TC649 PWM Fan Speed Controller with Auto-Shutdown and FanSense™ Technology Features • Temperature Proportional Fan Speed for Acoustic Control and Longer Fan Life • Efficient PWM Fan Drive • 3.0V to 5.5V Supply Range: - Fan Voltage Independent of TC649 Supply Voltage - Supports any Fan Voltage • FanSense™ Fault Detection Circuits Protect Against Fan Failure and Aid System Testing • Automatic Shutdown Mode for “Green” Systems • Supports Low Cost NTC/PTC Thermistors • Space Saving 8-Pin MSOP Package Applications • • • • • • • Power Supplies Computers File Servers Portable Computers Telecom Equipment UPSs, Power Amps General Purpose Fan Speed Control Available Tools • Fan Controller Demonstration Board (TC642DEMO) • Fan Controller Evaluation Kit (TC642EV) Package Types SOIC/PDIP/MSOP VIN 1 CF 2 VAS GND 8 VDD 7 VOUT 3 6 FAULT 4 5 SENSE TC649 General Description The TC649 is a switch mode, fan speed controller for use with brushless DC fans. Temperature proportional speed control is accomplished using pulse width modulation (PWM). A thermistor (or other voltage output temperature sensor) connected to the VIN input furnishes the required control voltage of 1.25V to 2.65V (typical) for 0% to 100% PWM duty cycle. The TC649 automatically suspends fan operation when measured temperature (VIN) is below a user programmed minimum setting (VAS). An integrated Start-up Timer ensures reliable motor start-up at turn-on, coming out of shutdown mode, auto-shutdown mode or following a transient fault. In normal fan operation, a pulse train is present at SENSE (Pin 5). The TC649 features Microchip Technology’s proprietary FanSenseTM technology for increasing system reliability. A missing pulse detector monitors this pin during fan operation. A stalled, open or unconnected fan causes the TC649 to trigger its Start-up Timer once. If the fault persists, the FAULT output goes low, and the device is latched in its shutdown mode. See Section 5.0, “Typical Applications”, for more information and system design guidelines. The TC649 is available in the 8-pin PDIP, SOIC and MSOP packages and is available in the industrial and extended commercial temperature ranges. 2001-2012 Microchip Technology Inc. DS21449D-page 1 TC649 Functional Block Diagram TC649 VIN – VDD PWM + Control Logic VOUT CF 3 x TPWM Timer Clock Generator – VAS Start-up Timer + FAULT SHDN Missing Pulse Detect – + – GND + VSHDN 10k SENSE 70mV (typ.) DS21449D-page 2 2001-2012 Microchip Technology Inc. TC649 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings* Supply Voltage ......................................................... 6V Input Voltage, Any Pin.... (GND – 0.3V) to (VDD +0.3V) *Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Resistance: PDIP (RJA) ............................................ 125°C/W SOIC (RJA) ............................................ 155°C/W MSOP (RJA) .......................................... 200°C/W Specified Temperature Range............ -40°C to +125°C Storage Temperature Range.............. -65°C to +150°C DC ELECTRICAL SPECIFICATIONS Electrical Characteristics: Unless otherwise specified, TMIN TA TMAX, VDD = 3.0V to 5.5V. Symbol Parameter Min Typ Max Units Test Conditions VDD Supply Voltage 3.0 — 5.5 V IDD Supply Current, Operating — 0.5 1.0 mA Pins 6, 7 Open, CF = 1 µF, VIN = VC(MAX) IDD(SHDN) Supply Current, Shutdown/ Auto-shutdown Mode — 25 — µA Pins 6, 7 Open; Note 1 CF =1 µF, VIN = 0.35V IIN VIN, VAS Input Leakage -1.0 — +1.0 µA VOUT Output tR VOUT Rise Time — — 50 µsec IOH = 5 mA, Note 1 tF VOUT Fall Time — — 50 tSHDN Pulse Width (On VIN) to Clear Fault Mode 30 — — µsec IOL = 1 mA, Note 1 µsec VSHDN, VHYST Specifications, Note 1 IOL Sink Current at VOUT Output 1.0 — — mA VOL = 10% of VDD IOH Source Current at VOUT Output 5.0 — — mA VOH = 80% of VDD 50 70 90 mV Note 1 SENSE Input VTH(SENSE) SENSE Input threshold Voltage with Respect to GND FAULT Output VOL Output Low Voltage — — 0.3 V IOL = 2.5 mA tMP Missing Pulse Detector Timer — 32/F — Sec CF = 1.0 µF tSTART Start-up Timer — 32/F — Sec CF = 1.0 µF tDIAG Diagnostic Timer — 3/F — Sec CF = 1.0 µF VIN, VAS Inputs VC(MAX) Voltage at VIN for 100% Duty Cycle 2.5 2.65 2.8 V VC(SPAN) VC(MAX) - VC(MIN) 1.3 1.4 1.5 V VAS Auto-shutdown Threshold VC(MAX) -VC(SPAN) — VC(MAX) V VSHDN Voltage applied to VIN to Release Reset/Shutdown — — VDD x 0.13 V VREL Voltage applied to VIN to Release Reset Mode VDD x 0.19 — — V VHYST Hysteresis on VSHDN, VREL Hysteresis on Auto-shutdown Comparator — 0.01 x VDD — V — 70 — mV 26 30 34 Hz VHAS VDD = 5V, See Figure 5-11 Pulse Width Modulator FOSC PWM Frequency CF = 1.0 µF Note 1: Ensured by design, not tested. 2001-2012 Microchip Technology Inc. DS21449D-page 3 TC649 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: Pin No. PIN FUNCTION TABLE Symbol Descriptiion 2.3 Analog Input (VAS) An external resistor divider connected to the VAS input sets the auto-shutdown threshold. Auto-shutdown occurs when VIN VAS. The fan is automatically restarted when VIN (VAS + VHAS). See Section 5.0, “Typical Applications”, for more details. 