MM74HCU04 Hex Inverter Features General Description ■ Typical propagation delay: 7ns The MM74HCU04 inverters utilize advanced silicon-gate CMOS technology to achieve operating speeds similar to LS-TTL gates with the low power consumption of standard CMOS integrated circuits. ■ Fanout of 15 LS-TTL loads ■ Quiescent power consumption: 10µA maximum at room temperature Low input current: 1µA maximum ■ The MM74HCU04 is an unbuffered inverter. It has high noise immunity and the ability to drive 15 LS-TTL loads. The 74HCU logic family is functionally as well as pin-out compatible with the standard 74LS logic family. All inputs are protected from damage due to static discharge by internal diode clamps to VCC and ground. Ordering Information Package Number Package Description MM74HCU04M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow MM74HCU04SJ M14D 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Order Number MM74HCU04MTC MM74HCU04N MTC14 N14A 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number. All packages are lead free per JEDEC: J-STD-020B standard. ©1983 Fairchild Semiconductor Corporation MM74HCU04 Rev. 1.4.0 www.fairchildsemi.com MM74HCU04 — Hex Inverter February 2008 MM74HCU04 — Hex Inverter Connection Diagram Pin Assignments for DIP, SOIC, SOP and TSSOP Top View Schematic Diagram ©1983 Fairchild Semiconductor Corporation MM74HCU04 Rev. 1.4.0 www.fairchildsemi.com 2 Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Rating VCC Supply Voltage VIN DC Input Voltage –1.5 to VCC+1.5V DC Output Voltage –0.5 to VCC+0.5V VOUT IIK, IOK –0.5 to +7.0V Clamp Diode Current ±20mA IOUT DC Output Current, per pin ±25mA ICC DC VCC or GND Current, per pin ±50mA TSTG PD Storage Temperature Range –65°C to +150°C Power Dissipation Note 2 600mW S.O. Package only TL 500mW Lead Temperature (Soldering 10 seconds) 260°C Notes: 1. Unless otherwise specified all voltages are referenced to ground. 2. Power Dissipation temperature derating — plastic “N” package: –12mW/°C from 65°C to 85°C. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Symbol VCC VIN, VOUT TA Parameter Min. Max. Units Supply Voltage 2 6 V DC Input or Output Voltage 0 VCC V –40 +85 °C Operating Temperature Range ©1983 Fairchild Semiconductor Corporation MM74HCU04 Rev. 1.4.0 www.fairchildsemi.com 3 MM74HCU04 — Hex Inverter Absolute Maximum Ratings(1) TA = –40°C to 85°C TA = 25°C Symbol VIH VIL VOH VOL Parameter VCC (V) Conditions Typ. TA = –55°C to 125°C Guaranteed Limits Minimum HIGH Level Input Voltage 2.0 1.7 1.7 1.7 4.5 3.6 3.6 3.6 6.0 4.8 4.8 4.8 Maximum LOW Level Input Voltage 2.0 0.3 0.3 0.3 4.5 0.8 0.8 0.8 6.0 1.1 1.1 1.1 2.0 1.8 1.8 1.8 4.5 4.0 4.0 4.0 6.0 5.5 5.5 5.5 Minimum HIGH Level Output Voltage Maximum LOW Level Output Voltage 2.0 4.5 VIN = VIL, |IOUT| ≤ 20µA 6.0 4.5 VIN = GND, |IOUT| ≤ 4.0mA 4.2 3.98 3.84 3.7 6.0 VIN = GND, |IOUT| ≤ 5.2mA 5.7 5.48 5.34 5.2 2.0 VIN = VIH, |IOUT| ≤ 20µA 0 0.2 0.2 0.2 0 0.5 0.5 0.5 0 0.5 0.5 0.5 4.5 6.0 4.5 VIN = VCC, |IOUT| ≤ 6.0mA 0.2 0.26 0.33 0.4 6.0 VIN = VCC, |IOUT| ≤ 7.8mA 0.2 0.26 0.33 0.4 Units V V V V IIN Maximum Input Current 6.0 VIN = VCC or GND ±0.1 ±1.0 ±1.0 µA ICC Maximum Quiescent Supply Current 6.0 VIN = VCC or GND, IOUT = 0µA 2.0 20 40 µA Note: 3. For a power supply of 5V ±10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing with this supply. Worst case VIH and VIL occur at VCC = 5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage current (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used. AC Electrical Characteristics VCC = 5V, TA = 25°C, CL = 15pF, tr = tf = 6ns Symbol Parameter Conditions tPHL, tPLH Maximum Propagation Delay ©1983 Fairchild Semiconductor Corporation MM74HCU04 Rev. 1.4.0 Typ. Guaranteed Limit Units 7 13 ns www.fairchildsemi.com 4 MM74HCU04 — Hex Inverter DC Electrical Characteristics TA=25°C Symbol tPHL, tPLH tTLH, tTHL Parameter Conditions VCC (V) Typ. Maximum Propagation Delay Maximum Output Rise and Fall Time CPD Power Dissipation Capacitance(4) CIN Maximum Input Capacitance (per