TCM811/TCM812 4-Pin Reset Monitors Features General Description • Precision VDD Monitor for 2.0V, 2.8V, 3.0V, 3.3V, 5.0V Nominal Supplies • Manual Reset Input • 140 ms Minimum RESET Output Duration • RESET Output Valid to VDD = 1.0V (TCM811) • Low 6 µA (typ.) Supply Current • VDD Transient Immunity • Small 4-Pin SOT-143 Package • No External Components • Replacement for MAX811/812 and Offers a Lower Threshold Voltage Option • Push-Pull RESET Output • Temperature Range: - Commercial (C) -40°C to +85°C The TCM811 and TCM812 are cost effective system supervisory circuits designed to monitor V DD in digital systems and provide a reset signal to the host controller when necessary. A manual reset input is provided to override the reset monitor and is suitable for use as a push-button reset. No external components are required. Applications • • • • Computers Embedded Systems Battery Powered Equipment Critical Microcontroller Power Supply Monitoring VDD 3 MR RESET GND 1 PIC Microcontroller TCM811 PUSH BUTTON Package Types: 2 GND © 2007 Microchip Technology Inc. RESET INPUT (Active Low) 4 VDD 3 MR TCM811 or TCM812 VDD 4 VDD The TCM811/TCM812 are optimized to reject fast transient glitches on the VDD line. A low supply current of 6 µA (VDD = 3.3V) makes these devices ideal for battery powered applications. SOT-143 Typical Application Circuit 0.1µF The reset output is driven active within 20 µs (5 µs for F version) of VDD falling through the reset voltage threshold. RESET is maintained active for a minimum of 140 ms after VDD rises above the reset threshold. The TCM812 has an active high RESET output while the TCM811 has an active low RESET output. The output of the TCM811 is valid down to VDD = 1V. Both devices are available in a 4-Pin SOT-143 package, specified with a temperature range of -40°C to +85°C. TCM811 RESET TCM812 (RESET) 2 GND DS21615C-page 1 TCM811/TCM812 1.0 ELECTRICAL CHARACTERISTICS *Notice: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ABSOLUTE MAXIMUM RATINGS* Supply Voltage (VDD to GND)........................................+6.0V RESET, RESET.................................... - 0.3V to (VDD + 0.3V) Input Current, VDD ........................................................20 mA Output Current, RESET, RESET...................................20 mA Operating Temperature Range......................– 40°C to +85°C Storage Temperature Range .......................– 65°C to +150°C Maximum Junction Temperature, TS.............................. 150°C ELECTRICAL CHARACTERISTICS VDD = 5V for L/M versions, VDD = 3.3V for T/S versions, VDD = 3V for R version, VDD = 2.0V for F version. Unless otherwise noted, TA = –40°C to +85°C. Typical values are at TA = +25°C. (Note 1) Parameters Sym Min Typ Max Units VDD Range VDD 1.0 1.1 — — 5.5 5.5 V TCM811 TCM812 Supply Current ICC — 6 15 µA TCM81_L/M, VDD = 5.5V, IOUT = 0 — 4.75 10 µA TCM81_R/S/T/F, VDD = 3.6V, IOUT = 0 4.54 4.50 4.63 — 4.72 4.75 V V TCM81_L: TA = +25°C TA = –40°C to +85°C 4.30 4.25 4.38 — 4.46 4.50 V V TCM81_M: TA = +25°C TA = –40°C to +85°C 3.03 3.00 3.08 — 3.14 3.15 V V TCM81_T: 2.88 2.85 2.93 — 2.98 3.00 V V TCM81_S: TA = +25°C TA = –40°C to +85°C 2.58 2.55 2.63 — 2.68 2.70 V V TCM81_R: TA = +25°C TA = –40°C to +85°C 1.71 1.70 1.75 — 1.79 1.80 V V TCM81_F: TA = +25°C TA = –40°C to +85°C Reset Threshold Tempco — 30 — ppm/° C VDD to Reset Delay — 20 — µs VDD = VTH to VTH –125 mV; TCM81_L/M — 5 — µs VDD = VTH to VTH –125 mV; TCM81_R/S/T/F VDD = VTH(MAX) Reset Threshold VTH Reset Active Timeout Period tRP 140 280 560 ms MR Minimum Pulse Width tMR 10 — — µs — 100 — ns — 0.5 — µs MR Glitch Immunity MR to Reset Propagation Delay tMD Conditions TA = +25°C TA = –40°C to +85°C