LV5686PVC

Ordering number : ENA2122
LV5686PVC
Bi-CMOS LSI
Multi-Power Supply IC
for Car Audio Systems
http://onsemi.com
Overview
LV5686PVC is a multiple voltage regulator for Car Audio System. This IC has 3 voltage regulators, 5V output for a
microcontroller, 9.85V output for illuminations, 9V output for audio control and 6 high side switches.
About protection circuits, it has Over-current-protection, Over-voltage-protection and Thermal-shut-down. This IC is
most suitable for Car Audio System.
Features
• 3 system regulators
VDD (MCU) : VOUT 5V, IOUT max 300mA, reverse current prevention.
Illumination : VOUT 9.85V, IOUT max 300mA
Audio
: VOUT 9.0V, IOUT max 500mA
• 6 high side switches
AMP : IOUT max 300mA, voltage difference between input and output: 1.0V
ANT : IOUT max 300mA, voltage difference between input and output: 1.0V
EXT1 : IOUT max 500mA, voltage difference between input and output: 1.0V
EXT2 : IOUT max 500mA, voltage difference between input and output: 1.0V
EXT3 : IOUT max 350mA, voltage difference between input and output: 0.5V
EXT4 : IOUT max 500mA, voltage difference between input and output: 1.0V
• Over Current Protection
• BATT. Detection: under voltage1 (<6.5V), under voltage2 (<9.5V) and over voltage (>18V)
• Over Voltage Protection Typ 25V (shutdown except VDD)
• Thermal Shut Down Circuit Typ 175°C
• Applied P-LDMOS to Output stage
(Warning) The protector functions only improve the IC’s tolerance and they do not guarantee the safety of the IC if used under the
conditions out of safety range or ratings. Use of the IC such as use under overcurrent protection range, thermal shutdown
state or V6IN OVS condition may degrade the IC’s reliability and eventually damage the IC.
Semiconductor Components Industries, LLC, 2013
August, 2013
92612NKPC 20120830-S00003 No.A2122-1/14
LV5686PVC
Specifications
Absolute Maximum Ratings at Ta = 25°C
Parameter
Conditions
Maximum supply voltage
VCC max
Allowable power dissipation
Pd max
Conditions
Independent IC
Ratings
Ta ≤ 25°C
Al heat sink *
With an infinity heat sink
See below for the waveform applied.
Unit
36
V
1.3
W
5.3
W
26.0
W
50
V
Peak supply voltage
VCC peak
Operating ambient temperature
Topr
-40 to +85
°C
Storage temperature
Tstg
-55 to +150
°C
Junction temperature
Tj max
150
°C
* : When the Aluminum heat sink (50mm × 50mm × 1.5mm) is used
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Waveform of surge test
50V
90%
10%
16V
5msec
100msec
Recommended Operating Range at Ta = 25°C
Parameter
Conditions
Operating supply voltage 1
VDD(5V)
Operating supply voltage 2
Ratings
Unit
6.5 to 16
V
AUDIO(9V)
11.5 to 16
V
Operating supply voltage 3
ILM(9.85V)
12.5 to 16
V
Operating supply voltage 4
AMP, ANT, EXT1, EXT2, EXT3, EXT4
7.5 to 16
V
No.A2122-2/14
LV5686PVC
Electrical Characteristics (1) at Ta = 25°C, VCC = 14.4V (*1)
Parameter
Symbol
Ratings
Conditions
min
Quiescent current
ICC
typ
VDD No Load, EN/CTRL1/2 = ⎡L/L/L⎦
Unit
max
60
100
μA
EN (AUDIO, ILM, AMP, EXT1 control)
⎡L⎦ input voltage
