TI SN74ALVCH162374GR

SN74ALVCH162374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES092F – JANUARY 1997 – REVISED OCTOBER 2004
FEATURES
•
•
•
•
•
DGG OR DL PACKAGE
(TOP VIEW)
Member of the Texas Instruments Widebus™
Family
Bus Hold on Data Inputs Eliminates the Need
for External Pullup/Pulldown Resistors
Output Ports Have Equivalent 26-Ω Series
Resistors, So No External Resistors Are
Required
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
1OE
1Q1
1Q2
GND
1Q3
1Q4
VCC
1Q5
1Q6
GND
1Q7
1Q8
2Q1
2Q2
GND
2Q3
2Q4
VCC
2Q5
2Q6
GND
2Q7
2Q8
2OE
DESCRIPTION/ORDERING INFORMATION
This 16-bit edge-triggered D-type flip-flop is designed
for 1.65-V to 3.6-V VCC operation.
The SN74ALVCH162374 is particularly suitable for
implementing buffer registers, I/O ports, bidirectional
bus drivers, and working registers. It can be used as
two 8-bit flip-flops or one 16-bit flip-flop. On the
positive transition of the clock (CLK) input, the Q
outputs of the flip-flop take on the logic levels set up
at the data (D) inputs.
The output-enable (OE) input can be used to place
the eight outputs in either a normal logic state (high
or low logic levels) or a high-impedance state. In the
high-impedance state, the outputs neither load nor
drive the bus lines significantly. The high-impedance
state and the increased drive provide the capability to
drive bus lines without need for interface or pullup
components. OE does not affect internal operations
of the flip-flop. Old data can be retained or new data
can be entered while the outputs are in the
high-impedance state.
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
1CLK
1D1
1D2
GND
1D3
1D4
VCC
1D5
1D6
GND
1D7
1D8
2D1
2D2
GND
2D3
2D4
VCC
2D5
2D6
GND
2D7
2D8
2CLK
The outputs, which are designed to sink up to 12 mA, include equivalent 26-Ω resistors to reduce overshoot and
undershoot.
ORDERING INFORMATION
PACKAGE (1)
TA
-40°C to 85°C
SSOP - DL
TSSOP - DGG
(1)
ORDERABLE PART NUMBER
Tube
SN74ALVCH162374DL
Tape and reel
SN74ALVCH162374DLR
Tape and reel
SN74ALVCH162374GR
TOP-SIDE MARKING
ALVCH162374
ALVCH162374
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1997–2004, Texas Instruments Incorporated
SN74ALVCH162374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES092F – JANUARY 1997 – REVISED OCTOBER 2004
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors
with the bus-hold circuitry is not recommended.
FUNCTION TABLE
(each flip-flop)
INPUTS
2
OE
CLK
D
OUTPUT
Q
L
↑
H
H
L
↑
L
L
L
H or L
X
Q0
H
X
X
Z
SN74ALVCH162374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES092F – JANUARY 1997 – REVISED OCTOBER 2004
LOGIC SYMBOL(1)
1OE
1CLK
2OE
2CLK
1D1
1D2
1D3
1D4
1D5
1D6
1D7
1D8
2D1
2D2
2D3
2D4
2D5
2D6
2D7
2D8
1
1EN
48
C1
24
2EN
25
C2
47
1D
2
1
46
3
44
5
43
6
41
8
40
9
38
11
37
12
36
13
2D
2
35
14
33
16
32
17
30
19
29
20
27
22
26
23
1Q1
1Q2
1Q3
1Q4
1Q5
1Q6
1Q7
1Q8
2Q1
2Q2
2Q3
2Q4
2Q5
2Q6
2Q7
2Q8
(1) This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
LOGIC DIAGRAM (POSITIVE LOGIC)
1OE
1CLK
1D1
1
2OE
48
47
2CLK
C1
1D
To Seven Other Channels
2
1Q1
24
25
C1
2D1
36
1D
13
2Q1
To Seven Other Channels
3
SN74ALVCH162374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES092F – JANUARY 1997 – REVISED OCTOBER 2004
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage range
-0.5
4.6
V
VI
Input voltage range (2)
-0.5
4.6
V
VO
Output voltage range (2) (3)
-0.5
VCC + 0.5
IIK
Input clamp current
VI < 0
IOK
Output clamp current
VO < 0
IO
Continuous output current
Continuous current through each VCC or GND
θJA
Package thermal impedance (4)
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
mA
-50
mA
±50
mA
±100
mA
DGG package
89
DL package
94
-65
V
-50
150
°C/W
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
This value is limited to 4.6 V maximum.
