The GbX Backplane Interconnect System Delivers Speeds Beyond 6.0Gbps and High Density With Up To 69 Mated Differential Channels Per Inch The GbX connector system provides the speed, density, and low applied cost required by leading-edge backplane applications. It is especially suited for designs that require future speed upgrades by daughtercard replacement into an existing backplane. With a native differential signaling speed of 6.0Gbps, the system is well suited for existing and future generations of XAUI (10 Gigabit Attachment Unit Interface) and InfiniBand* based systems, in addition to those based on ATCA** (Advanced Telecom Computing Architecture) and OIF (Optical Internetworking Forum) chip protocols. Internetworking and telecommunication equipment engineers will benefit by the GbX connector’s ability to provide not only a high-density, low applied-cost solution in the near term, but also by its electrical performance in upgradeable systems. Speeds of 10.0Gbps and beyond have been demonstrated with appropriate SERDES (Serializer / Deserializer) devices and board-material selection. This allows system architects freedom-of-design for faster future systems without the worry of backwards compatibility, along with the economy of a common backplane for two generations of equipment. 1.85 by 1.85mm (.073 by .073") Pitch GbX® Module-to-Backplane Connector System In 4- and 5-Pair Columns 75220, 75360 Daughtercard Assemblies 75235, 75237 Backplane Signal Headers 75341, 75510 Backplane Power In addition, the GbX L-Series system provides a complimentary high-density open pin field for costeffective design of slower speed circuits along the same stiffener as the standard, high-speed GbX wafers. Features and Benefits ■ Up to 69 real differential pairs per linear inch (27 real differential pairs per 10mm) provide higher density than VHDM-HSD® ■ Bifurcated contact beams in daughtercard receptacle allow greater reliability with two points of contact to header pin ■ Modular daughtercard components with GbX L-Series available as custom, cost-effective receptacle assemblies ■ ■ Optimized differential pair contacts allow easier board trace routing Data rate options up to 10.0Gbps to support future daughtercard speed upgrades SPECIFICATIONS Reference Information Packaging: Daughtercard Assemblies – Tube Headers -- Tray UL File No.: Pending CSA File No.: Pending Designed In: mm Electrical Signal/Shield Contact Current Rating: 1.0A Contact to Plated-Through-Hole Resistance: 1.0 milliohm max. Power Blade Contact Resistance: 3.0 milliohms max. Dielectric Withstanding Voltage: 750V RMS Insulation Resistance: 10,000 Megohms min. Notes: GbX and VHDM-HSD are registered trademarks of Teradyne, Inc. *InfiniBand is a registered trademark of the InfiniBand Trade Association **ATCA is a trademark of the PCI Industrial Manufacturers Group Mechanical Contact Insertion Force: 44.48N (10.00 lb) typical per contact Contact Retention Force: 8.90N (2.00 lb) min. per contact Mating Force: 0.59N (0.13 lb) max. per contact Unmating Force: 0.29N (0.07 lb) min. per contact Durability: 250 cycles max. Physical Housing: Liquid Crystal Polymer, UL 94V-0 Contact: Copper Alloy Plating: Contact Area – 0.76um (30µ”) Gold (Au) min. Solder Tail Area – Tin (Sn) Underplating – Nickel (Ni) PCB Thickness: 1.60mm (.062”) typical Operating Temperature: -55 to 105 degrees C 1.85 by 1.85mm (.073 by .073") Pitch GbX® Module-to-Backplane Connector System In 4- and 5-Pair Columns APPLICATIONS ■ ■ ■ ■ Internetworking Equipment: - Servers, Hubs, and Routers Telecommunications Equipment: - Central Office, Cellular Infrastructure and Multi-platform Service (DSL, Cable Data) systems Medical Diagnostic Equipment Test and Measurement Equipment 75220, 75360 Daughtercard Assemblies 75235, 75237 Backplane Signal Headers 75341, 75510 Backplane Power ORDERING INFORMATION Daughtercard Assembly Signal wafers, power modules and guide modules sequentially assigned by application Backplane Signal Header 10-Column Open 25-Column Open 10-Column Guide Left 25-Column Guide Left 10-Column Guide Right 25-Column Guide Right Backplane Power and Guide Components Power Stand-Alone Guide Pin 4-Pair 75220-XXXX (Wafer 75221-0001 for reference information only) 4-Pair (8 Circuits per Column)* Order No. Circuits 75235-0104 80 75235-0204 200 75235-2104 80 75235-2204 200 75235-4104 80 75235-4204 200 5-Pair 75360-XXXX (Wafer 75361-0001 for reference information only) 5-Pair (10 Circuits per Column)* Order No. Circuits 75237-0104 100 75237-0204 250 75237-2104 100 75237-2204 250 75237-4104 100 75237-4204 250 4-Pair 5-Pair Order No. 75341-4444 Circuits 8 Order No. 75510-4444 75234-0469 Circuits 10 75234-0469 *Note: Multiple keying options available. Contact Molex for details. Americas Headquarters Lisle, Illinois 60532 U.S.A. 1-800-78MOLEX [email protected] Far East North Headquarters Yamato, Kanagawa, Japan 81-462-65-2324 [email protected] Far East South Headquarters Jurong, Singapore 65-6-268-6868 [email protected] European Headquarters Munich, Germany 49-89-413092-0 [email protected] Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. 630-969-4550 Fax:630-969-1352 V isit o u r W e b sit e at www.mo l e x .co m/ pro du ct / back pl an / g bx .h t ml Order No. USA-250 Printed in USA/2.5K/JI/JI/2004.07 2004, Molex ©