LINER LTC2217CUP

LTC2217
16-Bit, 105Msps
Low Noise ADC
FEATURES
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DESCRIPTION
The LTC®2217 is a 105Msps sampling 16-bit A/D converter
designed for digitizing high frequency, wide dynamic range
signals with input frequencies up to 400MHz. The input
range of the ADC is fixed at 2.75VP-P.
Sample Rate: 105Msps
81.3dBFS Noise Floor
100dB SFDR
SFDR >90dB at 70MHz
85fsRMS Jitter
2.75VP-P Input Range
400MHz Full Power Bandwidth S/H
Optional Internal Dither
Optional Data Output Randomizer
LVDS or CMOS Outputs
Single 3.3V Supply
Power Dissipation: 1.19W
Clock Duty Cycle Stabilizer
Pin Compatible with LTC2208
64-Pin (9mm × 9mm) QFN Package
The LTC2217 is perfect for demanding communications
applications, with AC performance that includes 81.3dBFS
Noise Floor and 100dB spurious free dynamic range
(SFDR). Ultra low jitter of 85fsRMS allows undersampling
of high input frequencies while maintaining excellent noise
performance. Maximum DC specifications include ±3.5LSB
INL, ±1LSB DNL (no missing codes).
The digital output can be either differential LVDS or
single-ended CMOS. There are two format options for the
CMOS outputs: a single bus running at the full data rate or
demultiplexed buses running at half data rate. A separate
output power supply allows the CMOS output swing to
range from 0.5V to 3.6V.
APPLICATIONS
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Telecommunications
Receivers
Cellular Base Stations
Spectrum Analysis
Imaging Systems
ATE
The ENC+ and ENC– inputs may be driven differentially
or single-ended with a sine wave, PECL, LVDS, TTL or
CMOS inputs. An optional clock duty cycle stabilizer allows high performance at full speed with a wide range of
clock duty cycles.
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners. Patents Pending.
TYPICAL APPLICATION
3.3V
SENSE
2.2μF
AIN+
1.575V
COMMON MODE
BIAS VOLTAGE
+
ANALOG
INPUT
AIN–
INTERNAL ADC
REFERENCE
GENERATOR
16-BIT
PIPELINED
ADC CORE
S/H
AMP
–
64k Point FFT,
FIN = 4.9MHz, –1dBFS
0.5V TO 3.6V
1μF
OF
CLKOUT
D15
•
•
•
D0
OUTPUT
DRIVERS
CORRECTION
LOGIC AND
SHIFT REGISTER
AMPLITUDE (dBFS)
VCM
OVDD
CMOS
OR
LVDS
OGND
CLOCK/DUTY
CYCLE
CONTROL
3.3V
VDD
GND
1μF
1μF
1μF
2217 TA01
ENC +
ENC –
SHDN
DITH
MODE
LVDS
ADC CONTROL INPUTS
RAND
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
0
10
20
40
30
FREQUENCY (MHz)
50
2217 TA01b
2217f
1
LTC2217
ABSOLUTE MAXIMUM RATINGS
PIN CONFIGURATION
OVDD = VDD (Notes 1 and 2)
TOP VIEW
64 NC
63 RAND
62 MODE
61 LVDS
60 OF+/OFA
59 OF–/DA15
58 D15+/DA14
57 D15–/DA13
56 D14+/DA12
55 D14–/DA11
54 D13+/DA10
53 D13–/DA9
52 D12+/DA8
51 D12–/DA7
50 OGND
49 OVDD
Supply Voltage (VDD) ................................... –0.3V to 4V
Digital Output Ground Voltage (OGND)........ –0.3V to 1V
Analog Input Voltage (Note 3) ..... –0.3V to (VDD + 0.3V)
Digital Input Voltage .................... –0.3V to (VDD + 0.3V)
Digital Output Voltage ................–0.3V to (OVDD + 0.3V)
Power Dissipation............................................ 2000mW
Operating Temperature Range
LTC2217C ................................................ 0°C to 70°C
LTC2217I .............................................–40°C to 85°C
Storage Temperature Range ..................–65°C to 150°C
Digital Output Supply Voltage (OVDD) .......... –0.3V to 4V
SENSE 1
GND 2
VCM 3
GND 4
VDD 5
VDD 6
GND 7
AIN+ 8
AIN– 9
GND 10
GND 11
ENC+ 12
ENC– 13
GND 14
VDD 15
VDD 16
48 D11+/DA6
47 D11–/DA5
46 D10+/DA4
45 D10–/DA3
44 D9+/DA2
43 D9–/DA1
42 D8+/DA0
41 D8–/CLKOUTA
40 CLKOUT+/CLKOUTB
39 CLKOUT –/OFB
38 D7+/DB15
37 D7–/DB14
36 D6+/DB13
35 D6–/DB12
34 D5+/DB11
33 D5–/DB10
VDD 17
GND 18
SHDN 19
DITH 20
D0–/DB0 21
+/DB1 22
DO
D1–/DB2 23
D1+/DB3 24
D2–/DB4 25
D2+/DB5 26
D3–/DB6 27
D3+/DB7 28
D4–/DB8 29
D4+/DB9 30
OGND 31
OVDD 32
65
TJMAX = 150°C, θJA = 20°C/W
EXPOSED PAD (PIN 65) IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH
TAPE AND REEL
PART MARKING
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTC2217CUP#PBF
LTC2217IUP#PBF
LTC2217CUP#TRPBF
LTC2217IUP#TRPBF
LTC2217UP
LTC2217UP
64-Lead (9mm × 9mm) Plastic QFN
64-Lead (9mm × 9mm) Plastic QFN
0°C to 70°C
–40°C to 85°C
LEAD BASED FINISH
TAPE AND REEL
PART MARKING
PACKAGE DESCRIPTION
TEMPERATURE RANGE
LTC2217CUP
LTC2217IUP
LTC2217CUP#TR
LTC2217IUP#TR
LTC2217UP
LTC2217UP
64-Lead (9mm × 9mm) Plastic QFN
64-Lead (9mm × 9mm) Plastic QFN
0°C to 70°C
–40°C to 85°C
Consult LTC Marketing for parts specified with wider operating temperature ranges.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
CONVERTER CHARACTERISTICS
The ● denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C. (Note 4)
PARAMETER
CONDITIONS
Integral Linearity Error
Differential Analog Input (Note 5) TA = 25°C
Integral Linearity Error
Differential Analog Input (Note 5)
Differential Linearity Error
Offset Error
MIN
TYP
MAX
UNITS
±1.3
±3.5
LSB
●
±1.3
±4
LSB
Differential Analog Input
●
0.18/–0.22
±1
LSB
(Note 6)
●
±1.3
±6
mV
Gain Error
External Reference
●
±0.3
Full-Scale Drift
Internal Reference
External Reference
–65
±12
ppm/°C
ppm/°C
Transition Noise
External Reference
2
LSBRMS
Offset Drift
±4
μV/°C
±1
%FS
2217f
2
LTC2217
ANALOG INPUT
The ● denotes the specifications which apply over the full operating temperature range, otherwise
specifications are at TA = 25°C. (Note 4)
SYMBOL
PARAMETER
CONDITIONS
VIN
Analog Input Range (AIN+ – AIN–)
MIN
TYP
3.135V ≤ VDD ≤ 3.465V
VIN, CM
Analog Input Common Mode
Differential Input (Note 7)
●
1.2
1.575
Analog Input Leakage Current
0V ≤ AIN+, AIN– ≤ VDD
IIN
●
ISENSE
SENSE Input Leakage Current
0V ≤ SENSE ≤ VDD
●
IMODE
MODE Pin Pull-Down Current to GND
ILVDS
LVDS Pin Pull-Down Current to GND
CIN
Analog Input Capacitance
tAP
Sample-and-Hold
Acquisition Delay Time
tJITTER
Sample-and-Hold
Aperture Jitter
CMRR
Analog Input
Common Mode Rejection Ratio
BW-3dB
Full Power Bandwidth
MAX
UNITS
2.75
VP-P
1.8
V
–1
1
μA
–3
3
μA
Sample Mode ENC+ < ENC–
Hold Mode ENC+ > ENC–
10
μA
10
μA
9.1
1.8
pF
pF
0.35
ns
85
fs RMS
1.2V < (AIN+ = AIN–) <1.8V
80
dB
RS < 25Ω
400
MHz
DYNAMIC ACCURACY
The ● denotes the specifications which apply over the full operating temperature range,
otherwise specifications are at TA = 25°C. AIN = –1dBFS with 2.75V range unless otherwise noted. (Note 4)
SYMBOL
PARAMETER
CONDITIONS
SNR
Signal-to-Noise Ratio
5MHz Input
MIN
81.1
80.7
dBFS
dBFS
81.1
dBFS
