LCD EMI Filter Array with ESD Protection CM1420-22 Features Product Description • The CM1420 and CM1422 are EMI filter arrays with ESD protection, which integrate six and eight Pifilters (C-R-C), respectively. The CM1420/22 has component values of 15pF-100Ω-15pF. These devices include ESD protection diodes on every pin, which provide a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The ESD diodes connected to the filter ports safely dissipate ESD strikes of ±15kV, well beyond the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30kV. • • • • • • • • • Functionally and pin compatible with CSPEMI606 (CM1420) and CSPEMI608 (CM1422) devices OptiGuardTM coated for improved reliability at assembly Six and eight channels of EMI filtering +15kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +30kV ESD protection on each channel (HBM) Better than 30dB of attenuation at 1GHz to 3GHz Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 15-bump, 2.960mm x 1.330mm footprint Chip Scale Package (CM1420) 20-bump, 4.000mm x 1.458mm footprint Chip Scale Package (CM1422) RoHS compliant (lead-free) finishing Applications • • • • • • LCD data lines in clamshell wireless handsets EMI filtering & ESD protection for high-speed I/O data ports Wireless handsets / cell phones Notebook computers PDAs / Handheld PCs EMI filtering for high-speed data lines This device is particularly well suited for portable electronics (e.g. wireless handsets, PDAs, notebook computers) because of its small package format and easy-to-use pin assignments. In particular, the CM1420/22 is ideal for EMI filtering and protecting data lines from ESD for the LCD display in clamshell handsets. The CM1420 and CM1422 incorporate OptiGuardTM coating which results in improved reliability at assembly. The CM1420 and CM1422 are available in space-saving, low-profile chip-scale packages with RoHS compliant lead-free finishing. ©2010 SCILLC. All rights reserved. April 2010 Rev. 3 Publication Order Number: CM1420-22/D CM1420-22 Block Diagram Rev. 3 | Page 2 of 15 | www.onsemi.com CM1420-22 PIN DESCRIPTIONS CM1420 CM1422 NAME DESCRIPTION CM1420 CM1422 NAME DESCRIPTION PIN(s) PIN(s) NAME DESCRIPTION PIN(s) PIN(s) NAME DESCRIPTION A1 A1 FILTER1 Filter Channel 1 C1 C1 FILTER1 Filter Channel 1 A2 A2 FILTER2 Filter Channel 2 C2 C2 FILTER2 Filter Channel 2 A3 A3 FILTER3 Filter Channel 3 C3 C3 FILTER3 Filter Channel 3 A4 A4 FILTER4 Filter Channel 4 C4 C4 FILTER4 Filter Channel 4 A5 A5 FILTER5 Filter Channel 5 C5 C5 FILTER5 Filter Channel 5 A6 A6 FILTER6 Filter Channel 6 C6 C6 FILTER6 Filter Channel 6 - A7 FILTER7 Filter Channel 7 - C7 FILTER7 Filter Channel 7 - A8 FILTER8 Filter Channel 8 - C8 FILTER8 Filter Channel 8 B1-B3 B1-B4 GND Device Ground Ordering Information PART NUMBERING INFORMATION Bumps Package Ordering Part Number1 Part Marking 15 CSP CM1420-03CP N203 20 CSP CM1422-03CP N223 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Rev. 3 | Page 3 of 15 | www.onsemi.com CM1420-22 Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 500 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Rev. 3 | Page 4 of 15 | www.onsemi.com CM1420-22 ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS 80 100 120 Ω 12 15 18 pF R Resistance C Capacitance At 2.5V DC, 1MHz, 30mV AC Diode Standoff Voltage IDIODE=10μA 6.0 ILEAK Diode Leakage Current (reverse bias) VDIODE= 3.3V 100 200 nA VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA; Note 3 6.8 -0.8 9.0 -0.4 V V In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Note 2 VDIODE VESD RDYN f C Dynamic Resistance Positive Negative Cut-off Frequency ZSOURCE=50Ω, ZLOAD=50Ω 5.6 -1.5 V ±30 kV ±15 kV 2.30 0.90 Ω Ω 120 MHz R=100Ω, C=15pF Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Rev. 3 | Page 5 of 15 | www.onsemi.com CM1420-22 Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B1) Figure 2. Insertion Loss VS. Frequency (A2-C2 to GND B1) Rev. 3 | Page 6 of 15 | www.onsemi.com CM1420-22 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss VS. Frequency (A3-C3 to GND B2) Figure 4. Insertion Loss VS. Frequency (A4-C4 to GND B2) Rev. 3 | Page 7 of 15 | www.onsemi.com CM1420-22 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 5. Insertion Loss VS. Frequency (A5-C5 to GND B3) Figure 6. Insertion Loss VS. Frequency (A6-C6 to GND B3) Rev. 3 | Page 8 of 15 | www.onsemi.com CM1420-22 Performance Information (cont’d) Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 7. Insertion Loss VS. Frequency (A7-C7 to GND B4, CM1422 Only) Figure 8. Insertion Loss VS. Frequency (A8-C8 to GND B4, CM1422 Only) Rev. 3 | Page 9 of 15 | www.onsemi.com CM1420-22 Performance Information (cont’d) Figure 9. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) Rev. 3 | Page 10 of 15 | www.onsemi.com CM1420-22 Application Information PARAMETER VALUE Pad Size on PCB 0.240mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.290mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50μm Solder Ball Side Coplanarity +20μm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. Figure 5. Recommended Non-Solder Mask Defined Pad Illustration Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 3 | Page 11 of 15 | www.onsemi.com 260°C CM1420-22 Mechanical Details The CM1420/22 is offered in 15-bump and 20-bump custom Chip Scale Packages (CSP). Dimensions for each of these devices are presented in the following pages. CM1420 Mechanical Specifications The package dimensions for the CM1420 are presented below. PACKAGE DIMENSIONS Package Custom CSP Bumps 15 Millimeters Inches Dim Min Nom Max Min Nom Max A1 2.915 2.960 3.005 0.1148 0.1165 0.1183 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.0091 0.0110 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Package Dimensions for CM1420 Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 3 | Page 12 of 15 | www.onsemi.com CM1420-22 Mechanical Details (cont’d) CM1422 Mechanical Specifications The package dimensions for the CM1422 are presented below. PACKAGE DIMENSIONS Package Custom CSP Bumps 20 Millimeters Inches Dim Min Nom Max Min Nom Max A1 3.955 4.000 4.045 0.1557 0.1575 0.1593 A2 1.413 1.458 1.503 0.0556 0.0574 0.0592 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.200 0.250 0.300 0.0079 0.0098 0.0118 C2 0.244 0.294 0.344 0.0096 0.0116 0.0135 D1 0.575 0.644 0.714 0.0226 0.0254 0.0281 D2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel Package Dimensions for CM1422 Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 3 | Page 13 of 15 | www.onsemi.com CM1420-22 CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 CM1420 2.96 X 1.33 X 0.644 3.10 X 1.45 X 0.74 8mm 178mm (7") CM1422 4.00 X 1.46 X 0.644 4.11 X 1.57 X 0.76 8mm 178mm (7") + TAPE WIDTH REEL QTY PER W DIAMETER REEL + + Figure 12. Tape and Reel Mechanical Data Rev. 3 | Page 14 of 15 | www.onsemi.com P0 P1 3500 4mm 4mm 3500 4mm 4mm CM1420-22 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. 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