Time (tIAA, ns)
95
95
95
95
Max. Burst Access Time (tBA, ns)
11
9
7
6
Mode
Synchronous/Burst
VCC=1.7V
-1.95V
Asynchronous
Max. Access Time (tAA, ns)
100
100
100
100
Max. CE Access Time (tCE, ns)
100
100
100
100
Max. OE Access Time (tOE, ns)
15
15
15
15
[Table 2] PRODUCT Classification
Speed/Boot Option
Top
Bottom
Uniform
256Mb for 66/83MHz (Sync MRS option)
K8S5415ETC
K8S5415EBC
K8S5415EZC
256Mb for 108/133MHz (Sync MRS option)
K8S5515ETC
K8S5515EBC
K8S5515EZC
256Mb for 66/83MHz
K8S5615ETC
K8S5615EBC
K8S5615EZC
256Mb for 108/133MHz
K8S5715ETC
K8S5715EBC
K8S5715EZC
[Table 3] K8S(54/55/56/57)15E DEVICE BANK DIVISIONS
Bank 0 ~ Bank 15
Type
256Mbit (Boot block part)
Block Sizes
Four 16Kword blocks and two hundred fifty five 64Kword blocks
256Mbit (Uniform block part)
Two hundred fifty six 64Kword blocks
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Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
[Table 4] K8S(54/55/56/57)15EZC DEVICE BANK DIVISIONS (Uniform block)
Bank
Bank size
Quantity of Blocks
Block Size
0
16Mb
16
64 Kwords
1
16Mb
16
64 Kwords
2
16Mb
16
64 Kwords
3
16Mb
16
64 Kwords
4
16Mb
16
64 Kwords
5
16Mb
16
64 Kwords
6
16Mb
16
64 Kwords
7
16Mb
16
64 Kwords
8
16Mb
16
64 Kwords
9
16Mb
16
64 Kwords
10
16Mb
16
64 Kwords
11
16Mb
16
64 Kwords
12
16Mb
16
64 Kwords
13
16Mb
16
64 Kwords
14
16Mb
16
64 Kwords
15
16Mb
16
64 Kwords
Quantity of Blocks
Block Size
4
16 Kwords
15
64 Kwords
[Table 5] K8S(54/55/56/57)15ETC DEVICE BANK DIVISIONS (Top Boot block)
Bank
Bank size
0
16Mb
1
16Mb
16
64 Kwords
2
16Mb
16
64 Kwords
3
16Mb
16
64 Kwords
4
16Mb
16
64 Kwords
5
16Mb
16
64 Kwords
6
16Mb
16
64 Kwords
7
16Mb
16
64 Kwords
8
16Mb
16
64 Kwords
9
16Mb
16
64 Kwords
10
16Mb
16
64 Kwords
11
16Mb
16
64 Kwords
12
16Mb
16
64 Kwords
13
16Mb
16
64 Kwords
14
16Mb
16
64 Kwords
15
16Mb
16
64 Kwords
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Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
[Table 6] K8S(54/55/56/57)15EBC DEVICE BANK DIVISIONS (Bottom Boot block)
Bank
Bank size
Quantity of Blocks
Block Size
15
16Mb
16
64 Kwords
14
16Mb
16
64 Kwords
13
16Mb
16
64 Kwords
12
16Mb
16
64 Kwords
11
16Mb
16
64 Kwords
10
16Mb
16
64 Kwords
9
16Mb
16
64 Kwords
8
16Mb
16
64 Kwords
7
16Mb
16
64 Kwords
6
16Mb
16
64 Kwords
5
16Mb
16
64 Kwords
4
16Mb
16
64 Kwords
3
16Mb
16
64 Kwords
2
16Mb
16
64 Kwords
1
16Mb
16
64 Kwords
0
16Mb
15
64 Kwords
4
16 Kwords
- 10 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
7.0 PRODUCT INTRODUCTION
The K8S(54/55/56/57)15E is an 256Mbit (268,435,456 bits) NOR-type Burst Flash memory. The device features 1.8V single voltage power supply operating within the range of 1.7V to 1.95V. The device is programmed by using the Channel Hot Electron (CHE) injection mechanism which is used to program
EPROMs. The device is erased electrically by using Fowler-Nordheim tunneling mechanism. To provide highly flexible erase and program capability, the
device adapts a block memory architecture that divides its memory array into 256 blocks (64-Kword x 256 blocks, Uniform block part) / 259 blocks (16Kword x 4 + 64-Kword x 255, Boot block part). Programming is done in units of 16 bits (Word). All bits of data in one or multiple blocks can be erased
when the device executes the erase operation. To prevent the device from accidental erasing or over-writing the programmed data, 256 / 259 memory
blocks can be hardware protected. Regarding read access time, at 66MHz, the K8S54/5615E provides a burst access of 11ns with initial access times of
95ns at 30pF. At 83MHz, the K8S54/5615E provides a burst access of 9ns with initial access times of 95ns at 30pF. At 108MHz, the K8S55/5715E provides a burst access of 7ns with initial access times of 95ns at 30pF. At 133MHz, the K8S55/5715E provides a burst access of 6ns with initial access
times of 95ns at 30pF. The command set of K8S(54/55/56/57)15E is compatible with standard Flash devices. The device uses Chip Enable (CE), Write
Enable (WE), Address Valid(AVD) and Output Enable (OE) to control asynchronous read and write operation. For burst operations, the device additionally
requires Ready (RDY) and Clock (CLK). Device operations are executed by selective command codes. The command codes to be combined with
addresses and data are sequentially written to the command registers using microprocessor write timing. The command codes serve as inputs to an internal state machine which controls the program/erase circuitry. Register contents also internally latch addresses and data necessary to execute the program and erase operations. The K8S(54/55/56/57)15E is implemented with Internal Program/Erase Routines to execute the program/erase operations.
The Internal Program/Erase Routines are invoked by program/erase command sequences. The Internal Program Routine automatically programs and
verifies data at specified addresses. The Internal Erase Routine automatically pre-programs the memory cell which is not programmed and then executes
the erase operation. The K8S(54/55/56/57)15E has means to indicate the status of completion of program/erase operations. The status can be indicated
via Data polling of DQ7, or the Toggle bit (DQ6). Once the operations have been completed, the device automatically resets itself to the read mode. The
device requires only 35mA as burst and asynchronous mode read current and 25mA for Buffer program/erase operations.
[Table 7] Device Bus Operations
Operation
Asynchronous Read Operation
Write
Standby
Hardware Reset
Load Initial Burst Address
Burst Read Operation
Terminate Burst Read Cycle
Terminate Burst Read Cycle via RESET
Terminate Current Burst Read Cycle and Start
New Burst Read Cycle
CE
OE
WE
A16-23
A/DQ0-15
RESET
CLK
L
L
H
Add In
Add In/DOUT
H
L
L
H
L
Add In
Add In / DIN
H
L
H
X
X
X
High-Z
H
X
X
X
X
X
X
High-Z
L
X
X
L
H
H
Add In
Add In
H
L
L
H
X
Burst
DOUT
H
H
X
X
X
High-Z
H
X
X
X
X
X
X
High-Z
L
X
X
L
H
H
Add In
Add In
H
NOTE : L=VIL (Low), H=VIH (High), X=Don’t Care.
- 11 -
AVD
H
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
8.0 COMMAND DEFINITIONS
The K8S(54/55/56/57)15E operates by selecting and executing its operational modes. Each operational mode has its own command set. In order to
select a certain mode, a proper command with specific address and data sequences must be written into the command register. Writing incorrect information which include address and data or writing an improper command will reset the device to the read mode. The defined valid register command
sequences are stated in Table 8.
[Table 8] Command Sequences
Command Definitions
Asynchronous Read
Cycle
Add
Data
Add
Reset 5),20)
Data
Add
Autoselect
Manufacturer ID
6)
Data
Autoselect
Add
Device ID6)
Data
Autoselect
Add
Block Protection Verify 7)
Data
Autoselect
Add
Handshaking
6), 8)
Program
Unlock Bypass
Unlock Bypass Program 9)
Unlock Bypass Block Erase 9)
Unlock Bypass Chip Erase 9)
Unlock Bypass Reset
Chip Erase
Block Erase
Erase Suspend 10)
Erase Resume11)
Program Suspend 12)
Program Resume 11)
Block Protection/Unprotection 13)
CFI Query 14)
Data
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
1
1
4
4
4
4
4
3
2
2
2
2
6
6
1
1
1
1
3
1
1st Cycle
2nd Cycle 3rd Cycle
4th Cycle
5th Cycle
6th Cycle
2AAH
555H
RA
RD
XXXH
F0H
555H
2AAH
(DA)555H
(DA)X00H
AAH
55H
90H
ECH
555H
2AAH
(DA)555H
(DA)X01H
AAH
55H
90H
NOTE6
555H
2AAH
(BA)555H
(BA)X02H
AAH
55H
90H
555H
2AAH
(DA)555H
00H / 01H
(DA)X03H
AAH
55H
90H
0H/1H
555H
2AAH
555H
PA
PD
AAH
55H
A0H
555H
2AAH
555H
AAH
55H
20H
XXX
PA
A0H
PD
XXX
BA
80H
30H
XXXH
XXXH
80H
10H
XXXH
XXXH
90H
00H
555H
2AAH
555H
555H
AAH
55H
80H
AAH
55H
10H
555H
2AAH
555H
555H
2AAH
BA
AAH
55H
80H
AAH
55H
30H
XXX
XXX
ABP
60H
60H
60H
(DA)XXXH
B0H
(DA)XXXH
30H
(DA)XXXH
B0H
(DA)XXXH
30H
(DA)X55H
98H
- 12 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
Command Definitions
Write to Buffer 15)
Program buffer to Flash 15)
Write to Buffer Abort Reset 16),19)
Set Burst Mode Configuration Register 17),18)
Enter OTP Block Region
Exit OTP Block Region
Cycle
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
Add
Data
3
1
3
3
3
4
1st Cycle
2nd Cycle
3rd Cycle
4th Cycle
5th Cycle
6th Cycle
555H
2AAH
BA
AAH
55H
25H
BA
PA
WBL
WC
PD
PD
555H
2AAH
XXX
AAH
55H
F0H
555H
2AAH
NOTE 18
AAH
55H
C0H
555H
2AAH
XXX
AAH
55H
70H
555H
2AAH
555H
XXX
AAH
55H
75H
00H
BA
29H
NOTE :
1) RA : Read Address , PA : Program Address, RD : Read Data, PD : Program Data , BA : Block Address (A23 ~ A14), DA : Bank Address (A23 ~ A20)
ABP : Address of the block to be protected or unprotected , DI :Die revision ID, CR : Configuration Register Setting,
WBL : Write Buffer Location, WC : Word Count
2) The 4th cycle data of autoselect mode and RD are output data. The others are input data.
3) Data bits DQ15–DQ8 are don’t care in command sequences, except for RD, PD, WC and Device ID.
4) Unless otherwise noted, address bits A23–A11 are don’t cares.
5) The reset command is required to return to read mode.
If a bank entered the autoselect mode during the erase suspend mode, writing the reset command returns that bank to the erase suspend mode.
If a bank entered the autoselect mode during the program suspend mode, writing the reset command returns that bank to the program suspend mode.
If DQ5 goes high during the program or erase operation, writing the reset command returns that bank to read mode or erase suspend mode if that
bank was in erase suspend mode.
6) The 3rd and 4th cycle bank address of autoselect mode must be same.
Device ID Data : Top(2208H), Bottom(2209H), Uniform(3018H)
7) Normal Block Protection Verify : 00H for an unprotected block and 01H for a protected block.
OTP Block Protect verify (with OTP Block Address after Entering OTP Block) : 00H for unlocked, and 01H for locked.
8) 0H for handshaking, 1H for non-handshaking
9) The unlock bypass command sequence is required prior to this command sequence.
10) The system may read and program in non-erasing blocks when in the erase suspend mode.
The system may enter the autoselect mode when in the erase suspend mode.
The erase suspend command is valid only during a block erase operation, and requires the bank address.
11) The erase/program resume command is valid only during the erase/program suspend mode, and requires the bank address.
12) This mode is used only to enable Data Read by suspending the Program operation.
13) Set ABP(Address of the block to be protected or unprotected) as either A6 = VIH, A1 = VIH and A0 = VIL for unprotected or A6 = VIL, A1 = VIH
and A0 = VIL for protected.
14) Command is valid when the device is in Read mode or Autoselect mode.
15) For Buffer Program, Firstly Enter "Write to Buffer" Command sequence and then Enter Block Address and Word Count which is the number of word
data will be programmed. Word Count is smaller than the number of data wanted to program by one, Example if 15 words are wanted to program
then WC (Word Count) is 14. After Entering Command, Enter PA/PD’s (Program Addresses/ Program Data). Finally Enter "Program buffer to Flash"
Command sequence, This starts a buffer program operation. This Device supports 32-word Buffer Program.
There is some caution points.
- The number of PA/PD’s which are entered must be same to WC+1
- PA’s which are entered must be same A23~A5 address bits because Buffer Address is A23~A5 address and decided by PA entered firstly.
- If PA which are entered isn’t same Buffer Address, then PA/PD which is entered may be ignored and this buffer programming operation is aborted.
To return to normal operation, hardware reset or "Write to Buffer Abort Reset" command is issued.
- Overwrite for program buffer is also prohibited.
16) Command sequence resets device for next command after aborted write-to-buffer operation.
17) See "Set Burst Mode Configuration Register" for details.
18) On the third cycle, the data should be "C0h", address bits A10-A0 should be 101_0101_0101b, and address bits A21-A11 set the code to be latched.
19) After software reset and write to buffer abort reset command, min. 5us recovery time is needed for normal read mode.
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Rev. 1.0
K8S5615ETC
datasheet NOR FLASH MEMORY
9.0 DEVICE OPERATION
The device has inputs/outputs that accept both address and data information. To write a command or command sequence (which includes programming
data to the device and erasing blocks of memory), the system must drive CLK, AVD and CE to VIL and OE to VIH when providing an address to the device,
and drive CLK, WE and CE to VIL and OE to VIH when writing commands or data.
The device provides the unlock bypass mode to save its program time for program operation. Unlike the standard program command sequence which is
comprised of four bus cycles, only two program cycles are required to program a word in the unlock bypass mode. One block, multiple blocks, or the
entire device can be erased. Table 16 indicates the address space that each block occupies. The device’s address space is divided into sixteen banks. A
“bank address” is the address bits required to uniquely select a bank. Similarly, a “block address” is the address bits required to uniquely select a block.
ICC2 in the DC Characteristics table represents the active current specification for the write mode. The AC Characteristics section contains timing specification tables and timing diagrams for write operations.
9.1 Read Mode
The device automatically enters to asynchronous read mode after device power-up. No commands are required to retrieve data in asynchronous mode.
After completing an Internal Program/Erase Routine, each bank is ready to read array data. The reset command is required to return a bank to the read(or
erase-suspend-read)mode if DQ5 goes high during an active program/erase operation, or if the bank is in the autoselect mode.
(1) K8S5415ET(B)(Z)C : 66/83Mhz with the Sync MRS option
(2) K8S5515ET(B)(Z)C : 108/133Mhz with the Sync MRS option
The synchronous(burst) mode will automatically start on the rising edge of the CLK input while AVD is held low after Burst Mode Configuration
Register Setting to A19=1. If several CLKs exist in AVD low, the last rising edge is valid CLK.
(3) K8S5615ET(B)(Z)C : 66/83Mhz with no option
(4) K8S5715ET(B)(Z)C : 108/133Mhz with no option
The synchronous(burst) mode will automatically start on the rising edge of the CLK input while AVD is held low. If several CLKs exist in AVD
low, the last rising edge is valid CLK.
9.1.1 Asynchronous Read Mode
For the asynchronous read mode a valid address should be asserted on A/DQ0-A/DQ15 and A16-A23, while driving CLK and AVD and CE to VIL. WE and
OE should remain at VIH. Note that CLK must remain low for asynchronous read mode. The address is latched at the rising edge of AVD, and then the
system can drive OE to VIL. The data will appear on A/DQ0-A/DQ15. Since the memory array is divided into sixteen banks, each bank remains enabled
for read access until the command register contents are altered.
Address access time (tAA) is equal to the delay from valid addresses to valid output data. The chip enable access time(tCE) is the delay from the falling
edge of CE to valid data at the outputs. The output enable access time(tOE) is the delay from the falling edge of OE to valid data at the output. The asynchronous access time is measured from a valid address, falling edge of AVD or falling edge of CE whichever occurs last. To prevent the memory content
from spurious altering during power transition, the initial state machine is set for reading array data upon device power-up, or after a hardware reset.
9.1.2 Synchronous (Burst) Read Mode
The device is capable of continuous linear burst operation and linear burst operation of a preset length. For the burst mode, the system should
determine how many clock cycles are desired for the initial word(tIAA) of each burst access and what mode of burst operation is desired using
"Burst Mode Configuration Register" command sequences. See "Set Burst Mode Configuration" for further details. The status data also can be
read by synchronous read mode with a bank address which is programming or erasing. This status data by synchronous read mode can be
output and sustained until the system asserts CE high or RESET low or AVD low in conjunction with a new address. To initiate the synchro
nous read again, a new address and AVD pulse is needed after the host has completed status reads or the device has completed the pro
gram or erase operation.
