EH-MC10 Bluetooth® technology low energy module • Bluetooth® radio - Fully embedded Bluetooth® v4.0 single mode - TX power +6 dbm,-92.5dbm RX sensitivity - 128-bit encryption security - Range up to 100m - Integrated chip antenna or U.FL port - Multipoint capability(2devices at master) • Support profiles BLE (Master and slave) - The generic attribute profile (GATT) - Health care, Sports and fitness, Proximity sensing profiles - Alerts and timer profiles • User interface - Send AT command over UART - Firmware upgrade over the air (OTA) - Transmit data: 300kbps transmission speed (UART) - I2C interface(Master ) - SPI - PWM(4 channal) • General I/O - 10 general purpose I/Os - 3 analogue I/O (10bit ADC) • FCC and Bluetooth® qualified • Single voltage supply: 3.3V typical • Small form factor: 17.70 x 11.95x 2.2mm • Operating temperature range: -40 °C to 85 °C Version 2.0 July 21 2014 Shanghai Ehong Technologies Inc Bluetooth Low Energy Module 1. Contents 1. Description .........................................................................................................................................................3 2. Applications .......................................................................................................................................................4 3. EH-MC10 Product numbering ........................................................................................................................4 4. Electrical Characteristics................................................................................................................................4 4.1. Recommended Operation Conditions ......................................................................................................4 4.2. Absolute Maximum Rating .........................................................................................................................5 4.3. Input/Output Terminal Characteristics .....................................................................................................5 4.4. Power Consumption ...................................................................................................................................6 5. Pinout and Terminal Description ..................................................................................................................7 5.1. 6. Pin Configuration .........................................................................................................................................7 Physical Interfaces ...........................................................................................................................................9 6.1. Power Supply ...............................................................................................................................................9 6.2. PIO ................................................................................................................................................................9 6.3. AIO ................................................................................................................................................................9 6.4. PWM .............................................................................................................................................................9 6.5. UART .......................................................................................................................................................... 10 6.6. I2C Master .................................................................................................................................................. 10 6.7. SPI Master ................................................................................................................................................. 10 6.8. SPI Debug .................................................................................................................................................. 11 7. Reference Design ........................................................................................................................................... 11 8. Layout and Soldering Considerations ...................................................................................................... 11 8.1. Soldering Recommendations .................................................................................................................. 11 8.2. Layout Guidelines ..................................................................................................................................... 12 9. Mechanical and PCB Footprint Characteristics ...................................................................................... 13 10. Reflow Profile............................................................................................................................................... 