SLVS238E − AUGUST 1999 − REVISED SEPTEMBER 2004 D Single Supply or Dual Supplies D Wide Range of Supply Voltage DBV PACKAGE (TOP VIEW) . . . 2 V to 36 V IN− VCC−/GND IN+ D Low Supply-Current Drain Independent of D D D D D D Supply Voltage . . . 0.4 mA Typ Low Input Bias Current . . . 25 nA Typ Low Input Offset Voltage . . . 2 mV Typ Common-Mode Input Voltage Range Includes Ground Differential Input Voltage Range Equal to Maximum-Rated Supply Voltage . . . ±36 V Low Output Saturation Voltage Output Compatible With TTL, MOS, and CMOS 1 5 VCC 4 OUT 2 3 description/ordering information This device consists of a single voltage comparator that is designed to operate from a single power supply over a wide range of voltages. Operation from dual supplies also is possible if the difference between the two supplies is 2 V to 36 V and VCC is at least 1.5 V more positive than the input common-mode voltage. Current drain is independent of the supply voltage. The output can be connected to other open-collector outputs to achieve wired-AND relationships. ORDERING INFORMATION TA VIO(max) at 25°C −40°C to 85°C 5 mV PACKAGE† SOT-23 (DBV) ORDERABLE PART NUMBER Reel of 3000 TL331IDBVR Reel of 250 TL331IDBVT TOP-SIDE MARKING‡ T1I_ † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. ‡ DBV: The actual top-side marking has one additional character that designates the assembly/test site. logic diagram IN+ IN− OUT Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated !" #$ # % & ## '($ # ) # "( "# ) "" $ POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SLVS238E − AUGUST 1999 − REVISED SEPTEMBER 2004 schematic VCC 80-µA Current Regulator 10 µA 60 µA 10 µA IN+ 80 µA COMPONENT COUNT OUT Epi-FET Diodes Resistors Transistors 1 2 1 20 IN− GND Current values shown are nominal. absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 V Differential input voltage, VID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±36 V Input voltage range, VI (either input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 36 V Output voltage, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 V Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Duration of output short-circuit to ground (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited Package thermal impedance, θJA (see Notes 4 and 5) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 206°C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential voltages, are with respect to the network ground. 2. Differential voltages are at IN+ with respect to IN−. 3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction. 4. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can impact reliability. 5. The package thermal impedance is calculated in accordance with JESD 51-7. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SLVS238E − AUGUST 1999 − REVISED SEPTEMBER 2004 electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted) PARAMETER TEST CONDITIONS TA† MIN 25°C VIO Input offset voltage VCC = 5 V to 30 V, VO = 1.4 V, VIC = VIC(min) −40°C to 85°C IIO Input offset current VO = 1.4 V −40°C to 85°C IIB Input bias current VO = 1.4 V VICR Common-mode input voltage range‡ MAX 2 5 9 25°C 5 −25 −40°C to 85°C AVD Large-signal differential voltage amplification VCC = 15 V, VO = 1.4 V to 11.4 V, RL ≥ 15 kΩ to VCC IOH High-level output current VOH = 5 V, VOH = 30 V, VID = 1 V VID = 1 V 0 to VCC − 1.5 −40°C to 85°C 0 to VCC − 1.5 25°C 50 25°C VOL Low-level output voltage IOL = 4 mA, VID = −1 V IOL ICC Low-level output current VOL = 1.5 V, RL = ∞, VID = 1 V VCC = 5 V 200 V/mV 50 nA 1 µA 150 400 700 6 25°C nA 0.1 −40°C to 85°C 25°C nA V −40°C to 85°C 25°C mV −250 −400 25°C UNIT 50 250 25°C Supply current TYP mV mA 0.4 0.7 mA † All characteristics are measured with zero common-mode input voltage, unless otherwise specified. ‡ The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-mode voltage range is VCC+ − 1.5 V, but either or both inputs can go to 30 V without damage. switching characteristics, VCC = 5 V, TA = 25°C PARAMETER Response time TEST CONDITIONS RL connected to 5 V through 5.1 kΩ, CL = 15 pF§ (see Note 6) TYP 100-mV input step with 5-mV overdrive 1.3 TTL-level input step 0.3 UNIT µs § CL includes probe and jig capacitance. NOTE 6: The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 PACKAGE OPTION ADDENDUM www.ti.com 27-Feb-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TL331IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL331IDBVRE4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL331IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL331IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL331IDBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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