MICROCHIP MCP1603

MCP1603
2.0 MHz, 500 mA Synchronous Buck Regulator
Features
General Description
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The MCP1603 is a high efficient, fully integrated
500 mA synchronous buck regulator whose 2.7V to
5.5V input voltage range makes it ideally suited for
applications powered from 1-cell Li-Ion or 2-cell/3-cell
NiMH/NiCd batteries.
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Over 90% Typical Efficiency
Output Current Up To 500 mA
Low Quiescent Current = 45 µA, typical
Low Shutdown Current = 0.1 µA, typical
Adjustable Output Voltage:
- 0.8V to 4.5V
Fixed Output Voltage:
- 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V
2.0 MHz Fixed-Frequency PWM (Heavy Load)
Automatic PWM to PFM Mode Transition
100% Duty Cycle Operation
Internally Compensated
Undervoltage Lockout (UVLO)
Overtemperature Protection
Space Saving Packages:
- 5-Lead TSOT
- 8-Lead 2X3 DFN
At heavy loads, the MCP1603 operates in the 2.0 MHz
fixed frequency PWM mode which provides a low
noise, low output ripple, small-size solution. When the
load is reduced to light levels, the MCP1603
automatically changes operation to a PFM mode to
minimize quiescent current draw from the battery. No
intervention is necessary for a smooth transition from
one mode to another. These two modes of operation
allow the MCP1603 to achieve the highest efficiency
over the entire operating current range.
The MCP1603 is available with either an adjustable or
fixed output voltage. The available fixed output voltage
options are 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V. When a
fixed option is used, only three additional small external
components are needed to form a complete solution.
Couple this with the low profile, small-foot print
packages and the entire system solution is achieved
with minimal size.
Applications
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Cellular Telephones
Portable Computers
Organizers / PDAs
USB Powered Devices
Digital Cameras
Portable Equipment
+5V or +3.3V Distributed Systems
Additional protection features include:
overtemperature, and overcurrent protection.
UVLO,
Package Types
8-Lead 2x3 DFN
5-Lead TSOT
VIN
1
GND
2
SHDN
3
5
4
LX
VFB/VOUT
MCP1603
© 2007 Microchip Technology Inc.
SHDN
1
GND
2
LX
3
5
4
VFB/VOUT
VIN
LX 1
8 GND
NC 2
7 VIN
SHDN 3
6 NC
VFB/VOUT 4
5 NC
MCP1603L
DS22042A-page 1
MCP1603
Typical Application Circuit
L1
4.7 µH
VIN
2.7V To 4.5V
LX
VIN
CIN
4.7 µF
VOUT
1.8V @ 500 mA
COUT
4.7 µF
SHDN VFB
Efficiency (%)
GND
100
95
90
85
80
75
70
65
60
55
50
VOUT = 1.8V
VIN = 2.7V
VIN = 3.6V
VIN = 4.5V
0.1
1
10
100
1000
Output Current (mA)
DS22042A-page 2
© 2007 Microchip Technology Inc.
MCP1603
Functional Block Diagram
VIN
Band
Gap
UVLO
Thermal
Shutdown
UVLO
TSD
VREF
Soft Start
SHDN
IPK Limit
IPEAKPWM
ILIMPWM
ILIMPFM
IPEAKPFM
Slope
Comp
OSC
-ILPK
S
R
Q
POFF
Q
Switch Drive
Logic and timing
NOFF
LX
PWM/PFM
PFM Error Amp
VREF
PWM Error Amp
EA
PWM/PFM
Logic
GND
IPEAKPFM
IPEAKPWM
-ILPK
-IPK Limit
VREF
OV Threshold
Disable
Switcher
VFB / VOUT
© 2007 Microchip Technology Inc.
UVLO
TSD
UV Threshold
DS22042A-page 3
MCP1603
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
VIN - GND.......................................................................+6.0V
All Other I/O ...............................(GND - 0.3V) to (VIN + 0.3V)
LX to GND .............................................. -0.3V to (VIN + 0.3V)
Output Short Circuit Current..................................Continuous
Power Dissipation (Note 5) ..........................Internally Limited
Storage Temperature.....................................-65°C to +150°C
Ambient Temp. with Power Applied.................-40°C to +85°C
Operating Junction Temperature...................-40°C to +125°C
ESD Protection On All Pins:
HBM..............................................................................4 kV
MM...............................................................................300V
† Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational sections of this specification is not intended.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
DC CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH, VOUT(ADJ) = 1.8V,
IOUT = 100 mA, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
VIN
2.7
—
5.5
V
Note 1
—
mA
Note 1
Input Characteristics
Input Voltage
Maximum Output Current
IOUT
500
—
Shutdown Current
IIN_SHDN
—
0.1
1
µA
SHDN = GND
Quiescent Current
IQ
—
45
60
µA
SHDN = VIN, IOUT = 0 mA
Shutdown/UVLO/Thermal Shutdown Characteristics
SHDN, Logic Input Voltage Low
VIL
—
—
15
%VIN VIN = 2.7V to 5.5V
SHDN, Logic Input Voltage High
VIH
45
—
—
%VIN VIN = 2.7V to 5.5V
IL_SHDN
-1.0
±0.1
1.0
µA
VIN = 2.7V to 5.5V
UVLO
2.12
2.28
2.43
V
VIN Falling
Undervoltage Lockout Hysteresis UVLOHYS
Thermal Shutdown
TSHD
—
140
—
mV
—
150
—
°C
Note 4, Note 5
Thermal Shutdown Hysteresis
—
10
—
°C
Note 4, Note 5
SHDN, Input Leakage Current
Undervoltage Lockout
Note 1:
2:
3:
4:
5:
6:
TSHD-HYS
The minimum VIN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ VOUT + 0.5V.