9.1.3 Continuous Linear Burst Read
(1) K8S5415ET(B)(Z)C : 66/83Mhz with the Sync MRS option
(2) K8S5515ET(B)(Z)C : 108/133Mhz with the Sync MRS option
The synchronous(burst) mode will automatically start on the rising edge of the CLK input while AVD is held low after Burst Mode Configuration
Register Setting to A19=1. If several CLKs exist in AVD low, the last rising edge is valid CLK.
(3) K8S5615ET(B)(Z)C : 66/83Mhz with no option
(4) K8S5715ET(B)(Z)C : 108/133Mhz with no option
The synchronous(burst) mode will automatically start on the rising edge of the CLK input while AVD is held low. If several CLKs exist in AVD
low, the last rising edge is valid CLK.
The initial word is output tIAA after the rising edge of the last CLK cycle. Subsequent words are output tBA after the rising edge of each successive clock
cycle, which automatically increments the internal address counter. Note that the device has internal address boundary that occurs every 16 words. When
the device is crossing the first word boundary, additional clock cycles are needed before data appears for the next address. The number of additional
clock cycle can vary from zero to thirteen cycles, and the exact number of additional clock cycle depends on not olny the starting address of burst read but
- 14 -
Rev. 1.0
K8S5615ETC
datasheet NOR FLASH MEMORY
also programmable wait state setting. The RDY output indicates this condition to the system by pulsing low. The device will continue to output sequential
burst data, wrapping around to address 000000h after it reaches the highest addressable memory location until the system asserts CE high or RESET
low or AVD low in conjunction with a new address.(See Table 7.) The reset command does not terminate the burst read operation. When it accesses the
bank is programming or erasing, continuous burst read mode will output status data. And status data will be sustained until the system asserts CE high or
RESET low or AVD low in conjunction with a new address. Note that at least 10ns is needed to start next burst read operation from terminating previous burst read operation in the case of asserting CE high.
8-, 16-Word Linear Burst Read
As well as the Continuous Linear Burst Mode, there are two(8 & 16 word) linear wrap mode, in which a fixed number of words are read from consecutive
addresses. In these modes, the addresses for burst read are determined by the group within which the starting address falls. The groups are sized
according to the number of words read in a single burst sequence for a given mode.(See Table. 9)
[Table 9] Burst Address Groups(Wrap mode only)
Burst Mode
Group Size
Group Address Ranges
8 word
8 words
0-7h, 8-Fh, 10-17h, ....
16 word
16 words
0-Fh, 10-1Fh, 20-2Fh, ....
As an example: In wrap mode case, if the starting address in the 8-word mode is 2h, the address range to be read would be 0-7h, and the wrap burst
sequence would be 2-3-4-5-6-7-0-1h. The burst sequence begins with the starting address written to the device, but wraps back to the first address in the
selected group. In a similar manner, 16-word wrap mode begins its burst sequence on the starting address written to the device, and then wrap back to
the first address in the selected address group.
9.2 Programmable Wait State
The programmable wait state feature indicates to the device the number of additional clock cycles that must elapse after AVD is driven from low to high for
burst read mode. Upon power up, the number of total initial access cycles defaults to fourteen.
9.3 Handshaking
The handshaking feature allows the host system to simply monitor the RDY signal from the device to determine when the initial word of burst data is ready
to be read. To set the number of initial cycle for optimal burst mode, the host should use the programmable wait state configuration.(See "Set Burst Mode
Configuration Register" for details.) The rising edge of RDY after OE goes low indicates the initial word of valid burst data. (RDY can be low active by
Extended configuration register A11 settng : RDY low indicates data valid) Using the autoselect command sequence, the handshaking feature will be verified in the device.
9.4 Set Burst Mode Configuration Register
The device uses a configuration register to set the various burst parameters : the number of initial cycles for burst and burst read mode. The burst mode
configuration register must be set before the device enters burst mode. The burst mode configuration register is loaded with a three-cycle command
sequences. On the third cycle, the data should be C0h, address bits A10-A0 should be 101_0101_0101b, and address bits A21-A11 set the code to be
latched. The device returns to default setting after power up or hardware reset.
9.4.1 Programmable Wait State Configuration
This feature informs the device the number of clock cycles that must elapse after AVD is driven from low to high before data will be available. This value
is determined by the input frequency of the device. Address bits A14-A11 determine the setting. (See Configuration Register table 10.) The Programmable wait state setting instructs the device to set a particular number of clock cycles for the initial access in burst mode. Note that hardware reset will revert
the wait state to the default setting, that is 14 initial cycles.
9.4.2 Burst Read Mode Setting
The device supports three different burst read modes : continuous linear mode, 8 and 16 word linear burst modes with wrap.
9.4.3 RDY Configuration
By default, the RDY pin will be high whenever there is valid data on the output. (RDY can be low active by Extended configuration register A11 settng :
RDY low indicates data valid) The device can be set so that RDY goes active one data cycle before active data. Address bit A18 determines this setting.
The RDY pin behaves same way in word boundary crossing case.
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Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
[Table 10] Burst Mode Configuration Register Table : K8S54(55)15ET(B)(Z)C : 66/83/108/133Mhz with the Sync MRS option
Address Bit
Function
Settings(Binary)
A19
Read Mode
1 = Synchronous Burst Read Mode
0 = Asynchronous Read Mode (default)
A18
RDY Active
1 = RDY active one clock cycle before data
0 = RDY active with data(default)
A17
A16
000 = Continuous(default)
001 = 8-word linear with wrap
010 = 16-word linear with wrap
011~111 = Reserve
Burst Read Mode
A15
A14
0000 = Data is valid on the 4th active CLK edge after AVD transition to VIH
0001 = Data is valid on the 5th active CLK edge after AVD transition to VIH (40Mhz*)
0010 = Data is valid on the 6th active CLK edge after AVD transition to VIH (50/54Mhz*)
0011 = Data is valid on the 7th active CLK edge after AVD transition to VIH (60/66Mhz*)
0100 = Data is valid on the 8th active CLK edge after AVD transition to VIH (70Mhz*)
0101 = Data is valid on the 9th active CLK edge after AVD transition to VIH (80/83Mhz*)
0110 = Data is valid on the 10th active CLK edge after AVD transition to VIH (90/100Mhz*)
0111 = Data is valid on the 11th active CLK edge after AVD transition to VIH (108/110Mhz*)
1000 = Data is valid on the 12th active CLK edge after AVD transition to VIH (120Mhz*)
1001 = Data is valid on the 13th active CLK edge after AVD transition to VIH (133Mhz*,default)
1010 = Data is valid on the 14th active CLK edge after AVD transition to VIH
1011 = Data is valid on the 15th active CLK edge after AVD transition to VIH
A13
A12
Programmable Wait State
A11
NOTE :
Initial wait state should be set according to it’s clock frequency. Table 10 recommend the program wait state for each clock frequencies.
Not 100% tested
[Table 11] Burst Mode Configuration Register Table : K8S56(57)15ET(B)(Z)C : 66/83/108/133Mhz with no option
Address Bit
Function
A18
Settings(Binary)
1 = RDY active one clock cycle before data
0 = RDY active with data(default)
RDY Active
A17
A16
000 = Continuous(default)
001 = 8-word linear with wrap
010 = 16-word linear with wrap
011~111 = Reserve
Burst Read Mode
A15
A14
0000 = Data is valid on the 4th active CLK edge after AVD transition to VIH
0001 = Data is valid on the 5th active CLK edge after AVD transition to VIH (40Mhz*)
0010 = Data is valid on the 6th active CLK edge after AVD transition to VIH (50/54Mhz*)
0011 = Data is valid on the 7th active CLK edge after AVD transition to VIH (60/66Mhz*)
0100 = Data is valid on the 8th active CLK edge after AVD transition to VIH (70Mhz*)
0101 = Data is valid on the 9th active CLK edge after AVD transition to VIH (80/83Mhz*)
0110 = Data is valid on the 10th active CLK edge after AVD transition to VIH (90/100Mhz*)
0111 = Data is valid on the 11th active CLK edge after AVD transition to VIH (108/110Mhz*)
1000 = Data is valid on the 12th active CLK edge after AVD transition to VIH (120Mhz*)
1001 = Data is valid on the 13th active CLK edge after AVD transition to VIH (133Mhz*,default)
1010 = Data is valid on the 14th active CLK edge after AVD transition to VIH
1011 = Data is valid on the 15th active CLK edge after AVD transition to VIH
A13
A12
Programmable Wait State
A11
NOTE :
Initial wait state should be set according to it’s clock frequency. Table 11 recommend the program wait state for each clock frequencies.
Not 100% tested
[Table 12] Burst Address Sequences
Wrap
Burst Address Sequence
Start
Addr.
Continuous Burst
8-word Burst
16-word Burst
0
0-1-2-3-4-5-6...
0-1-2-3-4-5-6-7
0-1-2-3 ... -D-E-F
1
1-2-3-4-5-6-7...
1-2-3-4-5-6-7-0
1-2-3-4 ... -E-F-0
2
2-3-4-5-6-7-8...
2-3-4-5-6-7-0-1
2-3-4-5 ... -F-0-1
.
.
.
.
.
.
.
.
- 16 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
9.5 Autoselect Mode
By writing the autoselect command sequences to the system, the device enters the autoselect mode. This mode can be read only by asynchronous read
mode. The system can then read autoselect codes from the internal register(which is separate from the memory array). Standard asynchronous read
cycle timings apply in this mode. The device offers the Autoselect mode to identify manufacturer and device type by reading a binary code. In addition,
this mode allows the host system to verify the block protection or unprotection. Table 13 shows the address and data requirements. The autoselect command sequence may be written to an address within a bank that is in the read mode, erase-suspend-read mode or program-suspend-read mode. The
autoselect command may not be written while the device is actively programming or erasing in the device. The autoselect command sequence is initiated
by first writing two unlock cycles. This is followed by a third write cycle that contains the address and the autoselect command. Note that the block
address is needed for the verification of block protection. The system may read at any address within the same bank any number of times without initiating another autoselect command sequence. And the burst read should be prohibited during Autoselect Mode. To terminate the autoselect operation, write
Reset command(F0H) into the command register.
[Table 13] Autoselect Mode Description
Description
Address
Read Data
Manufacturer ID
(DA) + 00H
ECH
Device ID
(DA) + 01H
Top boot(2208H), Bottom boot(2209H), Uniform block(3018H)
Block Protection/Unprotection
(BA) + 02H
01H (protected), 00H (unprotected)
Handshaking
(DA) + 03H
0H : handshaking, 1H : non-handshaking
9.6 Standby Mode
When the CE inputs is held at VCC ± 0.2V, and the system is not reading or writing, the device enters Stand-by mode to minimize the power consumption.
In this mode, the device outputs are placed in the high impedence state, independent of the OE input. When the device is in either of these standby
modes, the device requires standard access time (tCE) for read access before it is ready to read data. If the device is deselected during erasure or programming, the device draws active current until the operation is completed. ICC5 in the DC Characteristics table represents the standby current specification.
9.7 Automatic Sleep Mode
The device features Automatic Sleep Mode to minimize the device power consumption during both asynchronous and burst mode. When addresses
remain stable for tAA+60ns, the device automatically enables this mode. The Automatic sleep mode is depends on the CE, WE and OE signal, so CE, WE
and OE signals are held at any state. In a sleep mode, output data is latched and always available to the system. When OE is active, the device provides
new data without wait time. Automatic sleep mode current is equal to standby mode current.
9.8 Output Disable Mode
When the OE input is at VIH , output from the device is disabled. The outputs are placed in the high impedance state.
9.9 Block Protection & Unprotection
To protect the block from accidental writes, the block protection/unprotection command sequence is used. On power up, all blocks in the device are protected. To unprotect a block, the system must write the block protection/unprotection command sequence. The first two cycles are written: addresses are
don’t care and data is 60h. Using the third cycle, the block address (ABP) and command (60h) is written, while specifying with addresses A6, A1 and A0
whether that block should be protected (A6 = VIL, A1 = VIH, A0 = VIL) or unprotected (A6 = VIH, A1 = VIH, A0 = VIL). After the third cycle, the system can
continue to protect or unprotect additional cycles, or exit the sequence by writing F0h (reset command).
The device offers three types of data protection at the block level :
• The block protection/unprotection command sequence disables or re-enables both program and erase operations in any block.
• When WP is at VIL, the two outermost blocks are protected.(Boot block part : K8S(54/55/56/57)15ET(B)C)
• When WP is at VIL, the last one block (BA255) is protected.(Uniform block part :K8S(54/55/56/57)15EZC)
• When VPP is at VIL, all blocks are protected.
Note that user never float the Vpp and WP, that is, Vpp is always connected with VIH, VIL or VID and WP is VIH or VIL.
9.10 Hardware Reset
The device features a hardware method of resetting the device by the RESET input. When the RESET pin is held low(VIL) for at least a period of tRP, the
device immediately terminates any operation in progress, tristates all outputs, and ignores all read/write commands for the duration of the RESET pulse.
The device also resets the internal state machine to asynchronous read mode. To ensure data integrity, the interrupted operation should be reinitiated
once the device is ready to accept another command sequence. The RESET pin may be tied to the system reset pin. If a system reset occurs during the
Internal Program or Erase Routine, the device will be automatically reset to the asynchronous read mode;
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Rev. 1.0
K8S5615ETC
datasheet NOR FLASH MEMORY
this will enable the systems microprocessor to read the boot-up firmware from the Flash memory. If RESET is asserted during a program or erase operation, the device requires a time of tREADY (during Internal Routines) before the device is ready to read data again. If RESET is asserted when a program
or erase operation is not executing, the reset operation is completed within a time of tREADY (not during Internal Routines). tRH is needed to read data
after RESET returns to VIH. Refer to the AC Characteristics tables for RESET parameters and to Figure 12 for the timing diagram. When RESET is at
logic high, the device is in standard operation.
9.11 Software Reset
The reset command provides that the bank is reseted to read mode, erase-suspend-read mode or program-suspend-read mode. The addresses are in
Don’t Care state. The reset command may be written between the sequence cycles in an erase command sequence before erasing begins, or in an program command sequence before programming begins. If the device begins erasure or programming, the reset command is ignored until the operation is
completed. If the program command sequence is written to a bank that is in the Erase Suspend mode, writing the reset command returns that bank to the
erase-suspend-read mode. The reset command valid between the sequence cycles in an autoselect command sequence. In an autoselect mode, the
reset command must be written to return to the read mode. If a bank entered the autoselect mode while in the Erase Suspend mode, writing the reset
command returns that bank to the erase-suspend-read mode. Also, if a bank entered the autoselect mode while in the Program Suspend mode, writing
the reset command returns that bank to the program-suspend-read mode. If DQ5 goes high during a program or erase operation, writing the reset command returns the banks to the read mode. (or erase-suspend-read mode if the bank was in Erase Suspend)
9.12 Program
The K8S(54/55/56/57)15E can be programmed in units of a word. Programming is writing 0's into the memory array by executing the Internal Program
Routine. In order to perform the Internal Program Routine, a four-cycle command sequence is necessary. The first two cycles are unlock cycles. The third
cycle is assigned for the program setup command. In the last cycle, the address of the memory location and the data to be programmed at that location
are written. The device automatically generates adequate program pulses and verifies the programmed cell margin by the Internal Program Routine. During the execution of the Routine, the system is not required to provide further controls or timings. During the Internal Program Routine, commands written
to the device will be ignored.
9.13 Accelerated Program
The device provides accelerated program operations through the Vpp input. Using this mode, faster manufacturing throughput at the factory is possible.
When VID is asserted on the Vpp input, the device automatically enters the Unlock Bypass mode, temporarily unprotects any protected blocks, and uses
the higher voltage on the input to reduce the time required for program operations. In accelerated program mode, the system would use a two-cycle program command sequence for only a word program. By removing VID returns the device to normal operation mode.
Note that Read While Accelerated Program(Erase) and Program suspend(Erase suspend) mode are not guaranteed.
• Program/Erase cycling must be limited below 100cycles for optimum performance.
• Ambient temperature requirements : TA = 30°C±10°C
9.14 Write Buffer Programming
Write Buffer Programming allows the system write to a maximum of 32-word in one programming operation. This results in faster effective programming
time than the standard programming algorithms. The Write Buffer Programming command sequence is initi-ated by first writing two unlock cycles. This is
followed by a third write cycle containing the Write Buffer Load command written at the block address in which programming will occur. The fourth cycle
writes the block address and the number of word locations, minus one, to be programmed. For example, if the system will program 19 unique address
locations, then 12h should be written to the device. This tells the device how many write buffer addresses will be loaded with data. The number of locations to program cannot exceed the size of the write buffer or the operation will abort. The fifth cycle writes the first address location and data to be programmed. The write-buffer-page is selected by address bits A23(max.) ~ A5 entered at fifth cycle. All subsequent address/ data pairs must fall
within the selected write-buffer-page, so that all subsequent addresses must have the same address bit A23(max.) ~ A5 as those entered at
fifth cycle. Write buffer locations may be loaded in any order.
