EdgeLineTM 12.5 Gbps Edge Card Connector FEATURES AND SPECIFICATIONS EdgeLineTM 12.5 Gbps Edge Card Connector delivers a low-cost, flexible and scalable solution for a wide variety of low-to mid-range telecom, computing, and storage applications The new one-piece EdgeLineTM 12.5 Gbps Edge Card Connector is designed to meet the demands of highspeed signal transmissions and density requirements. The connector system accommodates two board thicknesses to support multiple PCB layers on complex product designs. The press-fit connector offers high-speed differential performance up to 12.5 Gbps. In addition, the EdgeLineTM connector has the capability to optimally manage slower speed single-ended and power circuits. The stitched-terminal design offers both excellent electrical performance and product flexibility. Various circuit sizes are available, with or without a center key. The EdgeLineTM 12.5 Gbps Edge Card Connector is available in two PCB thicknesses, 1.57 and 2.36mm (.093 and .062”), with future capability to mate to a 2.00mm (.079”) thick PCB. Configured to meet Telecordia requirements, the EdgeLineTM 12.5 Gbps Edge Card Connector can fill many interconnect requirements. For more information on EdgeLineTM 12.5 Gbps Edge Card Connector, visit: www.molex.com/link/edgeline.html. Features and Benefits n High-speed differential design provides excellent signal integrity, performance up to 12.5 Gbps, depending upon the application n Accommodates 1.57 or 2.36mm (062 or .093”) thick PCBs to allow thicker boards to support more PCB layers on complex product designs n Cost-effective stitched terminal provides product flexibility to accommodate various signals and power n Press-fit, flat-rock tool ensures easy board termination with robust electrical termination n Common or singulated ground optimizes connector for power and slow-speed, single-ended signals in addition to high-speed differential circuits n Center key available on certain circuit sizes improve PCB alignment during mating by relaxing board tolerances up to 0.80mm (.031”) pitch n “Chevron” differential pattern allows “route through” for multilayer backplane applications SPECIFICATIONS Reference Information Packaging: Tray UL File No.: E29179 CSA File No.: 1827355 (LR 19980) Mates With: Customer Plug-in Card Product Specification: PS-75594-999 Electrical Voltage (max.): 250V AC Current (max.): 1.5A Contact Resistance: 10 milliohms max. Dielectric Withstanding Voltage: 300V AC Insulation Resistance: 10 Megohms min. Mechanical Insertion Force to PCB: 35.6N (8.00 lb) per pin Durability: 200 cycles min. Physical Housing: Glass Filled Thermoplastic, 94-VO, Black Contact: Copper (Cu) Alloy Plating: Contact Area — 0.76µm Gold (Au) min. Solder Tail Area — 0.76µm to 1.52µm Tin (Sn) Underplating — 1.27µm Nickel (Ni) min. Operating Temperature: -40 to +85°C 76421 108 Circuits, PCB Mating Thickness 2.36mm (.093”) 76691 Multiple Circuit Sizes PCB Mating Thickness 1.57mm (.062”) 76693 Multiple Circuit Sizes PCB Mating Thickness 2.36mm (.093”) EdgeLineTM 12.5 Gbps Edge Card Connector APPLICATIONS 76421 108 Circuits, PCB Mating Thickness 2.36mm (.093”) 76691 Multiple Circuit Sizes PCB Mating Thickness 1.57mm (.062”) 76693 Multiple Circuit Sizes PCB Mating Thickness 2.36mm (.093”) n Computing systems n Storage systems n Telecommunication hardware n Networking equipment n Supports many high-speed differential interfaces - PCIe - SAS - SATA - Others ORDERING INFORMATION Order No. Circuits PCB Mating Thickness Plant No. for Samples 76421-1000 108 2.36mm (.093”) #3109 76691-2108* 278 1.57mm (.062”) 76693-2278* 200 2.36mm (.093”) Contact Product Manager Note: *Multiple circuits are available within this product series; see sales drawing for options. www.molex.com/link/edgeline.html Americas Headquarters Lisle, Illinois 60532 U.S.A. 1-800-78MOLEX [email protected] Order No. 987650-2584 Asia Pacific North Headquarters Yamato, Kanagawa, Japan 81-46-265-2325 [email protected] Asia Pacific South Headquarters Jurong, Singapore 65-6268-6868 [email protected] USA/KC/2008.11 European Headquarters Munich, Germany 49-89-413092-0 [email protected] Corporate Headquarters 2222 Wellington Ct. Lisle, IL 60532 U.S.A. P: 630-969-4550 F: 630-969-1352 © 2008, Molex