Reference Feedback Voltage Tolerance applies to adjustable output voltage setting.
VR is the output voltage setting.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
temperature and the thermal resistance from junction to air (i.e. TA, TJ, θJA). Exceeding the maximum
allowable power dissipation causes the device to initiate thermal shutdown.
The internal MOSFET switches have an integral diode from the LX pin to the VIN pin, and from the LX pin
to the GND pin. In cases where these diodes are forward-biased, the package power dissipation limits
must be adhered to. Thermal protection is not able to limit the junction temperature for these cases.
The current limit threshold is a cycle-by-cycle peak current limit.
DS22042A-page 4
© 2007 Microchip Technology Inc.
MCP1603
DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH, VOUT(ADJ) = 1.8V,
IOUT = 100 mA, TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C.
Parameters
Sym
Min
Typ
Max
VOUT
VFB
Units
Conditions
0.8
—
4.5
V
—
0.8
—
V
-3.0
—
+3.0
%
TA = -40°C to +25°C
-2.5
—
+2.5
%
TA = +25°C to +85°C
Output Characteristics
Adjustable Output Voltage Range
Reference Feedback Voltage
Reference Feedback Voltage
Tolerance
Note 2
Feedback Input Bias Current
IVFB
—
0.1
—
nA
Output Voltage Tolerance Fixed
VOUT
-3.0%
VR
+3.0%
%
TA = -40°C to +25°C, Note 3
VOUT
-2.5
VR
+2.5
%
TA = +25°C to +85°C, Note 3
Line Regulation
VLINE-
—
0.3
—
%/V
Load Regulation
VLOAD-
—
0.35
—
%
FOSC
1.5
2.0
2.8
MHz
TSS
—
0.6
—
ms
TR = 10% to 90%
RDSon P-Channel
RDSon-P
—
500
—
mΩ
IP = 100 mA
RDSon N-Channel
RDSon-N
—
500
—
mΩ
IN = 100 mA
ILX
-1.0
±0.1
1.0
µA
SHDN = 0V, VIN = 5.5V,
LX = 0V, LX = 5.5V
+ILX(MAX)
—
860
—
mA
Note 6
REG
REG
Internal Oscillator Frequency
Start Up Time
LX Pin Leakage Current
Positive Current Limit Threshold
Note 1:
2:
3:
4:
5:
6:
VIN = VR + 1V to 5.5V,
IOUT = 100 mA
VIN = VR +1.5V,
ILOAD = 100 mA to 500 mA
The minimum VIN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ VOUT + 0.5V.
Reference Feedback Voltage Tolerance applies to adjustable output voltage setting.
VR is the output voltage setting.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
temperature and the thermal resistance from junction to air (i.e. TA, TJ, θJA). Exceeding the maximum
allowable power dissipation causes the device to initiate thermal shutdown.
The internal MOSFET switches have an integral diode from the LX pin to the VIN pin, and from the LX pin
to the GND pin. In cases where these diodes are forward-biased, the package power dissipation limits
must be adhered to. Thermal protection is not able to limit the junction temperature for these cases.
The current limit threshold is a cycle-by-cycle peak current limit.
© 2007 Microchip Technology Inc.
DS22042A-page 5
MCP1603
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits are specified for: VIN + 2.7V to 5.5V
Parameters
Sym
Min
Typ
Max
Units
Conditions
Operating Junction Temperature
Range
TJ
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
Maximum Junction Temperature
TJ
—
—
+150
°C
Thermal Resistance, 5L-TSOT
θJA
—
256
—
°C/W
Typical 4-layer Board with
Internal Ground Plane
Thermal Resistance, 8L-2x3 DFN
θJA
—
84.5
—
°C/W
Typical 4-layer Board with
Internal Ground Plane and
2-Vias in Thermal Pad
Temperature Ranges
Steady State
Transient
Package Thermal Resistances
DS22042A-page 6
© 2007 Microchip Technology Inc.
