MICROCHIP TCM810

TCM809/TCM810
3-Pin Microcontroller Reset Monitors
Features
General Description
• Precision VDD Monitor for 2.5V, 3.0V, 3.3V, 5.0V
Nominal System Voltage Supplies
• 140 msec Minimum RESET Time-Out Period
• RESET Output to VDD = 1.0V (TCM809)
• Low Supply Current, 9 µA (typ.)
• VDD Transient Immunity
• Small 3-Pin SC-70 and SOT-23B Packages
• No External Components
• Push-Pull RESET Output
• Temperature Ranges:
- Industrial: SC-70 (E): -40°C to +85°C
- Extended: SOT-23, SC-70 (V): -40°C to +125°C
The TCM809 and TCM810 are cost-effective system
supervisor circuits designed to monitor VDD in digital
systems; providing a reset signal to the host processor,
when necessary. No external components are
required.
Applications
•
•
•
•
•
Computers
Embedded Systems
Battery-powered Equipment
Critical Microcontroller Power Supply Monitoring
Automotive
The RESET output is typically driven active within
65 µsec of VDD falling through the reset voltage threshold. RESET is maintained active for a minimum of
140 msec after VDD rises above the reset threshold.
The TCM810 has an active-high RESET output, while
the TCM809 has an active-low RESET output. The
output of the TCM809/TCM810 is valid down to
VDD = 1V. Both devices are available in 3-Pin SC-70
and SOT-23B packages.
The TCM809/TCM810 are optimized to reject fast
transient glitches on the VDD line. A low supply current
of 9 µA (typ., VDD = 3.3V) make these devices suitable
for battery-powered applications.
Pin Configurations
SOT-23B/SC-70
Typical Application Circuit
VDD
3
VDD
PICmicro®
Microcontroller
TCM809
RESET
TCM809/
TCM810
GND 1
VDD
2
GND
1
© 2005 Microchip Technology Inc.
RESET
INPUT
(Active-Low)
GND
TCM809 RESET
TCM810 (RESET)
3
VDD
2
Note: 3-Pin SOT-23B is equivalent to
JEDEC TO-236.
DS21661D-page 1
TCM809/TCM810
1.0
ELECTRICAL
CHARACTERISTICS
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
Absolute Maximum Ratings†
Supply Voltage (VDD to GND) ........................................................6.0V
RESET, RESET ................................................... -0.3V to (VDD +0.3V)
Input Current, VDD .......................................................................20 mA
Output Current, RESET, RESET.................................................20 mA
dV/dt (VDD)........................................................................... 100V/µsec
Operating Temperature Range ...................................-40°C to +125°C
Power Dissipation (TA = 70°C):
3-Pin SOT-23B (derate 4 mW/°C above +70°C) ....................320 mW
3-Pin SC-70 (derate 2.17 mW/°C above +70°C)....................174 mW
Storage Temperature Range .......................................-65°C to +150°C
Maximum Junction Temperature, TJ............................................ 150°C
ELECTRICAL CHARACTERISTICS
VDD = Full Range, TA = Operating Temperature Range, unless otherwise noted. Typical values are at TA = +25°C,
VDD = 5V for L/M/J, 3.3V for T/S, 3.0V for R and 2.5V for Z (Note 1).
Parameter
Sym
VDD Range
Min
Typ
Max
Units
1.0
—
5.5
V
1.2
—
5.5
12
30
Supply Current
ICC
—
—
9
25
Reset Threshold (Note 2)
VTH
4.56
4.63
4.70
4.50
—
4.75
4.31
4.38
4.25
3.93
3.89
3.04
Reset Threshold Tempco
VDD to Reset Delay,
Reset Active Time Out
Period
RESET Output Voltage
Low (TCM809)
VOL
RESET Output Voltage
High (TCM809)
VOH
RESET Output Voltage
Low (TCM810)
VOL
RESET Output Voltage
High (TCM810)
VOH
Test Conditions
TA = 0°C to +70°C
TA = – 40°C to +125°C
µA
TCM8xxL/M/J:
TCM8xxR/S/T/Z:
VDD < 3.6V
V
TCM8xxL:
TA = +25°C
4.45
V
TCM8xxM:
—
4.50
V
4.00
4.06
V
—
4.10
V
3.08
3.11
V
3.00
—
3.15
V
2.89
2.93
2.96
V
2.85
—
3.00
V
2.59
2.63
2.66
V
2.55
—
2.70
V
2.28
2.32
2.35
V
2.25
—
2.38
V
—
30
—
ppm/°C
TA = – 40°C to +125°C
—
65
—
µsec
140
320
560
msec
—
—
0.3
V
—
—
0.4
—
—
0.3
0.8 VDD
—
—
VDD – 1.5
—
—
—
—
0.3
—
—
0.4
0.8 VDD
—
—
VDD < 5.5V
TA = +25°C
TA = – 40°C to +125°C
TCM809J:
TA = +25°C
TA = – 40°C to +125°C
TA = +25°C
TCM8xxT:
TA = – 40°C to +125°C
TA = +25°C
TCM8xxS:
TA = – 40°C to +125°C
TCM8xxR:
TA = +25°C
TA = – 40°C to +125°C
TA = +25°C
TCM8xxZ:
TA = – 40°C to +125°C
VDD = VTH to (VTH – 100 mV) (Note 2)
TCM809R/S/T/Z:
VDD = VTH min, ISINK = 1.2 mA
TCM809L/M/J:
VDD = VTH min, ISINK = 3.2 mA
VDD > 1.0V, ISINK = 50 µA
V
TCM809R/S/T/Z: VDD > VTH max, ISOURCE = 500 µA
TCM809L/M/J: VDD > VTH max, ISOURCE = 800 µA
V
TCM810R/S/T/Z:VDD = VTH max, ISINK = 1.2 mA
V
1.8 < VDD < VTH min, ISOURCE = 150 µA
TCM810L/M:
VDD = VTH max, ISINK = 3.2 mA
Note 1: Production testing done at TA = +25°C, overtemperature limits ensured by QC screen.
2: RESET output for TCM809, RESET output for TCM810.
DS21661D-page 2
© 2005 Microchip Technology Inc.
TCM809/TCM810
2.0
TYPICAL PERFORMANCE CHARACTERISTICS
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
18
TCM8xx/R/S/T/Z, No Load
450
16
VDD = 5V
400
Power-up Reset Timeout (µsec)
Supply Current ( µA)
14
12
10
VDD = 3V
8
6
4
VDD = 1V
2
350
300
250
200
150
100
50
0
-40
-20
0
20
40
60
80
100
0
120
-40
Temperature (°C)
FIGURE 2-1:
Temperature.
-20
0
20
FIGURE 2-3:
vs. Temperature.
Supply Current vs.
16
40
60
Temperature (°C)
80
100
120
Power-up Reset Time Out
1.001
TCM8xx/L/M/J, No Load
14
Normalized Reset Threshold
VDD = 5V
Supply Current ( µA)
12
10
VDD = 3V
8
6
VDD = 1V
4
1
0.999
0.998
2
0
0.997
-40
-20
0
20
40
60
80
100
Temperature (°C)
FIGURE 2-2:
Temperature.
Supply Current vs.
© 2005 Microchip Technology Inc.
120
-40
-20
0
20
40
60
80
100
120
Temperature (°C)
FIGURE 2-4:
Normalized Reset
Threshold vs. Temperature.
DS21661D-page 3
TCM809/TCM810
3.0
PIN DESCRIPTIONS
The descriptions of the pins are given in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
NAME
GND
FUNCTION
Ground
RESET (TCM809) RESET push-pull output
RESET (TCM810) RESET push-pull output
VDD
3.1
Supply voltage (+2.5V, +3.0V,
+3.3V, +5.0V).
Ground (GND)
Ground terminal.
3.2
RESET Output (TCM809)
The RESET push-pull output remains low while VDD is
below the reset voltage threshold, and for 240 msec
(140 msec min.) after VDD rises above reset threshold.
3.3
RESET Output (TCM810)
The RESET push-pull output remains high while VDD is
below the reset voltage threshold, and for 240 msec
(140 msec min.) after VDD rises above reset threshold.
3.4
Supply Voltage (VDD)
VDD: +2.5V, +3.0V, +3.3V and +5.0V
DS21661D-page 4
© 2005 Microchip Technology Inc.
TCM809/TCM810
4.0
APPLICATIONS INFORMATION
4.1
VDD Transient Rejection
The TCM809/TCM810 provides accurate VDD monitoring and reset timing during power-up, power-down and
brown-out/sag conditions. These devices also reject
negative-going transients (glitches) on the power
supply line. Figure 4-1 shows the maximum transient
duration vs. maximum negative excursion (overdrive)
for glitch rejection. Any combination of duration and
overdrive that lies under the curve will not generate a
reset signal.
VDD
VTH
Overdrive
Maximum Transient Duration (µsec)
Duration
400
TA = +25°C
Combinations above the curve are detected as a
brown-out or power-down condition. Transient
immunity can be improved by adding a capacitor in
close proximity to the VDD pin of the TCM809/TCM810.
4.2
RESET Signal Integrity During
Power-Down
The TCM809 RESET output is valid to VDD = 1.0V.
Below this voltage the output becomes an "open circuit" and does not sink current. This means CMOS
logic inputs to the microcontroller will be floating at an
undetermined voltage. Most digital systems are
completely shut down well above this voltage.
However, in situations where RESET must be maintained valid to VDD = 0V, a pull-down resistor must be
connected from RESET to ground to discharge stray
capacitances and hold the output low (Figure 4-2). This
resistor value, though not critical, should be chosen
such that it does not appreciably load RESET under
normal operation (100 kΩ will be suitable for most
applications). Similarly, a pull-up resistor to VDD is
required for the TCM810 to ensure a valid high RESET
for VDD below 1.0V.
320
VDD
240
160
VDD
TCM8XXL/M/J (SOT-23)
80
0
TCM809
TCM8XXZ/R/S/T
(SOT-23)
1
RESET
5
1000
100
Reset Comparator Overdrive
[VTH – VDD] (mv)
GND
R1
100 kΩ
VDD to Reset Delay (µsec)
130
120
FIGURE 4-2:
The addition of R1 at the
RESET output of the TCM809 ensures that the
RESET output is valid to VDD = 0V.
TCM8XXL/M/J (SC-70)
110
100
90
80
70
60
50
TCM8XXZ/R/S/T (SC-70)
40
30
1
10
100
1000
Reset Comparator Overdrive (mV)
[VTH – VDD] (mv)
FIGURE 4-1:
Maximum Transient
Duration vs. Overdrive for Glitch Rejection at
+25°C.
© 2005 Microchip Technology Inc.
DS21661D-page 5
TCM809/TCM810
4.3
Controllers and Processors With
Bidirectional I/O Pins
Some microcontrollers have bidirectional reset pins.
Depending on the current drive capability of the controller pin, an indeterminate logic level may result if there
is a logic conflict. This can be avoided by adding a
4.7 kΩ resistor in series with the output of the TCM809/
TCM810 (Figure 4-3). If there are other components in
the system that require a reset signal, they should be
buffered so as not to load the reset line. If the other
components are required to follow the reset I/O of the
microcontroller, the buffer should be connected as
shown with the solid line.
Buffer
Buffered RESET
To Other System
Components
VDD
TCM809
4.7 kΩ
RESET
GND
PICmicro®
Microcontroller
RESET
GND
FIGURE 4-3:
Interfacing the TCM809 to a
Bidirectional RESET I/O.
DS21661D-page 6
© 2005 Microchip Technology Inc.
TCM809/TCM810
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
Example:
3-Pin SOT-23B
Customer Specific Information Codes for:
TCM8xx =
Part Number
XXNN
TCM8xxL
TCM8xxM
TCM8xxT
TCM8xxS
TCM8xxR
TCM8xxJ
TCM8xxZ
3-Pin SC-70
ENB
VNB
ENB
VNB
ENB
VNB
ENB
VNB
ENB
VNB
ENB
VNB
ENB
TCM809 TCM810
J1
JZ
J2
JY
J3
JX
J4
JV
J5
JU
J6
JT
J7
K1
KZ
K2
KY
K3
KX
K4
KV
K5
KU
—
KS
K6
Example:
Customer Specific Information Codes for:
TCM8xx =
XXN
YWW
Part Number
TCM8xxL
Bottom Side
Top Side
TCM8xxM
TCM8xxT
OR
TCM8xxS
TCM8xxR
XXNN
TCM8xxJ
TCM8xxZ
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
ELB
VLB
ELB
VLB
ELB
VLB
ELB
VLB
ELB
VLB
ELB
VLB
ELB
VLB
TCM809 TCM810
J1
JZ
J2
JY
J3
JX
J4
JV
J5
JU
J6
JT
J7
JS
—
KZ
—
KY
—
KX
—
KV
—
KU
—
KS
—
KT
Customer-specific information*
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2005 Microchip Technology Inc.
