MICROCHIP MCP1701T

MCP1701
2 µA Low Dropout Positive Voltage Regulator
Features
General Description
• 2.0 µA Typical Quiescent Current
• Input Operating Voltage Range up to 10.0V
• Low Dropout Voltage:
- 250 mV (typ) @ 100 mA
- 500 mV (typ) @ 200 mA
• High Output Current: 250 mA (VOUT = 5.0V)
• High-Accuracy Output Voltage: ±2% (max)
• Low Temperature Drift: ±100 ppm/°C (typ.)
• Excellent Line Regulation: 0.2%/V (typ.)
• Package Options: 3-Pin SOT-23A and
3-Pin SOT-89
• Short Circuit Protection
• Standard Output Voltage Options:
- 1.8V, 2.5V, 3.0V, 3.3V, 5.0V
The MCP1701 is a family of CMOS low dropout (LDO),
positive voltage regulators that can deliver up to
250 mA of current while consuming only 2.0 µA of
quiescent current (typ.). The input operating range is
specified up to 10V, making it ideal for lithium-ion (one
or two cells), 9V alkaline and other two and three
primary cell battery-powered applications.
Applications
•
•
•
•
•
•
•
•
•
•
•
•
Battery-Powered Devices
Battery-Powered Alarm Circuits
Smoke Detectors
CO2 Detectors
Smart Battery Packs
PDAs
Low Quiescent Current Voltage Reference
Cameras and Portable Video Equipment
Pagers and Cellular Phones
Solar-Powered Instruments
Consumer Products
Microcontroller Power
Related Literature
• AN765, “Using Microchip’s Micropower LDOs”,
DS00765, Microchip Technology Inc., 2002
• AN766, “Pin-Compatible CMOS Upgrades to
Bipolar LDOs”, DS00766, Microchip Technology
Inc., 2002
© 2005 Microchip Technology Inc.
The MCP1701 is capable of delivering 250 mA with an
input-to-output voltage differential (dropout voltage) of
650 mV. The low dropout voltage extends the battery
operating lifetime. It also permits high currents in small
packages when operated with minimum VIN – VOUT
differentials.
The MCP1701 has a tight tolerance output voltage
regulation of ±0.5% (typ.) and very good line regulation
at ±0.2%. The LDO output is stable when using only
1 µF of output capacitance of either tantalum or
aluminum-electrolytic style capacitors. The MCP1701
LDO also incorporates short circuit protection to ensure
maximum reliability.
Package options include the 3-pin SOT-23A and 3-pin
SOT-89.
Package Types
3-Pin SOT-23A
VIN
3-Pin SOT-89
VIN
3
MCP1701
1
GND
2
VOUT
MCP1701
1
2
3
GND VIN VOUT
Note: 3-Pin SOT-23A is equivalent to the EIAJ
SC-59.
DS21874B-page 1
MCP1701
Functional Block Diagram
MCP1701
VIN
VOUT
Short-Circuit
Protection
+
–
Voltage
Reference
GND
Typical Application Circuits
MCP1701
GND
VOUT
3.3V
IOUT
50 mA
DS21874B-page 2
VIN
VOUT
VIN
9V Alkaline Battery
CIN
1 µF Tantalum
COUT
1 µF Tantalum
© 2005 Microchip Technology Inc.
MCP1701
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Input Voltage ........................................................ +12V
Output Current (Continuous)..........PD/(VIN – VOUT)mA
Output Current (peak) ..................................... 500 mA
Output Voltage ............... (GND – 0.3V) to (VIN + 0.3V)
Continuous Power Dissipation:
3-Pin SOT-23A ............................................ 150 mW
3-Pin SOT-89............................................... 500 mW
† Notice: Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to the
device. These are stress ratings only and functional operation
of the device at these or any other conditions above those
indicated in the operation sections of the specifications is not
implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
PIN FUNCTION TABLE
Symbol
Description
GND
Ground Terminal
VOUT
Regulated Voltage Output
VIN
Unregulated Supply Input
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits are established for an ambient temperature of TA = +25°C.
