STTH3002C ® HIGH EFFICIENCY ULTRAFAST DIODE MAIN PRODUCT CHARACTERISTICS IF(AV) 2 x 15A A1 VRRM 200 V A2 Tj (max) 175 °C VF (typ) 0.75 V trr (typ) 17 ns K FEATURES AND BENEFITS ■ ■ ■ ■ ■ ■ A2 A2 K Suited for SMPS Low losses Low forward and reverse recovery times High surge current capability High junction temperature Low leakage current DESCRIPTION Dual center tap rectifier suited for Switch Mode Power Supplies and High frequency DC to DC converters. Packaged in TO-220AB, D2PAK, TO-247 and I2PAK, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. K A1 A1 I2PAK STTH3002CR TO-220AB STTH3002CT K K A2 K A1 TO-247 STTH3002CW A2 A1 D2PAK STTH3002CG ABSOLUTE RATINGS (limiting values) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 200 V IF(RMS) RMS forward current 50 A A IF(AV) Average forward current δ =0.5 IFSM Surge non repetitive forward current Tstg Storage temperature range Tj Maximum operating junction temperature February 2004 - Ed: 1 Tc = 155°C Per diode 15 Tc = 145°C Per device 30 tp = 10 ms Sinusoidal 180 A - 65 + 175 °C 175 °C 1/7 STTH3002C THERMAL PARAMETERS Symbol Parameter Rth (j-c) Junction to case Rth (j-c) Maximum Unit Per diode 1.5 °C/W Per device 1.0 0.5 Coupling °C/W When the diodes 1 and 2 are used simultaneously: ∆ Tj (diode1) = P(diode1) x Rth(j-c) (per diode) + P(diode2) x Rth(c) STATIC ELECTRICAL CHARACTERISTICS Symbol Parameter IR* Tests conditions Reverse leakage current VF** Tj = 25°C Min. VR = VRRM 10 Tj = 125°C Forward voltage drop Typ. Max. Unit 20 µA 125 Tj = 25°C IF = 15 A 1.05 Tj = 25°C IF = 30 A 1.18 Tj = 150°C IF = 15 A Tj = 150°C IF = 30 A 0.75 V 0.84 0.99 Pulse test: * tp = 5ms, δ < 2% ** tp = 380µs, δ < 2% To evaluate the maximum conduction losses use the following equation : P = 0.69 x IF(AV) + 0.01 IF2(RMS) DYNAMIC ELECTRICAL CHARACTERISTICS Symbol trr IRM tfr VFP 2/7 Parameter Tests conditions Min. Typ. Max. Unit Reverse recovery time Tj = 25°C IF = 1 A VR = 30V dIF/dt = 200 A/µs 17 22 ns Reverse recovery current Tj = 125°C IF = 15 A VR = 160V dIF/dt = 200 A/µs 6.0 7.8 A Forward recovery time Tj = 25°C IF = 15 A dIF/dt = 200 A/µs VFR = 1.1 x VFmax 110 ns Forward recovery voltage Tj = 25°C IF = 15 A dIF/dt = 200 A/µs 2.5 V STTH3002C Fig. 1: Peak current versus duty cycle (per diode). Fig. 2-1: Forward voltage drop versus forward current (typical values, per diode). IM(A) IFM(A) 120 100 90 IM 100 T 80 δ=tp/T 80 70 Tj=150°C tp 60 P = 30W 50 60 40 P = 15W 40 Tj=25°C 30 P = 10W 20 20 10 δ VFM(V) 0 0 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 1.0 Fig. 2-2: Forward voltage drop versus forward current (maximum values, per diode). Fig. 3: Relative variation of thermal impedance junction to case versus pulse duration. Zth(j-c)/Rth(j-c) IFM(A) 1.0 100 90 80 70 Tj=150°C Single pulse 60 50 40 Tj=25°C 30 20 10 VFM(V) tp(s) 0 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Fig. 4: Junction capacitance versus reverse voltage applied (typical values, per diode). 1.E-03 1.E-02 1.E-01 1.E+00 Fig. 5: Reverse recovery charges versus dIF/dt (typical values, per diode). Qrr(nC) C(pF) 250 1000 F=1MHz VOSC=30mVRMS Tj=25°C IF=15A VR=160V 225 200 175 150 Tj=125°C 125 100 100 75 50 Tj=25°C 25 VR(V) 10 dIF/dt(A/µs) 0 0 50 100 150 200 10 100 1000 3/7 STTH3002C Fig. 6: Reverse recovery time versus dIF/dt (typical values, per diode). Fig. 7: Peak reverse recovery current versus dIF/dt (typical values, per diode). trr(ns) IRM(A) 14 70 IF=15A VR=160V 13 IF=15A VR=160V 60 12 11 50 10 Tj=125°C 9 8 40 7 Tj=125°C 6 30 5 4 20 Tj=25°C 3 Tj=25°C 2 10 dIF/dt(A/µs) 1 dIF/dt(A/µs) 0 0 10 100 10 1000 Fig. 8: Dynamic parameters versus junction temperature. 