DS21661D-page 7
TCM809/TCM810
3-Lead Plastic Small Outline Transistor (NB) (SOT-23)
E
E1
2
B
p1
n
D
p
1
α
c
A
φ
β
A1
L
Units
Dimension Limits
n
Number of Pins
p
Pitch
p1
Outside lead pitch (basic)
Overall Height
A
Molded Package Thickness
A2
Standoff §
A1
Overall Width
E
Molded Package Width
E1
Overall Length
D
Foot Length
L
φ
Foot Angle
c
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A2
B
α
β
MIN
.035
.035
.000
.083
.047
.110
.014
0
.004
.015
0
0
INCHES*
NOM
3
.038
.076
.040
.037
.002
.093
.051
.115
.018
5
.006
.017
5
5
MAX
.044
.040
.004
.104
.055
.120
.022
10
.007
.020
10
10
MILLIMETERS
NOM
3
0.96
1.92
0.89
1.01
0.88
0.95
0.01
0.06
2.10
2.37
1.20
1.30
2.80
2.92
0.35
0.45
0
5
0.09
0.14
0.37
0.44
0
5
0
5
MIN
MAX
1.12
1.02
0.10
2.64
1.40
3.04
0.55
10
0.18
0.51
10
10
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-236
Drawing No. C04-104
DS21661D-page 8
© 2005 Microchip Technology Inc.
TCM809/TCM810
3-Lead Plastic Small Outline Transistor (LB) (SC-70)
E
E1
2
B
p1
3
D
p
1
a
A2
A
c
b
A1
L
Units
Dimension Limits
Number of Pins
Pitch
Outside lead pitch (basic)
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
p
p1
A
A2
A1
E
E1
D
L
c
B
a
b
INCHES
MIN
3
.026 BSC.
.051 BSC.
.031
.031
.000
.071
.045
.071
.004
.003
.006
8°
8°
MAX
.043
.039
.0004
.094
.053
.089
.016
.010
.016
12°
12°
MILLIMETERS*
MIN
MAX
3
0.65 BSC.
1.30 BSC.
0.80
1.10
0.80
1.00
0.00
.010
1.80
2.40
1.15
1.35
1.80
2.25
0.10
0.41
0.08
0.25
0.15
0.40
8°
12°
8°
12°
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .005" (0.127mm) per side.
JEITA (EIAJ) Equivalent: SC70
Drawing No. C04-104
© 2005 Microchip Technology Inc.
DS21661D-page 9
TCM809/TCM810
5.2
Product Tape and Reel Specifications
FIGURE 5-1:
EMBOSSED CARRIER DIMENSIONS (8, 12, 16 AND 24 MM TAPE ONLY)
Top
Cover
Tape
A0
W
B0
K0
P
TABLE 1:
CARRIER TAPE/CAVITY DIMENSIONS
Case
Outline
Carrier
Dimensions
Package
Type
W
mm
Cavity
Dimensions
P
mm
A0
mm
B0
mm
K0
mm
Output
Quantity
Units
Reel
Diameter in
mm
NB
SOT-23
3L
8
4
3.15
2.77
1.22
3000
180
LB
SC-70
3L
8
4
2.4
2.4
1.19
3000
180
3-LEAD SOT-23/SC70 DEVICE TAPE AND REEL SPECIFICATIONS
Device
Marking
FIGURE 5-2:
User Direction of Feed
Device
Marking
Pin 1
W, Width
of Carrier
Tape
Pin 1
P, Pitch
Standard Reel Component Orientation
DS21661D-page 10
Reverse Reel Component Orientation
© 2005 Microchip Technology Inc.
TCM809/TCM810
APPENDIX A:
REVISION HISTORY
Revision D (March 2005)
• Updated 6.0 “Packaging Information” to include
old and new packaging examples.
• Applied new template and rearranged sections to
be consistent with current documentation.
Revision C (April 2004)
Revision B (January 2002)
Revision A (May 2001)
Initial release of data sheet.