gate) TA = –40°C to 85°C TA –55°C to 125°C Guaranteed Limits Units 2.0 49 82 103 120 4.5 9.9 16 21 24 6.0 8.4 14 18 20 2.0 30 75 95 110 4.5 8 15 19 22 6.0 7 13 16 19 90 8 ns ns pF 15 15 15 pF Note: 4. CPD determines the no load dynamic power consumption, PD = CPD VCC2 f + ICC VCC, and the no load dynamic current consumption, IS = CPD VCC f + ICC. Typical Applications Figure 1. Crystal Oscillator Figure 2. Stable RC Oscillator Figure 3. Schmitt Trigger ©1983 Fairchild Semiconductor Corporation MM74HCU04 Rev. 1.4.0 www.fairchildsemi.com 5 MM74HCU04 — Hex Inverter AC Electrical Characteristics VCC = 2.0V to 6.0V, CL = 50pF, tr = tf = 6ns (unless otherwise specified) 8.75 8.50 0.65 A 7.62 14 8 B 5.60 4.00 3.80 6.00 PIN ONE INDICATOR 1 1.70 7 0.51 0.35 1.27 0.25 (0.33) 1.75 MAX 1.50 1.25 1.27 LAND PATTERN RECOMMENDATION M C B A SEE DETAIL A 0.25 0.10 C 0.25 0.19 0.10 C NOTES: UNLESS OTHERWISE SPECIFIED A) THIS PACKAGE CONFORMS TO JEDEC MS-012, VARIATION AB, ISSUE C, B) ALL DIMENSIONS ARE IN MILLIMETERS. C) DIMENSIONS DO NOT INCLUDE MOLD GAGE PLANE FLASH OR BURRS. D) LANDPATTERN STANDARD: SOIC127P600X145-14M 0.36 E) DRAWING CONFORMS TO ASME Y14.5M-1994 F) DRAWING FILE NAME: M14AREV13 0.50 X 45° 0.25 R0.10 R0.10 8° 0° 0.90 0.50 (1.04) SEATING PLANE DETAIL A SCALE: 20:1 Figure 4. 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ ©1983 Fairchild Semiconductor Corporation MM74HCU04 Rev. 1.4.0 www.fairchildsemi.com 6 MM74HCU04 — Hex Inverter Physical Dimensions MM74HCU04 — Hex Inverter Physical Dimensions (Continued) Figure 5. 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ ©1983 Fairchild Semiconductor Corporation MM74HCU04 Rev. 1.4.0 www.fairchildsemi.com 7 MM74HCU04 — Hex Inverter Physical Dimensions (Continued) 0.65 0.43 TYP 1.65 6.10 0.45 12.00° TOP & BOTTOM R0.09 min A. CONFORMS TO JEDEC REGISTRATION MO-153, VARIATION AB, REF NOTE 6 B. DIMENSIONS ARE IN MILLIMETERS C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH, AND TIE BAR EXTRUSIONS D. DIMENSIONING AND TOLERANCES PER ANSI Y14.5M, 1982 E. LANDPATTERN STANDARD: SOP65P640X110-14M F. DRAWING FILE NAME: MTC14REV6 1.00 R0.09min Figure 6. 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ ©1983 Fairchild Semiconductor Corporation MM74HCU04 Rev. 1.4.0 www.fairchildsemi.com 8 MM74HCU04 — Hex Inverter Physical Dimensions (Continued) 19.56 18.80 14 8 6.60 6.09 1 7 (1.74) 8.12 7.62 1.77 1.14 3.56 3.30 0.35 0.20 5.33 MAX 0.38 MIN 3.81 3.17 0.58 0.35 8.82 2.54 NOTES: UNLESS OTHERWISE SPECIFIED THIS PACKAGE CONFORMS TO A) JEDEC MS-001 VARIATION BA B) ALL DIMENSIONS ARE IN MILLIMETERS. DIMENSIONS ARE EXCLUSIVE OF BURRS, C) MOLD FLASH, AND TIE BAR EXTRUSIONS. D) DIMENSIONS AND TOLERANCES PER ASME Y14.5-1994 E) DRAWING FILE NAME: MKT-N14AREV7 Figure 7. 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/ ©1983 Fairchild Semiconductor Corporation MM74HCU04 Rev. 1.4.0 www.fairchildsemi.com 9 ACEx® Build it Now™ CorePLUS™ CROSSVOLT™ CTL™ Current Transfer Logic™ EcoSPARK® EZSWITCH™ * ™ PDP-SPM™ Power220® POWEREDGE® Power-SPM™ PowerTrench® Programmable Active Droop™ QFET® QS™ QT Optoelectronics™ Quiet Series™ RapidConfigure™ SMART START™ SPM® STEALTH™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 FPS™ FRFET® Global Power ResourceSM Green FPS™ Green FPS™e-Series™ GTO™ i-Lo™ IntelliMAX™ ISOPLANAR™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MillerDrive™ Motion-SPM™ OPTOLOGIC® OPTOPLANAR® ® Fairchild® Fairchild Semiconductor® FACT Quiet Series™ FACT® FAST® FastvCore™ FlashWriter® * ® SupreMOS™ SyncFET™ ® The Power Franchise® TinyBoost™ TinyBuck™ TinyLogic® TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ µSerDes™ UHC® Ultra FRFET™ UniFET™ VCX™ * EZSWITCH™ and FlashWriter® are trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild Semiconductor. The datasheet is printed for reference information only. Rev. I33 ©1983 Fairchild Semiconductor Corporation MM74HCU04 Rev. 1.4.0 www.fairchildsemi.com 10 MM74HCU04 — Hex Inverter TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks.