LT3029 Dual 500mA/500mA Low Dropout, Low Noise, Micropower Linear Regulator DESCRIPTION FEATURES n n n n n n n n n n n n n Output Current: 500mA per Channel Low Dropout Voltage: 300mV Low Noise: 20μVRMS (10Hz to 100kHz) Low Quiescent Current: 55μA per Channel Wide Input Voltage Range: 1.8V to 20V (Common or Independent Input Supply) Adjustable Output: 1.215V Reference Voltage Very Low Quiescent Current in Shutdown: <1μA per Channel Stable with 3.3μF Minimum Output Capacitor Stable with Ceramic, Tantalum or Aluminum Electrolytic Capacitors Reverse-Battery and Reverse Output-to-Input Protection Current Limit with Foldback and Thermal Shutdown Tracking/Sequencing Capability: Compatible with LTC292X Power Supply Tracking ICs Thermally Enhanced 16-Lead MSOP and 16-Lead (4mm × 3mm) DFN Packages APPLICATIONS n n n n n General Purpose Linear Regulator Battery-Powered Systems Microprocessor Core/Logic Supplies Post Regulator for Switching Supplies Tracking/Sequencing Power Supplies The LT®3029 is a dual, micropower, low noise, low dropout linear regulator. The device operates either with a common input supply or independent input supplies for each channel, over an input voltage range of 1.8V to 20V. Each output supplies up to 500mA of output current with a typical dropout voltage of 300mV. Quiescent current is well controlled in dropout. With an external 10nF bypass capacitor, output noise is only 20μVRMS over a 10Hz to 100kHz bandwidth. Designed for use in battery-powered systems, the low 55μA quiescent current per channel makes it an ideal choice. In shutdown, quiescent current drops to less than 1μA. Shutdown control is independent for each channel, allowing for flexible power management. The LT3029 optimizes stability and transient response with low ESR ceramic output capacitors, requiring a minimum of only 3.3μF. The regulator does not require the addition of ESR, as is common with other regulators. Internal circuitry provides reverse-battery protection, reverse-current protection, current limiting with foldback and thermal shutdown. The device is available as an adjustable output voltage device with a 1.215V reference voltage. The LT3029 is offered in the thermally enhanced 16-lead MSOP and 16-lead, low profile (4mm × 3mm × 0.75mm) DFN packages. L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. Dropout Voltage vs Load Current TYPICAL APPLICATION 400 2.5VIN to 1.5V/1.8V Application IN1 3.3μF OUT1 LT3029 10nF BYP1 ADJ1 IN2 OUT2 10nF BYP2 ADJ2 GND 3.3μF 237k 1% SHDN1 SHDN2 113k 1% VOUT1 1.8V 500mA 54.9k 1% 237k 1% 3029 TA01 3.3μF VOUT2 1.5V 500mA DROPOUT VOLTAGE (mV) VIN 2.5V TJ = 25°C 350 300 250 200 150 100 50 0 0 50 100 150 200 250 300 350 400 450 500 OUTPUT CURRENT (mA) 3029 TA01b 3029f 1 LT3029 ABSOLUTE MAXIMUM RATINGS (Note 1) IN1, IN2 Pin Voltage................................................±22V OUT1, OUT2 Pin Voltage .........................................±22V Input-to-Output Differential Voltage ........................±22V ADJ1, ADJ2 Pin Voltage ............................................±9V BYP1, BYP2 Pin Voltage ........................................±0.6V SHDN1 , SHDN2 Pin Voltage..................................±22V Output Short-Circuit Duration .......................... Indefinite Operating Junction Temperature (Notes 2, 12) LT3029E ............................................. –40°C to 125°C LT3029I .............................................. –40°C to 125°C LT3029H ............................................ –40°C to 150°C LT3029MP.......................................... –55°C to 125°C Storage Temperature Range................... –65°C to 150°C Lead Temperature (Soldering, 10 sec) (MSOP Only)..................................................... 300°C PIN CONFIGURATION TOP VIEW BYP1 1 NC 2 OUT1 3 OUT1 4 GND 5 OUT2 6 OUT2 7 BYP2 8 TOP VIEW 16 ADJ1 15 SHDN1 17 GND BYP1 NC OUT1 OUT1 GND OUT2 OUT2 BYP2 14 IN1 13 IN1 12 IN2 11 IN2 10 SHDN2 9 ADJ2 1 2 3 4 5 6 7 8 17 GND 16 15 14 13 12 11 10 9 ADJ1 SHDN1 IN1 IN1 IN2 IN2 SHDN2 ADJ2 MSE PACKAGE 16-LEAD PLASTIC MSOP DE PACKAGE 16-LEAD (4mm s 3mm) PLASTIC DFN TJMAX = 125°C, θJA = 38°C/W, θJC = 4.3°C/W EXPOSED PAD (PIN 17) IS GND, MUST BE SOLDERED TO PCB GND TJMAX = 125°C (LT3029E/LT3029I, LT3029MP), θJA = 37°C/W, θJC: 5°C/W TO 10°C/W TJMAX = 150°C (LT3029H), θJA = 37°C/W, θJC: 5°C/W TO 10°C/W EXPOSED PAD (PIN 17) IS GND, MUST BE SOLDERED TO PCB GND ORDER INFORMATION LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE LT3029EDE#PBF LT3029EDE#TRPBF 3029 16-Lead (4mm × 3mm) Plastic DFN –40°C to 125°C LT3029IDE#PBF LT3029IDE#TRPBF 3029 16-Lead (4mm × 3mm) Plastic DFN –40°C to 125°C LT3029EMSE#PBF LT3029EMSE#TRPBF 3029 16-Lead Plastic MSOP –40°C to 125°C LT3029IMSE#PBF LT3029IMSE#TRPBF 3029 16-Lead Plastic MSOP –40°C to 125°C LT3029HMSE#PBF LT3029HMSE#TRPBF 3029 16-Lead Plastic MSOP –40°C to 150°C LT3029MPMSE#PBF LT3029MPMSE#TRPBF 3029 16-Lead Plastic MSOP –55°C to 125°C LEAD BASED FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE LT3029EDE LT3029EDE#TR 3029 16-Lead (4mm × 3mm) Plastic DFN –40°C to 125°C LT3029IDE LT3029IDE#TR 3029 16-Lead (4mm × 3mm) Plastic DFN –40°C to 125°C