1 VIN Analog Input 2 CF Analog Output 2.4 GND denotes the ground terminal. 3 VAS Analog Input 4 GND Ground Terminal 5 SENSE Analog Input 6 FAULT Digital (Open Collector) Output 7 VOUT Digital Output 8 VDD Power Supply Input 2.1 Analog Input (VIN) The thermistor network (or other temperature sensor) connects to the VIN input. A voltage range of 1.25V to 2.65V (typical) on this pin drives an active duty cycle of 0% to 100% on the VOUT pin. The TC649 enters shutdown mode when VIN VSHDN. During shutdown, the FAULT output is inactive, and supply current falls to 25 µA (typical). The TC649 exits shutdown mode when VIN VREL. See Section 5.0, “Typical Applications”, for details. 2.2 Analog Output (CF) CF is the positive terminal for the PWM ramp generator timing capacitor. The recommended CF is 1 µF for 30 Hz PWM operation. DS21449D-page 4 2.5 Ground (GND) Analog Input (SENSE) Pulses are detected at the SENSE pin as fan rotation chops the current through a sense resistor (RSENSE). The absence of pulses indicates a fault. See Section 5.0, “Typical Applications”, for more details. 2.6 Digital Output (FAULT) The FAULT line goes low to indicate a fault condition. When FAULT goes low due to a fan fault condition, the device is latched in shutdown mode until deliberately cleared or until power is cycled. 2.7 Digital Output (VOUT) VOUT is an active high complimentary output that drives the base of an external NPN transistor (via an appropriate base resistor) or the gate of an N-channel MOSFET. This output has asymmetrical drive (see Section 1.0, “Electrical Characteristics”). 2.8 Power Supply Input (VDD) VDD may be independent of the fan’s power supply (see Section 1.0, “Electrical Characteristics”). 2001-2012 Microchip Technology Inc. TC649 3.0 DETAILED DESCRIPTION 3.5 3.1 PWM Pulses appearing at SENSE due to the PWM turning on are blanked, and the remaining pulses are filtered by a missing pulse detector. If consecutive pulses are not detected for thirty-two PWM cycles (1 Sec if CF = 1 µF), the Diagnostic Timer is activated, and VOUT is driven high continuously for three PWM cycles (100 msec if CF = 1 µF). If a pulse is not detected within this window, the Start-up Timer is triggered (see Section 3.3, “Start-up Timer”). This should clear a transient fault condition. If the missing pulse detector times out again, the PWM is stopped and FAULT goes low. When FAULT is activated due to this condition, the device is latched in shutdown mode and will remain off indefinitely. The TC649 is thus prevented from attempting to drive a fan under catastrophic fault conditions. The PWM circuit consists of a ramp generator and threshold detector. The frequency of the PWM is determined by the value of the capacitor connected to the CF input. A frequency of 30 Hz is recommended for most applications (CF = 1 µF). The PWM is also the time base for the Start-up Timer (see Section 3.3, “Start-up Timer”). The PWM voltage control range is 1.25V to 2.65V (typical) for 0% to 100% output duty cycle. 3.2 VOUT Output The VOUT pin is designed to drive a low cost transistor or MOSFET as the low side power switching element in the system. Various examples of driver circuits will be shown throughout the datasheet. This output has asymmetric complementary drive and is optimized for driving NPN transistors or N-channel MOSFETs. Since the system relies on PWM rather than linear control, the power dissipation in the power switch is kept to a minimum. Generally, very small devices (TO-92 or SOT packages) will suffice. 3.3 Start-Up Timer To ensure reliable fan start-up, the Start-up Timer turns the VOUT output on for 32 cycles of the PWM whenever the fan is started from the off state. This occurs at power-up and when coming out of shutdown or autoshutdown mode. If the PWM frequency is 30 Hz (CF = 1 µF) the resulting start-up time will be approximately one second. If a fan fault is detected (see Section 3.5, FAULT Output), the Diagnostic Timer is triggered once, followed by the Start-up Timer. If the fault persists, the device is shut down (see Section 3.5, FAULT Output). 3.4 FAULT Output One of two things will restore operation: Cycling power off and then on again; or pulling VIN below VSHDN and releasing it to a level above VREL. When one of these two conditions is satisfied, the normal start-up cycle is triggered and operation will resume, provided the fault has been cleared. 