STPR1620CG/CT/CR ® ULTRA-FAST RECOVERY RECTIFIER DIODES MAIN PRODUCTS CHARACTERISTICS IF(AV) A1 2x8A VRRM 200 V Tj (max) 150°C VF (max) 0.99 V trr (max) 30 ns K A2 K K A2 A1 2 D PAK STPR1620CG FEATURES SUITED FOR SMPS LOW LOSSES LOW FORWARD AND REVERSE RECOVERY TIME HIGH SURGE CURRENT CAPABILITY ■ ■ ■ ■ DESCRIPTION e t le o s b O - ) s ( ct o r P K A1 A2 A2 TO-220AB STPR1620CT Low cost dual center tap rectifier suited for Switched Mode Power Supplies and high frequency DC to DC converters. Packaged in D2PAK, I2PAK or TO-220AB, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. c u d ) s t( A1 K I2PAK STPR1620CR u d o r P e ABSOLUTE RATINGS (limiting values, per diode) t e l o Symbol bs O Parameter Value Unit VRRM Repetitive peak reverse voltage 200 V IF(RMS) RMS forward current 20 A IF(AV) Average forward current δ = 0.5 Tc=120°C Per diode Per device 8 16 A IFSM Surge non repetitive forward current tp=10ms sinusoidal 80 A Tstg Storage temperature range Tj Maximum operating junction temperature Octobert 2002 - Ed: 3C - 65 to + 150 °C 150 °C 1/7 STPR1620CG / STPR1620CT / STPR1620CR THERMAL RESISTANCES Symbol Rth (j-c) Parameter Junction to case Rth (c) Value Unit Per diode 3.0 °C/W Total 1.8 °C/W Coupling 0.6 °C/W When the diodes 1 and 2 are used simultaneously : ∆ Tj(diode 1) = P(diode 1) x Rth(j-c) (Per diode) + P(diode 2) x Rth(c) STATIC ELECTRICAL CHARACTERISTICS Symbol Test conditions Tj = 25°C IR * Min. Max. Unit 50 µA 0.2 0.6 mA VR = VRRM Tj = 100°C VF ** Typ. ) s t( Tj = 125°C IF = 8 A 0.8 0.99 Tj = 125°C IF = 16 A 0.95 1.20 Tj = 25°C IF = 16 A c u d 1.25 Pulse test : * tp = 5 ms, δ < 2 % ** tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation : P = 0.78 x IF(AV) + 0.026 x IF2(RMS) RECOVERY CHARACTERISTICS Symbol e t le o s b O - Test conditions (s) V o r P Min. Typ. Unit 30 ns trr Tj = 25°C IF = 0.5A IR = 1A tfr Tj = 25°C IF = 3A VFR = 1.1 x VF max dIF/dt = 50 A/µs 20 ns VFP Tj = 25°C IF = 3A dIF/dt = 50 A/µs 3 V d o r P e t e l o s b O 2/7 t c u Irr = 0.25A Max. STPR1620CG / STRP1620CT / STPR1620CR Fig. 1: Average forward power dissipation versus average forward current (per diode). Fig. 2: Peak current versus form factor (per diode). Fig. 3: Average current versus ambient temperature (δ : 0.5, per diode). Fig. 4: Non repetitive surge peak forward current versus overload duration (maximum values, per diode). c u d e t le ) s ( ct u d o r P e ) s t( o r P o s b O - Fig. 5: Relative variation of thermal transient impedance junction to case versus pulse duration (per diode). Fig. 6: Forward voltage drop versus forward current (maximum values, per diode). t e l o s b O 3/7 STPR1620CG / STPR1620CT / STPR1620CR Fig. 7: Junction capacitance versus reverse voltage applied (typical values, per diode). Fig. 8: Recovery charges versus dIF/dt (per diode). H Fig. 9: Peak reverse current versus dIF/dt (per diode). c u d e t le ) s ( ct o r P o s b O - u d o r P e t e l o s b O Fig. 11: Thermal resistance junction to ambient versus copper surface under tab (epoxy printed circuit board, CU = 35µs) (STPR1620CG only). Rth(j-a) (°C/W) 80 70 60 50 40 30 20 10 0 4/7 S(Cu) (cm²) 0 2 4 6 8 ) s t( Fig. 10: Dynamic parameters versus junction temperature (per diode). 