VIL1
All: OFF
0.3
V
⎡M⎦ input voltage
VIM1
AUDIO, ILM, EXT1: ON
1.1
1.65
2.1
V
⎡H⎦ input voltage
VIM1
All: ON
2.7
3.3
5.5
V
Input impedance
RIN1
Input voltage ≤ 3.3V
280
400
520
kΩ
⎡L⎦ input voltage
VIL2
All: OFF
0.3
V
⎡M⎦ input voltage
VIM2
EXT2: ON
1.1
1.65
2.1
V
⎡H⎦ input voltage
VIM2
All: ON
2.7
3.3
5.5
V
Input impedance
RIN2
Input voltage ≤ 3.3V
280
400
520
kΩ
⎡L⎦ input voltage
VIL3
All: OFF
0.3
V
⎡M⎦ input voltage
VIM3
ANT: ON
1.1
1.65
2.1
V
⎡H⎦ input voltage
VIM3
All: ON
2.7
3.3
5.5
V
Input impedance
RIN3
Input voltage ≤ 3.3V
280
400
520
kΩ
5.0
5.25
V
0
CTRL1 (EXT2, EXT4 control)
0
CTRL2 (ANT, EXT3 control)
0
VDD output 5V (reverse current prevention diode implemented)
VDD output voltage
VO1
IO1 = 200mA
4.75
VDD output current
IO1
VO1 > 4.7V
300
Line regulation
ΔVOLN1
7.5V < VCC < 16V, IO1 = 200mA
30
60
mV
Load regulation
ΔVOLD1
1mA < IO1 < 200mA
70
140
mV
1.25
1.5
Dropout voltage
VDROP1
IO1 = 150mA
Ripple rejection
RREJ1
f = 120Hz, IO1 = 200mA
VDD reverse current
Irev
VO1 = 5V, VCC = 0V
40
mA
50
V
dB
10
100
9.85
10.34
μA
ILM output 9.85V-ON ; EN = ⎡M⎦, ⎡H⎦
ILM output voltage
VO2
IO2 = 200mA
9.36
ILM output current
IO2
VO2 > 9.2V
300
Line regulation
ΔVOLN2
12.5V < VCC < 16V, IO2 = 200mA
Load regulation
ΔVOLD2
Dropout voltage
VDROP2
Ripple rejection
RREJ2
f = 120Hz, IO2 = 200mA
V
mA
30
60
mV
1mA < IO2 < 200mA
70
140
mV
IO2 = 200mA
1.0
1.5
40
50
V
dB
(*1) All the specification is defined based on the tests performed under the conditions where Tj and Ta(=25°C) are almost equal. These tests were performed
with pulse load to minimize the increase of junction temperature (Tj).
No.A2122-3/14
LV5686PVC
Electrical Characteristics (2) at Ta = 25°C, VCC = 14.4V
Parameter
Symbol
Ratings
Conditions
min
typ
Unit
max
AUDIO output 9.0V -ON ; EN = ⎡M⎦, ⎡H⎦
AUDIO output voltage
VO3
IO3 = 400mA
8.55
9.0
9.45
AUDIO output current
IO3
VO3 > 8.5V
500
Line regulation
ΔVOLN3
Load regulation
ΔVOLD3
11.5V < VCC < 16V, IO3 = 400mA
40
80
mV
1mA < IO3 < 400mA
70
140
mV
0.6
1.0
Dropout voltage
VDROP3
IO3 = 200mA
Ripple rejection
RREJ3
f = 120Hz, IO3 = 200mA
Output voltage
VO4
IO4 = 300mA
Output current
IO4
VO4 ≥ VCC-1.8
V
mA
45
60
VCC-1.8
VCC-1.0
V
dB
AMP Remote-ON ; EN = ⎡H⎦
300
V
mA
ANT Remote-ON ; CTRL2 = ⎡M⎦, ⎡H⎦
Output voltage
VO5
IO5 = 300mA
Output current
IO5
VO5 ≥ VCC-1.8
Output voltage
VO6
IO6 = 500mA
Output current
IO6
VO6 ≥ VCC-1.8
Output voltage
VO7
IO7 = 500mA
Output current
IO7
VO7 ≥ VCC-1.8
Output voltage
VO8
IO8 = 350mA
Output current
IO8
VO8 ≥ VCC-1.0
Output voltage
VO9
IO9 = 500mA
Output current
IO9
VO9 ≥ VCC-1.8
VCC-1.8
VCC-1.0
300
V
mA
EXT1-ON ; EN = ⎡M⎦, ⎡H⎦
VCC-1.8
VCC-1.0
500
V
mA
EXT2-ON ; CTRL1 = ⎡M⎦, ⎡H⎦
VCC-1.8
VCC-1.0
500
V
mA
EXT3-ON ; CTRL2 = ⎡H⎦
VCC-1.8
VCC-1.0
350
V
mA
EXT4-ON ; CTRL1 = ⎡H⎦
VCC-1.8
500
VCC-1.0
V
mA
No.A2122-4/14
LV5686PVC
Electrical Characteristics (3) at Ta = 25°C, VCC = 14.4V
Parameter
Symbol
Ratings
Conditions
min
typ
Unit
max
BATT.DET output: VCC voltage detection
BATT.DET output voltage
Voff
IOL = 1mA, undetected.