3.6 Auto-Shutdown Mode If the voltage on VIN becomes less than the voltage on VAS, the fan is automatically shut off (auto-shutdown mode). The TC649 exits auto-shutdown mode when the voltage on VIN becomes higher than the voltage on VAS by VHAS (the auto-shutdown hysteresis voltage, see Figure 3-1). The Start-up Timer is triggered and normal operation is resumed upon exiting auto-shutdown mode. The FAULT output is unconditionally inactive in auto-shutdown mode. SENSE Input (FanSense™ Technology) The SENSE input (Pin 5) is connected to a low value current sensing resistor in the ground return leg of the fan circuit. During normal fan operation, commutation occurs as each pole of the fan is energized. This causes brief interruptions in the fan current, seen as pulses across the sense resistor. If the device is not in shutdown or auto-shutdown mode, and pulses are not appearing at the SENSE input, a fault exists. The short, rapid change in fan current (high dl/dt) causes a corresponding dV/dt across the sense resistor, RSENSE. The waveform on RSENSE is differentiated and converted to a logic-level pulse-train by CSENSE and the internal signal processing circuitry. The presence and frequency of this pulse-train is a direct indication of fan operation. See Section 5.0, “Typical Applications”, for more details. 2001-2012 Microchip Technology Inc. DS21449D-page 5 TC649 TC649 Status Normal Operation Auto-Shutdown Mode Normal Operation ShutDown Normal Operation HI 2.6V VAS + VHAS VAS TEMP. 1.2V tRESET VIN VREL VSHDN LO GND TIME FIGURE 3-1: 3.7 TC649 Nominal Operation. Shutdown Mode (RESET) If an unconditional shutdown and/or device reset is desired, the TC649 may be placed in shutdown mode by forcing VIN to a logic low (i.e., VIN < VSHDN) (see Figure 3-1). In this mode, all functions cease and the FAULT output is unconditionally inactive. The TC649 should not be shut down unless all heat producing activity in the system is at a negligible level. The TC649 exits shutdown mode when VIN becomes greater than VREL, the release voltage. Entering shutdown mode also performs a complete device reset. Shutdown mode resets the TC649 into its power-up state. The Start-up and Fault Timers and any current faults are cleared. FAULT is unconditionally inactive in shutdown mode. Upon exiting shutdown mode (VIN > VREL), the Start-up Timer will be triggered and normal operation will resume, assuming no fault conditions exist and VIN > (VAS + VHAS). Note: If VIN < VAS when the device exits shutdown mode, the fan will not restart, but will be in auto-shutdown mode. DS21449D-page 6 If a fan fault has occurred and the device has latched itself into shutdown mode, performing a reset will not clear the fault unless VIN > (VAS + VHAS). If VIN is not greater than VAS + VHAS upon exiting shutdown mode, the fan will not be restarted, and there will be no way to establish that the fan fault has been cleared. To ensure that a complete reset takes place, the user’s circuitry must ensure that VIN > (VAS + VHAS) when the device is released from shutdown mode. A recommended algorithm for management of the TC649 by a host microcontroller or other external circuitry is given in Section 5.0, “Typical Applications”. A small amount of hysteresis, typically one percent of VDD (50mV at VDD = 5.0V), is designed into the VSHDN/VREL threshold. The levels specified for VSHDN and VREL in Section 1.0, “Electrical Characteristics”, include this hysteresis plus adequate margin to account for normal variations in the absolute value of the threshold and hysteresis. CAUTION: The fan will remain off as long as the VIN pin is being held low or VIN < VAS+ VHAS. 2001-2012 Microchip Technology Inc. TC649 4.0 SYSTEM BEHAVIOR The flowcharts describing the TC649’s behavioral algorithm are shown in Figure 4-1. They can be summarized as follows: 4.1 Power-Up (1) Assuming the device is not being held in shutdown or auto-shutdown mode (VIN > VAS)... (2) Turn VOUT output on for 32 cycles of the PWM clock. This ensures that the fan will start from a dead stop. 4.3 Fan Fault Fan Fault is an infinite loop wherein the TC649 is latched in shutdown mode. This mode can only be released by a reset (i.e., VIN being brought below VSHDN, then above (VAS + VHAS) or by power-cycling). (1) While in this state, FAULT is latched on (low) and the VOUT output is disabled. (2) A reset sequence applied to the VIN pin will exit the loop to Power-up. (3) End. (3) During this Start-up Timer, if a fan pulse is detected, branch to Normal Operation; if none are received… (4) Activate the 32-cycle Start-up Timer one more time and look for fan pulse; if a fan pulse is detected, proceed to Normal Operation; if none are received… (5) Proceed to Fan Fault. (6) End. 4.2 Normal Operation Normal Operation is an endless loop which may only be exited by entering shutdown mode, auto-shutdown mode or Fan Fault. The loop can be thought of as executing at the frequency of the oscillator and PWM. (1) Reset the missing pulse detector. (2) Is TC649 in shutdown or auto-shutdown mode? If so… a. VOUT duty cycle goes to zero. b. FAULT is disabled. c. Exit the loop and