LT3029EMSE LT3029EMSE#TR 3029 16-Lead Plastic MSOP –40°C to 125°C LT3029IMSE LT3029IMSE#TR 3029 16-Lead Plastic MSOP –40°C to 125°C LT3029HMSE LT3029HMSE#TR 3029 16-Lead Plastic MSOP –40°C to 150°C LT3029MPMSE LT3029MPMSE#TR 3029 16-Lead Plastic MSOP –55°C to 125°C Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/ 3029f 2 LT3029 ELECTRICAL CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 2) PARAMETER CONDITIONS Minimum Input Voltage (Notes 3, 11) ILOAD = 500mA l ADJ1, ADJ2 Pin Voltage (Notes 3, 4, 9) VIN = 2V, ILOAD = 1mA 2.3V < VIN < 20V, 1mA < ILOAD < 500mA (E, I, MP) 2.3V < VIN < 20V, 1mA < ILOAD < 500mA (H) l l Line Regulation (Note 3) ΔVIN = 2V to 20V, ILOAD = 1mA l Load Regulation (Note 3) VIN = 2.3V, ΔILOAD = 1mA to 500mA VIN = 2.3V, ΔILOAD = 1mA to 500mA (E, I, MP) VIN = 2.3V, ΔILOAD = 1mA to 500mA (H) l l ILOAD = 10mA ILOAD = 10mA l ILOAD = 50mA ILOAD = 50mA l ILOAD = 100mA ILOAD = 100mA l ILOAD = 500mA ILOAD = 500mA l GND Pin Current (per Channel) VIN = VOUT(NOMINAL) (Notes 5, 7) ILOAD = 0mA ILOAD = 1mA ILOAD = 50mA ILOAD = 100mA ILOAD = 250mA ILOAD = 500mA l l l l l l Output Voltage Noise COUT = 10μF, CBYP = 10nF, ILOAD = 500mA, BW = 10Hz to 100kHz ADJ1/ADJ2 Pin Bias Current ADJ1, ADJ2 (Notes 3, 8) Shutdown Threshold VOUT = Off to On VOUT = On to Off l l SHDN1/SHDN2 Pin Current (Note 10) VSHDN1, VSHDN2 = 0V VSHDN1, VSHDN2 = 20V l l Dropout Voltage VIN = VOUT(NOMINAL) (Notes 5, 6, 11) MIN MAX 1.8 2.3 V 1.215 1.215 1.215 1.227 1.239 1.239 V V V 0.5 5 mV 2.5 6 15 32 mV mV mV 0.11 0.18 0.25 V V 0.16 0.22 0.31 V V 0.2 0.25 0.34 V V 0.3 0.36 0.46 V V 55 90 1.1 2 4.3 10 150 250 2 3.5 8 16 μA μA mA mA mA mA 20 Quiescent Current in Shutdown (per Channel) VIN = 6V, VSHDN1 = 0V, VSHDN2 = 0V Ripple Rejection VIN = 2.715V (Avg), VRIPPLE = 0.5VP-P, fRIPPLE = 120Hz, ILOAD = 500mA Current Limit (Note 9) VIN = 7V, VOUT = 0V VIN = 2.3V, ΔVOUT = –0.1V l Input Reverse Leakage Current VIN = –20V, VOUT = 0V l Reverse Output Current VOUT = 1.215V, VIN = 0V Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LT3029 is tested and specified under pulse load conditions such that TJ ≈ TA. The LT3029E is 100% tested at TA = 25°C. Performance of the LT3029E over the full –40°C to 125°C operating junction temperature range is assured by design, characterization and correlation with statistical process controls. The LT3029I is guaranteed over the full –40°C to 125°C operating junction temperature range. The LT3029MP is 100% tested and guaranteed over the –55°C to 125°C operating junction temperature range. The LT3029H is tested at 150°C operating junction temperature. High junction temperatures degrade operating lifetimes. Operating lifetime is derated at junction temperatures greater than 125°C. 1.203 1.191 1.173 TYP 0.20 55 UNITS μVRMS 30 100 nA 0.45 0.40 1.1 V V 0 0.6 0.5 3 μA μA 0.01 0.1 μA 67 dB 1.5 A mA 520 0.5 1 mA 10 μA Note 3: The LT3029 is tested and specified for these conditions with the ADJ1/ADJ2 pin connected to the corresponding OUT1/OUT2 pin. Note 4: Maximum junction temperature limits operating conditions. The regulated output voltage specification does not apply for all possible combinations of input voltage and output current. When operating at maximum input voltage, limit the output current range. When operating at maximum output current, limit the input voltage range. Note 5: To satisfy minimum input voltage requirements, the LT3029 is tested and specified for these conditions with an external resistor divider (two 243k resistors) for an output voltage of 2.437V. The external resistor divider adds 5μA of DC load on the output. Note 6: Dropout voltage is the minimum input to output voltage differential needed to maintain regulation at a specified output current. In dropout, the output voltage equals: VIN – VDROPOUT. 3029f 3 LT3029 ELECTRICAL CHARACTERISTICS Note 7: GND pin current is tested with VIN = 2.437V and a current source load. This means the device is tested while operating in its dropout region or at the minimum input voltage specification. This is the worst-case GND pin current. The GND pin current decreases slightly at higher input voltages. Total GND pin current equals the sum of output 1 and output 2 GND pin currents. Note 8: ADJ1/ADJ2 pin bias current flows into the pin. Note 9: The LT3029 contains current limit foldback circuitry. See the Typical Performance Characteristics for current limit as a function of the VIN – VOUT differential voltage. Note 10: SHDN1/ SHDN2 pin current flows into the pin. Note 11: The LT3029 minimum input voltage specification limits dropout voltage under some output voltage/load conditions. See the curve of Minimum Input Voltage in the Typical Performance Characteristics. Note 12: The LT3029 includes overtemperature protection that is intended to protect the device during momentary overload conditions. Junction temperature exceeds the maximum operating junction temperature when overtemperature protection is active. Continuous operation above the specified maximum operating junction temperature may impair device reliability. TYPICAL PERFORMANCE CHARACTERISTICS Typical Dropout Voltage Guaranteed Dropout Voltage 