SN54ABT273, SN74ABT273 OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH CLEAR SCBS185B – FEBRUARY 1991 – REVISED JANUARY 1997 D D D D State-of-the-Art EPIC-ΙΙB BiCMOS Design Significantly Reduces Power Dissipation Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25°C High-Drive Outputs (–32-mA IOH, 64-mA IOL) Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Plastic (N) and Ceramic (J) DIPs, and Ceramic Flat (W) Package SN54ABT273 . . . J OR W PACKAGE SN74ABT273 . . . DB, DW, N, OR PW PACKAGE (TOP VIEW) CLR 1Q 1D 2D 2Q 3Q 3D 4D 4Q GND description 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 8Q 8D 7D 7Q 6Q 6D 5D 5Q CLK SN54ABT273 . . . FK PACKAGE (TOP VIEW) 1D 1Q CLR VCC The ’ABT273 are 8-bit positive-edge-triggered D-type flip-flops with a direct clear (CLR) input. They are particularly suitable for implementing buffer and storage registers, shift registers, and pattern generators. 2D 2Q 3Q 3D 4D 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 8D 7D 7Q 6Q 6D 4Q GND CLK 5Q 5D Information at the data (D) inputs meeting the setup time requirements is transferred to the Q outputs on the positive-going edge of the clock pulse. Clock triggering occurs at a particular voltage level and is not directly related to the transition time of the positive-going pulse. When the clock (CLK) input is at either the high or low level, the D input signal has no effect at the output. 8Q D The SN54ABT273 is characterized for operation over the full military temperature range of –55°C to 125°C. The SN74ABT273 is characterized for operation from –40°C to 85°C. FUNCTION TABLE (each flip-flop) INPUTS CLR CLK D OUTPUT Q L X X L H ↑ H H H ↑ L L H H or L X Q0 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC-ΙΙB is a trademark of Texas Instruments Incorporated. Copyright 1997, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SN54ABT273, SN74ABT273 OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH CLEAR SCBS185B – FEBRUARY 1991 – REVISED JANUARY 1997 logic symbol† CLR CLK 1D 2D 3D 4D 5D 6D 7D 8D 1 R 11 C1 3 2 1D 4 5 7 6 8 9 13 12 14 15 17 16 18 19 1Q 2Q 3Q 4Q 5Q 6Q 7Q 8Q † This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. logic diagram (positive logic) 2D 1D CLK 11 3 3D 4 7 5D 8 6D 13 7D 14 8D 17 18 CLK(I) 1D 1D C1 1 1D C1 R CLR 4D 1D C1 R 1D C1 R 1D C1 R 1D C1 R 1D C1 R C1 R R R 2 1Q 5 2Q 6 3Q 9 4Q 12 5Q 15 6Q 16 7Q 19 8Q absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡ Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V Voltage range applied to any output in the high or power-off state, VO . . . . . . . . . . . . . . . . . . . –0.5 V to 5.5 V Current into any output in the low state, IO: SN54ABT273 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA SN74ABT273 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –50 mA Package thermal impedance, θJA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128°C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C ‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51, except for through-hole packages, which use a trace length of zero. 2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SN54ABT273, SN74ABT273 OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH CLEAR SCBS185B – FEBRUARY 1991 – REVISED JANUARY 1997 recommended operating conditions (see Note 3) SN54ABT273 SN74ABT273 MIN MAX MIN MAX 4.5 5.5 4.5 5.5 UNIT VCC VIH Supply voltage VIL VI Low-level input voltage IOH IOL High-level output current VCC –24 Low-level output current 48 64 mA ∆t/∆v Input transition rise or fall rate 10 10 ns/V 85 °C High-level input