MCP1603
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
50
49
48
47
46
45
44
43
42
41
40
52
VOUT = 1.8V
Quiescent Current (µA)
Quiescent Current (µA)
Note: Unless otherwise indicated, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH, VOUT(ADJ) = 1.8V, ILOAD = 100 mA,
TA = +25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics.
VIN = 3.6V
VIN = 4.2V
VIN = 3.0V
o
TA = +90 C
50
48
46
o
TA = +25 C
44
42
o
TA = - 40 C
40
-40 -25 -10
5
20
35
50
65
80
95 110 125
2.7
3.05
3.4
o
Ambient Temperature ( C)
FIGURE 2-1:
IQ vs. Ambient Temperature.
FIGURE 2-4:
VOUT = 1.2V
95
4.45
4.8
IOUT = 100 mA
90
85
80
IOUT = 300 mA
75
IOUT = 500 mA
70
70
IQ vs. Input Voltage.
50
40
30
20
3.4
3.75
4.1
4.45
4.8
5.15
VIN = 3.6V
60
60
3.05
5.5
VIN = 4.2V
0.1
1
Input Voltage (V)
FIGURE 2-2:
(VOUT = 1.2V).
Efficiency vs. Input Voltage
FIGURE 2-5:
(VOUT = 1.2V).
1000
IOUT = 300 mA
IOUT = 500 mA
75
Efficiency (%)
90
Efficiency vs. Output Load
VIN = 2.7V
90
IOUT = 100 mA
80
100
100
VOUT = 1.8V
85
10
Output Current (mA)
100
95
5.5
VIN = 2.7V
80
65
2.7
5.15
VOUT = 1.2V
90
Efficiency (%)
Efficiency (%)
4.1
100
100
Efficiency (%)
3.75
Input Voltage (V)
80
VIN = 3.6V
70
60
50
40
VIN = 4.2V
30
VOUT = 1.8V
20
70
2.7
3.05
3.4
3.75
4.1
4.45
4.8
5.15
5.5
0.1
Efficiency vs. Input Voltage
© 2007 Microchip Technology Inc.
10
100
1000
Output Current (mA)
Input Voltage (V)
FIGURE 2-3:
(VOUT = 1.8V).
1
FIGURE 2-6:
(VOUT = 1.8V).
Efficiency vs. Output Load
DS22042A-page 7
MCP1603
Typical Performance Curves (Continued)
Note: Unless otherwise indicated, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH, VOUT(ADJ) = 1.8V, ILOAD = 100 mA,
TA = +25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics.
100
IOUT = 300 mA
IOUT = 500 mA
85
Efficiency (%)
90
VIN = 2.7V
90
IOUT = 100 mA
95
Efficiency (%)
100
VOUT = 2.4V
80
80
VIN = 3.6V
70
60
50
40
75
VIN = 4.2V
VOUT = 2.4V
30
3
3.5
4
4.5
5
5.5
0.1
1
Input Voltage (V)
FIGURE 2-7:
(VOUT = 2.4V).
Efficiency vs. Input Voltage
100.0
FIGURE 2-10:
(VOUT = 2.4V).
IOUT = 100 mA
92.5
90.0
IOUT = 500 mA
87.5
80
85.0
4.25 4.5 4.75
5
Efficiency vs. Output Load
VIN = 3.6V
70
60
50
VIN = 4.2V
40
4
VOUT = 3.3V
30
5.25 5.5
0.1
1
Input Voltage (V)
FIGURE 2-8:
(VOUT = 3.3V).
10
100
1000
Output Current (mA)
Efficiency vs. Input Voltage
0.6
FIGURE 2-11:
(VOUT = 3.3V).
1.82
VOUT = 1.8V
0.5
IOUT = 300 mA
0.4
0.3
IOUT = 100 mA
0.2
1.81
Output Voltage (V)
Line Regualtion (%/V)
1000
90
IOUT = 300 mA
95.0
3.5 3.75
100
100
VOUT = 3.3V
Efficiency (%)
Efficiency (%)
97.5
10
Output Current (mA)
Efficiency vs. Output Load
o
o
TA = +125 C
TA = +90 C
1.80
1.79
o
1.78
TA = +25 C
o
TA = - 40 C
1.77
1.76
1.75
0.1
-40 -25 -10
5
20 35 50 65 80 95 110 125
o
Ambient Temperature ( C)
FIGURE 2-9:
Line Regulation vs. Ambient
Temperature (VOUT = 1.8V).
DS22042A-page 8
1.74
100
150
200
250
300
350
400
450
500
Output Current (mA)
FIGURE 2-12:
Output Voltage vs. Load
Current (VOUT = 1.8V).
© 2007 Microchip Technology Inc.
MCP1603
Typical Performance Curves (Continued)
2.20
Switching Frequency (MHz)
Switching Frequency (MHz)
Note: Unless otherwise indicated, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH, VOUT(ADJ) = 1.8V, ILOAD = 100 mA,
TA = +25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics.
