STMICROELECTRONICS GS

GS-BT2416C1.H
Bluetooth® class 1 module with embedded HCI FW
Features
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Bluetooth® specification V.1.2 compliant
Transmission rate up to 721 Kbps
Output power class 1 ( 20 dBm max)
Working distance up to 100 meters
ACL and SCO links
AFH interference resistance
Supports USB (1.1) /UART/PCM (pulse code
modulation)/SPI/ I²C interfaces
Optimized link manager and control
Support wireless LAN coexistence in
collocated scenario
Integrated 4 Mbit Flash, 64 Kbytes RAM,
4 Kbytes ROM
3.3 V single supply voltage
Hardware based UART flow control
Applications
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May 2008
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ST Bluetooth® modules are highly integrated for
easy implementation in embedded applications.
Class 1 modules enable wireless communication
with other Bluetooth® enabled devices up to
100 m away. The GS-BT2416C1.H integrates on
a unique FR4 PCB support: BT 1.2 radio and
baseband, memory, 32 kHz and 13 MHz
oscillator, Vreg as well PA function. The module
embeds customer framework up to HCI level
allowing interoperability with HCI top resident on
Host. The antenna has not been included in order
to grant a degree of freedom to the user in
selecting the most suitable design and placement
between external and integrated antenna that
could be SMA aerial or a low cost antenna trace
designed on PCB. For more details pleas refer to
GS-BT2416C1DB application note. The
GS-BT2416C1.H is the HCI module of the
GS-BT2416C1.xx series. GS-BT2416C1.H is
BQB pre-qualified. Conformance testing through
Bluetooth® qualification program enables a fast
time to market after system integration by
ensuring a high degree of compliance and
interoperability.
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Serial cable replacement
Industrial control
Laptops
POS terminals
Data acquisition equipment
Internet access points
Machine control
Sensor monitoring
Robotic and bionic control
Security control
Patient monitoring
Audio gateway applications
Hands-free sets
Wireless printers
Cordless terminals
Laptops, PCs and accessories
Hand held devices and accessories
HID devices (keyboard, mouse, joystick, game
controller...)
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Description
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www.st.com
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Contents
GS-BT2416C1.H
Contents
1
Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
2.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2
Operating ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1
4
DC I/O specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Bluetooth® section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4.1
5
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RF performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
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Integrate firmware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
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5.1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.2
Command interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.3
Usage scenarios . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
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Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6.1
Antenna reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
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Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
8
Pin settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
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8.1
8.2
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Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
10
Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
11
Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
12
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
2/19
GS-BT2416C1.H
1
Certifications
Certifications
●
●
CE compliant (IMQ Exp. opinion 0081-AREF00017)
–
Safety EN60950-1 (2001)
–
EMC EN301 489 17V1.2.1
–
Radio ES 300 328 V1.6.
–
FCC certified on GS-BT2416C1DB (for a more exhaustive explanation, please
refer to GS-BT2416C1DB application note)
–
FCC ID: S9NBT2416C1DB
BQB compliant
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3/19
Maximum ratings
GS-BT2416C1.H
2
Maximum ratings
2.1
Absolute maximum ratings
Absolute maximum ratings (see Table 1) indicate limits beyond which damage to the device
may occur. Sustained exposure to these limits will adversely affect device reliability.
Operating ranges (see Table 2) define the limits for functional operation and parametric
characteristics of the module. Functionality outside these limits is not implied.
Table 1.
Absolute maximum ratings
Values
Symbol
Parameter
Unit
Min
2.2
VDD
Module supply voltage
VIN
Input voltage on any digital pin
Tstg
Storage temperature
Tsold
Soldering temperature
Symbol
Parameter
VDD
Module supply voltage
Tstg
Operating ambient
temperature
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V
Vss1-0.5 Vdd+0.3
-40
+85
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240
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Operating ranges
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4
Operating ranges
Table 2.
