www.fairchildsemi.com FAN1539/FAN1540 1A/1.3A, LDO With Low Quiescent Current Features Description • • • • • • • • The FAN1539/FAN1540 series of high current LDO (1.0A and 1.3A) has been developed for portable applications where low quiescent current is an important requirement. The device features excellent line and load transient response which does not exceed 10% of nominal output value for full operating temperature range even during power ON cycle and short circuit removal. Internally trimmed, temperature compensated bandgap reference guarantees 2.5% accuracy for full range of input voltage, output current and temperature. Included on the chip are accurate current limit and thermal shutdown protection. Device stability is achieved with only two external low ESR ceramic capacitors. Very Low Ground Current (IGND = 1mA) Excellent Line Regulation Excellent Load Regulation Very Low Transient Overshoot Stable with low ESR Output Capacitor (ESR = 0mΩ) Thermal Shutdown Current Limit Output Options: 3.3V and 1.8V Applications • • • • Disk Drive Circuits Desktop Computers Laptop, Notebook Computers General purpose Three Terminal Regulator The FAN1539/FAN1540 is available in thermally enhanced 3x3mm 6-lead MLP, 5x6mm 8-lead MLP package and 3-lead TO-252 packages. The 5x6mm MLP package version features separate Kelvin sense pin for high precision applications. Block Diagram V OUT V IN X BANDGAP REFERENCE (Note1) V SENSE (Note2) CURRRENT LIMIT SRART-UP CIRCUIT ERROR AMPLIFIER THERMAL SHUTDOWN GND Notes: 1. No connection for FAN1540MMPX. 2. VSEN available for FAN1540MMPX. REV. 1.0.8 3/22/04 FAN1539/FAN1540 PRODUCT SPECIFICATION Pin Assignments TOP VIEW GND 1 8 VOUT 2 7 GND NC GND VOUT VIN FAN1540 VSEN 3 6 GND VIN 4 5 GND 1 6 GND 2 5 NC 3 4 NC FAN1539/FAN1540 3x3mm 6-Lead MLP FAN1540 VIN VOUT GND 5x6mm 8-Lead MLP 3-Lead TO-252 PACKAGE Pin Description Symbol VIN Input pin GND Ground Pin (Tab) VOUT Output pin: Fixed Output Voltage VSEN Output sense pin. Connect to VOUT if Kelvin sensing is not required NC 2 Name And Function No Connection REV. 1.0.8 3/22/04 PRODUCT SPECIFICATION FAN1539/FAN1540 Absolute Maximum Ratings Parameter Symbol Value Units Operating Input Voltage VIN 10 V Power Dissipation PD Internally Limited W IOSH Internally Limited A Operating Junction Temperature Range TJ 0 to 150 °C Thermal Resistance- Junction to Tab, TO-252 θ JC 3 °C/W Thermal Resistance- Junction to Tab, 3mmx3mm 6-lead MLP (Note 3) θ JC 8 °C/W Thermal Resistance- Junction to Tab, 5mmx6mm 8-lead MLP (Note 3) θ JC 4 °C/W Storage Temperature Range (Note 3) TSTG -65 to 150 °C Lead Temperature (I.R. Reflow) 30Sec. (Note 4) TLEAD 240 °C Lead Temperature (Soldering) 10Sec. (Note 4) TLEAD 260 °C ESD 4 kV Short Circuit Output Current Electrostatic Discharge Protection (Note 5) HBM CDM 2 Notes: 3. Junction to ambient thermal resistance, θ JA, is a strong function of PCB material, board thickness, thickness and number of copper plains, number of via used, diameter of via used, available copper surface, and attached heat sink characteristics.Thermal resistance( θ JA ), VIN, IOUT must be chosen not to exceed TJ = 150°C. 4. Soldering temperature should be 260°C for 10 second after 240°C for 30 second in I.R. reflow using 60/40 solder. Maximum rate of temperature rise is 3°C/SEC to within 100°C of the final temperature. 5. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model). REV. 1.0.8 3/22/04 3 FAN1539/FAN1540 PRODUCT SPECIFICATION Electrical Characteristics—FAN1539MPX, FAN1540MPX, FAN1540MMPX, FAN1540DX Unless otherwise specified, VIN = 4.50V to 7V, Tj = 25°C, IMAX (FAN1539) = 1.0A, IMAX (FAN1540) = 1.3A. Boldface limits apply over operating junction temperature range of 0°C ≤ T J ≤ 125°C. TEST CONDITIONS Parameter Output Voltage FAN1540 Symbol VIN IOUT VOUT 4.75V ≤ V IN ≤ 5.25V 5mA ≤ I OUT ≤ I MAX 3.0V ≤ V IN ≤ 5.25V Load Regulation REG(LOAD) 4.75V Current Limit Min. Output Current for regulation ( ∆V OUT ≤ 3% ) Min. Typ. V 3.383 15 mV FAN1539 25 35 mV FAN1540 30 40 0.9 1.2 5.5V 3.3 IOMIN V A 0 mA Temperature Stability TS IOUT = 5mA 0.3 % RMS Output Noise (Note 7) VN IOUT = IMAX 0.003 %VOUT dB Ripple Rejection Ratio (Note 8) Transient Response Change of VOUT with step load change (Note 9) RA ∆V OUT ---------------∆I OUT 5V 5V IOUT = 10mA 65 75 IOUT = 100mA 63 73 IOUT = IMAX 45 57 1mA to IMAX t r ≥ 1µS 2.0 IMAX to 1mA t f ≥ 1µS Transient Response Change of VOUT with application of VIN (Note 9) 4 Units 2 IOUT = IMAX VD IS 5mA ≤ I OUT ≤ I MAX 5mA ≤ I OUT ≤ I MAX Max. 3.234 3.300 3.366 3.217 Line Regulation REG(LINE) Dropout Voltage (Note 6) TEST LIMITS ∆V OUT ----------------∆V IN 0 to 5V Step Input t r ≥ 1µS 10% to 90% 1mA ≤ I OUT ≤ I MAX 5.0 10 (undershoot or overshoot of VOUT) 10 (undershoot or overshoot of VOUT) % % REV. 1.0.8 3/22/04 PRODUCT SPECIFICATION FAN1539/FAN1540 Electrical Characteristics—FAN1539MPX, FAN1540MPX, FAN1540MMPX, FAN1540DX (Continued) Unless otherwise specified, VIN = 4.50V to 7V, Tj = 25°C, IMAX (FAN1539) = 1.0A, IMAX (FAN1540) = 1.3A. Boldface limits apply over operating junction temperature range of 0°C ≤ T J ≤ 125°C. TEST CONDITIONS Parameter Transient Response Short circuit Removal Response (Note 9) Symbol ∆V OUT ---------------∆V IN TEST LIMITS VIN IOUT 5V Min. Typ. Max. Units IOUT = short to IOUT = 10mA 5.0 10 (overshoot or undershoot of VO) % @IOUT = short Quiescent Current IGND V IN ≤ 7V IOUT = 0mA 1.0 2.0 mA Quiescent Current IGND V IN ≤ 7V 2mA ≤ I OUT ≤ I MAX 1.0 2.0 mA Quiescent Current IGND VIN = 5V 0mA ≤ I OUT ≤ 50mA 1.0 2.0 mA Thermal Shutdown TjSD 3.0V ≤ V IN ≤ 5.25V 160 °C Thermal Hysteresis THYST 3.0 ≤ V IN ≤ 5.25V 15 °C Notes: 6. Dropout voltage is defined as the input to output differential voltage at which the output voltage drops 1% below the nominal value measured at VIN = 5V. 7. Measured within 10Hz to 10kHz bandwidth. 8. Measured at DC, specified at 120 Hz. 9. CIN = 22µF, COUT = 10µF. Both capacitors are low ESR X7R type. Test Circuit VOUT VIN IN CIN DUT 22µF OUT 10µF GND COUT Notes: 1. Use low ESR capacitors. 2. CIN should be placed as close to VIN as possible. REV. 1.0.8 3/22/04 5 FAN1539/FAN1540 PRODUCT SPECIFICATION Electrical Characteristics—FAN1540D18X Unless otherwise specified, VIN = 3.135V to 3.465V, Tj= 25°C, IMAX = 1.3A. Boldface limits apply over operating junction temperature range of 0°C ≤ T J ≤ 125°C. TEST CONDITIONS Parameter Output Voltage Line Regulation Symbol VIN IOUT VOUT 3.15V ≤ V IN ≤ 3.465V 5mA ≤ I OUT ≤ I MAX 1.755 1.800 1.845 V 5mA ≤ I OUT ≤ I MAX 3 10 mV 5mA ≤ I OUT ≤ I MAX 20 40 mV IOUT = IMAX 0.9 1.2 V REG(LINE) 3.135V ≤ V IN ≤ 3.465V Load Regulation REG(LOAD) Dropout Voltage (Note 6) Current Limit Min. Output Current for regulation ( ∆V OUT ≤ 3% ) TEST LIMITS 3.3V VD IS Min. 3.3V Typ. 2.5 IOMIN Units A 0 mA Temperature Stability TS IOUT = 5mA 0.3 % RMS Output Noise (Note 7) VN IOUT = IMAX 0.003 %VOUT Ripple Rejection Ratio (Note 8) Transient Response Change of VOUT with step load change (Note 9) RA 3.3V IOUT = 500mA ∆V OUT ---------------∆I