Once the specified number of write buffer locations have been loaded, the system must then write the "Program Buffer to Flash" com mand at the block
address. Any other command address/data combination aborts the Write Buffer Programming operation. The device then begins programming. Data polling should be used while monitoring the last address location loaded into the write buffer. DQ7, DQ6, DQ5, and DQ1 should be monitored to determine
the device status during Write Buffer Programming. The write-buffer programming operation can be suspended using the standard program suspend/
resume commands. Upon successful completion of the Write Buffer Programming operation, the device is ready to execute the next command.
Note also that an address loaction cannot be loaded more than once into the write-buffer-page.
The Write Buffer Programming Sequence can be aborted in the following ways:
• Loading a value that is greater than the buffer size(32-word) during then number of word locations to Program step.
(In case, WC > 1FH @Table 8)
• The number of Program address/data pairs entered is different to the number of word locations initially defined with WC (@Table 8)
• Writing a Program address to have a different write-buffer-page with selected write-buffer-page
( Address bits A23(max) ~ A5 are different)
• Writing non-exact "Program Buffer to Flash" command
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Rev. 1.0
K8S5615ETC
datasheet NOR FLASH MEMORY
The abort condition is indicated by DQ1 = 1, DQ7 = DATA (for the last address location loaded), DQ6 = toggle, and DQ5=0. A "Write-to-Buffer-Abort
Reset" command sequence must be written to reset the device for the next operation. Note that the third cycle of Write-to-Buffer-Abort Reset command
sequence is required when using Write-Buffer-Programming features in Unlock Bypass mode.
And from the third cycle to the last cycle of Write to Buffer command is also required when using Write-Buffer-Programming features in Unlock Bypass
mode. A bit cannot be programmed from “0” back to a “1.” Attempting to do so may cause the DQ7 and DQ6 status bits to indicate the operation was successful. However, a succeeding read will show that the data is still “0.” Only erase operations can convert a “0” to a “1."
9.15 Accelerated Write Buffer Programming
The device provides accelerated Write Buffer Program operations through the Vpp input. Using this mode, faster manufacturing throughput at the factory
is possible. When VID is asserted on the Vpp input, the device temporarily unprotects any protected blocks, and uses the higher voltage on the input to
reduce the time required for program operations. In accelerated Write Buffer Program mode, the system must enter "Write to Buffer" and "Program Buffer
to Flash" command sequence to be same as them of normal Write Buffer Programming. Note that the third cycle of "Write to Buffer Abort Reset" command sequence is required in an accelerated mode.
Note that Read While Accelerated Write Buffer Program and Program suspend mode are not guaranteed.
• Program/Erase cycling must be limited below 100cycles for optimum performance.
• Ambient temperature requirements : TA = 30°C±10°C
9.16 Chip Erase
To erase a chip is to write 1′s into the entire memory array by executing the Internal Erase Routine. The Chip Erase requires six bus cycles to write the
command sequence. The erase set-up command is written after first two "unlock" cycles. Then, there are two more write cycles prior to writing the chip
erase command. The Internal Erase Routine automatically pre-programs and verifies the entire memory for an all zero data pattern prior to erasing. The
automatic erase begins on the rising edge of the last WE pulse in the command sequence and terminates when DQ7 is "1". After that the device returns
to the read mode.
9.17 Block Erase
To erase a block is to write 1′s into the desired memory block by executing the Internal Erase Routine. The Block Erase requires six bus cycles to write the
command sequence shown in Table 8. After the first two "unlock" cycles, the erase setup command (80H) is written at the third cycle. Then there are two
more "unlock" cycles followed by the Block Erase command. The Internal Erase Routine automatically pre-programs and verifies the entire memory prior
to erasing it. The block address is latched on the rising edge of AVD , while the Block Erase command is latched on the rising edge of WE. Multiple blocks
can be erased sequentially by writing the sixth bus-cycle. Upon completion of the last cycle for the Block Erase, additional block address and the Block
Erase command (30H) can be written to perform the Multi-Block Erase. For the Multi-Block Erase, only sixth cycle(block address and 30H) is
needed.(Similarly, only second cycle is needed in unlock bypass block erase.) An 50us (typical) "time window" is required between the Block Erase command writes. The Block Erase command must be written within the 50us "time window", otherwise the Block Erase command will be ignored. The 50us
"time window" is reset when the falling edge of the WE occurs within the 50us of "time window" to latch the Block Erase command. During the 50us of
"time window", any command other than the Block Erase or the Erase Suspend command written to the device will reset the device to read mode. After
the 50us of "time window", the Block Erase command will initiate the Internal Erase Routine to erase the selected blocks. Any Block Erase address and
command following the exceeded "time window" may or may not be accepted. No other commands will be recognized except the Erase Suspend command during Block Erase operation.
The device provides accelerated erase operations through the Vpp input. When VID is asserted on the Vpp input, the device automatically enters the
Unlock Bypass mode, temporarily unprotects any protected blocks, and uses the higher voltage on the input to reduce the time required for erase. By
removing VID returns the device to normal operation mode.
9.18 Unlock Bypass
The K8S(54/55/56/57)15E provides the unlock bypass mode to save its operation time. This mode is possible for program, block erase, chip erase, write
to buffer and write to buffer abort reset operation.. There are two methods to enter the unlock bypass mode. The mode is invoked by the unlock bypass
command sequence or the assertion of VID on VPP pin. Unlike the standard program/erase command sequence that contains four bus cycles, the unlock
bypass program/erase command sequence comprises only two bus cycles. The unlock bypass mode is engaged by issuing the unlock bypass command
sequence which is comprised of three bus cycles. Writing first two unlock cycles is followed by a third cycle containing the unlock bypass command (20H).
Once the device is in the unlock bypass mode, the unlock bypass program/erase command sequence is necessary. The unlock bypass program command sequence is comprised of only two bus cycles; writing the unlock bypass program command (A0H) is followed by the program address and data.
This command sequence is the only valid one for programming the device in the unlock bypass mode. Also, The unlock bypass erase command
sequence is comprised of two bus cycles; writing the unlock bypass block erase command(80H-30H) or writing the unlock bypass chip erase command(80H-10H). This command sequences are the only valid ones for erasing the device in the unlock bypass mode. The unlock bypass reset command
sequence is the only valid command sequence to exit the unlock bypass mode. The unlock bypass reset command sequence consists of two bus cycles.
The first cycle must contain the data (90H). The second cycle contains only the data (00H). Then, the device returns to the read mode.
To enter the unlock bypass mode in hardware level, the VID also can be used. By assertion VID on the VPP pin, the device enters the unlock bypass mode.
Also, the all blocks are temporarily unprotected when the device using the VID for unlock bypass mode. To exit the unlock bypass mode, just remove the
asserted VID from the VPP pin.(Note that user never float the Vpp, that is, Vpp is always connected with VIH, VIL or VID.).
- 19 -
Rev. 1.0
K8S5615ETC
datasheet NOR FLASH MEMORY
9.19 Erase Suspend / Resume
The Erase Suspend command interrupts the Block Erase to read or program data in a block that is not being erased. Also, it is possible to protect or
unprotect of the block that is not being erased in erase suspend mode. The Erase Suspend command is only valid during the Block Erase operation
including the time window of 50us. The Erase Suspend command is not valid while the Chip Erase or the Internal Program Routine sequence is running.
When the Erase Suspend command is written during a Block Erase operation, the device requires a maximum of 30us(recovery time) to suspend the
erase operation. Therefore system must wait for 30us(recovery time) to read the data from the bank which include the block being erased. Otherwise,
system can read the data immediately from a bank which don’t include the block being erased without recovery time(max. 30us) after Erase Suspend
command. And, after the maximum 30us recovery time, the device is availble for programming data in a block that is not being erased. But, when the
Erase Suspend command is written during the block erase time window (50us), the device terminates the block erase time window and suspends the
erase operation in about 2us. The system may also write the autoselect command sequence when the device is in the Erase Suspend mode. When the
Erase Resume command is executed, the Block Erase operation will resume. When the Erase Suspend or Erase Resume command is executed, the
addresses are in the bank address which is operating in Erase Suspend or Erase Resume. While erase can be suspended and resumed multiple
times, a minimum 30us is required from resume to the next suspend.
9.20 Program Suspend / Resume
The device provides the Program Suspend/Resume mode. This mode is used to enable Data Read by suspending the Program operation. The device
accepts a Program Suspend command in Program mode(including Program operations performed during Erase Suspend) but other commands are
ignored. After input of the Program Suspend command, 10us is needed to enter the Program Suspend Read mode. Therefore system must wait for
10us(recovery time) to read the data from the bank which include the block being programmed. Otherwise, system can read the data immediately from a
bank which don't include block being programmed without recovery time(max.10us) after Program Suspend command. Like an Erase Suspend mode, the
device can be returned to Program mode by using a Program Resume command. While program can be suspended and resumed multiple times, a
minimum 30us is required from resume to the next suspend.
In the program suspend mode, protect/unprotect command is prohibited.
9.21 Read While Write Operation
The device is capable of reading data from one bank while writing in the other banks. This is so called the Read While Write operation. An erase operation may also be suspended to read from or program to another location within the same bank(except the block being erased). The Read While Write
operation is prohibited during the chip erase operation. Figure 19 shows how read and write cycles may be initiated for simultaneous operation with zero
latency. Refer to the DC Characteristics table for read-while-write current specifications.
9.22 OTP Block Region
The OTP Block feature provides a 512-word Flash memory region that enables permanent part identification through an Electronic Serial Number (ESN).
The OTP Block is customer lockable and shipped with itself unlocked, allowing customers to untilize the that block in any manner they choose. The customer-lockable OTP Block has the Protection Verify Bit (DQ0) set to a "0" for Unlocked state or a "1" for Locked state.
The system accesses the OTP Block through a command sequence (see "Enter OTP Block / Exit OTP Block Command sequence" at Table 8). After the
system has written the "Enter OTP Block" Command sequence, it may read the OTP Block by using the addresses (FFFE00h~FFFFFFh : Top Boot block
device/Uniform block device, 000000h-0001FFh : Bottom Boot block device) normally and may check the Protection Verify Bit (DQ0) by using the
"Autoselect Block Protection Verify" Command sequence with OTP Block address. This mode of operation continues until the system issues the "Exit
OTP Block" Command suquence, a hardware reset or until power is removed from the device. On power-up, or following a hardware reset, the device
reverts to sending commands to main blocks. Note that the Accelerated function and unlock bypass modes are not available when the OTP Block is
enabled.
Customer Lockable
In a Customer lockable device, The OTP Block is one-time programmable and can be locked only once. Note that the Accelerated programming and
Unlock bypass functions are not available when programming the OTP Block. Locking operation to the OTP Block is started by writing the "Enter OTP
Block" Command sequence, and then the "Block Protection" Command seqeunce (Table 8) with an OTP Block address. The Locking operation has to be
above 100us. "Exit OTP Block" commnad sequence and Hardware reset makes locking operation finished and then exiting from OTP Block after 30us.
The OTP Block Lock operation must be used with caution since, once locked, there is no procedure available for unlocking and none of the
bits in the OTP Block space can be modified in any way.
Suspend and resume operation are not supported during OTP protect, nor is OTP protect supported during any suspend operations. After
entering OTP block, program/erase operation on main blocks is prohibited. Enter OTP block command is not allowed while other operation is
excuting.
9.23 Low VCC Write Inhibit
To avoid initiation of a write cycle during Vcc power-up and power-down, a write cycle is locked out for Vcc less than VLKO. If the Vcc < VLKO (Lock-Out
Voltage), the command register and all internal program/erase circuits are disabled. Under this condition the device will reset itself to the read mode.Subsequent writes will be ignored until the Vcc level is greater than VLKO. It is the user’s responsibility to ensure that the control pins are logically correct to
prevent unintentional writes when Vcc is above VLKO.
- 20 -
Rev. 1.0
K8S5615ETC
datasheet NOR FLASH MEMORY
9.24 Write Pulse “Glitch” Protection
Noise pulses of less than 5ns (typical) on OE, CE, AVD or WE do not initiate a write cycle.
9.25 Logical Inhibit
Write cycles are inhibited by holding any one of OE = VIL , CE = VIH or WE = VIH. To initiate a write cycle, CE and WE must be a logical zero while OE is
a logical one.
- 21 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
10.0 FLASH MEMORY STATUS FLAGS
The K8S(54/55/56/57)15E has means to indicate its status of operation in the bank where a program or erase operation is in processes. Address must
include bank address being executed internal routine operation. The status is indicated by raising the device status flag via corresponding DQ pins. The
status data can be read during burst read mode by using AVD signal with a bank address. That means status read is supported in synchronous mode. If
status read is performed, the data provided in the burst read is identical to the data in the initial access. To initiate the synchronous read again, a new
address and AVD pulse is needed after the host has completed status reads or the device has completed the program or erase operation. The corresponding DQ pins are DQ7, DQ6, DQ5, DQ3, DQ2 and DQ1.
[Table 14] Hardware Sequence Flags
Status
DQ7
DQ6
DQ5
DQ3
DQ2
DQ1
Programming
DQ7
Toggle
0
0
1
0
Block Erase or Chip Erase
0
Toggle
0
1
Toggle
0
Erase Suspend Read
Erase Suspended
Block
1
1
0
0
Toggle1)
0
Erase Suspend Read
Non-Erase Suspended Block
Data
Data
Data
Data
Data
Data
Erase Suspend
Program
Non-Erase Suspended Block
DQ7
Toggle
0
0
1
0
Program Suspend Read
Program Suspended
Block
DQ7
1
0
0
Toggle1)
0
Program Suspend Read
Non- program
Suspended Block
Data
Data
Data
Data
Data
Data
DQ7
Toggle
1
0
No Toggle
0
In Progress
Programming
Exceeded
Time Limits
Write-toBuffer3)
Block Erase or Chip Erase
0
Toggle
1
1
(NOTE 2)
0
Erase Suspend Program
DQ7
Toggle
1
0
No Toggle
0
BUSY state
DQ7
Toggle
0
0
No Toggle
0
Exceeded Timing Limits
DQ7
Toggle
1
0
No Toggle
0
ABORT State
DQ7
Toggle
0
0
No Toggle
1
NOTE :
1) DQ2 will toggle when the device performs successive read operations from the erase/program suspended block.
2) If DQ5 is High (exceeded timing limits), successive reads from a problem block will cause DQ2 to toggle.
3) Note that DQ7 during Write-to-Buffer-Programming indicates the data-bar for DQ7 data for the last loaded write-buffer address location.
DQ7 : Data Polling
When an attempt to read the device is made while executing the Internal Program, the complement of the data is written to DQ7 as an indication of the
Routine in progress. When the Routine is completed an attempt to access to the device will produce the true data written to DQ7. When a user attempts
to read the block being erased or bank contains the block, DQ7 will be low. If the device is placed in the Erase/Program Suspend Mode, the status can be
detected via the DQ7 pin. If the system tries to read an address which belongs to a block that is being erase suspended, DQ7 will be high. And, if the system tries to read an address which belongs to a block that is being program suspended, the output will be the true data of DQ7 itself. If a non-erase-suspended or non-program-suspended block address is read, the device will produce the true data to DQ7. If an attempt is made to program a protected
block, DQ7 outputs complements the data for approximately 2us and the device then returns to the Read Mode without changing data in the block. If an
attempt is made to erase a protected block, DQ7 outputs complement data in approximately 100us and the device then returns to the Read Mode without
erasing the data in the block.
DQ6 : Toggle Bit
Toggle bit is another option to detect whether an Internal Routine is in progress or completed. Once the device is at a busy state, DQ6 will toggle. Toggling
DQ6 will stop after the device completes its Internal Routine. If the device is in the Erase/Program Suspend Mode, an attempt to read an address that
belongs to a block that is being erased or programmed will produce a high output of DQ6. If an address belongs to a block that is not being erased or programmed, toggling is halted and valid data is produced at DQ6. If an attempt is made to program a protected block, DQ6 toggles for approximately 2us
and the device then returns to the Read Mode without changing the data in the block. If an attempt is made to erase a protected block, DQ6 toggles for
approximately 100μs and the device then returns to the Read Mode without erasing the data in the block. #OE or #CE should be toggled in each toggle
bit status read.
- 22 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
DQ5 : Exceed Timing Limits
If the Internal Program/Erase Routine extends beyond the timing limits, DQ5 will go High, indicating program/erase failure.
DQ3 : Block Erase Timer
The status of the multi-block erase operation can be detected via the DQ3 pin. DQ3 will go High if 50μs of the block erase time window expires. In this
case, the Internal Erase Routine will initiate the erase operation.Therefore, the device will not accept further write commands until the erase operation is
completed. DQ3 is Low if the block erase time window is not expired. Within the block erase time window, an additional block erase command (30H) can
be accepted. To confirm that the block erase command has been accepted, the software may check the status of DQ3 following each block erase command.