500 DROPOUT VOLTAGE (mV) TJ = 150°C 400 350 TJ = 125°C 300 250 TJ = 25°C 200 150 TJ = –55°C 100 50 GUARANTEED DROPOUT VOLTAGE (mV) 500 450 TJ = 25°C, unless otherwise noted. = TEST POINTS 450 TJ = 150°C 400 350 TJ = 25°C 300 250 200 150 100 50 0 0 0 0 50 100 150 200 250 300 350 400 450 500 OUTPUT CURRENT (mA) 50 100 150 200 250 300 350 400 450 500 OUTPUT CURRENT (mA) 3029 G02 3029 G01 Dropout Voltage vs Temperature Quiescent Current (per Channel) 500 150 IL = 500mA 400 IL = 250mA 350 300 IL = 100mA 250 200 IL = 10mA 150 100 50 125 QUIESCENT CURRENT (μA) DROPOUT VOLTAGE (mV) 450 VIN = 6V RL = 243k, IL = 5μA 100 75 VSHDN = VIN 50 25 IL = 1mA IL = 50mA 0 –75 –50 –25 0 25 50 75 100 125 150 175 TEMPERATURE (°C) 3029 G03 0 –75 –50 –25 0 25 50 75 100 125 150 175 TEMPERATURE (°C) 3029 G04 3029f 4 LT3029 TYPICAL PERFORMANCE CHARACTERISTICS ADJ1 or ADJ2 Pin Voltage 1.239 Quiescent Current (per Channel) 160 IL = 1mA 1.233 TJ = 25°C RL = 243k VOUT = 1.215V 140 QUIESCENT CURRENT (μA) ADJ PIN VOLTAGE (V) TJ = 25°C, unless otherwise noted. 1.227 1.221 1.215 1.209 1.203 120 100 80 VSHDN = VIN 60 40 20 1.197 VSHDN = 0V 0 1.191 –75 –50 –25 0 25 50 75 100 125 150 175 TEMPERATURE (°C) 0 2 4 6 8 10 12 14 16 18 20 INPUT VOLTAGE (V) 3029 G05 3029 G06 GND Pin Current (per Channel) GND Pin Current (per Channel) 1.6 16 1.2 TJ = 25°C 14 FOR VOUT = 1.215V GND PIN CURRENT (mA) GND PIN CURRENT (mA) TJ = 25°C 1.4 FOR VOUT = 1.215V RL = 24.3Ω, IL = 50mA 1.0 0.8 0.6 0.4 RL = 121.5Ω, IL = 10mA 0.2 0 1 2 3 4 5 6 7 INPUT VOLTAGE (V) 10 RL = 2.43Ω, IL = 500mA 8 6 RL = 4.05Ω, IL = 300mA 4 RL = 12.15Ω, IL = 100mA 2 RL = 1.215kΩ, IL = 1mA 0 12 0 8 9 10 0 1 2 1.0 TJ = 25°C VIN = VOUT(NOMINAL) + 1V 0.9 SHDN PIN THRESHOLD (V) GND PIN CURRENT (mA) 9 10 SHDN1 or SHDN2 Pin Threshold (On-to-Off) GND Pin Current vs ILOAD 14 8 3029 G08 3029 G07 16 3 4 5 6 7 INPUT VOLTAGE (V) 12 10 8 6 4 2 IL = 1mA 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 0 50 100 150 200 250 300 350 400 450 500 OUTPUT CURRENT (mA) 3029 G09 0 –75 –50 –25 0 25 50 75 100 125 150 175 TEMPERATURE (°C) 3029 G10 3029f 5 LT3029 TYPICAL PERFORMANCE CHARACTERISTICS SHDN1 or SHDN2 Pin Input Current 1.0 1.0 0.9 0.9 SHDN PIN INPUT CURRENT (μA) SHDN PIN THRESHOLD (V) SHDN1 or SHDN2 Pin Threshold (Off-to-On) 0.8 0.7 IL = 500mA 0.6 0.5 IL = 1mA 0.4 0.3 0.2 TJ = 25°C, unless otherwise noted. TJ = 25°C 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.1 0 0 –75 –50 –25 0 25 50 75 100 125 150 175 TEMPERATURE (°C) 0 2 4 6 8 10 12 14 16 18 20 SHDN PIN VOLTAGE (V) 3029 G12 3029 G11 SHDN1 or SHDN2 Pin Input Current 1.0 VSHDN = 20V 135 ADJ PIN BIAS CURRENT (nA) 0.9 SHDN PIN INPUT CURRENT (μA) ADJ1 or ADJ2 Pin Bias Current 150 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 120 105 90 75 60 45 30 15 0 –75 –50 –25 0 25 50 75 100 125 150 175 TEMPERATURE (°C) 0 –75 –50 –25 0 25 50 75 100 125 150 175 TEMPERATURE (°C) 3029 G14 3029 G13 Current Limit 2.0 VOUT = 0V 1.8 1.6 VIN = 7V 1.8 VOUT = 0V 1.6 TJ = 25°C 1.4 1.2 1.0 TJ = –55°C 0.8 TJ = 125°C 0.6 TJ = 150°C 0.4 CURRENT LIMIT (A) CURRENT LIMIT (A) Current Limit 2.0 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.2 0 0 2 4 6 8 10 12 14 16 18 20 INPUT VOLTAGE (V) 0 –75 –50 –25 0 25 50 75 100 125 150 175 TEMPERATURE (°C) 3029 G15 3029 G16 3029f 6 LT3029 TYPICAL PERFORMANCE CHARACTERISTICS Reverse Current 300 Input Ripple Rejection 100 VIN = 0V VADJ = VOUT = 1.215V 240 210 RIPPLE REJECTION (dB) REVERSE CURRENT (μA) 270 TJ = 25°C, unless otherwise noted. IADJ 180 150 120 90 TJ = 25°C 90 IL = 500mA +1V + 50mVRMS RIPPLE V =V 80 CIN = OUT(NOMINAL) BYP 0 COUT = 10μF 70 60 50 40 30 COUT = 3.3μF 20 60 10 30 IOUT 0 –75 –50 –25 0 0 10 25 50 75 100 125 150 175 100 TEMPERATURE (°C) IADJ FLOWS INTO ADJ PIN TO GND PIN IOUT FLOWS INTO OUT PIN TO IN PIN 90 90 CBYP = 0.01μF 60 CBYP = 1000pF CBYP = 100pF 30 20 10 0 TJ = 25°C IL = 500mA VIN = VOUT(NOMINAL) +1V + 50mVRMS RIPPLE COUT = 10μF 10 100 1k 10k 100k FREQUENCY (Hz) VIN = VOUT(NOMINAL) + 1.5V + 0.5VP-P RIPPLE f = 120Hz IL = 500mA 80 70 1M RIPPLE REJECTION (dB) RIPPLE REJECTION (dB) Input Ripple Rejection 100 40 70 60 50 40 30 20 10 0 –75 –50 –25 0 25 50 75 100 125 150 175 TEMPERATURE (°C) 10M 3029 G19 3029 G20 Channel-to-Channel Isolation Minimum Input Voltage MINIMUM INPUT VOLTAGE (V) 2.25 2.00 100 VOUT = 1.215V CHANNEL-TO-CHANNEL ISOLATION (dB) 2.50 IL = 500mA 1.75 1.50 1.25 10M 3029 G17 Input Ripple Rejection 50 1M 3029 G18 100 80 1k 10k 100k FREQUENCY (Hz) IL = 1mA 1.00 0.75 0.50 0.25 0 –75 –50 –25 0 25 50 75 100 125 150 175 TEMPERATURE (°C) 3029 G21 90 TJ = 25°C 80 70 60 50 40 30 20 10 0 10 100 1k 10k 100k FREQUENCY (Hz) 1M GIVEN CHANNEL IS TESTED WITH 50mVRMS SIGNAL ON OPPOSING CHANNEL, BOTH CHANNELS DELIVERING FULL CURRENT 10M 3029 G22 3029f 7 LT3029 TYPICAL PERFORMANCE CHARACTERISTICS Channel-to-Channel Isolation TJ = 25°C, unless otherwise noted. Load Regulation 0 –2 LOAD REGULATION (mV) VOUT1 50mV/DIV VOUT2 50mV/DIV –4 –6 –8 –10 –12 –14 –16 3029 G23 50μs/DIV COUT1 = 10μF ΔIL1 = 50mA TO 500mA COUT2 = 10μF ΔIL2 = 50mA TO 500mA CBYP1 = CBYP2 = 0.01μF VIN = 6V, VOUT1 = VOUT2 = 5V –18 ΔIL = 1mA TO 500mA –20 –75 –50 –25 0 25 50 75 100 125 150 