OUT 3.3V 1mA to IMAX t r ≥ 1µS 40 dB 2.0 IMAX to 1mA t f ≥ 1µS Transient Response Change of VOUT with application of VIN (Note 9) 6 Max. ∆V OUT ---------------∆V IN 0 to 1.8V Step Input t r ≥ 1µS 10% to 90% 1mA ≤ I OUT ≤ I MAX 3.0 10 (undershoot or overshoot of VOUT) 10 (undershoot or overshoot of VOUT) % % REV. 1.0.8 3/22/04 PRODUCT SPECIFICATION FAN1539/FAN1540 Electrical Characteristics—FAN1540D18X (Continued) Unless otherwise specified, VIN = 3.135V to 3.465V, TA= 25°C. Boldface limits apply over operating junction temperature range of 0°C ≤ T J ≤ 125°C. TEST CONDITIONS Parameter Transient Response Short circuit Removal Response (Note 9) Symbol ∆V OUT ---------------∆V IN TEST LIMITS VIN IOUT 3.3V Min. Typ. Max. Units IOUT = short to IOUT = 10mA 3.0 10 (overshoot or undershoot of VO) % @IOUT = short Quiescent Current IGND 3.3V IOUT = 0mA 1.0 2.0 mA Quiescent Current IGND 3.3V 2mA ≤ I OUT ≤ I MAX 1.0 2.0 mA Thermal Shutdown TjSD 160 °C Thermal Hysteresis THYST 10 °C Notes: 6. Dropout voltage is defined as the input to output differential voltage at which the output voltage drops 1% below the nominal value measured at VIN = 3.3V. 7. Measured within 10Hz to 10kHz bandwidth. 8. Measured at DC, specified at 120 Hz. 9. CIN = 22µF, COUT = 10µF. Both capacitors are low ESR X7R type. Test Circuit VOUT VIN IN CIN DUT 22µF OUT 10µF GND COUT Notes: 1. Use low ESR capacitors. 2. CIN should be placed as close to VIN as possible. REV. 1.0.8 3/22/04 7 FAN1539/FAN1540 PRODUCT SPECIFICATION Typical Performance Characteristics—FAN1539MPX, FAN1540MPX, FAN1540MMPX, FAN1540DX Ground Pin Current vs. Temperature Output Voltage vs. Temperature 3.310 Output Voltage (V) 3.300 3.295 3.290 VIN = 5V 3.285 VIIN = 5V = 10mA OUT OUT = 5mA Typical I3.3V Device Typical 3.3V Device 3.280 Quiescent Current (mA) 1.3 3.305 VIN = 5V IOUT = 10mA 1.2 1.1 1.0 0.9 0.8 0.7 3.275 -50 0 50 100 0 150 Ambient Temperature (°C) 1.15 1.06 1.10 1.05 1.00 IOUT = 10mA 0.90 Quiescent Current (mA) Quiescent Current (mA) 1.07 4 1.05 1.04 1.03 VIN = 5V 1.02 1.01 5 6 7 8 9 0 10 200 400 600 800 1000 1200 1400 Output Current (mA) Input Voltage (V) Output Voltage vs. Output Current Dropout Voltage vs. Temperature 3.5 1.2 3.0 1.1 1.0 IOUT = 1.3A 0.9 IOU T 0.8 IO UT = 1A = 0. 5A Output Voltage (V) Dropout Voltage (V) 150 1.00 0.85 2.5 2.0 VIN = 5V 1.5 Tj = 25°C 1.0 0.5 0.7 0.0 0.6 -50 0 50 100 Ambient Temperature (°C) 8 100 Ground Pin Current vs. Output Current Ground Pin Current vs. Input Voltage 1.20 0.95 50 Ambient Temperature (°C) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Output Current (A) REV. 1.0.8 3/22/04 PRODUCT SPECIFICATION FAN1539/FAN1540 Typical Performance Characteristics—FAN1539MPX, FAN1540MPX, FAN1540MMPX, FAN1540DX (Continued) 3.300V CIN = 22µF COUT = 10µF tr = 1µs (2.5V/div) Output Voltage (Ceramic Low ESR Capacitors) Tj = 25°C VIN = 5V 3.300V (20mV/div) IOUT = IMAX Output Voltage Load Transient Response CIN = 22µF COUT = 10µF (Ceramic Low ESR Capacitors) Output Current (0.5A/div) (50mV/div) Output Voltage Line Transient Response tr = 1µs tf = 1µs Tj = 25°C Time (20µs/div) Time (20µs/div) Ripple Rejection vs. Frequency 100 VIN = 5V 3.300V CIN = 22µF COUT = 10µF (Ceramic Low ESR Capacitors) ~3.3A 90 Ripple Rejection (dB) Output Current (2.5A/div) Output Voltage (50mV/div) Short Circuit Removal Response tTf j==1µs 25°C 10mA 80 70 60 50 40 30 VIN = 5V IOUT = 10mA 20 COUT = 10µF (Low ESR) 10 0 10 1 10 2 10 3 10 4 Frequency (Hz) 10 5 10 6 Time (40µs/div) Typical Region of Stability