Parameters
Sym
Min
Typ
Max
Output Voltage Regulation
VOUT
VR - 2%
VR±0.5%
VR + 2%
V
Maximum Output Current
IOUTMAX
250
—
—
mA
200
—
—
VOUT = 4.0V
150
—
—
VOUT = 3.3V
150
—
—
VOUT = 3.0V
125
—
—
VOUT = 2.5V
110
—
—
VOUT = 1.8V
Load Regulation (Note 3)
Dropout Voltage
ΔVOUT/ VOUT
VIN - VOUT
%
Conditions
IOUT = 40 mA (Note 1)
VOUT = 5.0V
(VIN = VR + 1.0V)
VOUT = 5.0V, 1 mA ≤ IOUT ≤ 100 mA
-1.60
±0.8
+1.60
-2.25
±1.1
+2.25
VOUT = 4.0V, 1 mA ≤ IOUT ≤ 100 mA
-2.72
±1.3
+2.72
VOUT = 3.3V, 1 mA ≤ IOUT ≤ 80 mA
-3.00
±1.5
+3.00
VOUT = 3.0V, 1 mA ≤ IOUT ≤ 80 mA
-3.60
±1.8
+3.60
VOUT = 2.5V, 1 mA ≤ IOUT ≤ 60 mA
-1.60
±0.8
+1.60
—
400
630
—
400
630
IOUT = 200 mA, VR = 4.0V
—
400
700
IOUT = 160 mA, VR = 3.3V
—
400
700
IOUT = 160 mA, VR = 3.0V
—
400
700
IOUT = 120 mA, VR = 2.5V
—
180
300
IOUT = 20 mA, VR = 1.8V
VOUT = 1.8V, 1 mA ≤ IOUT ≤ 30 mA
mV
IOUT = 200 mA, VR = 5.0V
IQ
—
2.0
3.0
µA
ΔVOUT•100
—
0.2
0.3
%/V
VIN
—
—
10
V
TCVOUT
—
±100
—
ppm/°
C
IOUT = 40 mA, -40°C ≤ TA ≤ +85°C
(Note 2)
TR
—
200
—
µsec
10% VR to 90% VR, VIN = 0V to VR +1V,
RL = 25Ω resistive
Input Quiescent Current
Line Regulation
Units
VIN = VR + 1.0V
IOUT = 40 mA, (VR +1) ≤ VIN ≤ 10.0V
ΔVIN•VOUT
Input Voltage
Temperature Coefficient of
Output Voltage
Output Rise Time
1:
2:
3:
VR is the nominal regulator output voltage. For example: VR = 1.8V, 2.5V, 3.3V, 4.0V, 5.0V.
The input voltage VIN = VR + 1.0V, IOUT = 40 mA.
TCVOUT = (VOUT-HIGH – VOUT-LOW) *106 / (VR * ΔTemperature), VOUT-HIGH = Highest voltage measured
over the temperature range. VOUT-LOW = Lowest voltage measured over the temperature range.
Load regulation is measured at a constant junction temperature using low duty cycle pulse testing.
© 2005 Microchip Technology Inc.
DS21874B-page 3
MCP1701
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Specified Temperature Range (I)
TA
-40
—
+85
°C
Storage Temperature Range
TA
-40
—
+125
°C
θJA
—
335
—
°C/W
Minimum trace width single
layer application
—
230
—
°C/W
Typical FR4, 4-layer
application
—
52
—
°C/W
Typical, when mounted on 1
square inch of copper
Temperature Ranges
Package Thermal Resistances
Thermal Resistance, 3L-SOT-23A
Thermal Resistance, 3L-SOT-89
DS21874B-page 4
θJA
© 2005 Microchip Technology Inc.
MCP1701
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
2.65
2.60
2.55
2.50
2.45
2.40
2.35
2.30
2.25
2.20
2.15
2.10
2.05
2.00
1.95
VR = 1.8V
Supply Current (µA)
Supply Current (µA)
Notes: Unless otherwise specified, VOUT = 1.8V, 3.0V, 5.0V, TA = +25°C, CIN = 1 µF Tantalum, COUT = 1 µF Tantalum.