175 TEMPERATURE (°C) 3029 G24 TJ = 25°C COUT = 10μF CBYP = 0 IL = 500mA Output Noise Spectral Density OUTPUT NOISE SPECTRAL DENSITY (μV/Hz) OUTPUT NOISE SPECTRAL DENSITY (μV/Hz) Output Noise Spectral Density 10 VOUT = 5V 1 VOUT = VADJ 0.1 0.01 0.01 0.1 1 10 FREQUENCY (kHz) 100 10 TJ = 25°C COUT = 10μF IL = 500mA VOUT = 5V CBYP = 1000pF 1 CBYP = 100pF VOUT =VADJ 0.1 CBYP = 0.01μF 0.01 0.01 0.1 1 10 FREQUENCY (kHz) 100 3029 G26 3029 G25 RMS Output Noise vs Load Current RMS Output Noise vs Bypass Capacitor TJ = 25°C COUT = 10μF IL = 500mA fBW = 10Hz TO 100kHz OUTPUT NOISE (μVRMS) 140 120 VOUT = 5V 100 80 60 VOUT = 1.215V 40 160 OUTPUT NOISE (μVRMS) 160 TJ = 25°C 140 COUT = 10μF CBYP = 0 CBYP = 10nF 120 100 80 VOUT =VADJ 60 40 VOUT = 5V 20 20 0 10 100 1000 10000 CBYP (pF) 3029 G27 VOUT = 5V 0 0.01 VOUT =VADJ 0.1 1 10 100 LOAD CURRENT (mA) 3029 G28 3029f 8 LT3029 TYPICAL PERFORMANCE CHARACTERISTICS 10Hz to 100kHz Output Noise, CBYP = 0pF TJ = 25°C, unless otherwise noted. 10Hz to 100kHz Output Noise, CBYP = 100pF VOUT 100μV/DIV VOUT 100μV/DIV COUT = 10μF IL = 500mA VOUT = 5V 1ms/DIV 3029 G29 COUT = 10μF IL = 500mA VOUT = 5V 1ms/DIV 3029 G30 10Hz to 100kHz Output Noise, CBYP = 0.01μF 10Hz to 100kHz Output Noise, CBYP = 1000pF VOUT 100μV/DIV VOUT 100μV/DIV COUT = 10μF IL = 500mA VOUT = 5V 1ms/DIV 3029 G31 COUT = 10μF IL = 500mA VOUT = 5V 1ms/DIV 3029 G32 3029f 9 LT3029 TYPICAL PERFORMANCE CHARACTERISTICS Transient Response, CBYP = 0pF TJ = 25°C, unless otherwise noted. Transient Response, CBYP = 0.01μF VOUT DEVIATION VOUT DEVIATION 50mV/DIV 200mV/DIV LOAD CURRENT DEVIATION LOAD CURRENT DEVIATION 250mA/DIV 250mA/DIV VIN = 6V CIN = 10μF COUT = 10μF 200μs/DIV IL = 100mA TJ = 25°C VOUT = 5V 3029 G33 VIN = 6V CIN = 10μF COUT = 10μF Start-Up Time from Shutdown, CBYP = 0pF Start-Up Time from Shutdown, CBYP = 0.01μF VOUT 1V/DIV VOUT 1V/DIV SHDN VOLTAGE 2V/DIV SHDN VOLTAGE 2V/DIV VIN = 2.5V COUT = 10μF RL = 3Ω 1ms/DIV IL = 500mA VOUT = 1.5V 3029 G34 20μs/DIV IL = 100mA TJ = 25°C VOUT = 5V 3029 G35 VIN = 2.5V COUT = 10μF RL = 3Ω 1ms/DIV IL = 500mA VOUT = 1.5V 3029 G36 3029f 10 LT3029 PIN FUNCTIONS BYP1/BYP2 (Pin 1/Pin 8): Bypass. Use the BYP1/BYP2 pins to bypass the reference of the LT3029 regulator and achieve low output noise performance. Internal circuitry clamps the BYP1/BYP2 pins to ±0.6V (one VBE) from ground. A small capacitor from the corresponding output to this pin bypasses the reference to lower the output voltage noise. Using a maximum value of 10nF reduces the output voltage noise to a typical 20μVRMS over a 10Hz to 100kHz bandwidth. If not used, this pin must be left unconnected. Include a bypass capacitor in battery-powered circuits, as a battery’s output impedance rises with frequency. A bypass capacitor in the range of 1μF to 10μF suffices. The LT3029’s design withstands reverse voltages on the IN pins with respect to ground and the OUT pins. In the case of a reversed input, which occurs if a battery is plugged in backwards, the LT3029 acts as if a diode is in series with its input. No reverse current flows into the LT3029 and no reverse voltage appears at the load. The device protects itself and the load. NC (Pin 2): No Connect. This pin is not connected to any internal circuitry. It may be floated, tied to VIN or tied to GND. SHDN1 / SHDN2 (Pin 15/Pin 10): Shutdown. Pulling the SHDN1 or SHDN2 pin low puts its corresponding LT3029 channel into a low power state and turns its output off. The SHDN1 and SHDN2 pins are completely independent of each other, and each SHDN pin only affects operation on its corresponding channel. Drive the SHDN1 and SHDN2 pins with either logic or an open collector/drain with pull-up resistors. The resistors supply the pull-up current to the open collectors/drains and the SHDN1 or SHDN2 current, typically less than 1μA. If unused, connect the SHDN1 and SHDN2 to their corresponding IN pins. Each channel will be in its low power shutdown state if its corresponding SHDN pin is not connected. OUT1/OUT2 (Pins 3, 4/Pins 6, 7): Output. The outputs supply power to the loads. A minimum 3.3μF output capacitor prevents oscillations on each output. Applications with large output load transients require larger values of output capacitance to limit peak voltage transients. See the Applications Information section for more on output capacitance and reverse output characteristics. GND (Pin 5, 17): Ground. The exposed pad (Pin 17) of the DFN and MSOP packages is an electrical connection to GND. To ensure proper electrical and thermal performance, solder Pin 17 to the PCB ground and tie directly to Pin 5. Connect the bottom of the output voltage setting resistor divider directly to GND (Pin 5) for optimum load regulation performance. IN1/IN2 (Pins 13, 14/Pins 11, 12): Inputs. The IN1/IN2 pins supply power to each channel. The LT3029 requires a bypass capacitor at the IN1/IN2 pins if located more than six inches away from the main input filter capacitor. ADJ1/ADJ2: (Pin 16/Pin 9) Adjust Pin. These are the error amplifier inputs. These pins are internally clamped to ±9V. A typical input bias current of 30nA flows into the pins (see curve of ADJ1/ADJ2 