voltage 2 2 0.8 Input voltage 0 TA Operating free-air temperature NOTE 3: Unused inputs must be held high or low to prevent them from floating. –55 125 V 0.8 0 –40 V VCC –32 V V mA electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH TEST CONDITIONS VCC = 4.5 V, VCC = 4.5 V, II = –18 mA IOH = –3 mA VCC = 5 V, VCC = 4 4.5 5V VOL Vhys II Ioff ICEX IO‡ VCC = 4 4.5 5V MIN TA = 25°C TYP† MAX SN54ABT273 MIN –1.2 MAX SN74ABT273 MIN –1.2 MAX –1.2 2.5 2.5 2.5 IOH = –3 mA IOH = –24 mA 3 3 3 2 2 IOH = –32 mA IOL = 48 mA 2* IOL = 64 mA V 0.55 0.55* 0.55 100 VI = VCC or GND VI or VO ≤ 4.5 V VCC = 5.5 V, VCC = 5.5 V, VO = 5.5 V VO = 2.5 V ±1 ∆ICC¶ VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND ±1 µA µA 50 –200§ µA –100 Outputs high 1 400§ 400§ 400§ µA Outputs low 24 30 30 30 mA 1.5 1.5 1.5 mA –50 50 –200§ ±1 ±100 50 –200§ –50 VCC = 5.5 V,, IO = 0,, VI = VCC or GND V mV ±100 Outputs high ICC V 2 0.55 VCC = 5.5 V, VCC = 0, UNIT –50 Ci VI = 2.5 V or 0.5 V 7 * On products compliant to MIL-PRF-38535, this parameter does not apply. † All typical values are at VCC = 5 V. ‡ Not more than one output should be tested at a time, and the duration of the test should not exceed one second. § This data sheet limit may vary among suppliers. ¶ This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 mA pF 3 SN54ABT273, SN74ABT273 OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH CLEAR SCBS185B – FEBRUARY 1991 – REVISED JANUARY 1997 timing requirements over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 1) VCC = 5 V, TA = 25°C fclock Clock frequency tw Pulse duration Setup time before CLK↑ ↑ th Hold time after CLK↑ † This data sheet limit may vary among suppliers. SN74ABT273 MIN MAX MIN MAX MIN MAX 0 150 0 150 0 150 UNIT MHz CLK high or low 3.3 3.3 3.3 CLR low 3.3 3.3 3.3 2 2 2 Data low 2.5 2.5 2.5 ns CLR high 2 1.2† 2 1.4† 2 1.2† ns Data high tsu SN54ABT273 Data high or low ns switching characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER fmax tPLH FROM (INPUT) TO (OUTPUT) MIN SN54ABT273 MAX 150 CLK Q CLR † This data sheet limit may vary among suppliers. Q tPHL tPHL VCC = 5 V, TA = 25°C MIN 150 MHz 2.5 6 2.5 7 3.3 6.8 7.5† 3.3 7.5 2.5 8.2 2.5 UNIT MAX ns ns switching characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1) PARAMETER fmax tPLH FROM (INPUT) TO (OUTPUT) Q CLR † This data sheet limit may vary among suppliers. Q 4 MIN SN74ABT273 MAX 150 CLK tPHL tPHL VCC = 5 V, TA = 25°C POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MIN 150 MHz 2.5 6 2.5 6.5 3.3 6.8 6.7† 3.3 7.3 7.4† 2.5 2.5 UNIT MAX ns ns SN54ABT273, SN74ABT273 OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH CLEAR SCBS185B – FEBRUARY 1991 – REVISED JANUARY 1997 PARAMETER MEASUREMENT INFORMATION 500 Ω From Output Under Test S1 7V Open GND CL = 50 pF (see Note A) 500 Ω TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 7V Open 3V LOAD CIRCUIT Timing Input 1.5 V 0V tw tsu 3V th 3V 1.5 V Input 1.5 V Data Input 0V 1.5 V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION 3V 3V 1.5 V Input Output Control 1.5 V 0V 1.5 V 1.5 V VOL tPLH tPHL VOH Output 1.5 V 1.5 V VOL 1.5 V 0V tPLZ Output Waveform 1 S1 at 7 V (see Note B) VOH Output 1.5 V tPZL tPHL tPLH 1.5 V Output Waveform 2 S1 at Open (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 3.5 V VOL + 0.3 V VOL tPHZ tPZH 1.5 V VOH – 0.3 V VOH ≈0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 PACKAGE OPTION ADDENDUM www.ti.com 17-Aug-2007 PACKAGING INFORMATION (1) Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-9321701Q2A ACTIVE LCCC FK 20 1 TBD 