DQ2 : Toggle Bit 2
The device generates a toggling pulse in DQ2 only if an Internal Erase Routine or an Erase/Program Suspend is in progress. When the device executes
the Internal Erase Routine, DQ2 toggles if the bank including an erasing block is read. Although the Internal Erase Routine is in the Exceeded Time Limits, DQ2 toggles only if an erasing block in the Exceeded Time Limits is read. When the device is in the Erase/Program Suspend mode, DQ2 toggles only
if an address in the erasing or programming block is read. If a non-erasing or non-programmed block address is read during the Erase/Program Suspend
mode, then DQ2 will produce valid data. DQ2 will go High if the user tries to program a non-erase suspend block while the device is in the Erase Suspend
mode. #OE or #CE should be toggled in each toggle bit status read.
DQ1 : Buffer Program Abort Indicator
DQ1 indocates whether a Write-to-Buffer operation was aborted. Under these conditions DQ1 produces a "1". The system must issue the Write-to-BufferAbort-Reset command sequence to return the device to reading array data.
RDY: Ready
Normally the RDY signal is used to indicate if new burst data is available at the rising edge of the clock cycle or not. If RDY is low state, data is not valid
at expected time, and if high state, data is valid. Note that, if CE is low and OE is high, the RDY is high state.
Start
Read(DQ0~DQ7)
Valid Address
Start
Read(DQ0~DQ7)
Valid Address
Read(DQ0~DQ7)
Valid Address
DQ7 = Data ?
DQ6 = Toggle ?
Yes
No
Yes
No
No
No
DQ5 = 1 ?
DQ5 = 1 ?
Yes
Yes
Read twice(DQ0~DQ7)
Valid Address
Read(DQ0~DQ7)
Valid Address
No
Yes
DQ6 = Toggle ?
DQ7 = Data ?
Yes
No
Fail
Fail
Pass
Figure 1: Data Polling Algorithms
Pass
Figure 2: Toggle Bit Algorithms
- 23 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
11.0 Deep Power Down
In order to reduce the power consumption of the device, it shall a deep power down mode inplemented on a seperate pin. The deep power down mode is
active when the deep power down signal is activated, high state. In deep power down the device shall turn off all circuitry in order to reach a power consumption of 2uA(typ). The device shall exit the deep power down mode within 75us after that the deep power down signal has been de-activated, set to
low. In deep power down the state of the device chip select shall have no impact on the device power consumption. All programming capabilities of the
device are inhibited.
At the power up, the device shall accept any order of activation of the reset and deep power down signal. The device shall respond within the specified
time for the signal that was deactivated/activated latest. The deep power down mode is activated when DPD pin high state only. If DPD is asserted during
a program or erase operation, the device requires a time of tDP(During Internal Routines) before the device is ready to enter DPD mode.
Note that user never float the DPD that is, DPD is always connected with VIH, VIL.
Deep Power Down (DPD)
Parameter
All Speed Options
Symbol
Min
Typ
Max
DPD Pin High(NOT During Internal Routines)
to DPD Mode*
tDP
100
-
-
DPD Pin High(During Internal Routines)
to DPD Mode*
tDP
20
-
-
twkup
75
-
-
DPD Low Time Before Read*
NOTE : Not 100% tested.
SWITCHING WAVEFORMS
CE, OE
twkup
DPD
tDP
DPD Timings NOT during Internal Routines
≈
CE, OE
twkup
≈
DPD
tDP
DPD Timings during Internal Routines
Figure 3. DPD Timings
- 24 -
Unit
ns
μs
μs
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
12.0 Common Flash Memory Interface
Common Flash Memory Interface is contrived to increase the compatibility of host system software. It provides the specific information of the device, such
as memory size and electrical features. Once this information has been obtained, the system software will know which command sets to use to enable
flash writes, block erases, and control the flash component.
When the system writes the CFI command(98H) to address 55H , the device enters the CFI mode. And then if the system writes the address shown in
Table 15, the system can read the CFI data. Query data are always presented on the lowest-order data outputs(DQ0-7) only. In word(x16) mode, the
upper data outputs(DQ8-15) is 00h. To terminate this operation, the system must write the reset command.
[Table 15] Common Flash Memory Interface Code
Addresses
(Word Mode)
Data
Query Unique ASCII string "QRY"
10H
11H
12H
0051H
0052H
0059H
Primary OEM Command Set
13H
14H
0002H
0000H
Address for Primary Extended Table
15H
16H
0040H
0000H
Alternate OEM Command Set (00h = none exists)
17H
18H
0000H
0000H
Address for Alternate OEM Extended Table (00h = none exists)
19H
1AH
0000H
0000H
Vcc Min. (write/erase)
D7-D4: volt, D3-D0: 100 millivolt
1BH
0017H
Vcc Max. (write/erase)
D7-D4: volt, D3-D0: 100 millivolt
1CH
0019H
Vpp(Acceleration Program) Supply Minimum
00 = Not Supported, D7 - D4 : Volt, D3 - D0 : 100mV
1DH
0085H
Vpp(Acceleration Program) Supply Maximum
00 = Not Supported, D7 - D4 : Volt, D3 - D0 : 100mV
1EH
0095H
Typical timeout per single word write 2N us
1FH
0008H
Typical timeout for Max buffer write 2N us(00H = not supported)
20H
0009H
Typical timeout per individual block erase 2N ms
21H
000AH
Typical timeout for full chip erase 2N ms(00H = not supported)
22H
0012H
Max. timeout for word write 2 times typical
23H
0001H
Max. timeout for buffer write 2 times typical
24H
0001H
Max. timeout per individual block erase 2N times typical
25H
0004H
Description
N
N
Max. timeout for full chip erase 2 times typical(00H = not supported)
26H
0000H
Device Size = 2N byte
27H
0019H
Flash Device Interface description
28H
29H
0000H
0000H
Max. number of byte in multi-byte write = 2N
2AH
2BH
0006H
0000H
Number of Erase Block Regions within device1)
2CH
0002H
Erase Block Region 1 Information (Boot block part : (K8S(54/55/56/57)ET(B)C) )
Bits 0~15: y+1=block number
Bits 16~31: block size= z x 256bytes
2DH
2EH
2FH
30H
0003H
0000H
0080H
0000H
N
- 25 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
Addresses
(Word Mode)
Data
Erase Block Region 1 Information (Uniform block part : (K8S(54/55/56/57)EZC) )
Bits 0~15: y+1=block number
Bits 16~31: block size= z x 256bytes
2DH
2EH
2FH
30H
00FFH
0000H
0000H
0002H
Erase Block Region 2 Information (Boot block part : (K8S(54/55/56/57)ET(B)C) )
31H
32H
33H
34H
00FEH
0000H
0000H
0002H
31H
32H
33H
34H
0000H
0000H
0000H
0000H
Erase Block Region 3 Information
35H
36H
37H
38H
0000H
0000H
0000H
0000H
Erase Block Region 4 Information
39H
3AH
3BH
3CH
0000H
0000H
0000H
0000H
Query-unique ASCII string "PRI"
40H
41H
42H
0050H
0052H
0049H
Major version number, ASCII
43H
0030H
Minor version number, ASCII
44H
0030H
Address Sensitive Unlock(Bits 1-0)
0 = Required, 1= Not Required
Silcon Revision Number(Bits 7-2)
45H
0000H
Erase Suspend
0 = Not Supported, 1 = To Read Only, 2 = To Read & Write
46H
0002H
Block Protect
00 = Not Supported, 01 = Supported
47H
0001H
Block Temporary Unprotect 00 = Not Supported, 01 = Supported
48H
0000H
Block Protect/Unprotect scheme 00 = Not Supported, 01 = Supported
49H
0001H
Simultaneous Operation
00 = Not Supported, 01 = Supported
4AH
0001H
Burst Mode Type 00 = Not Supported, 01 = Supported
4BH
0001H
Page Mode Type
00 = Not Supported, 01 = 4 Word Page, 02 = 8 Word Page, 03 = 16 Word Page
4CH
0000H
Top/Bottom Boot/Uniform Block Flag
02H = Bottom Boot Device, 03H = Top Boot Device, 04H = Uniform Device
4DH
0003H
Max. Operating Clock Frequency (MHz ) 2)
4EH
0085H
RWW(Read While Write) Functionality Restriction (00H = non exists , 01H = exists)
4FH
0000H
Handshaking
00 = Not Supported at both mode, 01 = Supported at Sync. Mode
10 = Supported at Async. Mode, 11 = Supported at both Mode
50H
0001H
Description
Erase Block Region 2 Information (Uniform block part : (K8S(54/55/56/57)EZC) )
NOTE :
1) Uniform block part (K8S(54/55/56/57)EZC) : Data is 01H
Boot block part (K8S(54/55/56/57)ET(B)C) : Data is 02H
2) Max. Operating Clock Frequency : Data is 85H in 108/133Mhz part (K8S(55/57)15E(T/B/Z)C), Data is 53H in 66/83Mhz part (K8S(54/56)15E(T/B/Z)C)
- 26 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
13.0 ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Rating
Vcc
-0.5 to +2.5
Vcc
Voltage on any pin relative to VSS
VPP
V
-0.5 to +9.5
VIN
All Other Pins
Unit
-0.5 to +2.5
Storage Temperature
Tstg
-65 to +100
°C
Short Circuit Output Current
IOS
5
mA
TA (Commercial Temp.)
0 to +70
°C
TA (Extended Temp.)
-25 to + 85
°C
Operating Temperature
NOTE :
1) Minimum DC voltage is -0.5V on Input/ Output pins. During transitions, this level may fall to -2.0V for periods <20ns.
Maximum DC voltage is Vcc+0.6V on input / output pins which, during transitions, may overshoot to Vcc+2.0V for periods <20ns.
2) Minimum DC input voltage is -0.5V on VPP . During transitions, this level may fall to -2.0V for periods <20ns.
Maximum DC input voltage is +9.5V on VPP which, during transitions, may overshoot to +12.0V for periods <20ns.
3) Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to the conditions
detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
14.0 RECOMMENDED OPERATING CONDITIONS ( Voltage reference to GND )
Parameter
Symbol
Min
Typ.
Max
Unit
Supply Voltage
VCC
1.7
1.8
1.95
V
Supply Voltage
VSS
0
0
0
V
NOTE :
1) Data retention is not guaranteed on Operating condition Extended temperature(-25’C~85’C) over.
- 27 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
15.0 DC CHARACTERISTICS
Parameter
Input Leakage Current
Symbol
Test Conditions
Min
Typ
Max
Unit
ILI
VIN=VSS to VCC, VCC=VCCmax
- 1.0
-
+ 1.0
μA
VCC=VCCmax , VPP=VCCmax
- 1.0
-
+ 1.0
μA
VPP Leakage Current
ILIP
VCC=VCCmax , VPP=9.5V
-
-
35
μA
Output Leakage Current
ILO
VOUT=VSS to VCC, VCC=VCCmax, OE=VIH
- 1.0
-
+ 1.0
μA
Active Burst Read Current
ICCB1
CE=VIL, OE=VIH (@133MHz)
-
35
55
mA
Active Asynchronous
Read Current
ICC1
CE=VIL, OE=VIH
-
35
55
mA
Active Write Current 2)
ICC2
CE=VIL, OE=VIH, WE=VIL, VPP=VIH
-
25
40
mA
Read While Write Current
ICC3
CE=VIL, OE=VIH
-
45
70
mA
Accelerated Program Current
ICC4
CE=VIL, OE=VIH , VPP=9.5V
-
20
30
mA
Standby Current
ICC5
CE= RESET=VCC ± 0.2V
-
30
120
μA
Standby Current During Reset
ICC6
RESET = VSS ± 0.2V
-
30
120
μA
Automatic Sleep Mode 3)
ICC7
CE=VSS ± 0.2V, Other Pins=VIL or VIH
VIL = VSS ± 0.2V, VIH = VCC ± 0.2V
-
30
120
μA
Deep Power Down Mode
ICC8
-
2
30
μA
10MHz
Input Low Voltage
VIL
-0.5
-
0.4
V
Input High Voltage
VIH
VCC-0.4
-
VCC+0.4
V
Output Low Voltage
VOL
IOL = 100 μA , VCC=VCCmin
-
-
0.1
V
Output High Voltage
VOH
IOH = -100 μA , VCC=VCCmin
VCC-0.1
-
-
V
VID
8.5
9.0
9.5
V
Low VCC Lock-out Voltage
VLKO
-
-
1.4
V
Vpp current in program/erase
Ivpp
Vpp = 9.5V
-
0.8
5
mA
Vpp = 1.95V
-
-
50
μA
Voltage for Accelerated Program
NOTE :
1) Maximum ICC specifications are tested with VCC = VCCmax.
2) ICC active while Internal Erase or Internal Program is in progress.
3) Device enters automatic sleep mode when addresses are stable for tAA + 60ns.
- 28 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
Vcc Power-up
Parameter
Symbol
Vcc Setup Time
Time between RESET (high) and CE (low)
All Speed Options
Max
tVCS
200
-
μs
tRH
200
-
ns
NOTE : Not 100% tested.
SWITCHING WAVEFORMS
tVCS
tVCCmin
Vcc/Vccq
VIH
RESET
tRH
CE
DPD
Unit
Min
Low
Figure 4. Vcc Power-up Diagram
NOTE : DPD should be low during power-up sequence.
- 29 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
16.0 CAPACITANCE (TA = 25 °C, VCC = 1.8V, f = 1.0MHz)
Item
Symbol
Test Condition
Min
Max
Unit
CIN
VIN=0V
-
10
pF
Output Capacitance
COUT
VOUT=0V
-
10
pF
Control Pin Capacitance
CIN2
VIN=0V
-
10
pF
Input Capacitance
NOTE : Capacitance is periodically sampled and not 100% tested.
17.0 AC TEST CONDITION
Parameter
Value
Input Pulse Levels
0V to VCC
Input Rise and Fall Times
3ns(max)@66Mhz, 2.5ns(max)@83Mhz, 1.5ns(max)@108Mhz, 1ns(max)@133Mhz
Input and Output Timing Levels
VCC/2
Output Load
CL = 30pF
Address to Address Skew
3ns(max)
Device
Under
Test
VCC
VCC/2
Input & Output
Test Point
VCC/2
* CL = 30pF including scope
and Jig capacitance
0V
Input Pulse and Test Point (including CLK characterization)
Output Load
18.0 AC CHARACTERISTICS
18.1 Synchronous/Burst Read
Parameter
Initial Access Time
Symbol
tIAA
1C
(66 MHz)
1D
(83 MHz)
1E
(108 MHz)
1F
(133 MHz)
Unit
Min
Max
Min
Max
Min
Max
Min
Max
-
95
-
95
-
95
-
95
ns
tBA
-
11
-
9
-
7
-
6
ns
tAVDS
5
-
4
-
3.5
-
2.5
-
ns
AVD Hold Time from CLK
tAVDH
2
-
2
-
2
-
2
-
ns
AVD High to OE Low
tAVDO
0
-
0
-
0
-
0
-
ns
Address Setup Time to CLK
tACS
5
-
4
-
3.5
-
2.5
-
ns
Address Hold Time from CLK
tACH
6
-
5
-
2
-
2
-
ns
Data Hold Time from Next Clock Cycle
tBDH
3
-
3
-
2
-
2
-
ns
Output Enable to RDY valid
tOER
-
11
-
9
-
7
-
6
ns
CE Disable to High Z
tCEZ
-
9
-
9
-
9
-
9
ns
OE Disable to High Z
tOEZ
-
9
-
9
-
9
-
9
ns
CE Setup Time to CLK
tCES
6
-
4.5
-
4
-
3.5
-
ns
CE Enable to RDY active
tRDY
-
11
-
9
-
7
-
6
ns
Burst Access Time Valid Clock to Output Delay
AVD Setup Time to CLK
CLK to RDY Setup Time
tRDYA
-
11
-
9
-
7
-
6
ns
RDY Setup Time to CLK
tRDYS
3
-
3
-
2
-
2
-
ns
tCLK
15.1
-
12.05
-
9.26
-
7.52
-
ns
CLK High or Low Time
tCLKH/L
0.4x
tCLK
0.6x
tCLK
0.4x
tCLK
0.6x
tCLK
0.4x
tCLK
0.6x
tCLK
0.4x
tCLK
0.6x
tCLK
ns
CLK Fall or Rise Time
tCLKHCL
-
3
-
2.5
-
1.5
-
1
ns
CLK period
- 30 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
SWITCHING WAVEFORMS
13 cycles for initial access shown.
CR setting : A14=1, A13=0, A12=0, A11=1
7.5ns typ(133MHz).
tCES
tCEZ
2
1
4
3
5
12
13
≈
≈
≈
tAVDS
tAVDS
tAVDO
AVD
11
≈
CLK
≈
≈
CE
tAVDH
tBA
tACH
Aa
tIAA
≈
tRDYS
≈
RDY
≈
tOER
tRDY
Da+n
tOEZ
Da Da+1 Da+2 Da+3 Da+4 Da+5 Da+6
OE
tRDYA
Hi-Z
≈
Hi-Z
Hi-Z
≈
≈
A/DQ0:
A/DQ15
≈ ≈
A16-A23
tBDH
≈ ≈
tACS
Aa
Figure 5: Continuous Burst Mode Read (133 MHz)
NOTE : In order to avoid a bus conflict the OE signal is enabled on the next rising edge after AVD is going high.