Max
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Values
Conditions
- 20 °C < T < 70 °C
V
Unit
Min
Typ
Max
3.13
3.3
3.47
V
+70
°C
-20
GS-BT2416C1.H
Electrical characteristics
3
Electrical characteristics
3.1
DC I/O specification
Table 3.
DC input / output specification
Values
Symbol
Parameter
Conditions
Unit
Min
Low level input voltage
3.13 V < VDD < 3.47 V
Vih
High level input voltage
3.13 V < VDD < 3.47 V
2
V
Vhyst
Schmitt trigger hysteresis
3.13 V < VDD < 3.47 V
0.4
V
Vol
Low level output voltage
Io load = pin drive
capability
Voh
High level output voltage
Io load = pin drive
capability
Table 4.
Bluetooth® section
Symbol
Parameter
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Channel space
Hop
Hopping
13M CK
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0.15
VDD0.15
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Values
Unit
Min
Typ
Max
1
MHz
1600
Hops/
sec
13
MHZ
- 20
Low power clock
Low power clock accuracy
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Conditions
- 20 °C to 70 °C
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System clock
System clock stability
LP CK
0.8
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Max
Vil
Bluetooth® section
4
Typ
20
32
- 200
ppm
kHz
200
ppm
Tra
Transmission rate
asynchronous
721
Kbits/
sec
Trs
Transmission rate
synchronous
432
Kbits/
sec
Operation current TX mode
180
mA
Operation RX mode
60
mA
Iop
5/19
Bluetooth® section
4.1
GS-BT2416C1.H
RF performance characteristics
In the performance characteristics table the following applies:
●
Test condition: nominal
– Voltage typical Vdd 3.3 V
– Temperature typical TA = 25 °C
Parameters are given at antenna pin
Table 5.
Transmitter and receiver performance characteristics
Symbol
TX Pout
ACP
RX sens
Table 6.
Parameter
TX output power
TX output spectrum adjacent
channel power
Receiver sensitivity
Parameter
RF in
RF out
Input and output frequency range
TX out
TX output spectrum at -20 dB
Bandwidth
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Typ
Max
Unit
2.402 GHz
18
20
dBm
2.441 GHz
18
20
dBm
2.480 GHz
18
20
dBm
lM-Nl = 2
- 36
lM-Nl ≥ 3
- 44
@BER 0.1 %
- 84
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TX carrier frequency drift
Min
dBm
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Conditions
dBm
Max
Unit
2480
MHz
1000
kHz
75
kHz
DH1 data
packet
25
kHz
DH3 data
packet
40
kHz
DH5 data
packet
40
kHz
Drift rate
20
Hz
2402
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TX initial carrier frequency
tolerance
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l∆F/50µsl
Min
Synthesizer performance characteristics
Symbol
∆F
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Conditions
- 75
920
GS-BT2416C1.H
5
Integrate firmware
Integrate firmware
The GS-BT2416C1.H includes customer framework up to HCI (host control interface)
Figure 1.
HCI firmware implementation
HCI Top
resident on the Host
HCI Physical
HCI Bottom
Serial Interface Layer
UART, USB, …
AUDIO
SCO channels –
Synchronous Connection
Oriented
5.1
resident on the Module
HCI FIRMWARE
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LINK MANAGER
Hardware Layer
BASEBAND HW
Set up the physical
connection
RF H W
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Host Control Interface
Between lower and
upper levels
Set up, manage and secure
the link: it’s responsible for
paging, including ACL, SCO,
inquiry, authentication,
encryption, low
consumption...
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The module with HCI embedded is interoperable with qualified BT stack protocols and
suitable for any BT applications.
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Command interface
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The HCI commands are accessible through the serial port using the host control SW any
HCI SW for example bluesoleil (most popular Bluetooth® PC open SW).
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5.3
The module with embedded HCI FW is completely open to any custom implementation,
strictly depending on the BT stack and profiles that will be added. Module can be configured
both as master or slave. Master can support point to point connection or standard point to
multi point Pico net up to seven points.