2.15
2.10
2.05
2.00
1.95
-40 -25 -10 5
2.20
2.15
2.10
2.05
2.00
1.95
20 35 50 65 80 95 110 125
2.7
3.05
3.4
o
FIGURE 2-13:
Switching Frequency vs.
Ambient Temperature.
FIGURE 2-16:
Input Voltage.
4.1
4.45
4.8
5.15
5.5
Switching Frequency vs.
0.9
Switch Resistance (mΩ)
0.65
Switch Resistance (mΩ)
3.75
Input Voltage (V)
Ambient Temperature ( C)
0.60
0.55
0.50
N-Channel
P-Channel
0.45
0.40
0.8
N-Channel
0.7
0.6
0.5
0.4
P-Channel
0.3
0.35
2.7
3.05
3.4
3.75
4.1
4.45
4.8
5.15
5.5
-40 -25 -10
5
20
35
50
65
80
95 110 125
o
Input Voltage (V)
Ambient Temperature ( C)
FIGURE 2-14:
Voltage.
Switch Resistance vs. Input
FIGURE 2-17:
Switch Resistance vs.
Ambient Temperature.
FIGURE 2-15:
Waveform.
Output Voltage Startup
FIGURE 2-18:
Waveform.
© 2007 Microchip Technology Inc.
Heavy Load Switching
DS22042A-page 9
MCP1603
Typical Performance Curves (Continued)
Note: Unless otherwise indicated, VIN = SHDN = 3.6V, COUT = CIN = 4.7 µF, L = 4.7 µH, VOUT(ADJ) = 1.8V, ILOAD = 100 mA,
TA = +25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics.
FIGURE 2-19:
Waveform.
Light Load Switching
FIGURE 2-21:
Output Voltage Line Step
Response vs. Time.
FIGURE 2-20:
Output Voltage Load Step
Response vs. Time.
DS22042A-page 10
© 2007 Microchip Technology Inc.
MCP1603
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
Description
Symbol
MCP1603
TSOT23
MCP1603L
TSOT23
2x3 DFN
1
4
7
2
2
8
GND
3
1
3
SHDN
4
5
4
VFB/VOUT
5
3
1
LX
Switch Node, Buck Inductor Connection Pin
—
—
2, 5, 6
NC
No Connect
—
—
Exposed
Pad
EP
For the DFN package, the center exposed pad is a thermal
path to remove heat from the device. Electrically this pad is at
ground potential and should be connected to GND
3.1
VIN
Power Supply Input Voltage Pin
(VIN)
Connect the input voltage source to VIN. The input
source must be decoupled to GND with a 4.7 µF
capacitor.
3.2
Ground Pin (GND)
Ground pin for the device. The loop area of the ground
traces should be kept as minimal as possible.
3.3
Shutdown Control Input Pin
(SHDN)
The SHDN pin is a logic-level input used to enable or
disable the device. A logic high (> 45% of VIN) will
enable the regulator output. A logic-low (< 15% of VIN)
will ensure that the regulator is disabled.
© 2007 Microchip Technology Inc.
Power Supply Input Voltage Pin
Ground Pin
Shutdown Control Input Pin
Feedback / Output Voltage Pin
3.4
Feedback / Output Voltage Pin
(VFB/VOUT)
For adjustable output options, connect the center of the
output voltage divider to the VFB/VOUT pin. For fixedoutput voltage options, connect the output directly to
the VFB/VOUT pin.
3.5
Switch Node, Buck Inductor
Connection Pin (LX)
Connect the LX pin directly to the buck inductor. This
pin carries large signal-level current; all connections
should be made as short as possible.
3.6
Exposed Metal Pad (EP)
For the DFN package, connect the Exposed Pad to
GND, with vias into the GND plane. This connection to
the GND plane will aid in heat removal from the
package.
DS22042A-page 11
MCP1603
4.0
DETAILED DESCRIPTION
4.1
Device Overview
The MCP1603 is a synchronous buck regulator that
operates in a Pulse Frequency Modulation (PFM)
mode or a Pulse Width Modulation (PWM) mode to
maximize system efficiency over the entire operating
current range. Capable of operating from a 2.7V to
5.5V input voltage source, the MCP1603 can deliver
500 mA of continuous output current.
When using the MCP1603, the PCB area required for
a complete step-down converter is minimized since
both the main P-Channel MOSFET and the synchronous N-Channel MOSFET are integrated. Also while in
PWM mode, the device switches at a constant
frequency of 2.0 MHz (typ) which allow for small filtering components. Both fixed and adjustable output
voltage options are available. The fixed voltage options
(1.2V, 1.5V 1.8V, 2.5V, 3.3V) do not require an external
voltage divider which further reduces the required
circuit board footprint. The adjustable output voltage
options allow for more flexibility in the design, but
require an external voltage divider.