11 cycles for initial access shown.
CR setting : A14=0, A13=1, A12=1, A11=1
9.25ns typ(108MHz).
tCES
tCEZ
CE
≈
≈
2
1
CLK
3
9
10
11
≈
≈
≈
≈
tAVDS
tAVDS
tAVDO
AVD
4
tAVDH
tACH
tIAA
Da+3
Da+4
Da+5
Da+6
Da+n
tOEZ
tRDYS
tRDYA
≈
Hi-Z
Da+2
Figure 6: Continuous Burst Mode Read (108 MHz)
NOTE: In order to avoid a bus conflict the OE signal is enabled on the next rising edge after AVD is going high.
- 31 -
≈
RDY
tOER
Da+1
≈
tRDY
Da
≈
OE
Hi-Z
≈
Aa
tBA
≈ ≈
A/DQ0:
A/DQ15
tBDH
≈ ≈
A16-A23
≈ ≈
tACS
Aa
Hi-Z
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
SWITCHING WAVEFORMS
13 cycles for initial access shown.
CR setting : A14=1, A13=0, A12=0, A11=1
7.5ns typ(133MHz).
tCES
≈
CE
3
4
AVD
11
12
13
≈
tAVDS
tAVDS
tAVDO
≈
2
1
CLK
tAVDH
A16-A23
tACH
Aa
tIAA
tOER
tRDY
RDY
D7
D0
D1
D2
D3
D4
D5
D6
D7
D0
D4
D5
D6
D7
D0
≈
OE
tBA
≈ ≈
A/DQ0:
A/DQ15
tBDH
≈ ≈
tACS
Aa
tRDYS
tRDYA
≈
Hi-Z
Figure 7: 8 word Linear Burst Mode with Wrap Around (133 MHz)
NOTE : In order to avoid a bus conflict the OE signal is enabled on the next rising edge after AVD is going high.
13 cycles for initial access shown.
CR setting : A14=1, A13=0, A12=0, A11=1
7.5ns typ(133MHz).
tCES
≈
CE
AVD
4
10
11
12
13
≈
tAVDS
tAVDS
tAVDO
3
≈
2
1
CLK
tAVDH
A16-A23
tACH
Aa
tIAA
tRDY
D0
D1
D2
D3
tRDYS
≈
Hi-Z
tOER
D7
≈
OE
RDY
tBA
≈ ≈
A/DQ0:
A/DQ15
tBDH
≈ ≈
tACS
Aa
tRDYA
Figure 8: 8 word Linear Burst with RDY Set One Cycle Before Data (Wrap Around Mode, CR setting : A18=1)
NOTE : In order to avoid a bus conflict the OE signal is enabled on the next rising edge after AVD is going high.
- 32 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
SWITCHING WAVEFORMS
13 cycles for initial access shown.
CR setting : A14=1, A13=0, A12=0, A11=1
7.5ns typ(133MHz).
tCES
tCEZ
CE
2
1
3
4
5
12
11
13
- 33 -
≈
NOTE: In order to avoid a bus conflict the OE signal is enabled on the next rising edge after AVD is going high.
Hi-Z
D6
D0
tOEZ
≈
Figure 9: 16 word Linear Burst Mode with Wrap Around (133Mhz)
≈ ≈
Hi-Z
D15
≈
tRDYS
tRDYA
≈ ≈
D10
≈
RDY
tOER
D9
≈
tRDY
D8
≈
OE
D7
≈ ≈
tIAA
≈ ≈
Aa
tBA
≈ ≈
tACH
A/DQ0:
A/DQ15
tBDH
≈ ≈
A16-A23
≈
tAVDH
tACS
Aa
≈
≈
AVD
≈
≈
tAVDS
tAVDS
tAVDO
≈
CLK
Hi-Z
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
AC CHARACTERISTICS
18.2 Asynchronous Read
Parameter
All speed
Symbol
Min
Max
Unit
Access Time from CE Low
tCE
-
100
ns
Asynchronous Access Time
tAA
-
100
ns
AVD Low time
tAVDP
12
-
ns
Address Setup Time to rising Edge of AVD
tAAVDS
5
-
ns
Address Hold Time from Rising Edge of AVD
tAAVDH
2
-
ns
tOE
-
15
ns
Output Enable to Output Valid
Read
Output Enable
Hold Time
tOEH
Toggle and Data Polling
tOEZ
Output Disable to High Z*
0
-
ns
10
-
ns
-
9
ns
NOTE: Not 100% tested.
SWITCHING WAVEFORMS
Asynchronous Mode Read (tCE)
CLK
VIL
CE
tOE
OE
tOEH
WE
tCE
A/DQ0:
A/DQ15
VA
A16-A23
VA
tAAVDS
tOEZ
Valid RD
tAAVDH
AVD
RDY
Hi-Z
tAVDP
Hi-Z
Figure 10: Asynchronous Mode Read (tCE)
NOTE :
1) VA=Valid Read Address, RD=Read Data.
Asynchronous mode may not support read following four sequential invalid read condition within 200ns.
2) CLK "HIGH" should be prohibited in asynchronous read mode start (From CE LOW).
- 34 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
Asynchronous Mode Read (tAA)
Case 1 : Valid Address Transition occurs before AVD is driven to Low
CLK
VIL
CE
tOE
OE
tOEH
WE
tOEZ
A/DQ0:
A/DQ15
VA
Valid RD
tAA
A16-A23
VA
tAAVDS
tAAVDH
AVD
tAVDP
RDY
Hi-Z
Hi-Z
Case 2 : Valid Address Transition occurs after AVD is driven to Low
CLK
VIL
CE
tOE
OE
tOEH
WE
tOEZ
A/DQ0:
A/DQ15
VA
Valid RD
tAA
VA
A16-A23
tAAVDS
tAAVDH
AVD
RDY
Hi-Z
tAVDP
Hi-Z
Figure 11: Asynchronous Mode Read (tAA)
NOTE :
1) VA=Valid Read Address, RD=Read Data.
2) Asynchronous mode may not support read following four sequential invalid read condition within 200ns.
3) CLK "HIGH" should be prohibited in asynchronous read mode start (From CE LOW).
- 35 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
AC CHARACTERISTICS
18.3 Hardware Reset(RESET)
Parameter
All Speed Options
Symbol
Min
Max
Unit
RESET Pin Low(During Internal Routines)
to Read Mode*
tReady
-
20
μs
RESET Pin Low(NOT During Internal Routines)
to Read Mode*
tReady
-
500
ns
RESET Pulse Width
tRP
200
-
ns
Reset High Time Before Read*
tRH
200
-
ns
NOTE : Not 100% tested.
SWITCHING WAVEFORMS
CE, OE
tRH
RESET
tRP
tReady
Reset Timings NOT during Internal Routines
≈
CE, OE
tReady
≈
RESET
tRP
Reset Timings during Internal Routines
Figure 12: Reset Timings
- 36 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
AC CHARACTERISTICS
18.4 Erase/Program Operation
Parameter
Symbol
All speed options
Unit
Min
Typ
Max
tWC
75
-
-
ns
Address Setup Time
tAS
5
-
-
ns
Address Hold Time
tAH
2
-
-
ns
tAVDP
12
-
-
ns
Data Setup Time
tDS
30
-
-
ns
Data Hold Time
tDH
0
-
-
ns
tGHWL
0
-
-
ns
CE Setup Time
tCS
0
-
-
ns
CE Hold Time
tCH
0
-
-
ns
WE High to AVD low
tWEA
30
-
-
ns
WE Pulse Width
tWP
30
-
-
ns
WE Pulse Width High
tWPH
45
-
-
ns
tSR/W
0
-
-
ns
tPGM
-
80
-
μs
tPGM_BP
-
250
-
μs
tPGM_BP
-
89.6
-
μs
tACCPGM
-
80
-
μs
tACCPGM_BP
-
1.4
-
μs
tACCPGM_BP
-
44.8
-
μs
Block Erase Operation (64KW block)
tBERS
-
0.6
-
sec
VPP Rise and Fall Time
tVPP
500
-
-
ns
VPP Setup Time (During Accelerated Programming)
tVPS
1
-
-
μs
WE Cycle Time
1)
AVD Low Time
Read Recovery Time Before Write
Latency Between Read and Write Operations
Word Programming Operation
Single word Buffer Program
32-word Buffer Program
2)
2)
4)
Accelerated Programming Operation
3)
Accelerated Single word Buffer Program
3)
Accelerated 32-word Buffer Program 4)
NOTE :
1) Not 100% tested.
2) Internal programming algorithm is optimized for Buffer Program, so Normal word programming or Single word Buffer Program use Buffer Program algorithm.
3) Internal programming algorithm for supporting Accelerated mode uses a method to double the number of words programmed simultaneously.
4) Typical 32-word Buffer Program time pays due regard to that Each program data pattern ("11", "10". "01", "00") has a same portion in 32-word Buffer.
- 37 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
18.5 Erase/Program Performance
Limits
Parameter
Block Erase Time
Min.
Max.
64 Kword
-
0.6
3.0
16 Kword
-
0.3
1.5
-
154.2
771
64 Kword
-
0.4
3.0
Chip Erase Time (3)
Accelerated Block Erase Time
Typ.
-
0.2
1.5
Accelerated Chip Erase Time (3)
16 Kword
-
103
515
Word Programming Time
-
80
550
32-word Buffer Programming Time (4)
-
2.8
14
Accelerated Word Programming Time
-
80
550
Accelerated 32-word Buffer Programming Time
-
1.4
7
Chip Buffer Programming Time
-
47
235
Accelerated Buffer Chip Programming Time
-
23.4
117
Unit
Comments
sec
Includes 00h programming
prior to erasure
μs / word
Excludes system level overhead
sec
Excludes system level overhead
NOTE :
1)25°C, VCC = 1.8V, 100,000 cycles, typical pattern.
2) System-level overhead is defined as the time required to execute the two or four bus cycle command necessary to program each word.
3) Chip Erase time & Accel. Chip Erase time for boot block part : K8S(54/55/56/57)15ET(B)C
4) Not 100% tested.
- 38 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
SWITCHING WAVEFORMS
Program Operations
Program Command Sequence (last two cycles)
tWEA
tAS
Read Status Data
AVD
tAVDP
tAH
A16:A23
PA
555h
A0h
PA
≈ ≈
A/DQ0:
A/DQ15
VA
PD
tDS
≈
tCH
OE
≈
tDH
CE
VA
tWP
≈
WE
tWPH
tPGM
tCS
VIL
tWC
≈
CLK
tVCS
≈
VCC
NOTE :
1) PA = Program Address, PD = Program Data, VA = Valid Address for reading status bits.
2) “In progress” and “complete” refer to status of program operation.
3) A16–A23 are don’t care during command sequence unlock cycles.
4) Status reads in this figure is asynchronous read, but status read in synchronous mode is also supported.
Figure 13: Program Operation Timing
- 39 -
VA
In
Progress
VA
Complete
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
SWITCHING WAVEFORMS
Buffer Program Operations
Buffer Program Command Sequence
tAS
Word Count
Program Address/Data pairs (WC+1) "Buffer to Flash"
≈
AVD
tAH
tAVDP
A/DQ0:
A/DQ15
555h
2AAh
A0h
55h
BA
BA
25h
BA
PA_1
PA_0
WC
PA_0
PD_0
PA_1
PD_1
PA_N
≈
BA
≈
A16:A23
PA_N
BA
PD_N
BA
29h
tDS
≈
CE
≈
OE
tWP
≈
WE
VIL
tWC
≈
CLK
tPGM_BP
tWPH
tCS
tVCS
≈
VCC
NOTE :
1) BA = Block Address, WC = Word Count, PA = Program Address, PD = Program Data, VA = Valid Address for reading status bits.
2) Sequential PA_1, PA_2, ... , PA_N must have same address bits A23(max.) ~ A5 as PA_0 entered firstly
3) The number of Program/Data pairs entered must be same as WC+1 because WC = N.
4) “In progress” and “complete” refer to status of program operation.
5) A16–A23 are don’t care during command sequence unlock cycles.
6) Status reads in this figure is asynchronous read, but status read in synchronous mode is also supported.
Figure 14: Buffer Program Operation Timing
- 40 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
SWITCHING WAVEFORMS
Erase Operation
Erase Command Sequence (last two cycles)
tWEA
tAS
Read Status Data
AVD
tAVDP
tAH
A16:A23
BA
2AAh
55h
10h for
chip erase
BA
30h
tDS
≈ ≈
A/DQ0:
A/DQ15
VA
555h for
chip erase
≈
tCH
OE
≈
tDH
CE
VA
tWP
≈
WE
tWPH
tBERS
tCS
VIL
tWC
≈
CLK
tVCS
≈
VCC
NOTE :
1) BA is the block address for Block Erase.
2) Address bits A16–A23 are don’t cares during unlock cycles in the command sequence.
3) Status reads in this figure is asynchronous read, but status read in synchronous mode is also supported.
Figure 15: Chlp/Block Erase Operations
- 41 -
VA
In
Progress
VA
Complete
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
SWITCHING WAVEFORMS
Unlock Bypass Program Operations(Accelerated Program)
CE
AVD
WE
PA
A16:A23
A/DQ0:
A/DQ15
Don’t Care
OE
A0h
PA
PD
Don’t Care
tVPS
VID
tVPP
VPP
VIL or VIH
Unlock Bypass Block Erase Operations
CE
AVD
WE
BA
A16:A23
A/DQ0:
A/DQ15
Don’t Care
OE
80h
555h for
chip erase
10h for
chip erase
BA
30h
Don’t Care
tVPS
VID
tVPP
VPP
VIL or VIH
NOTE :
1) VPP can be left high for subsequent programming pulses.
2) Use setup and hold times from conventional program operations.
3) Conventional Program/Erase commands as well as Unlock Bypass Program/Erase commands can be used when the VID is applied to Vpp.
Figure 16: Unlock Bypass Operation Timings
- 42 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
SWITCHING WAVEFORMS
Data Polling Operations
tCES
≈
≈
CE
CLK
≈ ≈
AVD
≈ ≈
tAVDS
tAVDH
tIAA
VA
Status Data
≈
tRDYS
Hi-Z
≈
≈
RDY
Status Data
≈
OE
≈ ≈
VA
≈ ≈
tACH
A/DQ0:
A/DQ15
VA
≈ ≈
A16-A23
≈ ≈
tACS
VA
NOTE :
1) VA = Valid Address. When the Internal Routine operation is complete, and Data Polling will output true data.
Figure 17: Data Polling Timings (During Internal Routine)
Toggle Bit Operations
tCES
≈
≈
CE
CLK
≈ ≈
AVD
≈ ≈
tAVDS
tAVDH
tIAA
VA
≈
tRDYS
Hi-Z
≈
≈
RDY
Status Data
≈
OE
≈ ≈
VA
≈ ≈
tACH
A/DQ0:
A/DQ15
VA
≈ ≈
≈ ≈
A16-A23
tACS
VA
NOTE :
1) VA = Valid Address. When the Internal Routine operation is complete, the toggle bits will stop toggling.
Figure 18: Toggle Bit Timings(During Internal Routine)
- 43 -
Status Data
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
SWITCHING WAVEFORMS
Read While Write Operations
Last Cycle in
Program or
Block Erase
Command Sequence
tWC
tRC
tRC
tWC
≈
CE
≈
OE
tOE
tOEH
tGHWL
≈
WE
tWPH
tAA
tOEH
tDH
PD/30h
RA
RD
RA
≈
PA/BA
tWP
tDS
≈
A/DQ0:
A/DQ15
Begin another
Program or Erase
Command Sequences
Read status in same bank
and/or array data from other bank
RA
RD
555h
AAh
tSR/W
A16-A23
PA/BA
RA
≈
tAS
AVD
tAH
Figure 19: Read While Write Operation
NOTE :
Breakpoints in waveforms indicate that system may alternately read array data from the “non-busy bank” and checking the status of the program or erase operation in the “busy”
bank.
- 44 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
19.0 CROSSING OF FIRST WORD BOUNDARY IN BURST READ MODE
The additional clock insertion for word boundary is needed only at the first crossing of word boundary. This means that no additional clock cycle is needed
from 2nd word boundary crossing to the end of continuous burst read. Also, the number of additional clock cycle for the first word boundary can vary from
zero to thirteen cycles, and the exact number of additional clock cycle depends on the starting address of burst read and programmable wait state settings.
For example, if the starting address is 16N+15 (the worst case) and programmable wait state setting(A14~A11) is "0011" (which means data is valid on
the 7th active CLK edge after AVD transition to Vih), six additional clock cycle is needed.
Similarly, if the starting address is 16N+15 (the worst case) and programmable wait state setting(A14~A11) is "0010" (which means data is valid on the 6th
active CLK edge after AVD transition to Vih), five additional clock cycle is needed.
Below table shows the starting address vs. additional clock cycles for first word boundary.