Pin Bias Current vs Temperature in the Typical Performance Characteristics section). The ADJ1 and ADJ2 pin voltage is 1.215V referenced to ground and the output voltage range is 1.215V to 19.5V. 3029f 11 LT3029 APPLICATIONS INFORMATION The LT3029 is a dual 500mA/500mA low dropout regulator with independent inputs, micropower quiescent current and shutdown. The device supplies up to 500mA from each channel’s output at a typical dropout voltage of 300mV. The two regulators share a common GND pin and are thermally coupled. However, the two inputs and outputs of the LT3029 operate independently. Each channel can be shut down independently, but a thermal shutdown fault on either channel shuts off the output on both channels. The addition of a 10nF reference bypass capacitor lowers output voltage noise to 20μVRMS over a 10Hz to 100kHz bandwidth. Additionally, the reference bypass capacitor improves transient response of the regulator, lowering the settling time for transient load conditions. The low operating quiescent current (55μA per channel) drops to less than 1μA in shutdown. In addition to the low quiescent current, the LT3029 regulator incorporates several protection features that make it ideal for use in batterypowered systems. Most importantly, the device protects itself against reverse input voltages. Current limiting with foldback necessitates a minimum load current of 20μA for input/output voltage differentials of more than 10V to keep the output regulated. Adjustable Operation Each of the LT3029’s channels has an output voltage range of 1.215V to 19.5V. Figure 1 illustrates that output voltage is set by the ratio of two external resistors. The device regulates the output to maintain the corresponding ADJ pin voltage at 1.215V referenced to ground. R1’s current equals 1.215V/R1. R2’s current equals R1’s current plus the ADJ pin bias current. The ADJ pin bias current, 30nA at 25°C, flows through R2 into the ADJ pin. Use the formula in Figure 1 to calculate output voltage. Linear Technology recommends that the value of R1 be less than 243k to minimize errors in the output voltage due to the ADJ pin bias current. In shutdown, the output turns off and the divider current is zero. Curves of ADJ Pin Voltage vs Temperature LT3029 OUT1/OUT2 VIN VOUT IN1/IN2 R2 ( )( ) VADJ = 1.215V C IADJ = 30nA AT 25°C ADJ1/ADJ2 GND ⎛ R2 ⎞ VOUT = 1.215V ⎜ 1+ ⎟ + IADJ R2 ⎝ R1⎠ OUTPUT RANGE = 1.215V TO O 19.5V R1 3029 F01 Figure 1. Adjustable Operation and ADJ Pin Bias Current vs Temperature appear in the Typical Performance Characteristics section. Linear Technology tests and specifies each LT3029 channel with its ADJ pin tied to the corresponding OUT pin for a 1.215V output voltage. Specifications for output voltages greater than 1.215V are proportional to the ratio of desired output voltage to 1.215V: VOUT 1 . 215V For example, load regulation on either output for an output current change of 1mA to 500mA is typically –2.5mV at VOUT = 1.215V. At VOUT = 2.5V, load regulation is: 2 . 5V • (− 2 . 5mV) = − 5 . 14mV 1 . 215V Table 1 shows 1% resistor divider values for some common output voltages with a resistor divider current of approximately 5μA. Table 1. Output Voltage Resistor Divider Values VOUT (V) R1 (k) R2 (k) 1.5 237 54.9 1.8 237 113 2.5 243 255 3 232 340 3.3 210 357 5 200 619 3029f 12 LT3029 APPLICATIONS INFORMATION Bypass Capacitance and Low Noise Performance Output Capacitance and Transient Response Using a bypass capacitor connected between a channel’s BYP pin and its corresponding OUT pin significantly lowers LT3029 output voltage noise, but is not required in all applications. Linear Technology recommends a good quality low leakage capacitor. This capacitor bypasses the regulator’s reference, providing a low frequency noise pole. A 10nF bypass capacitor introduces a noise pole that decreases output voltage noise to as low as 20μVRMS. Using a bypass capacitor provides the added benefit of improving transient response. With no bypass capacitor, and a 10μF output capacitor, a 100mA to 500mA load step settles to within 1% of its final value in approximately 100μs. With the addition of a 10nF bypass capacitor and evaluating the same load step, output voltage excursion stays within 1% (see Transient Response in the Typical Performance Characteristics section). Using a bypass capacitor makes regulator start-up time proportional to the value of the bypass capacitor. For example, a 10nF bypass capacitor and 10μF output capacitor slow start-up time to 15ms. The LT3029 design is stable with a wide range of output capacitors. The ESR of the output capacitor affects stability, most notably with small capacitors. Linear Technology recommends a minimum output capacitor of 3.3μF with an ESR of 3Ω, or less, to prevent oscillations. The LT3029 is a micropower device, and output transient response is a function of output capacitance. Larger values of output capacitance decrease the peak deviations and provide improved transient response for larger load current changes. Ceramic capacitors require extra consideration. Manufacturers make ceramic capacitors with a variety of