+25°C
0°C
-40°C
2
3
4
5
6
7
8
9
2.10
2.05
2.00
1.95
1.90
1.85
1.80
1.75
1.70
1.65
1.60
1.55
1.50
1.45
1.40
1.35
1.30
1.25
1.20
10
+25°C
+85°C
0°C
-40°C
VIN = 4.0V
VR = 3.0V
0
20
40
60
VR = 3.0V
+25°C
+85°C
-40°C
3
4
5
6
7
8
9
2.75
2.70
2.65
2.60
2.55
2.50
2.45
2.40
2.35
2.30
2.25
2.20
2.15
2.10
2.05
2.00
10
0°C
-40°C
20
40
60
+25°C
+85°C
2.25
-40°C
2.10
1.95
1.80
1.65
1.50
5
6
7
8
9
10
2.9
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
1.9
1.8
1.7
1.6
1.5
1.4
100
120
140
160
180
200
VR = 5.0V
VR = 1.8V
VR = 3.0V
VIN = VR + 1V
IOUT = 0 µA
-40
-20
Input Voltage (V)
FIGURE 2-3:
Supply Current vs. Input
Voltage (VR = 5.0V).
© 2005 Microchip Technology Inc.
80
VIN = 6.0V
VR = 5.0V
FIGURE 2-5:
Supply Current vs. Load
Current (VR = 5.0V).
Supply Current (µA)
Supply Current (µA)
2.70
2.40
160
+85°C
0
VR = 5.0V
2.55
140
Load Current (mA)
FIGURE 2-2:
Supply Current vs. Input
Voltage (VR = 3.0V).
2.85
120
+25°C
Input Voltage (V)
3.00
100
FIGURE 2-4:
Supply Current vs. Load
Current (VR = 3.0V).
Supply Current (µA)
Supply Current (µA)
FIGURE 2-1:
Supply Current vs. Input
Voltage (VR = 1.8V).
2.4
2.3
2.2
2.1
2.0
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
80
Load Current (mA)
Input Voltage (V)
0
20
40
60
80
100
Temperature (°C)
FIGURE 2-6:
Temperature.
Supply Current vs.
DS21874B-page 5
MCP1701
Note: Unless otherwise indicated, VOUT = 1.8V, 3.0V, 5.0V, TA = +25°C, CIN = 1 µF Tantalum, COUT = 1 µF Tantalum.
1.85
IOUT = 0.1 mA
1.83
VIN = 2.8V
Output Voltage (V)
Output Voltage (V)
1.84
+25°C
1.83
+85°C
1.82
0°C
1.81
1.80
-40°C
1.79
1.78
2
3
4
5
6
7
8
9
+25°C
1.82
+85°C
1.81
1.80
0°C
1.79
-40°C
1.78
1.77
10
0
10
20
Input Voltage (V)
+85°C
3.01
0°C
-40°C
2.99
80
90
3.04
3.02
+25°C
+85°C
3.00
0°C
2.98
-40°C
2.96
2.98
2.97
2.94
4.0
5.0
6.0
7.0
8.0
9.0
10.0
0
15
30
Input Voltage (V)
5.10
5.09
5.08
5.07
5.06
5.05
5.04
5.03
5.02
5.01
5.00
4.99
4.98
4.97
4.96
45
60
75
90
105
120
135
150
Load Current (mA)
FIGURE 2-8:
Output Voltage vs. Input
Voltage (VR = 3.0V).
FIGURE 2-11:
Output Voltage vs. Load
Current (VR = 3.0V).
5.07
IOUT = 0.1 mA
VIN = 6.0V
+25°C
5.05
+25°C
Output Voltage (V)
Output Voltage (V)
70
VIN = 4.0V
Output Voltage (V)
Output Voltage (V)
+25°C
3.00
60
3.06
IOUT = 0.1 mA
3.02
50
FIGURE 2-10:
Output Voltage vs. Load
Current (VR = 1.8V).
3.04
3.03
40
Load Current (mA)
FIGURE 2-7:
Output Voltage vs. Input
Voltage (VR = 1.8V).
3.05
30
+85°C
0°C
5.03
+85°C
5.01
0°C
4.99
4.97
4.95
-40°C
-40°C
4.93
5.5
6.0
6.5
7.0
7.5
8.0
8.5
9.0
9.5
10.0
Input Voltage (V)
FIGURE 2-9:
Output Voltage vs. Input
Voltage (VR = 5.0V).
DS21874B-page 6
0
25
50
75
100
125
150
175
200
225
250
Load Current (mA)
FIGURE 2-12:
Output Voltage vs. Load
Current (VR = 5.0V).
© 2005 Microchip Technology Inc.