© 2005 Microchip Technology Inc.
DS21661D-page 11
TCM809/TCM810
NOTES:
DS21661D-page 12
© 2005 Microchip Technology Inc.
TCM809/TCM810
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
X
XXXXX
Device
VDD
Temperature
Range
Package
Reset
Threshold
Device:
TCM809: Supervisor circuit with active-low RESET output
TCM810: Supervisor circuit with active-high RESET output
VDD Reset Threshold:
L
M
J
T
S
R
Z
=
=
=
=
=
=
=
Temperature Range:
E
V
= -40°C to +85°C
= -40°C to +125°C
Package:
NB713 = SOT-23B, 3-pin (Tape and Reel)
LB713 = SC-70, 3-pin (Tape and Reel)
4.63V
4.38V
4.00V
3.08V
2.93V
2.63V
2.32V
Examples:
a)
TCM809LENB713:
b)
TCM809LVLB713:
c)
TCM809LVNB713:
a)
TCM810MENB713:
b)
TCM810RVLB713:
c)
TCM810TVLB713:
SOT-23B-3-TR,
Microcontroller 4.63V
Reset Monitor,
-40°C to +85°C,
Tape and Reel.
SC-70-3-TR,
Microcontroller 4.63V
Reset Monitor,
-40°C to +125°C,
Tape and Reel.
SOT-23B-3-TR,
Microcontroller 4.63V
Reset Monitor,
-40°C to +125°C,
Tape and Reel.
SOT-23B-3-TR,
Microcontroller 4.38V
Reset Monitor,
-40°C to +85°C,
Tape and Reel.
SOT-23B-3-TR,
Microcontroller 2.63V
Reset Monitor,
-40°C to +125°C,
Tape and Reel.
SC-70-3-TR,
Microcontroller 4.38V
Reset Monitor,
-40°C to +125°C,
Tape and Reel.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
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© 2005 Microchip Technology Inc.
DS21661D-page 13
TCM809/TCM810
NOTES:
DS21661D-page 14
© 2005 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
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RELATED TO THE INFORMATION, INCLUDING BUT NOT
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AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
PICMASTER, SEEVAL, SmartSensor and The Embedded
Control Solutions Company are registered trademarks of
Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, MPASM, MPLIB, MPLINK,
MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail,
PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance and WiperLock are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2005, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
© 2005 Microchip Technology Inc.
DS21661D-page 15
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://support.microchip.com
Web Address:
www.microchip.com
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
India - Bangalore
Tel: 91-80-2229-0061
Fax: 91-80-2229-0062
China - Beijing
Tel: 86-10-8528-2100
Fax: 86-10-8528-2104
India - New Delhi
Tel: 91-11-5160-8631
Fax: 91-11-5160-8632
Austria - Weis
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark - Ballerup
Tel: 45-4450-2828
Fax: 45-4485-2829
China - Chengdu
Tel: 86-28-8676-6200
Fax: 86-28-8676-6599
Japan - Kanagawa
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
France - Massy
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
China - Fuzhou
Tel: 86-591-8750-3506
Fax: 86-591-8750-3521
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Germany - Ismaning
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Atlanta
Alpharetta, GA
Tel: 770-640-0034
Fax: 770-640-0307
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
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Tel: 630-285-0071
Fax: 630-285-0075
Dallas
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Tel: 972-818-7423
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Kokomo
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Tel: 765-864-8360
Fax: 765-864-8387
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
China - Shunde
Tel: 86-757-2839-5507
Fax: 86-757-2839-5571
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Kaohsiung
Tel: 886-7-536-4818
Fax: 886-7-536-4803
Taiwan - Taipei
Tel: 886-2-2500-6610
Fax: 886-2-2508-0102
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
England - Berkshire
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Taiwan - Hsinchu
Tel: 886-3-572-9526
Fax: 886-3-572-6459
China - Qingdao
Tel: 86-532-502-7355
Fax: 86-532-502-7205
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
San Jose
Mountain View, CA
Tel: 650-215-1444
Fax: 650-961-0286
Toronto
Mississauga, Ontario,
Canada
Tel: 905-673-0699
Fax: 905-673-6509
03/01/05
DS21661D-page 16
© 2005 Microchip Technology Inc.