ESR vs. Output Current* ESR (mΩ) (Equivalent Series Resistance) 1000 (µVrms/rtHz) Output Spectral Noise Density Output Spectral Noise Density vs. Frequency Region of Instability 100 Region of Stability 10 VIN = 5V CIN= 22µF 1 COUT = 10µF Tj = 25°C 0.1 0 Frequency (Hz) 200 400 600 800 1000 1200 1400 Output Current (mA) *Note: ESR Values measured at f=10kHz Note: Transient response tests require short lead lengths and low resistance connections at source and load. REV. 1.0.8 3/22/04 9 FAN1539/FAN1540 PRODUCT SPECIFICATION Typical Performance Characteristics—FAN1540D18X Output Voltage vs. Temperature Ground Pin Current vs. Temperature 1.810 1.3 Quiescent Current (mA) Output Voltage (V) 1.805 1.800 1.795 1.790 VIN = 3.3V IOUT = 10mA Typical 1.8V Device 1.785 1.780 1.775 0 50 100 VIN = 3.3V IOUT = 10mA 1.2 1.1 1.0 0.9 0.8 0.7 150 0 Ambient Temperature (°C) 1.15 1.06 Quiescent Current (mA) Quiescent Current (mA) 1.07 1.10 1.05 1.00 IOUT = 10mA 0.90 150 1.05 1.04 1.03 VIN = 3.3V 1.02 1.01 1.00 0.85 3 4 5 6 7 8 9 0 10 200 0.9 IOU T = 1A 0.8 IO UT = 0. 5A Output Voltage (V) IOUT = 1.3A 800 1000 1200 1400 1.9 1.2 1.0 600 Output Voltage vs. Output Current Dropout Voltage vs. Temperature 1.1 400 Output Current (mA) Input Voltage (V) Dropout Voltage (V) 100 Ground Pin Current vs. Output Current Ground Pin Current vs. Input Voltage 1.20 0.95 50 Ambient Temperature (°C) 1.8 1.7 VIN = 3.3V Tj = 25°C 1.6 1.5 0.7 1.4 0.6 0.0 -50 0 50 100 Ambient Temperature (°C) 10 0.5 1.0 1.5 2.0 2.5 3.0 Output Current (A) REV. 1.0.8 3/22/04 FAN1539/FAN1540 Applications Information General Circuit Description The FAN1539/FAN1540 is an advanced low dropout voltage regulator, specially designed for applications in portable computers, where high performance and low quiescent current is required. The device has an internal trimmed bandgap voltage reference and an internal output voltage sense divider. These two signals form the input to the error amplifier which regulates the output voltage. The FAN1539/FAN1540 has a complete set of internal protection circuitry including thermal shutdown, short circuit current limit and electrostatic discharge protection. Low ESR ceramic capacitors are needed for input as well as output pins to maintain the circuit stability. Short Circuit Current Limit The device has internal over-current limit and short circuit protection. Under over-current conditions the device current is determined by the current limit threshold. Once the device is released from short circuit conditions, the normal level of current limit is gradually re-established as the device output voltage reaches normal levels. Special circuitry has been added to ensure that recovery from short circuit current conditions does not lead to excessive overshoot of the output voltage -- a phenomenon often encountered in conventional regulators. Thermal Protection The FAN1539/FAN1540 is designed to supply at least 1A/ 1.3A output currents. Excessive output load at high input output voltage difference will cause the device temperature to increase and exceed maximum ratings due to power dissipation. During output overload conditions, when the die temperature exceeds the shutdown limit temperature of 160°C, an onboard thermal protection will disable the output until the temperature drops approximately 15°C below the limit, at which point the output is re-enabled. Thermal Characteristics The FAN1539/FAN1540 is designed to supply at least 1A/ 1.3A at the specified output voltage with an operating die (junction) temperature of up to 125°C. Once the power dissipation and thermal resistance is known, the maximum junction temperature of the device can be calculated. While the power dissipation is calculated from known electrical parameters, the actual thermal resistance depends on the thermal characteristics of the chosen package and the surrounding PC board copper to which it is mounted. 