The package thermal impedance is calculated in accordance with JESD 51.
RECOMMENDED OPERATING CONDITIONS (1)
VCC
Supply voltage
VCC = 1.65 V to 1.95 V
VIH
High-level input voltage
MIN
MAX
1.65
3.6
Low-level input voltage
V
0.65 × VCC
VCC = 2.3 V to 2.7 V
1.7
VCC = 2.7 V to 3.6 V
2
V
0.35 × VCC
VCC = 1.65 V to 1.95 V
VIL
UNIT
VCC = 2.3 V to 2.7 V
0.7
VCC = 2.7 V to 3.6 V
0.8
V
VI
Input voltage
0
VCC
V
VO
Output voltage
0
VCC
V
IOH
High-level output current
VCC = 1.65 V
-2
VCC = 2.3 V
-6
VCC = 2.7 V
-8
VCC = 3 V
IOL
Low-level output current
∆t/∆v
Input transition rise or fall rate
TA
Operating free-air temperature
-12
VCC = 1.65 V
2
VCC = 2.3 V
6
VCC = 2.7 V
8
VCC = 3 V
(1)
4
mA
mA
12
-40
10
ns/V
85
°C
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SN74ALVCH162374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES092F – JANUARY 1997 – REVISED OCTOBER 2004
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
IOH = -100 µA
VOH
1.65 V to 3.6 V
1.65 V
1.2
IOH = -4 mA
2.3 V
1.9
2.3 V
1.7
3V
2.4
IOH = -8 mA
2.7 V
2
IOH = -12 mA
3V
2
IOL = 100 µA
II(hold)
MAX
1.65 V to 3.6 V
0.2
1.65 V
0.45
IOL = 4 mA
2.3 V
0.4
2.3 V
0.55
3V
0.55
IOL = 8 mA
2.7 V
0.6
IOL = 12 mA
3V
0.8
V
±5
VI = VCC or GND
3.6 V
VI = 0.58 V
1.65 V
25
VI = 1.07 V
1.65 V
-25
VI = 0.7 V
2.3 V
45
VI = 1.7 V
2.3 V
-45
VI = 0.8 V
3V
75
3V
-75
VI = 2 V
UNIT
V
IOL = 2 mA
IOL = 6 mA
II
TYP (1)
VCC - 0.2
IOH = -2 mA
IOH = -6 mA
VOL
MIN
µA
µA
VI = 0 to 3.6 V (2)
3.6 V
±500
IOZ
VO = VCC or GND
3.6 V
±10
µA
ICC
VI = VCC or GND, IO = 0
3.6 V
40
µA
750
µA
∆ICC
Ci
Data inputs
Co
(1)
(2)
One input at VCC - 0.6 V, Other inputs at VCC or GND
Control inputs
Outputs
3 V to 3.6 V
VI = VCC or GND
3.3 V
VO = VCC or GND
3.3 V
3
pF
6
7
pF
All typical values are at VCC = 3.3 V, TA = 25°C.
This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to
another.
TIMING REQUIREMENTS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
VCC = 1.8 V
MIN
MAX
VCC = 2.5 V
± 0.2 V
MIN
(1)
MAX
VCC = 2.7 V
MIN
MIN
150
UNIT
MAX
fclock
Clock frequency
tw
Pulse duration, CLK high or low
(1)
3.3
3.3
3.3
ns
tsu
Setup time, data before CLK↑
(1)
2.1
2.2
1.9
ns
th
Hold time, data after CLK↑
(1)
0.6
0.5
0.5
ns
(1)
150
MAX
VCC = 3.3 V
± 0.3 V
150
MHz
This information was not available at the time of publication.