80.4
80.1
dBFS
dBFS
140MHz Input
78.8
dBFS
5MHz Input
100
dBc
dBc
dBc
70MHz Input, TA = 25°C
70MHz Input
●
80.4
80.1
15MHz Input, TA = 25°C
15MHz Input
●
79.6
79.3
●
88
87
100
99
95
dBc
●
85
83
92
88
dBc
dBc
140MHz Input
85
dBc
5MHz Input
105
dBc
105
dBc
105
dBc
103
dBc
95
dBc
30MHz Input
70MHz Input, TA = 25°C
70MHz Input
SFDR
Spurious Free Dynamic Range
4th Harmonic or Higher
UNITS
dBFS
30MHz Input, TA = 25°C
Spurious Free
Dynamic Range
2nd or 3rd Harmonic
MAX
81.2
15MHz Input, TA = 25°C
15MHz Input
SFDR
TYP
15MHz Input
●
93
30MHz Input
70MHz Input
140MHz Input
●
93
2217f
3
LTC2217
DYNAMIC ACCURACY
The ● denotes the specifications which apply over the full operating temperature range,
otherwise specifications are at TA = 25°C. AIN = –1dBFS with 2.75V range unless otherwise noted. (Note 4)
SYMBOL
PARAMETER
CONDITIONS
S/(N+D)
Signal-to-Noise
Plus Distortion Ratio
5MHz Input
MIN
SFDR
IMD
Spurious Free Dynamic Range
at –25dBFS
Dither “ON”
Intermodulation Distortion
UNITS
81
80.6
dBFS
dBFS
81.1
dBFS
80
79.5
dBFS
dBFS
140MHz Input
78.8
dBFS
5MHz Input
105
dBFS
15MHz Input
105
dBFS
30MHz Input
105
dBFS
70MHz Input
105
dBFS
140MHz Input
100
dBFS
5MHz Input
115
dBFS
115
dBFS
30MHz Input
115
dBFS
70MHz Input
115
dBFS
140MHz Input
110
dBFS
fIN1 = 14MHz, fIN2 = 21MHz, –7dBFS
fIN1 = 67MHz, fIN2 = 74MHz, –7dBFS
100
90
dBc
dBc
15MHz Input, TA = 25°C
15MHz Input
70MHz Input, TA = 25°C
70MHz Input
Spurious Free Dynamic Range
at –25dBFS
Dither “OFF”
MAX
dBFS
●
79.9
79.7
30MHz Input
SFDR
TYP
81.2
15MHz Input
●
●
78.7
78.2
100
COMMON MODE BIAS CHARACTERISTICS
The ● denotes the specifications which apply over the
full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4)
PARAMETER
CONDITIONS
MIN
TYP
MAX
VCM Output Voltage
IOUT = 0
1.475
1.575
1.675
UNITS
V
VCM Output Tempco
IOUT = 0
±60
ppm/°C
VCM Line Regulation
3.135V ≤ VDD ≤ 3.465V
2.4
mV/ V
VCM Output Resistance
| IOUT | ≤ 0.8mA
1.1
Ω
2217f
4
LTC2217
DIGITAL INPUTS AND DIGITAL OUTPUTS
The ● denotes the specifications which apply over the
full operating temperature range, otherwise specifications are at TA = 25°C. (Note 4)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Encode Inputs (ENC+, ENC–)
VID
Differential Input Voltage
(Note 7)
VICM
Common Mode Input Voltage
Internally Set
Externally Set (Note 7)
●
0.2
V
1.6
1.2
3
V
V
RIN
Input Resistance
(See Figure 2)
6
kΩ
CIN
Input Capacitance
(Note 7)
3
pF
VIH
High Level Input Voltage
VDD = 3.3V
●
VIL
Low Level Input Voltage
VDD = 3.3V
●
0.8
V
IIN
Digital Input Current
VIN = 0V to VDD
●
±10
μA
CIN
Digital Input Capacitance
(Note 7)
Logic Inputs
2
V
1.5
pF
3.299
3.29
V
V
LOGIC OUTPUTS (CMOS MODE)
OVDD = 3.3V
VOH
VOL
High Level Output Voltage
Low Level Output Voltage
VDD = 3.3V
VDD = 3.3V
IO = –10μA
IO = –200μA
●
IO = 160μA
IO = 1.6mA
●
3.1
0.01
0.10
0.4
V
V
ISOURCE
Output Source Current
VOUT = 0V
–50
mA
ISINK
Output Sink Current
VOUT = 3.3V
50
mA
VOH
High Level Output Voltage
VDD = 3.3V
IO = –200μA
2.49
V
VOL
Low Level Output Voltage
VDD = 3.3V
IO = 1.60mA
0.1
V
VOH
High Level Output Voltage
VDD = 3.3V
IO = –200μA
1.79
V
VOL
Low Level Output Voltage
VDD = 3.3V
IO = 1.60mA
0.1
V
OVDD = 2.5V
OVDD = 1.8V
LOGIC OUTPUTS (LVDS MODE)
STANDARD LVDS
VOD
Differential Output Voltage
100Ω Differential Load
●
247
350
454
mV
VOS
Output Common Mode Voltage
100Ω Differential Load
●
1.125
1.2
1.375
V
VOD
Differential Output Voltage
100Ω Differential Load
●
125
175
250
mV
VOS
Output Common Mode Voltage
100Ω Differential Load
●
1.125
1.2
1.375
V
Low Power LVDS
2217f
5
LTC2217
POWER REQUIREMENTS
The ● denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. AIN = –1dBFS unless otherwise noted. (Note 4)
SYMBOL
PARAMETER
CONDITIONS
VDD
Analog Supply Voltage
(Note 8)
PSHDN
Shutdown Power
SHDN = VDD
●
MIN
TYP
MAX
3.135
3.3
3.465
17
UNITS
V
mW
Standard LVDS Output Mode
(Note 8)
●
OVDD
Output Supply Voltage
3
3.3
3.6
V
IVDD
Analog Supply Current
●
IOVDD
Output Supply Current
●
365
430
mA
75
90
mA
PDIS
Power Dissipation
●
1450
1716
mW
3.3
3.6
V
363
430
mA
Low Power LVDS Output Mode
(Note 8)
●
OVDD
Output Supply Voltage
3
IVDD
Analog Supply Current
●
IOVDD
Output Supply Current
●
42
50
mA
PDIS
Power Dissipation
●
1335
1584
mW
CMOS Output Mode
Output Supply Voltage
IVDD
Analog Supply Current
●
Power Dissipation
●
PDIS
(Note 8)
●
OVDD
0.5
3.6
V
360
430
mA
1190
1420
mW
TIMING CHARACTERISTICS
The ● denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C. (Note 4)
SYMBOL
PARAMETER
CONDITIONS
MIN
fS
Sampling Frequency
(Note 8)
●
1
tL
ENC Low Time
Duty Cycle Stabilizer Off (Note 7)
Duty Cycle Stabilizer On (Note 7)
●
●
4.52
3.1
tH
ENC High Time
Duty Cycle Stabilizer Off (Note 7)
Duty Cycle Stabilizer On (Note 7)
●
●
TYP
MAX
UNITS
105
MHz
4.762
4.762
500
500
ns
ns
4.52
3.1
4.762
4.762
500
500
ns
ns
LVDS Output Mode (Standard and Low Power)
tD
ENC to DATA Delay
(Note 7)
●
1.3
2.5
3.8
ns
tC
ENC to CLKOUT Delay
(Note 7)
●
1.3
2.5
3.8
ns
tSKEW
DATA to CLKOUT Skew
(tC-tD) (Note 7)
●
–0.6
0
0.6
ns
tRISE
Output Rise Time
0.5
ns
tFALL
Output Fall Time
0.5
ns
Data Latency
Data Latency
7
Cycles
CMOS Output Mode
tD
ENC to DATA Delay
(Note 7)
●
1.3
2.7
1.3
2.7
4
ns
–0.6
0
0.6
ns
tC
ENC to CLKOUT Delay
(Note 7)
●
tSKEW
DATA to CLKOUT Skew
(tC-tD) (Note 7)
●
Data Latency
Data Latency
Full Rate CMOS
Demuxed
7
7
4
ns
Cycles
Cycles
2217f
6
LTC2217
ELECTRICAL CHARACTERISTICS
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: All voltage values are with respect to GND, with GND and OGND
shorted (unless otherwise noted).
Note 3: When these pin voltages are taken below GND or above VDD, they
will be clamped by internal diodes. This product can handle input currents
of greater than 100mA below GND or above VDD without latchup.
Note 4: VDD = 3.3V, fSAMPLE = 105MHz, LVDS outputs, differential ENC+/
ENC– = 2VP-P sine wave with 1.6V common mode, input range = 2.75VP-P
with differential drive, unless otherwise specified.
Note 5: Integral nonlinearity is defined as the deviation of a code from a “best
fit straight line” to the transfer curve. The deviation is measured from the
center of the quantization band.
Note 6: Offset error is the offset voltage measured from –1/2LSB when the
output code flickers between 0000 0000 0000 0000 and 1111 1111 1111
1111 in 2’s complement output mode.
Note 7: Guaranteed by design, not subject to test.
Note 8: Recommended operating conditions.
