MICROCHIP TC1272A

TC1272A
3-Pin Reset Monitor
Features
General Description
•
•
•
•
•
•
The TC1272A are cost-effective system supervisor
circuits designed to monitor VDD in digital systems and
provide a reset signal to the host processor, when
necessary. No external components are required.
Precision VDD Monitor
140 msec Minimum RESET, Output Duration
Output Valid to VDD = 1.2V
VDD Transient Immunity
Small 3-Pin SOT-23B Package
No External Components
Applications
•
•
•
•
Computers
Embedded Systems
Battery-Powered Equipment
Critical µP Power Supply Monitoring
The reset output is driven active within 65 µsec (typ.)
of VDD falling through the reset voltage threshold.
RESET is maintained active for a minimum of
140 msec after VDD rises above the reset threshold.
The TC1272A has a complimentary output. The output
of the TC1272A is valid down to VDD = 1.2V. The
device is available in a 3-Pin SOT-23B package.
The TC1272A device is optimized to reject fast
transient glitches on the VDD line.
Package Type
Typical Application Circuit
3-Pin SOT-23B*
VDD
2
VDD
RESET
VDD
1
RESET 1
RESET
Input
TC1272A
Processor
GND
GND
TC1272A 3 GND
VDD
2
3
Note: 3-Pin SOT-23B is equivalent to
JEDEC TO-236.
 2004-2012 Microchip Technology Inc.
DS21877B-page 1
TC1272A
1.0
ELECTRICAL
CHARACTERISTICS
† Notice: Stresses above those listed under “Maximum
ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Absolute Maximum Ratings†
Supply Voltage (VDD to GND) ..........................................6.0V
RESET .................................................. –0.3V to (VDD +0.3V)
PIN FUNCTION TABLE
Input Current, VDD.........................................................20 mA
Output Current, RESET ................................................20 mA
NAME
dV/dt (VDD) ............................................................. 100V/µsec
Operating Temperature Range..................... –40°C to +125°C
Power Dissipation (TA = 70°C):
3-Pin SOT-23B (derate 4 mW/°C above +70°C) ....320 mW
FUNCTION
GND
Ground
RESET
RESET push-pull output remains
low while VDD is below the reset
voltage threshold and for 140 msec
(min.) after VDD rises above reset
threshold
Storage Temperature Range ........................ –65°C to +150°C
Maximum Junction Temperature, TJ .............................. 150°C
VDD
ELECTRICAL CHARACTERISTICS
VDD = Full Range, TA = Operating Temperature Range, unless otherwise noted. Typical values are at TA = +25°C,
VDD = 5V for L/M/J, 3.3V for T/S, 3.0V for R and 2.5V for Z (Note 1).
Parameter
Sym
Min
Typ
Max
Units
1.0
—
5.5
V
1.2
—
5.5
—
12
30
—
9
25
4.56
4.63
4.70
4.50
—
4.75
4.31
4.38
4.45
V
4.25
—
4.50
V
3.93
4.00
4.06
V
3.89
—
4.10
V
3.04
3.08
3.11
V
3.00
—
3.15
V
2.89
2.93
2.96
V
2.85
—
3.00
V
2.59
2.63
2.66
V
2.55
—
2.70
V
2.28
2.32
2.35
V
2.25
—
2.38
V
Reset Threshold Tempco
—
30
—
ppm/°C
VDD to Reset Delay,
—
65
—
µsec
140
320
560
msec
—
—
0.3
V
—
—
0.4
—
—
0.3
0.8 VDD
—
—
VDD – 1.5
—
—
VDD Range
Supply Current
Reset Threshold (Note 2)
ICC
VTH
Reset Active Time Out
Period
RESET Output Voltage
Low
RESET Output Voltage
High
VOL
VOH
Test Conditions
TA = 0°C to +70°C
TA = – 40°C to +125°C
µA
TC1272AL/M/J:
VDD < 5.5V
TC1272AR/S/T/Z: VDD < 3.6V
V
TC1272AL:
TA = +25°C
TA = – 40°C to +125°C
TA = +25°C
TC1272AM:
TA = – 40°C to +125°C
TC1272AJ:
TA = +25°C
TA = – 40°C to +125°C
TA = +25°C
TC1272AT:
TA = – 40°C to +125°C
TA = +25°C
TC1272AS:
TA = – 40°C to +125°C
TC1272AR:
TA = +25°C
TA = – 40°C to +125°C
TA = +25°C
TC1272AZ:
TA = – 40°C to +125°C
VDD = VTH to (VTH – 100 mV) (Note 2)
TC1272AR/S/T/Z: VDD = VTH min, ISINK = 1.2 mA
TC1272AL/M/J:
VDD = VTH min, ISINK = 3.2 mA
VDD > 1.0V, ISINK = 50 µA
V
TC1272AR/S/T/Z: VDD > VTH max,
ISOURCE = 500 µA
TC1272AL/M/J: VDD > VTH max, ISOURCE = 800 µA
Note 1: Production testing done at TA = +25°C, overtemperature limits ensured by QC screen.
2: RESET Output for TC1272A.