10 12 14 16 18 20 STPR1620CG / STRP1620CT / STPR1620CR PACKAGE MECHANICAL DATA D2PAK (Plastic) REF. A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm ) s ( ct FOOT PRINT (in millimeters) r P e t e l o s b O c u d e t le ) s t( o r P o s b O - u d o 16.90 10.30 A A1 A2 B B2 C C2 D E G L L2 L3 M R V2 DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.40 4.60 0.173 0.181 2.49 2.69 0.098 0.106 0.03 0.23 0.001 0.009 0.70 0.93 0.027 0.037 1.14 1.70 0.045 0.067 0.45 0.60 0.017 0.024 1.23 1.36 0.048 0.054 8.95 9.35 0.352 0.368 10.00 10.40 0.393 0.409 4.88 5.28 0.192 0.208 15.00 15.85 0.590 0.624 1.27 1.40 0.050 0.055 1.40 1.75 0.055 0.069 2.40 3.20 0.094 0.126 0.40 typ. 0.016 typ. 0° 8° 0° 8° 5.08 1.30 3.70 8.90 5/7 STPR1620CG / STPR1620CT / STPR1620CR PACKAGE MECHANICAL DATA I2PAK REF. DIMENSIONS Millimeters Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 b 0.70 0.93 0.028 0.037 b1 1.14 1.17 0.044 0.046 b2 1.14 1.17 0.044 0.046 c 0.45 0.60 0.018 0.024 c2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 e 2.40 2.70 0.094 E 10.0 10.4 L 13.1 13.6 A E c2 L2 D L1 A1 b2 L b1 b c u d o r P e t e l o s b O 6/7 o s b O - 3.48 c u d ro P e let L1 e ) s ( ct Inches 3.78 0.394 ) s t( 0.368 0.106 0.409 0.516 0.535 0.137 0.149 STPR1620CG / STPR1620CT / STPR1620CR PACKAGE MECHANICAL DATA TO-220AB (JEDEC outline) REF. H2 A C L5 L7 Dia OPTIONAL L6 L2 L9 D F2 F1(x2) L4 M F E G1 G ■ o s b O - Package Weight Base qty Delivery mode STPR1620CT STPR1620CT TO-220AB STPR1620CR ■ e t le o r P Marking STPR1620CG-TR ■ c u d ) s t( Ordering type STPR1620CG ■ A C D E F F1 F2 G G1 H2 L2 L4 L5 L6 L7 L9 M Dia. DIMENSIONS Millimeters Inches Min. Max. Min. Max. 4.30 4.60 0.169 0.181 1.22 1.32 0.048 0.052 2.40 2.72 0.094 0.107 0.33 0.70 0.013 0.028 0.61 0.93 0.024 0.037 1.14 1.70 0.045 0.067 1.14 1.70 0.045 0.067 4.95 5.15 0.195 0.202 2.40 2.70 0.094 0.106 10.00 10.40 0.394 0.409 16.00 Typ. 0.630 Typ. 13.00 14.00 0.512 0.551 2.65 2.95 0.104 0.116 14.80 15.75 0.583 0.620 6.20 6.60 0.244 0.260 3.40 3.94 0.134 0.155 2.60 Typ. 0.102 Typ. 3.75 3.89 0.148 0.153 STPR1620CG uc STPR1620CG STPR1620 od (t s) 2.23 g 50 Tube 2 1.48 g 50 Tube 2 1.48 g 1000 Tape & reel 2 1.49 g 50 Tube D PAK D PAK I PAK Cooling method : by conduction (C) Recommended torque value : 0.55N.m. Maximum torque value : 0.7N.m. Epoxy meets UL94,V0 r P e t e l o s b O Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 2002 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 7/7