TCM809/TCM810 3-Pin Microcontroller Reset Monitors Features General Description • Precision VDD Monitor for 2.5V, 3.0V, 3.3V, 5.0V Nominal System Voltage Supplies • 140 msec Minimum RESET Time Out Period • RESET Output to VDD = 1.0V (TCM809) • Low Supply Current, 9 µA (typ.) • VDD Transient Immunity • Small 3-Pin SC-70 and SOT-23B Packages • No External Components • Push-Pull RESET Output • Temperature Range: - Industrial, SC-70 (E): -40°C to +85°C - Extended, SOT-23, SC-70 (V): -40°C to +125°C The TCM809 and TCM810 are cost-effective system supervisor circuits designed to monitor VDD in digital systems and provide a reset signal to the host processor, when necessary. No external components are required. Applications • • • • • Computers Embedded Systems Battery-Powered Equipment Critical Microcontroller Power Supply Monitoring Automotive The RESET output is typically driven active within 65 µsec of VDD falling through the reset voltage threshold. RESET is maintained active for a minimum of 140 msec after VDD rises above the reset threshold. The TCM810 has an active-high RESET output, while the TCM809 has an active-low RESET output. The output of the TCM809/TCM810 is valid down to VDD = 1V. Both devices are available in 3-Pin SC-70 and SOT-23B packages. The TCM809/TCM810 is optimized to reject fast transient glitches on the VDD line. A low supply current of 9 µA (typ., VDD = 3.3V) make these devices suitable for battery-powered applications. Pin Configurations SOT-23B/SC-70 Typical Application Circuit GND 1 VDD 3 VDD PICmicro® Microcontroller TCM809 RESET TCM809/ TCM810 VDD 2 GND 1 2004 Microchip Technology Inc. RESET INPUT (Active-Low) GND TCM809 RESET TCM810 (RESET) 3 VDD 2 Note: 3-Pin SOT-23B is equivalent to JEDEC TO-236. DS21661C-page 1 TCM809/TCM810 1.0 ELECTRICAL CHARACTERISTICS PIN FUNCTION TABLE NAME Absolute Maximum Ratings† GND Supply Voltage (VDD to GND) ..........................................6.0V FUNCTION Ground. RESET (TCM809) RESET push-pull output remains low while VDD is below the reset voltage threshold and for 240 msec (140 msec min.) after VDD rises above reset threshold. RESET, RESET.................................... – 0.3V to (VDD +0.3V) Input Current, VDD.........................................................20 mA Output Current, RESET, RESET...................................20 mA dV/dt (VDD) ............................................................. 100V/µsec Operating Temperature Range.................... – 40°C to +125°C RESET (TCM810) RESET push-pull output remains high while VDD is below the reset voltage threshold and for 240 msec (140 msec min.) after VDD rises above reset threshold. Power Dissipation (TA = 70°C): 3-Pin SOT-23B (derate 4 mW/°C above +70°C) ......320 mW 3-Pin SC-70 (derate 2.17 mW/°C above +70°C)......174 mW Storage Temperature Range ....................... – 65°C to +150°C Maximum Junction Temperature, TJ .............................. 150°C † Notice: Stresses above those listed under “Maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Supply voltage (+2.5V, +3.0V, +3.3V, +5.0V). VDD ELECTRICAL CHARACTERISTICS VDD = Full Range, TA = Operating Temperature Range, unless otherwise noted. Typical values are at TA = +25°C, VDD = 5V for L/M/J, 3.3V for T/S, 3.0V for R and 2.5V for Z (Note 1). Parameter Sym Min Typ Max Units 1.0 — 5.5 V 1.2 — 5.5 — 12 30 — 9 25 4.56 4.63 4.70 4.50 — 4.75 4.31 4.38 4.45 V 4.25 — 4.50 V 3.93 4.00 4.06 V 3.89 — 4.10 V 3.04 3.08 3.11 V 3.00 — 3.15 V 2.89 2.93 2.96 V 2.85 — 3.00 V 2.59 2.63 2.66 V 2.55 — 2.70 V 2.28 