5962-9321701QRA ACTIVE CDIP J 20 1 TBD 1 Lead/Ball Finish MSL Peak Temp (3) POST-PLATE N / A for Pkg Type Call TI N / A for Pkg Type TBD A42 N / A for Pkg Type TBD Call TI 5962-9321701QSA ACTIVE CFP W 20 SN74ABT273DBLE OBSOLETE SSOP DB 20 SN74ABT273DBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT273DBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT273DW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT273DWE4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT273DWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT273DWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT273DWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT273DWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT273N ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ABT273NE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type SN74ABT273NSR ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT273NSRE4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT273NSRG4 ACTIVE SO NS 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT273PW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT273PWE4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT273PWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT273PWLE OBSOLETE TSSOP PW 20 SN74ABT273PWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT273PWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ABT273PWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SNJ54ABT273FK ACTIVE LCCC FK 20 1 TBD SNJ54ABT273J ACTIVE CDIP J 20 1 TBD Call TI N / A for Pkg Type SNJ54ABT273W ACTIVE CFP W 20 1 TBD A42 N / A for Pkg Type TBD The marketing status values are defined as follows: Addendum-Page 1 Call TI Call TI Call TI POST-PLATE N / A for Pkg Type PACKAGE OPTION ADDENDUM www.ti.com 17-Aug-2007 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 16-Jul-2007 TAPE AND REEL INFORMATION Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com Device 16-Jul-2007 Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74ABT273DBR DB 20 MLA 330 16 8.2 7.5 2.5 12 16 Q1 SN74ABT273DWR DW 20 MLA 330 24 10.8 13.0 2.7 12 24 Q1 SN74ABT273NSR NS 20 MLA 330 24 8.2 13.0 2.5 12 24 Q1 SN74ABT273PWR PW 20 MLA 330 16 6.95 7.1 1.6 8 16 Q1 TAPE AND REEL BOX INFORMATION Device Package Pins Site Length (mm) Width (mm) Height (mm) SN74ABT273DBR DB 20 MLA 346.0 346.0 33.0 SN74ABT273DWR DW 20 MLA 333.2 333.2 31.75 SN74ABT273NSR NS 20 MLA 333.2 333.2 31.75 SN74ABT273PWR PW 20 MLA 346.0 346.0 33.0 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 16-Jul-2007 Pack Materials-Page 3 MECHANICAL DATA MLCC006B – OCTOBER 1996 FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER 28 TERMINAL SHOWN 18 17 16 15 14 13 NO. OF TERMINALS ** 12 19 11 20 10 A B MIN MAX MIN MAX 20 0.342 (8,69) 0.358 (9,09) 0.307 (7,80) 0.358 (9,09) 28 0.442 (11,23) 0.458 (11,63) 0.406 (10,31) 0.458 (11,63) 21 9 22 8 44 0.640 (16,26) 0.660 (16,76) 0.495 (12,58) 0.560 (14,22) 23 7 52 0.739 (18,78) 0.761 (19,32) 0.495 (12,58) 0.560 (14,22) 24 6 68 0.938 (23,83) 0.962 (24,43) 0.850 (21,6) 0.858 (21,8) 84 1.141 (28,99) 1.165 (29,59) 1.047 (26,6) 1.063 (27,0) B SQ A SQ 25 5 26 27 28 1 2 3 4 0.080 (2,03) 0.064 (1,63) 0.020 (0,51) 0.010 (0,25) 0.020 (0,51) 0.010 (0,25) 0.055 (1,40) 0.045 (1,14) 0.045 (1,14) 0.035 (0,89) 0.045 (1,14) 0.035 (0,89) 0.028 (0,71) 0.022 (0,54) 0.050 (1,27) 4040140 / D 10/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a metal lid. The terminals are gold plated. Falls within JEDEC MS-004 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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