0.3
0.4
V
BATT.DET output voltage
Von
IOH = -1mA, Under-voltage1
VDD-0.4
VDD-0.3
Under-voltage
VthL1
VCC falling, BATT.DET: ”Hi-Z” → ”Hi”
6.3
6.5
6.7
V
V
VthL1r
VCC rising
6.8
7.0
7.2
V
0.4
0.5
0.6
V
detect threshold1
Under-voltage
release threshold1
Under-voltage1
Vuv1hys
Hysteresis
Under-voltage
VthL2
VCC falling, BATT.DET: ”Lo” → ”Hi-Z”
9.25
9.5
9.75
V
VthL2r
VCC rising
9.75
10
10.25
V
0.4
0.5
0.6
V
17
18
19
V
16.5
17.5
18.5
V
0.4
0.5
0.6
V
22.5
25
27.5
V
detect threshold2
Under-voltage
release threshold2
Under-voltage2
Vuv2hys
Hysteresis
Over-voltage
VthH
VCC rising, BATT.DET: ”Lo” → ”Hi-Z”
VthHr
VCC falling
detect threshold
Over-voltage
release threshold
Over-voltage
Vovhys
Hysteresis
Overvoltage shutdown
Vovp
no hysteresis
*VCC voltage detection & over-voltage shutdown
VCC
OFF
Over-voltage shutdown
25V
Hi-Z
Over-voltage
18V
17.5V
L
10V
9.5V
7V
6.5V
ON
Under-voltage2
Hi-Z
Under-voltage1
H
BATT.DET
(PIN4)
Normal operation
OUTPUT
Status
No.A2122-5/14
LV5686PVC
CTRL terminal truth table
EN
EXT1
AUDIO
ILM
AMP
CTRL1
EXT2
EXT4
CTRL2
ANT
EXT3
L
OFF
OFF
OFF
OFF
L
OFF
OFF
L
OFF
OFF
M
ON
ON
ON
OFF
M
ON
OFF
M
ON
OFF
H
ON
ON
ON
ON
H
ON
ON
H
ON
ON
EN/CTRL1/CTRL2 voltage range and threshold
5.5V
H
2.5V
2.35V(typ)
2.1V
M
1.1V
0.8V(typ)
0.5V
L
0V
Package Dimensions
unit : mm (typ)
3336
• Allowable power dissipation derating curve
Pd max -- Ta
Allowable power dissipation, Pd max -- W
8
21.6
HEAT SPREADER
(20.0)
3.0
(11.0)
(11.0)
3.35
12.4
(9.05)
(14.55)
17.9
(8.6)
(R1.75)
1
0.4
15
(1.91)
1.27
2.54 2.54
0.7
Aluminum heat sink mounting conditions
tightening torque : 39N•cm, using silicone grease
7
6
5.3
5
Aluminum heat sink (50×50×1.5mm3) when using
θja=96.15°C/W
4
3
2
1.3
1
Independent IC
θja=23.6°C/W
0
--40
--20
0
20
40
60
80
100
120
140150 160
Ambient temperature, Ta -- °C
SANYO : HZIP15
Pin assignment
1
3
5
7
9
11
13
14
ILM
GND
EXT3
12
EXT4
10
EXT2
CTRL2
CTRL1
8
AUDIO
6
VCC
EN
B.DET
4
VDD
2
EXT1
ANT
AMP
LV5686PVC
15
No.A2122-6/14
LV5686PVC
Application Circuit Example
C2
+
D3
D2
D4
EN
CTRL2
C10
+
ILM
14
13
C11
+
15
C12
+
+
+
C8 C9
VCC
GND
EXT4
EXT3
EXT2
CTRL2
CTRL1
AUDIO
12
11
CTRL1
C6 C7
VDD
ANT
10
9
+
C4 C5
AMP
8
7
C3
+
+
D1
6
5
B.DET
C1
+
VCC
4
3
EN
VDD
2
1
B.DET
EXT1
AMP
ANT
LV5686PVC
C13 C14
AUDIO
ILM
EXT2 EXT3 EXT4
EXT1
Peripheral parts
Part name
Description
Recommended value
Note
C1, C2, C3, C10, C11, C12
output stabilization capacitor for high-side switches
greater than 2.2μF
C4, C8, C13
output stabilization capacitor
greater than10μF (*1)
C5, C9, C14
output stabilization capacitor
greater than0.22μF (*1)
C6
Capacitor for bypass power supply
greater than 100μF
Make sure to implement close to
C7
Capacitor for oscillation protector
greater than 0.22μF
VCC and GND.