DS21877B-page 2
 2004-2012 Microchip Technology Inc.
TC1272A
2.0
TYPICAL PERFORMANCE CHARACTERISTICS
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
18
TC1272A/R/S/T/Z, No Load
450
16
Power-up Reset Timeout (µsec)
VDD = 5V
Supply Current ( µA)
14
12
10
VDD = 3V
8
6
4
VDD = 1V
2
400
350
300
250
200
150
100
50
0
-40
-20
0
20
40
60
80
100
0
120
-40
-20
0
20
Temperature (°C)
FIGURE 2-1:
Temperature.
40
60
80
100
120
Temperature (°C)
FIGURE 2-3:
vs. Temperature.
Supply Current vs.
16
Power-up Reset Time Out
1.001
TC1272A/L/M/J, No Load
VDD = 5V
Normalized Reset Threshold
Supply Current ( µA)
14
12
10
VDD = 3V
8
6
VDD = 1V
4
2
0
1
0.999
0.998
0.997
-40
-20
0
20
40
60
80
100
Temperature (°C)
FIGURE 2-2:
Temperature.
Supply Current vs.
 2004-2012 Microchip Technology Inc.
120
-40
-20
0
20
40
60
80
100
120
Temperature (°C)
FIGURE 2-4:
Normalized Reset
Threshold vs. Temperature.
DS21877B-page 3
TC1272A
3.0
APPLICATIONS INFORMATION
3.1
VDD Transient Rejection
The TC1272A provides accurate VDD monitoring and
reset timing during power-up, power-down and brownout/sag conditions. These devices also reject negativegoing transients (glitches) on the power supply line.
Figure 3-1 shows the maximum transient duration vs.
maximum negative excursion (overdrive) for glitch
rejection. Any combination of duration and overdrive
that lies under the curve will not generate a reset
signal.
VDD
VTH
Overdrive
Maximum Transient Duration (µsec)
Duration
3.2
RESET Signal Integrity During
Power-Down
The TC1272A RESET output is valid to VDD = 1.0V.
Below this voltage, the output becomes an "open circuit" and does not sink current. This means CMOS
logic inputs to the microcontroller will be floating at an
undetermined voltage. Most digital systems are completely shut down well above this voltage. However, in
situations where RESET must be maintained valid to
VDD = 0V, a pull-down resistor must be connected from
RESET to ground to discharge stray capacitances and
hold the output low (Figure 3-2). This resistor value,
though not critical, should be chosen such that it does
not appreciably load RESET under normal operation
(100 k will be suitable for most applications).
400
TA = +25°C
VDD
320
VDD
240
TC1272A
160
RESET
TC1272A/L/M/J
80
0
TC1272A/Z/R/S/T
1
GND
R1
100 k
5
1000
100
Reset Comparator Overdrive
[VTH - VDD] (mv)
FIGURE 3-2:
The addition of R1 at the
RESET output of the TC1272A ensures that the
RESET output is valid to VDD = 0V.
130
120
VDD to Reset Delay ( µsec)
Combinations above the curve are detected as a
brown-out or power-down condition. Transient immunity can be improved by adding a capacitor in close
proximity to the VDD pin of the TC1272A.
110
TC1272A/L/M/J
100
90
80
70
60
50
TC1272A/Z/R/S/T
40
30
1
10
100
1000
Reset Comparator Overdrive (mV)
[VTH - VDD] (mv)
FIGURE 3-1:
Maximum Transient
Duration vs. Overdrive for Glitch Rejection at
+25°C.
DS21877B-page 4
 2004-2012 Microchip Technology Inc.
TC1272A
3.3
Controllers and Processors With
Bidirectional I/O Pins
Some microcontrollers have bidirectional reset pins.
Depending on the current drive capability of the
controller pin, an indeterminate logic level may result if
there is a logic conflict. This can be avoided by adding
a 4.7 k resistor in series with the output of the
TC1272A (Figure 3-3). If there are other components in
the system that require a reset signal, they should be
buffered so as not to load the reset line. If the other
components are required to follow the reset I/O of the
microcontroller, the buffer should be connected as
shown with the solid line.
Buffer
Buffered RESET
To Other System
Components
VDD
PIC®
MicroMCU
TC1272A
4.7 k
RESET
GND
RESET
GND
FIGURE 3-3:
Interfacing the TC1272A to
a Bidirectional RESET I/O.
 2004-2012 Microchip Technology Inc.
DS21877B-page 5
TC1272A
4.0
PACKAGING INFORMATION
4.1
Package Marking Information
3-Pin SOT-23B