14 11. Contact Information ................................................................................................................................... 15 Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module 2. Table of Tables TABLE 1: RECOMMENDED OPERATION CONDITIONS....................................................................................................4 TABLE 2：ABSOLUTE MAXIMUM RATING......................................................................................................................5 TABLE 3: DIGITAL I/O CHARACTERISTICS .....................................................................................................................5 TABLE 4: AIO CHARACTERISTICS .................................................................................................................................5 TABLE 5 ESD PROTECTION ..........................................................................................................................................6 TABLE 6: CURRENT CONSUMPTION ..............................................................................................................................6 TABLE 7：PIN TERMINAL DESCRIPTION.......................................................................................................................8 TABLE 8: POSSIBLE UART SETTINGS ........................................................................................................................ 10 3. Table of Figures FIGURE 1： PINOUT OF EH-MC10 ..............................................................................................................................7 FIGURE 2： POWER SUPPLY PCB DESIGN .................................................................................................................9 FIGURE 3： CONNECTION TO HOST DEVICE .............................................................................................................. 10 FIGURE 4： REFERENCE DESIGN ............................................................................................................................... 11 FIGURE 5: CLEARANCE AREA OF ANTENNA................................................................................................................. 12 FIGURE 6 ：PHYSICAL DIMENSIONS AND RECOMMENDED FOOTPRINT (UNIT: MM, DEVIATION:0.02MM) ................ 13 FIGURE 7: RECOMMENDED REFLOW PROFILE........................................................................................................... 14 1. Description EH-MC10 Bluetooth® low energy single mode module is a single mode device targeted for low power sensors and accessories. Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module The module offers all Bluetooth® low energy features: radio, stack, profiles and application space for customer applications, so no external processor is needed. The module also provides flexible hardware interfaces to connect s e n s o r s , s i m p l e u s e r i n t e r f a c e s o r even displays directly to the module. The module can be powered directly with a standard 3V coin cell batteries or pair of AAA batteries. In lowest power sleep mode it consumes only 600nA and will wake up in few hundred microseconds. After buying Bluetooth® module, we provide free technical support APP of iOS system or APP Android system. 2. Applications Sports and fitness Healthcare Home entertainment Office and mobile accessories Automotive Commercial Watches Human interface devices 3. EH-MC10 Product numbering EH-MC10X A. EH ------------- B. MC10 ------------ C. X ------------ Company Name(EHong) Module Name A = Antenna B =U.FL 4. Electrical Characteristics 4.1. Recommended Operation Conditions Table 1: Recommended Operation Conditions Operating Condition Min Typical Max Unit Operating Temperature Range -30 -- +80 °C Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module Battery (VDD_BAT) operation 1.8 -- +3.6 V I/O Supply Voltage (VDD_PIO) 1.2 -- +3.6 V 0 - +1.3 V 2480 MHz AIO input Frequency range 2402 Table 2：Absolute Maximum Rating 4.2. Absolute Maximum Rating Rating Min Max Unit Storage Temperature -40 +85 °C Battery (VBAT) operation* 1.8 3.6 V I/O supply voltage -0.4 +3.6 V Vss-0.4 VBAT+0 .4 V Other Terminal Voltages except RF * Short-term operation up to a maximum of 10% of product lifetime is permissible without damage, but output regulation and other specifications are not guaranteed in excess of 4.2V. 4.3. Input/Output Terminal Characteristics Table 3: Digital I/O Characteristics Input Voltage Levels Min Typical Max Unit VIL input logic level low -0.4 - 0.4 V VIH input logic level high 0.7 x VDD - VDD + 0.4 V - - 25 ns Min Typical Max Unit - - 0.4 V 0.75 x VDD - -- V - - 5 ns Input and Tri-state Current Min Typical Max Unit With strong pull-up -150 -40 -10 μA 10 40 150 μA With weak pull-up -5.0 -1.0 -0.33 μA With weak pull-down 0.33 +1.0 5.0 μA CI Input Capacitance 1.0 - 5.0 pF Tr/Tf Output Voltage Levels VOL output logic level low, lOL = 4.0mA VOH output logic level high, lOH = -4.0mA Tr/Tf With strong pull-down Table 4: AIO