Additionally the device features undervoltage lockout
(UVLO), overtemperature shutdown, overcurrent
protection, and enable/disable control.
4.2
Synchronous Buck Regulator
The MCP1603 has two distinct modes of operation that
allow the device to maintain a high level of efficiency
throughout the entire operating current and voltage
range. The device automatically switched between
PWM mode and PFM mode depending upon the output
load requirements.
4.2.1
FIXED FREQUENCY, PWM MODE
During heavy load conditions, the MCP1603 operates
at a high, fixed switching frequency of 2.0 MHz (typical)
using current mode control. This minimizes output ripple (10 - 15 mV typically) and noise while maintaining
high efficiency (88% typical with VIN = 3.6V,
VOUT = 1.8V, IOUT = 300 mA).
During normal PWM operation, the beginning of a
switching cycle occurs when the internal P-Channel
MOSFET is turned on. The ramping inductor current is
sensed and tied to one input of the internal high-speed
comparator. The other input to the high-speed comparator is the error amplifier output. This is the difference
between the internal 0.8V reference and the divideddown output voltage. When the sensed current
becomes equal to the amplified error signal, the highspeed comparator switches states and the P-Channel
MOSFET is turned off. The N-Channel MOSFET is
turned on until the internal oscillator sets an internal RS
latch initiating the beginning of another switching cycle.
PFM-to-PWM mode transition is initiated for any of the
following conditions:
• Continuous device switching
• Output voltage has dropped out of regulation
4.2.2
LIGHT LOAD, PFM MODE
During light load conditions, the MCP1603 operates in
a PFM mode. When the MCP1603 enters this mode, it
begins to skip pulses to minimize unnecessary quiescent current draw by reducing the number of switching
cycles per second. The typical quiescent current draw
for this device is 45 µA.
PWM-to-PFM mode transition is initiated for any of the
following conditions:
• Discontinuous inductor current is sensed for a set
duration
• Inductor peak current falls below the transition
threshold limit
DS22042A-page 12
© 2007 Microchip Technology Inc.
MCP1603
4.3
Soft Start
The output of the MCP1603 is controlled during startup. This control allows for a very minimal amount of
VOUT overshoot during start-up from VIN rising above
the UVLO voltage or SHDN being enabled.
4.4
Overtemperature Protection
Overtemperature protection circuitry is integrated in the
MCP1603. This circuitry monitors the device junction
temperature and shuts the device off, if the junction
temperature exceeds the typical 150°C threshold. If
this threshold is exceeded, the device will automatically
restart once the junction temperature drops by
approximately 10°C. The soft start is reset during an
overtemperture condition.
4.5
Overcurrent Protection
Cycle-by-cycle current limiting is used to protect the
MCP1603 from being damaged when an external short
circuit is applied. The typical peak current limit is
860 mA. If the sensed current reaches the 860 mA
limit, the P-Channel MOSFET is turned off, even if the
output voltage is not in regulation. The device will
attempt to start a new switching cycle when the internal
oscillator sets the internal RS latch.
© 2007 Microchip Technology Inc.
4.6
Enable/Disable Control
The SHDN pin is used to enable or disable the
MCP1603. When the SHDN pin is pulled low, the
device is disabled. When pulled high the device is
enabled and begins operation provided the input
voltage is not below the UVLO threshold or a fault
condition exists.
4.7
Undervoltage Lockout (UVLO)
The UVLO feature uses a comparator to sense the
input voltage (VIN) level. If the input voltage is lower
than the voltage necessary to properly operate the
MCP1603, the UVLO feature will hold the converter off.
When VIN rises above the necessary input voltage, the
UVLO is released and soft start begins. Hysteresis is
built into the UVLO circuit to compensate for input
impedance. For example, if there is any resistance
between the input voltage source and the device when
it is operating, there will be a voltage drop at the input
to the device equal to IIN x RIN. The typical hysteresis
is 140 mV.
DS22042A-page 13
MCP1603
5.0
APPLICATION INFORMATION
5.1
Typical Applications
The MCP1603 500 mA synchronous buck regulator
operates over a wide input voltage range (2.7V to 5.5V)
and is ideal for single-cell Li-Ion battery powered
applications, USB powered applications, three cell
NiMH or NiCd applications and 3V or 5V regulated
input applications. The 5-lead TSOT and 8-lead 2x3
DFN packages provide a small footprint with minimal
external components.
5.2
Fixed Output Voltage Applications
Typical Application Circuit shows a fixed MCP1603
in an application used to convert three NiMH batteries
into a well regulated 1.8V @ 500 mA output. A 4.7 µF
input capacitor, 4.7 µF output capacitor, and a 4.7 µH
inductor make up the entire external component solution for this application. No external voltage divider or
compensation is necessary. In addition to the fixed
1.8V option, the MCP1603 is also available in 1.2V,
1.5V, 2.5V, or 3.3V fixed voltage options.