5
SN74ALVCH162374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES092F – JANUARY 1997 – REVISED OCTOBER 2004
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
(1)
MIN
TYP
(1)
fmax
tpd
VCC = 2.5 V
± 0.2 V
VCC = 1.8 V
CLK
MIN
VCC = 3.3 V
± 0.3 V
VCC = 2.7 V
MAX
MIN
150
MAX
150
(1)
1
5.4
5.4
1
6.5
1
5.6
ten
OE
Q
tdis
OE
Q
(1)
UNIT
MAX
150
Q
(1)
MIN
MHz
1
4.6
ns
6.4
1
5.2
ns
5
1.2
4.5
ns
This information was not available at the time of publication.
OPERATING CHARACTERISTICS
TA = 25°C
PARAMETER
Cpd Power dissipation capacitance
(1)
6
TEST CONDITIONS
Outputs enabled
Outputs disabled
CL = 0, f = 10 MHz
This information was not available at the time of publication.
VCC = 1.8 V
VCC = 2.5 V
VCC = 3.3 V
TYP
TYP
TYP
(1)
28
31
(1)
10
11
UNIT
pF
SN74ALVCH162374
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH 3-STATE OUTPUTS
www.ti.com
SCES092F – JANUARY 1997 – REVISED OCTOBER 2004
PARAMETER MEASUREMENT INFORMATION
VLOAD
S1
RL
From Output
Under Test
Open
GND
CL
(see Note A)
RL
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
LOAD CIRCUIT
INPUT
VCC
1.8 V ± 0.15 V
2.5 V ± 0.2 V
2.7 V
3.3 V ± 0.3 V
VI
tr/tf
VCC
VCC
2.7 V
2.7 V
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
VM
VLOAD
CL
RL
V∆
VCC/2
VCC/2
1.5 V
1.5 V
2 × VCC
2 × VCC
6V
6V
30 pF
30 pF
50 pF
50 pF
1 kΩ
500 Ω
500 Ω
500 Ω
0.15 V
0.15 V
0.3 V
0.3 V
tw
VI
Timing
Input
VM
VM
VM
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VM
VM
0V
tPLH
Output
Control
(low-level
enabling)
tPLZ
VLOAD/2
VM
tPZH
VOH
VM
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VM
0V
Output
Waveform 1
S1 at VLOAD
(see Note B)
tPHL
VM
VI
VM
tPZL
VI
Input
VOLTAGE WAVEFORMS
PULSE DURATION
th
VI
Data
Input
VM
0V
0V
tsu
Output
VI
VM
Input
Output
Waveform 2
S1 at GND
(see Note B)
VOL + V∆
VOL
tPHZ
VOH
VM
VOH − V∆
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
7
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74ALVCH162374DLG4
ACTIVE
SSOP
DL
48
74ALVCH162374DLRG4
ACTIVE
SSOP
DL
74ALVCH162374GRE4
ACTIVE
TSSOP
74ALVCH162374GRG4
ACTIVE
SN74ALVCH162374DGGR
25
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
OBSOLETE
TSSOP
DGG
48
SN74ALVCH162374DL
ACTIVE
SSOP
DL
48
SN74ALVCH162374DLR
ACTIVE
SSOP
DL
SN74ALVCH162374GR
ACTIVE
TSSOP
DGG
TBD
Call TI
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
25
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74ALVCH162374DLR
SSOP
DL
48
1000
330.0
32.4
11.35
16.2
3.1
16.0
32.0
Q1
SN74ALVCH162374GR
TSSOP
DGG
48
2000
330.0
24.4
8.6
15.8
1.8
12.0
24.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74ALVCH162374DLR
SSOP
DL
48
1000
346.0
346.0
49.0
SN74ALVCH162374GR
TSSOP
DGG
48
2000
346.0
346.0
41.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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dsp.ti.com
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logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
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