TI SN74HC138N

SN54HC138, SN74HC138
3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
SCLS107E − DECEMBER 1982 − REVISED SEPTEMBER 2003
D Targeted Specifically for High-Speed
D
D
D
D
D
D
D
Memory Decoders and Data-Transmission
Systems
Wide Operating Voltage Range of 2 V to 6 V
Outputs Can Drive Up To 10 LSTTL Loads
Low Power Consumption, 80-μA Max ICC
Typical tpd = 15 ns
±4-mA Output Drive at 5 V
Low Input Current of 1 μA Max
Incorporate Three Enable Inputs to Simplify
Cascading and/or Data Reception
SN54HC138 . . . J OR W PACKAGE
SN74HC138 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
A
B
C
G2A
G2B
G1
Y7
GND
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
Y0
Y1
Y2
Y3
Y4
Y5
Y6
SN54HC138 . . . FK PACKAGE
(TOP VIEW)
C
G2A
NC
G2B
G1
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
Y1
Y2
NC
Y3
Y4
Y7
GND
NC
Y6
Y5
The ’HC138 devices are designed to be used in
high-performance memory-decoding or datarouting applications requiring very short
propagation delay times. In high-performance
memory systems, these decoders can be used to
minimize the effects of system decoding. When
employed with high-speed memories utilizing a
fast enable circuit, the delay times of these
decoders and the enable time of the memory are
usually less than the typical access time of the
memory. This means that the effective system
delay introduced by the decoders is negligible.
B
A
NC
VCC
Y0
description/ordering information
NC − No internal connection
ORDERING INFORMATION
PACKAGE†
TA
PDIP − N
SN74HC138N
Tube of 40
SN74HC138D
Reel of 2500
SN74HC138DR
Reel of 250
SN74HC138DT
SOP − NS
Reel of 2000
SN74HC138NSR
HC138
SSOP − DB
Reel of 2000
SN74HC138DBR
HC138
Tube of 90
SN74HC138PW
Reel of 2000
SN74HC138PWR
Reel of 250
SN74HC138PWT
CDIP − J
Tube of 25
SNJ54HC138J
SNJ54HC138J
CFP − W
Tube of 150
SNJ54HC138W
SNJ54HC138W
LCCC − FK
Tube of 55
SNJ54HC138FK
SNJ54HC138FK
TSSOP − PW
−55°C
55 C to 125
125°C
C
†
TOP-SIDE
MARKING
Tube of 25
SOIC − D
−40°C
40 C to 85°C
85 C
ORDERABLE
PART NUMBER
SN74HC138N
HC138
HC138
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54HC138, SN74HC138
3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
SCLS107E − DECEMBER 1982 − REVISED SEPTEMBER 2003
description/ordering information (continued)
The conditions at the binary-select inputs at the three enable inputs select one of eight output lines. Two
active-low and one active-high enable inputs reduce the need for external gates or inverters when expanding.
A 24-line decoder can be implemented without external inverters, and a 32-line decoder requires only one
inverter. An enable input can be used as a data input for demultiplexing applications.
