SN54AHC273, SN74AHC273 OCTAL D-TYPE FLIP-FLOPS WITH CLEAR SCLS376G – JUNE 1997 – REVISED JULY 2003 D D D D D SN54AHC273 . . . J OR W PACKAGE SN74AHC273 . . . DB, DGV, DW, N, NS, OR PW PACKAGE (TOP VIEW) Operating Range 2-V to 5.5-V VCC Contain Eight Flip-Flops With Single-Rail Outputs Direct Clear Input Individual Data Input to Each Flip-Flop Applications Include: – Buffer/Storage Registers – Shift Registers – Pattern Generators Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 1000-V Charged-Device Model (C101) CLR 1Q 1D 2D 2Q 3Q 3D 4D 4Q GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 8Q 8D 7D 7Q 6Q 6D 5D 5Q CLK SN54AHC273 . . . FK PACKAGE (TOP VIEW) 1D 1Q CLR VCC description/ordering information These circuits are positive-edge-triggered D-type flip-flops with a direct clear (CLR) input. 2D 2Q 3Q 3D 4D 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 8D 7D 7Q 6Q 6D 4Q GND CLK 5Q 5D Information at the data (D) inputs meeting the setup time requirements is transferred to the Q outputs on the positive-going edge of the clock (CLK) pulse. Clock triggering occurs at a particular voltage level and is not directly related to the transition time of the positive-going pulse. When CLK is at either the high or low level, the D input has no effect at the output. 8Q D D ORDERING INFORMATION PDIP – N SN74AHC273N Tube SN74AHC273DW Tape and reel SN74AHC273DWR SOP – NS Tape and reel SN74AHC273NSR AHC273 SSOP – DB Tape and reel SN74AHC273DBR HA273 Tube SN74AHC273PW Tape and reel SN74AHC273PWR TVSOP – DGV Tape and reel SN74AHC273DGVR HA273 CDIP – J Tube SNJ54AHC273J SNJ54AHC273J CFP – W Tube SNJ54AHC273W SNJ54AHC273W LCCC – FK Tube SNJ54AHC273FK SNJ54AHC273FK TSSOP – PW –55°C to 125°C TOP-SIDE MARKING Tube SOIC – DW –40°C 40°C to 85°C ORDERABLE PART NUMBER PACKAGE† TA SN74AHC273N AHC273 HA273 † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54AHC273, SN74AHC273 OCTAL D-TYPE FLIP-FLOPS WITH CLEAR SCLS376G – JUNE 1997 – REVISED JULY 2003 FUNCTION TABLE (each flip-flop) INPUTS CLR CLK OUTPUT Q D L X X L H ↑ H H H ↑ L L H L X Q0 logic diagram (positive logic) CLK 1D 2D 3D 4D 3 4 7 8 6D 13 7D 14 8D 17 18 11 1D 1D C1 1D C1 R CLR 5D 1D C1 R 1D C1 R 1D C1 R 1D C1 R 1D C1 R C1 R R 1 2 5 6 1Q 2Q 3Q 9 12 4Q 15 5Q 6Q 16 19 7Q 8Q logic diagram, each flip-flop (positive logic) D C C TG TG Q C C C C TG CLK(I) TG C C C C R 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54AHC273, SN74AHC273 OCTAL D-TYPE FLIP-FLOPS WITH CLEAR SCLS376G – JUNE 1997 – REVISED JULY 2003 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to VCC + 0.5 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mA Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±75 mA Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69°C/W NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 3) SN54AHC273 VCC VIH Supply voltage VCC = 2 V VCC = 3 V High-level input voltage VCC = 5.5 V VCC = 2 V VIL VI VO IOH Low-level input voltage ∆t/∆v MAX 2 5.5 Input voltage Output voltage VCC = 2 V VCC = 3.3 V ± 0.3 V High-level output current Low-level output current Input transition rise or fall rate SN74AHC273 MIN MAX 2 5.5 1.5 1.5 2.1 2.1 3.85 UNIT V V 3.85 0.5 VCC = 3 V VCC = 5.5 V VCC = 5 V ± 0.5 V VCC = 2 V IOL MIN 0.5 0.9 0.9 1.65 1.65 V 0 5.5 0 5.5 V 0 VCC –50 0 VCC –50 mA –4 –4 –8 –8 50 50 VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V 4 4 8 8 VCC = 3.3 V ± 0.3 V VCC = 5 V ± 0.5 V 100 100 20 20 V mA mA mA ns/V TA Operating free-air temperature –55 125 –40 85 °C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SN54AHC273, SN74AHC273 OCTAL D-TYPE FLIP-FLOPS WITH CLEAR SCLS376G – JUNE 1997 – REVISED JULY 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VCC IOH = –50 mA VOH IOH = –4 mA IOH = –8 mA IOL = 50 mA MIN TA = 25°C TYP MAX SN54AHC273 MIN MAX SN74AHC273 MIN 2V 1.9 1.9 1.9 3V 2.9 2.9 2.9 4.5 V 4.4 4.4 4.4 3V 2.58 2.48 2.48 4.5 V 3.94 3.8 MAX UNIT V 3.8 2V 0.1 0.1 0.1 0.1 3V 0.1 0.1 4.5 V 0.1 0.1 0.1 3V 0.36 0.5 0.44 4.5 V 0.36 0.5 0.44 0 V to 5.5 V ±0.1 ±1* ±1 mA IO = 0 5.5 V 4 VI = VCC or GND 5V 2.5 10 * On products compliant to MIL-PRF-38535, this parameter is not production tested at VCC = 0 V. 40 40 mA 10 pF VOL IOL = 4 mA IOL = 8 mA II ICC VI = 5.5 V or GND VI = VCC or GND, Ci V timing requirements over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1) SN54AHC273 TA = 25°C MIN MAX tw Pulse duration tsu Setup time th Hold time, data after CLK↑ MIN SN74AHC273 MAX TA = 25°C MIN MAX MIN CLR low 5 6 5 6 CLK high or low 5 6.5 5 6.5 Data before CLK↑ 5.5 6.5 5.5 6.5 CLR before CLK↑ 2.5 2.5 2.5 2.5 1.5 2 1 1 MAX UNIT ns ns ns timing requirements over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) SN54AHC273 TA = 25°C MIN MAX 4 tw Pulse duration tsu Setup time th Hold time, data after CLK↑ MIN SN74AHC273 MAX TA = 25°C MIN MAX MIN CLR low 5 5 5 5 CLK high or low 5 5 5 5 Data before CLK↑ 4.5 4.5 4.5 4.5 CLR before CLK↑ 2 2 2 2 1.5 2 1 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MAX UNIT ns ns ns SN54AHC273, SN74AHC273 OCTAL D-TYPE FLIP-FLOPS WITH CLEAR SCLS376G – JUNE 1997 – REVISED JULY 2003 switching characteristics over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) 75* 120* 65* 65 CL = 50 pF 50 75 45 45 CLR Q CL = 15 pF tPLH tPHL CLK Q CL = 15 pF CLR Q CL = 50 pF CLK SN74AHC273 CL = 15 pF tPHL tPHL tsk(o) SN54AHC273 MIN fmax tPHL tPLH TA = 25°C TYP MAX LOAD CAPACITANCE CL = 50 pF Q MIN MAX MIN MAX MHz 8.9* 13.6* 1* 16* 1 16 8.7* 13.6* 1* 16* 1 16 8.7* 13.6* 1* 16* 1 16 11.4 17.1 1 19.5 1 19.5 11.2 17.1 1 19.5 1 19.5 11.2 17.1 1 19.5 1 19.5 CL = 50 pF * On products compliant to MIL-PRF-38535, this parameter is not production tested. ** On products compliant to MIL-PRF-38535, this parameter does not apply. UNIT 1.5** 1.5 ns ns ns ns ns switching characteristics over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) TO (OUTPUT) tPHL tPHL tPLH tPHL SN74AHC273 CL = 15 pF 120* 165* 100* 100 CL = 50 pF 80 110 70 70 CLR Q CL = 15 pF CLK Q CL = 15 pF CLR Q CL = 50 pF CLK SN54AHC273 MIN fmax tPHL tPLH TA = 25°C TYP MAX LOAD CAPACITANCE CL = 50 pF Q MIN MAX MIN MAX MHz 5.2* 8.5* 1* 10* 1 10 5.8* 9* 1* 10.5* 1 10.5 5.8* 9* 1* 10.5* 1 10.5 6.7 10.5 1 12 1 12 7.3 11 1 12.5 1 12.5 7.3 11 1 12.5 1 12.5 tsk(o) CL = 50 pF * On products compliant to MIL-PRF-38535, this parameter is not production tested. ** On products compliant to MIL-PRF-38535, this parameter does not apply. UNIT 1** 1 ns ns ns ns ns noise characteristics, VCC = 5 V, CL = 50 pF, TA = 25°C (see Note 4) SN74AHC273 PARAMETER MIN TYP MAX UNIT VOL(P) VOL(V) Quiet output, maximum dynamic VOL 0.7 V Quiet output, minimum dynamic VOL –0.7 V VOH(V) VIH(D) Quiet output, minimum dynamic VOH 4.7 V High-level dynamic input voltage 3.5 VIL(D) Low-level dynamic input voltage NOTE 4: Characteristics are for surface-mount packages only. V 1.5 V TYP UNIT operating characteristics, TA = 25°C PARAMETER Cpd TEST CONDITIONS Power dissipation capacitance No load, POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 f = 1 MHz 31 pF 5 SN54AHC273, SN74AHC273 OCTAL D-TYPE FLIP-FLOPS WITH CLEAR SCLS376G – JUNE 1997 – REVISED JULY 2003 PARAMETER MEASUREMENT INFORMATION From Output Under Test RL = 1 kΩ From Output Under Test Test Point VCC Open S1 TEST GND CL (see Note A) CL (see Note A) S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open Drain Open VCC GND VCC LOAD CIRCUIT FOR 3-STATE AND OPEN-DRAIN OUTPUTS LOAD CIRCUIT FOR TOTEM-POLE OUTPUTS VCC 