D1, D2, D3, D4
Internal device protector diode
SB1003M3
Ceramic capacitor
(*2)
Note: Circuit diagram and the values are only tentative and subject to change.
(*1) Make sure that total capacitance of regulator output is greater than 10μF and meets the condition of ESR = 0.001 to 10Ω , in which voltage/temperature
dependence and unit differences are taken into consideration. Moreover, in case of electrolytic capacitor, high-frequency characteristics should be
sufficiently good.
(*2) These parts are necessary if output voltage of high-side switches gets lower than GND or higher than VCC. The same consideration is required on EXT1
through EXT4.
No.A2122-7/14
LV5686PVC
Block Diagram
VCC
+B
C6
+
7
C7
AMP
CTRL
AMP
1
C1
Over/Under
Voltage
Detection
VDD
Start
up
ANT
CTRL
300mA
+
D1
ANT
2
C2
D2
300mA
+
D3
D4
Vref
EXT1
CTRL
EXT1
3
C3
BATT.DET. 4
EXT2
CTRL
500mA
+
EXT2
11
C10
500mA
+
CTRL1 8
EXT3
CTRL
EXT3
12
OUTPUT
CTRL2 10
C11
350mA
+
Control
EXT4
CTRL
EXT4
13
C12
EN 6
500mA
+
ILM9.85V
Thermal
15
C13
Shut Down
+
300mA
C14
AUDIO 9V
GND
14
9
C8
+
C9
VDD5V
5
C4
+
500mA
300mA
C5
No.A2122-8/14
LV5686PVC
Pin Function
Pin No.
1
Pin name
AMP
Description
AMP output
When EN = H,
Equivalent Circuit
VCC
7
100kΩ
AMP is ON
VCC-1V/300mA
1
2
ANT
ANT output
When CTRL2 = M or H,
5kΩ
14
GND
7
VCC
100kΩ
ANT is ON
VCC-1V/300mA
2
3
EXT1
EXT1 output
When EN = M or H,
5kΩ
14
GND
7
VCC
100kΩ
EXT1 is ON
VCC-1V/500mA
3
4
BATT.DET
Battery voltage detector output
L
: 9.5V<VCC<18V
HiZ
: 6.5V<VCC<9.5V
5kΩ
14
GND
5
VDD
or VCC>18V
H (VDD) : VCC<6.5V
4
14
100Ω
GND
Continued on next page.
No.A2122-9/14
LV5686PVC
Continued from preceding page.
Pin No.
5
Pin name
VDD
Description
Equivalent Circuit
VDD output,
5.0V/0.3A
VCC
7
5
420kΩ
140kΩ
14
6
EN
Control input
8
CTRL1
3-value input
10
CTRL2
GND
VCC
7
6
8
10kΩ
10
140kΩ
165kΩ
0.5V
85kΩ
14
7
9
VCC
AUDIO
GND
Power supply
AUDIO output
When EN = M or H,
7
VCC
14
GND
VCC
7
AUDIO is ON
9V/0.5A
9
279kΩ
45kΩ
14
11
EXT2
EXT2 output
When CTRL1 = M or H,
GND
VCC
7
100kΩ
EXT2 is ON
VCC-1V/500mA
11
14
5kΩ
GND
Continued on next page.