11 PRODUCT SPECIFICATION The power dissipation is equal to the product of the input-tooutput voltage differential and the output current plus the ground current multiplied by the input voltage, or: P D = ( V IN – V OUT )I OUT + V IN I GND The ground pin current, IGND can be found in the charts provided in the “Electrical Characteristics” section. The relationship describing the thermal behavior of the package is: T J ( max ) – T A - P D ( max ) = ----------------------------θ JA where TJ(max) is the maximum allowable junction temperature of the die, which is 150°C, and TA is the ambient operating temperature. θJA is dependent on the surrounding PC board layout and can be empirically obtained. While the θJC (junction-to-case) of the 6-lead MLP package is specified at 8°C /W, the θJA for a minimum PWB footprint will be in substantially higher. This can be improved upon by providing a heat sink of surrounding copper ground on the PWB. Depending on the size of the copper area, and the thickness of the copper layer, the resulting θJA can vary over a wide range. The addition of backside copper with through-holes, stiffeners, and other enhancements can also aid in reducing thermal resistance. Thermal simulations performed on a thermally optimized board layout indicate that θJA as low as 20°C /W can be achieved. For example, the heat contributed by the dissipation of other devices located nearby must be included in the design considerations. Overload conditions also need to be considered. It is possible for the device to enter a thermal cycling loop, in which the circuit enters a shutdown condition, cools, re-enables, and then again overheats and shuts down repeatedly due to a persistent fault condition. Capacitor ESR and Printed Circuit Board Layout The FAN1539/FAN1540 has been optimized to accommodate low ESR bypass capacitors down to 0 mΩ. For best results it is important to place both input and output bypass capacitors as near to the input and output pins as possible. Use of X7R types such as Murata’s GRM31CR70J106KA01B (10µF) and GRM43ER71A226KE01B (22µF) or similar component from TDK. The capacitors should connect directly to the ground plane. Use of ground plane on the top and the bottom side of the PCB is recommended. As many via as possible should be used to minimize ground plane resistance. REV. 1.0.8 3/22/04 PRODUCT SPECIFICATION FAN1539/FAN1540 Mechanical Dimensions 5x6mm 8-Lead MLP REV. 1.0.8 3/22/04 12 PRODUCT SPECIFICATION FAN1539/FAN1540 Mechanical Dimensions 3x3mm 6-Lead MLP REV. 1.0.8 3/22/04 13 PRODUCT SPECIFICATION FAN1539/FAN1540 Mechanical Dimensions 3-Lead TO-252 REV. 1.0.8 3/22/04 14 FAN1539/FAN1540 PRODUCT SPECIFICATION Ordering Information Product Number Output Voltage Package FAN1540MMPX 3.3V 5x6mm 8-Lead MLP in T&R FAN1539MX 3.3V 3x3mm 6-Lead MLP in T&R FAN1540MX 3.3V 3x3mm 6-Lead MLP in T&R FAN1540DX 3.3V 3-Lead TO-252 in T&R FAN1540D18X 1.8V 3-Lead TO-252 in T&R Tape and Reel Information Quantity Reel Size Width 3000 7" 8mm DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com REV. 1.0.8 3/22/04 2004 Fairchild Semiconductor Corporation