MCP1701
Note: Unless otherwise indicated, VOUT = 1.8V, 3.0V, 5.0V, TA = +25°C, CIN = 1 µF Tantalum, COUT = 1 µF Tantalum.
Dropout Voltage (V)
0.7
VR = 1.8V
0.6
VIN=0V to
2.8V
0.5
0.4
+85°C
0°C
0.3
-40°C
0.2
RLOAD = 25 ohms
COUT = 1 µF Tantalum
0.1
VR=1.8V
0.0
0
10
20
30
40
50
60
70
80
90
Load Current (mA)
FIGURE 2-13:
Dropout Voltage vs. Load
Current (VR = 1.8V).
FIGURE 2-16:
(VR = 1.8V).
Start-up From VIN
0
0.6
Dropout Voltage (V)
VR = 3.0V
0.5
VIN=0V to
4.0V
0.4
0.3
+85°C
0°C
0.2
-40°C
RLOAD = 25 ohms
COUT = 1 µF Tantalum
0.1
0
0
15
30
45
60
75
90
105
120
135
150
VR=3.0V
Load Current (mA)
FIGURE 2-14:
Dropout Voltage vs. Load
Current (VR = 3.0V).
0.8
FIGURE 2-17:
(VR = 3.0V).
Start-up From VIN
VR = 5.0V
Dropout Voltage (V)
0.7
0.6
VIN=0V to
6.0V
0.5
+85°C
0.4
0°C
0.3
-40°C
0.2
0.1
0.0
0
25
50
75
100
125
150
175
200
225
250
VR=5.0V
RLOAD = 25 ohms
COUT = 1 µF Tantalum
Load Current (mA)
FIGURE 2-15:
Dropout Voltage vs. Load
Current (VR = 5.0V).
© 2005 Microchip Technology Inc.
FIGURE 2-18:
(VR = 5.0V).
Start-up From VIN
DS21874B-page 7
MCP1701
Note: Unless otherwise indicated, VOUT = 1.8V, 3.0V, 5.0V, TA = +25°C, CIN = 1 µF Tantalum, COUT = 1 µF Tantalum.
0.00
Line Regulation (%/V)
Load Regulation (%)
0.15
VR = 1.8V
IOUT = 1 to 30mA
-0.05
-0.10
-0.15
-0.20
VIN = 6.0V
VIN = 4.0V
-0.25
-0.30
VIN = 2.8V
-0.35
-0.40
VR = 1.8V
VIN = 2.8V to 10V
0.14
IOUT = 90 mA
0.13
IOUT = 40 mA
0.12
IOUT = 1 mA
0.11
IOUT = 10 mA
0.10
-40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
-40 -30 -20 -10
0
Temperature (°C)
FIGURE 2-22:
Line Regulation vs.
Temperature (VR = 1.8V).
FIGURE 2-19:
Load Regulation vs.
Temperature (VR = 1.8V).
-0.30
Line Regulation (%/V)
Load Regulation (%)
0.13
VR = 3.0V
IOUT = 1 to 80 mA
-0.35
-0.40
-0.45
VIN = 6.0V
-0.50
-0.55
-0.60
VIN = 4.0V
VIN = 10.0V
-0.65
-0.70
0.12
IOUT = 1 mA
0.11
0.10
IOUT = 10 mA
0.09
0.08
0.07
IOUT = 150 mA
VR = 3.0V
VIN = 4.0V to 10V
0.06
-40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
-40 -30 -20 -10
0
Temperature (°C)
10 20 30 40 50 60 70 80 90
Temperature (°C)
FIGURE 2-20:
Load Regulation vs.
Temperature (VR = 3.0V).
FIGURE 2-23:
Line Regulation vs.
Temperature (VR = 3.0V).
0.0
0.17
VR = 5.0V
IOUT = 1 to 100 mA
-0.1
Line Regulation (%/V)
Load Regulation (%)
10 20 30 40 50 60 70 80 90
Temperature (°C)
-0.2
-0.3
VIN = 7.0V
VIN = 6.0V
-0.4
VIN = 10.0V
-0.5
VR = 5.0V
VIN = 6.0V to 10V
0.16
0.15
IOUT = 1 mA
0.14
IOUT = 10 mA
0.13
0.12
0.11
0.10
IOUT = 100 mA
IOUT = 250 mA
0.09
-0.6
0.08
-40 -30 -20 -10
0
10 20 30 40
50 60 70 80
Temperature (°C)
FIGURE 2-21:
Load Regulation vs.