2.32 2.35 V 2.25 — 2.38 V Reset Threshold Tempco — 30 — ppm/°C VDD to Reset Delay, — 65 — µsec 140 320 560 msec VDD Range Supply Current Reset Threshold (Note 2) Reset Active Time Out Period ICC VTH Test Conditions TA = 0°C to +70°C TA = – 40°C to +125°C µA V TCM8xxL/M/J: VDD < 5.5V TCM8xxR/S/T/Z: VDD < 3.6V TCM8xxL: TA = +25°C TA = – 40°C to +125°C TCM8xxM: TA = +25°C TA = – 40°C to +125°C TCM809J: TA = +25°C TA = – 40°C to +125°C TCM8xxT: TA = +25°C TA = – 40°C to +125°C TCM8xxS: TA = +25°C TA = – 40°C to +125°C TCM8xxR: TA = +25°C TA = – 40°C to +125°C TCM8xxZ: TA = +25°C TA = – 40°C to +125°C VDD = VTH to (VTH – 100 mV) (Note 2) Note 1: Production testing done at TA = +25°C, overtemperature limits ensured by QC screen. 2: RESET output for TCM809, RESET output for TCM810. DS21661C-page 2 2004 Microchip Technology Inc. TCM809/TCM810 ELECTRICAL CHARACTERISTICS (CONTINUED) VDD = Full Range, TA = Operating Temperature Range, unless otherwise noted. Typical values are at TA = +25°C, VDD = 5V for L/M/J, 3.3V for T/S, 3.0V for R and 2.5V for Z (Note 1). Parameter Sym Min Typ Max Units RESET Output Voltage Low (TCM809) VOL — — 0.3 V — — 0.4 RESET Output Voltage High (TCM809) VOH RESET Output Voltage Low (TCM810) VOL RESET Output Voltage High (TCM810) VOH — — 0.3 0.8 VDD — — VDD – 1.5 — — — — 0.3 — — 0.4 0.8 VDD — — Test Conditions TCM809R/S/T/Z: VDD = VTH min, ISINK = 1.2 mA TCM809L/M/J: VDD = VTH min, ISINK = 3.2 mA VDD > 1.0V, ISINK = 50 µA V TCM809R/S/T/Z: VDD > VTH max, ISOURCE = 500 µA TCM809L/M/J: VDD > VTH max, ISOURCE = 800 µA V TCM810R/S/T/Z:VDD = VTH max, ISINK = 1.2 mA V 1.8 < VDD < VTH min, ISOURCE = 150 µA TCM810L/M: VDD = VTH max, ISINK = 3.2 mA Note 1: Production testing done at TA = +25°C, overtemperature limits ensured by QC screen. 2: RESET output for TCM809, RESET output for TCM810. 2004 Microchip Technology Inc. DS21661C-page 3 TCM809/TCM810 2.0 TYPICAL PERFORMANCE CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 18 TCM8xx/R/S/T/Z, No Load 450 16 VDD = 5V 400 Power-up Reset Timeout (µsec) Supply Current ( µA) 14 12 10 VDD = 3V 8 6 4 VDD = 1V 2 350 300 250 200 150 100 50 0 -40 -20 0 20 40 60 80 100 0 120 -40 Temperature (°C) FIGURE 2-1: Temperature. -20 0 20 FIGURE 2-3: vs. Temperature. Supply Current vs. 16 40 60 Temperature (°C) 80 100 120 Power-up Reset Time Out 1.001 TCM8xx/L/M/J, No Load 14 Normalized Reset Threshold VDD = 5V Supply Current ( µA) 12 10 VDD = 3V 8 6 VDD = 1V 4 1 0.999 0.998 2 0 0.997 -40 -20 0 20 40 60 80 100 Temperature (°C) FIGURE 2-2: Temperature. DS21661C-page 4 Supply Current vs. 120 -40 -20 0 20 40 60 80 100 120 Temperature (°C) FIGURE 2-4: Normalized Reset Threshold vs. Temperature. 2004 Microchip Technology Inc. TCM809/TCM810 3.0 APPLICATIONS INFORMATION 3.1 VDD Transient Rejection The TCM809/TCM810 provides accurate VDD monitoring and reset timing during power-up, power-down and brown-out/sag conditions. These devices also reject negative-going transients (glitches) on the power supply line. Figure 3-1 shows the maximum transient duration vs. maximum negative excursion (overdrive) for glitch rejection. Any combination of duration and overdrive that lies under the curve will not generate a reset signal. VDD VTH Overdrive Maximum Transient Duration (µsec) Duration 400 TA = +25°C Combinations above the curve are detected as a brown-out or power-down condition. Transient immunity can be improved by adding a capacitor in close proximity to the VDD pin of the TCM809/TCM810. 