wait for VIN > (VAS + VHAS) to resume operation. (3) Drive VOUT to a duty cycle proportional to VIN on a cycle by cycle basis. (4) If a fan pulse is detected, branch back to the start of the loop (1). (5) If the missing pulse detector times out … (6) Activate the 3-cycle Diagnostic Timer and look for pulses; if a fan pulse is detected, branch back to the start of the loop (1); if none are received… (7) Activate the 32-cycle Start-up Timer and look for pulses; if a fan pulse is detected, branch back to the start of the loop (1); if none are received… (8) Quit Normal Operation and go to Fan Fault. (9) End. 2001-2012 Microchip Technology Inc. DS21449D-page 7 TC649 Normal Operation Power-Up Clear Missing Pulse Detector Power-on Reset FAULT = 1 Yes Shutdown VOUT = 0 VIN < VSHDN Yes No VIN > VREL? VIN < VSHDN? No No VIN > VREL No Yes Yes AutoShutdown VOUT = 0 Yes VIN < VAS? VIN < VAS? No VIN > No (VAS + VHAS) Fire Start-up Timer (1 SEC) Yes Fan Pulse Detected? Fan Pulse Detected? Hot Start No No Yes Fire Diagnostic Timer (100msec) Yes Fan Pulse Detected? Yes Normal Operation Power-Up Yes M.P.D. Expired? Fire Start-up Timer YES (1 SEC) Yes Yes VOUT Proportional to VIN Yes No Auto Shutdown VOUT = 0 No VIN > (VAS + VHAS) No Hot Start Shutdown VOUT = 0 No No Fan Pulse Detected? Fire Start-up Timer (1 Sec) Fan Fault Yes Fan Pulse Detected? No Fan Fault Fan Fault FAULT = 0, VOUT = 0 No Auto-Shutdown FAULT = 1, VOUT = 0 VIN < VSHDN? Yes Yes No VIN > VREL? No No Cycling Power Yes VIN > (VAS + VHAS)? Yes Power-Up FIGURE 4-1: DS21449D-page 8 TC649 Behavioral Algorithm Flowchart. 2001-2012 Microchip Technology Inc. TC649 5.0 TYPICAL APPLICATIONS The TC642 demonstration and prototyping board (TC642DEMO) and the TC642 Evaluation Kit (TC642EV) provide working examples of TC649 circuits and prototyping aids. The TC642DEMO is a printed circuit board optimized for small size and ease of inclusion into system prototypes. The TC642EV is a larger board intended for benchtop development and analysis. At the very least, anyone contemplating a design using the TC649 should consult the documentation for both TC642EV (DS21403) and TC642DEMO (DS21401).Figure 5-1 shows the base schematic for the TC642DEMO. Designing with the TC649 involves the following: (1) The temperature sensor network must be configured to deliver 1.25V to 2.65V on VIN for 0% to 100% of the temperature range to be regulated. (2) The auto-shutdown temperature must be set with a voltage divider on VAS. (3) The output drive transistor and associated circuitry must be selected. (4) The SENSE network, RSENSE and CSENSE, must be designed for maximum efficiency while delivering adequate signal amplitude. (5) If shutdown capability is desired, the drive requirements of the external signal or circuit must be considered. +5V* +C +12V B 1 µF R1 NTC Fan Shutdown** CB 0.01 µF R2 VIN VDD FAULT +5V Fan Fault Shutdown Q1 RBASE TC649 VOUT R3 VAS CB 0.01 µF SENSE CSENSE CF R4 CF GND RSENSE 1 µF Notes: FIGURE 5-1: *See cautions regarding Latch-up Considerations in Section 5.0, "Typical Applications". **Optional. See Section 5.0, "Typical Applications" for details. Typical Application Circuit. 2001-2012 Microchip Technology Inc. DS21449D-page 9 TC649 5.1 Temperature Sensor Design EQUATION The temperature signal connected to VIN must output a voltage in the range of 1.25V to 2.65V (typical) for 0% to 100% of the temperature range of interest. The circuit in Figure 5-2 illustrates a convenient way to provide this signal. VDD x R2 RTEMP (T1) + R2 VDD x R2 RTEMP (T2) + R2 VDD R1 =100 kΩ VIN R2 = 23.2 kΩ FIGURE 5-2: Circuit. Temperature Sensing Figure 5-2 shows a simple temperature dependent voltage divider circuit. RT1 is a conventional NTC thermistor, while R1 and R2 are standard resistors. The supply voltage, VDD, is divided between R2 and the parallel combination of RT1 and R1. For convenience, the parallel combination of RT1 and R1 will be referred to as RTEMP. The resistance of the thermistor at various temperatures is obtained from the manufacturer’s specifications. Thermistors are often referred to in terms of their resistance at 25°C. Generally, the thermistor shown in Figure 5-2 is a nonlinear device with a negative temperature coefficient (also called an NTC thermistor). In Figure 5-2, R1 is used to linearize the thermistor temperature response and R2 is used to produce a positive temperature coefficient at the VIN node. As an added benefit, this configuration produces an output voltage delta of 1.4V, which is well within the range of the VC(SPAN) specification of the TC649. A 100 kNTC thermistor is selected for this application in order to keep IDIV at a minimum. For the voltage range at VIN to be equal to 1.25V to 2.65V, the temperature range of this configuration is 0°C to 50°C. If a different temperature range is required from this circuit, R1 should be