4-Channel ESD/EMI Filter Array Plus 4-Channel ESD Array for USB CSPEMI307A Features Product Description • The CSPEMI307A is a multichannel EMI/ESD array offering a combination of four low-pass filter + ESD channels to reduce EMI/RFI emissions on a data port and four dedicated ESD-only channels intended specifically for ESD protection on a USB port. Each EMI/RFI channel integrates a high quality pi-style filter (C-R-C) which provides greater than 30dB attenuation in the 800-2700 MHz range. These pistyle filters support bidirectional filtering, controlling EMI both to and from a data port connector. • • • • • • • Four channels of combined EMI/RFI filtering + ESD protection Four additional channels of ESD-only protection EMI/ESD channels provide greater than 32dB attenuation at 1GHz ±15kV ESD protection on all channels (IEC 61000-4-2 Level 4, contact discharge) ± 30kV ESD protection on all channels (HBM) Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance 15-bump, 2.960mm X 1.330mm footprint Chip Scale Package (CSP) Lead-free version available Applications • • • • • • • EMI filtering and ESD protection for both data and I/O ports Outer 4 channels provide ESD protection for USB lines and other I/O port applications Wireless Handsets Handheld PCs / PDAs MP3 Players Notebooks Desktop PCs The CSPEMI307A provides a high-level of ESD protection on all eight channels for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The input pins are designed and characterized to safely dissipate ESD strikes of ±15kV, exceeding the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than ±30kV. The CSPEMI307A is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package footprint and low weight. The CSPEMI307A is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing. ©2010 SCILLC. All rights reserved. May 2010 Rev. 2 Publication Order Number: CSPEMI307A/D CSPEMI307A Electrical Schematic Lead-free devices are specified by using a "+" character for the top side orientation mark. Rev. 2 | Page 2 of 12 | www.onsemi.com CSPEMI307A PIN DESCRIPTIONS PIN(s) NAME DESCRIPTION A1 ESD_1 ESD Channel 1 A2 FILTER+ESD_1 Filter + ESD Channel 1 A3 FILTER+ESD_2 Filter + ESD Channel 2 A4 FILTER+ESD_3 Filter + ESD Channel 3 A5 FILTER+ESD_4 Filter + ESD Channel 4 A6 ESD_2 ESD Channel 2 B1-B3 GND Device Ground C1 ESD_3 ESD Channel 3 C2 FILTER+ESD_1 Filter + ESD Channel 1 C3 FILTER+ESD_2 Filter + ESD Channel 2 C4 FILTER+ESD_3 Filter + ESD Channel 3 C5 FILTER+ESD_4 Filter + ESD Channel 4 C6 ESD_4 ESD Channel 4 Ordering Information PART NUMBERING INFORMATION Standard Finish Lead-free Finish 2 Bumps Package Ordering Part 1 Number Part Marking Ordering Part 1 Number Part Marking 15 CSP CSPEMI307A 307A CSPEMI307AG 307A Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. Rev. 2 | Page 3 of 12 | www.onsemi.com CSPEMI307A Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS -65 to +150 °C DC Power per Resistor 100 mW DC Package Power Rating 600 mW RATING UNITS -40 to +85 °C Storage Temperature Range STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range Rev. 2 | Page 4 of 12 | www.onsemi.com CSPEMI307A ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL PARAMETER R Resistance C Capacitance CONDITIONS At 2.5V DC TCR Temperature Coefficient of Resistance TCC Temperature Coefficient of Capacitance At 2.5V DC VDIODE Diode Voltage (reverse bias) IDIODE=10µA ILEAK Diode Leakage Current (reverse bias) VDIODE=3.3V VSIG Signal Voltage Positive Clamp Negative Clamp ILOAD = 10mA In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2 and 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2,3 and 4 Cut-off frequency ZSOURCE = 50Ω, ZLOAD = 50Ω R = 100Ω, C = 30pF VESD VCL fC MIN TYP MAX UNITS 80 100 120 Ω 24 30 36 pF 1200 ppm/°C -300 ppm/°C 5.5 5.6 -0.4 V 6.8 -0.8 100 nA 9.0 -1.5 V V ±30 kV ±15 kV +10 -5 V V 64 MHz Note 1: TA=25°C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A2, then clamping voltage is measured at Pin C2. Note 4: Unused pins are left open. Rev. 2 | Page 5 of 12 | www.onsemi.com CSPEMI307A Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 1. Insertion Loss VS. Frequency (A2-C2 to GND B2) Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2) Rev. 2 | Page 6 of 12 | www.onsemi.com CSPEMI307A Performance Information Typical Filter Performance (TA=25°C, DC Bias=0V, 50 Ohm Environment) Figure 3. Insertion Loss VS. Frequency (A4-C4 to GND B2) Figure 4. Insertion Loss VS. Frequency (A5-C5 to GND B2) Rev. 2 | Page 7 of 12 | www.onsemi.com CSPEMI307A Performance Information Typical Filter Performance (TA=25°C, 50 Ohm Environment) Figure 5. Comparison of Filter Response Curves for CSPEMI307A VS. DC Bias Rev. 2 | Page 8 of 12 | www.onsemi.com CSPEMI307A Performance Information (cont’d) Figure 6. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) Figure 7. Resistance vs. Temperature (normalized to resistance at 25°C) Rev. 2 | Page 9 of 12 | www.onsemi.com CSPEMI307A Application Information PARAMETER VALUE Pad Size on PCB 0.240mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.290mm Round Solder Stencil Thickness 0.125mm - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.300mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance — Edge To Corner Ball +50µm Solder Ball Side Coplanarity +20µm Maximum Dwell Time Above Liquidous 60 seconds Maximum Soldering Temperature for Lead-free Devices using a Lead-free Solder Paste Non-Solder Mask Defined Pad 0.240mm DIA. Solder Stencil Opening 0.300mm DIA. Solder Mask Opening 0.290mm DIA. Figure 8. Recommended Non-Solder Mask Defined Pad Illustration Figure 9. Lead-free (SnAgCu) Solder Ball Reflow Profile Rev. 2 | Page 10 of 12 | www.onsemi.com 260°C CSPEMI307A Mechanical Details CSP Mechanical Specifications The CSPEMI307A is offered in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on the CSP, see the California Micro Devices CSP Package Information document. PACKAGE DIMENSIONS Package Custom CSP Bumps 15 B3 Dim Millimeters Min Nom Max Inches Min Nom Max A1 2.915 2.960 3.005 0.1148 0.1165 0.1183 A2 1.285 1.330 1.375 0.0506 0.0524 0.0541 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0.245 0.250 0.255 0.0096 0.0098 0.0100 B3 0.430 0.435 0.440 0.0169 0.0171 0.0173 B4 0.430 0.435 0.440 0.0169 0.0171 0.0173 C1 0.180 0.230 0.280 0.0071 0.0091 0.0110 C2 0.180 0.230 0.280 0.0071 0.0091 0.0110 D1 0.561 0.605 0.649 0.0221 0.0238 0.0256 D2 0.355 0.380 0.405 0.0140 0.0150 0.0160 # per tape and reel 0.30 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS Package Dimensions for CSPEMI307A Chip Scale Package 3500 pieces Controlling dimension: millimeters Rev. 2 | Page 11 of 12 | www.onsemi.com CSPEMI307A CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 CSPEMI307A 2.96 X 1.33 X 0.605 3.10 X 1.45 X 0.74 8mm 178mm (7") 3500 4mm 4mm Figure 11. Tape and Reel Mechanical Data ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. 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