dielectrics, each with different behavior across temperature and applied voltage. The most common dielectrics specify the EIA temperature characteristic codes of Z5U, Y5V, X5R and X7R. Z5U and Y5V dielectrics provide high C-V products in a small package at low cost, but exhibit strong voltage and temperature coefficients, as shown in Figures 2 and 3. When used with a 5V regulator, a 16V 10μF Y5V capacitor can exhibit an effective value as low as 1μF to 40 20 BOTH CAPACITORS ARE 16V, 1210 CASE SIZE, 10μF 20 X5R CHANGE IN VALUE (%) CHANGE IN VALUE (%) 0 –20 –40 –60 Y5V –80 –100 X5R 0 –20 –40 Y5V –60 –80 0 2 4 8 6 10 12 DC BIAS VOLTAGE (V) 14 16 3029 F02 Figure 2. Ceramic Capacitor DC Bias Characteristics BOTH CAPACITORS ARE 16V, 1210 CASE SIZE, 10μF –100 50 25 75 –50 –25 0 TEMPERATURE (°C) 100 125 3029 F03 Figure 3. Ceramic Capacitor Temperature Characteristics 3029f 13 LT3029 APPLICATIONS INFORMATION 2μF for the applied DC bias voltage and over the operating temperature range. X5R and X7R dielectrics result in more stable characteristics and are more suitable for use as the output capacitor. The X7R type has better stability across temperature, while the X5R is less expensive and is available in higher values. Exercise care even when using X5R and X7R capacitors; the X5R and X7R codes only specify operating temperature range and maximum capacitance change over temperature. Capacitance change due to DC bias (voltage coefficient) with X5R and X7R capacitors is better than with Y5V and Z5U capacitors, but can still be significant enough to drop capacitor values below appropriate levels. Capacitor DC bias characteristics tend to improve as case size increases. Linear Technology recommends verifying expected versus actual capacitance values at operating voltage in situ for an application. Voltage and temperature coefficients are not the only sources of problems. Some ceramic capacitors have a piezoelectric response. A piezoelectric device generates voltage across its terminals due to mechanical stress, similar to the way a piezoelectric accelerometer or microphone works. For a ceramic capacitor, the stress can be induced by vibrations in the system or thermal transients. The resulting voltages produced can cause appreciable amounts of noise, especially when a ceramic capacitor is used for noise bypassing. A ceramic capacitor produced Figure 4’s trace in response to light tapping from a pencil. Similar vibration induced behavior can masquerade as increased output voltage noise. COUT = 10μF CBYP = 0.01μF ILOAD = 500mA VOUT 500μV/DIV 100ms/DIV 3029 F04 Figure 4. Noise Resulting from Tapping on a Ceramic Capacitor 3029f 14 LT3029 APPLICATIONS INFORMATION Thermal Considerations The LT3029’s power handling capability limits the maximum rated junction temperature (125°C, LT3029E/LT3029I/ LT3029MP or 150°C, LT3029H). Two components comprise the power dissipated by each channel: 1. Output current multiplied by the input/output voltage differential: (IOUT)(VIN – VOUT), and 2. GND pin current multiplied by the input voltage: (IGND)(VIN). Ground pin current is found by examining the GND Pin Current curves in the Typical Performance Characteristics section. Power dissipation for each channel equals the sum of the two components listed above. Total power dissipation for the LT3029 equals the sum of the power dissipated by each channel. The LT3029’s internal thermal shutdown circuitry protects both channels of the device if either channel experiences an overload or fault condition. Activation of the thermal shutdown circuitry turns both channels off. If the overload or fault condition is removed, both outputs are allowed to turn back on. For continuous normal conditions, do not exceed the maximum junction temperature rating of 125°C (LT3029E/LT3029I/LT3029MP) or 150°C (LT3029H). Carefully consider all sources of thermal resistance from junction-to-ambient, including additional heat sources mounted in proximity to the LT3029. For surface mount devices, use the heat spreading capabilities of the PC board and its copper traces to accomplish heat sinking. Copper board stiffeners and plated through-holes can also spread the heat generated by power devices. The following tables list thermal resistance as a function of copper area in a fixed board size. All measurements were taken in still air on a four-layer FR-4 board with 1oz solid internal planes, and 2oz external trace planes with a total board thickness of 1.6mm. For further information on thermal resistance and using thermal information, refer to JEDEC standard JESD51, notably JESD51-12. Table 2. DE Package, 16-Lead DFN COPPER AREA THERMAL RESISTANCE BOARD AREA (JUNCTION-TO-AMBIENT) TOPSIDE* BACKSIDE 2500mm2 2500mm2 2500mm2 36°C/W 1000mm2 2500mm2 2500mm2 37°C/W 225mm2 2500mm2 2500mm2 38°C/W 100mm2 2500mm2 2500mm2 40°C/W *Device is mounted on topside. Table 3. MSE Package, 16-Lead MSOP COPPER AREA THERMAL RESISTANCE BOARD AREA (JUNCTION-TO-AMBIENT) TOPSIDE* BACKSIDE 2500mm2 2500mm2 2500mm2 35°C/W 1000mm2 2500mm2 2500mm2 36°C/W 225mm2 2500mm2 2500mm2 37°C/W 100mm2 2500mm2 2500mm2 39°C/W *Device is mounted on topside. The junction-to-case thermal resistance (θJC), measured at the Exposed Pad on the back of the die, is 4.3°C/W for the DFN package, and 5°C/W to 10°C/W for the MSOP package. 