chosen to equal the resistance value of the thermistor at the center of this new temperature range. It is suggested that a maximum temperature range of 50°C be used with this circuit due to thermistor linearity limitations. With this change, R2 is adjusted according to the following equations: DS21449D-page 10 = V(T2) Where T1 and T2 define the temperature range of the circuit. RTEMP is the parallel equivalent of the thermistor and R1 at those temperatures. IDIV RT1 NTC Thermistor 100 kΩ @ 25˚C = V(T1) More information about thermistors may be obtained from AN679, “Temperature Sensing Technologies”, and AN685, “Thermistors in Single Supply Temperature Sensing Circuit”, which can be downloaded from Microchip’s website at www.microchip.com. 5.2 Auto-Shutdown Temperature Design A voltage divider on VAS sets the temperature at which the part is automatically shut down if the sensed temperature at VIN drops below the set temperature at VAS (i.e. VIN < VAS). As with the VIN input, 1.25V to 2.65V (typ.) corresponds to the temperature range of interest from T1 to T2, respectively. Assuming that the temperature sensor network designed above is linearly related to temperature, the shutdown temperature TAS is related to T2 and T1 by: EQUATION 2.65V - 1.25V T2 - T1 VAS = ( 1.4V T2 - T1 ) = VAS - 1.25 TAS - T1 (TAS - T1) + 1.25 For example, if 1.25V and 2.65V at VIN corresponds to a temperature range of T1 = 0°C to T2 = 125°C, and the auto-shutdown temperature desired is 25°C, then VAS voltage is: EQUATION 1.4V VAS = (25 - 0) + 1.25 = 1.53V (125 - 0) The VAS voltage may be set using a simple resistor divider, as is shown in Figure 5-3. 2001-2012 Microchip Technology Inc. TC649 5.3 VDD R1 IDIV One boundary condition which may impact the selection of the minimum fan speed is the irregular activation of the Diagnostic Timer due to the TC649 “missing” fan commutation pulses at low speeds. This is a natural consequence of low PWM duty cycles (typically 25% or less). Recall that the SENSE function detects commutation of the fan as disturbances in the current through RSENSE. These can only occur when the fan is energized (i.e., VOUT is “on”). At very low duty cycles, the VOUT output is “off” most of the time. The fan may be rotating normally, but the commutation events are occurring during the PWM’s off-time. IIN VAS R2 GND FIGURE 5-3: VAS Circuit. Per Section 1.0, “Electrical Characteristics”, the leakage current at the VAS pin is no more than 1 µA. It is conservative to design for a divider current, IDIV, of 100 µA. If VDD = 5.0V then: EQUATION 5.0V IDIV = 1e– 4A R1 + R2 5.0V R1 + R2 = 1e–4A , therefore = 50,000 = 50 k We can further specify R1 and R2 by the condition that the divider voltage is equal to our desired VAS. This yields the following: EQUATION VAS = VDD x R2 R1 + R2 Solving for the relationship between R1 and R2 results in: EQUATION R1 = R2 x VDD - VAS VAS 5 -1.53 = R2 x Operations at Low Duty Cycle 1.53 In the case of this example, R1 = (2.27) R2. Substituting this relationship back into the VAS equation above yields the resistor values: The phase relationship between the fan’s commutation and the PWM edges tends to “walk around” as the system operates. At certain points, the TC649 may fail to capture a pulse within the 32-cycle missing pulse detector window. If this happens, the 3-cycle Diagnostic Timer will be activated, the VOUT output will be active continuously for three cycles and, if the fan is operating normally, a pulse will be detected. If all is well, the system will return to normal operation. There is no harm in this behavior, but it may be audible to the user as the fan accelerates briefly when the Diagnostic Timer fires. For this reason, it is recommended that VAS be set no lower than 1.8V. 5.4 FanSense™ Network (RSENSE and CSENSE) The FanSense network, comprised of RSENSE and CSENSE, allows the TC649 to detect commutation of the fan motor (FanSense™ technology). This network can be thought of as a differentiator and threshold detector. The function of RSENSE is to convert the fan current into a voltage. CSENSE serves to AC-couple this voltage signal and provide a ground-referenced input to the SENSE pin. Designing a proper SENSE network is simply a matter of scaling RSENSE to provide the necessary amount of gain (i.e., the current-to-voltage conversion ratio). A 0.1 µF ceramic capacitor is recommended for CSENSE. Smaller values require larger sense resistors, and higher value capacitors are bulkier and more expensive. Using a 0.1 µF capacitor results in reasonable values for RSENSE. Figure 5-4 illustrates a typical SENSE network. Figure 5-5 shows the waveforms observed using a typical SENSE network. R2 = 15.3 k, and R1 = 34.7 k In this case, the standard values of 34.8 k and 15.4 k are very close to the calculated values and would be more than adequate. 