Starting Address vs. Additional Clock Cycles for first word boundary
Srarting
Address
Group for
Burst Read
The Residue of
(Address/16)
LSB Bits
of
Address
A14~A11 "0000"
Valid data : 4th CLK
A14~A11 "0001"
Valid data : 5th CLK
A14~A11 "0010"
Valid data : 6th CLK
...
A14~A11 "1010"
Valid data : 14th CLK
16N
0
0000
0 cycle
0 cycle
0 cycle
...
0 cycle
16N+1
1
0001
0 cycle
0 cycle
0 cycle
...
0 cycle
16N+2
2
0010
0 cycle
0 cycle
0 cycle
...
0 cycle
Additional Clock Cycles for First Word Boundary 1)
16N+3
3
0011
0 cycle
0 cycle
0 cycle
...
1 cycle
16N+4
4
0100
0 cycle
0 cycle
0 cycle
...
2 cycle
16N+5
5
0101
0 cycle
0 cycle
0 cycle
...
3 cycle
16N+6
6
0110
0 cycle
0 cycle
0 cycle
...
4 cycle
16N+7
7
0111
0 cycle
0 cycle
0 cycle
...
5 cycle
16N+8
8
1000
0 cycle
0 cycle
0 cycle
...
6 cycle
16N+9
9
1001
0 cycle
0 cycle
0 cycle
...
7 cycle
16N+10
10
1010
0 cycle
0 cycle
0 cycle
...
8 cycle
16N+11
11
1011
0 cycle
0 cycle
1 cycle
...
9 cycle
16N+12
12
1100
0 cycle
1 cycle
2 cycle
...
10 cycle
16N+13
13
1101
1 cycle
2 cycle
3 cycle
...
11 cycle
16N+14
14
1110
2 cycle
3 cycle
4 cycle
...
12 cycle
16N+15
15
1111
3 cycle
4 cycle
5 cycle
...
13 cycle
NOTE :
1) Address bit A14~A11 means the programmable wait state on burst mode configuration register. Refer to Table 10.
- 45 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
Case 1 : Start from "16N" address group
14th rising edge CLK
CR setting : A14=1, A13=0, A12=1, A11=0
A/DQ0:
A/DQ15
Aa
≈ ≈
Aa
≈≈
A16-A23
0B
0C
0D
0E
0F
10
11
12
≈
CLK
00
0B
0C
0D
0F
0E
10
11
12
13
≈
AVD
No Additional Cycle for First Word Boundary
≈
CE
tOER
≈
OE
tCEZ
tOEZ
≈ ≈
RDY
NOTE :
1) Address boundary occurs every 16 words beginning at address 000000FH , 000001FH , 000002FH , etc.
2) Address 000000H is also a boundary crossing.
3) No additional clock cycles are needed except for 1st boundary crossing.
Figure 20: Crossing of first word boundary in burst read mode.
Case 2 : Start from "16N+3" address group
14th rising edge CLK
CR setting : A14=1, A13=0, A12=1, A11=0
A/DQ0:
A/DQ15
Aa
≈ ≈
Aa
≈ ≈≈
A16-A23
CLK
0D
0D
00
0E
0E
0F
0F
10
10
11
11
12
12
13
13
14
≈
AVD
Additional 1 Cycle for First Word Boundary
≈
CE
tOER
tOEZ
≈≈
RDY
≈
OE
tCEZ
NOTE :
1) Address boundary occurs every 16 words beginning at address 000000FH , 000001FH , 000002FH , etc.
2) Address 000000H is also a boundary crossing.
3) No additional clock cycles are needed except for 1st boundary crossing.
Figure 21: Crossing of first word boundary in burst read mode.
- 46 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
Case3 : Start from "16N+4" address group
14th rising edge CLK
CR setting : A14=1, A13=0, A12=1, A11=0
A/DQ0:
A/DQ15
Aa
≈ ≈
Aa
≈ ≈≈
A16-A23
CLK
00
0F
0E
0E
0F
10
11
10
11
12
12
13
13
14
≈
AVD
Additional 2 Cycle for First Word Boundary
≈
CE
tOER
≈
OE
tCEZ
tOEZ
≈ ≈
RDY
Case 4 : Start from "16N+15" address group
14th rising edge CLK
CR setting : A14=1, A13=0, A12=1, A11=0
A/DQ0:
A/DQ15
Aa
CLK
00
3F
3F
10
≈
Additional 13 Cycle for First Word Boundary
≈
tOER
≈
OE
≈
≈
CE
10
11
≈
AVD
≈
≈≈
RDY
≈ ≈ ≈≈ ≈
Aa
≈ ≈≈
A16-A23
NOTE :
1) Address boundary occurs every 16 words beginning at address 000000FH , 000001FH , 000002FH , etc.
2) Address 000000H is also a boundary crossing.
3) No additional clock cycles are needed except for 1st boundary crossing.
Figure 22: Crossing of first word boundary in burst read mode.
- 47 -
11
12
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
[Table 16] Top Boot Block Address Table
Bank
Bank 0
Bank 1
Bank 2
Block
Block Size
(x16) Address Range
BA258
16 kwords
FFC000h-FFFFFFh
BA257
16 kwords
FF8000h-FFBFFFh
BA256
16 kwords
FF4000h-FF7FFFh
BA255
16 kwords
FF0000h-FF3FFFh
BA254
64 kwords
FE0000h-FEFFFFh
BA253
64 kwords
FD0000h-FDFFFFh
BA252
64 kwords
FC0000h-FCFFFFh
BA251
64 kwords
FB0000h-FBFFFFh
BA250
64 kwords
FA0000h-FAFFFFh
BA249
64 kwords
F90000h-F9FFFFh
BA248
64 kwords
F80000h-F8FFFFh
BA247
64 kwords
F70000h-F7FFFFh
BA246
64 kwords
F60000h-F6FFFFh
BA245
64 kwords
F50000h-F5FFFFh
BA244
64 kwords
F40000h-F4FFFFh
BA243
64 kwords
F30000h-F3FFFFh
BA242
64 kwords
F20000h-F2FFFFh
BA241
64 kwords
F10000h-F1FFFFh
BA240
64 kwords
F00000h-F0FFFFh
BA239
64 kwords
EF0000h-EFFFFFh
BA238
64 kwords
EE0000h-EEFFFFh
BA237
64 kwords
ED0000h-EDFFFFh
BA236
64 kwords
EC0000h-ECFFFFh
BA235
64 kwords
EB0000h-EBFFFFh
BA234
64 kwords
EA0000h-EAFFFFh
BA233
64 kwords
E90000h-E9FFFFh
BA232
64 kwords
E80000h-E8FFFFh
BA231
64 kwords
E70000h-E7FFFFh
BA230
64 kwords
E60000h-E6FFFFh
BA229
64 kwords
E50000h-E5FFFFh
BA228
64 kwords
E40000h-E4FFFFh
BA227
64 kwords
E30000h-E3FFFFh
BA226
64 kwords
E20000h-E2FFFFh
BA225
64 kwords
E10000h-E1FFFFh
BA224
64 kwords
E00000h-E0FFFFh
BA223
64 kwords
DF0000h-DFFFFFh
BA222
64 kwords
DE0000h-DEFFFFh
BA221
64 kwords
DD0000h-DDFFFFh
BA220
64 kwords
DC0000h-DCFFFFh
BA219
64 kwords
DB0000h-DBFFFFh
BA218
64 kwords
DA0000h-DAFFFFh
BA217
64 kwords
D90000h-D9FFFFh
BA216
64 kwords
D80000h-D8FFFFh
BA215
64 kwords
D70000h-D7FFFFh
BA214
64 kwords
D60000h-D6FFFFh
- 48 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
Bank
Bank 2
Bank 3
Bank 4
Bank 5
Block
Block Size
(x16) Address Range
BA213
64 kwords
D50000h-D5FFFFh
BA212
64 kwords
D40000h-D4FFFFh
BA211
64 kwords
D30000h-D3FFFFh
BA210
64 kwords
D20000h-D2FFFFh
BA209
64 kwords
D10000h-D1FFFFh
BA208
64 kwords
D00000h-D0FFFFh
BA207
64 kwords
CF0000h-CFFFFFh
BA206
64 kwords
CE0000h-CEFFFFh
BA205
64 kwords
CD0000h-CDFFFFh
BA204
64 kwords
CC0000h-CCFFFFh
BA203
64 kwords
CB0000h-CBFFFFh
BA202
64 kwords
CA0000h-CAFFFFh
BA201
64 kwords
C90000h-C9FFFFh
BA200
64 kwords
C80000h-C8FFFFh
BA199
64 kwords
C70000h-C7FFFFh
BA198
64 kwords
C60000h-C6FFFFh
BA197
64 kwords
C50000h-C5FFFFh
BA196
64 kwords
C40000h-C4FFFFh
BA195
64 kwords
C30000h-C3FFFFh
BA194
64 kwords
C20000h-C2FFFFh
BA193
64 kwords
C10000h-C1FFFFh
BA192
64 kwords
C00000h-C0FFFFh
BA191
64 kwords
BF0000h-BFFFFFh
BA190
64 kwords
BE0000h-BEFFFFh
BA189
64 kwords
BD0000h-BDFFFFh
BA188
64 kwords
BC0000h-BCFFFFh
BA187
64 kwords
BB0000h-BBFFFFh
BA186
64 kwords
BA0000h-BAFFFFh
BA185
64 kwords
B90000h-B9FFFFh
BA184
64 kwords
B80000h-B8FFFFh
BA183
64 kwords
B70000h-B7FFFFh
BA182
64 kwords
B60000h-B6FFFFh
BA181
64 kwords
B50000h-B5FFFFh
BA180
64 kwords
B40000h-B4FFFFh
BA179
64 kwords
B30000h-B3FFFFh
BA178
64 kwords
B20000h-B2FFFFh
BA177
64 kwords
B10000h-B1FFFFh
BA176
64 kwords
B00000h-B0FFFFh
BA175
64 kwords
AF0000h-AFFFFFh
BA174
64 kwords
AE0000h-AEFFFFh
BA173
64 kwords
AD0000h-ADFFFFh
BA172
64 kwords
AC0000h-ACFFFFh
BA171
64 kwords
AB0000h-ABFFFFh
BA170
64 kwords
AA0000h-AAFFFFh
BA169
64 kwords
A90000h-A9FFFFh
- 49 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
Bank
Bank 5
Bank 6
Bank 7
Bank 8
Block
Block Size
(x16) Address Range
BA168
64 kwords
A80000h-A8FFFFh
BA167
64 kwords
A70000h-A7FFFFh
BA166
64 kwords
A60000h-A6FFFFh
BA165
64 kwords
A50000h-A5FFFFh
BA164
64 kwords
A40000h-A4FFFFh
BA163
64 kwords
A30000h-A3FFFFh
BA162
64 kwords
A20000h-A2FFFFh
BA161
64 kwords
A10000h-A1FFFFh
BA160
64 kwords
A00000h-A0FFFFh
BA159
64 kwords
9F0000h-9FFFFFh
BA158
64 kwords
9E0000h-9EFFFFh
BA157
64 kwords
9D0000h-9DFFFFh
BA156
64 kwords
9C0000h-9CFFFFh
BA155
64 kwords
9B0000h-9BFFFFh
BA154
64 kwords
9A0000h-9AFFFFh
BA153
64 kwords
990000h-99FFFFh
BA152
64 kwords
980000h-98FFFFh
BA151
64 kwords
970000h-97FFFFh
BA150
64 kwords
960000h-96FFFFh
BA149
64 kwords
950000h-95FFFFh
BA148
64 kwords
940000h-94FFFFh
BA147
64 kwords
930000h-93FFFFh
BA146
64 kwords
920000h-92FFFFh
BA145
64 kwords
910000h-91FFFFh
BA144
64 kwords
900000h-90FFFFh
BA143
64 kwords
8F0000h-8FFFFFh
BA142
64 kwords
8E0000h-08EFFFFh
BA141
64 kwords
8D0000h-8DFFFFh
BA140
64 kwords
8C0000h-8CFFFFh
BA139
64 kwords
8B0000h-8BFFFFh
BA138
64 kwords
8A0000h-8AFFFFh
BA137
64 kwords
890000h-89FFFFh
BA136
64 kwords
880000h-88FFFFh
BA135
64 kwords
870000h-87FFFFh
BA134
64 kwords
860000h-86FFFFh
BA133
64 kwords
850000h-85FFFFh
BA132
64 kwords
840000h-84FFFFh
BA131
64 kwords
830000h-83FFFFh
BA130
64 kwords
820000h-82FFFFh
BA129
64 kwords
810000h-81FFFFh
BA128
64 kwords
800000h-80FFFFh
BA127
64 kwords
7F0000h-7FFFFFh
BA126
64 kwords
7E0000h-7EFFFFh
BA125
64 kwords
7D0000h-7DFFFFh
BA124
64 kwords
7C0000h-7CFFFFh
- 50 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
Bank
Bank 8
Bank 9
Bank10
Block
Block Size
(x16) Address Range
BA123
64 kwords
7B0000h-7BFFFFh
BA122
64 kwords
7A0000h-7AFFFFh
BA121
64 kwords
790000h-79FFFFh
BA120
64 kwords
780000h-78FFFFh
BA119
64 kwords
770000h-77FFFFh
BA118
64 kwords
760000h-76FFFFh
BA117
64 kwords
750000h-75FFFFh
BA116
64 kwords
740000h-74FFFFh
BA115
64 kwords
730000h-73FFFFh
BA114
64 kwords
720000h-72FFFFh
BA113
64 kwords
710000h-71FFFFh
BA112
64 kwords
700000h-70FFFFh
BA111
64 kwords
6F0000h-6FFFFFh
BA110
64 kwords
6E0000h-6EFFFFh
BA109
64 kwords
6D0000h-6DFFFFh
BA108
64 kwords
6C0000h-6CFFFFh
BA107
64 kwords
6B0000h-6BFFFFh
BA106
64 kwords
6A0000h-6AFFFFh
BA105
64 kwords
690000h-69FFFFh
BA104
64 kwords
680000h-68FFFFh
BA103
64 kwords
670000h-67FFFFh
BA102
64 kwords
660000h-66FFFFh
BA101
64 kwords
650000h-65FFFFh
BA100
64 kwords
640000h-64FFFFh
BA99
64 kwords
630000h-63FFFFh
BA98
64 kwords
620000h-62FFFFh
BA97
64 kwords
610000h-61FFFFh
BA96
64 kwords
600000h-60FFFFh
BA95
64 kwords
5F0000h-5FFFFFh
BA94
64 kwords
5E0000h-5EFFFFh
BA93
64 kwords
5D0000h-5DFFFFh
BA92
64 kwords
5C0000h-5CFFFFh
BA91
64 kwords
5B0000h-5BFFFFh
BA90
64 kwords
5A0000h-5AFFFFh
BA89
64 kwords
590000h-59FFFFh
BA88
64 kwords
580000h-58FFFFh
BA87
64 kwords
570000h-57FFFFh
BA86
64 kwords
560000h-56FFFFh
BA85
64 kwords
550000h-55FFFFh
BA84
64 kwords
540000h-54FFFFh
BA83
64 kwords
530000h-53FFFFh
BA82
64 kwords
520000h-52FFFFh
BA81
64 kwords
510000h-51FFFFh
BA80
64 kwords
500000h-50FFFFh
- 51 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
Bank
Bank 11
Bank 12
Bank 13
Block
Block Size
BA79
64 kwords
4F0000h-4FFFFFh
BA78
64 kwords
4E0000h-4EFFFFh
BA77
64 kwords
4D0000h-4DFFFFh
BA76
64 kwords
4C0000h-4CFFFFh
BA75
64 kwords
4B0000h-4BFFFFh
BA74
64 kwords
4A0000h-4AFFFFh
BA73
64 kwords
490000h-49FFFFh
BA72
64 kwords
480000h-48FFFFh
BA71
64 kwords
470000h-47FFFFh
BA70
64 kwords
460000h-46FFFFh
BA69
64 kwords
450000h-45FFFFh
BA68
64 kwords
440000h-44FFFFh
BA67
64 kwords
430000h-43FFFFh
BA66
64 kwords
420000h-42FFFFh
BA65
64 kwords
410000h-41FFFFh
BA64
64 kwords
400000h-40FFFFh
BA63
64 kwords
3F0000h-3FFFFFh
BA62
64 kwords
3E0000h-3EFFFFh
BA61
64 kwords
3D0000h-3DFFFFh
BA60
64 kwords
3C0000h-3CFFFFh
BA59
64 kwords
3B0000h-3BFFFFh
BA58
64 kwords
3A0000h-3AFFFFh
BA57
64 kwords
390000h-39FFFFh
BA56
64 kwords
380000h-38FFFFh
BA55
64 kwords
370000h-37FFFFh
BA54
64 kwords
360000h-36FFFFh
BA53
64 kwords
350000h-35FFFFh
BA52
64 kwords
340000h-34FFFFh
BA51
64 kwords
330000h-33FFFFh
BA50
64 kwords
320000h-32FFFFh
BA49
64 kwords
310000h-31FFFFh
BA48
64 kwords
300000h-30FFFFh
BA47
64 kwords
2F0000h-2FFFFFh
BA46
64 kwords
2E0000h-2EFFFFh
BA45
64 kwords
2D0000h-2DFFFFh
BA44
64 kwords
2C0000h-2CFFFFh
BA43
64 kwords
2B0000h-2BFFFFh
BA42
64 kwords
2A0000h-2AFFFFh
BA41
64 kwords
290000h-29FFFFh
BA40
64 kwords
280000h-28FFFFh
BA39
64 kwords
270000h-27FFFFh
BA38
64 kwords
260000h-26FFFFh
BA37
64 kwords
250000h-25FFFFh
BA36
64 kwords
240000h-24FFFFh
BA35
64 kwords
230000h-23FFFFh
- 52 -
(x16) Address Range
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
Bank
Bank 13
Bank 14
Bank 15
Block
Block Size
(x16) Address Range
BA34
64 kwords
220000h-22FFFFh
BA33
64 kwords
210000h-21FFFFh
BA32
64 kwords
200000h-20FFFFh
BA31
64 kwords
1F0000h-1FFFFFh
BA30
64 kwords
1E0000h-1EFFFFh
BA29
64 kwords
1D0000h-1DFFFFh
BA28
64 kwords
1C0000h-1CFFFFh
BA27
64 kwords
1B0000h-1BFFFFh
BA26
64 kwords
1A0000h-1AFFFFh
BA25
64 kwords
190000h-19FFFFh
BA24
64 kwords
180000h-18FFFFh
BA23
64 kwords
170000h-17FFFFh
BA22
64 kwords
160000h-16FFFFh
BA21
64 kwords
150000h-15FFFFh
BA20
64 kwords
140000h-14FFFFh
BA19
64 kwords
130000h-13FFFFh
BA18
64 kwords
120000h-12FFFFh
BA17
64 kwords
110000h-11FFFFh
BA16
64 kwords
100000h-10FFFFh
BA15
64 kwords
0F0000h-0FFFFFh
BA14
64 kwords
0E0000h-0EFFFFh
BA13
64 kwords
0D0000h-0DFFFFh
BA12
64 kwords
0C0000h-0CFFFFh
BA11
64 kwords
0B0000h-0BFFFFh
BA10
64 kwords
0A0000h-0AFFFFh
BA9
64 kwords
090000h-09FFFFh
BA8
64 kwords
080000h-08FFFFh
BA7
64 kwords
070000h-07FFFFh
BA6
64 kwords
060000h-06FFFFh
BA5
64 kwords
050000h-05FFFFh
BA4
64 kwords
040000h-04FFFFh
BA3
64 kwords
030000h-03FFFFh
BA2
64 kwords
020000h-02FFFFh
BA1
64 kwords
010000h-01FFFFh
BA0
64 kwords
000000h-00FFFFh
Block Address
A23 ~ A8
Block Size
(x16) Address Range*
FFFFh
512words
FFFE00h-FFFFFFh
[Table 17] OTP Block Addresses
OTP
After entering OTP Block, any issued addresses should be in the range of OTP block address.
