HD Mezz The HD Mezz performs at 9.0 GHz/pair at a 20mm stack HD Mezz is a 1.2mm x 2mm grid interconnect system for elevated, high speed board-toboard applications. The high density array’s open pin field design allows both single-ended or differential pair routing. When routed differentially, HD Mezz is rated at 9.0 GHz/pair at a 20mm stack height. The HD Mezz is sourced by both Samtec and Molex Incorporated. Elevated stack heights of 20mm, 25mm, 30mm and 35mm High density elevated board-to-board 143, 195, and 299 positions The HDAM/HDAF Series (HD Mezz) is available in: 1.2mm x 2mm grid • 143, 195, and 299 positions • 20mm, 25mm, 30mm, and 35mm standard stack heights • Custom heights available Dual wipe contacts provide a reliable mating interface and the 1.2mm grid is ideal for applications where PCB real estate is limited. The HD Mezz has the option to contain lead or a lead-free tin alloy, to meet RoHS compliancy requirements. The HDAM/ Guide posts for alignment HDAF Series also incorporates guide posts as a standard feature to aid in alignment. Final Inch® information is available for the HD Mezz system. Final Inch® is a “reference design” for one of the most difficult design issues on the board - the Breakout Region (BOR) around the connector. Samtec can provide empirical TDR and frequency domain data, test boards, and validated electrical models for the HD Mezz ©Samtec, Inc., 2007 system. This information is a time saving and unmatched service in the interconnect industry. Visit www.finalinch. com for more information. Other high density, high speed array interconnects include: • SEARAY™ • DP Array™ • SamArray® *HD Mezz is a trademark of Molex Incorporated.