2001-2012 Microchip Technology Inc. DS21449D-page 11 TC649 RSENSE VS. FAN CURRENT TABLE 5-1: VDD Nominal Fan Current (mA) RSENSE () 50 9.1 100 4.7 150 3.0 200 2.4 250 2.0 300 1.8 350 1.5 400 1.3 450 1.2 500 1.0 Fan RBASE VOUT Q1 SENSE CSENSE (0.1 µF Typ.) RSENSE 5.5 GND FIGURE 5-4: SENSE Network. Tek Run: 10.0kS/s Sample [ T ] Waveform @ Sense Resistor GND 1 Waveform @ Sense Pin 90mV 50mV GND T 2 Ch1 100mV Ch2 FIGURE 5-5: 100mV M5.00ms Ch1 142mV SENSE Waveforms. Table 5-1 lists the recommended values of RSENSE based on the nominal operating current of the fan. Note that the current draw specified by the fan manufacturer may be a worst-case rating for near-stall conditions and may not be the fan’s nominal operating current. The values in Table 5-1 refer to actual average operating current. If the fan current falls between two of the values listed, use the higher resistor value. The end result of employing Table 5-1 is that the signal developed across the sense resistor is approximately 450 mV in amplitude. DS21449D-page 12 Output Drive Transistor Selection The TC649 is designed to drive an external transistor or MOSFET for modulating power to the fan. This is shown as Q1 in Figures 5-1, 5-4, 5-6, 5-7, 5-8 and 5-9. The VOUT pin has a minimum source current of 5 mA and a minimum sink current of 1 mA. Bipolar transistors or MOSFETs may be used as the power switching element as shown in Figure 5-6. When high current gain is needed to drive larger fans, two transistors may be used in a Darlington configuration. These circuit topologies are shown in Figure 5-6: (a) shows a single NPN transistor used as the switching element; (b) illustrates the Darlington pair; and (c) shows an Nchannel MOSFET. One major advantage of the TC649’s PWM control scheme versus linear speed control is that the power dissipation in the pass element is kept very low. Generally, low cost devices in very small packages, such as TO-92 or SOT, can be used effectively. For fans with nominal operating currents of no more than 200 mA, a single transistor usually suffices. Above 200 mA, the Darlington or MOSFET solution is recommended. For the fan sensing function to work correctly, it is imperative that the pass transistor be fully saturated when “on”. 2001-2012 Microchip Technology Inc. TC649 Table 5-2 gives examples of some commonly available transistors and MOSFETs. This table should be used as a guide only since there are many transistors and MOSFETs which will work just as well as those listed. The critical issues when choosing a device to use as Q1 are: (1) the breakdown voltage (V(BR)CEO or VDS (MOSFET)) must be large enough to withstand the highest voltage applied to the fan (Note: This will occur when the fan is off); (2) 5 mA of base drive current must VDD VDD VDD Fan Fan Fan RBASE VOUT be enough to saturate the transistor when conducting the full fan current (transistor must have sufficient gain); (3) the VOUT voltage must be high enough to sufficiently drive the gate of the MOSFET to minimize the RDS(on) of the device; (4) rated fan current draw must be within the transistor's/MOSFET's current handling capability; and (5) power dissipation must be kept within the limits of the chosen device. VOUT Q1 RBASE Q1 Q1 VOUT Q2 RSENSE GND TABLE 5-2: Device MMBT2222A MPS2222A MPS6602 GND GND a) Single Bipolar Transistor FIGURE 5-6: RSENSE RSENSE b) Darlington Transistor Pair C) N-Channel MOSFET Output Drive Transistor Circuit Topologies. TRANSISTORS AND MOSFETS FOR Q1 (VDD = 5V) Package Max. VBE(sat)/VGS (V) Min. HFE VCEO/VDS (V) Fan Current (mA) Suggested RBASE () SOT-23 1.2 50 40 150 800 TO-92 1.2 50 40 150 800 TO-92 1.2 50 40 500 301 SI2302 SOT-23 2.5 NA 20 500 Note 1 MGSF1N02E SOT-23 2.5 NA 20 500 Note 1 SI4410 SO-8 4.5 NA 30 1000 Note 1 SI2308 SOT-23 4.5 NA 60 500 Note 1 Note 1: A series gate resistor may be used in order to control the MOSFET turn-on and turn-off times. 2001-2012 Microchip Technology Inc. DS21449D-page 13 TC649 A base-current limiting resistor is required with bipolar transistors (Figure 5-7). The correct value for this resistor can be determined as follows: VOH = VRSENSE + VBE(SAT) + VRBASE VRSENSE = IFAN x RSENSE VRBASE = RBASE x IBASE IBASE = IFAN / hFE VDD Fan VOH is specified as 80% of VDD in Section 1.0, “Electrical Characteristics”; VBE(SAT) is given in the chosen transistor data sheet. It is now possible to solve for RBASE. RBASE VOH = 80% VDD +V RBASE VBE(SAT)– EQUATION RBASE = Q1 – + + VRSENSE VOH - VBE(SAT) - VRSENSE IBASE RSENSE – Some applications benefit from the fan being powered from a negative supply to keep motor noise out of the positive supply rails. This can be accomplished as shown in Figure 5-8, with zener diode D1 offsetting the -12V power supply voltage, holding transistor Q1 off when VOUT is low. When VOUT is high, the voltage at the anode of D1 increases by VOUT, causing Q1 to turn on. Operation is otherwise the same as in the case of fan operation from +12V. GND FIGURE 5-7: RBASE. Circuit For Determining +5V VDD R2* 2.2 kΩ VOUT D1 12.0V Zener FAN TC649 Q1* GND R4* 10 kΩ R3* 2.2 Ω -12V Note: * Value depends on the specific application and is shown for example only. See Section 5.0, "Typical Applications", for more details. FIGURE 5-8: DS21449D-page 14 Powering the Fan from a -12V Supply. 