TIMING DIAGRAM
LVDS Output Mode Timing
All Outputs are Differential and Have LVDS Levels
tAP
ANALOG
INPUT
N+1
N+4
N
N+3
N+2
tH
tL
ENC–
ENC+
tD
N–7
D0-D15, OF
CLKOUT+
CLKOUT –
N–6
N–5
N–4
N–3
tC
2217 TD01
2217f
7
LTC2217
TIMING DIAGRAMS
Full-Rate CMOS Output Mode Timing
All Outputs are Single-Ended and Have CMOS Levels
tAP
ANALOG
INPUT
N+1
N+4
N
N+3
N+2
tH
tL
ENC–
ENC+
tD
N–7
DA0-DA15, OFA
N–6
N–5
N–4
N–3
tC
CLKOUTA
CLKOUTB
HIGH IMPEDANCE
DB0-DB15, OFB
2217 TD02
Demultiplexed CMOS Output Mode Timing
All Outputs are Single-Ended and Have CMOS Levels
tAP
ANALOG
INPUT
N+1
N
N+4
N+2
N+3
tH
tL
ENC–
ENC+
tD
DA0-DA15, OFA
N–8
N–6
N–4
N–7
N–5
N–3
tD
DB0-DB15, OFB
tC
CLKOUTA
CLKOUTB
2217 TD03
2217f
8
LTC2217
TYPICAL PERFORMANCE CHARACTERISTICS
Integral Nonlinearity (INL) vs
Output Code - Dither “Off“
Integral Nonlinearity (INL) vs
Output Code - Dither “On“
Differential Nonlinearity (DNL) vs
Output Code
2.0
2.0
1.0
1.5
1.5
0.8
1.0
1.0
0.5
0.0
–0.5
0.5
0.0
–0.5
–1.0
–1.0
–1.5
–1.5
–2.0
DNL ERROR (LSB)
INL ERROR (LSB)
INL ERROR (LSB)
0.6
16384
32768
49152
OUTPUT CODE
65536
16384
32768
49152
OUTPUT CODE
8000
6000
4000
2000
0
10
20
30
40
FREQUENCY (MHz)
2217 G04
10
20
30
40
FREQUENCY (MHz)
64k Point 2-Tone FFT,
fIN = 14.25MHz and 21.5MHz,
–7dBFS
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
0
10
20
30
40
FREQUENCY (MHz)
50
2217 G06
AMPLITUDE (dBFS)
AMPLITUDE (dBFS)
AMPLITUDE (dBFS)
0
50
64k Point FFT, fIN = 15.1MHz,
–20dBFS, Dither “On”
50
65536
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
2217 G05
64k Point FFT, fIN = 15.1MHz,
–20dBFS, Dither “Off”
2217 G07
32768
49152
OUTPUT CODE
64k Point FFT, fIN = 15.1MHz,
–1dBFS
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
32754
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
16384
2217 G03
AMPLITUDE (dBFS)
AMPLITUDE (dBFS)
COUNT
10000
20
30
40
FREQUENCY (MHz)
0
65536
64k Point FFT, fIN = 4.9MHz,
–1dBFS
12000
10
–0.4
2217 G02
14000
0
–0.2
–1.0
0
AC Grounded Input Histogram
32745
OUTPUT CODE
0.0
–0.8
2217 G01
0
32736
0.2
–0.6
–2.0
0
0.4
50
2217 G08
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
0
10
20
30
40
FREQUENCY (MHz)
50
2217 G09
2217f
9
LTC2217
TYPICAL PERFORMANCE CHARACTERISTICS
SFDR vs Input Level,
fIN = 15.2MHz, Dither “Off”
0
10
20
30
40
FREQUENCY (MHz)
140
140
130
130
120
120
110
110
100
90
80
70
60
40
10
20
30
40
FREQUENCY (MHz)
64k Point FFT, fIN = 30.1MHz,
–20dBFS, Dither “On”
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
0
50
2217 G16
20
30
40
FREQUENCY (MHz)
64k Point FFT, fIN = 70.1MHz,
–20dBFS, Dither “Off”
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
0
10
20
30
40
FREQUENCY (MHz)
50
2217 G15
AM PLITUDE (dBFS)
AM PLITUDE (dBFS)
50
10
2217 G14
64k Point FFT, fIN = 70.1MHz,
–10dBFS, Dither “Off”
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
0
2217 G12
AMPLITUDE (dBFS)
SNR (dBFS)
AMPLITUDE (dBFS)
0
0
64k Point FFT, fIN = 70.2MHz,
–1dBFS
AMPLITUDE (dBFS)
30
–80 –70 –60 –50 –40 –30 –20 –10
INPUT LEVEL (dBFS)
0
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
2217 G13
20
30
40
FREQUENCY (MHz)
60
64k Point FFT, fIN = 28.7MHz,
–1dBFS
81
10
70
2217 G11
82
0
80
50
SNR vs Input Level, fIN = 15.2MHz
79
90
40
2217 G10
80
100
50
30
–80 –70 –60 –50 –40 –30 –20 –10
INPUT LEVEL (dBFS)
50
78
–80 –70 –60 –50 –40 –30 –20 –10
INPUT LEVEL (dBFS)
SFDR vs Input Level,
fIN = 15.2MHz, Dither “On”
SFDR (dBc AND dBFS)
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
SFDR (dBc AND dBFS)
AMPLITUDE (dBFS)
64k Point 2-Tone FFT,
fIN = 14.25MHz and 21.5MHz,
–25dBFS, Dither “On”
50
2217 G17
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
0
10
20
30
40
FREQUENCY (MHz)
50
2217 G18
2217f
10
LTC2217
TYPICAL PERFORMANCE CHARACTERISTICS
SFDR vs Input Level,
fIN = 70.5MHz, Dither “Off”
0
10
20
30
40
FREQUENCY (MHz)
140
140
130
130
120
120
110
110
100
90
80
70
60
40
0
0
10
2217 G21
20
30
40
FREQUENCY (MHz)
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
0
50
2217 G25
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
0
10
20
30
40
FREQUENCY (MHz)
50
64k Point FFT, fIN = 140.1MHz,
–20dBFS, Dither “On”
AMPLITUDE (dBFS)
AMPLITUDE (dBFS)
50
20
30
40
FREQUENCY (MHz)
2217 G24
64k Point FFT, fIN = 140.5MHz,
–1dBFS
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
10
2217 G23
64k Point 2-Tone FFT,
fIN = 67.2MHz and 74.4MHz,
–25dBFS, Dither “On”
0
64k Point 2-Tone FFT,
fIN = 67.2MHz and 74.4MHz,
–15dBFS, Dither “On”
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
2217 G22
AMPLITUDE (dBFS)
30
–80 –70 –60 –50 –40 –30 –20 –10
INPUT LEVEL (dBFS)
0
AMPLITUDE (dBFS)
AMPLITUD E (dBFS)
SNR (dBFS)
78
20
30
40
FREQUENCY (MHz)
60
64k Point 2-Tone FFT,
fIN = 67.2MHz and 74.4MHz,
–7dBFS
81
10
70
50
SNR vs Input Level, FIN = 70.5MHz
0
80
2217 G20
82
79
90
40
2217 G19
80
100
50
30
–80 –70 –60 –50 –40 –30 –20 –10
INPUT LEVEL (dBFS)
50
–80 –70 –60 –50 –40 –30 –20 –10
INPUT LEVEL (dBFS)
SFDR vs Input Level,
fIN = 70.5MHz, Dither “On”
SFDR (dBc AND dBFS)
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
SFDR (dBc AND dBFS)
AMPLITUDE (dBFS)
64k Point FFT, fIN = 70.1MHz,
–20dBFS, Dither “On”
50
2217 G26
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
0
10
20
30
40
FREQUENCY (MHz)
50
2217 G27
2217f
11
LTC2217
TYPICAL PERFORMANCE CHARACTERISTICS
SFDR vs Input Level,
fIN = 140.5MHz, Dither “On”
140
140
130
130
120
120
110
110
100
90
80
70
60
82
81
100
90
80
70
60
50
50
40
40
30
–80 –70 –60 –50 –40 –30 –20 –10
INPUT LEVEL (dBFS)
SNR vs Input Level,
fIN = 140.5MHz
SNR (dBFS)
SFDR (dBc AND dBFS)
SFDR (dBc AND dBFS)
SFDR vs Input Level,
fIN = 140.5MHz, Dither “Off”
79
30
–80 –70 –60 –50 –40 –30 –20 –10
INPUT LEVEL (dBFS)
0
80
78
–80 –70 –60 –50 –40 –30 –20 –10
INPUT LEVEL (dBFS)
0
2217 G29
2217 G28
SFDR (HD2 and HD3) vs
Input Frequency
SNR and SFDR vs Sample Rate,
fIN = 5.2MHz
SNR vs Input Frequency
82
110
0
2217 G30
110
LIMIT
105
81
SNR (dBFS) AND SFDR (dBc)
100
80
95
SNR (dBFS)
SFDR, HD2, HD3 (dBc)
105
HD2
90
HD3
SFDR
85
79
78
80
77
75
0
50
100
150
200
INPUT FREQUENCY (MHz)
0
250
100
95
90
85
SNR
80
75
70
76
70
SFDR
50
100
150
200
INPUT FREQUENCY (MHz)
0
250
40
80
120
SAMPLE RATE (MSPS)
2217 G33
2217 G32
2217 G31
SNR and SFDR vs Supply
Voltage (VDD), fIN = 5.1MHz
SNR and SFDR vs Clock Duty
Cycle, fIN = 5.2MHz
IVDD vs Sample Rate and Supply
Voltage, fIN = 5MHz, –1dBFS
110
160
110
450
LOWER LIMIT
425
SFDR
VDD = 3.3V
400
95
UPPER LIMIT
90
85
375
VDD = 3.465V
VDD = 3.135V
350
SNR
80
325
75
70
2.8
300
3.0
3.2
3.4
SUPPLY VOLTAGE (V)
3.6
2217 G34
SNR (dBFS) AND SFDR (dBc)
100
100
IVDD (mA)
SNR (dBFS) AND SFDR (dBc)
105
90
80
SFDR DCS OFF
SNR DCS OFF
SFDR DCS ON
SNR DCS ON
70
60
0
50
100
150
SAMPLE RATE (Msps)
200
2217 G35
30
40
50
60
DUTY CYCLE (%)
70
2217 G36
2217f
12
LTC2217
TYPICAL PERFORMANCE CHARACTERISTICS
Input Offset Voltage vs
Temperature, Internal Reference,
5 Units
1.005
5
1.004
4
1.003
3
OFFSET VOLTAGE (mV)
NORMALIZED FULL SCALE
Normalized Full Scale vs
Temperature, Internal Reference,
5 Units
1.002
1.001
1
0.999
0.998
2
1
0
–1
–2
0.997
–3
0.996
–4
0.995
–40
–20
0
20
40
TEMPERATURE (°C)
60
–5
–40
80
–20
0
20
40
TEMPERATURE (°C)
60
80
2217 G38
2217 G37
Input Offset Voltage vs
Temperature, External Reference,
5 Units
1.005
5
1.004
4
1.003
3
OFFSET VOLTAGE (mV)
NORMALIZED FULL SCALE
Normalized Full Scale vs
Temperature, External Reference,
5 Units
1.002
1.001
1
0.999
0.998
2
1
0
–1
–2
0.997
–3
0.996
–4
0.995
–40
–20
0
20
40
TEMPERATURE (°C)
60
80
–5
–40
–20
0
20
40
TEMPERATURE (°C)
2217 G39
0.5
105
0.4
100
0.3
FULL-SCALE ERROR (%)
5MHz
95
SFDR (dBc)
Mid-Scale Settling After Wake
Up from Shutdown or Starting
Encode Clock
110
90
85
80
70MHz
75
Full-Scale Settling After Wake
Up from Shutdown or Starting
Encode Clock
0.5
0.4
WAKE-UP
0.1
0.0
CLOCK START
–0.2
0.2
0.1
0.0
–0.2
–0.3
–0.3
65
–0.4
–0.4
60
0.5
–0.5
1
1.25
1.5
1.75
2
ANALOG INPUT COMMON MODE VOLTAGE (V)
2217 G41
–0.5
0
300
600
900
1200
1500
TIME AFTER WAKE-UP OR CLOCK START (μs)
2217 G42
CLOCK START
–0.1
70
0.75
WAKE-UP
0.3
0.2
–0.1
80
2217 G40
FULL-SCALE ERROR (%)
SFDR vs Analog Input Common
Mode Voltage, 5MHz and 70MHz,
–1dBFS
60
0
400
800
1200
1600
2000
TIME AFTER WAKE-UP OR CLOCK START (μs)
2217 G43
2217f
13
LTC2217
PIN FUNCTIONS
For CMOS Mode. Full Rate or Demultiplexed
SENSE (Pin 1): Reference Mode Select and External
Reference Input. Tie SENSE to VDD to select the internal
2.5V bandgap reference. An external reference of 2.5V or
1.25V may be used; both reference values will set a full
scale ADC range of 2.75V.