Note 1: Production testing done at TA = +25°C and +85°C, overtemperature limits are tested with periodic QA tests in production. DS21615C-page 2 © 2007 Microchip Technology Inc. TCM811/TCM812 VDD = 5V for L/M versions, VDD = 3.3V for T/S versions, VDD = 3V for R version, VDD = 2.0V for F version. Unless otherwise noted, TA = –40°C to +85°C. Typical values are at TA = +25°C. (Note 1) Parameters MR Input Threshold Sym Min Typ Max Units VIH 2.3 — — V VDD > VTH(MAX), TCM81_L/M 0.7 VDD — — V VDD > VTH(MAX), TCM81_R/S/T/F — — 0.8 V VDD > VTH(MAX), TCM81_L/M VDD > VTH(MAX), TCM81_R/S/T/F VIL MR Pull-up Resistance RESET Output Voltage Low (TCM811) RESET Output Voltage High (TCM811) RESET Output Voltage Low (TCM812) RESET Output Voltage High (TCM812) VOL VOH VOL VOH Conditions — — 0.25 VDD V 10 20 40 kΩ — — 0.3 V TCM811R/S/T only; ISINK = 1.2 mA, VDD = VTH(MIN) — — 0.4 V TCM811F only; ISINK = 500 µA, VDD = VTH(MIN) — — 0.3 V TCM811L/M only; ISINK = 3.2 mA, VDD = VTH(MIN) ISINK = 3.2 mA, VDD = VTH(MIN) 0.8 VDD — — V TCM811R/S/T/F only; ISOURCE = 500 µA, VDD > VTH(MAX) VDD - 1.5 — — V TCM811L/M only; ISOURCE = 800 µA, VDD > VTH(MAX) — — 0.2 V TCM812F only, ISINK = 500 µA, VDD = VTH(MAX) — — 0.3 V TCM812R/S/T only, ISINK = 1.2 mA, VDD = VTH(MAX) — — 0.4 V TCM812L/M only, ISINK = 1.2 mA, VDD = VTH(MAX) 0.8 VDD — — V ISOURCE = 150 µA, VDD ≤ VTH(MIN) Note 1: Production testing done at TA = +25°C and +85°C, overtemperature limits are tested with periodic QA tests in production. © 2007 Microchip Technology Inc. DS21615C-page 3 TCM811/TCM812 2.0 TYPICAL PERFORMANCE CHARACTERISTICS Note: The graphs provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 8 14 SUPPLY CURRENT (µA) 12 SUPPLY CURRENT (µA) TCM81xR/S/T/F No Load 10 VDD = 5V 8 VDD = 3V 6 4 VDD = 1V TCM81xL/M No Load 6 VDD = 5V 4 VDD = 3V VDD = 1V 2 2 0 –40 –20 0 40 20 60 0 –40 85 –20 0 FIGURE 2-1: FIGURE 2-4: Supply Current vs. Temperature. TCM81xF 40 30 VOD = 20 mV 20 10 VOD = 100 mV VOD = 200 mV –20 0 40 20 60 POWER-DOWN RESET DELAY (µsec) POWER-DOWN RESET DELAY (µsec) 85 Supply Current vs. Temperature. 85 VOD = 20 mV VOD = 100 mV 40 VOD = 200 mV 30 20 10 TCM81xL/M 0 –40 –20 TEMPERATURE (˚C) FIGURE 2-2: Temperature. Power-Down Reset Delay vs. FIGURE 2-5: Temperature. POWER-DOWN RESET DELAY (µsec) TCM81xL/M 240 TCM81xR/S/T/F 235 230 –20 0 20 40 Power-Up DS21615C-page 4 Reset 60 85 Power-Down Reset 60 85 Delay vs. TCM81x/R/S/T 40 30 20 VOD = 200 mV VOD = 100 mV VOD = 20 mV 10 0 –40 TEMPERATURE (˚C) FIGURE 2-3: Temperature. 40 20 50 245 225 –40 0 TEMPERATURE (˚C) 250 POWER-UP RESET TIMEOUT (msec) 60 50 50 0 –40 40 20 TEMPERATURE (˚C) TEMPERATURE (˚C) –20 0 20 40 60 85 TEMPERATURE (˚C) Timeout vs. FIGURE 2-6: Temperature. Power-Down Reset Delay vs. © 2007 Microchip Technology Inc. TCM811/TCM812 1.0030 NORMALIZED THRESHOLD (V) 1.0020 1.0010 1.0000 0.9990 0.9980 0.9970 0.9960 0.9950 0.9940 –40 FIGURE 2-7: Temperature. –15 35 10 TEMPERATURE (˚C) Normalized Reset © 2007 Microchip Technology Inc. 60 Threshold 65 vs. DS21615C-page 5 TCM811/TCM812 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: Pin No. 3.1 PIN FUNCTION TABLE Symbol Description 1 GND 2 RESET (TCM811) Ground RESET push-pull output remains low while VDD is below the reset voltage threshold, and for at least 140 ms (min.) after VDD rises above reset threshold 2 RESET (TCM812) Reset push-pull output remains high while VDD is below the reset voltage threshold, and for at least 140 ms (min.) after VDD rises above reset threshold 3 MR Manual Reset input generates a Reset when MR is below VIL 4 VDD Supply voltage Ground Terminal (GND) GND provides the negative reference for the analog input voltage. Typically, the circuit ground is used. 3.2 Reset Output (RESET) (TCM811) RESET output remains low while VDD is below the Reset voltage threshold (VTRIP). Once the device voltage (VDD) returns to a high level (VTRIP + VHYS), the device will remain in Reset for the Reset delay timer (TRST). After that time expires, the RESET pin will be driven to the high state. 