3029f 15 LT3029 APPLICATIONS INFORMATION Calculating Junction Temperature Protection Features Example: Channel 1’s output voltage is set to 1.8V. Channel 2’s output voltage is set to 1.5V. Each channel’s input voltage is 2.5V. Each channel’s output current range is 0mA to 500mA. The application has a maximum ambient temperature of 50°C. What is the LT3029’s maximum junction temperature? The LT3029 regulator incorporates several protection features that make it ideal for use in battery-powered circuits. In addition to the normal protection features associated with monolithic regulators, such as current limiting and thermal limiting, the device protects itself against reverse input voltages and reverse voltages from output to input. The two regulators have independent inputs, a common GND pin and are thermally coupled. However, the two channels of the LT3029 operate independently. Each channel’s output can be shut down independently, and a fault condition on one output does not affect the other output electrically, unless the thermal shutdown circuitry is activated. The power dissipated by each channel equals: IOUT(MAX)(VIN – VOUT) + IGND(VIN) where for each output: IOUT(MAX) = 500mA VIN = 2.5V IGND at (IOUT = 500mA, VIN = 2.5V) = 8.5mA So, for output 1: P = 500mA (2.5V – 1.8V) + 8.5mA (2.5V) = 0.37W For output 2: P = 500mA (2.5V – 1.5V) + 8.5mA (2.5V) = 0.52W The thermal resistance is in the range of 35°C/W to 40°C/W, depending on the copper area. So, the junction temperature rise above ambient temperature approximately equals: (0.37W + 0.52W) 39°C/W = 34.7°C The maximum junction temperature then equals the maximum ambient temperature plus the maximum junction temperature rise above ambient temperature, or: TJMAX = 50°C + 34.7°C = 84.7°C Current limit protection and thermal overload protection protect the device against current overload conditions at each output of the LT3029. For normal operation, do not allow the junction temperature to exceed 125°C (LT3029E/ LT3029I/LT3029MP) or 150°C (LT3029H). The typical thermal shutdown temperature threshold is 165°C and the circuitry incorporates approximately 5°C of hysteresis. Each channel’s input withstands reverse voltages of 22V. Current flow into the device is limited to less than 1mA (typically less than 100μA) and no negative voltage appears at the respective channel’s output. The device protects both itself and the load against batteries that are plugged in backwards. The LT3029 incurs no damage if either channel’s output is pulled below ground. If the input is left open-circuit, or grounded, the output can be pulled below ground by 3029f 16 LT3029 APPLICATIONS INFORMATION 22V. The output acts like an open circuit, and no current flows from the output. However, current flows in (but is limited by) the external resistor divider that sets the output voltage. into the ADJ pin to less than 5mA when the ADJ pin is at 9V. The 11V difference between the OUT and ADJ pins divided by the 5mA maximum current into the ADJ pin yields a minimum top resistor value of 2.2k. The LT3029 incurs no damage if either ADJ pin is pulled above or below ground by 9V. If the input is left open circuit or grounded, the ADJ pins perform like an open circuit down to –1.5V, and then like a 1.2k resistor down to –9V when pulled below ground. When pulled above ground, the ADJ pins perform like an open circuit up to 0.5V, then like a 5.7k resistor up to 3V, then like a 1.8k resistor up to 9V. In circuits where a backup battery is required, several different input/output conditions can occur. The output voltage may be held up while the input is either pulled to ground, pulled to some intermediate voltage or is left open-circuit. Current flow back into the output follows the curve shown in Figure 5. If either of the LT3029’s IN pins is forced below its corresponding OUT pin, or the OUT pin is pulled above its corresponding IN pin, input current for that channel typically drops to less than 2μA. This occurs if the IN pin is connected to a discharged (low voltage) battery, and either a backup battery or a second regulator circuit holds up the output. The state of that channel’s SHDN pin has no effect on the reverse output current if the output is pulled above the input. In situations where an ADJ pin connects to a resistor divider that would pull the pin above its 9V clamp voltage if the output is pulled high, the ADJ pin input current must be limited to less than 5mA. For example, assume a resistor divider sets the regulated output voltage to 1.5V, and the output is forced to 20V. The top resistor of the resistor divider must be chosen to limit the current REVERSE CURRENT (mA) 5.0 TJ = 25°C 4.5 VIN = 0V = VOUT V 4.0 ADJ 3.5 3.0 2.5 2.0 IADJ 1.5 1.0 0.5 IOUT 0 0 1 2 3 4 5 6 7 8 9 OUTPUT VOLTAGE (V) IADJ FLOWS INTO ADJ PIN TO GND PIN IOUT FLOWS INTO OUT PIN TO IN PIN 3029 F05 Figure 5. Reverse Output Current 3029f 17 LT3029 PACKAGE DESCRIPTION DE Package 16-Lead Plastic DFN (4mm × 