No.A2122-10/14
LV5686PVC
Continued from preceding page.
Pin No.
12
Pin name
EXT3
Description
Equivalent Circuit
EXT3 output
VCC
7
When CTRL2 = H,
100kΩ
EXT3 is ON
VCC-0.5V/350mA
12
13
EXT4
5kΩ
14
GND
7
VCC
EXT4 output
When CTRL1 = H,
100kΩ
EXT4 is ON
VCC-1V/500mA
13
5kΩ
14
14
GND
15
ILM
ILM output
When EN = M or H,
GND
VCC
7
ILM is ON
9.85V/0.3A
15
310kΩ
45kΩ
14
GND
No.A2122-11/14
LV5686PVC
Timing Chart
25V
18V
VCC
14.4V
7V
10V
10V
(PIN7)
17.5V
9.5V
6.5V
10V
7V
VDD output
(PIN5)
H
EN
(PIN6)
M
L
H
CTRL1
(PIN8)
CTRL2
(PIN10)
M
L
H
M
L
ILM output
(PIN15)
AUDIO output
(PIN9)
EXT1 output
(PIN3)
EXT2 output
(PIN11)
EXT3 output
(PIN12)
EXT4 output
(PIN13)
ANT output
(PIN2)
AMP output
(PIN1)
VDD-0.3V
BATT.DET
(PIN4)
(Hi-Z state)
No.A2122-12/14
LV5686PVC
HZIP15 Heat sink attachment
Heat sinks are used to lower the semiconductor device junction temperature by leading the head generated by the device to
the outer environment and dissipating that heat.
a.
Unless otherwise specified, for power ICs with tabs and power ICs with attached heat sinks, solder must not be
applied to the heat sink or tabs.
b.
Heat sink attachment
• Use flat-head screws to attach heat sinks.
• Use also washer to protect the package.
• Use tightening torques in the ranges 39-59Ncm(4-6kgcm) .
• If tapping screws are used, do not use screws with a diameter larger
than the holes in the semiconductor device itself.
• Do not make gap, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
• Take care a position of via hole .
• Do not allow dirt, dust, or other contaminants to get between the
semiconductor device and the tab or heat sink.
• Verify that there are no press burrs or screw-hole burrs on the heat sink.
• Warping in heat sinks and printed circuit boards must be no more than
0.05 mm between screw holes, for either concave or convex warping.
• Twisting must be limited to under 0.05mm.
• Heat sink and semiconductor device are mounted in parallel.
Take care of electric or compressed air drivers
• The speed of these torque wrenches should never exceed 700 rpm,
and should typically be about 400 rpm.
Binding head
machine screw
Countersunk head
mashine screw
Heat sink
gap
Via hole
c.
Silicone grease
• Spread the silicone grease evenly when mounting heat sinks.
• Our company recommends YG-6260 (Momentive Performance Materials Japan LLC)
d.
Mount
• First mount the heat sink on the semiconductor device, and then mount that assembly on the printed circuit board.
• When attaching a heat sink after mounting a semiconductor device into the printed circuit board, when tightening
up a heat sink with the screw, the mechanical stress which is impossible to the semiconductor device and the pin
doesn't hang.
e.
When mounting the semiconductor device to the heat sink using jigs, etc.,
• Take care not to allow the device to ride onto the jig or positioning dowel.
• Design the jig so that no unreasonable mechanical stress is applied to the semiconductor device.
f.
Heat sink screw holes
• Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw head used.
• When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of the screws used.
A hole diameter about 15% larger than the diameter of the screw is desirable.
• When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small. A diameter about
15% smaller than the diameter of the screw is desirable.
g.
There is a method to mount the semiconductor device to the heat sink by using a spring band. But this method is not
recommended because of possible displacement due to fluctuation of the spring force with time or vibration.
No.A2122-13/14
LV5686PVC
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damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual
performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical
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PS No.A2122-14/14