100 1000 Fig. 9: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, eCU: 35µm) for D2PAK. Rth(j-a)(°C/W) Qrr;IRM[Tj]/Qrr;IRM[Tj=125°C] 80 1.4 IF=15A VR=160V 70 1.2 60 1.0 50 IRM 0.8 40 Qrr 0.6 30 0.4 20 0.2 10 Tj(°C) S(Cu)(cm²) 0.0 0 25 4/7 50 75 100 125 150 0 2 4 6 8 10 12 14 16 18 20 STTH3002C Ordering code Marking Package Weight Base qty Delivery mode STTH3002CT STTH3002CT TO-220AB 2.23 g 50 Tube 2 1.48 g 50 Tube 2 1.48 g 1000 Tape & reel 2 STTH3002CG STTH3002CG STTH3002CG-TR D PAK STTH3002CG D PAK STTH3002CR STTH3002CR I PAK 1.49 g 50 Tube STTH3002CW STTH3002CW TO-247 4.46 g 50 Tube PACKAGE MECHANICAL DATA D2PAK DIMENSIONS REF. A E C2 L2 D L L3 A1 B2 R C B G A2 M * V2 * FLAT ZONE NO LESS THAN 2mm Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.14 1.70 0.045 0.067 C 0.45 0.60 0.017 0.024 C2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.40 0.393 0.409 G 4.88 5.28 0.192 0.208 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 M 2.40 3.20 0.094 0.126 R V2 0.40 typ. 0° 8° 0.016 typ. 0° 8° FOOTPRINT DIMENSIONS (in millimeters) 16.90 10.30 5.08 1.30 3.70 8.90 5/7 STTH3002C PACKAGE MECHANICAL DATA I2PAK DIMENSIONS REF. A E c2 L2 D L1 A1 b2 L b1 b c Millimeters Inches Min. Max. Min. Max. A 4.40 4.60 0.173 0.181 A1 2.49 2.69 0.098 0.106 b 0.70 0.93 0.028 0.037 b1 1.14 1.17 0.044 0.046 b2 1.14 1.17 0.044 0.046 c 0.45 0.60 0.018 0.024 c2 1.23 1.36 0.048 0.054 D 8.95 9.35 0.352 0.368 e 2.40 2.70 0.094 0.106 E 10.0 10.4 0.394 0.409 L 13.1 13.6 0.516 0.535 L1 3.48 3.78 0.137 0.149 L2 1.27 1.40 0.050 0.055 e PACKAGE MECHANICAL DATA TO-247 DIMENSIONS V REF. Dia. V A H L5 L L2 L4 F2 F1 L1 F3 V2 F4 D L3 F(x3) M G = 6/7 = E Millimeters Min. Typ. Max. Min. A 4.85 5.15 0.191 D 2.20 2.60 0.086 E 0.40 0.80 0.015 F 1.00 1.40 0.039 F1 3.00 F2 2.00 F3 2.00 2.40 0.078 F4 3.00 3.40 0.118 G 10.90 H 15.45 15.75 0.608 L 19.85 20.15 0.781 L1 3.70 4.30 0.145 L2 18.50 L3 14.20 14.80 0.559 L4 34.60 L5 5.50 M 2.00 3.00 0.078 V 5° V2 60° Dia. 3.55 3.65 0.139 Inches Typ. Max. 0.203 0.102 0.031 0.055 0.118 0.078 0.094 0.133 0.429 0.620 0.793 0.169 0.728 0.582 1.362 0.216 0.118 5° 60° 0.143 STTH3002C PACKAGE MECHANICAL DATA TO-220AB DIMENSIONS REF. Dia Max. Min. Max. A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107 E 0.49 0.70 0.019 0.027 F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.066 F2 1.14 1.70 0.044 0.066 G 4.95 5.15 0.194 0.202 G1 2.40 2.70 0.094 0.106 H2 10 10.40 0.393 0.409 C L5 L7 L6 L2 F2 F1 D L9 L4 L2 F M G1 E G ■ ■ 0.645 typ. 13 14 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.20 6.60 0.244 0.259 L9 3.50 3.93 0.137 0.154 Diam. ■ 16.4 typ. L4 M ■ Inches Min. A H2 Millimeters 2.6 typ. 3.75 3.85 0.102 typ. 0.147 0.151 Epoxy meets UL94,V0 Cooling method: by conduction (method C) Recommended torque value (TO-220AB): 0.8 N.m. Maximum torque value (TO-220AB): 1.0 N.m. Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2004 STMicroelectronics - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain Sweden - Switzerland - United Kingdom - United States www.st.com 7/7