1.27mm (.050”) Pitch CPU Socket FEATURES AND SPECIFICATIONS Molex offers the Socket S1 for AMD Turion ™ 64 and Athlon™ 64 Mobile Processor in 638 pin µPGA Package The Socket S1 socket is designed for Advanced Micro Devices (AMD) Turion 64 and Athlon 64 mobile processors. The 638-pin micro pin grid array (µPGA) is packaged for the notebook PC industry.This socket will replace existing Socket 754 for notebooks. It will support dual-channel DDR2 SDRAM, dual-core mobile CPUs and virtualisation technology. 47296 Socket S1 Our high density PGA sockets feature low profile and proven Ball Grid Array BGA soldering technology for stable PCB processing. Features Benefits • High-temperature thermoplastic housing/cover • Withstands lead-free processing • PGA contact/BGA solder • Prevents CPU misalignment • Lead free BGA solder balls • Compliant with environmental needs • Actuation Cam • Easy CPU insertion/removal during high volume production and tool less operation for end customer • Zero Insertion Force Socket • Prevent contact from being damage • Dual Beam Contact Design • Reliable electrical and mechanical performance SPECIIFICATIONS Reference Information Packaging: Embossed Tape on Reel UL File No.: TBD Mates With: AMD Turion Processor and AMD Athlon 64 Processor Designed In: mm Electrical Voltage: 100V DC Current: 1.5A Contact Resistance: 17 milliohms max. Dielectric Withstanding Voltage: 650V AC Insulation Resistance: 1000 Megohms min. Mechanical Insertion Force to Socket: Zero Insertion Force Cam Actuation/De-Actuation Force: 2.5 in-lbf Durability: 30 cycles Physical Housing: LCP, UL 94-0 Contact: Copper Alloy Plating: Contact Area — 0.25 μm (10 μ”) Gold Underplating — 1.27 um (50u”) Nickel overall 1.27mm (.050”) Pitch CPU Socket MARKETS AND APPLICATIONS • Notebook Industry 47296 Socket S1 ORDERING INFORMATION Lead-Free Order No. Description 47296-6111 1.27mm (0.050”) Pitch Socket S1, 638 Circuits, 0.25μm (10μ”) Gold, Vertical, Surface Mount Bringing People & Technology Together, WorldwideSM Americas Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 1-800-78MOLEX [email protected] Far East North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 [email protected] Far East South Headquarters Jurong, Singapore 65-6-268-6868 [email protected] European Headquarters Munich, Germany 49-89-413092-0 [email protected] Corporate Headquarters 2222 Wellington Ct. Lisle, Illinois 60532 USA 630-969-4550 Visit our Web site at http://www.molex.com Order No. SNG-050 ©2006, Molex