- 53 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
[Table 18] Bottom Boot Block Address Table
Bank
Bank 15
Bank 14
Bank 13
Block
Block Size
BA258
64 kwords
FF0000h-FFFFFFh
BA257
64 kwords
FE0000h-FEFFFFh
BA256
64 kwords
FD0000h-FDFFFFh
BA255
64 kwords
FC0000h-FCFFFFh
BA254
64 kwords
FB0000h-FBFFFFh
BA253
64 kwords
FA0000h-FAFFFFh
BA252
64 kwords
F90000h-F9FFFFh
BA251
64 kwords
F80000h-F8FFFFh
BA250
64 kwords
F70000h-F7FFFFh
BA249
64 kwords
F60000h-F6FFFFh
BA248
64 kwords
F50000h-F5FFFFh
BA247
64 kwords
F40000h-F4FFFFh
BA246
64 kwords
F30000h-F3FFFFh
BA245
64 kwords
F20000h-F2FFFFh
BA244
64 kwords
F10000h-F1FFFFh
BA243
64 kwords
F00000h-F0FFFFh
BA242
64 kwords
EF0000h-EFFFFFh
BA241
64 kwords
EE0000h-EEFFFFh
BA240
64 kwords
ED0000h-EDFFFFh
BA239
64 kwords
EC0000h-ECFFFFh
BA238
64 kwords
EB0000h-EBFFFFh
BA237
64 kwords
EA0000h-EAFFFFh
BA236
64 kwords
E90000h-E9FFFFh
BA235
64 kwords
E80000h-E8FFFFh
BA234
64 kwords
E70000h-E7FFFFh
BA233
64 kwords
E60000h-E6FFFFh
BA232
64 kwords
E50000h-E5FFFFh
BA231
64 kwords
E40000h-E4FFFFh
BA230
64 kwords
E30000h-E3FFFFh
BA229
64 kwords
E20000h-E2FFFFh
BA228
64 kwords
E10000h-E1FFFFh
BA227
64 kwords
E00000h-E0FFFFh
BA226
64 kwords
DF0000h-DFFFFFh
BA225
64 kwords
DE0000h-DEFFFFh
BA224
64 kwords
DD0000h-DDFFFFh
BA223
64 kwords
DC0000h-DCFFFFh
BA222
64 kwords
DB0000h-DBFFFFh
BA221
64 kwords
DA0000h-DAFFFFh
BA220
64 kwords
D90000h-D9FFFFh
BA219
64 kwords
D80000h-D8FFFFh
BA218
64 kwords
D70000h-D7FFFFh
BA217
64 kwords
D60000h-D6FFFFh
BA216
64 kwords
D50000h-D5FFFFh
BA215
64 kwords
D40000h-D4FFFFh
BA214
64 kwords
D30000h-D3FFFFh
- 54 -
(x16) Address Range
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
Bank
Bank 13
Bank 12
Bank 11
Bank 10
Block
Block Size
(x16) Address Range
BA213
64 kwords
D20000h-D2FFFFh
BA212
64 kwords
D10000h-D1FFFFh
BA211
64 kwords
D00000h-D0FFFFh
BA210
64 kwords
CF0000h-CFFFFFh
BA209
64 kwords
CE0000h-CEFFFFh
BA208
64 kwords
CD0000h-CDFFFFh
BA207
64 kwords
CC0000h-CCFFFFh
BA206
64 kwords
CB0000h-CBFFFFh
BA205
64 kwords
CA0000h-CAFFFFh
BA204
64 kwords
C90000h-C9FFFFh
BA203
64 kwords
C80000h-C8FFFFh
BA202
64 kwords
C70000h-C7FFFFh
BA201
64 kwords
C60000h-C6FFFFh
BA200
64 kwords
C50000h-C5FFFFh
BA199
64 kwords
C40000h-C4FFFFh
BA198
64 kwords
C30000h-C3FFFFh
BA197
64 kwords
C20000h-C2FFFFh
BA196
64 kwords
C10000h-C1FFFFh
BA195
64 kwords
C00000h-C0FFFFh
BA194
64 kwords
BF0000h-BFFFFFh
BA193
64 kwords
BE0000h-BEFFFFh
BA192
64 kwords
BD0000h-BDFFFFh
BA191
64 kwords
BC0000h-BCFFFFh
BA190
64 kwords
BB0000h-BBFFFFh
BA189
64 kwords
BA0000h-BAFFFFh
BA188
64 kwords
B90000h-B9FFFFh
BA187
64 kwords
B80000h-B8FFFFh
BA186
64 kwords
B70000h-B7FFFFh
BA185
64 kwords
B60000h-B6FFFFh
BA184
64 kwords
B50000h-B5FFFFh
BA183
64 kwords
B40000h-B4FFFFh
BA182
64 kwords
B30000h-B3FFFFh
BA181
64 kwords
B20000h-B2FFFFh
BA180
64 kwords
B10000h-B1FFFFh
BA179
64 kwords
B00000h-B0FFFFh
BA178
64 kwords
AF0000h-AFFFFFh
BA177
64 kwords
AE0000h-AEFFFFh
BA176
64 kwords
AD0000h-ADFFFFh
BA175
64 kwords
AC0000h-ACFFFFh
BA174
64 kwords
AB0000h-ABFFFFh
BA173
64 kwords
AA0000h-AAFFFFh
BA172
64 kwords
A90000h-A9FFFFh
BA171
64 kwords
A80000h-A8FFFFh
BA170
64 kwords
A70000h-A7FFFFh
BA169
64 kwords
A60000h-A6FFFFh
- 55 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
Bank
Bank 10
Bank 9
Bank 8
Bank 7
Block
Block Size
(x16) Address Range
BA168
64 kwords
A50000h-A5FFFFh
BA167
64 kwords
A40000h-A4FFFFh
BA166
64 kwords
A30000h-A3FFFFh
BA165
64 kwords
A20000h-A2FFFFh
BA164
64 kwords
A10000h-A1FFFFh
BA163
64 kwords
A00000h-A0FFFFh
BA162
64 kwords
9F0000h-9FFFFFh
BA161
64 kwords
9E0000h-9EFFFFh
BA160
64 kwords
9D0000h-9DFFFFh
BA159
64 kwords
9C0000h-9CFFFFh
BA158
64 kwords
9B0000h-9BFFFFh
BA157
64 kwords
9A0000h-9AFFFFh
BA156
64 kwords
990000h-99FFFFh
BA155
64 kwords
980000h-98FFFFh
BA154
64 kwords
970000h-97FFFFh
BA153
64 kwords
960000h-96FFFFh
BA152
64 kwords
950000h-95FFFFh
BA151
64 kwords
940000h-94FFFFh
BA150
64 kwords
930000h-93FFFFh
BA149
64 kwords
920000h-92FFFFh
BA148
64 kwords
910000h-91FFFFh
BA147
64 kwords
900000h-90FFFFh
BA146
64 kwords
8F0000h-8FFFFFh
BA145
64 kwords
8E0000h-08EFFFFh
BA144
64 kwords
8D0000h-8DFFFFh
BA143
64 kwords
8C0000h-8CFFFFh
BA142
64 kwords
8B0000h-8BFFFFh
BA141
64 kwords
8A0000h-8AFFFFh
BA140
64 kwords
890000h-89FFFFh
BA139
64 kwords
880000h-88FFFFh
BA138
64 kwords
870000h-87FFFFh
BA137
64 kwords
860000h-86FFFFh
BA136
64 kwords
850000h-85FFFFh
BA135
64 kwords
840000h-84FFFFh
BA134
64 kwords
830000h-83FFFFh
BA133
64 kwords
820000h-82FFFFh
BA132
64 kwords
810000h-81FFFFh
BA131
64 kwords
800000h-80FFFFh
BA130
64 kwords
7F0000h-7FFFFFh
BA129
64 kwords
7E0000h-7EFFFFh
BA128
64 kwords
7D0000h-7DFFFFh
BA127
64 kwords
7C0000h-7CFFFFh
BA126
64 kwords
7B0000h-7BFFFFh
BA125
64 kwords
7A0000h-7AFFFFh
BA124
64 kwords
790000h-79FFFFh
- 56 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
Bank
Bank 7
Bank 6
Bank5
Bank4
Block
Block Size
(x16) Address Range
BA123
64 kwords
780000h-78FFFFh
BA122
64 kwords
770000h-77FFFFh
BA121
64 kwords
760000h-76FFFFh
BA120
64 kwords
750000h-75FFFFh
BA119
64 kwords
740000h-74FFFFh
BA118
64 kwords
730000h-73FFFFh
BA117
64 kwords
720000h-72FFFFh
BA116
64 kwords
710000h-71FFFFh
BA115
64 kwords
700000h-70FFFFh
BA114
64 kwords
6F0000h-6FFFFFh
BA113
64 kwords
6E0000h-6EFFFFh
BA112
64 kwords
6D0000h-6DFFFFh
BA111
64 kwords
6C0000h-6CFFFFh
BA110
64 kwords
6B0000h-6BFFFFh
BA109
64 kwords
6A0000h-6AFFFFh
BA108
64 kwords
690000h-69FFFFh
BA107
64 kwords
680000h-68FFFFh
BA106
64 kwords
670000h-67FFFFh
BA105
64 kwords
660000h-66FFFFh
BA104
64 kwords
650000h-65FFFFh
BA103
64 kwords
640000h-64FFFFh
BA102
64 kwords
630000h-63FFFFh
BA101
64 kwords
620000h-62FFFFh
BA100
64 kwords
610000h-61FFFFh
BA99
64 kwords
600000h-60FFFFh
BA98
64 kwords
5F0000h-5FFFFFh
BA97
64 kwords
5E0000h-5EFFFFh
BA96
64 kwords
5D0000h-5DFFFFh
BA95
64 kwords
5C0000h-5CFFFFh
BA94
64 kwords
5B0000h-5BFFFFh
BA93
64 kwords
5A0000h-5AFFFFh
BA92
64 kwords
590000h-59FFFFh
BA91
64 kwords
580000h-58FFFFh
BA90
64 kwords
570000h-57FFFFh
BA89
64 kwords
560000h-56FFFFh
BA88
64 kwords
550000h-55FFFFh
BA87
64 kwords
540000h-54FFFFh
BA86
64 kwords
530000h-53FFFFh
BA85
64 kwords
520000h-52FFFFh
BA84
64 kwords
510000h-51FFFFh
BA83
64 kwords
500000h-50FFFFh
BA82
64 kwords
4F0000h-4FFFFFh
BA81
64 kwords
4E0000h-4EFFFFh
BA80
64 kwords
4D0000h-4DFFFFh
- 57 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
Bank
Bank 4
Bank 3
Bank 2
Block
Block Size
(x16) Address Range
BA79
64 kwords
4C0000h-4CFFFFh
BA78
64 kwords
4B0000h-4BFFFFh
BA77
64 kwords
4A0000h-4AFFFFh
BA76
64 kwords
490000h-49FFFFh
BA75
64 kwords
480000h-48FFFFh
BA74
64 kwords
470000h-47FFFFh
BA73
64 kwords
460000h-46FFFFh
BA72
64 kwords
450000h-45FFFFh
BA71
64 kwords
440000h-44FFFFh
BA70
64 kwords
430000h-43FFFFh
BA69
64 kwords
420000h-42FFFFh
BA68
64 kwords
410000h-41FFFFh
BA67
64 kwords
400000h-40FFFFh
BA66
64 kwords
3F0000h-3FFFFFh
BA65
64 kwords
3E0000h-3EFFFFh
BA64
64 kwords
3D0000h-3DFFFFh
BA63
64 kwords
3C0000h-3CFFFFh
BA62
64 kwords
3B0000h-3BFFFFh
BA61
64 kwords
3A0000h-3AFFFFh
BA60
64 kwords
390000h-39FFFFh
BA59
64 kwords
380000h-38FFFFh
BA58
64 kwords
370000h-37FFFFh
BA57
64 kwords
360000h-36FFFFh
BA56
64 kwords
350000h-35FFFFh
BA55
64 kwords
340000h-34FFFFh
BA54
64 kwords
330000h-33FFFFh
BA53
64 kwords
320000h-32FFFFh
BA52
64 kwords
310000h-31FFFFh
BA51
64 kwords
300000h-30FFFFh
BA50
64 kwords
2F0000h-2FFFFFh
BA49
64 kwords
2E0000h-2EFFFFh
BA48
64 kwords
2D0000h-2DFFFFh
BA47
64 kwords
2C0000h-2CFFFFh
BA46
64 kwords
2B0000h-2BFFFFh
BA45
64 kwords
2A0000h-2AFFFFh
BA44
64 kwords
290000h-29FFFFh
BA43
64 kwords
280000h-28FFFFh
BA42
64 kwords
270000h-27FFFFh
BA41
64 kwords
260000h-26FFFFh
BA40
64 kwords
250000h-25FFFFh
BA39
64 kwords
240000h-24FFFFh
BA38
64 kwords
230000h-23FFFFh
BA37
64 kwords
220000h-22FFFFh
BA36
64 kwords
210000h-21FFFFh
BA35
64 kwords
200000h-20FFFFh
- 58 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
Bank
Bank 1
Bank 0
Block
Block Size
(x16) Address Range
BA34
64 kwords
1F0000h-1FFFFFh
BA33
64 kwords
1E0000h-1EFFFFh
BA32
64 kwords
1D0000h-1DFFFFh
BA31
64 kwords
1C0000h-1CFFFFh
BA30
64 kwords
1B0000h-1BFFFFh
BA29
64 kwords
1A0000h-1AFFFFh
BA28
64 kwords
190000h-19FFFFh
BA27
64 kwords
180000h-18FFFFh
BA26
64 kwords
170000h-17FFFFh
BA25
64 kwords
160000h-16FFFFh
BA24
64 kwords
150000h-15FFFFh
BA23
64 kwords
140000h-14FFFFh
BA22
64 kwords
130000h-13FFFFh
BA21
64 kwords
120000h-12FFFFh
BA20
64 kwords
110000h-11FFFFh
BA19
64 kwords
100000h-10FFFFh
BA18
64 kwords
0F0000h-0FFFFFh
BA17
64 kwords
0E0000h-0EFFFFh
BA16
64 kwords
0D0000h-0DFFFFh
BA15
64 kwords
0C0000h-0CFFFFh
BA14
64 kwords
0B0000h-0BFFFFh
BA13
64 kwords
0A0000h-0AFFFFh
BA12
64 kwords
090000h-09FFFFh
BA11
64 kwords
080000h-08FFFFh
BA10
64 kwords
070000h-07FFFFh
BA9
64 kwords
060000h-06FFFFh
BA8
64 kwords
050000h-05FFFFh
BA7
64 kwords
040000h-04FFFFh
BA6
64 kwords
030000h-03FFFFh
BA5
64 kwords
020000h-02FFFFh
BA4
64 kwords
010000h-01FFFFh
BA3
16 kwords
00C000h-00FFFFh
BA2
16 kwords
008000h-00BFFFh
BA1
16 kwords
004000h-007FFFh
BA0
16 kwords
000000h-003FFFh
Block Address
A23 ~ A8
Block Size
(x16) Address Range*
0000h
512 words
000000h-0001FFh
[Table 19] Bottom Boot OTP Block Addresses
OTP
After entering OTP Block, any issued addresses should be in the range of OTP block address.