3.3 Reset Output (RESET) (TCM812) 3.4 Manual Reset (MR) The Manual Reset (MR) input pin allows a push button switch to easily be connected to the system. When the push button is depressed, it forces a system Reset. This pin has circuitry that filters noise that may be present on the MR signal. The MR pin is active-low and has an internal pull-up resistor. 3.5 Supply Voltage (VDD) VDD can be used for power supply monitoring or a voltage level that requires monitoring. RESET output remains high while VDD is below the Reset voltage threshold (VTRIP). Once the device voltage (VDD) returns to a high level (VTRIP + VHYS), the device will remain in Reset for the Reset delay timer (TRST). After that time expires, the RESET pin will be driven to the low state. DS21615C-page 6 © 2007 Microchip Technology Inc. TCM811/TCM812 4.0 APPLICATIONS INFORMATION The TCM811/TCM812 provides accurate VDD monitoring and reset timing during power-up, powerdown, and brownout/sag conditions. These devices also reject negative-going transients (glitches) on the power supply line. Figure 4-1 shows the maximum transient duration vs. maximum negative excursion (overdrive) for glitch rejection. Any combination of duration and overdrive that is under the curve will not generate a reset signal. Combinations above the curve are detected as a brownout or power-down. Transient immunity can be improved by adding a 0.1 µF capacitor in close proximity to the VDD pin of the TCM811/ TCM812. such that it does not appreciably load RESET under normal operation (100 kΩ will be suitable for most applications). Similarly, a pull-up resistor to VDD is required for the TCM812 to ensure a valid high RESET for VDD below 1.1V. VDD 4 VDD 0.1µF TCM811 2 RESET R1 100 kΩ VDD GND 1 VTH Overdrive = VD D MAXIMUM TRANSIENT DURATION (µsec) Duration 400 TA = +25˚C FIGURE 4-2: The addition of R1 at the RESET output of the TCM811 ensures that the RESET output is valid to VDD = 0V. 4.2 320 240 160 TCM81xL/M 80 TCM81xR/S/T 0 1 10 1000 100 RESET COMPARATOR OVERDRIVE, VTH - VDD (mV) Controllers and Processors With Bidirectional I/O Pins Some microcontrollers have bidirectional reset pins. Depending on the current drive capability of the controller pin, an indeterminate logic level may result if there is a logic conflict. This can be avoided by adding a 4.7 kΩ resistor in series with the output of the TCM811/TCM812 (Figure 4-3). If there are other components in the system which require a reset signal, they should be buffered so as not to load the reset line. If the other components are required to follow the reset I/O of the microcontroller, the buffer should be connected as shown with the solid line. Buffered RESET To Other System Components FIGURE 4-1: Maximum Transient Duration vs. Overdrive for Glitch Rejection at +25°C. 4.1 BUFFER RESET Signal Integrity During Power-Down The TCM811 RESET push-pull output is valid to VDD = 1.0V. Below this voltage the output becomes an "open circuit" and does not sink current. This means CMOS logic inputs to the microcontroller will be floating at an undetermined voltage. Most digital systems are completely shutdown well above this voltage. However, in situations where RESET must be maintained valid to VDD = 0V, a pull-down resistor must be connected from RESET to ground to discharge stray capacitances and hold the output low (Figure 4-2). This resistor