GND (Pins 2, 4, 7, 10, 11, 14, 18): ADC Power Ground.
VCM (Pin 3): 1.575V Output. Optimum voltage for input common mode. Must be bypassed to ground with a minimum
of 2.2μF. Ceramic chip capacitors are recommended.
VDD (Pins 5, 6, 15, 16, 17): 3.3V Analog Supply Pin.
Bypass to GND with 1μF ceramic chip capacitors.
AIN+ (Pin 8): Positive Differential Analog Input.
AIN– (Pin 9): Negative Differential Analog Input.
ENC+
(Pin 12): Positive Differential Encode Input. The
sampled analog input is held on the rising edge of ENC+.
Internally biased to 1.6V through a 6.2kΩ resistor. Output
data can be latched on the rising edge of ENC+.
ENC– (Pin 13): Negative Differential Encode Input. The
sampled analog input is held on the falling edge of ENC –.
Internally biased to 1.6V through a 6.2kΩ resistor. Bypass to ground with a 0.1μF capacitor for a single-ended
Encode signal.
SHDN (Pin 19): Power Shutdown Pin. SHDN = low results
in normal operation. SHDN = high results in powered
down analog circuitry and the digital outputs are placed
in a high impedance state.
DITH (Pin 20): Internal Dither Enable Pin. DITH = low
disables internal dither. DITH = high enables internal
dither. Refer to Internal Dither section of this data sheet
for details on dither operation.
DB0-DB15 (Pins 21-30 and 33-38): Digital Outputs, B Bus.
DB15 is the MSB. Active in demultiplexed mode. The B bus
is in high impedance state in full rate CMOS mode.
OGND (Pins 31 and 50): Output Driver Ground.
OVDD (Pins 32 and 49): Positive Supply for the Output
Drivers. Bypass to ground with 1μF capacitor.
OFB (Pin 39): Over/Under Flow Digital Output for the B Bus.
OFB is high when an over or under flow has occurred on the
B bus. At high impedance state in full rate CMOS mode.
CLKOUTB (Pin 40): Data Valid Output. CLKOUTB will toggle
at the sample rate in full rate CMOS mode or at 1/2 the
sample rate in demultiplexed mode. Latch the data on the
falling edge of CLKOUTB.
CLKOUTA (Pin 41): Inverted Data Valid Output. CLKOUTA
will toggle at the sample rate in full rate CMOS mode or
at 1/2 the sample rate in demultiplexed mode. Latch the
data on the rising edge of CLKOUTA.
DA0-DA15 (Pins 42-48 and 51-59): Digital Outputs, A Bus.
DA15 is the MSB. Output bus for full rate CMOS mode
and demultiplexed mode.
OFA (Pin 60): Over/Under Flow Digital Output for the A
Bus. OFA is high when an over or under flow has occurred
on the A bus.
LVDS (Pin 61): Data Output Mode Select Pin. Connecting
LVDS to 0V selects full rate CMOS mode. Connecting LVDS
to 1/3VDD selects demultiplexed CMOS mode. Connecting
LVDS to 2/3VDD selects Low Power LVDS mode. Connecting LVDS to VDD selects Standard LVDS mode.
MODE (Pin 62): Output Format and Clock Duty Cycle
Stabilizer Selection Pin. Connecting MODE to 0V selects
offset binary output format and disables the clock duty
cycle stabilizer. Connecting MODE to 1/3VDD selects offset
binary output format and enables the clock duty cycle stabilizer. Connecting MODE to 2/3VDD selects 2’s complement
output format and enables the clock duty cycle stabilizer.
Connecting MODE to VDD selects 2’s complement output
format and disables the clock duty cycle stabilizer.
RAND (Pin 63): Digital Output Randomization Selection
Pin. RAND low results in normal operation. RAND high
selects D1-D15 to be EXCLUSIVE-ORed with D0 (the
LSB). The output can be decoded by again applying an
XOR operation between the LSB and all other bits. This
mode of operation reduces the effects of digital output
interference.
NC (Pin 64): Not Connected Internally. For pin compatibility
with the LTC2208 this pin should be connected to GND or
VDD as required. Otherwise no connection.
GND (Exposed Pad): ADC Power Ground. The exposed
pad on the bottom of the package must be soldered to
ground.
2217f
14
LTC2217
PIN FUNCTIONS
For LVDS Mode. STANDARD or LOW POWER
OGND (Pins 31 and 50): Output Driver Ground.
SENSE (Pin 1): Reference Mode Select and External
Reference Input. Tie SENSE to VDD to select the internal
2.5V bandgap reference. An external reference of 2.5V or
1.25V may be used; both reference values will set a full
scale ADC range of 2.75V.
OVDD (Pins 32 and 49): Positive Supply for the Output
Drivers. Bypass to ground with 0.1μF capacitor.
GND (Pins 2, 4, 7, 10, 11, 14, 18): ADC Power Ground.
VCM (Pin 3): 1.575V Output. Optimum voltage for input
common mode. Must be bypassed to ground with a
minimum of 2.2μF. Ceramic chip capacitors are recommended.
VDD (Pins 5, 6, 15, 16, 17): 3.3V Analog Supply Pin.
Bypass to GND with 1μF ceramic chip capacitors.
AIN + (Pin 8): Positive Differential Analog Input.
AIN – (Pin 9): Negative Differential Analog Input.
ENC + (Pin 12): Positive Differential Encode Input. The
sampled analog input is held on the rising edge of ENC+.
Internally biased to 1.6V through a 6.2kΩ resistor. Output
data can be latched on the rising edge of ENC+.
ENC – (Pin 13): Negative Differential Encode Input. The
sampled analog input is held on the falling edge of ENC –.
Internally biased to 1.6V through a 6.2kΩ resistor. Bypass to ground with a 0.1μF capacitor for a single-ended
Encode signal.
SHDN (Pin 19): Power Shutdown Pin. SHDN = low results
in normal operation. SHDN = high results in powered
down analog circuitry and the digital outputs are set in
high impedance state.
DITH (Pin 20): Internal Dither Enable Pin. DITH = low
disables internal dither. DITH = high enables internal dither.
Refer to Internal Dither section of the data sheet for details
on dither operation.
D0–/D0+ to D15–/D15+ (Pins 21-30, 33-38, 41-48 and
51-58): LVDS Digital Outputs. All LVDS outputs require
differential 100Ω termination resistors at the LVDS receiver.
D15+/D15– is the MSB.
CLKOUT–/CLKOUT + (Pins 39 and 40): LVDS Data Valid
0utput. Latch data on the rising edge of CLKOUT +, falling
edge of CLKOUT –.
OF–/OF+ (Pins 59 and 60): Over/Under Flow Digital Output
OF is high when an over or under flow has occurred.
LVDS (Pin 61): Data Output Mode Select Pin. Connecting
LVDS to 0V selects full rate CMOS mode. Connecting LVDS
to 1/3VDD selects demultiplexed CMOS mode. Connecting
LVDS to 2/3VDD selects Low Power LVDS mode. Connecting LVDS to VDD selects Standard LVDS mode.
MODE (Pin 62): Output Format and Clock Duty Cycle
Stabilizer Selection Pin. Connecting MODE to 0V selects
offset binary output format and disables the clock duty
cycle stabilizer. Connecting MODE to 1/3VDD selects offset
binary output format and enables the clock duty cycle stabilizer. Connecting MODE to 2/3VDD selects 2’s complement
output format and enables the clock duty cycle stabilizer.
Connecting MODE to VDD selects 2’s complement output
format and disables the clock duty cycle stabilizer.
RAND (Pin 63): Digital Output Randomization Selection Pin.
RAND low results in normal operation. RAND high selects
D1-D15 to be EXCLUSIVE-ORed with D0 (the LSB). The
output can be decoded by again applying an XOR operation
between the LSB and all other bits. The mode of operation
reduces the effects of digital output interference.
NC (Pin 64): Not Connected Internally. For pin compatibility with the LTC2208 this pin should be connected to
GND or VDD as required. Otherwise no connection.
GND (Exposed Pad Pin 65): ADC Power Ground. The
exposed pad on the bottom of the package must be soldered to ground.