2001-2012 Microchip Technology Inc. TC649 5.6 Latch-up Considerations a high impedance source (such as a thermistor). Additionally, the VDD input should be bypassed with a 1 µF capacitor with grounds being kept as short as possible. To keep fan noise off the TC649 ground pin, individual ground returns for the TC649 and the low side of the fan current sense resistor should be used. As with any CMOS IC, the potential exists for latch-up if signals are applied to the device which are outside the power supply range. This is of particular concern during power-up if the external circuitry (such as the sensor network, VAS divider or shutdown circuit) are powered by a supply different from that of the TC649. Care should be taken to ensure that the TC649’s VDD supply powers up first. If possible, the networks attached to VIN and VAS should connect to the VDD supply at the same physical location as the IC itself. Even if the IC and any external networks are powered by the same supply, physical separation of the connecting points can result in enough parasitic capacitance and/ or inductance in the power supply connections to delay one power supply “routing” versus another. 5.7 Design Example Step 1. Calculate R1 and R2 based on using an NTC having a resistance of 10 k at TMIN (25°C) and 4.65 k at TMAX (45°C) (see Figure 5-9). R1 = 20.5 k R2 = 3.83 k Step 2. Set auto-shutdown Level. VAS = 1.8V. Limit the divider current to 100 µA R5 = 33 k R6 = 18 k Power Supply Routing and Bypassing Step 3. Design the output circuit. Noise present on the VIN and VAS inputs may cause erroneous operation of the FAULT output. As a result, these inputs should be bypassed with a 0.01 µF capacitor mounted as close to the package as possible. This is especially true of VIN, which is usually drive from Maximum fan motor current = 250 mA. Q1 beta is chosen at 50 from which R7 = 800 +5V OpenDrain Device R1 20.5 kΩ (Optional) NTC 10 kΩ @ 25˚C 1 RESET Shutdown R2 3.83 kΩ CB 1 µF VIN +12V +5V 8 4 VDD GND CB 0.01 µF Fan FAULT 6 R7 800 Ω +5V TC649 VOUT R5 33 kΩ R6 18 kΩ 3 VAS CB 0.01 µF 2 CF Q1 Fan Fault SENSE 7 5 CSENSE 0.1 µF RSENSE 2.2 Ω C1 1 µF FIGURE 5-9: Design Example. 2001-2012 Microchip Technology Inc. DS21449D-page 15 TC649 5.8 TC649 as a Microcontroller Peripheral (5% tolerance) form a crude 3-bit DAC that translates this 3-bit code from the processor's outputs into a 1.6V DC control signal. A monolithic DAC or digital pot may be used instead of the circuit shown in Figure 5-10. In a system containing a microcontroller or other host intelligence, the TC649 can be effectively managed as a CPU peripheral. Routine fan control functions can be performed by the TC649 without processor intervention. The microcontroller receives temperature data from one or more points throughout the system. It calculates a fan operating speed based on an algorithm specifically designed for the application at hand. The processor controls fan speed using complementary port bits I/O1 through I/O3. Resistors R1 through R6 With VAS set at 1.8V, the TC649 enters auto-shutdown when the processor's output code is 000[B]. Output codes 001[B] to 111[B] operate the fan from roughly 40% to 100% of full speed. An open-drain output from the processor (I/O0) can be used to reset the TC649 following detection of a fault condition. The FAULT output can be connected to the processor's interrupt input or to another I/O pin for polled operation. . +12V +5V (RESET) (Optional) Open-Drain I/O0 Output R1 110 kΩ I/O1 (MSB) Analog or Digital Temperature Data from One or more Sensors CMOS Outputs R2 240 kΩ R3 360 kΩ I/O2 I/O3 CMOS (LSB) R5 1.5 kΩ Microcontroller +5V R6 1 kΩ +5V 1 V IN CB .01 µF R7 R4 18 kΩ 33 kΩ +5V R8 18 kΩ VDD 8 2 VOUT 7 CF + TC649 1µF 3 V AS CB .01µF 4 GND FAULT SENSE 6 5 Fan CB 1 µF R9 800 Ω 2N2222A +5V R10 10 kΩ 0.1 µF R11 2.2 Ω GND FIGURE 5-10: INT TC649 as a Microcontroller Peripheral. VRELEASE vs. Temperature 1.0 VDD = 5.5V VRELEASE (V) 0.9 VDD = 5.0V 0.8 0.7 VDD = 4.0V 0.6 VDD = 3.0V 0.5 0.4 0˚C 25˚C 85˚C TEMPERATURE FIGURE 5-11: DS21449D-page 16 VRELEASE vs. Temperature. 