Characteristics Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module Input Voltage Levels Min Typical Max Unit 0 - 1.3 V AIO Table 5 ESD Protection Condition Class Max Rating Human Body Model Contact Discharge per JEDEC EIA/JESD22-A114 Machine Model Contact Discharge per JEDEC EIA/JESD22A115 Charged Device Model Contact Discharge per JEDEC EIA/JESD22-C101 2 2000V (all pins) 200V (all pins) 500V (all pins) 200V III 4.4. Power Consumption The current consumption are measured at the VBAT Table 6: Current Consumption Mode Description Total typical current at 3.3V (average) Hibernate All functions are shutdown. To wake up toggle the WAKE pin All functions are shutdown except for the sleep clock. The module can wake up on a timer on the sleep clock. Deep sleep VDD=3.3V 1ms wake up time <5uA Idea VDD=3.3V <1us wake up time 1mA RF RX /TX active (0dBm) VDD=3.3V VDD_PIO=3.3V Dormant Shanghai Ehong Technologies Co., Ltd <600nA <1.5uA ~16mA @3V peak Bluetooth Low Energy Module 5. Pinout and Terminal Description 5.1. Pin Configuration Figure 1： Pinout of EH-MC10 Symbol Pin PAD Type Description GND 1 Ground Ground AIO2 AIO1 AIO0 UART_TX UART_RX 2 Bidirectional analogue 3 Bidirectional analogue 4 5 6 7 PIO3 8 PIO4 Bidirectional analogue CMOS output, tristate, with weak internal pull-up CMOS input with weak internal pulldown Bi-directional with programmable strength internal pull-up/down Bi-directional with programmable strength internal pull-up/down 9 Bi-directional with programmable strength internal pull-up/down PIO5/SPI_CLK GND 10 Shanghai Ehong Technologies Co., Ltd Ground 10bit Analogue programmable I/O line 10bit Analogue programmable I/O line 10bit Analogue programmable I/O line UART data output UART data input Programmable input/output line PWM or LED Controls Programmable input/output line PWM or LED Controls Programmable input/output line Or debug SPI_CLK select by SPI_PIO_SEL Ground Bluetooth Low Energy Module I2C_SDA 11 Bi-directional tristate with weak internal pull-up I2C_SCL 12 Input with weak internal pull-up PIO2 13 Bi-directional with programmable strength internal pull-up/down PIO6/SPI_CSB PIO7/SPI_MOSI VCC_PIO PIO8/SPI_MISO 14 Bi-directional with programmable strength internal pull-up/down 15 Bi-directional with programmable strength internal pull-up/down 16 Powered 17 Bi-directional with programmable strength internal pull-up/down PIO9 18 Bi-directional with programmable strength internal pull-up/down GND 19 Ground PIO10 20 Bi-directional with programmable strength internal pull-up/down PIO11 SPI_PIO_S NP VBAT I2C data input/output or SPI serial flash data output(SF_OUT) I2C clock or SPI serial flash clock output (SF_CLK) Programmable input/output line Programmable input/output line Or debug chip select, selected by SPI_PIO_SEL Programmable input/output line Or debug SPI_MOSI, selected by SPI_PIO_SEL PIO power supply Programmable input/output line Or debug SPI_MISO, selected by SPI_PIO_SEL Programmable input/output line PWM or LED Controls Ground 21 Bi-directional with programmable strength internal pull-up/down Programmable input/output line PWM or LED Controls Programmable input/output line 22 Input with strong internal pull-down Selects SPI debug on (8:5) 23 NP NP 24 Power supply Button cell battery or DC 1.8V to 3.6V GND 25 Ground Ground NP 26 NP NP 27 Input has no internal pull-up or pulldown use external pull-down Set high to wake the module from hibernate. Use an external pull-down for this pin. 28 Ground Ground WAKE_UP GND Table 7：PIN Terminal Description Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module 6. Physical Interfaces 6.1. Power Supply - The module power supply 3v coin cell batteries or DC 3.3v Power supply pin connection capacitor to chip and pin as far as possible close Capacitor decouples power to the chip Capacitor prevents noise coupling back to power plane. - Figure 2： Power Supply PCB Design 6.2. PIO 10 PIOs are provided (4 are multiplexed with SPI debug interface). They are powered from VDD_PIO. PIO lines are software-configurable as weak pull-up, weak pull-down, strong pull-up or strong pull-down. Note: At reset all PIO lines are inputs with weak pull-downs. Any of the PIO lines can be configured as interrupt request lines or as wake-up lines from sleep modes. 6.3. AIO 3 AIOs are provided. They can be connected to internal 10 bits ADC. Their functions depend on software. They can be used to read or output a voltage between 0V to 1.3V. Each of them can be used as a digital output with special firmware. 6.4. PWM 4 PIOs (PIO3, PIO4, PIO9, and PIO10) can be driven by internal PWM module. The PWM module also works while the module is sleep. So it can be used as a LED flasher. These functions are controlled by special firmware. Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module 6.5. UART This is a standard UART interface for communicating with other serial devices. The UART interface provides a simple mechanism for communicating with other serial devices using the RS232 protocol. Table 8: Possible UART Settings Parameter Baud Rate Possible Values Minimum Maximum Flow Control Parity Number of Stop Bits Bits per Byte 1200 baud (≤2%Error) 9600 baud (≤1%Error) 2M baud (≤1%Error) RTS/CTS or None None, Odd or Even 1 or 2 8 Figure 3： Connection To Host device 6.6. I2C Master The module can act as an I2C master when configured by software. Any two PIOs can be configured as I2C_SCL and I2C_SDA. 6.7. SPI Master The module can act as an SPI master (mode 0) when configured by software. Any four PIOs can be configured as SPI_CLK, SPI_CS#, SPI_DIN and SPI_DOUT. The clock rate of the software SPI is around 470kHz. Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module 6.8. SPI Debug The SPI Debug interface is chosen when SPI_PIO_S is high. The interface is used to program and debug the module. So always place test points or header on PCB for this interface and SPI_PIO_SEL. 7. Reference Design Figure 4： Reference Design 8. Layout and Soldering Considerations 8.1. Soldering Recommendations EH-MC10 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste used. Consult the datasheet of particular solder paste for profile configurations. Comply will give following recommendations for soldering the module to ensure reliable solder joint and operation of the module after soldering. Since the profile used is Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module process and layout dependent, the optimum profile should be studied case by case. Thus following recommendation should be taken as a starting point guide. Refer to technical documentations of particular solder paste for profile configurations Avoid using more than one flow. Reliability of the solder joint and self-alignment of the component are dependent on the solder volume. Minimum of 150um stencil thickness is recommended. Aperture size of the stencil should be 1:1 with the pad size. A low residue, “no clean” solder paste should be used due to low mounted height of the component. 8.2. Layout Guidelines For optimal performance of the antenna place the module at the corner of the PCB as shown in the figure 3. Do not place any metal (traces, components, battery etc.) within the clearance area of the antenna. Connect all the GND pins directly to a solid GND plane. Place the GND vias as close to the GND pins as possible. Use good layout practices to avoid any excessive noise coupling to signal lines or supply voltage lines. Avoid placing plastic or any other dielectric material closer than 6 mm from the antenna. Any dielectric closer than 6 mm from the antenna will detune the antenna to lower frequencies. Figure 5: Clearance area of antenna Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module 9. Mechanical and PCB Footprint Characteristics Figure 6 ：Physical Dimensions and Recommended Footprint (Unit: mm, Deviation:0.02mm) Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module 10. Reflow Profile The soldering profile depends on various parameters necessitating a set up for each application. The data here is given only for guidance on solder reflow. ℃ 250 217 210 A 25 0 B 1 2 C 3 D 4 E 5 6 min Figure 7: Recommended Reflow Profile Pre-heat zone (A) — This zone raises the temperature at a controlled rate, typically 0.5 – 2 C/s. The purpose of this zone is to preheat the PCB board and components to 120 ~ 150 C. This stage is required to distribute the heat uniformly to the PCB board and completely remove solvent to reduce the heat shock to components. Equilibrium Zone 1 (B) — In this stage the flux becomes soft and uniformly encapsulates solder particles and spread over PCB board, preventing them from being re-oxidized. Also with elevation of temperature and liquefaction of flux, each activator and rosin get activated and start eliminating oxide film formed on the surface of each solder particle and PCB board. The temperature is recommended to be 150 to 210 for 60 to 120 second for this zone. Equilibrium Zone 2 (c) (optional) — In order to resolve the upright component issue, it is recommended to keep the temperature in 210 – 217 for about 20 to 30 second. Reflow Zone (D) — The profile in the figure is designed for Sn/Ag3.0/Cu0.5. It can be a reference for other lead-free solder. The peak temperature should be high enough to achieve good wetting but not so high as to cause component discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. The recommended peak temperature (Tp) is 230 ~ 250 C. The soldering time should be 30 to 90 second when the temperature is above 217 C. Cooling Zone (E) — The cooling ate should be fast, to keep the solder grains small which will give a longerlasting joint. Typical cooling rate should be 4 C. Shanghai Ehong Technologies Co., Ltd Bluetooth Low Energy Module 11. Contact Information Sales: [email protected] Technical support: [email protected] Phone: +86 21 61139798 Fax: +86 21 61263536 Street address: Rom501,No 3 building ,#439 jinglianRd ,Minghang district shanghai Shanghai Ehong Technologies Co., Ltd