7/19
Application information
6
GS-BT2416C1.H
Application information
Here below there are some suggestions to better implement the module in the final
application.
●
Module is usually put on a motherboard, avoid that traces with switching signals are
routed below the module. The best would be to have a ground plane underneath the
module.
●
Connect the supply voltage ground of the module with the other grounds present on the
motherboard in a star way.
●
Keep the RF ground separate from the module supply voltage ground; the two grounds
are already connected inside the module in one point, see below a possible
implementation.
Figure 2.
Module foot print
Supply voltage GND
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RF gnd
Module
foot print
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GS-BT2416C1.H
6.1
Application information
Antenna reference
RF output pin must be connected to an antenna which could be:
Figure 3.
●
Antenna directly printed on the pcb (Figure 3.)
●
Integrated antenna as, for example, antenova® 30-30-A5839-01, Murata
ANCV12G44SAA127, pulse W3008, Yageo CAN4311153002451K. (Figure 4.)
●
External antenna connected by means a SMA connector (Figure 5.)
Antenna on PCB
Figure 4.
Antenna examples
SMA connector for
external antenna
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Despite of the type of antenna chosen, the connection between the RF out pin and the
antenna must be executed in such a way that the connection trace must be matched to
have characteristic impedance (Z0) of 50 Ω to get the maximum power transfer.
●
Matching for 50 Ω is depending on the various factors, elements to be taken into
consideration are:
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Type of material, i.e. FR4
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The electrical characteristics of the material, i.e. the εr, electric constant at
2.4 GHz
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Mechanical dimensions of the PCB and traces, i.e. PCB thickness, trace/
reference ground thickness, trace width, trace thickness.
–
Just to give an example, using a 1 mm thick FR4 board, with an εr = 4.3 at
2.4 GHz, with Cu thickness of 41 µm, the resulted width of 50 Ω strip-line is
1.9 mm (Microstrip type calculation).
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Figure 6.
Parameters for trace matching
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Trace width
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Figure 5.
PCB
thickness
Trace thickness
εr (Dielectric constant)
Reference ground
Tools for calculating the characteristic impedance, based on the physical and mechanical
characteristics of the PCB, can be easily found on the web.
9/19
Block diagram
7
GS-BT2416C1.H
Block diagram
Figure 7.
Block diagram
RF antenna
32kHz
XTAL
UART
32kHz
XTAL
USB
PCM
PA
SPI
STLC2416
Baseband
ARM7 proc
I²C
GPIO
STLC2150
Radio chip
SW
Filter
LNA
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GS-BT2416C1.H
Pin settings
8
Pin settings
8.1
Pin connections
Figure 8.
Pin connection diagram
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Pin settings
GS-BT2416C1.H
8.2
Pin descriptions
Table 7.
Pin descriptions
Pin N°
Name
I/O
Description
Power, ground and system signal
1
Vss1
---
GND
2
Vdd
---
Module supply voltage- single 3.3 V
41
1V8
O
1.8 V digital supply out (test purpose) to be left not connected
42
3V3
O
3.3 V I/O power supply out (test purpose) to be left not connected
43
Vss1
---
GND (test purpose) to be left not connected
44
2V7
O
2.7 digital core supply out (test purpose) to be left not connected
45
RESET
I
Reset pin (active low)
46
BOOT
I
External downloading enable (active low) internally pull-upped to 1.8 V by 10 kΩ
13
LP CLOCK
OUT
O
32 kHz out
I
External Interrupt signal internally connected to VSS1 with 10 kΩ / If not used
connect to VSS1
26
INT1
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General purpose signals
3
GPIO0
I/O General purpose I/O line
4
GPIO1
I/O General purpose I/O line
5
GPIO2
I/O General purpose I/O line
6
GPIO3
I/O General purpose I/O line
7
GPIO4
I/O General purpose I/O line
8
GPIO5
I/O General purpose I/O line
10
GPIO7
I/O General purpose I/O line
11
GPIO8
I/O General purpose I/O line
12
GPIO9
I/O General purpose I/O line
14
GPIO11
I/O General purpose I/O line
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No connect signals
9
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I/O Not to be used internally used for RX/TX switch
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I/O Not to be used internally used for TX gain setting
16
----
I/O Not to be used internally used for TX gain setting
17
----
I/O Not to be used internally used for TX gain setting
18
----
I/O Not to be used internally used for TX gain setting
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Table 7.