FUNCTION TABLE
INPUTS
ENABLE
2
OUTPUTS
SELECT
G1
G2A
G2B
C
B
A
Y0
Y1
Y2
Y3
Y4
Y5
Y6
Y7
X
H
X
X
X
X
H
H
H
H
H
H
H
H
X
X
H
X
X
X
H
H
H
H
H
H
H
H
L
X
X
X
X
X
H
H
H
H
H
H
H
H
H
L
L
L
L
L
L
H
H
H
H
H
H
H
H
L
L
L
L
H
H
L
H
H
H
H
H
H
H
L
L
L
H
L
H
H
L
H
H
H
H
H
H
L
L
L
H
H
H
H
H
L
H
H
H
H
H
L
L
H
L
L
H
H
H
H
L
H
H
H
H
L
L
H
L
H
H
H
H
H
H
L
H
H
H
L
L
H
H
L
H
H
H
H
H
H
L
H
H
L
L
H
H
H
H
H
H
H
H
H
H
L
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54HC138, SN74HC138
3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
SCLS107E − DECEMBER 1982 − REVISED SEPTEMBER 2003
logic diagram (positive logic)
15
A
B
C
1
14
Y1
2
13
3
12
11
10
G1
Y0
6
Y2
Y3
Y4
Y5
9
Y6
G2A
4
7
G2B
Y7
5
Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN54HC138, SN74HC138
3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
SCLS107E − DECEMBER 1982 − REVISED SEPTEMBER 2003
recommended operating conditions (see Note 3)
SN54HC138
VCC
Supply voltage
VCC = 2 V
VIH
VCC = 4.5 V
High-level
High
level input voltage
VCC = 6 V
MIN
NOM
MAX
2
5
6
Input voltage
VO
Output voltage
TA
5
6
3.15
4.2
0
0
Input transition rise/fall time
2
4.2
VCC = 2 V
Δt/Δv
MAX
3.15
VCC = 6 V
VI
NOM
1.5
VCC = 4.5 V
Low-level
Low
level input voltage
MIN
1.5
VCC = 2 V
VIL
SN74HC138
0.5
1.35
1.35
1.8
1.8
0
VCC
0
V
VCC
V
1000
VCC = 4.5 V
500
500
VCC = 6 V
400
400
−55
125
−40
V
VCC
1000
Operating free-air temperature
V
V
0.5
VCC
UNIT
85
ns
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
VOH
TEST CONDITIONS
4
MIN
1.998
1.9
1.9
4.499
4.4
4.4
6V
5.9
5.999
5.9
5.9
IOH = −4 mA
4.5 V
3.98
4.3
3.7
3.84
6V
5.48
5.8
5.2
5.34
IOL = 5.2 mA
Ci
MAX
4.4
IOL = 4 mA
VI = VCC or 0,
MIN
1.9
VI = VIH or VIL
VI = VCC or 0
MAX
2V
IOL = 20 μA
ICC
TYP
SN74HC138
4.5 V
VI = VIH or VIL
II
MIN
SN54HC138
IOH = −20
20 μA
IOH = −5.2 mA
VOL
TA = 25°C
VCC
IO = 0
MAX
UNIT
V
2V
0.002
0.1
0.1
0.1
4.5 V
0.001
0.1
0.1
0.1
6V
0.001
0.1
0.1
0.1
4.5 V
0.17
0.26
0.4
0.33
6V
0.15
0.26
0.4
0.33
6V
±0.1
±100
±1000
±1000
nA
8
160
80
μA
10
10
10
pF
6V
2 V to 6 V
POST OFFICE BOX 655303
3
• DALLAS, TEXAS 75265
V
SN54HC138, SN74HC138
3-LINE TO 8-LINE DECODERS/DEMULTIPLEXERS
SCLS107E − DECEMBER 1982 − REVISED SEPTEMBER 2003
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC
A, B, or C
Any Y
tpd
Enable
Any Y
tt
Any
y
TA = 25°C
MIN
SN54HC138
MIN
SN74HC138
TYP
MAX
MAX
MIN
MAX
2V
67
180
270
225
4.5 V
18
36
54
45
6V
15
31
46
38
2V
66
155
235
195
4.5 V
18
31
47
39
6V
15
26
40
33
2V
38
75
110
95
4.5 V
8
15
22
19
6V
6
13
19
16
UNIT
ns
ns
operating characteristics, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
No load
TYP
UNIT
85
pF
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
VCC
Test
Point
Input
50%
50%
0V
CL = 50 pF
(see Note A)
tPLH
In-Phase
Output
LOAD CIRCUIT
50%
10%
tPHL
90%
90%
tr
Input
50%
10%
90%
90%
tr
tPHL
VCC
50%
10% 0 V
Out-of-Phase
Output
90%
tf
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
VOH
50%
10%
VOL
tf
tPLH
50%
10%
tf
50%
10%
90%
VOH
VOL
tr
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. The outputs are measured one at a time with one input transition per measurement.
D. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
27-May-2010
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
5962-8406201VEA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
Purchase Samples
5962-8406201VFA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
Purchase Samples
POST-PLATE N / A for Pkg Type
Purchase Samples
84062012A
ACTIVE
LCCC
FK
20
1
TBD
8406201EA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
Purchase Samples
8406201FA
ACTIVE
CFP
W
16
1
TBD
A42
N / A for Pkg Type
Purchase Samples
JM38510/65802B2A
ACTIVE
LCCC
FK
20
1
TBD
JM38510/65802BEA
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
Contact TI Distributor
or Sales Office
SN54HC138J
ACTIVE
CDIP
J
16
1
TBD
A42
N / A for Pkg Type
Contact TI Distributor
or Sales Office
SN74HC138D
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74HC138DBR
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SN74HC138DBRE4
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SN74HC138DBRG4
ACTIVE
SSOP
DB
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SN74HC138DE4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74HC138DG4
ACTIVE
SOIC
D
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74HC138DR
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SN74HC138DRE4
ACTIVE
SOIC
D
16
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SN74HC138DRG3
PREVIEW
SOIC
D
16
2500
TBD
SN74HC138DRG4
ACTIVE
SOIC
D
16
2500
SN74HC138DT
ACTIVE
SOIC
D
16
250
POST-PLATE N / A for Pkg Type
Call TI
Samples Not Available
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
Addendum-Page 1
Call TI
Contact TI Distributor
or Sales Office
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
27-May-2010
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
SN74HC138DTE4
ACTIVE
SOIC
D
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74HC138DTG4
ACTIVE
SOIC
D
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
SN74HC138N
ACTIVE
PDIP
N
16
25
Pb-Free (RoHS)
SN74HC138N3
OBSOLETE
PDIP
N
16
SN74HC138NE4
ACTIVE
PDIP
N
16
25
Pb-Free (RoHS)
TBD
SN74HC138NSR
ACTIVE
SO
NS
16
2000
SN74HC138NSRG4
ACTIVE
SO
NS
16
SN74HC138PW
ACTIVE
TSSOP
PW
SN74HC138PWE4
ACTIVE
TSSOP
SN74HC138PWG4
ACTIVE
SN74HC138PWLE
SN74HC138PWR
CU NIPDAU N / A for Pkg Type
Call TI
Call TI
Contact TI Distributor
or Sales Office
Samples Not Available
CU NIPDAU N / A for Pkg Type
Contact TI Distributor
or Sales Office
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
TSSOP
PW
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Purchase Samples
OBSOLETE
TSSOP
PW
16
Call TI
Samples Not Available
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SN74HC138PWRE4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SN74HC138PWRG4
ACTIVE
TSSOP
PW
16
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SN74HC138PWT
ACTIVE
TSSOP
PW
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SN74HC138PWTE4
ACTIVE
TSSOP
PW
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SN74HC138PWTG4
ACTIVE
TSSOP
PW
16
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
SNJ54HC138FK
ACTIVE
LCCC
FK
20
1
TBD
SNJ54HC138J
ACTIVE
CDIP
J
16
1
TBD
TBD
Addendum-Page 2
Call TI
POST-PLATE N / A for Pkg Type
A42
N / A for Pkg Type
Contact TI Distributor
or Sales Office
Contact TI Distributor
or Sales Office
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
SNJ54HC138W
27-May-2010
Status
(1)
Package Type Package
Drawing
ACTIVE
CFP
W
Pins
16
Package Qty
Eco Plan
1
TBD
(2)
Lead/
Ball Finish
A42
MSL Peak Temp
(3)
Samples
(Requires Login)
N / A for Pkg Type
Contact TI Distributor
or Sales Office
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC138, SN54HC138-SP, SN74HC138 :
• Catalog: SN74HC138, SN54HC138
• Automotive: SN74HC138-Q1, SN74HC138-Q1
• Military: SN54HC138
• Space: SN54HC138-SP
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
27-May-2010
NOTE: Qualified Version Definitions:
• Catalog - TI's standard catalog product
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Military - QML certified for Military and Defense Applications
• Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Aug-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SN74HC138DBR
SSOP
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
12.0
16.0
Q1
DB
16
2000
330.0
16.4
8.2
6.6
2.5
SN74HC138DR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
SN74HC138NSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
SN74HC138PWR
TSSOP
PW
16
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
SN74HC138PWT
TSSOP
PW
16
250
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
6-Aug-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74HC138DBR
SSOP
DB
16
2000
346.0
346.0
33.0
SN74HC138DR
SOIC
D
16
2500
333.2
345.9
28.6
SN74HC138NSR
SO
NS
16
2000
346.0
346.0
33.0
SN74HC138PWR
TSSOP
PW
16
2000
346.0
346.0
29.0
SN74HC138PWT
TSSOP
PW
16
250
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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