2217f
15
LTC2217
BLOCK DIAGRAM
AIN+
AIN–
VDD
INPUT
S/H
FIRST PIPELINED
ADC STAGE
SECOND PIPELINED
ADC STAGE
THIRD PIPELINED
ADC STAGE
FOURTH PIPELINED
ADC STAGE
FIFTH PIPELINED
ADC STAGE
GND
DITHER
SIGNAL
GENERATOR
CORRECTION LOGIC
AND
SHIFT REGISTER
ADC CLOCKS
RANGE
SELECT
OVDD
SENSE
PGA
VCM
BUFFER
ADC
REFERENCE
DIFFERENTIAL
INPUT
LOW JITTER
CLOCK
DRIVER
CONTROL
LOGIC
OUTPUT
DRIVERS
•
•
•
VOLTAGE
REFERENCE
OGND
ENC+
ENC–
SHDN RAND M0DE LVDS
CLKOUT+
CLKOUT–
OF+
OF–
D15+
D15–
D0+
D0–
2217 F01
DITH
Figure 1. Functional Block Diagram
2217f
16
LTC2217
OPERATION
DYNAMIC PERFORMANCE
by the presence of another sinusoidal input at a different
frequency.
Signal-to-Noise Plus Distortion Ratio
The signal-to-noise plus distortion ratio [S/(N+D)] is the
ratio between the RMS amplitude of the fundamental input
frequency and the RMS amplitude of all other frequency
components at the ADC output. The output is band limited to frequencies above DC to below half the sampling
frequency (Nyquist Frequency).
Signal-to-Noise Ratio
The signal-to-noise (SNR) is the ratio between the RMS
amplitude of the fundamental input frequency and the RMS
amplitude of all other frequency components, except the
first five harmonics.
Total Harmonic Distortion
Total harmonic distortion is the ratio of the RMS sum of
all harmonics of the input signal to the fundamental itself.
The out-of-band harmonics alias into the frequency band
between DC and half the sampling frequency (Nyquist
Frequency). THD is expressed as:
⎛
⎜
THD = –20Log ⎜
⎜⎝
(V
2
2
2
2
+ V3 + V4 +… VN
V1
2
)
⎞
⎟
⎟
⎟⎠
where V1 is the RMS amplitude of the fundamental frequency and V2 through VN are the amplitudes of the second
through nth harmonics.
Intermodulation Distortion
If the ADC input signal consists of more than one spectral
component, the ADC transfer function nonlinearity can
produce intermodulation distortion (IMD) in addition to
THD. IMD is the change in one sinusoidal input caused
If two pure sine waves of frequencies fa and fb are applied
to the ADC input, nonlinearities in the ADC transfer function
can create distortion products at the sum and difference
frequencies of mfa ± nfb, where m and n = 0, 1, 2, 3, etc.
For example, the 3rd order IMD terms include (2fa + fb),
(fa + 2fb), (2fa - fb) and (fa - 2fb). The 3rd order IMD is
defined as the ratio of the RMS value of either input tone
to the RMS value of the largest 3rd order IMD product.
Spurious Free Dynamic Range (SFDR)
The ratio of the RMS input signal amplitude to the RMS
value of the peak spurious spectral component expressed
in dBc. SFDR may also be calculated relative to full scale
and expressed in dBFS.
Full Power Bandwidth
The Full Power bandwidth is that input frequency at which
the amplitude of the reconstructed fundamental is reduced
by 3dB from a full scale input signal.
Aperture Delay Time
The time from when a rising ENC + equals the ENC– voltage
to the instant that the input signal is held by the sampleand-hold circuit.
Aperture Delay Jitter
The variation in the aperture delay time from conversion
to conversion. This random variation will result in noise
when sampling an AC input. The signal-to-noise ratio term
due to the jitter alone will be:
SNRJITTER = –20log (2π • fIN • tJITTER)
This formula states SNR due to jitter alone at any amplitude
in terms of dBc.
2217f
17
LTC2217
APPLICATIONS INFORMATION
CONVERTER OPERATION
The LTC2217 is a CMOS pipelined multistep converter with
a low noise front-end. As shown in Figure 1, the converter
has five pipelined ADC stages; a sampled analog input
will result in a digitized value seven cycles later (see the
Timing Diagram section). The analog input is differential for
improved common mode noise immunity and to maximize
the input range. Additionally, the differential input drive
will reduce even order harmonics of the sample and hold
circuit. The encode input is also differential for improved
common mode noise immunity.
The LTC2217 has two phases of operation, determined
by the state of the differential ENC+/ENC – input pins. For
brevity, the text will refer to ENC+ greater than ENC – as
ENC high and ENC+ less than ENC – as ENC low.
Each pipelined stage shown in Figure 1 contains an ADC,
a reconstruction DAC and an interstage amplifier. In
operation, the ADC quantizes the input to the stage and
the quantized value is subtracted from the input by the
DAC to produce a residue. The residue is amplified and
output by the residue amplifier. Successive stages operate out of phase so that when odd stages are outputting
their residue, the even stages are acquiring that residue
and vice versa.
When ENC is low, the analog input is sampled differentially directly onto the input sample-and-hold capacitors,
inside the “input S/H” shown in the block diagram. At the
instant that ENC transitions from low to high, the voltage
on the sample capacitors is held. While ENC is high, the
held input voltage is buffered by the S/H amplifier which
drives the first pipelined ADC stage. The first stage acquires
the output of the S/H amplifier during the high phase of
ENC. When ENC goes back low, the first stage produces
its residue which is acquired by the second stage. At
the same time, the input S/H goes back to acquiring the
analog input. When ENC goes high, the second stage
produces its residue which is acquired by the third stage.
An identical process is repeated for the third and fourth
stages, resulting in a fourth stage residue that is sent to
the fifth stage for final evaluation.
Each ADC stage following the first has additional range to
accommodate flash and amplifier offset errors. Results
from all of the ADC stages are digitally delayed such that
the results can be properly combined in the correction
logic before being sent to the output buffer.
18
SAMPLE/HOLD OPERATION AND INPUT DRIVE
Sample/Hold Operation
Figure 2 shows an equivalent circuit for the LTC2217 CMOS
differential sample and hold. The differential analog inputs
are sampled directly onto sampling capacitors (CSAMPLE)
through NMOS transitors. The capacitors shown attached
to each input (CPARASITIC) are the summation of all other
capacitance associated with each input.
During the sample phase when ENC is low, the NMOS
transistors connect the analog inputs to the sampling
capacitors and they charge to, and track the differential
input voltage. When ENC transitions from low to high, the
sampled input voltage is held on the sampling capacitors.
During the hold phase when ENC is high, the sampling
capacitors are disconnected from the input and the held
voltage is passed to the ADC core for processing. As ENC
transitions for high to low, the inputs are reconnected to
the sampling capacitors to acquire a new sample. Since
the sampling capacitors still hold the previous sample,
a charging glitch proportional to the change in voltage
between samples will be seen at this time. If the change
between the last sample and the new sample is small,
the charging glitch seen at the input will be small. If the
LTC2217
VDD
RPARASITIC
3Ω
AIN+
RON
20Ω
CSAMPLE
7.3pF
CPARASITIC
1.8pF
VDD
RPARASITIC
3Ω
AIN–
RON
20Ω
CSAMPLE
7.3pF
CPARASITIC
1.8pF
VDD
1.6V
6k
ENC+
ENC–
6k
1.6V
2217 F02
Figure 2. Equivalent Input Circuit
2217f
LTC2217
APPLICATIONS INFORMATION
input change is large, such as the change seen with input
frequencies near Nyquist, then a larger charging glitch
will be seen.
has a very broadband S/H circuit, DC to 400MHz; it can
be used in a wide range of applications; therefore, it is not
possible to provide a single recommended RC filter.
Common Mode Bias
Figures 3 and 4 show two examples of input RC filtering for
two ranges of input frequencies. In general it is desirable
to make the capacitors as large as can be tolerated—this
will help suppress random noise as well as noise coupled
from the digital circuitry. The LTC2217 does not require any
input filter to achieve data sheet specifications; however,
no filtering will put more stringent noise requirements on
the input drive circuitry.
The ADC sample-and-hold circuit requires differential drive
to achieve specified performance. Each input should swing
±0.6875V for the 2.75V range, around a common mode
voltage of 1.575V. The VCM output pin (Pin 3) is designed
to provide the common mode bias level. VCM can be tied
directly to the center tap of a transformer to set the DC
input level or as a reference level to an op amp differential
driver circuit. The VCM pin must be bypassed to ground
close to the ADC with 2.2μF or greater.
Input Drive Impedance
As with all high performance, high speed ADCs the dynamic
performance of the LTC2217 can be influenced by the input
drive circuitry, particularly the second and third harmonics.
Source impedance and input reactance can influence SFDR.
At the falling edge of ENC the sample and hold circuit will
connect the sampling capacitor to the input pin and start the
sampling period. The sampling period ends when ENC rises,
holding the sampled input on the sampling capacitor. Ideally, the input circuitry should be fast enough to fully charge
the sampling capacitor during the sampling period
1/(2 • fENCODE); however, this is not always possible and
the incomplete settling may degrade the SFDR. The sampling glitch has been designed to be as linear as possible
to minimize the effects of incomplete settling.
For the best performance it is recommended to have a
source impedance of 100Ω or less for each input. The
source impedance should be matched for the differential
inputs. Poor matching will result in higher even order
harmonics, especially the second.
Transformer Coupled Circuits
Figure 3 shows the LTC2217 being driven by an RF transformer with a center-tapped secondary. The secondary
center tap is DC biased with VCM, setting the ADC input
signal at its optimum DC level. Figure 3 shows a 1:1 turns
ratio transformer. Other turns ratios can be used; however,
as the turns ratio increases so does the impedance seen by
the ADC. Source impedance greater than 50Ω can reduce
the input bandwidth and increase high frequency distortion. A disadvantage of using a transformer is the loss of
low frequency response. Most small RF transformers have
poor performance at frequencies below 1MHz.
Center-tapped transformers provide a convenient means
of DC biasing the secondary; however, they often show
poor balance at high input frequencies, resulting in large
2nd order harmonics.