5.3
Adjustable Output Voltage
Applications
When the desired output for a particular application is
not covered by the fixed voltage options, an adjustable
MCP1603 can be used. The circuit listed in Figure 6-2
shows an adjustable MCP1603 being used to convert a
5V rail to 1.0V @ 500 mA. The output voltage is adjustable by using two external resistors as a voltage
divider. For adjustable-output voltages, it is
recommended that the top resistor divider value be
200 kΩ. The bottom resistor value can be calculated
using the following equation:
EQUATION 5-1:
V FB
R BOT = R TOP × ⎛ -----------------------------⎞
⎝ V OUT – V FB⎠
Example:
RTOP
=
200 kΩ
VOUT
=
1.0V
VFB
=
0.8V
RBOT
=
200 kΩ x (0.8V/(1.0V - 0.8V))
RBOT
=
800 kΩ
(Standard Value = 787 kΩ)
DS22042A-page 14
For adjustable output applications, an additional R-C
compensation network is necessary for control loop
stability. Recommended values for any output voltage
are:
RCOMP
=
4.99 kΩ
CCOMP
=
33 pF
Refer to Figure 6-2 for proper placement of RCOMP and
CCOMP.
5.4
Input Capacitor Selection
The input current to a buck converter, when operating
in continuous conduction mode, is a squarewave with
a duty cycle defined by the output voltage (VOUT) to
input voltage (VIN) relationship of VOUT/VIN. To prevent
undesirable input voltage transients, the input capacitor
should be a low ESR type with an RMS current rating
given by Equation 5.5. Because of their small size and
low ESR, ceramic capacitors are often used. Ceramic
material X5R or X7R are well suited since they have a
low temperature coefficient and acceptable ESR.
EQUATION 5-2:
⎛ V OUT × ( V IN – V OUT )⎞
I CIN ,RMS = I OUT ,MAX × ⎜ -----------------------------------------------------⎟
V IN
⎝
⎠
Table 5-1 contains the recommend range for the input
capacitor value.
5.5
Output Capacitor Selection
The output capacitor helps provide a stable output
voltage during sudden load transients, smooths the
current that flows from the inductor to the load, and
reduces the output voltage ripple. Therefore, low ESR
capacitors are a desirable choice for the output capacitor. As with the input capacitor, X5R and X7R ceramic
capacitors are well suited for this application.
The output ripple voltage is often a design specification. A buck converters’ output ripple voltage is a
function of the charging and discharging of the output
capacitor and the ESR of the capacitor. This ripple
voltage can be calculated by Equation 5-3.
EQUATION 5-3:
Δ IL
Δ V OUT = Δ I L × ESR + -------------------8×f×C
© 2007 Microchip Technology Inc.
MCP1603
Table 5-1 contains the recommend range for the output
capacitor value.
TABLE 5-1:
5.6
CAPACITOR VALUE RANGE
CIN
COUT
Minimum
4.7 µF
4.7 µF
Maximum
—
22 µF
Inductor Selection
When using the MCP1603, the inductance value can
range from 3.3 µH to 10 µH. An inductance value of
4.7 µH is recommended to achieve a good balance
between converter load transient response and minimized noise.
The value of inductance is selected to achieve a
desired amount of ripple current. It is reasonable to
assume a ripple current that is 20% of the maximum
load current. The larger the amount of ripple current
allowed, the larger the output capacitor value becomes
to meet ripple voltage specifications. The inductor
ripple current can be calculated according to the following equation.
EQUATION 5-4:
V OUT
V OUT⎞
ΔI L = ------------------- × ⎛⎝ 1 – -----------F SW × L
V IN ⎠
Where:
FSW = Switching Frequency
When considering inductor ratings, the maximum DC
current rating of the inductor should be at least equal to
the maximum load current, plus one half the peak-topeak inductor ripple current (1/2 * ΔIL). The inductor DC
resistance adds to the total converter power loss. An
inductor with a low DC resistance allows for higher
converter efficiency.
TABLE 5-2:
MCP1603 RECOMMENDED
INDUCTORS
Value
(µH)
DCR
Ω
(max)
ISAT
(A)
Size
WxLxH (mm)
SD3110
3.3
0.195
0.81
3.1x3.1x1.0
SD3110
4.7
0.285
0.68
3.1x3.1x1.0
Part
Number
Coiltronics®
SD3110
6.8
0.346
0.58
3.1x3.1x1.0
SD3812
3.3
0.159
1.40
3.8x3.8x1.2
SD3812
4.7
0.256
1.13
3.8x3.8x1.2
SD3812
6.8
0.299
0.95
3.8x3.8x1.2
Würth
Elektronik®
WE-TPC
Type XS
3.3
0.225
0.72
3.3x3.5x0.95
WE-TPC
Type XS
4.7
0.290
0.50
3.3x3.5x0.95
WE-TPC
Type S
4.7
0.105
0.90
3.8x3.8x1.65
WE-TPC
Type S
6.8
0.156
0.75
3.8x3.8x1.65
CMD4D06
3.3
0.174
0.77
3.5x4.3x0.8
CMD4D06
4.7
0.216
0.75
3.5x4.3x0.8
CMD4D06
6.8
0.296
0.62
3.5x4.3x0.8
Sumida®
5.7
Thermal Calculations
The MCP1603 is available in two different packages
(TSOT-23 and 2x3 DFN). By calculating the power
dissipation and applying the package thermal
resistance, (θJA), the junction temperature is
estimated. The maximum continuous junction
temperature rating for the MCP1603 is +125°C.