Temperature (VR = 5.0V).
DS21874B-page 8
90
-40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
Temperature (°C)
FIGURE 2-24:
Line Regulation vs.
Temperature (VR = 5.0V).
© 2005 Microchip Technology Inc.
MCP1701
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
SOT-23A
Pin No.
SOT-89
1
1
GND
Ground Terminal
2
3
VOUT
Regulated Voltage Output
3
2
VIN
Unregulated Supply Input
3.1
Name
Function
Ground Terminal (GND)
Regulator ground. Tie GND to the negative side of the
output and the negative side of the input capacitor.
Only the LDO bias current (2 µA, typ.) flows out of this
pin, there is no high current. The LDO output regulation
is referenced to this pin. Minimize voltage drops
between this pin and the negative side of the load.
3.2
Regulated Voltage Output (VOUT)
Connect VOUT to the positive side of the load and the
positive terminal of the output capacitor. The positive
side of the output capacitor should be physically
located as close as possible to the LDO VOUT pin. The
current flowing out of this pin is equal to the DC load
current.
© 2005 Microchip Technology Inc.
3.3
Unregulated Supply Input (VIN)
Connect the input supply voltage and the positive side
of the input capacitor to VIN. Like all low dropout linear
regulators, low source impedance is necessary for the
stable operation of the LDO. The amount of
capacitance required to ensure low source impedance
will depend on the proximity of the input source
capacitors or battery type. The input capacitor should
be physically located as close as possible to the VIN
pin. For most applications, 1 µF of capacitance will
ensure stable operation of the LDO circuit. For applications that have load currents below 100 mA, the input
capacitance requirement can be lowered. The type of
capacitor used can be ceramic, tantalum or aluminum
electrolytic. The low equivalent series resistence
characteristics of the ceramic will yield better noise and
PSRR performance at high frequency. The current flow
into this pin is equal to the DC load current, plus the
LDO bias current (2 µA, typ.).
DS21874B-page 9
MCP1701
4.0
DETAILED DESCRIPTION
The MCP1701 is a low quiescent current, precision,
fixed-output voltage LDO. Unlike bipolar regulators,
the MCP1701 supply current does not increase
proportionally with load current.
4.1
Output Capacitor
A minimum of 1 µF output capacitor is required. The
output capacitor should have an ESR greater than
0.1Ω and less than 5Ω, plus a resonant frequency
above 1 MHz. Larger output capacitors can be used to
improve supply noise rejection and transient response.
Care should be taken when increasing COUT to ensure
that the input impedance is not high enough to cause
high input impedance oscillation.
4.2
Input Capacitor
A 1 µF input capacitor is recommended for most
applications when the input impedance is on the order
of 10Ω. Larger input capacitance may be required for
stability when operating from a battery input, or if there
is a large distance from the input source to the LDO.
When large values of output capacitance are used, the
input capacitance should be increased to prevent high
source impedance oscillations.
4.3
Overcurrent
The MCP1701 internal circuitry monitors the amount of
current flowing through the P-channel pass transistor.
In the event of a short circuit or excessive output
current, the MCP1701 will act to limit the output current.
VIN
VOUT
Short Circuit
Protection
+
–
Voltage
Reference
GND
FIGURE 4-1:
DS21874B-page 10
Block Diagram.
© 2005 Microchip Technology Inc.
MCP1701
5.0
THERMAL CONSIDERATIONS
5.1
Power Dissipation
The amount of power dissipated internal to the LDO
linear regulator is the sum of the power dissipation
within the linear pass device (P-channel MOSFET) and
the quiescent current required to bias the internal
reference and error amplifier. The internal linear pass
device power dissipation is calculated as shown in
Equation 5-1.
EQUATION 5-1:
PD (Pass Device) = (VIN – VOUT) x IOUT
The internal power dissipation, as a result of the bias
current for the LDO internal reference and error
amplifier, is calculated as shown in Equation 5-2.