VCM
2.2μF
5Ω
5Ω AIN+
10Ω
T1
8.2pF
35Ω
LTC2217
8.2pF
0.1μF
INPUT DRIVE CIRCUITS
Input Filtering
A first-order RC low-pass filter at the input of the ADC can
serve two functions: limit the noise from input circuitry and
provide isolation from ADC S/H switching. The LTC2217
10Ω
T1 = MA/COM ETC1-1T
RESISTORS, CAPACITORS
ARE 0402 PACKAGE SIZE
EXCEPT 2.2μF
35Ω
5Ω AIN–
8.2pF
2217 F03
Figure 3. Single-Ended to Differential Conversion
Using a Transformer. Recommended for Input
Frequencies from 5MHz to 100MHz
2217f
19
LTC2217
APPLICATIONS INFORMATION
Figure 4 shows transformer coupling using a transmission line balun transformer. This type of transformer has
much better high-frequency response and balance than
flux coupled center-tap transformers. Coupling capacitors
are added at the ground and input primary terminals to
allow the secondary terminals to be biased at 1.575V.
VCM
HIGH SPEED
DIFFERENTIAL
AMPLIFIER
ANALOG
INPUT
+
2.2μF
5Ω
0.1μF
CM
–
–
25Ω
0.1μF
T1
1:1
25Ω
0.1μF
4.7pF
4.7pF
10Ω
T1 = MA/COM ETC1-1-13
RESISTORS, CAPACITORS
ARE 0402 PACKAGE SIZE
EXCEPT 2.2μF
12pF
2217 F05
Figure 5. DC Coupled Input with Differential Amplifier
LTC2217
5Ω AIN–
4.7pF
AIN–
25Ω
AMPLIFIER = LTC6600-20,
LTC1993, ETC.
5Ω AIN+
10Ω
ANALOG
INPUT
LTC2217
12pF
+
VCM
2.2μF
AIN+
25Ω
2217 F04
Figure 4. Using a Transmission Line Balun Transformer.
Recommended for Input Frequencies from 100MHz to 250MHz
Direct Coupled Circuits
Figure 5 demonstrates the use of a differential amplifier to
convert a single ended input signal into a differential input
signal. The advantage of this method is that it provides
low frequency input response; however, the limited gain
bandwidth of any op amp or closed-loop amplifier will degrade the ADC SFDR at high input frequencies. Additionally,
wideband op amps or differential amplifiers tend to have
high noise. As a result, the SNR will be degraded unless
the noise bandwidth is limited prior to the ADC input.
reference, tie the SENSE pin to VDD. To use an external
reference, simply apply either a 1.25V or 2.5V reference
voltage to the SENSE input pin. Both 1.25V and 2.5V applied to SENSE will result in a full scale range of 2.75VP-P. A
1.575V output, VCM, is provided for a common mode bias
for input drive circuitry. An external bypass capacitor is
required for the VCM output. This provides a high frequency
low impedance path to ground for internal and external
circuitry. This is also the compensation capacitor for the
reference; which will not be stable without this capacitor.
The minimum value required for stability is 2.2μF.
TIE TO VDD TO USE
INTERNAL 2.5V
REFERENCE
OR INPUT AN
EXTERNAL 2.5V
REFERENCE
OR INPUT AN
EXTERNAL 1.25V
REFERENCE
RANGE
SELECT
AND GAIN
CONTROL
SENSE
PGA
2.5V
BANDGAP
REFERENCE
Reference Operation
Figure 6 shows the LTC2217 reference circuitry consisting
of a 2.5V bandgap reference, a programmable gain amplifier and control circuit. The LTC2217 has three modes of
reference operation: Internal Reference, 1.25V external
reference or 2.5V external reference. To use the internal
INTERNAL
ADC
REFERENCE
VCM
BUFFER
1.575V
2.2μF
2217 F06
Figure 6. Reference Circuit
2217f
20
LTC2217
APPLICATIONS INFORMATION
The internal programmable gain amplifier provides the
internal reference voltage for the ADC. This amplifier has
very stringent settling requirements and therefore is not
accessible for external use.
The SENSE pin can be driven ±5% around the nominal 2.5V
or 1.25V external reference inputs. This adjustment range
can be used to trim the ADC gain error or other system
gain errors. When selecting the internal reference, the
SENSE pin should be tied to VDD as close to the converter
as possible. If the sense pin is driven externally it should
be bypassed to ground as close to the device as possible
with 1μF ceramic capacitor.
3. If the ADC is clocked with a fixed-frequency sinusoidal
signal, filter the encode signal to reduce wideband
noise.
4. Balance the capacitance and series resistance at both
encode inputs such that any coupled noise will appear
at both inputs as common mode noise.
The encode inputs have a common mode range of 1.2V
to VDD. Each input may be driven from ground to VDD for
single-ended drive.
LTC2217
TO INTERNAL
ADC CLOCK
DRIVERS
VCM
1.575V
2.2μF
2
3.3V
1μF
LTC1461-2.5
4
VDD
6
SENSE
1.6V
VDD
6k
LTC2217
ENC+
2.2μF
VDD
1.6V
6k
2217 F07
Figure 7. A 2.75V Range ADC with
an External 2.5V Reference
ENC–
Driving the Encode Inputs
The noise performance of the LTC2217 can depend on
the encode signal quality as much as on the analog input.
The encode inputs are intended to be driven differentially,
primarily for noise immunity from common mode noise
sources. Each input is biased through a 6k resistor to a
1.6V bias. The bias resistors set the DC operating point
for transformer coupled drive circuits and can set the logic
threshold for single-ended drive circuits.
Any noise present on the encode signal will result in additional aperture jitter that will be RMS summed with the
inherent ADC aperture jitter.
In applications where jitter is critical (high input frequencies), take the following into consideration:
2217 F08a
Figure 8a. Equivalent Encode Input Circuit
0.1μF
ENC+
T1
50Ω
100Ω
LTC2217
8.2pF
0.1μF
50Ω
0.1μF
ENC–
2217 F08b
T1 = MA/COM ETC1-1-13
RESISTORS AND CAPACITORS
ARE 0402 PACKAGE SIZE
Figure 8b. Balun-Driven Encode
1. Differential drive should be used.
2. Use as large an amplitude possible. If using transformer coupling, use a higher turns ratio to increase the
amplitude.
2217f
21
LTC2217
APPLICATIONS INFORMATION
ENC+
VTHRESHOLD = 1.6V
1.6V ENC–
LTC2217
0.1μF
2217 F09
Figure 9. Single-Ended ENC Drive,
Not Recommended for Low Jitter
DIGITAL OUTPUTS
Digital Output Modes
3.3V
MC100LVELT22
3.3V
130Ω
Q0
130Ω
ENC+
D0
ENC–
LTC2217
Q0
83Ω
The lower limit of the LTC2217 sample rate is determined
by droop affecting the sample and hold circuits. The
pipelined architecture of this ADC relies on storing analog
signals on small valued capacitors. Junction leakage will
discharge the capacitors. The specified minimum operating
frequency for the LTC2217 is 1Msps.
83Ω
2217 F10
Figure 10. ENC Drive Using a CMOS to PECL Translator
Maximum and Minimum Encode Rates
The maximum encode rate for the LTC2217 is 105Msps.
For the ADC to operate properly the encode signal should
have a 50% (±5%) duty cycle. Each half cycle must have
at least 4.5ns for the ADC internal circuitry to have enough
settling time for proper operation. Achieving a precise 50%
duty cycle is easy with differential sinusoidal drive using
a transformer or using symmetric differential logic such
as PECL or LVDS. When using a single-ended ENCODE
signal asymmetric rise and fall times can result in duty
cycles that are far from 50%.
An optional clock duty cycle stabilizer can be used if the
input clock does not have a 50% duty cycle. This circuit
uses the rising edge of ENC pin to sample the analog input.
The falling edge of ENC is ignored and an internal falling
edge is generated by a phase-locked loop. The input clock
duty cycle can vary from 30% to 70% and the clock duty
cycle stabilizer will maintain a constant 50% internal duty
cycle. If the clock is turned off for a long period of time,
the duty cycle stabilizer circuit will require one hundred
clock cycles for the PLL to lock onto the input clock. To
use the clock duty cycle stabilizer, the MODE pin must be
connected to 1/3VDD or 2/3VDD using external resistors.
The LTC2217 can operate in four digital output modes:
standard LVDS, low power LVDS, full rate CMOS, and
demultiplexed CMOS. The LVDS pin selects the mode of
operation. This pin has a four level logic input, centered at
0, 1/3VDD, 2/3VDD and VDD. An external resistor divider can
be used to set the 1/3VDD and 2/3VDD logic levels. Table 1
shows the logic states for the LVDS pin.
Table 1. LVDS Pin Function
LVDS
DIGITAL OUTPUT MODE
0V(GND)
Full-Rate CMOS
1/3VDD
Demultiplexed CMOS
2/3VDD
Low Power LVDS
VDD
LVDS
Digital Output Buffers (CMOS Modes)
Figure 11 shows an equivalent circuit for a single output
buffer in CMOS Mode, Full-Rate or Demultiplexed. Each
buffer is powered by OVDD and OGND, isolated from the
ADC power and ground. The additional N-channel transistor
in the output driver allows operation down to low voltages.
The internal resistor in series with the output makes the
output appear as 50Ω to external circuitry and eliminates
the need for external damping resistors.
As with all high speed/high resolution converters, the
digital output loading can affect the performance. The
digital outputs of the LTC2217 should drive a minimum
capacitive load to avoid possible interaction between the
digital outputs and sensitive input circuitry. The output
should be buffered with a device such as a ALVCH16373
CMOS latch. For full speed operation the capacitive load
should be kept under 10pF. A resistor in series with the
2217f
22
LTC2217
APPLICATIONS INFORMATION
output may be used, but is not required since the ADC
has a series resistor of 43Ω on-chip.
Lower OVDD voltages will also help reduce interference
from the digital outputs.