2001-2012 Microchip Technology Inc. TC649 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX NNN YYWW 8-Lead SOIC (150 mil) XXXXXXXX YYWW NNN 8-Lead MSOP e3 * Note: TC649VPA 025 0215 Example: TC649VOA 0215 025 Example: TC649E 215025 XXXXXX YWWNNN Legend: XX...X Y YY WW NNN Example: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2001-2012 Microchip Technology Inc. DS21449D-page 17 TC649 8-Lead Plastic Dual In-line (P) – 300 mil (PDIP) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E1 D 2 n 1 E A2 A L c A1 B1 p eB B Units Dimension Limits n p Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D L c § B1 B eB MIN .140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5 INCHES* NOM MAX 8 .100 .155 .130 .170 .145 .313 .250 .373 .130 .012 .058 .018 .370 10 10 .325 .260 .385 .135 .015 .070 .022 .430 15 15 MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10 MIN MAX 4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018 DS21449D-page 18 2001-2012 Microchip Technology Inc. TC649 8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E E1 p D 2 B n 1 h 45× c A2 A f L Units Dimension Limits n p Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic A A2 A1 E E1 D h L f c B MIN .053 .052 .004 .228 .146 .189 .010 .019 0 .008 .013 0 0 A1 INCHES* NOM 8 .050 .061 .056 .007 .237 .154 .193 .015 .025 4 .009 .017 12 12 MAX .069 .061 .010 .244 .157 .197 .020 .030 8 .010 .020 15 15 MILLIMETERS NOM 8 1.27 1.35 1.55 1.32 1.42 0.10 0.18 5.79 6.02 3.71 3.91 4.80 4.90 0.25 0.38 0.48 0.62 0 4 0.20 0.23 0.33 0.42 0 12 0 12 MIN MAX 1.75 1.55 0.25 6.20 3.99 5.00 0.51 0.76 8 0.25 0.51 15 15 Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057 2001-2012 Microchip Technology Inc. DS21449D-page 19 TC649 8-Lead Plastic Micro Small Outline Package (MS) (MSOP) Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging E p E1 D 2 B n 1 A2 A c A1 (F) L INCHES Units Number of Pins Pitch Dimension Limits n p Overall Height MILLIMETERS* NOM MIN MAX MIN NOM 8 .026 0.65 .044 A 1.18 .038 0.76 .006 0.05 .193 .200 .114 .118 .114 .118 L .016 .035 Foot Angle F Lead Thickness c .004 Lead Width B .010 Mold Draft Angle Top Mold Draft Angle Bottom Molded Package Thickness A2 .030 Standoff A1 .002 E .184 Molded Package Width E1 Overall Length D Foot Length Footprint (Reference) § Overall Width MAX 8 0.86 0.97 4.67 4.90 .5.08 .122 2.90 3.00 3.10 .122 2.90 3.00 3.10 .022 .028 0.40 0.55 0.70 .037 .039 0.90 0.95 1.00 6 0 .006 .008 0.10 0.15 0.20 .012 .016 0.25 0.30 0.40 .034 0 0.15 6 7 7 7 7 *Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed. 010" (0.254mm) per side. Drawing No. C04-111 DS21449D-page 20 2001-2012 Microchip Technology Inc. TC649 6.2 Taping Form Component Taping Orientation for 8-Pin SOIC (Narrow) Devices User Direction of Feed PIN 1 W P Standard Reel Component Orientation for TR Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package 8-Pin SOIC (N) Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in Component Taping Orientation for 8-Pin MSOP Devices User Direction of Feed PIN 1 W P Standard Reel Component Orientation for TR Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package 8-Pin MSOP 2001-2012 Microchip Technology Inc. Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 2500 13 in DS21449D-page 21 TC649 7.0 REVISION HISTORY Revision D (December 2012) Added a note to each package outline drawing. DS21449D-page 22 2001-2012 Microchip Technology Inc. THE MICROCHIP WEB SITE CUSTOMER SUPPORT Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 2001-2012 Microchip Technology Inc. DS21449D-page 23 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. TO: Technical Publications Manager RE: Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ FAX: (______) _________ - _________ Application (optional): Would you like a reply? Y N Device: Literature Number: DS21449D Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21449D-page 24 2001-2012 Microchip Technology Inc. TC649 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X /XX Temperature Range Package Device: TC649: PWM Fan Speed Controller w/Auto Shutdown and Fault Detection Temperature Range: V E Package: PA = Plastic DIP (300 mil Body), 8-lead * OA = Plastic SOIC, (150 mil Body), 8-lead UA = Plastic Micro Small Outline (MSOP), 8-lead Examples: a) TC649VOA: PWM Fan Speed Controller w/ Auto-Shutdown and Fault Detection, SOIC package. b) TC649VUA: PWM Fan Speed Controller w/ Auto-Shutdown and Fault Detection, MSOP package c) = 0C to +85C = -40C to +85C TC649VPA: PWM Fan Speed Controller w/ Auto-Shutdown and Fault Detection, PDIP package. d) TC649EOATR: PWM Fan Speed Controller w/ Auto-Shutdown and Fault Detection, SOIC package, Tape and Reel. * PDIP package is only offered in the V temp range. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. Your local Microchip sales office The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2001-2012 Microchip Technology Inc. DS21449D-page25 TC649 NOTES: DS21449D-page 26 2001-2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2001-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620768303 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == 2001-2012 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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