EQUATION 5-2:
To determine the junction temperature of the device, the
thermal resistance from junction-to-ambient must be
known. The 3-pin SOT-23 thermal resistance from
junction-to-air (RθJA) is estimated to be approximately
335° C/W. The SOT-89 RθJA is estimated to be
approximately 52° C/W when mounted on 1 square inch
of copper. The RθJA will vary with physical layout, airflow
and other application-specific conditions.
The device junction temperature is determined by
calculating the junction temperature rise above
ambient, then adding the rise to the ambient
temperature.
EQUATION 5-5:
JUNCTION
TEMPERATURE – SOT-23
EXAMPLE:
T J = PDMAX × R θJA + T A
T J = 116.0 milliwatts × 335°C/W + 55°C
T J = 93.9°C
PD (Bias) = VIN x IGND
The total internal power dissipation is the sum of PD
(pass device) and PD (bias).
EQUATION 5-3:
PTOTAL = PD (Pass Device) + PD (Bias)
EQUATION 5-6:
JUNCTION
TEMPERATURE – SOT-89
EXAMPLE:
T J = 116.0 milliwatts × 52°C/W + 55°C
T J = 61°C
For the MCP1701, the internal quiescent bias current is
so low (2 µA, typ.) that the PD (bias) term of the power
dissipation equation can be ignored. The maximum
power dissipation can be estimated by using the
maximum input voltage and the minimum output
voltage to obtain a maximum voltage differential
between input and output. The next step would be to
multiply the maximum voltage differential by the
maximum output current.
EQUATION 5-4:
PD = (VINMAX – VOUTMIN) x IOUTMAX
Given:
VIN
=
3.3V to 4.1V
VOUT
=
3.0V ± 2%
IOUT
=
1 mA to 100 mA
TAMAX
=
55°C
PMAX
=
(4.1V – (3.0V x 0.98)) x 100 mA
PMAX
=
116.0 milliwatts
© 2005 Microchip Technology Inc.
DS21874B-page 11
MCP1701
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
3-Pin SOT-23A
1
1
2
2
4
1
3
4
represents first voltage digit
1V, 2V, 3V, 4V, 5V, 6V
Ex: 3.xV =
2
3
3-Pin SOT-89
3
represents first decimal place voltage (x.0 - x.9)
Ex: 3.4V =
3
E
Symbol
Voltage
Symbol
Voltage
A
B
C
D
E
x.0
x.1
x.2
x.3
x.4
F
H
K
L
M
x.5
x.6
x.7
x.8
x.9
3
represents polarity
0 = Positive (fixed)
4
represents assembly lot number
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS21874B-page 12
Customer-specific information*
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2005 Microchip Technology Inc.
MCP1701
3-Lead Plastic Small Outline Transistor (CB) (SOT23)
E
E1
2
B
p1
n
D
p
1
α
c
A
φ
β
A1
L
Units
Dimension Limits
n
Number of Pins
p
Pitch
p1
Outside lead pitch (basic)
Overall Height
A
Molded Package Thickness
A2
Standoff §
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Foot Length
L
f
Foot Angle
c
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A2
B
a
b
MIN
.040
.039
.000
.102
.059
.106
.014
0
.004
.014
0
0
INCHES*
NOM
3
.038
.076
.046
.043
.002
.110
.063
.114
.018
5
.006
.016
5
5
MAX
.051
.047
.004
.118
.071
.122
.022
10
.010
.020
10
10
MILLIMETERS
NOM
3
0.96
1.92
1.16
1.01
1.00
1.10
0.01
0.06
2.60
2.80
1.50
1.60
2.70
2.90
0.35
0.45
0
5
0.10
0.15
0.35
0.40
0
5
0
5
MIN
MAX
1.30
1.20
0.10
3.00
1.80
3.10
0.55
10
0.25
0.50
10
10
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
EIAJ SC-59 Equivalent
Drawing No. C04-104
© 2005 Microchip Technology Inc.