value, though not critical, should be chosen © 2007 Microchip Technology Inc. VDD 4 0.1µF Micro controller TCM811 4.7 kΩ RESET GND 1 2 RESET GND FIGURE 4-3: Interfacing the TCM811 to a Bidirectional Reset I/O. DS21615C-page 7 TCM811/TCM812 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 1 & 2 = part number code + reset threshold voltage (two-digit code) Part Number 1 2 3 4 TCM811LERCTR 4.63 U1 TCM811MERCTR 4.38 U2 TCM811TERCTR 3.08 U3 TCM811SERCTR 2.93 U4 TCM811RERCTR 2.63 U5 TCM811FERCTR 1.75 U7 Part Number (V) TCM812 Code TCM812LERCTR 4.63 V1 TCM812MERCTR 4.38 V2 TCM812TERCTR 3.08 V3 TCM812SERCTR 2.93 V4 TCM812RERCTR 2.63 V5 TCM812FERCTR 1.75 V7 3 represents year and two-month period code 4 represents production lot ID code Note: 5.2 TCM811 Code (V) In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. Taping Form User Direction of Feed Device Marking Pin 1 Pin 1 W, Width of Carrier Tape P, Pitch Standard Reel Component Orientation Reverse Reel Component Orientation for TR Suffix Device (Mark Right Side Up) Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 4-Pin SOT-143 8 mm 4 mm 3000 7 in. DS21615C-page 8 © 2007 Microchip Technology Inc. TCM811/TCM812 4-Lead Plastic Small Outline Transistor (RC) [SOT-143] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D e e/2 N E E1 1 2 e1 A2 A c φ A1 b2 Units Dimension Limits Number of Pins L L1 3X b MILLIMETERS MIN N NOM MAX 4 Pitch e 1.92 BSC Pin1 Offset e1 0.20 BSC Overall Height A 0.80 – Molded Package Thickness A2 0.75 0.90 1.22 1.07 Standoff § A1 0.01 – 0.15 Overall Width E 2.10 – 2.64 Molded Package Width E1 1.20 1.30 1.40 Overall Length D 2.67 2.90 3.05 Foot Length L 0.13 0.50 0.60 Footprint L1 Foot Angle φ 0° – 8° Lead Thickness c 0.08 – 0.20 Lead 1 Width b1 0.76 – 0.94 Leads 2, 3 & 4 Width b 0.30 – 0.54 REF 0.54 Notes: 1. § Significant Characteristic. 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-031B © 2007 Microchip Technology Inc. DS21615C-page 9 TCM811/TCM812 NOTES: DS21615C-page 10 © 2007 Microchip Technology Inc. TCM811/TCM812 APPENDIX A: REVISION HISTORY Revision C (February 2007) • Section 5.0 “Packaging Information”: Corrected SOT-143 packaging information. • Section 3.0 “Pin Descriptions”: Added pin descriptions. • Added disclaimer on package outline drawing. • Updated package outline drawing. • Section 1.0 “Electrical Characteristics”: Reformatted Electrical Characteristics Revision B (January 2002) • Undocumented changes. Revision A (October 2001) • Original Release of this Document. © 2007 Microchip Technology Inc. DS21615C-page 11 TCM811/TCM812 NOTES: DS21615C-page 12 © 2007 Microchip Technology Inc. TCM811/TCM812 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X X VDD Temperature Reset Range Threshold Device XXXX Package Examples: Device: TCM811: 4-Pin µP Reset Monitor (RESET low) TCM812: 4-Pin µP Reset Monitor (RESET high) a) b) c) d) e) f) Threshold Voltage: (typical) L M T S R F = = = = = = a) b) c) d) e) f) Temperature Range: E = -40°C to +85°C Package: RCTR = 4.63V 4.38V 3.08V 2.93V 2.63V 1.75V TCM811LERCTR: TCM811MERCTR: TCM811TERCTR: TCM811SERCTR: TCM811RERCTR: TCM811FERCTR: 4.63V 4.38V 3.08V 2.93V 2.63V 1.75V TCM812LERCTR: TCM812MERCTR: TCM812TERCTR: TCM812SERCTR: TCM812RERCTR: TCM812FERCTR: 4.63V 4.38V 3.08V 2.93V 2.63V 1.75V Plastic Small Outline Transistor (RC) SOT-143, 4 lead, (tape and reel). © 2007 Microchip Technology Inc. DS21615C-page 13 TCM811/TCM812 NOTES: DS21615C-page 14 © 2007 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. 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Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. © 2007 Microchip Technology Inc. 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