50% VCC Timing Input tw tsu VCC Input 50% VCC 50% VCC 0V th VCC 50% VCC Data Input 50% VCC 0V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION VCC 50% VCC Input 50% VCC 0V tPLH In-Phase Output tPHL 50% VCC tPHL Out-of-Phase Output VOH 50% VCC VOL VCC Output Control Output Waveform 1 S1 at VCC (see Note B) 50% VCC 0V tPZL VOH 50% VCC VOL tPLZ ≈VCC 50% VCC tPZH tPLH 50% VCC 50% VCC Output Waveform 2 S1 at GND (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS VOL + 0.3 V VOL tPHZ 50% VCC VOH – 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns. D. The outputs are measured one at a time with one input transition per measurement. E. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-9853001Q2A ACTIVE LCCC FK 20 1 TBD 5962-9853001QRA ACTIVE CDIP J 20 1 TBD 1 Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type A42 SNPB N / A for Pkg Type TBD A42 N / A for Pkg Type TBD Call TI 5962-9853001QSA ACTIVE CFP W 20 SN74AHC273DBLE OBSOLETE SSOP DB 20 SN74AHC273DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC273DBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC273DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC273DGVR ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC273DGVRE4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC273DGVRG4 ACTIVE TVSOP DGV 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC273DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC273DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC273DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC273DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC273N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74AHC273NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74AHC273NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC273NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC273NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC273PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC273PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC273PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC273PWLE OBSOLETE TSSOP PW 20 SN74AHC273PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC273PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74AHC273PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54AHC273FK ACTIVE LCCC FK 20 TBD 1 Addendum-Page 1 TBD Call TI Call TI Call TI POST-PLATE N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 Orderable Device Status (1) Package Type SNJ54AHC273J ACTIVE CDIP J 20 1 TBD A42 SNPB N / A for Pkg Type SNJ54AHC273W ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 12-Feb-2008 TAPE AND REEL BOX INFORMATION Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74AHC273DBR DB 20 SITE 41 330 16 8.2 7.5 2.5 12 16 Q1 SN74AHC273DGVR DGV 20 SITE 41 330 12 7.0 5.6 1.6 8 12 Q1 SN74AHC273DWR DW 20 SITE 41 330 24 10.8 13.0 2.7 12 24 Q1 SN74AHC273PWR PW 20 SITE 41 330 16 6.95 7.1 1.6 8 16 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 12-Feb-2008 Package Pins Site Length (mm) Width (mm) Height (mm) SN74AHC273DBR DB 20 SITE 41 346.0 346.0 33.0 SN74AHC273DGVR DGV 20 SITE 41 346.0 346.0 29.0 SN74AHC273DWR DW 20 SITE 41 346.0 346.0 41.0 SN74AHC273PWR PW 20 SITE 41 346.0 346.0 33.0 Pack Materials-Page 2 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Amplifiers Data Converters DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID RF/IF and ZigBee® Solutions amplifier.ti.com dataconverter.ti.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/lprf Applications Audio Automotive Broadband Digital Control Medical Military Optical Networking Security Telephony Video & Imaging Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2008, Texas Instruments Incorporated