LTC2217
OVDD
VDD
0.5V
TO 3.6V
VDD
0.1μF
OVDD
DATA
FROM
LATCH
PREDRIVER
LOGIC
43Ω
TYPICAL
DATA
OUTPUT
OGND
2217 F11
Figure 11. Equivalent Circuit for a Digital Output Buffer
Digital Output Buffers (LVDS Modes)
Figure 12 shows an equivalent circuit for an LVDS output
pair. A 3.5mA current is steered from OUT+ to OUT– or
vice versa, which creates a ±350mV differential voltage
across the 100Ω termination resistor at the LVDS receiver.
A feedback loop regulates the common mode output voltage to 1.20V. For proper operation each LVDS output pair
must be terminated with an external 100Ω termination
resistor, even if the signal is not used (such as OF+/OF– or
CLKOUT+/CLKOUT–). To minimize noise the PC board
traces for each LVDS output pair should be routed close
together. To minimize clock skew all LVDS PC board traces
should have about the same length.
In Low Power LVDS Mode 1.75mA is steered between
the differential outputs, resulting in ±175mV at the LVDS
receiver’s 100Ω termination resistor. The output common mode voltage is 1.20V, the same as standard LVDS
Mode.
Data Format
The LTC2217 parallel digital output can be selected for
offset binary or 2’s complement format. The format is
selected with the MODE pin. This pin has a four level
logic input, centered at 0, 1/3VDD, 2/3VDD and VDD. An
external resistor divider can be user to set the 1/3VDD
and 2/3VDD logic levels. Table 2 shows the logic states
for the MODE pin.
Table 2. MODE Pin Function
OUTPUT FORMAT
CLOCK DUTY
CYCLE STABILIZER
0(GND)
Offset Binary
Off
1/3VDD
Offset Binary
On
2/3VDD
2’s Complement
On
VDD
2’s Complement
Off
MODE
LTC2217
OVDD
3.3V
3.5mA
0.1μF
VDD
VDD
OVDD
43Ω
DATA
FROM
LATCH
PREDRIVER
LOGIC
10k
10k
OVDD
100Ω
LVDS
RECEIVER
43Ω
1.20V
+
–
OGND
2217 F12
Figure 12. Equivalent Output Buffer in LVDS Mode
2217f
23
LTC2217
APPLICATIONS INFORMATION
Overflow Bit
An overflow output bit (OF) indicates when the converter
is over-ranged or under-ranged. In CMOS mode, a logic
high on the OFA pin indicates an overflow or underflow on
the A data bus, while a logic high on the OFB pin indicates
an overflow on the B data bus. In LVDS mode, a differential logic high on OF+/OF– pins indicates an overflow
or underflow.
LSB and all other bits. The LSB, OF and CLKOUT output
are not affected. The output Randomizer function is active
when the RAND pin is high.
LTC2217
CLKOUT
CLKOUT
OF
OF
Output Clock
The ADC has a delayed version of the encode input available as a digital output, CLKOUT. The CLKOUT pin can
be used to synchronize the converter data to the digital
system. This is necessary when using a sinusoidal encode. In both CMOS modes, A bus data will be updated
as CLKOUTA falls and CLKOUTB rises. In demultiplexed
CMOS mode the B bus data will be updated as CLKOUTA
falls and CLKOUTB rises.
D15
In Full Rate CMOS Mode, only the A data bus is active;
data may be latched on the rising edge of CLKOUTA or
the falling edge of CLKOUTB.
D1
In demultiplexed CMOS mode CLKOUTA and CLKOUTB
will toggle at 1/2 the frequency of the encode signal. Both
the A bus and the B bus may be latched on the rising edge
of CLKOUTA or the falling edge of CLKOUTB.
D15 ⊕ D0
D14
D2
RAND = HIGH,
SCRAMBLE
ENABLED
D14 ⊕ D0
•
•
•
D2 ⊕ D0
D1 ⊕ D0
RAND
D0
D0
2217 F13
Figure 13. Functional Equivalent of Digital Output Randomizer
Digital Output Randomizer
Interference from the ADC digital outputs is sometimes
unavoidable. Interference from the digital outputs may be
from capacitive or inductive coupling, or coupling through
the ground plane. Even a tiny coupling factor can result in
discernible unwanted tones in the ADC output spectrum.
By randomizing the digital output before it is transmitted
off chip, these unwanted tones can be randomized, trading
a slight increase in the noise floor for a large reduction in
unwanted tone amplitude.
The digital output is “Randomized” by applying an exclusive-OR logic operation between the LSB and all other data
output bits. To decode, the reverse operation is applied;
that is, an exclusive-OR operation is applied between the
Output Driver Power
Separate output power and ground pins allow the output
drivers to be isolated from the analog circuitry. The power
supply for the digital output buffers, OVDD, should be tied
to the same power supply as for the logic being driven.
For example, if the converter is driving a DSP powered
by a 1.8V supply, then OVDD should be tied to that same
1.8V supply. In CMOS mode OVDD can be powered with
any logic voltage up to the 3.6V. OGND can be powered
with any voltage from ground up to 1V and must be less
than OVDD. The logic outputs will swing between OGND
and OVDD. In LVDS Mode, OVDD should be connected to
a 3.3V supply and OGND should be connected to GND.
2217f
24
LTC2217
APPLICATIONS INFORMATION
Internal Dither
PC BOARD
FPGA
The LTC2217 is a 16-bit ADC with a very linear transfer
function; however, at low input levels even slight imperfections in the transfer function will result in unwanted tones.
Small errors in the transfer function are usually a result
of ADC element mismatches. An optional internal dither
mode can be enabled to randomize the input location on
the ADC transfer curve, resulting in improved SFDR for
low signal levels.
CLKOUT
OF
D15 ⊕ D0
D15
D14 ⊕ D0
As shown in Figure 15, the output of the sample-and-hold
amplifier is summed with the output of a dither DAC. The
dither DAC is driven by a long sequence pseudo-random
number generator; the random number fed to the dither DAC
is also subtracted from the ADC result. If the dither DAC
is precisely calibrated to the ADC, very little of the dither
signal will be seen at the output. The dither signal that does
leak through will appear as white noise. The dither DAC is
calibrated to result in typically less than 0.5dB elevation
in the noise floor of the ADC as compared to the noise
floor with dither off, when a suitable input termination is
provided (see Demo Board schematic DC996B).
D14
•
•
•
LTC2217
D2 ⊕ D0
D2
D1 ⊕ D0
D1
D0
D0
2217 F14
Figure 14. Descrambling a Scrambled Digital Output
LTC2217
AIN+
ANALOG
INPUT
AIN–
16-BIT
PIPELINED
ADC CORE
S/H
AMP
CLOCK/DUTY
CYCLE
CONTROL
PRECISION
DAC
DIGITAL
SUMMATION
CLKOUT
OF
D15
•
•
•
D0
OUTPUT
DRIVERS
MULTIBIT DEEP
PSEUDO-RANDOM
NUMBER
GENERATOR
2217 F15
ENC +
ENC –
DITH
DITHER ENABLE
HIGH = DITHER ON
LOW = DITHER OFF
Figure 15. Functional Equivalent Block Diagram of Internal Dither Circuit
2217f
25
LTC2217
APPLICATIONS INFORMATION
Grounding and Bypassing
The LTC2217 requires a printed circuit board with a
clean unbroken ground plane; a multilayer board with an
internal ground plane is recommended. The pinout of the
LTC2217 has been optimized for a flowthrough layout so
that the interaction between inputs and digital outputs is
minimized. Layout for the printed circuit board should
ensure that digital and analog signal lines are separated
as much as possible. In particular, care should be taken
not to run any digital track alongside an analog signal
track or underneath the ADC.
High quality ceramic bypass capacitors should be used
at the VDD, VCM, and OVDD pins. Bypass capacitors must
be located as close to the pins as possible. The traces
connecting the pins and bypass capacitors must be kept
short and should be made as wide as possible.
The LTC2217 differential inputs should run parallel and
close to each other. The input traces should be as short
as possible to minimize capacitance and to minimize
noise pickup.
Heat Transfer
Most of the heat generated by the LTC2217 is transferred
from the die through the bottom-side exposed pad. For
good electrical and thermal performance, the exposed
pad must be soldered to a large grounded pad on the PC
board. It is critical that the exposed pad and all ground
pins are connected to a ground plane of sufficient area
with as many vias as possible.