- 59 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
[Table 20] Uniform Block Address Table
Bank
Bank 0
Bank 1
Bank 2
Block
Block Size
(x16) Address Range
BA255
64 kwords
0FF0000h-0FFFFFFh
BA254
64 kwords
0FE0000h-0FEFFFFh
BA253
64 kwords
0FD0000h-0FDFFFFh
BA252
64 kwords
0FC0000h-0FCFFFFh
BA251
64 kwords
0FB0000h-0FBFFFFh
BA250
64 kwords
0FA0000h-0FAFFFFh
BA249
64 kwords
0F90000h-0F9FFFFh
BA248
64 kwords
0F80000h-0F8FFFFh
BA247
64 kwords
0F70000h-0F7FFFFh
BA246
64 kwords
0F60000h-0F6FFFFh
BA245
64 kwords
0F50000h-0F5FFFFh
BA244
64 kwords
0F40000h-0F4FFFFh
BA243
64 kwords
0F30000h-0F3FFFFh
BA242
64 kwords
0F20000h-0F2FFFFh
BA241
64 kwords
0F10000h-0F1FFFFh
BA240
64 kwords
0F00000h-0F0FFFFh
BA239
64 kwords
0EF0000h-0EFFFFFh
BA238
64 kwords
0EE0000h-0EEFFFFh
BA237
64 kwords
0ED0000h-0EDFFFFh
BA236
64 kwords
0EC0000h-0ECFFFFh
BA235
64 kwords
0EB0000h-0EBFFFFh
BA234
64 kwords
0EA0000h-0EAFFFFh
BA233
64 kwords
0E90000h-0E9FFFFh
BA232
64 kwords
0E80000h-0E8FFFFh
BA231
64 kwords
0E70000h-0E7FFFFh
BA230
64 kwords
0E60000h-0E6FFFFh
BA229
64 kwords
0E50000h-0E5FFFFh
BA228
64 kwords
0E40000h-0E4FFFFh
BA227
64 kwords
0E30000h-0E3FFFFh
BA226
64 kwords
0E20000h-0E2FFFFh
BA225
64 kwords
0E10000h-0E1FFFFh
BA224
64 kwords
0E00000h-0E0FFFFh
BA223
64 kwords
0DF0000h-0DFFFFFh
BA222
64 kwords
0DE0000h-0DEFFFFh
BA221
64 kwords
0DD0000h-0DDFFFFh
BA220
64 kwords
0DC0000h-0DCFFFFh
BA219
64 kwords
0DB0000h-0DBFFFFh
BA218
64 kwords
0DA0000h-0DAFFFFh
BA217
64 kwords
0D90000h-0D9FFFFh
BA216
64 kwords
0D80000h-0D8FFFFh
BA215
64 kwords
0D70000h-0D7FFFFh
BA214
64 kwords
0D60000h-0D6FFFFh
- 60 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
Bank
Bank 2
Bank 3
Bank 4
Bank 5
Block
Block Size
(x16) Address Range
BA213
64 kwords
0D50000h-0D5FFFFh
BA212
64 kwords
0D40000h-0D4FFFFh
BA211
64 kwords
0D30000h-0D3FFFFh
BA210
64 kwords
0D20000h-0D2FFFFh
BA209
64 kwords
0D10000h-0D1FFFFh
BA208
64 kwords
0D00000h-0D0FFFFh
BA207
64 kwords
0CF0000h-0CFFFFFh
BA206
64 kwords
0CE0000h-0CEFFFFh
BA205
64 kwords
0CD0000h-0CDFFFFh
BA204
64 kwords
0CC0000h-0CCFFFFh
BA203
64 kwords
0CB0000h-0CBFFFFh
BA202
64 kwords
0CA0000h-0CAFFFFh
BA201
64 kwords
0C90000h-0C9FFFFh
BA200
64 kwords
0C80000h-0C8FFFFh
BA199
64 kwords
0C70000h-0C7FFFFh
BA198
64 kwords
0C60000h-0C6FFFFh
BA197
64 kwords
0C50000h-0C5FFFFh
BA196
64 kwords
0C40000h-0C4FFFFh
BA195
64 kwords
0C30000h-0C3FFFFh
BA194
64 kwords
0C20000h-0C2FFFFh
BA193
64 kwords
0C10000h-0C1FFFFh
BA192
64 kwords
0C00000h-0C0FFFFh
BA191
64 kwords
0BF0000h-0BFFFFFh
BA190
64 kwords
0BE0000h-0BEFFFFh
BA189
64 kwords
0BD0000h-0BDFFFFh
BA188
64 kwords
0BC0000h-0BCFFFFh
BA187
64 kwords
0BB0000h-0BBFFFFh
BA186
64 kwords
0BA0000h-0BAFFFFh
BA185
64 kwords
0B90000h-0B9FFFFh
BA184
64 kwords
0B80000h-0B8FFFFh
BA183
64 kwords
0B70000h-0B7FFFFh
BA182
64 kwords
0B60000h-0B6FFFFh
BA181
64 kwords
0B50000h-0B5FFFFh
BA180
64 kwords
0B40000h-0B4FFFFh
BA179
64 kwords
0B30000h-0B3FFFFh
BA178
64 kwords
0B20000h-0B2FFFFh
BA177
64 kwords
0B10000h-0B1FFFFh
BA176
64 kwords
0B00000h-0B0FFFFh
BA175
64 kwords
0AF0000h-0AFFFFFh
BA174
64 kwords
0AE0000h-0AEFFFFh
BA173
64 kwords
0AD0000h-0ADFFFFh
BA172
64 kwords
0AC0000h-0ACFFFFh
BA171
64 kwords
0AB0000h-0ABFFFFh
BA170
64 kwords
0AA0000h-0AAFFFFh
BA169
64 kwords
0A90000h-0A9FFFFh
- 61 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
Bank
Bank 5
Bank 6
Bank 7
Bank 8
Block
Block Size
(x16) Address Range
BA168
64 kwords
0A80000h-0A8FFFFh
BA167
64 kwords
0A70000h-0A7FFFFh
BA166
64 kwords
0A60000h-0A6FFFFh
BA165
64 kwords
0A50000h-0A5FFFFh
BA164
64 kwords
0A40000h-0A4FFFFh
BA163
64 kwords
0A30000h-0A3FFFFh
BA162
64 kwords
0A20000h-0A2FFFFh
BA161
64 kwords
0A10000h-0A1FFFFh
BA160
64 kwords
0A00000h-0A0FFFFh
BA159
64 kwords
09F0000h-09FFFFFh
BA158
64 kwords
09E0000h-09EFFFFh
BA157
64 kwords
09D0000h-09DFFFFh
BA156
64 kwords
09C0000h-09CFFFFh
BA155
64 kwords
09B0000h-09BFFFFh
BA154
64 kwords
09A0000h-09AFFFFh
BA153
64 kwords
0990000h-099FFFFh
BA152
64 kwords
0980000h-098FFFFh
BA151
64 kwords
0970000h-097FFFFh
BA150
64 kwords
0960000h-096FFFFh
BA149
64 kwords
0950000h-095FFFFh
BA148
64 kwords
0940000h-094FFFFh
BA147
64 kwords
0930000h-093FFFFh
BA146
64 kwords
0920000h-092FFFFh
BA145
64 kwords
0910000h-091FFFFh
BA144
64 kwords
0900000h-090FFFFh
BA143
64 kwords
08F0000h-08FFFFFh
BA142
64 kwords
08E0000h-08EFFFFh
BA141
64 kwords
08D0000h-08DFFFFh
BA140
64 kwords
08C0000h-08CFFFFh
BA139
64 kwords
08B0000h-08BFFFFh
BA138
64 kwords
08A0000h-08AFFFFh
BA137
64 kwords
0890000h-089FFFFh
BA136
64 kwords
0880000h-088FFFFh
BA135
64 kwords
0870000h-087FFFFh
BA134
64 kwords
0860000h-086FFFFh
BA133
64 kwords
0850000h-085FFFFh
BA132
64 kwords
0840000h-084FFFFh
BA131
64 kwords
0830000h-083FFFFh
BA130
64 kwords
0820000h-082FFFFh
BA129
64 kwords
0810000h-081FFFFh
BA128
64 kwords
0800000h-080FFFFh
BA127
64 kwords
07F0000h-07FFFFFh
BA126
64 kwords
07E0000h-07EFFFFh
BA125
64 kwords
07D0000h-07DFFFFh
BA124
64 kwords
07C0000h-07CFFFFh
- 62 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
Bank
Bank 8
Bank 9
Bank10
Block
Block Size
(x16) Address Range
BA123
64 kwords
07B0000h-07BFFFFh
BA122
64 kwords
07A0000h-07AFFFFh
BA121
64 kwords
0790000h-079FFFFh
BA120
64 kwords
0780000h-078FFFFh
BA119
64 kwords
0770000h-077FFFFh
BA118
64 kwords
0760000h-076FFFFh
BA117
64 kwords
0750000h-075FFFFh
BA116
64 kwords
0740000h-074FFFFh
BA115
64 kwords
0730000h-073FFFFh
BA114
64 kwords
0720000h-072FFFFh
BA113
64 kwords
0710000h-071FFFFh
BA112
64 kwords
0700000h-070FFFFh
BA111
64 kwords
06F0000h-06FFFFFh
BA110
64 kwords
06E0000h-06EFFFFh
BA109
64 kwords
06D0000h-06DFFFFh
BA108
64 kwords
06C0000h-06CFFFFh
BA107
64 kwords
06B0000h-06BFFFFh
BA106
64 kwords
06A0000h-06AFFFFh
BA105
64 kwords
0690000h-069FFFFh
BA104
64 kwords
0680000h-068FFFFh
BA103
64 kwords
0670000h-067FFFFh
BA102
64 kwords
0660000h-066FFFFh
BA101
64 kwords
0650000h-065FFFFh
BA100
64 kwords
0640000h-064FFFFh
BA99
64 kwords
0630000h-063FFFFh
BA98
64 kwords
0620000h-062FFFFh
BA97
64 kwords
0610000h-061FFFFh
BA96
64 kwords
0600000h-060FFFFh
BA95
64 kwords
05F0000h-05FFFFFh
BA94
64 kwords
05E0000h-05EFFFFh
BA93
64 kwords
05D0000h-05DFFFFh
BA92
64 kwords
05C0000h-05CFFFFh
BA91
64 kwords
05B0000h-05BFFFFh
BA90
64 kwords
05A0000h-05AFFFFh
BA89
64 kwords
0590000h-059FFFFh
BA88
64 kwords
0580000h-058FFFFh
BA87
64 kwords
0570000h-057FFFFh
BA86
64 kwords
0560000h-056FFFFh
BA85
64 kwords
0550000h-055FFFFh
BA84
64 kwords
0540000h-054FFFFh
BA83
64 kwords
0530000h-053FFFFh
BA82
64 kwords
0520000h-052FFFFh
BA81
64 kwords
0510000h-051FFFFh
BA80
64 kwords
0500000h-050FFFFh
- 63 -
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
Bank
Bank 11
Bank 12
Bank 13
Block
Block Size
BA79
64 kwords
04F0000h-04FFFFFh
BA78
64 kwords
04E0000h-04EFFFFh
BA77
64 kwords
04D0000h-04DFFFFh
BA76
64 kwords
04C0000h-04CFFFFh
BA75
64 kwords
04B0000h-04BFFFFh
BA74
64 kwords
04A0000h-04AFFFFh
BA73
64 kwords
0490000h-049FFFFh
BA72
64 kwords
0480000h-048FFFFh
BA71
64 kwords
0470000h-047FFFFh
BA70
64 kwords
0460000h-046FFFFh
BA69
64 kwords
0450000h-045FFFFh
BA68
64 kwords
0440000h-044FFFFh
BA67
64 kwords
0430000h-043FFFFh
BA66
64 kwords
0420000h-042FFFFh
BA65
64 kwords
0410000h-041FFFFh
BA64
64 kwords
0400000h-040FFFFh
BA63
64 kwords
03F0000h-03FFFFFh
BA62
64 kwords
03E0000h-03EFFFFh
BA61
64 kwords
03D0000h-03DFFFFh
BA60
64 kwords
03C0000h-03CFFFFh
BA59
64 kwords
03B0000h-03BFFFFh
BA58
64 kwords
03A0000h-03AFFFFh
BA57
64 kwords
0390000h-039FFFFh
BA56
64 kwords
0380000h-038FFFFh
BA55
64 kwords
0370000h-037FFFFh
BA54
64 kwords
0360000h-036FFFFh
BA53
64 kwords
0350000h-035FFFFh
BA52
64 kwords
0340000h-034FFFFh
BA51
64 kwords
0330000h-033FFFFh
BA50
64 kwords
0320000h-032FFFFh
BA49
64 kwords
0310000h-031FFFFh
BA48
64 kwords
0300000h-030FFFFh
BA47
64 kwords
02F0000h-02FFFFFh
BA46
64 kwords
02E0000h-02EFFFFh
BA45
64 kwords
02D0000h-02DFFFFh
BA44
64 kwords
02C0000h-02CFFFFh
BA43
64 kwords
02B0000h-02BFFFFh
BA42
64 kwords
02A0000h-02AFFFFh
BA41
64 kwords
0290000h-029FFFFh
BA40
64 kwords
0280000h-028FFFFh
BA39
64 kwords
0270000h-027FFFFh
BA38
64 kwords
0260000h-026FFFFh
BA37
64 kwords
0250000h-025FFFFh
BA36
64 kwords
0240000h-024FFFFh
BA35
64 kwords
0230000h-023FFFFh
- 64 -
(x16) Address Range
Rev. 1.0
datasheet NOR FLASH MEMORY
K8S5615ETC
Bank
Bank 13
Bank 14
Bank 15
Block
Block Size
(x16) Address Range
BA34
64 kwords
0220000h-022FFFFh
BA33
64 kwords
0210000h-021FFFFh
BA32
64 kwords
0200000h-020FFFFh
BA31
64 kwords
01F0000h-01FFFFFh
BA30
64 kwords
01E0000h-01EFFFFh
BA29
64 kwords
01D0000h-01DFFFFh
BA28
64 kwords
01C0000h-01CFFFFh
BA27
64 kwords
01B0000h-01BFFFFh
BA26
64 kwords
01A0000h-01AFFFFh
BA25
64 kwords
0190000h-019FFFFh
BA24
64 kwords
0180000h-018FFFFh
BA23
64 kwords
0170000h-017FFFFh
BA22
64 kwords
0160000h-016FFFFh
BA21
64 kwords
0150000h-015FFFFh
BA20
64 kwords
0140000h-014FFFFh
BA19
64 kwords
0130000h-013FFFFh
BA18
64 kwords
0120000h-012FFFFh
BA17
64 kwords
0110000h-011FFFFh
BA16
64 kwords
0100000h-010FFFFh
BA15
64 kwords
00F0000h-00FFFFFh
BA14
64 kwords
00E0000h-00EFFFFh
BA13
64 kwords
00D0000h-00DFFFFh
BA12
64 kwords
00C0000h-00CFFFFh
BA11
64 kwords
00B0000h-00BFFFFh
BA10
64 kwords
00A0000h-00AFFFFh
BA9
64 kwords
0090000h-009FFFFh
BA8
64 kwords
0080000h-008FFFFh
BA7
64 kwords
0070000h-007FFFFh
BA6
64 kwords
0060000h-006FFFFh
BA5
64 kwords
0050000h-005FFFFh
BA4
64 kwords
0040000h-004FFFFh
BA3
64 kwords
0030000h-003FFFFh
BA2
64 kwords
0020000h-002FFFFh
BA1
64 kwords
0010000h-001FFFFh
BA0
64 kwords
0000000h-000FFFFh
Block Address
A23 ~ A8
Block Size
(x16) Address Range*
FFFFh
512 words
FFFE00h-FFFFFFh
[Table 21] Uniform OTP Block Addresses
OTP
After entering OTP Block, any issued addresses should be in the range of OTP block address.
- 65 -