www.ti.com FEATURES • • • • • • • Member of the Texas Instruments Widebus™ Family Operates From 1.65 to 3.6 V Max tpd of 4.2 ns at 3.3 V ±24-mA Output Drive at 3.3 V Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) DESCRIPTION/ORDERING INFORMATION This 16-bit edge-triggered D-type flip-flop is designed for 1.65-V to 3.6-V VCC operation. The SN74ALVCH16374 is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. It can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK) input, the Q outputs of the flip-flop take on the logic levels at the data (D) inputs. OE can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components. SN74ALVCH16374 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS SCES021L – JULY 1995 – REVISED SEPTEMBER 2004 DGG, DGV, OR DL PACKAGE (TOP VIEW) 1OE 1Q1 1Q2 GND 1Q3 1Q4 VCC 1Q5 1Q6 GND 1Q7 1Q8 2Q1 2Q2 GND 2Q3 2Q4 VCC 2Q5 2Q6 GND 2Q7 2Q8 2OE 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 1CLK 1D1 1D2 GND 1D3 1D4 VCC 1D5 1D6 GND 1D7 1D8 2D1 2D2 GND 2D3 2D4 VCC 2D5 2D6 GND 2D7 2D8 2CLK OE does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1995–2004, Texas Instruments Incorporated SN74ALVCH16374 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS www.ti.com SCES021L – JULY 1995 – REVISED SEPTEMBER 2004 ORDERING INFORMATION PACKAGE (1) TA Tape and reel SN74ALVCH16374DLR TSSOP - DGG Tape and reel SN74ALVCH16374DGGR ALVCH16374 TVSOP - DGV Tape and reel SN74ALVCH16374DGVR VH374 VFBGA - GQL Tape and reel VFBGA - ZQL (Pb-free) (1) TOP-SIDE MARKING SN74ALVCH16374DL SSOP - DL -40°C to 85°C ORDERABLE PART NUMBER Tube ALVCH16374 SN74ALVCH16374KR VH374 74ALVCH16374ZQLR Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guideline are available at www.ti.com/sc/package. GQL OR ZQL PACKAGE (TOP VIEW) TERMINAL ASSIGNMENTS (1) 1 2 3 4 5 6 A 1OE NC NC NC NC 1CLK A B 1Q2 1Q1 GND GND 1D1 1D2 B C 1Q4 1Q3 VCC VCC 1D3 1D4 C D 1Q6 1Q5 GND GND 1D5 1D6 D E 1Q8 1Q7 1D7 1D8 1 2 3 4 5 6 E F G H F 2Q1 2Q2 2D2 2D1 G 2Q3 2Q4 GND GND 2D4 2D3 H 2Q5 2Q6 VCC VCC 2D6 2D5 J 2Q7 2Q8 GND GND 2D8 2D7 K 2OE NC NC NC NC 2CLK J K (1) NC - No internal connection FUNCTION TABLE (each flip-flop) INPUTS OE CLK D OUTPUT Q L ↑ H H L ↑ L L L H or L X Q0 H X X Z LOGIC DIAGRAM (POSITIVE LOGIC) 1OE 1CLK 1D1 1 2OE 48 47 2CLK C1 2 1D To Seven Other Channels Pin numbers shown are for the DGG, DGV, and DL packages. 2 1Q1 24 25 C1 2D1 36 1D To Seven Other Channels 13 2Q1 SN74ALVCH16374 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS www.ti.com SCES021L – JULY 1995 – REVISED SEPTEMBER 2004 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage range -0.5 4.6 V VI Input voltage range (2) -0.5 4.6 V VO Output voltage range (2) (3) -0.5 VCC + 0.5 IIK Input clamp current VI < 0 IOK Output clamp current VO < 0 IO Continuous output current Continuous current through each VCC or GND θJA Package thermal impedance (4) Tstg Storage temperature range (1) (2) (3) (4) mA -50 mA ±50 mA ±100 mA DGG package 70 DGV package 58 DL package 63 GQL/ZQL package V -50 °C/W 42 -65 °C 150 Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. This value is limited to 4.6 V, maximum. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VCC = 1.65 V to 1.95 V VIH High-level input voltage MIN MAX 1.65 3.6 Low-level input voltage V 0.65 × VCC VCC = 2.3 V to 2.7 V 1.7 VCC = 2.7 V to 3.6 V 2 V 0.35 × VCC VCC = 1.65 V to 1.95 V VIL UNIT VCC = 2.3 V to 2.7 V 0.7 VCC = 2.7 V to 3.6 V 0.8 V VI Input voltage 0 VCC V VO Output voltage 0 VCC V IOH High-level output current IOL Low-level output current ∆t/∆v Input transition rise or fall rate TA Operating free-air temperature (1) VCC = 1.65 V -4 VCC = 2.3 V -12 VCC = 2.7 V -12 VCC = 3 V -24 VCC = 1.65 V 4 VCC = 2.3 V 12 VCC = 2.7 V 12 VCC = 3 V 24 -40 mA mA 10 ns/V 85 °C All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 3 SN74ALVCH16374 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS www.ti.com SCES021L – JULY 1995 – REVISED SEPTEMBER 2004 ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = -100 µA 1.65 V to 3.6 V 1.65 V IOH = -6 mA 2.3 V 2 2.3 V 1.7 2.7 V 2.2 3V 2.4 IOH = -24 mA 3V 2 IOL = 100 