DS21874B-page 13
MCP1701
3-Lead Plastic Small Outline Transistor (MB) (SOT89)
H
E
B1
3
B
D
D1
p1
2
p
1
B1
L
E1
A
C
Units
Dimension Limits
p
Pitch
Outside lead pitch (basic)
Overall Height
Overall Width
Molded Package Width at Base
Molded Package Width at Top
Overall Length
Tab Length
Foot Length
Lead Thickness
Lead 2 Width
Leads 1 & 3 Width
p1
A
H
E
E1
D
D1
L
c
B
B1
INCHES
MIN
MAX
.059 BSC
.118 BSC
.055
.063
.155
.167
.090
.102
.084
.090
.173
.181
.064
.072
.035
.047
.014
.017
.017
.022
.014
.019
MILLIMETERS*
MIN
MAX
1.50 BSC
3.00 BSC
1.40
1.60
3.94
4.25
2.29
2.60
2.13
2.29
4.40
4.60
1.62
1.83
0.89
1.20
0.35
0.44
0.44
0.56
0.36
0.48
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .005" (0.127mm) per side.
JEDEC Equivalent: TO-243
Drawing No. C04-29
DS21874B-page 14
© 2005 Microchip Technology Inc.
MCP1701
APPENDIX A:
REVISION HISTORY
Revision B (May 2005)
The following is the list of modifications:
1.
2.
Removed T0-92 device from entire data sheet.
Added Appendix A: Revision History.
Revision A (March 2004)
• Original Release of this Document.
© 2005 Microchip Technology Inc.
DS21874B-page 15
MCP1701
NOTES:
DS21874B-page 16
© 2005 Microchip Technology Inc.
MCP1701
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X-
XX
X
X
X/
XX
Tape
Output Feature Tolerance Temp. Package
and Reel Voltage Code
Examples:
a)
MCP1701T-1802I/CB:
1.8V LDO Positive
Voltage Regulator,
SOT-23A-3 pkg.
b)
MCP1701T-1802I/MB: 1.8V LDO Positive
Voltage Regulator,
SOT89-3 pkg.
c)
MCP1701T-2502I/CB:
2.5V LDO Positive
Voltage Regulator,
SOT-23A-3 pkg.
3.0V LDO Positive
Voltage Regulator,
SOT-23A-3 pkg.
Device:
MCP1701: 2 µA Low Dropout Positive Voltage Regulator
Tape and Reel:
T
Output Voltage:
18 = 1.8V “Standard”
25 = 2.5V “Standard”
30 = 3.0V “Standard”
33 = 3.3V “Standard”
50 = 5.0V “Standard”
*Contact factory for other output voltage options.
d)
MCP1701T-3002I/CB:
e)
MCP1701T-3002I/MB: 3.0V LDO Positive
Voltage Regulator,
SOT89-3 pkg.
Extra Feature Code:
0
= Fixed
f)
MCP1701T-3302I/CB:
Tolerance:
2
= 2.0% (Standard)
g)
Temperature:
I
= -40°C to +85°C
MCP1701T-3302I/MB: 3.3V LDO Positive
Voltage Regulator,
SOT89-3 pkg.
h)
MCP1701T-5002I/CB:
Package Type:
CB = 3-Pin SOT-23A (equivalent to EIAJ SC-59)
MB = 3-Pin SOT-89
i)
MCP1701T-5002I/MB: 5.0V LDO Positive
Voltage Regulator,
SOT89-3 pkg.
= Tape and Reel
© 2005 Microchip Technology Inc.
3.3V LDO Positive
Voltage Regulator,
SOT-23A-3 pkg.
5.0V LDO Positive
Voltage Regulator,
SOT-23A-3 pkg.
DS21874B-page 17
MCP1701
NOTES:
DS21874B-page 18
© 2005 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION, INCLUDING BUT NOT
LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and
its use. Use of Microchip’s products as critical components in
life support systems is not authorized except with express
written approval by Microchip. No licenses are conveyed,
implicitly or otherwise, under any Microchip intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro,
PICSTART, PRO MATE, PowerSmart, rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
PICMASTER, SEEVAL, SmartSensor and The Embedded
Control Solutions Company are registered trademarks of
Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Linear Active Thermistor,
MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM,
PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo,
PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode,
Smart Serial, SmartTel, Total Endurance and WiperLock are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2005, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2005 Microchip Technology Inc.
DS21874B-page 19
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
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Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
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Tel: 91-80-2229-0061
Fax: 91-80-2229-0062
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Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
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Tel: 91-11-5160-8631
Fax: 91-11-5160-8632
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Tel: 43-7242-2244-399
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Tel: 45-4450-2828
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Tel: 86-28-8676-6200
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04/20/05
DS21874B-page 20
© 2005 Microchip Technology Inc.