To quickly estimate the internal power dissipation for
the switching buck regulator, an empirical calculation
using measured efficiency can be used. Given the
measured efficiency, the internal power dissipation is
estimated by:
EQUATION 5-5:
OUT × I OUT⎞
⎛V
------------------------------ – ( V OUT × I OUT ) = P Diss
⎝ Efficiency ⎠
The difference between the first term, input power
dissipation, and the second term, power delivered, is
the internal power dissipation. This is an estimate
assuming that most of the power lost is internal to the
MCP1603. There is some percentage of power lost in
the buck inductor, with very little loss in the input and
output capacitors.
© 2007 Microchip Technology Inc.
DS22042A-page 15
MCP1603
5.8
PCB Layout Information
Therefore, it is important that the components along the
high current path should be placed as close as possible
to the MCP1603 to minimize the loop area.
Good printed circuit board layout techniques are
important to any switching circuitry and switching
power supplies are no different. When wiring the high
current paths, short and wide traces should be used.
This high current path is shown with red connections in
Figure 5-1. The current in this path is switching.
The feedback resistors and feedback signal should be
routed away from the switching node and this switching
current loop. When possible ground planes and traces
should be used to help shield the feedback signal and
minimize noise and magnetic interference.
L1
4.7 µH
VIN
2.7V To 4.5V
VIN
CIN
4.7 µF
VOUT
1.8V @ 500 mA
LX
SHDN VFB
COUT
4.7 µF
GND
FIGURE 5-1:
DS22042A-page 16
PCB High Current Path.
© 2007 Microchip Technology Inc.
MCP1603
6.0
TYPICAL APPLICATION CIRCUITS
l
L1
4.7 µH
VIN
3.0V To 4.2V
VIN
CIN
4.7 µF
VOUT
1.5V @ 500 mA
LX
COUT
4.7 µF
SHDN VFB
GND
FIGURE 6-1:
Single Li-Ion to 1.5V @ 500 mA Application.
L1
4.7 µH
VIN
5.0V
LX
VIN
CIN
4.7 µF
SHDN
RTOP
200 kΩ
VFB
GND
FIGURE 6-2:
RCOMP
4.99 kΩ
VOUT
1.0V @ 500 mA
CCOMP
33 pF
COUT
4.7 µF
RBOT
787 kΩ
5V to 1.0V @ 500 mA Application.
L1
4.7 µH
VIN
2.7V To 4.5V
CIN
4.7 µF
VOUT
1.2V @ 500 mA
LX
VIN
SHDN VFB
COUT
4.7 µF
GND
FIGURE 6-3:
3 NiMH Batteries to 1.2V @ 500 mA Application.9
© 2007 Microchip Technology Inc.
DS22042A-page 17
MCP1603
7.0
PACKAGING INFORMATION
7.1
Package Marking Information (Not to Scale)
8-Lead 2x3 DFN
Part Number
XXX
YWW
NNN
MCP1603-120I/MC
MCP1603-150I/MC
MCP1603-180I/MC
MCP1603-250I/MC
MCP1603-330I/MC
MCP1603-ADJI/MC
AFM
AFK
AFJ
AFG
AFA
AFQ
Part Number
Marking
Code
5-Lead TSOT
XXNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS22042A-page 18
Marking
Code
MCP1603T-120I/OS
MCP1603T-150I/OS
MCP1603T-180I/OS
MCP1603T-250I/OS
MCP1603T-330I/OS
MCP1603T-ADJI/OS
ETNN
EUNN
EVNN
EWNN
EXNN
EYNN
Part Number
Marking
Code
MCP1603LT-120I/OS
MCP1603LT-150I/OS
MCP1603LT-180I/OS
MCP1603LT-250I/OS
MCP1603LT-330I/OS
MCP1603LT-ADJI/OS
FMNN
FKNN
EJNN
FGNN
FANN
FQNN
Example:
AFM
711
25
Example
ET25
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3)
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2007 Microchip Technology Inc.