3.2 RESET Signal Integrity During Power-Down The TCM809 RESET output is valid to VDD = 1.0V. Below this voltage the output becomes an "open circuit" and does not sink current. This means CMOS logic inputs to the microcontroller will be floating at an undetermined voltage. Most digital systems are completely shut down well above this voltage. However, in situations where RESET must be maintained valid to VDD = 0V, a pull-down resistor must be connected from RESET to ground to discharge stray capacitances and hold the output low (Figure 3-2). This resistor value, though not critical, should be chosen such that it does not appreciably load RESET under normal operation (100 kΩ will be suitable for most applications). Similarly, a pull-up resistor to VDD is required for the TCM810 to ensure a valid high RESET for VDD below 1.0V. 320 VDD 240 160 VDD TCM8XXL/M/J (SOT-23) 80 0 TCM809 TCM8XXZ/R/S/T (SOT-23) 1 RESET 5 1000 100 Reset Comparator Overdrive [VTH - VDD] (mv) GND R1 100 kΩ VDD to Reset Delay (µsec) 130 120 FIGURE 3-2: The addition of R1 at the RESET output of the TCM809 ensures that the RESET output is valid to VDD = 0V. TCM8XXL/M/J (SC-70) 110 100 90 80 70 60 50 TCM8XXZ/R/S/T (SC-70) 40 30 1 10 100 1000 Reset Comparator Overdrive (mV) [VTH - VDD] (mv) FIGURE 3-1: Maximum Transient Duration vs. Overdrive for Glitch Rejection at +25°C. 2004 Microchip Technology Inc. DS21661C-page 5 TCM809/TCM810 3.3 Controllers and Processors With Bidirectional I/O Pins Some microcontrollers have bidirectional reset pins. Depending on the current drive capability of the controller pin, an indeterminate logic level may result if there is a logic conflict. This can be avoided by adding a 4.7 kΩ resistor in series with the output of the TCM809/ TCM810 (Figure 3-3). If there are other components in the system that require a reset signal, they should be buffered so as not to load the reset line. If the other components are required to follow the reset I/O of the microcontroller, the buffer should be connected as shown with the solid line. Buffer Buffered RESET To Other System Components VDD TCM809 4.7 kΩ RESET GND PICmicro® Microcontroller RESET GND FIGURE 3-3: Interfacing the TCM809 to a Bidirectional RESET I/O. DS21661C-page 6 2004 Microchip Technology Inc. TCM809/TCM810 4.0 PACKAGING INFORMATION 4.1 Package Marking Information 3-Pin SOT-23B 3-Pin SC-70 cdef c d e f g h Top Side Bottom Side Part Number TCM809LENB J1 TCM809MENB J2 TCM809TENB J3 TCM809SENB J4 TCM809RENB J5 TCM809JENB J6 TCM809ZENB J7 TCM809LVNB/TCM809LVLB JZ TCM809MVNB/TCM809MVLB JY TCM809TVNB/TCM809TVLB JX TCM809SVNB/TCM809SVLB JV TCM809RVNB/TCM809RVLB JU TCM809JVNB/TCM809JVLB JT TCM809ZVNB/TCM809ZVLB JS (SC-70 package only) Part Number Legend: Note: 1 2 3 4 5 6 SOT-23/SC-70 SOT-23/SC-70 TCM810LENB TCM810MENB TCM810TENB TCM810SENB TCM810RENB TCM810ZENB K1 K2 K3 K4 K5 K6 TCM810LVNB/TCM810LVLB TCM810MVNB/TCM810MVLB TCM810TVNB/TCM810TVLB TCM810SVNB/TCM810SVLB TCM810RVNB/TCM810RVLB KZ KY KX KV KU Part Number + temperature range and voltage (two-digit code) Part Number + temperature range and voltage (two-digit code) Lot ID number Year and work week Year and work week Year and work week In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. 