Pin N°
Pin settings
Pin descriptions (continued)
Name
I/O
Description
Test interface signals
19
TDI
---
JTAG pin
20
TDO
---
JTAG pin
21
TMS
---
JTAG pin
22
NTRST
---
JTAG pin
23
TCK
---
JTAG pin If not used connect to VSS1
I2C interface signals
24
I2C_dat
I/O I2C bus interface data to be connected to VDD with 10 kΩ resistor
25
I2C_clk
I/O I2C bus interface clock to be connected to VDD with 10 kΩ resistor
PCM interface signals
27
PCM_SYNC
I/O PCM 8 kHz synch
28
PCM_CLK
29
PCM_A
I/O PCM data in/out
30
PCM_B
I/O PCM data in//out
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I/O PCM clock
USB interface signals
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USB_DN
I/O USB data - If not used connect to VSS1
32
USB_DP
I/O USB data + If not used connect to VSS1
UART interface signals
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33
UART2_RXD
I
UART2 data input If not used connect to VDD
34
UART2_TXD
O
UART2 data output
35
UART2_I1
I
UART2 clear to send input If not used connect to VDD
36
UART2_02
O
UART2 ready to send output
47
UART10_TXD
O
UART1 data output
48
UART11_RXD
I
UART1 data input If not used connect to VDD
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SPI interface signals
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37
SPI_FRM
I/O Synchronous serial interface frame synch
SPI_CLK
I/O Synchronous serial Interface clock
39
SPI_TXD
O/T Synchronous serial Interface transmit data
40
SPI_RXD
bs
38
O
I
Synchronous serial Interface receive data If not used connect to VSS1
Antenna signals
49
Vss2 ( RF GND)
---
RF GND
50
+ANTENNA
---
Antenna out
51
Vss2 (RF GND)
---
RF GND
13/19
Soldering
9
GS-BT2416C1.H
Soldering
Soldering phase has to be execute with care: in order to avoid undesired melting
phenomenon, particular attention has to be take on the set up of the peak temperature.
Here following some suggestions for the temperature profile based on
IPC/JEDEC J-STD-020C, July 2004 recommendations.
Table 8.
Soldering
Profile feature
PB free assembly
Average ramp up rate (TSMAX to TP)
3 °C / sec max
Preheat
Temperature min (TS min)
Temperature max (TS max)
Time (tS min to tS max) (tS)
150 °C
200 °C
60 – 100 sec
Time maintained above:
Temperature TL
Time tL
217 °C
40 – 70 sec
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Peak temperature (Tp)
Time within 5 °C of actual peak temperature (tP)
10 – 20 sec
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Ramp down rate
Time from 25 °C to peak temperature
Figure 9.
Soldering
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240 + 0 °C
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6 °C / sec
8 minutes max
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GS-BT2416C1.H
10
Mechanical dimensions
Mechanical dimensions
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 10. Mechanical dimensions
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Mechanical dimensions
GS-BT2416C1.H
Figure 11. Land pattern
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GS-BT2416C1.H
11
Ordering information scheme
Ordering information scheme
Table 9.
Ordering information scheme
GS-BT
2416
C1
H
Bluetooth® modules
V 1.2 compliant
Class 1
Embedded HCI
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Revision history
12
GS-BT2416C1.H
Revision history
Table 10.
Revision history
Date
Revision
Changes
31-Aug-2006
1
First release
27-May-2008
2
Updated: Cover page
Added: Section 9 on page 14
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GS-BT2416C1.H
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