2217f
26
LTC2217
APPLICATIONS INFORMATION
Layer 1 Component Side
Layer 2 GND Plane
2217f
27
LTC2217
APPLICATIONS INFORMATION
Layer 3 GND
Layer 4 GND
2217f
28
LTC2217
APPLICATIONS INFORMATION
Layer 5 GND
Layer 6 Bottom Side
2217f
29
C10
8.2pF
R36
R44
86.6Ω 86.6Ω
L1
56nH
LTC2216IUP
LTC2215IUP
LTC2215IUP
DC996B-I
DC996B-J
LTC2216IUP
DC996B-H
16
LTC2217IUP
DC996B-F
DC996B-G
16
16
16
16
16
U2
LTC2217IUP
DC996B-E
BITS
5
3
1
ASSEMBLY
*VERSION TABLE
TP2
PWR
GND
TP5
3.3V
C1
0.01μF
1.8pF
4.7pF
1.8pF
4.7pF
1.8pF
4.7pF
C8
56nH
8.2pF
3.9pF
8.2pF
18nH
56nH
18nH
18nH
3.9pF
3.9pF
L1
56nH
8.2pF
6
4
2
43.2
86.6
43.2
86.6
43.2
86.6
R36, 44
VCC
R1
49.9Ω
R2
49.9Ω
C5
0.01μF
C7
0.01μF
R15
5Ω
182
86.6
182
86.6
182
86.6
R45
VCC
C4
8.2pF
R4
5.1Ω
R5
5.1Ω
5
3
1
5
3
1
OFF
RUN
T2
WBC1-1LB
WBC1-1LB
MABAES0060
WBC1-1LB
MABAES0060
FREQUENCY
6
4
2
6
4
2
70MHZ TO 140MHZ
1MHZ TO 70MHZ
70MHZ TO 140MHZ
1MHZ TO 70MHZ
70MHZ TO 140MHZ
1MHZ TO 70MHZ
R8
1000Ω
GND
VDD
J2 MODE
R6 1000Ω
ON
SHDN
DITHER
J3
R13
100Ω
C17
2.2μF
R27
10Ω
C8
4.7pF
R28
10Ω
R14
1000Ω
R12
33.2Ω
C13
2.2μF
VCC
R10
10Ω
R11
33.2Ω
MABAES0060
TP1
EXT REF
C12
0.1μF
T1
MABA-007159- T2
000000
• •
C9-10
J9
AUX PWR
CONNECTOR
C3
0.01μF
• •
J7
ENCODE C2
T3
CLOCK 0.01μF ETC1-1-13
C8
8.2pF
C6
J5
AIN 0.01μF
• •
R45
86.6Ω
R7
1000Ω
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
VDD16
VDD15
GND14
ENCN
ENCP
GND11
GND10
AINN
AINP
GND7
VDD6
VDD5
GND
VCM
GND2
SENSE
64
4
3
2
1
17
R9
10Ω
C26
0.1μF
C25
0.1μF
C16
0.1μF
C18
OPT
C19
OPT
R37
100Ω
62
63
NC
VDD17
61
RAND
GND18
5
60
R3
DNP
VCC
GND
C15
0.1μF
DOUT–
DOUT+
GND
EN
RIN+
U5
FIN1101K8X
R41
100Ω
58
GND
VDD
59
RIN–
18
MODE
SHDN
19
LVDS
DITH
20
OF+
D0–
21
J4
5
6
7
8
ON
OFF
56
3
6
4
2
U2
LTC2217IUP
D1+
24
OF–
57
D15–
55
26
D0+
22
D15+
D1–
23
D14+
D2–
25
53
54
R16
100Ω
49
50
C22
0.1μF
D5–
D5+
D8–
D8+
D7–
D7+
CLKOUT–
R42
FERRITE BEAD
C14
4.7μF
D8–
D8+
D9–
D9+
D10–
D10+
D11–
D11+
CLKCOUT+
C20
0.1μF
D14–
D2+
52
D13+
27
D3–
51
D13–
D3+
27
D12+
D4–
29
D12–
D4+
30
OGND50
OGND31
31
OVDD49
OVDD32
32
1
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
C24
4.7μF
R43
FERRITE BEAD
65
C38
4.7μF
3.3V
C34
0.1μF
C35
0.1μF
C36
0.1μF
C28
0.1μF
C29
0.1μF
C30
0.1μF
C31
0.1μF
C32
0.1μF
R40
100Ω
R39
100Ω
R38
100Ω
R35
100Ω
R34
100Ω
R33
100Ω
R32
100Ω
R31
100Ω
R30
100Ω
R23
100Ω
R22
100Ω
R21
100Ω
R20
100Ω
R19
100Ω
R18
100Ω
R17
100Ω
20
21
18
19
16
17
14
15
10
11
8
9
6
7
4
5
3
22
27
46
13
20
21
18
19
16
17
14
15
10
11
8
9
6
7
4
5
3
22
27
46
13
3.3V
12
25
26
47
48
I8N
I8P
I7N
I7P
I6N
I6P
I5N
I5P
I4N
I4P
I3N
I3P
I2N
I2P
I1N
I1P
EN12
EN34
EN58
EN78
EN
41
40
39
38
35
34
33
32
31
30
29
28
O4N
O4P
O5N
O5P
O6N
O6P
O7N
O7P
O8N
O8P
3.3V
I8N
I8P
I7N
I7P
I6N
I6P
I5N
I5P
I4N
I4P
I3N
I3P
I2N
I2P
I1N
I1P
EN12
EN34
EN58
EN78
EN
O8N
O8P
O7N
O7P
O6N
O6P
O5N
O5P
O4N
O4P
U4
O3N
FIN1108 O3P
O2N
O2P
O1N
O1P
29
28
31
30
33
32
35
34
39
38
41
40
43
42
45
44
43
42
O2N
O2P
5
44
O3N
U3
FIN1108 O3P
O1N
O1P
VC1
VC2
VC3
VC4
VC5
VE1
VE2
VE3
VE4
VE5
1
2
23
36
37
12
25
26
47
48
VC1
VC2
VC3
VC4
VC5
VE1
VE2
VE3
VE4
VE5
30
1
2
23
36
37
VCC
56
58
60
62
64
66
68
70
72
74
76
78
80
82
84
86
88
90
92
94
96
98
100
4
GND
VCC
8
ARRAY
EEPROM
U1
24LC02ST
R24
100k
55
57
59
61
63
65
67
69
71
73
75
77
79
81
83
85
87
89
91
93
95
97
99
R29
4990Ω
3.3V
A0
A2
A1
6DA
WP
1
2
3
7
5
6
C27
0.1μF
6CL
MEC8-150-02-L-D-EDGE_CONNRE-DIM
J1E J1O
2
1
4
3
6
5
8
7
10
9
12
11
14
13
16
15
18
17
20
19
22
21
24
23
26
25
28
27
30
29
32
31
34
33
36
35
38
37
40
39
42
41
44
43
46
45
48
47
50
49
52
51
54
53
2217 F16
R26
4990Ω
R25
4990Ω
LTC2217
APPLICATIONS INFORMATION
2217f
LTC2217
PACKAGE DESCRIPTION
UP Package
64-Lead Plastic QFN (9mm × 9mm)
(Reference LTC DWG # 05-08-1705)
0.70 ±0.05
7.15 ±0.05
7.50 REF
8.10 ±0.05 9.50 ±0.05
(4 SIDES)
7.15 ±0.05
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
9 .00 ± 0.10
(4 SIDES)
0.75 ± 0.05
R = 0.10
TYP
R = 0.115
TYP
63 64
0.40 ± 0.10
PIN 1 TOP MARK
(SEE NOTE 5)
1
2
PIN 1
CHAMFER
C = 0.35
7.15 ± 0.10
7.50 REF
(4-SIDES)
7.15 ± 0.10
(UP64) QFN 0406 REV C
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
6. DRAWING NOT TO SCALE
0.25 ± 0.05
0.50 BSC
BOTTOM VIEW—EXPOSED PAD
2217f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
31
LTC2217
RELATED PARTS
PART NUMBER DESCRIPTION
COMMENTS
LTC1749
12-Bit, 80Msps Wideband ADC
Up to 500MHz IF Undersampling, 87dB SFDR
LTC1750
14-Bit, 80Msps Wideband ADC
Up to 500MHz IF Undersampling, 90dB SFDR
LT1993
High Speed Differential Op Amp
600MHz BW, 75dBc Distortion at 70MHz
LTC2202
16-Bit, 10Msps ADC
150mW, 81.6dB SNR, 100dB SFDR
LTC2203
16-Bit, 25Msps ADC
230mW, 81.6dB SNR, 100dB SFDR
LTC2204
16-Bit, 40Msps ADC
470mW, 79dB SNR, 100dB SFDR
LTC2205
16-Bit, 65Msps ADC
530mW, 79dB SNR, 100dB SFDR
LTC2206
16-Bit, 80Msps ADC
725mW, 77.9dB SNR, 100dB SFDR
LTC2207
16-Bit, 105Msps ADC
900mW, 77.9dB SNR, 100dB SFDR
LTC2208
16-Bit, 130Msps ADC
1250mW, 77.7dB SNR, 100dB SFDR
LTC2209
16-Bit, 160Msps ADC
1450mW, 77.1dB SNR, 100dB SFDR
LTC2215
16-Bit, 65Msps ADC
700mW, 81.5dB SNR, 100dB SFDR
LTC2216
16-Bit, 80Msps ADC
970mW, 81.3dB SNR, 100dB SFDR
LTC2220
12-Bit, 170Msps ADC
890mW, 67.5dB SNR, 9mm × 9mm QFN Package
LTC2220-1
12-Bit, 185Msps ADC
910mW, 67.5dB SNR, 9mm × 9mm QFN Package
LTC2249
14-Bit, 65Msps ADC
230mW, 73dB SNR, 5mm × 5mm QFN Package
LTC2250
10-Bit, 105Msps ADC
320mW, 61.6dB SNR, 5mm × 5mm QFN Package
LTC2251
10-Bit, 125Msps ADC
395mW, 61.6dB SNR, 5mm × 5mm QFN Package
LTC2252
12-Bit, 105Msps ADC
320mW, 70.2dB SNR, 5mm × 5mm QFN Package
LTC2253
12-Bit, 125Msps ADC
395mW, 70.2dB SNR, 5mm × 5mm QFN Package
LTC2254
14-Bit, 105Msps ADC
320mW, 72.5dB SNR, 5mm × 5mm QFN Package
LTC2255
14-Bit, 125Msps ADC
395mW, 72.4dB SNR, 5mm × 5mm QFN Package
LTC2299
Dual 14-Bit, 80Msps ADC
445mW, 73dB SNR, 9mm × 9mm QFN Package
LT5512
DC-3GHz High Signal Level
Downconverting Mixer
DC to 3GHz, 21dBm IIP3, Integrated LO Buffer
LT5514
Ultralow Distortion IF Amplifier/ADC
Driver with Digitally Controlled Gain
450MHz 1dB BW, 47dB OIP3, Digital Gain Control 10.5dB to 33dB in 1.5dB/Step
LT5522
600MHz to 2.7GHz High Linearity
Downconverting Mixer
4.5V to 5.25V Supply, 25dBm IIP3 at 900MHz, NF = 12.5dB, 50Ω Single-Ended RF and LO Ports
2217f
32 Linear Technology Corporation
LT 0108 • PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
●
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© LINEAR TECHNOLOGY CORPORATION 2007