2004 Microchip Technology Inc. DS21661C-page 7 TCM809/TCM810 3-Lead Plastic Small Outline Transistor (NB) (SOT-23) E E1 2 B p1 n D p 1 α c A φ β A1 L Units Dimension Limits n Number of Pins p Pitch p1 Outside lead pitch (basic) Overall Height A Molded Package Thickness A2 Standoff § A1 Overall Width E Molded Package Width E1 Overall Length D Foot Length L φ Foot Angle c Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A2 B α β MIN .035 .035 .000 .083 .047 .110 .014 0 .004 .015 0 0 INCHES* NOM 3 .038 .076 .040 .037 .002 .093 .051 .115 .018 5 .006 .017 5 5 MAX .044 .040 .004 .104 .055 .120 .022 10 .007 .020 10 10 MILLIMETERS NOM 3 0.96 1.92 0.89 1.01 0.88 0.95 0.01 0.06 2.10 2.37 1.20 1.30 2.80 2.92 0.35 0.45 0 5 0.09 0.14 0.37 0.44 0 5 0 5 MIN MAX 1.12 1.02 0.10 2.64 1.40 3.04 0.55 10 0.18 0.51 10 10 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: TO-236 Drawing No. C04-104 DS21661C-page 8 2004 Microchip Technology Inc. TCM809/TCM810 3-Lead Plastic Small Outline Transistor (LB) (SC-70) E E1 2 B p1 3 D p 1 a A2 A c b A1 L Units Dimension Limits Number of Pins Pitch Outside lead pitch (basic) Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom p p1 A A2 A1 E E1 D L c B a b INCHES MIN 3 .026 BSC. .051 BSC. .031 .031 .000 .071 .045 .071 .004 .003 .006 8˚ 8˚ MAX .043 .039 .0004 .094 .053 .089 .016 .010 .016 12˚ 12˚ MILLIMETERS* MIN MAX 3 0.65 BSC. 1.30 BSC. 0.80 1.10 0.80 1.00 0.00 .010 1.80 2.40 1.15 1.35 1.80 2.25 0.10 0.41 0.08 0.25 0.15 0.40 8˚ 12˚ 8˚ 12˚ *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. JEITA (EIAJ) Equivalent: SC70 Drawing No. C04-104 2004 Microchip Technology Inc. DS21661C-page 9 TCM809/TCM810 4.2 Product Tape and Reel Specifications FIGURE 4-1: EMBOSSED CARRIER DIMENSIONS (8, 12, 16, AND 24 MM TAPE ONLY) Top Cover Tape A0 W B0 K0 P TABLE 1: CARRIER TAPE/CAVITY DIMENSIONS Case Outline Carrier Dimensions Package Type W mm Cavity Dimensions P mm A0 mm B0 mm K0 mm Output Quantity Units Reel Diameter in mm NB SOT-23 3L 8 4 3.15 2.77 1.22 3000 180 LB SC-70 3L 8 4 2.4 2.4 1.19 3000 180 3-LEAD SOT-23/SC70 DEVICE TAPE AND REEL SPECIFICATIONS Device Marking FIGURE 4-2: User Direction of Feed Device Marking Pin 1 W, Width of Carrier Tape Pin 1 P, Pitch Standard Reel Component Orientation DS21661C-page 10 Reverse Reel Component Orientation 2004 Microchip Technology Inc. TCM809/TCM810 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X X XXXXX Device VDD Temperature Range Package Reset Threshold Device: TCM809: Supervisor circuit with active-low RESET output TCM810: Supervisor circuit with active-high RESET output VDD Reset Threshold: L M J T S R Z = = = = = = = Temperature Range: E V = -40°C to +85°C = -40°C to +125°C Package: NB713 = SOT-23B, 3-pin (Tape and Reel) LB713 = SC-70, 3-pin (Tape and Reel) 4.63V 4.38V 4.00V 3.08V 2.93V 2.63V 2.32V Examples: a) TCM809LENB713: b) TCM809LVLB713: c) TCM809LVNB713: a) TCM810MENB713: b) TCM810RVLB713: c) TCM810TVLB713: SOT-23B-3-TR, Microcontroller 4.63V Reset Monitor, -40°C to +85°C, Tape and Reel. SC-70-3-TR, Microcontroller 4.63V Reset Monitor, -40°C to +125°C, Tape and Reel. SOT-23B-3-TR, Microcontroller 4.63V Reset Monitor, -40°C to +125°C, Tape and Reel. SOT-23B-3-TR, Microcontroller 4.38V Reset Monitor, -40°C to +85°C, Tape and Reel. SOT-23B-3-TR, Microcontroller 2.63V Reset Monitor, -40°C to +125°C, Tape and Reel. SC-70-3-TR, Microcontroller 4.38V Reset Monitor, -40°C to +125°C, Tape and Reel. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2004 Microchip Technology Inc. DS21661C-page 11 TCM809/TCM810 NOTES: DS21661C-page 12 2004 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart and rfPIC are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartShunt and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, Select Mode, SmartSensor, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. © 2004, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. 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