3mm) (Reference LTC DWG # 05-08-1732 Rev Ø) 0.70 ±0.05 3.30 ±0.05 3.60 ±0.05 2.20 ±0.05 1.70 ± 0.05 PACKAGE OUTLINE 0.25 ± 0.05 0.45 BSC 3.15 REF RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED R = 0.115 TYP 4.00 ±0.10 (2 SIDES) R = 0.05 TYP 9 0.40 ± 0.10 16 3.30 ±0.10 3.00 ±0.10 (2 SIDES) 1.70 ± 0.10 PIN 1 NOTCH R = 0.20 OR 0.35 × 45° CHAMFER PIN 1 TOP MARK (SEE NOTE 6) (DE16) DFN 0806 REV Ø 8 0.200 REF 1 0.23 ± 0.05 0.45 BSC 0.75 ±0.05 3.15 REF 0.00 – 0.05 BOTTOM VIEW—EXPOSED PAD NOTE: 1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WGED-3) IN JEDEC PACKAGE OUTLINE MO-229 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 3029f 18 LT3029 PACKAGE DESCRIPTION MSE Package 16-Lead Plastic MSOP, Exposed Die Pad (Reference LTC DWG # 05-08-1667 Rev A) BOTTOM VIEW OF EXPOSED PAD OPTION 2.845 p 0.102 (.112 p .004) 5.23 (.206) MIN 2.845 p 0.102 (.112 p .004) 0.889 p 0.127 (.035 p .005) 8 1 1.651 p 0.102 (.065 p .004) 1.651 p 0.102 3.20 – 3.45 (.065 p .004) (.126 – .136) 0.305 p 0.038 (.0120 p .0015) TYP 16 0.50 (.0197) BSC 4.039 p 0.102 (.159 p .004) (NOTE 3) RECOMMENDED SOLDER PAD LAYOUT 0.254 (.010) 0.35 REF 0.12 REF DETAIL “B” CORNER TAIL IS PART OF DETAIL “B” THE LEADFRAME FEATURE. FOR REFERENCE ONLY 9 NO MEASUREMENT PURPOSE 0.280 p 0.076 (.011 p .003) REF 16151413121110 9 DETAIL “A” 0o – 6o TYP 3.00 p 0.102 (.118 p .004) (NOTE 4) 4.90 p 0.152 (.193 p .006) GAUGE PLANE 0.53 p 0.152 (.021 p .006) 1234567 8 DETAIL “A” 1.10 (.043) MAX 0.18 (.007) SEATING PLANE 0.17 – 0.27 (.007 – .011) TYP 0.50 (.0197) BSC NOTE: 1. DIMENSIONS IN MILLIMETER/(INCH) 2. DRAWING NOT TO SCALE 3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS. INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE 5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX 0.86 (.034) REF 0.1016 p 0.0508 (.004 p .002) MSOP (MSE16) 0608 REV A 3029f Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. 19 LT3029 TYPICAL APPLICATION Coincident Tracking Supply Application 3.3V 0.1μF VCC OFF ON ON GATE CGATE 0.1μF 3.3V BYP1 ADJ1 LT3029 1M RAMPBUF FB1 IN2 SDO 3.3μF 54.9k 1% 63.4k 1% OUT2 10nF BYP2 SHDN2 ADJ2 GND TRACK2 FB2 GND 113k 1% VOUT1 1.8V 3.3μF 500mA VOUT1 VOUT2 500mV/DIV 237k 1% SHDN1 2.5V TRACK1 90.9k 1% 10nF 3.3μF RAMP LTC2923 113k 1% OUT1 IN1 54.9k 1% 237k 1% VOUT2 3.3μF 1.5V 500mA 3029 TA02b 10ms/DIV 3029 TA02 RELATED PARTS PART NUMBER DESCRIPTION COMMENTS LT1761 100mA, Low Noise Micropower LDO VIN : 1.8V to 20V, VOUT(MIN) = 1.22V, VDO = 0.3V, IQ = 20μA, ISD < 1μA, Low Noise < 20μVRMS, Stable with 1μF Ceramic Capacitors, ThinSOTTM Package LT1763 500mA, Low Noise Micropower LDO VIN : 1.8V to 20V, VOUT(MIN) = 1.22V, VDO = 0.3V, IQ = 30μA, ISD < 1μA, Low Noise < 20μVRMS, S8 and DFN Packages LT1963/ LT1963A 1.5A, Low Noise, Fast Transient Response LDOs VIN : 2.1V to 20V, VOUT(MIN) = 1.21V, VDO = 0.34V, IQ = 1mA, ISD < 1μA, Low Noise: < 40μVRMS, “A” Version Stable with Ceramic Capacitors; DD, TO220-5, SOT223, S8 and TSSOP Packages LT1964 200mA, Low Noise Micropower, Negative LDO VIN : –1.9V to –20V, VOUT(MIN) = –1.22V, VDO = 0.34V, IQ = 30μA, ISD = 3μA, Low Noise: <30μVRMS, Stable with Ceramic Capacitors, ThinSOT Package LT1965 1.1A, Low Noise LDO VIN : 1.8V to 20V, VOUT(MIN) = 1.20V, VDO = 0.31V, IQ = 0.5mA, ISD < 1μA, Low Noise: <40μVRMS, Stable with Ceramic Capacitors; 3mm × 3mm DFN, MS8E, DD-Pak and TO-220 Packages LT3020 100mA, Low Voltage VLDO VIN : 0.9V to 10V, VOUT(MIN) = 0.20V, VDO = 0.15V, IQ = 120μA, ISD < 3μA; 3mm × 3mm DFN and MS8 Packages LT3021 500mA, Low Voltage VLDO VIN : 0.9V to 10V, VOUT(MIN) = 0.20V, VDO = 0.16V, IQ = 120μA, ISD < 3μA; 5mm × 5mm DFN and SO8 Packages LT3023 Dual 100mA, Low Noise, Micropower LDO VIN : 1.8V to 20V, VOUT(MIN) = 1.22V, VDO = 0.30V, IQ = 40μA, ISD < 1μA; DFN and MS10E Packages LT3024 Dual 100mA/500mA, Low Noise, Micropower LDO VIN : 1.8V to 20V, VOUT(MIN) = 1.22V, VDO = 0.30V, IQ = 60μA, ISD < 1μA; DFN and TSSOP-16E Packages LTC3025 300mA, Low Voltage Micropower VLDO VIN : 0.9V to 5.5V, Low IQ: 54μA, Low Noise < 80μVRMS, 45mV Dropout Voltage; 2mm × 2mm 6-Lead DFN Package LTC3026 1.5A, Low Input Voltage VLDO VIN : 1.14V to 5.5V, Low IQ: 950μA, Low Noise < 110μVRMS, 100mV Dropout Voltage; 10-Lead 3mm × 3mm DFN and MS10E Packages LT3027 Dual 100mA, Low Noise, Micropower LDO with Independent Inputs VIN : 1.8V to 20V, VOUT(MIN) = 1.22V, VDO = 0.30V, IQ = 50μA, ISD < 1μA; DFN and MS10E Packages LT3028 Dual 100mA/500mA, Low Noise, Micropower VIN : 1.8V to 20V, VOUT(MIN) = 1.22V, VDO = 0.32V, IQ = 60μA, ISD < 1μA; LDO with Independent Inputs DFN and TSSOP-16E Packages LT3080/ LT3080-1 1.1A, Parallelable, Low Noise LDO VIN : 1.2V to 36V, VOUT: 0V to 35.7V, Low Noise < 40μVRMS, 300mV Dropout Voltage (2-Supply Operation), Current-Based Reference with 1-Resistor VOUT Set, Directly Parallelable (No Op Amp Required), Stable with Ceramic Capacitors; TO-220, SOT-223, MS8E and 3mm × 3mm DFN Packages ThinSOT is a trademark of Linear Technology Corporation. 3029f 20 Linear Technology Corporation LT 0110 • PRINTED IN USA 1630 McCarthy Blvd., Milpitas, CA 95035-7417 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com © LINEAR TECHNOLOGY CORPORATION 2010