µA IOH = -12 mA II(hold) 0.2 1.65 V 0.45 IOL = 6 mA 2.3 V 0.4 2.3 V 0.7 1.65 V 25 1.65 V -25 VI = 0.7 V 2.3 V 45 VI = 1.7 V 2.3 V -45 VI = 0.8 V 3V 75 3V -75 VI = VCC or GND, IO = 0 ∆ICC One input at VCC - 0.6 V, Other inputs at VCC or GND (1) (2) V µA µA 3.6 V ±500 3.6 V ±10 µA 3.6 V 40 µA 3 V to 3.6 V 750 µA V (2) ICC Outputs ±5 VI = 1.07 V VO = VCC or GND Co 0.55 VI = 0.58 V VI = 0 to 3.6 Data inputs 0.4 3V 3.6 V IOZ Control inputs 2.7 V VI = VCC or GND VI = 2 V Ci V 1.65 V to 3.6 V IOL = 24 mA UNIT 1.2 IOL = 4 mA IOL = 12 mA II MAX VCC - 0.2 IOH = -4 mA VOH VOL MIN TYP (1) VCC VI = VCC or GND 3.3 V VO = VCC or GND 3.3 V 3 pF 6 7 pF All typical values are at VCC = 3.3 V, TA = 25°C. This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another. TIMING REQUIREMENTS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) VCC = 1.8 V MIN fclock TYP VCC = 2.5 V ± 0.2 V MIN (1) Clock frequency MAX VCC = 2.7 V MIN 150 MAX VCC = 3.3 V ± 0.3 V MIN 150 UNIT MAX 150 MHz tw Pulse duration, CLK high or low (1) 3.3 3.3 3.3 ns tsu Setup time, data before CLK↑ (1) 2.1 2.2 1.9 ns th Hold time, data after CLK↑ (1) 0.6 0.5 0.5 ns (1) 4 This information was not available at the time of publication. SN74ALVCH16374 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS www.ti.com SCES021L – JULY 1995 – REVISED SEPTEMBER 2004 SWITCHING CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) VCC = 1.8 V TO (OUTPUT) MIN (1) fmax tpd (1) TYP CLK VCC = 2.5 V ± 0.2 V MIN VCC = 2.7 V MAX 150 MIN MAX 150 (1) 1 5.3 4.9 1 6.2 1 5.3 ten OE Q tdis OE Q (1) MIN UNIT MAX 150 Q (1) VCC = 3.3 V ± 0.3 V MHz 1 4.2 ns 5.9 1 4.8 ns 4.7 1.2 4.3 ns This information was not available at the time of publication. OPERATING CHARACTERISTICS TA = 25°C TEST CONDITIONS PARAMETER Cpd Power dissipation capacitance (1) Outputs enabled Outputs disabled CL = 50 pF, f = 10 MHz VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V TYP TYP TYP (1) 31 30 (1) 16 18 UNIT pF This information was not available at the time of publication. 5 SN74ALVCH16374 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH 3-STATE OUTPUTS www.ti.com SCES021L – JULY 1995 – REVISED SEPTEMBER 2004 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test Open GND CL (see Note A) RL TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUT VCC 1.8 V 2.5 V ± 0.2 V 2.7 V 3 V ± 0.3 V VI tr/tf VCC VCC 2.7 V 2.7 V ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ VCC/2 VCC/2 1.5 V 1.5 V 2 × VCC 2 × VCC 6V 6V 30 pF 30 pF 50 pF 50 pF 1 kΩ 500 Ω 500 Ω 500 Ω 0.15 V 0.15 V 0.3 V 0.3 V tw VI Timing Input VM VM VM 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VM VM 0V tPLH Output Control (low-level enabling) tPLZ VLOAD/2 VM tPZH VOH VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPHL VM VI VM tPZL VI Input VOLTAGE WAVEFORMS PULSE DURATION th VI Data Input VM 0V 0V tsu Output VI VM Input Output Waveform 2 S1 at GND (see Note B) VOL + V∆ VOL tPHZ VOH VM VOH − V∆ 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 6 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing 74ALVCH16374DGGRE4 ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCH16374DGVRE4 ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCH16374DLG4 ACTIVE SSOP DL 48 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCH16374DLRG4 ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCH16374ZQLR ACTIVE BGA MI CROSTA R JUNI OR ZQL 56 1000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM SN74ALVCH16374DGGR ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCH16374DGVR ACTIVE TVSOP DGV 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCH16374DL ACTIVE SSOP DL 48 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCH16374DLR ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCH16374KR ACTIVE GQL 56 1000 SNPB Level-1-240C-UNLIM BGA MI CROSTA R JUNI OR Pins Package Eco Plan (2) Qty 25 25 TBD Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. Falls within JEDEC: 24/48 Pins – MO-153 14/16/20/56 Pins – MO-194 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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