Part Number
TC1272AZVNBTR
Legend:
Note:
DS21877B-page 6
1
2
3
4
5
6
SOT-23
BA
TC1272ARVNBTR
BB
TC1272ASVNBTR
BC
TC1272ATVNBTR
BD
TC1272AJVNBTR
BE
TC1272AMVNBTR
BF
TC1272ALVNBTR
BG
Part Number + temperature range and voltage (two-digit code)
Part Number + temperature range and voltage (two-digit code)
Lot ID number
Year and work week
Year and work week
Year and work week
In the event the full Microchip part number cannot be marked on one line, it will be
carried over to the next line thus limiting the number of available characters for customer
specific information.
 2004-2012 Microchip Technology Inc.
TC1272A
3-Lead Plastic Small Outline Transistor (NB) (SOT-23)
Note:
For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
E
E1
2
B
p1
n
D
p
1

c
A


A1
L
Units
Dimension Limits
n
Number of Pins
p
Pitch
p1
Outside lead pitch (basic)
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A2
A
A2
A1
E
E1
D
L

c
B


MIN
.035
.035
.000
.083
.047
.110
.014
0
.004
.015
0
0
INCHES*
NOM
3
.038
.076
.040
.037
.002
.093
.051
.115
.018
5
.006
.017
5
5
MAX
.044
.040
.004
.104
.055
.120
.022
10
.007
.020
10
10
MILLIMETERS
NOM
3
0.96
1.92
0.89
1.01
0.88
0.95
0.01
0.06
2.10
2.37
1.20
1.30
2.80
2.92
0.35
0.45
0
5
0.09
0.14
0.37
0.44
0
5
0
5
MIN
MAX
1.12
1.02
0.10
2.64
1.40
3.04
0.55
10
0.18
0.51
10
10
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-236
Drawing No. C04-104
 2004-2012 Microchip Technology Inc.
DS21877B-page 7
TC1272A
4.2
Product Tape and Reel Specifications
FIGURE 4-1:
EMBOSSED CARRIER DIMENSIONS (8, 12, 16, AND 24 MM TAPE ONLY)
Top
Cover
Tape
A0
W
B0
K0
P
TABLE 1:
CARRIER TAPE/CAVITY DIMENSIONS
Case
Outline
Carrier
Dimensions
Package
Type
NB
SOT-23
W
mm
P
mm
A0
mm
B0
mm
K0
mm
8
4
3.15
2.77
1.22
Output
Quantity
Units
Reel
Diameter in
mm
3000
180
3-LEAD SOT-23 DEVICE TAPE AND REEL SPECIFICATIONS
Device
Marking
FIGURE 4-2:
3L
Cavity
Dimensions
User Direction of Feed
Device
Marking
Pin 1
W, Width
of Carrier
Tape
Pin 1
P, Pitch
Standard Reel Component Orientation
DS21877B-page 8
Reverse Reel Component Orientation
 2004-2012 Microchip Technology Inc.
TC1272A
5.0
REVISION HISTORY
Revision B (January 2013)
Added a note to each package outline drawing.
 2004-2012 Microchip Technology Inc.
DS21877B-page 9
TC1272A
NOTES:
DS21877B-page 10
 2004-2012 Microchip Technology Inc.
TC1272A
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
X
XXXXX
Device
VDD
Temperature
Range
Package
Reset
Threshold
Device:
TC1272A: Supervisor circuit with active-low RESET output
VDD Reset Threshold:
L
M
J
T
S
R
Z
=
=
=
=
=
=
=
4.63V
4.38V
4.00V
3.08V
2.93V
2.63V
2.32V
Temperature Range:
V
Package:
NBTR = SOT-23B, 3-pin (Tape and Reel)
Examples:
a)
TC1272AZVNBTR:
Supervisor w/2.32 VDD
option.
b)
TC1272ARVNBTR:
Supervisor w/2.63 VDD
option.
c)
TC1272ASVNBTR:
Supervisor w/2.93 VDD
option.
d)
TC1272ATVNBTR:
Supervisor w/3.08 VDD
option.
e)
TC1272AJVNBTR:
Supervisor w/4.00 VDD
option.
f)
TC1272AMVNBTR: Supervisor w/4.38 VDD
g)
TC1272ALVNBTR:
option.
Supervisor w/4.63 VDD
option.
= -40°C to +125°C
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
Your local Microchip sales office
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2004-2012 Microchip Technology Inc.
DS21877B-page 11
TC1272A
NOTES:
DS21877B-page 12
 2004-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2004-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620769041
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
 2004-2012 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS21877B-page 13
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Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
DS21877B-page 14
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
11/29/12
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