MCP1603
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
b
N
N
L
K
E2
E
EXPOSED PAD
NOTE 1
2
1
2
NOTE 1
1
D2
BOTTOM VIEW
TOP VIEW
A
A3
A1
NOTE 2
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
N
NOM
MAX
8
Pitch
e
Overall Height
A
0.80
0.90
1.00
Standoff
A1
0.00
0.02
0.05
Contact Thickness
A3
0.20 REF
Overall Length
D
2.00 BSC
Overall Width
E
Exposed Pad Length
D2
1.30
–
Exposed Pad Width
E2
1.50
–
1.90
b
0.18
0.25
0.30
Contact Length
L
0.30
0.40
0.50
Contact-to-Exposed Pad
K
0.20
–
–
Contact Width
0.50 BSC
3.00 BSC
1.75
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-123B
© 2007 Microchip Technology Inc.
DS22042A-page 19
MCP1603
5-Lead Plastic Thin Small Outline Transistor (OS) [TSOT]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
b
N
E
E1
NOTE 1
1
3
2
e
e1
D
α
A
A2
c
φ
L
A1
β
Units
Dimension Limits
Number of Leads
L1
MILLIMETERS
MIN
NOM
MAX
N
5
Lead Pitch
e
0.95 BSC
Outside Lead Pitch
e1
Overall Height
A
–
–
Molded Package Thickness
A2
0.70
0.90
1.00
Standoff
A1
0.00
–
0.10
1.90 BSC
Overall Width
E
Molded Package Width
E1
1.60 BSC
Overall Length
D
2.90 BSC
1.10
2.80 BSC
Foot Length
L
Footprint
L1
0.30
0.45
0.60
Foot Angle
φ
0°
4°
8°
Lead Thickness
c
0.08
–
0.20
Lead Width
b
0.30
–
0.50
Mold Draft Angle Top
α
4°
10°
12°
Mold Draft Angle Bottom
β
4°
10°
0.60 REF
12°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-128B
DS22042A-page 20
© 2007 Microchip Technology Inc.
MCP1603
APPENDIX A:
REVISION HISTORY
Revision A (May 2007)
• Original Release of this Document.
© 2007 Microchip Technology Inc.
DS22042A-page 21
MCP1603
NOTES:
DS22042A-page 22
© 2007 Microchip Technology Inc.
MCP1603
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
X
XXX
X
/
XX
TSOT
Tape Voltage Temp. Package
Config. and Reel Option
Examples:
8-Lead DFN:
a)
b)
Device:
MCP1603: 2.0 MHz, 500 mA Buck Regulator
TSOT Pin
Config. Designator *
Blank = Standard pinout
L
= Alternate pinout
* Refer to Package Types for an explanation regarding the
function of the device pins.
c)
d)
e)
MCP1603-120I/MC: 1.20V Buck Reg.,
8LD-DFN pkg.
MCP1603-150I/MC: 1.50V Buck Reg.,
8LD-DFN pkg.
MCP1603-180I/MC: 1.80V Buck Reg.,
8LD-DFN pkg.
MCP1603-250I/MC: 2.50V Buck Reg.,
8LD-DFN pkg.
MCP1603-330I/MC: 3.30V Buck Reg.,
8LD-DFN pkg.
T
Blank
= Tape and Reel
= Tube
5-Lead TSOT:
ADJ
120
150
180
250
330
=
=
=
=
=
=
Adjustable
1.20V “Standard”
1.50V “Standard”
1.80V “Standard”
2.50V “Standard”
3.30V “Standard”
b)
Temperature:
I
= -40°C to +85°C
Package Type:
MC = Plastic Dual-Flat No-Lead Package (MC), 8-Lead
OS = Plastic Thin Small Outline Transistor (OS), 5-Lead
Tape and Reel:
Voltage Option:
© 2007 Microchip Technology Inc.
a)
c)
d)
e)
f)
g)
MCP1603T-120I/OS: 1.20V Buck Reg.,
5LD-TSOT pkg.
MCP1603T-180I/OS: 1.80V Buck Reg.,
5LD-TSOT pkg.
MCP1603T-250I/OS: 2.50V Buck Reg.,
5LD-TSOT pkg.
MCP1603T-330I/OS: 3.30V Buck Reg.,
5LD-TSOT pkg.
MCP1603T-ADJI/OS: Adj. Buck Reg.,
5LD-TSOT pkg.
MCP1603LT-250I/OS:2.50V Buck Reg.,
5LD-TSOT pkg.
MCP1603LT-ADJI/OS:Adj. Buck Reg.,
5LD-TSOT pkg.
DS22042A-page 23
MCP1603
NOTES:
DS22042A-page 24
© 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
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hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC,
PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Linear Active Thermistor, Migratable
Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The
Embedded Control Solutions Company are registered
trademarks of Microchip Technology Incorporated in the
U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select
Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,
WiperLock and ZENA are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2007 Microchip Technology Inc.
DS22042A-page 25
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Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xian
Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
12/08/06
DS22042A-page 26
© 2007 Microchip Technology Inc.